Liquid cooling chip level radiator based on high heat source chip

Abstract

The invention discloses a liquid cooling chip level radiator based on a high heat source chip, and belongs to the technical field of electronic chip heat dissipation. Comprising an upper heat dissipation cavity, a lower heat dissipation cavity and a flexible graphite film, spiral threads are arranged on the inner side wall of the lower portion of the upper heat dissipation cavity and the outer side wall of the upper portion of the lower heat dissipation cavity, the upper heat dissipation cavity is connected with the lower heat dissipation cavity in a sealed and screwed mode through the spiral threads, and the flexible graphite film is fixed to the bottom face of the lower heat dissipation cavity. The problems that an existing chip heat dissipation scheme proposed in the background technology is generally limited in heat dissipation capacity, complex in structure, high in cost and the like, and the strict requirement for heat dissipation of a high-performance chip in the future is difficult to meet can be solved.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic chip heat dissipation, and in particular to a liquid-cooled chip-level radiator based on a high-heat source chip. Background Art

[0002] As electronic device performance continues to improve, chip power density and heat output have significantly increased. Efficient heat dissipation has become crucial for electronic product design. Modern chips utilize advanced manufacturing processes, resulting in ever-increasing integration and performance, but this also presents a more severe heat dissipation challenge. Ensuring chip reliability and stability under high-power operating conditions has long been a hot topic in the electronics industry.

[0003] Currently, chip cooling relies primarily on the following methods: passive cooling, active cooling, and liquid cooling. Passive cooling primarily utilizes metal heat sinks or thermal pads to conduct heat, offering advantages such as simple structure and low cost, but with limited heat dissipation capacity. Active cooling utilizes forced convection cooling via a drive device such as a fan or heat pipe, significantly improving heat dissipation efficiency. However, this method is complex and consumes high power. Liquid cooling utilizes the principle of heat transfer through liquid circulation and offers superior heat dissipation capabilities, but its complex structure and high cost limit its application to high-powered servers and workstations.

[0004] In general, while current mainstream chip cooling technologies have met the cooling needs of electronic products to a certain extent, as chip power consumption continues to rise, these cooling solutions generally suffer from limited cooling capacity, complex structures, and high costs. They are no longer able to meet the demanding cooling requirements of future high-performance chips. Therefore, there is an urgent need to overcome the bottlenecks of existing cooling technologies and explore new, efficient, and low-cost chip cooling solutions. Summary of the Invention

[0005] The purpose of the present invention is to solve the above-mentioned problems existing in the prior art and to provide a liquid-cooled chip-level radiator based on a high heat source chip.

[0006] To achieve the above purpose, the present invention adopts the following technical solutions:

[0007] A liquid-cooled chip-level radiator based on a high-heat source chip includes: an upper heat dissipation cavity, a lower heat dissipation cavity, and a flexible graphite film. The inner wall below the upper heat dissipation cavity and the outer wall above the lower heat dissipation cavity are both provided with spiral patterns. The upper heat dissipation cavity is sealed and screwed together with the lower heat dissipation cavity through the spiral patterns, and a flexible graphite film is fixed to the bottom surface of the lower heat dissipation cavity.

[0008] The top surface of the heat dissipation upper cavity is provided with multiple bionic protrusions, and an upper fixing frame is detachably fixed on the top surface of the heat dissipation upper cavity, an upper bearing is fixed on the top surface of the upper fixing frame, a driven fan is fixed on the rotating shaft one, the upper end of the rotating shaft one is fixedly connected to the upper bearing, and an upper magnetic coupler is fixed on the lower end of the rotating shaft, and the upper bearing, the driven fan, the rotating shaft one and the upper magnetic coupler are coaxially arranged.

[0009] A lower fixing frame is fixed inside the lower heat dissipation cavity, a lower bearing is fixed on the lower fixing frame, the rotating shaft 2 is fixed through the lower bearing, a driving fan is fixed at the lower end of the rotating shaft 2, an upper magnetic coupler is fixed at the upper end of the rotating shaft 2, the upper magnetic coupler and the lower magnetic coupler are arranged correspondingly, the lower magnetic coupler, the lower bearing, the rotating shaft 2, the lower fixing frame and the lower heat dissipation cavity are coaxially arranged, and the upper magnetic coupler and the lower magnetic coupler are coaxially arranged.

[0010] The cooling reflux tower includes an integrally formed conical upper cavity and a cylindrical lower cavity. The cooling reflux tower is fixedly connected to the inner bottom surface of the heat dissipation lower cavity. An ascending channel is provided in the center of the cooling reflux tower along its height direction. The rotating shaft 2 and the driving fan are provided in the ascending channel. A conical reflux channel is provided on the bottom surface of the cooling reflux tower. The upper end of the reflux channel is fixedly connected to the ascending channel. The side wall of the cooling reflux tower is provided with multiple liquid inlets along its circumference.

[0011] Compared with the prior art, the present invention has the following beneficial effects:

[0012] This invention provides a liquid-cooled chip-level heat sink based on a high-heat-source chip. This device addresses the issues raised in the background art by efficiently dissipating heat from a single heat source. This device utilizes the evaporation and liquefaction of ethanol to form a cycle, using the evaporated ethanol as the driving force for a fan. This, in turn, uses magnetic force to drive a driven fan, creating a self-circulating heat dissipation system that requires no external cooling, contributing to the development of efficient and reliable electronic equipment and intelligent technology.

[0013] The present invention leverages temperature differences to drive the spontaneous flow of ethanol within the device, resulting in highly efficient heat exchange. Through its rational internal structural design, the device enables continuous circulation of ethanol without the need for external energy sources, reducing chip energy consumption and improving overall cooling efficiency. Furthermore, during the circulation process, ethanol absorbs heat generated by the chip, effectively dissipating it and preventing performance degradation or damage caused by chip overheating. The system has a simple structure, is easy to maintain, and can adapt to various environmental conditions, ensuring the stability and reliability of the chip during long-term operation.

[0014] The bionic protrusions in this invention utilize a bionic structure inspired by the spherical protrusions on a beetle's back, drawing inspiration from the natural morphology of the spherical protrusions on the beetle's back. This bionic design effectively increases the hydrophilicity of the heat dissipation cavity surface, thereby promoting the rapid condensation of cooling steam. Each spherical protrusion forms a tiny water droplet condensation point on the surface. These water droplets maintain close contact with the surface through capillary action, further enhancing the condensation process.

[0015] The present invention employs an upper magnetic coupling and a lower magnetic coupling structure, and fully utilizes the rising ethanol vapor as a driving force source to drive the driven fan to rotate, thereby effectively reducing the temperature of the upper wall of the heat dissipation upper cavity and increasing the temperature difference between the surfaces of the upper heat dissipation upper cavity and the lower heat dissipation lower cavity. The increase in temperature difference promotes the flow of ethanol vapor, further accelerating the speed of the driving fan and forming a positive feedback mechanism. This not only improves the heat dissipation efficiency, but also effectively enhances the overall heat exchange performance. This design fully utilizes the thermal energy of ethanol vapor, converting it into mechanical energy to achieve efficient energy recycling, thereby improving the self-driving capability and energy efficiency performance of the device.

[0016] The present invention obtains flexible graphite film by pressing worm graphite and applies it to the connection between the heat sink and the chip. It has a high crystallinity similar to graphite and an excellent structure of orderly arrangement of carbon atoms. Its unique micro-chip layer is preferentially arranged in a direction perpendicular to the external pressure, making the stacking of the graphite film layers more compact, further enhancing the thermal conductivity of the material. Because the carbon atoms of the graphite film form strong covalent bonds between the layers, this structure not only allows heat to be quickly conducted within the film, but also ensures its stability in high-temperature environments. Compared with traditional thermal conductive materials, graphite film can still maintain a high thermal conductivity at a thinner thickness, which gives it a huge advantage in thermal management and heat dissipation applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0018] Figure 2 This is a schematic diagram of the exterior of the upper heat dissipation cavity and the lower heat dissipation cavity of the present invention;

[0019] Figure 3 It is a schematic diagram of the bionic convex structure.

[0020] Bionic protrusion 1, upper heat dissipation cavity 2, lower heat dissipation cavity 3, flexible graphite film 4, upper bearing 5, driven fan 6, upper magnetic coupler 7, lower magnetic coupler 8, lower fixing frame 9, lower bearing 10, rising channel 11, driving fan 12, cooling reflux tower 13, spiral pattern 14, reflux channel 15. DETAILED DESCRIPTION

[0021] The technical solutions of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0022] A liquid-cooled chip-level radiator based on a high-heat source chip includes: an upper heat dissipation cavity 2, a lower heat dissipation cavity 3, and a flexible graphite film 4. The lower inner wall of the upper heat dissipation cavity 2 and the upper outer wall of the lower heat dissipation cavity 3 are both provided with spiral patterns 14. The upper heat dissipation cavity 2 is sealed and screwed together with the lower heat dissipation cavity 3 through the spiral patterns 14, and the flexible graphite film 4 is fixed to the bottom surface of the lower heat dissipation cavity 3.

[0023] The upper heat sink chamber 2 and the lower heat sink chamber 3 are screwed together via spiral threads 14, facilitating assembly and repair, convenient component maintenance and replacement, and convenient ethanol refilling. This prevents ethanol leakage from the lower heat sink chamber 3, ensuring the overall sealing of the device. The flexible graphite film 4, made by pressing four times using a sheet press, is made from a 1:1 mixture of expanded graphite (100 ml / g) and paraffin wax. It is attached to the lower surface of the lower heat sink chamber 3, directly contacting the chip requiring heat dissipation and transferring heat generated during operation to the lower heat sink chamber 3.

[0024] The top surface of the heat dissipation upper cavity 2 is provided with multiple bionic protrusions 1. An upper fixing bracket 16 is removably fixed to the top surface of the heat dissipation upper cavity 2. An upper bearing 5 is fixed to the inner top surface of the upper fixing bracket 16. A driven fan 6 is fixed to the rotating shaft 1. The upper end of the rotating shaft 1 is fixedly connected to the upper bearing 5. An upper magnetic coupler 7 is fixed to the lower end of the rotating shaft. The upper bearing 5, driven fan 6, rotating shaft 1, and upper magnetic coupler 7 are coaxially arranged. The driven fan 6 adopts a "windmill" structure, which is easily rotated by the rising airflow. The bionic protrusions 1 protrude from the surface of the heat dissipation upper cavity 2, increasing the heat dissipation area and improving the heat exchange between the heat dissipation upper cavity 2 and the outside world.

[0025] A lower fixing frame 9 is fixed inside the lower heat dissipation cavity 3, a lower bearing 10 is fixed on the lower fixing frame 9, the rotating shaft 2 is fixed through the lower bearing 10, a driving fan 12 is fixed to the lower end of the rotating shaft 2, and an upper magnetic coupler 7 is fixed to the upper end of the rotating shaft 2. The upper magnetic coupler 7 is arranged corresponding to the lower magnetic coupler 8. The lower magnetic coupler 8, the lower bearing 10, the rotating shaft 2, the lower fixing frame 9 and the lower heat dissipation cavity 3 are coaxially arranged, and the upper magnetic coupler 7 is coaxially arranged with the lower magnetic coupler 8.

[0026] The cooling reflux tower 13 includes an integrally formed conical upper cavity and a cylindrical lower cavity. The cooling reflux tower 13 is fixedly connected to the inner bottom surface of the heat dissipation lower cavity 3. An ascending channel 11 is provided in the center of the cooling reflux tower 13 along its height direction. The rotating shaft 2 and the driving fan 12 are arranged in the ascending channel 11. A conical reflux channel 15 is provided on the bottom surface of the cooling reflux tower 13. The upper end of the reflux channel 15 is fixedly connected to the ascending channel 11. The side wall of the cooling reflux tower 13 is provided with multiple liquid inlets along its circumference.

[0027] After the heat dissipation lower cavity 3 is filled with ethanol, the ethanol liquid gathers at the bottom of the heat dissipation lower cavity 3 under the action of gravity. At the same time, ethanol enters between the reflux channel 15 and the bottom surface of the heat dissipation lower cavity 3 through multiple liquid inlets, which can provide space for ethanol vapor formed by the ethanol liquid being heated and evaporated. When the heat of the chip that needs to be dissipated is transferred to the ethanol liquid through the heat dissipation lower cavity 3, the ethanol liquid is heated and evaporated. Due to the characteristic of low density of ethanol vapor, ethanol evaporates from the bottom of the heat dissipation lower cavity 3, gradually gathers at the bottom of the reflux channel 15 and enters the rising channel 11. After the ethanol vapor gathers in the tapered reflux channel 15, it will quickly pass through the rising channel 11. After passing through the rising channel 11, the ethanol vapor contacts the top surface of the heat dissipation upper cavity 2 and the bionic protrusion 1. The heat dissipation upper cavity 2 is made of copper. The heat of the ethanol vapor is transferred to the outside through the thin copper wall, which reduces the temperature of the upper heat dissipation cavity 2. At the same time, the ethanol vapor condenses into ethanol droplets when it encounters cold on the top surface of the upper heat dissipation cavity 2. In addition, the bionic protrusion 1 adopts a bionic structure of the protrusion on the back of a beetle. By increasing the area, it also helps the ethanol vapor to condense into small droplets on the inner surface of the upper heat dissipation cavity 2, thereby accelerating the condensation of ethanol vapor on the top surface of the upper heat dissipation cavity 2. When the ethanol liquid on the top surface of the upper heat dissipation cavity 2 condenses into droplets that are large enough, it will drip onto the surface of the cooling reflux tower 13 under the action of gravity, and flow around along the integrally formed conical upper cavity surface, and finally flow back to the bottom of the lower heat dissipation cavity 3, and flow back through the liquid inlet into the gap between the reflux channel 15 and the bottom surface of the lower heat dissipation cavity 3, absorbing heat and evaporating again. At the same time, when ethanol vapor passes through the ascending channel 11, it drives the driving fan 12 to rotate. The driving fan 12 rotates and drives the lower magnetic coupler 8 to rotate through the rotating shaft 2. The lower magnetic coupler 8 rotates and drives the upper magnetic coupler 7 to rotate through the action of magnetic coupling. The upper magnetic coupler 7 rotates and drives the driven fan 6 to rotate through the rotating shaft 1, which can reduce the temperature of the upper heat dissipation cavity 2, thereby increasing the temperature difference between the upper and lower surfaces of the upper heat dissipation cavity 2 and the lower heat dissipation cavity 3.

[0028] Before using the flexible graphite film 4, its thickness and size must be accurately determined, which is a crucial step. Through reasonable selection, it can be ensured that the flexible graphite film 4, while having a high thermal conductivity, can fit the surface of the chip to the greatest extent possible, thereby achieving a tight fit. This tight fit not only helps to conduct heat evenly and quickly on the flexible graphite film 4, but also improves the overall heat dissipation efficiency. At the same time, it is also necessary to ensure that the lower surface of the heat dissipation cavity 3 and the flexible graphite film 4 are in contact with each other to achieve a tight fit. This fit is crucial for the uniform heating of the ethanol liquid inside the cavity, enabling ethanol to absorb heat more efficiently and convert into ethanol vapor. Since the present invention includes a gas-liquid conversion process, the spiral pattern 14 also needs to be precisely sealed to ensure that the spiral pattern 14 is tightly screwed together to effectively prevent ethanol from volatilizing during the rising process, thereby preventing the ethanol liquid from being unable to continuously and quickly dissipate heat due to the lack of timely replenishment and reflux.

[0029] When filling the ethanol liquid, the amount of liquid should be accurately added according to the actual usage and needs. It is necessary to ensure that the filling amount is moderate, not too much filling so as to block the rising channel 11 of the ethanol vapor, and also avoid filling too little to prevent the ethanol from failing to complete the continuous conversion process.

[0030] During the specific operation and to ensure the efficient operation of the entire cooling system, in order to maintain its efficient and stable operation state, the installation position of the driving fan 12 must be accurately installed to avoid unnecessary contact with the inner wall of the rising channel 11, thereby effectively reducing friction resistance and energy consumption. It can also ensure that the driving fan 12 does not generate excessive noise and vibration when rotating at high speed, thereby extending the service life of the entire system.

[0031] The precise coupling between upper and lower magnetic couplers 7, 8, is crucial for efficient system operation. These two magnetic couplers must be precisely designed and installed to ensure that driven fan 6 rotates in sync with the driving fan 12. This contactless transmission method not only reduces mechanical wear and improves system reliability, but also makes energy transfer more efficient and reduces energy loss during transmission.

[0032] When the temperature of the bottom surface of the heat dissipation lower chamber 3 rises, the ethanol liquid inside evaporates rapidly, producing a large amount of ethanol vapor, causing the pressure inside the lower chamber to increase. This change forces the driving fan 12 to rotate faster, releasing the internal high pressure, and drives the driven fan 6 to accelerate synchronously. This way, more air is quickly pumped and flows through the top surface of the heat dissipation upper chamber 2, greatly accelerating the heat dissipation rate and achieving a positive feedback loop for heat dissipation efficiency.

[0033] Throughout this process, the stability of the upper mounting bracket 16 must also be ensured. As one of the supporting structures of the entire cooling system, the stability and robustness of the upper mounting bracket 16 are directly related to the safety and reliability of the entire system. Therefore, during the design and installation process, high-quality materials and advanced craftsmanship must be used to ensure that the upper mounting bracket 16 can withstand various external forces and vibrations for a long time without deformation or loosening.

[0034] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0035] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A liquid-cooled chip-level radiator based on a high-heat source chip, characterized by: include: The upper heat dissipation cavity (2), the lower heat dissipation cavity (3), and the flexible graphite film (4) are provided with spiral patterns (14) on the lower inner wall of the upper heat dissipation cavity (2) and the upper outer wall of the lower heat dissipation cavity (3). The upper heat dissipation cavity (2) is sealed and screwed with the lower heat dissipation cavity (3) via the spiral patterns (14). The bottom surface of the lower heat dissipation cavity (3) is fixed with the flexible graphite film (4).

2. The liquid-cooled chip-level radiator based on a high-heat-source chip according to claim 1, characterized in that: The top surface of the heat dissipation upper cavity (2) is provided with a plurality of bionic protrusions (1); an upper fixing frame (16) is detachably fixed on the top surface of the heat dissipation upper cavity (2); an upper bearing (5) is fixed on the inner top surface of the upper fixing frame (16); a driven fan (6) is fixed on the rotating shaft 1; the upper end of the rotating shaft 1 is fixedly connected to the upper bearing (5); an upper magnetic coupler (7) is fixed on the lower end of the rotating shaft; and the upper bearing (5), the driven fan (6), the rotating shaft 1 and the upper magnetic coupler (7) are coaxially arranged.

3. The liquid-cooled chip-level radiator based on a high-heat-source chip according to claim 2, characterized in that: A lower fixing frame (9) is fixed inside the heat dissipation lower cavity (3), a lower bearing (10) is fixed on the lower fixing frame (9), a second rotating shaft is fixedly passed through the lower bearing (10), a driving fan (12) is fixed on the lower end of the second rotating shaft, an upper magnetic coupler (7) is fixed on the upper end of the second rotating shaft, the upper magnetic coupler (7) and the lower magnetic coupler (8) are arranged correspondingly, the lower magnetic coupler (8), the lower bearing (10), the second rotating shaft, the lower fixing frame (9) and the heat dissipation lower cavity (3) are coaxially arranged, and the upper magnetic coupler (7) and the lower magnetic coupler (8) are coaxially arranged.

4. The liquid-cooled chip-level radiator based on a high-heat-source chip according to claim 3, characterized in that: The cooling reflux tower (13) comprises an integrally formed conical upper cavity and a cylindrical lower cavity. The cooling reflux tower (13) is fixedly connected to the inner bottom surface of the heat dissipation lower cavity (3). An ascending channel (11) is provided at the center of the cooling reflux tower (13) along its height direction. The second rotating shaft and the driving fan (12) are provided in the ascending channel (11). A conical reflux channel (15) is provided on the bottom surface of the cooling reflux tower (13). The upper end of the reflux channel (15) is fixedly connected to the ascending channel (11). The side wall of the cooling reflux tower (13) is provided with a plurality of liquid inlets along its circumference.

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