Intermediate connection member for electrically interconnecting two circuit units

Abstract

The present disclosure relates to an intermediate connection member, an electronic module, an electronic apparatus, and a method of manufacturing the intermediate connection member. The intermediate connection member includes: a first insulating substrate portion; a second insulating substrate portion; an insulating layer portion provided between the first insulating substrate portion and the second insulating substrate portion and formed of a different material from the first insulating substrate portion and the second insulating substrate portion; a plurality of first wiring portions provided between the first insulating substrate portion and the insulating layer portion so as to extend in a first direction such that both end portions of the plurality of first wiring portions in the first direction are exposed to the outside; and a plurality of second wiring portions provided between the second insulating substrate portion and the insulating layer portion so as to extend in the first direction such that both end portions of the plurality of second wiring portions in the first direction are exposed to the outside.

Description

[0001] This application is a divisional application of the Chinese patent application with national application number 202110798188.9, application date July 15, 2021, and name “Intermediate connecting component for electrically interconnecting two circuit units”. Technical Field

[0002] The present invention relates to an intermediate connecting member for electrically interconnecting two circuit units. Background Art

[0003] An imaging device (e.g., a digital camera or smartphone) including a camera, which serves as an example of an electronic device, includes an imaging module, which serves as an example of an electronic module. The imaging module includes multiple electronic components. In the case of an imaging module, one of the multiple electronic components is an image sensor. Each electronic component is mounted on a rigid board, such as a printed wiring board. Due to the demand for miniaturization of electronic devices, there is an increasing need to mount electronic components on the substrate of the imaging module at a high density.

[0004] As an example of a structure that achieves high-density placement, a three-dimensional mounting structure consisting of a multilayer structure formed by stacking circuit units is known. Known methods for forming a three-dimensional mounting structure include interconnecting two opposing circuit units using solder balls and interconnecting two opposing circuit units using an intermediate connecting member including wires. The method of interconnecting two circuit units using an intermediate connecting member is used when electronic components are arranged between two rigid boards of two circuit units.

[0005] Japanese Patent Laid-Open No. 2001-111232 discloses an intermediate connection member formed by defining a plurality of through-holes in an insulating substrate and injecting conductors into the through-holes of the insulating substrate.

[0006] The demand for further miniaturization of electronic devices has led to a need for further miniaturization of three-dimensional mounting structures including intermediate connecting members, and a need to reduce the pitch of wiring within these intermediate connecting members. In methods for forming wiring in through-holes, holes are typically drilled in an insulating substrate using a mechanical drill. Attempting to reduce the pitch between through-holes results in a thinning of the insulating material between the through-holes. This leads to difficulties in maintaining high-precision machining while meeting the demand for reduced wiring pitch, resulting in problems such as peeling or deformation of the thinned portion during drilling. Summary of the Invention

[0007] According to a first aspect of the present invention, a method for manufacturing an intermediate connecting member for electrically connecting a first unit and a second circuit unit arranged opposite to each other includes: forming a first insulating substrate, the first insulating substrate including a first main surface provided with a plurality of first grooves; forming a second insulating substrate, the second insulating substrate including a second main surface provided with a plurality of second grooves; arranging a plurality of first conductive members in the plurality of first grooves; arranging a plurality of second conductive members in the plurality of second grooves; forming a structure by bonding the first main surface of the first insulating substrate and the second main surface of the second insulating substrate together in a state in which the insulating member is located between the first insulating substrate and the second insulating substrate, so that the direction in which the plurality of first conductive members extend and the direction in which the plurality of second conductive members extend are aligned; and cutting the structure in a second direction intersecting the first direction in which the plurality of first conductive members and the plurality of second conductive members extend.

[0008] According to a second aspect of the present invention, an intermediate connecting member for electrically connecting a first circuit unit and a second circuit unit arranged opposite to each other includes: a first insulating substrate portion; a second insulating substrate portion; an insulating layer portion, the insulating layer portion being arranged between the first insulating substrate portion and the second insulating substrate portion and being formed of a material different from that of the first insulating substrate portion and the second insulating substrate portion; a plurality of first wiring portions, the plurality of first wiring portions being arranged between the first insulating substrate portion and the insulating layer portion so as to extend in a first direction so that two end portions of the plurality of first wiring portions in the first direction are exposed to the outside; and a plurality of second wiring portions, the plurality of second wiring portions being arranged between the second insulating substrate portion and the insulating layer portion so as to extend in the first direction so that two end portions of the plurality of second wiring portions in the first direction are exposed to the outside.

[0009] According to a third aspect of the present invention, an intermediate connecting member for electrically connecting a first circuit unit and a second circuit unit disposed opposite each other includes a plurality of first wiring portions arranged at a predetermined distance in a second direction intersecting the first direction. Each of the plurality of first wiring portions is arranged to extend in the first direction such that both end surfaces of the plurality of first wiring portions in the first direction are exposed to the outside. At least one of the plurality of first wiring portions has a first width, and at least another of the plurality of first wiring portions has a second width greater than the first width.

[0010] According to a fourth aspect of the present invention, an intermediate connecting member for electrically connecting a first circuit unit and a second circuit unit disposed opposite each other includes a plurality of first wiring portions arranged at a predetermined distance in a second direction intersecting the first direction. Each of the plurality of first wiring portions is arranged to extend in the first direction such that both end surfaces of the plurality of first wiring portions in the first direction are exposed to the outside. At least one of the plurality of first wiring portions has a first thickness, and at least another of the plurality of first wiring portions has a second thickness greater than the first thickness.

[0011] According to a fifth aspect of the present invention, an intermediate connecting member for electrically connecting a first circuit unit and a second circuit unit disposed opposite each other includes a first insulating substrate portion; and a plurality of first wiring portions disposed on the first insulating substrate portion and spaced apart in a second direction intersecting the first direction. Each of the plurality of first wiring portions is configured to extend in the first direction such that both end surfaces of the plurality of first wiring portions in the first direction are exposed to the outside. The first insulating substrate portion includes a first groove portion having a width greater than the width of one of the plurality of first wiring portions and / or a depth greater than the thickness of one of the plurality of first wiring portions.

[0012] Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is an explanatory diagram of a digital camera serving as an example of electronic equipment according to the first embodiment.

[0014] Figure 2A is a plan view of a camera module serving as an example of an electronic module according to the first embodiment.

[0015] Figure 2B is a cross-sectional view of a camera module according to a first embodiment.

[0016] Figure 3A is a perspective view of an intermediate connecting member according to a first embodiment.

[0017] Figure 3B yes Figure 3A An enlarged view of a portion of the intermediate connecting member is shown.

[0018] Figure 4A 2 are diagrams for describing a method of manufacturing an intermediate connection member according to a first embodiment.

[0019] Figure 4B2 are diagrams for describing a method of manufacturing an intermediate connection member according to a first embodiment.

[0020] Figure 5A 2 are diagrams for describing a method of manufacturing an intermediate connection member according to a first embodiment.

[0021] Figure 5B 2 are diagrams for describing a method of manufacturing an intermediate connection member according to a first embodiment.

[0022] Figure 5C 2 are diagrams for describing a method of manufacturing an intermediate connection member according to a first embodiment.

[0023] Figure 6A 2 are diagrams for describing a method of manufacturing an intermediate connection member according to a first embodiment.

[0024] Figure 6B 2 are diagrams for describing a method of manufacturing an intermediate connection member according to a first embodiment.

[0025] Figure 6C 2 are diagrams for describing a method of manufacturing an intermediate connection member according to a first embodiment.

[0026] Figure 7A 2 are diagrams for describing a method of manufacturing an intermediate connection member according to a first embodiment.

[0027] Figure 7B 2 are diagrams for describing a method of manufacturing an intermediate connection member according to a first embodiment.

[0028] Figure 7C 2 are diagrams for describing a method of manufacturing an intermediate connection member according to a first embodiment.

[0029] Figure 8A 2 are diagrams for describing a method of manufacturing an intermediate connection member according to a first embodiment.

[0030] Figure 8B 2 are diagrams for describing a method of manufacturing an intermediate connection member according to a first embodiment.

[0031] Figure 9A 1 and 2 are diagrams for describing a method for manufacturing a camera module according to a first embodiment.

[0032] Figure 9B 1 and 2 are diagrams for describing a method for manufacturing a camera module according to a first embodiment.

[0033] Figure 9C 1 and 2 are diagrams for describing a method for manufacturing a camera module according to a first embodiment.

[0034] Figure 10A1 and 2 are diagrams for describing a method for manufacturing a camera module according to a first embodiment.

[0035] Figure 10B 1 and 2 are diagrams for describing a method for manufacturing a camera module according to a first embodiment.

[0036] Figure 10C 1 and 2 are diagrams for describing a method for manufacturing a camera module according to a first embodiment.

[0037] Figure 11A is a perspective view of an intermediate connecting member according to a second embodiment.

[0038] Figure 11B yes Figure 11A An enlarged view of a portion of the intermediate connecting member is shown.

[0039] Figure 12A are diagrams for describing a method for manufacturing an intermediate connecting member according to a second embodiment.

[0040] Figure 12B are diagrams for describing a method for manufacturing an intermediate connecting member according to a second embodiment.

[0041] Figure 12C are diagrams for describing a method for manufacturing an intermediate connecting member according to a second embodiment.

[0042] Figure 12D are diagrams for describing a method for manufacturing an intermediate connecting member according to a second embodiment.

[0043] Figure 13 is a perspective view of an intermediate connecting member according to a third embodiment.

[0044] Figure 14 is a perspective view of an intermediate connecting member according to a fourth embodiment.

[0045] Figure 15A is a perspective view of an intermediate connecting member according to a fifth embodiment.

[0046] Figure 15B are explanatory diagrams of two insulating substrate portions according to a fifth embodiment.

[0047] Figure 16A is a perspective view of an intermediate connecting member according to a sixth embodiment.

[0048] Figure 16B is an explanatory diagram of two insulating substrate portions according to the sixth embodiment.

[0049] Figure 17A It is an explanatory diagram of an intermediate connecting member of a modified example.

[0050] Figure 17B It is an explanatory diagram of an intermediate connecting member of a modified example.

[0051] Figure 18A is a perspective view of an intermediate connecting member according to a seventh embodiment.

[0052] Figure 18B It is an explanatory diagram of an insulating substrate portion according to a seventh embodiment.

[0053] Figure 19 is a perspective view of an intermediate connecting member according to an eighth embodiment.

[0054] Figure 20A It is an explanatory diagram of an intermediate connecting member of a modified example.

[0055] Figure 20B It is an explanatory diagram of an intermediate connecting member of a modified example. Specific embodiments

[0056] Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0057] First embodiment

[0058] Figure 1 1 is an explanatory diagram of a digital camera 100 as an image pickup apparatus serving as an example of electronic equipment according to the first embodiment. The digital camera 100 is a digital camera with interchangeable lenses and includes a camera body 101. A lens barrel 102 including a lens is detachably attached to the camera body 101. The lens barrel 102 is an interchangeable lens, that is, a lens unit.

[0059] The camera body 101 includes a housing 111, and a camera module 200 and a processing module 400 provided inside the housing 111. The camera module 200 and the processing module 400 are connected in electrical communication with each other via a cable (not shown).

[0060] Camera module 200 is an example of an electronic module and has a three-dimensional mounting structure. Camera module 200 includes circuit units 201 and 202, and multiple intermediate connecting members 300. In this embodiment, circuit unit 201 serves as a first circuit unit, and circuit unit 202 serves as a second circuit unit. Circuit unit 201 is a printed wiring board, a printed circuit board, or a semiconductor package, and in this embodiment, a semiconductor package. Circuit unit 202 is a printed wiring board, a printed circuit board, or a semiconductor package, and in this embodiment, a printed circuit board. Circuit units 201 and 202 are arranged so as to be separated from each other in the Z direction, which is the stacking direction, and are electrically and mechanically interconnected by multiple intermediate connecting members 300. In other words, intermediate connecting members 300 serve to electrically and mechanically interconnect circuit units 201 and 202, which are arranged opposite each other in the Z direction.

[0061] Circuit unit 201 includes wiring board 211 and image sensor 212, which is an example of a first electronic component mounted on wiring board 211. Wiring board 211 is a package board. Also, wiring board 211 is a rigid board. Image sensor 212 is a semiconductor element and an imaging element.

[0062] Circuit unit 202 includes a wiring board 221 and a plurality of storage elements 222 serving as an example of a second electronic component mounted on wiring board 221. Wiring board 221 is a printed circuit board. In addition, wiring board 221 is a rigid board. Storage element 222 is a semiconductor element and, in this embodiment, is capable of storing image data. The electronic component (the storage element 222 mounted on wiring board 221 in this embodiment) is arranged between wiring boards 211 and 221. Therefore, in this embodiment, wiring boards 211 and 221 are electrically and mechanically interconnected via a plurality of intermediate connecting members 300 so that storage element 222 does not interfere with wiring board 211.

[0063] For example, the image sensor 212 may be a complementary metal oxide semiconductor (CMOS) image sensor or a charge coupled device (CCD) image sensor. The image sensor 212 has a function of converting incident light passing through the lens barrel 102 into an electrical signal.

[0064] The processing module 400 includes a printed wiring board 401 and an image processing device 402, which is a semiconductor device mounted on the printed wiring board 401. The image processing device 402 is, for example, a digital signal processor. The image processing device 402 has the function of obtaining an electrical signal from the image sensor 212, performing processing for correcting the obtained electrical signal, and generating image data.

[0065] Figure 2A is a plan view of the camera module 200, and Figure 2B is a cross-sectional view of the camera module 200. Figure 2A In the figure, for the convenience of description, the circuit unit 201 is omitted. Figure 2B It is along Figure 2A 1B-11B is a cross-sectional view of the camera module 200. The circuit unit 201 of the camera module 200 includes a frame 213 provided on the wiring board 211 and a cover 214 provided on the frame 213. For example, a glass substrate is used as the cover 214.

[0066] The plurality of intermediate connection members 300 are arranged to surround the plurality of storage elements 222. In the present embodiment, five intermediate connection members 300 and two storage elements 222 are provided.

[0067] In the wiring board 211, a plurality of solder pads 215 are arranged on a main surface 2112 opposite to the main surface 2111 on which the image sensor 212 is mounted. A solder resist film not shown may be provided on the main surface 2112. In this case, openings are preferably provided in the solder resist film at positions corresponding to the solder pads 215. The shape of each of the solder pads 215 is not particularly limited and may be, for example, a circle or a polygon in a plan view. In addition, the relationship between the solder resist film and the solder pad may be one of solder mask definition: SMD and non-solder mask definition: NSMD. As the insulating material of the insulating substrate of the wiring board 211, a resin with a small thermal expansion coefficient is used.

[0068] In the wiring board 221, a plurality of pads 225 and a plurality of pads 226 are arranged on a main surface 2211 on which a storage element 222 is mounted. A plurality of storage elements 222 are bonded to the plurality of pads 226 via solder 230. A solder resist film not shown may be provided on the main surface 2211. In this case, an opening is preferably provided in the solder resist film at a position corresponding to the pads 225 and 226. The shape of each of the pads 225 and 226 is not particularly limited and may be, for example, a circle or a polygon in a plan view. In addition, the relationship between the solder resist film and the pads may be either SMD or NSMD. As the insulating material of the insulating substrate of the wiring board 221, a resin such as FR-4 is used.

[0069] Each intermediate connection member 300 includes a plurality of wiring portions 310 extending in the Z direction. Both end surfaces 3101 and 3102 of each wiring portion 310 in the Z direction are exposed to the outside. The end surface 3101 is electrically and mechanically connected to a corresponding one of the pads 215 via solder 240, and the end surface 3102 is electrically and mechanically connected to a corresponding one of the pads 225 via solder 250.

[0070] The pads 215, 225, and 226 are each an electrode formed of a metal such as copper as a conductive material. For example, the pads 215, 225, and 226 are each a signal electrode, a power supply electrode, a ground electrode, or a dummy electrode.

[0071] Figure 3A is a perspective view of the intermediate connection member 300 according to the first embodiment. Figure 3B yes Figure 3A An enlarged view of a portion of the intermediate connecting member 300 is shown.

[0072] The intermediate connecting member 300 is a rigid plate having a rectangular parallelepiped shape and has a pair of end surfaces 301 and 302 in the Z direction, each of which is used for bonding. Here, the longitudinal direction of the intermediate connecting member 300 is the X direction, the width direction of the intermediate connecting member 300 is the Y direction, and the height direction of the intermediate connecting member 300 is the Z direction. The Z direction serves as a first direction, the X direction serves as a second direction, and the Y direction serves as a third direction. The X direction, Y direction, and Z direction intersect with each other. In this embodiment, the X direction, Y direction, and Z direction are perpendicular to each other.

[0073] The intermediate connection member 300 includes a plurality of wiring portions 311 serving as a plurality of first wiring portions and a plurality of wiring portions 312 serving as a plurality of second wiring portions. The plurality of wiring portions 311 and the plurality of wiring portions 312 constitute Figure 2A and Figure 2B A plurality of wiring sections 310 are shown.

[0074] The intermediate connection member 300 includes an insulating substrate portion 321 serving as a first insulating substrate portion and an insulating substrate portion 322 serving as a second insulating substrate portion. Furthermore, the intermediate connection member 300 includes an insulating layer portion 323 disposed between the insulating substrate portions 321 and 322 and formed of a material different from that of the insulating substrate portions 321 and 322.

[0075] Multiple wiring portions 311 are arranged between insulating substrate portion 321 and insulating layer portion 323. Furthermore, multiple wiring portions 311 are arranged at intervals in the X direction. Furthermore, multiple wiring portions 311 are arranged to extend in the Z direction. Therefore, both end surfaces 3111 and 3112 of each of the multiple wiring portions 311 in the Z direction are exposed to the outside of both end surfaces 301 and 302 of intermediate connecting member 300, allowing for soldering to terminal blocks 211 and 221.

[0076] Multiple wiring portions 312 are arranged between insulating substrate portion 322 and insulating layer portion 323. Furthermore, multiple wiring portions 312 are arranged at intervals in the X direction. Furthermore, multiple wiring portions 312 are arranged to extend in the Z direction. Therefore, both end surfaces 3121 and 3122 of each of the multiple wiring portions 312 in the Z direction are exposed to the outside of both end surfaces 301 and 302 of intermediate connecting member 300, allowing for soldering to terminal blocks 211 and 221.

[0077] In addition, the plurality of wiring portions 311 and the plurality of wiring portions 312 are arranged alternately in the X direction. The insulating layer portion 323 is arranged between the plurality of wiring portions 311 and the plurality of wiring portions 312. That is, the plurality of wiring portions 311 and the plurality of wiring portions 312 are separated from each other in the Y direction. Therefore, the plurality of wiring portions 311 and the plurality of wiring portions 312 are arranged in a staggered manner in the X direction. Due to this staggered arrangement of the plurality of wiring portions 311 and the plurality of wiring portions 312, a further high-density arrangement of the wiring can be achieved, and therefore further miniaturization of the camera module 200 can be achieved. It should be noted that, in the case where there is no need to arrange the wiring at a high density, the plurality of wiring portions 311 and the plurality of wiring portions 312 can be arranged relative to each other instead of being arranged in a staggered manner.

[0078] The insulating layer portion 323 is formed by solidifying the adhesive, that is, curing the adhesive. That is, the insulating substrate portion 321 , the insulating substrate portion 322 , the plurality of wiring portions 311 , and the plurality of wiring portions 312 are integrated via the insulating layer portion 323 , thereby forming the intermediate connection member 300 .

[0079] Insulating substrate portions 321 and 322 are formed from the same insulating material. The insulating material of insulating substrate portions 321 and 322 is glass epoxy resin. Glass epoxy resin is a material obtained by, for example, impregnating a glass fabric obtained by weaving glass fibers into a cloth-like shape with liquid epoxy resin and then heat-curing the epoxy resin. It is also called epoxy glass, epoxy glass resin, etc. Insulating layer portion 323 is formed by, for example, solidifying an adhesive containing epoxy resin or silicone resin as a main component. Wiring portions 311 and 312 are each formed from a conductive material such as copper.

[0080] Each of the plurality of wiring portions 311 is formed with the same diameter. Therefore, a conductor into which a large current flows (for example, a wiring portion serving as a ground wire among the plurality of wiring portions 311) can be formed of a different material than the other wiring portions, that is, a material having a lower resistivity. The same applies to the plurality of wiring portions 312.

[0081] The length L of the intermediate connection member 300 in the X direction is smaller than the lengths of the wiring boards 211 and 221. The width W of the intermediate connection member 300 in the Y direction depends on the areas of the main surfaces 2112 and 2211 of the wiring boards 211 and 221 and the method for manufacturing the camera module 200.

[0082] When the intermediate connecting member 300 is erected relative to the terminal plate 221 during the manufacturing process and is bonded to the terminal plate 221 with solder, the width W of the intermediate connecting member 300 is preferably 1 mm or more. In addition, considering high-density arrangement, the width W of the intermediate connecting member 300 is preferably 5 mm or less.

[0083] In addition, memory element 222 has the largest height among the electronic components mounted on main surface 2211 of wiring board 221. The height H of intermediate connecting member 300 in the Z direction is preferably greater than the height of memory element 222. For example, when the height of memory element 222 in the Z direction is 1.6 mm, the height H of intermediate connecting member 300 is preferably greater than 1.6 mm.

[0084] The spacing P between the two closest wiring portions 311 and 312 is preferably 0.36 mm to 0.44 mm.

[0085] A method of manufacturing the intermediate connection member 300 will be described. Figures 4A to 8B 3 are diagrams for describing steps of a method for manufacturing the intermediate connection member 300 .

[0086] exist Figure 4A and Figure 4B In the illustrated step, a matrix material 500 having a plate shape is prepared. Figure 4A is a plan view of the parent material 500, and Figure 4B It is along Figure 4A 1 is a cross-sectional view of the matrix material 500 taken along line IV-IV shown in FIG. Although the illustration is omitted here, two matrix materials 500 are prepared. The matrix material 500 is formed of an insulating material such as glass epoxy resin (eg, FR-4). Figure 3A The thickness W of the intermediate connection member 300 shown is preferably 5 mm or less. Therefore, the thickness of the matrix material 500 is preferably 2.5 mm or less.

[0087] Next, a process of defining a plurality of grooves in the main surface 501 of each of the two parent materials 500 is performed. Figure 5A and Figure 5B In the step shown, an insulating substrate 601 having a main surface 611 provided with a plurality of grooves 621 is formed. Figure 5A is a plan view of the insulating substrate 601, and Figure 5B It is along Figure 5A: This is a cross-sectional view of the insulating substrate 601 taken along line VV. The groove 621 serves as a first groove. The main surface 611 serves as a first main surface. The insulating substrate 601 serves as a first insulating substrate.

[0088] Similarly, in Figure 5C In the step shown, an insulating substrate 602 having a main surface 612 provided with a plurality of grooves 622 is formed. Figure 5C 6 is a cross-sectional view of the insulating substrate 602. The groove 622 serves as a second groove. The main surface 612 serves as a second main surface. The insulating substrate 602 serves as a second insulating substrate.

[0089] The plurality of grooves 621 are defined at intervals in the X direction and extend in the Z direction. Similar to the plurality of grooves 621, the plurality of grooves 622 are defined at intervals in the X direction and extend in the Z direction. Although the plurality of grooves 621 and the plurality of grooves 622 are each defined as a straight line in the present embodiment, the plurality of grooves 621 and the plurality of grooves 622 may each be defined as a curved line.

[0090] The width and depth of each of the grooves 621 and 622 are set according to the diameter of the wiring portions 311 and 312 to be formed. For example, if the diameter of the wire described later is φ0.2 mm, the width and depth of each of the grooves 621 and 622 are preferably set to approximately 0.2 mm, which is the same as the diameter of the wire. Furthermore, it is preferable that the pitch of the plurality of grooves 621 and the pitch of the plurality of grooves 622 are set to the same value, and each pitch is set to approximately 0.57 mm, for example.

[0091] Although the cross-sectional shape of each of the grooves 621 and 622 is rectangular in this embodiment, the cross-sectional shape is not limited thereto and may be, for example, a semicircular shape. Although the process for defining the grooves 621 and 622 is preferably performed by machining using a cutting machine or a slicer, the grooves 621 and 622 may be defined by masking the matrix material 500 with a resist or the like and physically machining the matrix material 500 using a milling machine. Alternatively, the insulating substrates 601 and 602 may be molded using a mold having a shape suitable for defining the grooves. Forming an insulating substrate having multiple grooves adjacent to each other is easier than forming an insulating substrate having multiple through-holes adjacent to each other. Therefore, the insulating substrate 601 having multiple grooves 621 and the insulating substrate 602 having multiple grooves 622 can be formed with high precision.

[0092] Next, in Figure 6A and Figure 6B In the illustrated step, a plurality of conductive members 701 are arranged in a plurality of grooves 621 . Figure 6Ais a plan view of an insulating substrate 601 in which a plurality of conductive members 701 are arranged, and Figure 6B is an insulating substrate 601 in which a plurality of conductive members 701 are arranged. Figure 6A The conductive member 701 is used as the first conductive member. Similarly, in Figure 6C In the illustrated step, the plurality of conductive members 702 are disposed in the plurality of grooves 622 . Figure 6C : is a cross-sectional view of an insulating substrate 602 in which a plurality of conductive members 702 are arranged. The conductive members 702 serve as second conductive members.

[0093] Each of the plurality of conductive members 701 and the plurality of conductive members 702 is a conductive wire formed of a metal such as copper. In this embodiment, the diameter of each of the conductive members 701 is set to the same value. In this embodiment, the diameter of each of the conductive members 702 is also set to the same value. Furthermore, in this embodiment, the diameter of each of the conductive members 701 and the diameter of each of the conductive members 702 are also set to the same value.

[0094] Although the cross-sectional shape of the wire is circular in this embodiment, the cross-sectional shape is not limited thereto and may be a polygon such as a quadrilateral. Figure 6A and Figure 6B In the step shown, the plurality of conductive members 701 are assembled in the plurality of grooves 621. Figure 6C In the step shown, the plurality of conductive members 702 are fitted into the plurality of grooves 622. Therefore, the conductive members 701 can be suppressed from falling out of the grooves 621 of the insulating substrate 601 in a later step, and the conductive members 702 can be suppressed from falling out of the grooves 622 of the insulating substrate 602 in a later step.

[0095] When the conductive member 701 is mounted in the groove 621, an adhesive (not shown) may be applied to the groove 621 in advance. Similarly, when the conductive member 702 is mounted in the groove 622, an adhesive (not shown) may be applied to the groove 622 in advance. Preferably, an adhesive that hardens at approximately room temperature is selected as this adhesive. Thus, the conductive member 701 can be effectively prevented from falling out of the groove 621 of the insulating substrate 601, and the conductive member 702 can be effectively prevented from falling out of the groove 622 of the insulating substrate 602.

[0096] It should be noted that while installing the conductive wires in the grooves is a preferred method for arranging the conductive members 701 and 702 in the grooves 621 and 622, the method is not limited thereto. For example, the conductive members can be formed by applying a conductive paste in the grooves using a dispenser or the like and firing the paste. The conductive members 701 and 702 can be made of any material as long as the material is conductive. For example, the material can be an inorganic material such as copper, silver, or aluminum, or an organic material such as conductive rubber.

[0097] Considering the bonding properties with the pads of the terminal blocks 211 and 221 via solder, as well as the operability and deformation of the conductive members 701 and 702 when arranged in the grooves 621 and 622, the diameter and thickness of the conductive members 701 and 702 are preferably greater than or equal to 0.05 mm and less than or equal to 2 mm. Considering the high-density arrangement of the wires, the diameter and thickness of the conductive members 701 and 702 are more preferably less than or equal to 0.5 mm.

[0098] Next, the method for forming 7A to 7C 800 is formed by bonding the main surface 611 of the insulating substrate 601 and the main surface 612 of the insulating substrate 602 (with the insulating member 651 positioned therebetween) together, so that the direction in which the plurality of conductive members 701 extend is aligned with the direction in which the plurality of conductive members 702 extend. In this series of steps, the structure 800 is formed by bonding the main surface 611 of the insulating substrate 601 and the main surface 612 of the insulating substrate 602 together so that the plurality of conductive members 701 and the plurality of conductive members 702 are alternately arranged in the X direction.

[0099] The following describes the formation of 7A to 7C The steps of the structure 800 are shown. First, Figure 7A In the illustrated step, adhesive 650 is applied to main surface 611 of insulating substrate 601. Adhesive 650 is, for example, an insulating adhesive containing epoxy resin or silicone resin as a main component. Adhesive 650 can be selected from adhesives that are heat-cured at approximately 100°C.

[0100] Next, in Figure 7BIn the illustrated step, before the adhesive 650 cures, the main surface 612 of the insulating substrate 602 is brought into contact with the adhesive 650, such that the adhesive 650 is sandwiched between the main surfaces 611 and 612. The insulating substrates 601 and 602 are aligned by an alignment device (not shown). Thus, while controlling the thickness of the adhesive 650 layer, the main surface 611 of the insulating substrate 601 and the main surface 612 of the insulating substrate 602 are bonded together with the plurality of conductive members 701 and 702 positioned therebetween. Alignment between the insulating substrates 601 and 602 can be performed by causing the end surfaces of the insulating substrates 601 and 602 to abut against an abutment member (not shown), or by using pre-formed alignment marks (not shown). Furthermore, to control the thickness of the adhesive 650 layer, an insulating spacer serving as a thickness control material may be mixed into the adhesive 650.

[0101] Then, in Figure 7C In the step shown, adhesive 650 is cured to form insulating member 651. As described above, by bonding main surface 611 of insulating substrate 601 and main surface 612 of insulating substrate 602 together using adhesive 650, insulating member 651 is formed via cured adhesive 650.

[0102] In this embodiment, structure 800 is processed to form intermediate connecting member 300. The insulating substrate 601 in structure 800 corresponds to the insulating substrate portion 321 in intermediate connecting member 300. The insulating substrate 602 in structure 800 corresponds to the insulating substrate portion 322 in intermediate connecting member 300. The insulating member 651 in structure 800 corresponds to the insulating layer portion 323 in intermediate connecting member 300. The conductive member 701 in structure 800 corresponds to the wiring portion 311 in intermediate connecting member 300. The conductive member 702 in structure 800 corresponds to the wiring portion 312 in intermediate connecting member 300.

[0103] from inhibiting the subsequent reflow step Figure 3AFrom the perspective of preventing the insulating substrate portions 321 and 322 from peeling off, the thickness of the insulating member 651, which becomes the insulating layer portion 323, in the Y direction is preferably 10 μm or greater. If the thickness is less than 10 μm, the insulating substrate portions 321 and 322 may peel off from each other, or the conductive members 701 and 702 may short-circuit when they are arranged opposite each other. Furthermore, to consider deformation of the conductive member, the thickness of the insulating member 651, which becomes the insulating layer portion 323, in the Y direction is preferably 300 μm or less. If the thickness is greater than 300 μm, the conductive member may deform due to moisture absorption, or the insulating layer portion 323 may lack sufficient mechanical strength. In other words, the thickness of the insulating member 651, which becomes the insulating layer portion 323, in the Y direction is preferably 10 μm to 300 μm. Therefore, the thickness of the insulating layer portion 323 in the Y direction is preferably 10 μm to 300 μm.

[0104] Next, in Figure 8A and Figure 8B In the step shown, the structure 800 is cut in the X direction. Figure 8A is a plan view of structure 800, and Figure 8B It is along Figure 8A By cutting the structure 800 in the X direction along lines separated by a distance H from each other in the Z direction, the Figure 3A The end surfaces 3111, 3112, 3121, and 3122 of the wiring portions 311 and 312 are shown. In this embodiment, by cutting the structure 800 in the X and Z directions, an intermediate connecting member 300 having predetermined dimensions, namely, a predetermined length L, height H, and width W, can be formed. For example, an intermediate connecting member 300 is formed in which each of the insulating substrate portions 321 and 322 has a thickness of 0.5 mm in the Y direction, and the insulating layer portion 323 has a thickness of 0.085 mm in the Y direction, and the intermediate connecting member has a length L of 41.0 mm, a height H of 2.0 mm, and a width W of 1.085 mm. The structure 800 is cut using a cutting machine, a wire saw, or the like. In this step, one intermediate connecting member 300 can be formed from one structure 800, or multiple intermediate connecting members 300 can be formed from one structure 800. When a plurality of intermediate connection members 300 are formed from one structure 800 , one structure 800 may be cut in the X direction at intervals of H in the Z direction. Alternatively, one structure 800 may be cut in the Z direction at intervals of L in the X direction.

[0105] Note that the direction of the cutting structure 800 may be inclined relative to the conductive members 701 and 702. In this case, the end surface of the formed wiring portion has an elliptical shape, which has a larger cross-sectional area than a circle, and thus the bonding area with the solder can be larger.

[0106] According to the manufacturing process as described above, it is possible to obtain Figure 3A The intermediate connection member 300 shown has the wiring portions 311 and 312 arranged with high precision. In addition, a high-precision intermediate connection member 300 including the wiring portions 311 and 312 arranged with high density at a small pitch can be obtained.

[0107] Here, the pitch between two closest wiring portions among the plurality of wiring portions 311 and 312 is represented by P. The ratio H / P of the height H of the intermediate connection member 300 in the Z direction to the pitch P is preferably greater than or equal to 4. For example, if the pitch P is set to 0.4 mm and the height H is set to 2.0 mm, the ratio H / P is 5. As described above, the intermediate connection member 300 having a large height H can be formed while the wiring portions 311 and 312 are arranged at a high density.

[0108] Next, a method of manufacturing the camera module will be described. Figures 9A to 10C 1 and 2 are diagrams for describing steps of a method for manufacturing the camera module 200 according to the first embodiment.

[0109] like Figure 9A As shown in FIG. 2 , a wiring board 221 is prepared. Then, solder paste P1 containing solder powder and flux is supplied to pads 225 and 226 on the wiring board 221, as shown in FIG. Figure 9B As shown. As solder powder, for example, Sn-Ag-Cu solder powder is used. Solder paste P1 can be supplied by, for example, screen printing or using a dispenser.

[0110] Similar to so-called offset printing, the solder paste P1 may be supplied to cover the entire surface of the pads 225 and 226 , or may be supplied to cover a portion of the surface of the pads 225 and 226 .

[0111] Next, if Figure 9C As shown, the memory element 222, the intermediate connection member 300 and the chip components not shown are placed on the wiring board 211, as shown in FIG. Figure 9CAs shown. The chip component not shown is, for example, a capacitor or a resistor. Using a mounter or the like, the storage element 222, the intermediate connecting member 300, and the chip component not shown are placed on the corresponding pads. That is, the storage element 222 is placed on the pad 226, and the intermediate connecting member 300 is placed on the pad 225. At this time, the intermediate connecting member 300 is mounted on the wiring board 221 so that the end surface 3102 of the wiring portion 310 of the intermediate connecting member 300 contacts the solder paste P1. The intermediate connecting member 300 is preferably capable of standing upright without any supporting mechanism after being mounted on the wiring board 221.

[0112] Next, in a reflow oven (not shown), a reflow process is performed in which the solder paste P1 is heated to a temperature equal to or higher than the melting point of the solder powder to melt and aggregate the solder powder, and then cooled to a temperature lower than the melting point of the solder powder to solidify the solder paste P1. Due to the solidification of the solder, the memory element 222, the intermediate connection member 300, and the chip components (not shown) are electrically and mechanically bonded to the wiring board 221, as shown in FIG. Figure 10A That is, a structure in which the intermediate connection member 300 and the circuit unit 202 are bonded via solder is manufactured. The wiring portion 310 of the intermediate connection member 300 is electrically connected to the pad 225 via solder 250 .

[0113] Next, if Figure 10B As shown, solder paste P2 containing solder powder and flux is supplied to pads 215 on wiring board 211. As solder powder, for example, Sn-Ag-Cu solder powder is used. Solder paste P2 can be supplied by, for example, screen printing or using a dispenser. Similar to so-called offset printing, solder paste P2 can be supplied to cover the entire surface of pads 215, or solder paste P2 can be supplied to cover a portion of the surface of pads 215.

[0114] Then, if Figure 10C As shown, the circuit unit 201 is mounted on the intermediate connection member 300 on the circuit unit 202. The circuit unit 201 is placed on the intermediate connection member 300 by using a mounter or the like. At this time, the circuit unit 201 is mounted on the intermediate connection member 300 so that the solder paste P2 contacts the end surface 3101 of the wiring portion 310 of the intermediate connection member 300.

[0115] Next, in a reflow furnace (not shown), a reflow process is performed in which the solder paste P2 is heated to a temperature equal to or higher than the melting point of the solder powder to melt and aggregate the solder powder, and then cooled to a temperature lower than the melting point of the solder powder to solidify the solder paste P2. Due to the solidification of the solder, the intermediate connection member 300 is bonded to the circuit unit 201 via the solder, and thus the Figure 2B The camera module 200 is shown.

[0116] In the camera module 200 manufactured in this manner, there is no connection failure between the intermediate connection member 300 and the circuit units 201 and 202 , and thus sufficient optical performance of the image sensor 212 included in the circuit unit 201 can be ensured.

[0117] Second embodiment

[0118] Next, an intermediate connecting member according to a second embodiment will be described. Figure 11A is a perspective view of an intermediate connection member 300A according to the second embodiment. Figure 11B yes Figure 11A An enlarged view of a portion of the intermediate connecting member 300A is shown. Note that, in the second embodiment, elements substantially identical to those of the first embodiment are denoted by the same reference numerals in the drawings and description thereof will be omitted.

[0119] The intermediate connection member 300A is a rigid plate having a rectangular parallelepiped shape, and its paired end faces 301 and 302 in the Z direction each serve as a connection surface. The intermediate connection member 300A includes a plurality of wiring portions 311 and a plurality of wiring portions 312.

[0120] The intermediate connection member 300A includes insulating substrate portions 321 and 322. In addition, the intermediate connection member 300A includes an insulating layer portion 323A disposed between the insulating substrate portions 321 and 322 and formed of a material different from that of the insulating substrate portions 321 and 322.

[0121] The plurality of wiring portions 311 are arranged between the insulating substrate portion 321 and the insulating layer portion 323A. The plurality of wiring portions 312 are arranged between the insulating substrate portion 322 and the insulating layer portion 323A.

[0122] Insulating layer portion 323A includes three insulating layers 323A-1, 323A-2, and 323A-3. Insulating layer 323A-1 serves as a first insulating layer. Insulating layer 323A-2 serves as a second insulating layer. Insulating layer 323A-3 serves as a third insulating layer. Insulating layers 323A-1 and 323A-2 are formed by solidifying an adhesive made of the same material. Insulating layer 323A-3 is arranged between insulating layers 323A-1 and 323A-2. Insulating layer 323A-3 is formed from a different material than insulating layers 323A-1 and 323A-3. Insulating layers 323A-1 and 323A-2 are formed by, for example, solidifying an adhesive primarily composed of epoxy resin or silicone resin. Insulating layer 323A-3 is formed from, for example, polyimide.

[0123] The thickness W of the insulating layer portion 323A in the Y direction is preferably 10 μm to 300 μm, as in the first embodiment.

[0124] Next, a method for manufacturing the intermediate connection member 300A according to the second embodiment will be described. 12A to 12D The steps of the manufacturing method for the intermediate connection member 300A according to the second embodiment are described. The manufacturing method for the intermediate connection member 300A according to the second embodiment is the same as the manufacturing method for the intermediate connection member 300 according to the first embodiment, except that the intermediate connection member 300A is formed. 7A to 7C That is, in 12A to 12D The structure 800A formed in the steps shown is different from the structure 800 formed in the first embodiment. Therefore, only the steps for forming 12A to 12D 800A shown in FIG. In this series of steps, structure 800A is formed by bonding main surface 611 of insulating substrate 601 and main surface 612 of insulating substrate 602 together with insulating member 651A positioned therebetween, so that the directions in which the plurality of conductive members 701 extend and the directions in which the plurality of conductive members 702 extend are aligned. In this series of steps, structure 800A is formed by bonding main surface 611 of insulating substrate 601 and main surface 612 of insulating substrate 602 together so that the plurality of conductive members 701 and the plurality of conductive members 702 are alternately arranged in the X direction.

[0125] In the formation of 12A to 12D In the steps of the structure 800A shown, the insulating member 651A is formed by bonding the main surface 611 of the insulating substrate 601 and the main surface 612 of the insulating substrate 602 together with an adhesive with the insulating sheet 650A-3 positioned between the insulating substrates 601 and 602. The steps for forming the structure 800A will be described in detail below. First, Figure 12A In the step shown, an adhesive 650A-1 is applied on the main surface 611 of the insulating substrate 601. The adhesive 650A-1 is, for example, an insulating adhesive containing epoxy resin or silicone resin as a main component.

[0126] Next, in Figure 12B In the illustrated step, before the adhesive 650A-1 is cured, an insulating sheet 650A-3 is placed on the adhesive 650A-1, and then an adhesive 650A-2 having the same composition as the adhesive 650A-1 is applied to the insulating sheet 650A-3. The insulating sheet 650A-3 is a film-shaped sheet made of polyimide or the like.

[0127] Next, in Figure 12CIn the illustrated step, the main surface 612 of the insulating substrate 602 is brought into contact with the adhesive 650A-2. The insulating substrates 601 and 602 are aligned using an unillustrated alignment device. The insulating sheet 650A-3 defines the thickness of each layer of adhesive 650A-1 and 650A-2 in the Y direction, thereby making the thickness of the layers of adhesive 650A-1 and 650A-2 uniform in the Y direction. Thus, while controlling the thickness of the layers of adhesive 650A-1 and 650A-2, the main surface 611 of the insulating substrate 601 and the main surface 612 of the insulating substrate 602 are bonded together with the plurality of conductive members 701 and 702 positioned therebetween. Alignment between the insulating substrates 601 and 602 can be performed by causing the end surfaces of the insulating substrates 601 and 602 to abut against an unillustrated abutment member, or by using pre-formed alignment marks, unillustrated.

[0128] Then, the adhesives 650A-1 and 650A-2 are cured to form Figure 12D The insulating member 651A shown is composed of an insulating layer 651A-1 formed by curing the adhesive 650A-1, an insulating layer 651A-2 formed by curing the adhesive 650A-2, and an insulating sheet 650A-3.

[0129] In this embodiment, the intermediate connecting member 300A is formed by cutting the structure 800A. The cutting method is essentially the same as in the first embodiment. The insulating substrate 601 in the structure 800A corresponds to the insulating substrate portion 321 in the intermediate connecting member 300A. The insulating substrate 602 in the structure 800A corresponds to the insulating substrate portion 322 in the intermediate connecting member 300A. The insulating member 651A in the structure 800A corresponds to the insulating layer portion 323A in the intermediate connecting member 300A. The conductive member 701 in the structure 800A corresponds to the wiring portion 311 in the intermediate connecting member 300A. The conductive member 702 in the structure 800A corresponds to the wiring portion 312 in the intermediate connecting member 300A.

[0130] In addition, the insulating layer 651A-1 in the structure 800A corresponds to the insulating layer 323A-1 in the intermediate connection member 300A. The insulating layer 651A-2 in the structure 800A corresponds to the insulating layer 323A-2 in the intermediate connection member 300A. The insulating sheet 650A-3 in the structure 800A corresponds to the insulating layer 323A-3 in the intermediate connection member 300A.

[0131] According to the second embodiment as well, similar to the first embodiment, an intermediate connecting member 300A can be obtained in which the wiring portions 311 and 312 are arranged with high precision. Furthermore, a high-precision intermediate connecting member 300A can be obtained, including the wiring portions 311 and 312 arranged at a high density with a small pitch. It should be noted that the manufacturing method for the camera module according to the second embodiment is substantially the same as that of the first embodiment, and therefore, its description will be omitted.

[0132] Third embodiment

[0133] Next, an intermediate connecting member according to a third embodiment will be described. Figure 13 is a perspective view of an intermediate connecting member 300B according to a third embodiment. Note that in the third embodiment, elements substantially identical to those of the first embodiment are denoted by the same reference numerals in the drawings, and their descriptions are omitted. Furthermore, the manufacturing method for intermediate connecting member 300B is also substantially identical to that of the first embodiment, and therefore, its description will be omitted.

[0134] The intermediate connection member 300B includes insulating substrate portions 321 and 322 and an insulating layer portion 323. Furthermore, the intermediate connection member 300B includes a wiring portion group 311B consisting of a plurality of first wiring portions and a wiring portion group 312B consisting of a plurality of second wiring portions. The wiring portion groups 311B and 312B are formed of metal, such as copper.

[0135] The wiring portion group 311B includes a wiring portion 311B-1 and a wiring portion 311B-2 having a larger diameter than the wiring portion 311B-1. The wiring portion group 312B includes a wiring portion 312B-1 and a wiring portion 312B-2 having a larger diameter than the wiring portion 312B-1.

[0136] Therefore, a larger current can flow through wiring portions 311B-2 and 312B-2 than through wiring portions 311B-1 and 312B-1. Therefore, wiring portions 311B-2 and 312B-2 can be used as, for example, grounding wires. When manufacturing intermediate connecting member 300B, a wire with a larger diameter than that used for wiring portions 311B-1 and 312B-1 can be used for wiring portions 311B-2 and 312B-2. For example, if the diameter of each of wiring portions 311B-1 and 312B-1 is set to φ0.2 mm, the diameter of each of wiring portions 311B-2 and 312B-2 used as a grounding wire can be set to φ0.3 mm, which is larger than φ0.2 mm.

[0137] Wiring portion groups 311B and 312B can each include a wiring portion with a first diameter and a wiring portion with a second diameter greater than the first diameter. In the present embodiment, wiring portions 311B-1 and 312B-1 are used as wiring portions with a first diameter, and wiring portions 311B-2 and 312B-2 are used as wiring portions with a second diameter. It should be noted that it is possible to adopt a structure in which only one of wiring portion groups 311B and 312B includes a wiring portion 311B-2 or 312B-2 with a diameter greater than wiring portion 311B-1 or 312B-1. That is, the structure of the wiring portion group is not limited, as long as the diameter of at least one wiring portion in wiring portion groups 311B and 312B is greater than the diameter of other wiring portions. In addition, the insulating layer portion 323 can be constructed in a manner similar to the insulating layer portion 323A of the second embodiment.

[0138] Fourth embodiment

[0139] Next, an intermediate connecting member according to a fourth embodiment will be described. Figure 14 is a perspective view of an intermediate connecting member 300C according to a fourth embodiment. It should be noted that in the fourth embodiment, elements substantially identical to those in the first embodiment are denoted by the same reference numerals in the drawings, and their description will be omitted. Furthermore, the manufacturing method for intermediate connecting member 300C is also substantially the same as that of the first embodiment, and therefore its description will be omitted. Although the first embodiment describes an intermediate connecting member 300 having a layered structure comprising two insulating substrate portions 321 and 322, with multiple wiring portions 311 and multiple wiring portions 312 arranged in the connecting portion between the two insulating substrates, the structure is not limited to this. Any structure may be employed as long as the intermediate connecting member comprises three or more insulating substrate portions, and multiple first wiring portions and multiple second wiring portions are arranged in the connecting portion between two adjacent insulating substrate portions.

[0140] The intermediate connecting member 300C of the fourth embodiment includes three insulating substrate portions 321C-1, 322C, and 321C-2. When insulating substrate portion 321C-1 serves as the first insulating substrate portion, insulating substrate portion 322C serves as the second insulating substrate portion. Alternatively, when insulating substrate portion 321C-2 serves as the first insulating substrate portion, insulating substrate portion 322C serves as the second insulating substrate portion. The insulating material forming insulating substrate portions 321C-1, 322C, and 321C-2 is, for example, FR-4.

[0141] Insulating layer portion 323C-1 is disposed between insulating substrate portions 321C-1 and 322C, and insulating layer portion 323C-2 is disposed between insulating substrate portions 321C-2 and 322C. Insulating layer portions 323C-1 and 323C-2 are formed from an insulating material different from the insulating material constituting insulating substrate portions 321C-1, 322C, and 321C-2. Insulating layer portions 323C-1 and 323C-2 are formed by curing an insulating adhesive containing, for example, epoxy resin or silicone resin as a main component.

[0142] The intermediate connecting member 300C of the fourth embodiment includes a plurality of first connecting portions 311-1 and a plurality of second connecting portions 312-1. The plurality of connecting portions 311-1 are arranged between an insulating substrate portion 321C-1 and an insulating layer portion 323C-1, extending in the Z direction, with both ends of the connecting portions exposed to the outside. The plurality of connecting portions 312-1 are arranged between an insulating substrate portion 322C and an insulating layer portion 323C-1, extending in the Z direction, with both ends of the connecting portions exposed to the outside. The plurality of connecting portions 311-1 and the plurality of connecting portions 312-1 are arranged alternately in the X direction.

[0143] In addition, the intermediate connecting member 300C includes a plurality of wiring portions 311-2 serving as a plurality of first wiring portions and a plurality of wiring portions 312-2 serving as a plurality of second wiring portions. The plurality of wiring portions 311-2 are arranged between the insulating substrate portion 321C-2 and the insulating layer portion 323C-2 so as to extend in the Z direction, with both end surfaces thereof exposed to the outside. The plurality of wiring portions 312-2 are arranged between the insulating substrate portion 322C and the insulating layer portion 323C-2 so as to extend in the Z direction, with both end surfaces thereof exposed to the outside. The plurality of wiring portions 311-2 and the plurality of wiring portions 312-2 are arranged alternately in the X direction.

[0144] As described above, according to the fourth embodiment, similar to the first embodiment, an intermediate connecting member 300C can be obtained in which the wiring portions 311-1, 312-1, 311-2, and 312-2 are arranged with high precision. Furthermore, according to the fourth embodiment, the intermediate connecting member 300C can be manufactured with high precision while achieving a fine-pitch wiring structure. It should be noted that while the insulating layer portions 323C-1 and 323C-2 have substantially the same configuration as the insulating layer portion 323 of the first embodiment, the insulating layer portions 323C-1 and 323C-2 can have substantially the same configuration as the insulating layer portion 323A of the second embodiment.

[0145] Fifth embodiment

[0146] Next, an intermediate connecting member of a fifth embodiment will be described. Figure 15A is a perspective view of an intermediate connecting member 300D according to the fifth embodiment. It should be noted that the configuration and manufacturing method of the intermediate connecting member 300D of the fifth embodiment are substantially the same as those of the intermediate connecting member 300B of the third embodiment. That is, the manufacturing method of the intermediate connecting member 300D of the fifth embodiment is substantially the same as the manufacturing method used for the intermediate connecting member 300 of the first embodiment.

[0147] Intermediate connecting member 300D includes a wiring portion assembly 311D constructed in a manner substantially similar to wiring portion assembly 311B of the third embodiment, and a wiring portion assembly 312D constructed in a manner substantially similar to wiring portion assembly 312B of the third embodiment. Furthermore, intermediate connecting member 300D includes an insulating substrate portion 321D constructed in a manner substantially similar to insulating substrate portion 321 of the third embodiment, an insulating substrate portion 322D constructed in a manner substantially similar to insulating substrate portion 322 of the third embodiment, and an insulating layer portion 323D constructed in a manner substantially similar to insulating layer portion 323 of the third embodiment. Insulating substrate portion 321D serves as a first insulating substrate portion, and insulating substrate portion 322D serves as a second insulating substrate portion. Insulating substrate portions 321D and 322D face each other, with insulating layer portion 323D positioned between them. Insulating substrate portions 321D and 322D are formed from the same material (e.g., glass epoxy) as insulating substrate portions 321 and 322 described in the first embodiment. The insulating layer portion 323D is formed of a material different from that of the insulating substrate portions 321D and 322D and the same material as that of the insulating layer portion 323 described in the first embodiment (eg, a setting adhesive containing epoxy resin or silicone resin as a main component).

[0148] In the fifth embodiment, the wiring portion group 311D includes a plurality of wiring portions 311D-0 as a plurality of first wiring portions. In this embodiment, the wiring portion group 311D includes seven wiring portions 311D-0. The plurality of wiring portions 311D-0 are arranged at a certain distance in the X direction. Each of the wiring portions 311D-0 is arranged to extend in the Z direction so that its two end faces in the Z direction are exposed to the outside. The material of each of the wiring portions 311D-0 is a conductive material such as copper. The plurality of wiring portions 311D-0 include, for example, six wiring portions 311D-1 as at least one first wiring portion, and, for example, one wiring portion 311D-2 as at least another first wiring portion having a size and / or shape different from that of the wiring portion 311D-1. The number of wiring portions 311D-1 is preferably greater than or equal to 2, and in the fifth embodiment, is 6. The number of wiring portions 311D-2 is preferably less than the number of wiring portions 311D-1, and in the fifth embodiment, is 1.

[0149] The wiring portion group 312D is arranged at a position away from the wiring portion group 311D in the Y direction. The wiring portion group 312D includes a plurality of wiring portions 312D-0 as a plurality of second wiring portions. In the present embodiment, the wiring portion group 312D includes seven wiring portions 312D-0. The plurality of wiring portions 312D-0 are arranged at a certain distance apart in the X direction. Each of the wiring portions 312D-0 is arranged to extend in the Z direction so that its two end faces in the Z direction are exposed to the outside. The material of each of the wiring portions 312D-0 is a conductive material such as copper. The plurality of wiring portions 312D-0 include, for example, six wiring portions 312D-1 as at least one second wiring portion, and, for example, one wiring portion 312D-2 as at least another second wiring portion having a size and / or shape different from that of the wiring portion 312D-1. The number of the wiring portions 312D-1 is preferably greater than or equal to 2, and is 6 in the fifth embodiment. The number of wiring portions 312D- 2 is preferably smaller than the number of wiring portions 312D- 1 , and is one in the fifth embodiment.

[0150] In the manufacturing process of the camera module in the fifth embodiment, it is preferred that the intermediate connecting member 300D is provided with a Figure 9C Alignment marks are shown for alignment accuracy between the wiring boards 221. By providing the intermediate connection member 300D with alignment marks, wiring portions can be arranged with high accuracy in the camera module.

[0151] In addition, during the manufacturing process of the intermediate connection member 300 in the first embodiment, the insulating substrates 601 and 602 are bonded together by using an adhesive, such as Figure 7CAs shown and described above. Also in the fifth embodiment, during the manufacturing process of intermediate connecting member 300D, the insulating substrate corresponding to insulating substrate portion 321D and the insulating substrate corresponding to insulating substrate portion 322D are bonded together using an adhesive. To improve alignment accuracy, it is preferable that at least one of the two insulating substrates be provided with alignment marks. Providing alignment marks on the insulating substrates allows the wiring portions to be positioned with high precision within intermediate connecting member 300D.

[0152] Therefore, in the fifth embodiment, the wiring portion 311D-2 among the plurality of wiring portions 311D-0 and the wiring portion 312D-2 among the plurality of wiring portions 312D-0 serve as alignment marks. The wiring portion 311D-2 is a wiring portion located at an end portion in the X direction among the plurality of wiring portions 311D-0. The wiring portion 312D-2 is a wiring portion located at an end portion in the X direction among the plurality of wiring portions 312D-0.

[0153] Each of the wiring portions 311D-1 has a width W11D in the X direction. Width W11D serves as a first width. Wiring portion 311D-2 has a width W12D in the X direction that is greater than width W11D. Width W12D serves as a second width. Since width W12D of wiring portion 311D-2 is greater than width W11D of each of wiring portions 311D-1 as described above, wiring portion 311D-2 can serve as an alignment mark.

[0154] In addition, each of the wiring portions 311D-1 has a thickness T1D in the Y direction. Thickness T1D serves as a first thickness. The thickness of the wiring portion 311D-2 in the Y direction is a thickness T2D that is greater than thickness T1D. Thickness T2D serves as a second thickness. Since thickness T2D of wiring portion 311D-2 is greater than thickness T1D of wiring portion 311D-1 as described above, wiring portion 311D-2 can serve as an alignment mark.

[0155] Each of the wiring portions 311D-1 and 311D-2 is made of, for example, a conductive wire, and the diameter of the wiring portion 311D-2 is larger than the diameter of each of the wiring portions 311D-1. Therefore, the width W12D of the wiring portion 311D-2 is larger than the width W11D of each of the wiring portions 311D-1, and the thickness T2D of the wiring portion 311D-2 is larger than the thickness T1D of each of the wiring portions 311D-1.

[0156] Each of the wiring portions 312D-1 has a width W13D in the X direction. Width W13D serves as a third width. Wiring portion 312D-2 has a width W14D in the X direction that is greater than width W13D. Width W14D serves as a fourth width. Since, as described above, width W14D of wiring portion 312D-2 is greater than width W13D of wiring portion 312D-1, wiring portion 312D-2 can serve as an alignment mark.

[0157] Furthermore, each of the wiring portions 312D-1 has a thickness T3D in the Y direction. Thickness T3D serves as a third thickness. The thickness of the wiring portion 312D-2 in the Y direction is a thickness T4D that is greater than thickness T3D. Thickness T4D serves as a fourth thickness. Since thickness T4D of the wiring portion 312D-2 is greater than thickness T3D of each of the wiring portions 312D-1 as described above, the wiring portion 312D-2 can serve as an alignment mark.

[0158] Each of the wiring portions 312D-1 and 312D-2 is made of, for example, a conductive wire, and the diameter of the wiring portion 312D-2 is larger than the diameter of the wiring portion 312D-1. Therefore, the width W14D of the wiring portion 312D-2 is larger than the width W13D of each of the wiring portions 312D-1, and the thickness T4D of the wiring portion 312D-2 is larger than the thickness T3D of each of the wiring portions 312D-1.

[0159] In the fifth embodiment, a plurality of wiring portions 311D-0 are arranged on an insulating substrate portion 321D, and a plurality of wiring portions 312D-0 are arranged on an insulating substrate portion 322D. The configurations of the insulating substrate portion 321D on which the wiring portions 311D-0 are arranged and the insulating substrate portion 322D on which the wiring portions 312D-0 are arranged will be described in detail below. Figure 15B 321D and 322D according to the fifth embodiment. Figure 15B 321D and 322D are plan views of the insulating substrate portions 321D and 322D as viewed in the Z direction.

[0160] The insulating substrate portion 321D has a surface 3211D and a surface 3212D opposite to the surface 3211D in the Y direction. The insulating substrate portion 322D has a surface 3221D and a surface 3222D opposite to the surface 3221D in the Y direction. Figure 15A The insulating layer portion 323D is shown disposed between the surfaces 3212D and 3222D. That is, the surfaces 3212D and 3222D are opposite to each other, with the insulating layer portion 323D located therebetween.

[0161] Multiple wiring portions 311D-0 are arranged on surface 3212D, and multiple wiring portions 312D-0 are arranged on surface 3222D. That is, multiple wiring portions 311D-0 are arranged between insulating substrate portion 321D and insulating layer portion 323D, and multiple wiring portions 312D-0 are arranged between insulating substrate portion 322D and insulating layer portion 323D.

[0162] A plurality of groove portions 31D-0 corresponding to the plurality of wiring portions 311D-0 are defined in the surface 3212D. The plurality of groove portions 31D-0 are defined at intervals in the X direction. Each groove portion 31D-0 extends in the Z direction. The plurality of groove portions 31D-0 includes a plurality of groove portions 31D-1 corresponding to the plurality of wiring portions 311D-1 and a groove portion 31D-2 corresponding to the wiring portion 311D-2. The groove portion 31D-2 serves as a first groove portion.

[0163] Each of the wiring portions 311D-1 is arranged within a corresponding one of the groove portions 31D-1. The wiring portion 311D-2 is arranged within the groove portion 31D-2. Therefore, the width W22D of the groove portion 31D-2 in the X direction is greater than the width W21D of each of the groove portions 31D-1 in the X direction, that is, greater than the width W11D of each of the wiring portions 311D-1 in the X direction. Furthermore, the depth D2D of the groove portion 31D-2 in the Y direction is greater than the depth D1D of each of the groove portions 31D-1 in the Y direction, that is, greater than the thickness T1D of each of the wiring portions 311D-1 in the Y direction.

[0164] The width W21D of each of the groove portions 31D-1 is preferably greater than the width W11D of each of the wiring portions 311D-1. That is, the width W21D of each of the groove portions 31D-1 is preferably greater than 1.0 times the width W11D of each of the wiring portions 311D-1. For example, the width W21D of each of the groove portions 31D-1 is preferably 1.1 times or more the width W11D of each of the wiring portions 311D-1, may be 1.5 times or more the width W11D, or may be 2.0 times or more the width W11D. In addition, the width W21D of each of the groove portions 31D-1 is preferably 20 times or less the width W11D of each of the wiring portions 311D-1.

[0165] The width W22D of the groove portion 31D-2 is preferably greater than the width W12D of the wiring portion 311D-2. Specifically, the width W22D of the groove portion 31D-2 is preferably greater than 1.0 times the width W12D of the wiring portion 311D-2. For example, the width W22D of the groove portion 31D-2 is preferably 1.1 times or greater than the width W12D of the wiring portion 311D-2, may be 1.5 times or greater than the width W12D, or may be 2.0 times or greater than the width W12D. Furthermore, the width W22D of the groove portion 31D-2 is preferably 20 times or less than the width W12D of the wiring portion 311D-2.

[0166] The depth D1D of each of the groove portions 31D-1 is preferably greater than the thickness T1D of each of the wiring portions 311D-1. That is, the depth D1D of each of the groove portions 31D-1 is preferably greater than 1.0 times the thickness T1D of each of the wiring portions 311D-1. For example, the depth D1D of each of the groove portions 31D-1 is preferably 1.1 times or more the thickness T1D of each of the wiring portions 311D-1, may be 1.5 times or more the thickness T1D, or may be 2.0 times or more the thickness T1D. In addition, the depth D1D of each of the groove portions 31D-1 is preferably 20 times or less the thickness T1D of each of the wiring portions 311D-1.

[0167] The depth D2D of the groove portion 31D-2 is preferably greater than the thickness T2D of the wiring portion 311D-2. Specifically, the depth D2D of the groove portion 31D-2 is preferably greater than 1.0 times the thickness T2D of the wiring portion 311D-2. For example, the depth D2D of the groove portion 31D-2 is preferably 1.1 times or greater than the thickness T2D of the wiring portion 311D-2, may be 1.5 times or greater than the thickness T2D, or may be 2.0 times or greater than the thickness T2D. Furthermore, the depth D2D of the groove portion 31D-2 is preferably 20 times or less than the thickness T2D of the wiring portion 311D-2.

[0168] A plurality of groove portions 32D-0 corresponding to the plurality of wiring portions 312D-0 are defined in the surface 3222D. The plurality of groove portions 32D-0 are defined at intervals in the X direction. Each groove portion 32D-0 extends in the Z direction. The plurality of groove portions 32D-0 includes a plurality of groove portions 32D-1 corresponding to the plurality of wiring portions 312D-1 and a groove portion 32D-2 corresponding to the wiring portion 312D-2. The groove portion 32D-2 serves as a second groove portion.

[0169] Each of the wiring portions 312D-1 is arranged within a corresponding one of the groove portions 32D-1. The wiring portion 312D-2 is arranged within the groove portion 32D-2. Therefore, the width W24D of the groove portion 32D-2 in the X direction is greater than the width W23D of each of the groove portions 32D-1 in the X direction, that is, greater than the width W13D of each of the wiring portions 312D-1 in the X direction. Furthermore, the depth D4D of the groove portion 32D-2 in the Y direction is greater than the depth D3D of each of the groove portions 32D-1 in the Y direction, that is, greater than the thickness T3D of each of the wiring portions 312D-1 in the Y direction.

[0170] The width W23D of each of the groove portions 32D-1 is preferably greater than the width W13D of each of the wiring portions 312D-1. That is, the width W23D of each of the groove portions 32D-1 is preferably greater than 1.0 times the width W13D of each of the wiring portions 312D-1. For example, the width W23D of each of the groove portions 32D-1 is preferably 1.1 times or more the width W13D of each of the wiring portions 312D-1, may be 1.5 times or more the width W13D, or may be 2.0 times or more the width W13D. In addition, the width W23D of each of the groove portions 32D-1 is preferably 20 times or less the width W13D of each of the wiring portions 312D-1.

[0171] The width W24D of the groove portion 32D-2 is preferably greater than the width W14D of the wiring portion 312D-2. Specifically, the width W24D of the groove portion 32D-2 is preferably greater than 1.0 times the width W14D of the wiring portion 312D-2. For example, the width W24D of the groove portion 32D-2 is preferably 1.1 times or greater than the width W14D of the wiring portion 312D-2, may be 1.5 times or greater than the width W14D, or may be 2.0 times or greater than the width W14D. Furthermore, the width W24D of the groove portion 32D-2 is preferably 20 times or less than the width W14D of the wiring portion 312D-2.

[0172] The depth D3D of each of the groove portions 32D-1 is preferably greater than the thickness T3D of each of the wiring portions 312D-1. That is, the depth D3D of each of the groove portions 32D-1 is preferably greater than 1.0 times the thickness T3D of each of the wiring portions 312D-1. For example, the depth D3D of each of the groove portions 32D-1 is preferably 1.1 times or more the thickness T3D of each of the wiring portions 312D-1, may be 1.5 times or more the thickness T3D, or may be 2.0 times or more the thickness T3D. In addition, the depth D3D of each of the groove portions 32D-1 is preferably 20 times or less the thickness T3D of each of the wiring portions 312D-1.

[0173] The depth D4D of the groove portion 32D-2 is preferably greater than the thickness T4D of the wiring portion 312D-2. Specifically, the depth D4D of the groove portion 32D-2 is preferably greater than 1.0 times the thickness T4D of the wiring portion 312D-2. For example, the depth D4D of the groove portion 32D-2 is preferably 1.1 times or greater than the thickness T4D of the wiring portion 312D-2, may be 1.5 times or greater than the thickness T4D, or may be 2.0 times or greater than the thickness T4D. Furthermore, the depth D4D of the groove portion 32D-2 is preferably 20 times or less than the thickness T4D of the wiring portion 312D-2.

[0174] In this manner, as viewed in the Z direction, the area of the wiring portion 311D-2 is larger than the area of each of the wiring portions 311D-1, and the area of the wiring portion 312D-2 is larger than the area of each of the wiring portions 312D-1. Therefore, the wiring portions 311D-2 and 312D-2 each serve as an alignment mark, and thus the intermediate connection member 300D is aligned with respect to the intermediate connection member 300D. Figure 9C The alignment accuracy of the wiring board 221 is improved. In addition, since the area of each of the wiring portions 311D-2 and 312D-2 is large when viewed in the Z direction, the self-alignment effect of the intermediate connecting member 300D relative to the wiring board 221 is improved when the intermediate connecting member 300D is bonded to the wiring board 221 with solder.

[0175] In the fifth embodiment, wiring portion 311D-2, which has a width of W12D and a thickness of T2D and is included in the plurality of wiring portions 311D-0, and wiring portion 312D-2, which has a width of W14D and a thickness of T4D and is included in the plurality of wiring portions 312D-0, are displaced relative to each other in the X direction. That is, in the plurality of wiring portions 311D-0 and the plurality of wiring portions 312D-0, the distance between wiring portions 311D-2 and 312D-2 is greater than the distance between any two of the other wiring portions. Therefore, during the manufacturing process of the camera module in the fifth embodiment, the alignment accuracy of the intermediate connecting member 300D relative to the wiring board 221 is further improved. Furthermore, when the intermediate connecting member 300D is bonded to the wiring board 221 using solder, the self-alignment effect of the intermediate connecting member 300D relative to the wiring board 221 is further enhanced. Furthermore, during the manufacturing process of the intermediate connecting member 300D, the alignment accuracy when bonding the insulating substrate corresponding to the insulating substrate portion 321D and the insulating substrate corresponding to the insulating substrate portion 322D is further improved.

[0176] It should be noted that while the wiring portions 311D-2 and 312D-2 have been described as each serving as an alignment mark, the configuration is not limited thereto. For example, a configuration may be employed in which the wiring portion 312D-2 and the groove portion 32D-2 are omitted, and only the wiring portion 311D-2 is used as an alignment mark. Furthermore, in the intermediate connection member 300D, the wiring portion group 312D, namely the plurality of wiring portions 312D-0, may be omitted. In this case as well, the wiring portion 311D-2 may serve as an alignment mark.

[0177] In addition, although it is preferred that the width W12D of the wiring portion 311D-2 is greater than the width W11D of each of the wiring portions 311D-1 and the thickness T2D of the wiring portion 311D-2 is greater than the thickness T1D of each of the wiring portions 311D-1, the configuration is not limited thereto. For example, in the case where the width W12D of the wiring portion 311D-2 is greater than the width W11D of each of the wiring portions 311D-1, the thickness T2D of the wiring portion 311D-2 may be equal to or less than the thickness T1D of each of the wiring portions 311D-1. In this case, it is preferred that the width W22D of the groove portion 31D-2 is greater than the width W21D of each of the groove portions 31D-1 and the depth D2D of the groove portion 31D-2 is equal to or less than the depth D1D of each of the groove portions 31D-1. Similarly, in the case where the thickness T2D of the wiring portion 311D-2 is greater than the thickness T1D of each of the wiring portions 311D-1, the width W12D of the wiring portion 311D-2 can be equal to or less than the width W11D of each of the wiring portions 311D-1. In this case, it is preferable that the depth D2D of the groove portion 31D-2 is greater than the depth D1D of each of the groove portions 31D-1 and the width W22D of the groove portion 31D-2 is equal to or less than the width W21D of each of the groove portions 31D-1. In other words, it is sufficient for the groove portion 31D-2 to be a groove portion having a width greater than the width of each of the groove portions 31D-1 (i.e., greater than the width of each of the wiring portions 311D-1) and / or a thickness greater than the depth of each of the groove portions 31D-1 (i.e., greater than the thickness of each of the wiring portions 311D-1). In these cases, the wiring portion 311D-2 can also serve as an alignment mark.

[0178] Similarly, while it is preferred that the width W14D of the wiring portion 312D-2 is greater than the width W13D of each of the wiring portions 312D-1 and the thickness T4D of the wiring portion 312D-2 is greater than the thickness T3D of each of the wiring portions 312D-1, the configuration is not limited thereto. For example, in the case where the width W14D of the wiring portion 312D-2 is greater than the width W13D of each of the wiring portions 312D-1, the thickness T4D of the wiring portion 312D-2 may be equal to or less than the thickness T3D of each of the wiring portions 312D-1. In this case, it is preferred that the width W24D of the groove portion 32D-2 is greater than the width W23D of each of the groove portions 32D-1 and the depth D4D of the groove portion 32D-2 is equal to or less than the depth D3D of each of the groove portions 32D-1. Similarly, when the thickness T4D of the wiring portion 312D-2 is greater than the thickness T3D of each of the wiring portions 312D-1, the width W14D of the wiring portion 312D-2 may be equal to or less than the width W13D of each of the wiring portions 312D-1. In this case, it is preferable that the depth D4D of the groove portion 32D-2 is greater than the depth D3D of each of the groove portions 32D-1 and the width W24D of the groove portion 32D-2 is equal to or less than the width W23D of each of the groove portions 32D-1. In other words, it is sufficient for the groove portion 32D-2 to be a groove portion having a width greater than the width of each of the groove portions 32D-1 (i.e., greater than the width of each of the wiring portions 312D-1) and / or a thickness greater than the depth of each of the groove portions 32D-1 (i.e., greater than the thickness of each of the wiring portions 312D-1). In these cases, the wiring portion 312D-2 can also serve as an alignment mark.

[0179] In addition, although the case where the wiring portion group 311D (i.e., the plurality of wiring portions 311D-0) includes one wiring portion 311D-2 has been described, the configuration is not limited thereto, and the wiring portion group 311D may include two or more wiring portions 311D-2. In this case, it is preferable that the two wiring portions located at the respective ends in the X direction of the plurality of wiring portions 311D-0 are each a wiring portion 311D-2.

[0180] Similarly, although the case where the wiring portion group 312D (i.e., the plurality of wiring portions 312D-0) includes one wiring portion 312D-2 has been described, the configuration is not limited thereto, and the wiring portion group 312D may include two or more wiring portions 312D-2. In this case, it is preferred that the two wiring portions located at the respective ends in the X direction of the plurality of wiring portions 312D-0 are each a wiring portion 312D-2.

[0181] In addition, although the case where each of the plurality of wiring portions 311D-0 is a conductive wire has been described, the configuration is not limited thereto. As long as each of the plurality of wiring portions 311D-0 is formed of a conductive material, the plurality of wiring portions 311D-0 may be of any form. Thus, for example, a configuration may be employed in which a portion or all of the plurality of wiring portions 311D-0 is formed of a conductor pattern.

[0182] Similarly, although the case where each of the plurality of wiring portions 312D-0 is a conductive wire has been described, the configuration is not limited thereto. As long as each of the plurality of wiring portions 312D-0 is formed of a conductive material, the plurality of wiring portions 312D-0 may be of any form. Thus, for example, a configuration may be employed in which a portion or all of the plurality of wiring portions 312D-0 is formed of a conductor pattern.

[0183] In addition, although the wiring portions 311D-2 and 312D-2 are respectively arranged in the groove portions 31D-2 and 32D-2, the configuration is not limited thereto, and one or both of the wiring portions 311D-2 and 312D-2 may be omitted. In this case, the groove portion where the wiring portion is not provided can be used as an alignment mark. It should be noted that the groove portion where the wiring portion is not provided is filled with a portion of the insulating layer portion 323D.

[0184] Sixth embodiment

[0185] Next, an intermediate connecting member of a sixth embodiment will be described. Figure 16A is a perspective view of an intermediate connecting member 300E according to a sixth embodiment. It should be noted that the construction and manufacturing method of the intermediate connecting member 300E of the sixth embodiment are substantially the same as those of the intermediate connecting member 300B of the third embodiment. In other words, the manufacturing method for the intermediate connecting member 300E of the sixth embodiment is substantially the same as the manufacturing method for the intermediate connecting member 300 of the first embodiment.

[0186] Intermediate connecting member 300E includes a wiring portion assembly 311E and a wiring portion assembly 312E. Furthermore, intermediate connecting member 300E includes an insulating substrate portion 321E, an insulating substrate portion 322E, and an insulating layer portion 323E. Insulating substrate portion 321E serves as a first insulating substrate portion, and insulating substrate portion 322E serves as a second insulating substrate portion. Insulating substrate portions 321E and 322E face each other, with insulating layer portion 323E positioned between them. Insulating substrate portions 321E and 322E are formed from the same material (e.g., glass epoxy) as insulating substrate portions 321 and 322 described in the first embodiment. Insulating layer portion 323E is formed from a different material than insulating substrate portions 321E and 322E and from the same material (e.g., a curing adhesive primarily composed of epoxy or silicone) as insulating layer portion 323 described in the first embodiment.

[0187] In the sixth embodiment, the wiring portion group 311E includes a plurality of wiring portions 311E-0 as a plurality of first wiring portions. For example, in this embodiment, the wiring portion group 311E includes seven wiring portions 311E-0. The plurality of wiring portions 311E-0 are arranged at a certain distance in the X direction. Each wiring portion 311E-0 is arranged to extend in the Z direction so that its two end faces in the Z direction are exposed to the outside. The material of each of the wiring portions 311E-0 is a conductive material such as copper. The plurality of wiring portions 311E-0 include, for example, six wiring portions 311E-1 as at least one first wiring portion, and, for example, one wiring portion 311E-2 as at least another first wiring portion having a size and / or shape different from that of the wiring portion 311E-1. The number of wiring portions 311E-1 is preferably greater than or equal to 2, and in the sixth embodiment, it is 6. The number of wiring portions 311E-2 is preferably less than the number of wiring portions 311E-1, and in the sixth embodiment, it is 1.

[0188] The wiring portion group 312E is arranged at a position away from the wiring portion group 311E in the Y direction. The wiring portion group 312E includes a plurality of wiring portions 312E-0 as a plurality of second wiring portions. For example, in the present embodiment, the wiring portion group 312E includes seven wiring portions 312E-0. The plurality of wiring portions 312E-0 are arranged at a certain distance apart in the X direction. Each of the wiring portions 312E-0 is arranged to extend in the Z direction so that its two end faces in the Z direction are exposed to the outside. The material of each of the wiring portions 312E-0 is a conductive material such as copper. The plurality of wiring portions 312E-0 include, for example, six wiring portions 312E-1 as at least one second wiring portion, and, for example, one wiring portion 312E-2 as at least another second wiring portion having a size and / or shape different from that of the wiring portion 312E-1. The number of the wiring portions 312E-1 is preferably greater than or equal to 2, and is 6 in the sixth embodiment. The number of wiring portions 312E- 2 is preferably smaller than the number of wiring portions 312E- 1 , and is one in the sixth embodiment.

[0189] Here, during the manufacturing process of the electronic module, the intermediate connecting member needs to be aligned with the wiring board to which the intermediate connecting member is to be coupled with high precision. Therefore, during the manufacturing process of the camera module in the sixth embodiment, it is preferable that the intermediate connecting member 300E is provided with a plurality of holes for improving the alignment between the intermediate connecting member 300E and the wiring board. Figure 9C Alignment marks are shown for alignment accuracy between the wiring boards 221. By providing the intermediate connection member 300E with alignment marks, wiring portions can be arranged with high accuracy in the camera module.

[0190] Furthermore, during the manufacturing process of intermediate connecting member 300E in the sixth embodiment, the insulating substrate corresponding to insulating substrate portion 321E and the insulating substrate corresponding to insulating substrate portion 322E are bonded together using an adhesive. To improve alignment accuracy, it is preferable that at least one of the two insulating substrates be provided with alignment marks. Providing alignment marks on the insulating substrates allows the wiring portions to be positioned with high precision within intermediate connecting member 300E.

[0191] Therefore, in the sixth embodiment, the wiring portion 311E-2 among the plurality of wiring portions 311E-0 and the wiring portion 312E-2 among the plurality of wiring portions 312E-0 serve as alignment marks. The wiring portion 311E-2 is the wiring portion located at the end in the X direction among the plurality of wiring portions 311E-0. The wiring portion 312E-2 is the wiring portion located at the end in the X direction among the plurality of wiring portions 312E-0.

[0192] Each of the wiring portions 311E-1 has a width W11E in the X direction. Width W11E serves as a first width. Wiring portion 311E-2 has a width W12E in the X direction that is greater than width W11E. Width W12E serves as a second width. Since width W12E of wiring portion 311E-2 is greater than width W11E of each of wiring portions 311E-1, as described above, wiring portion 311E-2 can serve as an alignment mark.

[0193] Furthermore, each of the wiring portions 311E-1 has a thickness T1E in the Y direction. Thickness T1E serves as a first thickness. The thickness of the wiring portion 311E-2 in the Y direction is a thickness T2E that is greater than thickness T1E. Thickness T2E serves as a second thickness. Since thickness T2E of the wiring portion 311E-2 is greater than thickness T1E of each of the wiring portions 311E-1 as described above, the wiring portion 311E-2 can serve as an alignment mark.

[0194] Each of the wiring portions 311E-1 and 311E-2 is made of, for example, a conductive wire, and the diameter of the wiring portion 311E-2 is larger than the diameter of the wiring portion 311E-1. Therefore, the width W12E of the wiring portion 311E-2 is larger than the width W11E of each of the wiring portions 311E-1, and the thickness T2E of the wiring portion 311E-2 is larger than the thickness T1E of each of the wiring portions 311E-1.

[0195] Each of the wiring portions 312E-1 has a width W13E in the X direction. Width W13E serves as a third width. Wiring portion 312E-2 has a width W14E in the X direction that is greater than width W13E. Width W14E serves as a fourth width. Since, as described above, width W14E of wiring portion 312E-2 is greater than width W13E of each of wiring portions 312E-1, wiring portion 312E-2 can serve as an alignment mark.

[0196] Furthermore, each of the wiring portions 312E-1 has a thickness T3E in the Y direction. Thickness T3E serves as a third thickness. The thickness of the wiring portion 312E-2 in the Y direction is T4E, which is greater than thickness T3E. Thickness T4E serves as a fourth thickness. Since thickness T4E of the wiring portion 312E-2 is greater than thickness T3E of each of the wiring portions 312E-1, as described above, the wiring portion 312E-2 can serve as an alignment mark.

[0197] Each of the wiring portions 312E-1 and 312E-2 is made of, for example, a conductive wire, and the diameter of the wiring portion 312E-2 is larger than the diameter of each of the wiring portions 312E-1. Therefore, the width W14E of the wiring portion 312E-2 is larger than the width W13E of each of the wiring portions 312E-1, and the thickness T4E of the wiring portion 312E-2 is larger than the thickness T3E of each of the wiring portions 312E-1.

[0198] In the sixth embodiment, a plurality of wiring portions 311E-0 are arranged on an insulating substrate portion 321E, and a plurality of wiring portions 312E-0 are arranged on an insulating substrate portion 322E. The configurations of the insulating substrate portion 321E on which the wiring portions 311E-0 are arranged and the insulating substrate portion 322E on which the wiring portions 312E-0 are arranged will be described in detail below. Figure 16B 321E and 322E according to the sixth embodiment. Figure 16B 321E and 322E are plan views of the insulating substrate portions 321E and 322E as viewed in the Z direction.

[0199] The insulating substrate portion 321E has a surface 3211E and a surface 3212E opposite to the surface 3211E. The insulating substrate portion 322E has a surface 3221E and a surface 3222E opposite to the surface 3221E. Figure 16A The insulating layer portion 323E is shown disposed between the surfaces 3212E and 3222E. That is, the surfaces 3212E and 3222E are opposite to each other, with the insulating layer portion 323E located therebetween.

[0200] Multiple wiring portions 311E-0 are arranged on surface 3211E, and multiple wiring portions 312E-0 are arranged on surface 3221E. That is, multiple wiring portions 311E-0 are arranged on outer surface 3211E of insulating substrate portion 321E, and multiple wiring portions 312E-0 are arranged on outer surface 3221E of insulating substrate portion 322E. It should be noted that an insulating layer (not shown) may be provided on each of surfaces 3211E and 3221E.

[0201] A plurality of groove portions 31E-0 corresponding to the plurality of wiring portions 311E-0 are defined in the surface 3211E. The plurality of groove portions 31E-0 are defined at intervals in the X direction. Each groove portion 31E-0 extends in the Z direction. The plurality of groove portions 31E-0 includes a plurality of groove portions 31E-1 corresponding to the plurality of wiring portions 311E-1 and a groove portion 31E-2 corresponding to the wiring portion 311E-2. The groove portion 31E-2 serves as a first groove portion.

[0202] Each of the wiring portions 311E-1 is arranged within a corresponding one of the groove portions 31E-1. The wiring portion 311E-2 is arranged within the groove portion 31E-2. Therefore, the width W22E of the groove portion 31E-2 in the X direction is greater than the width W21E of each of the groove portions 31E-1 in the X direction, that is, greater than the width W11E of each of the wiring portions 311E-1 in the X direction. Furthermore, the depth D2E of the groove portion 31E-2 in the Y direction is greater than the depth D1E of each of the groove portions 31E-1 in the Y direction, that is, greater than the thickness T1E of each of the wiring portions 311E-1 in the Y direction.

[0203] The width W21E of each of the groove portions 31E-1 is preferably greater than the width W11E of each of the wiring portions 311E-1. That is, the width W21E of each of the groove portions 31E-1 is preferably greater than 1.0 times the width W11E of each of the wiring portions 311E-1. For example, the width W21E of each of the groove portions 31E-1 is preferably 1.1 times or more the width W11E of each of the wiring portions 311E-1, may be 1.5 times or more the width W11E, or may be 2.0 times or more the width W11E. In addition, the width W21E of each of the groove portions 31E-1 is preferably 20 times or less the width W11E of each of the wiring portions 311E-1.

[0204] The width W22E of the groove portion 31E-2 is preferably greater than the width W12E of the wiring portion 311E-2. Specifically, the width W22E of the groove portion 31E-2 is preferably greater than 1.0 times the width W12E of the wiring portion 311E-2. For example, the width W22E of the groove portion 31E-2 is preferably 1.1 times or greater than the width W12E of the wiring portion 311E-2, may be 1.5 times or greater than the width W12E, or may be 2.0 times or greater than the width W12E. Furthermore, the width W22E of the groove portion 31E-2 is preferably 20 times or less than the width W12E of the wiring portion 311E-2.

[0205] The depth D1E of each of the groove portions 31E-1 is preferably greater than the thickness T1E of each of the wiring portions 311E-1. That is, the depth D1E of each of the groove portions 31E-1 is preferably greater than 1.0 times the thickness T1E of each of the wiring portions 311E-1. For example, the depth D1E of each of the groove portions 31E-1 is preferably 1.1 times or more the thickness T1E of each of the wiring portions 311E-1, may be 1.5 times or more the thickness T1E, or may be 2.0 times or more the thickness T1E. In addition, the depth D1E of each of the groove portions 31E-1 is preferably 20 times or less the thickness T1E of each of the wiring portions 311E-1.

[0206] The depth D2E of the groove portion 31E-2 is preferably greater than the thickness T2E of the wiring portion 311E-2. Specifically, the depth D2E of the groove portion 31E-2 is preferably greater than 1.0 times the thickness T2E of the wiring portion 311E-2. For example, the depth D2E of the groove portion 31E-2 is preferably 1.1 times or greater than the thickness T2E of the wiring portion 311E-2, may be 1.5 times or greater than the thickness T2E, or may be 2.0 times or greater than the thickness T2E. Furthermore, the depth D2E of the groove portion 31E-2 is preferably 20 times or less than the thickness T2E of the wiring portion 311E-2.

[0207] A plurality of groove portions 32E-0 corresponding to the plurality of wiring portions 312E-0 are defined in surface 3221E. The plurality of groove portions 32E-0 are defined at intervals in the X direction. Each groove portion 32E-0 extends in the Z direction. The plurality of groove portions 32E-0 includes a plurality of groove portions 32E-1 corresponding to the plurality of wiring portions 312E-1 and a groove portion 32E-2 corresponding to the wiring portion 312E-2. The groove portion 32E-2 serves as a second groove portion.

[0208] Each of the wiring portions 312E-1 is arranged within a corresponding one of the groove portions 32E-1. The wiring portion 312E-2 is arranged within the groove portion 32E-2. Therefore, the width W24E of the groove portion 32E-2 in the X direction is greater than the width W23E of each of the groove portions 32E-1 in the X direction, that is, greater than the width W13E of each of the wiring portions 312E-1 in the X direction. Furthermore, the depth D4E of the groove portion 32E-2 in the Y direction is greater than the depth D3E of each of the groove portions 32E-1 in the Y direction, that is, greater than the thickness T3E of each of the wiring portions 312E-1 in the Y direction.

[0209] The width W23E of each of the groove portions 32E-1 is preferably greater than the width W13E of each of the wiring portions 312E-1. That is, the width W23E of each of the groove portions 32E-1 is preferably greater than 1.0 times the width W13E of each of the wiring portions 312E-1. For example, the width W23E of each of the groove portions 32E-1 is preferably 1.1 times or greater than the width W13E of each of the wiring portions 312E-1, may be 1.5 times or greater than the width W13E, or may be 2.0 times or greater than the width W13E. In addition, the width W23E of each of the groove portions 32E-1 is preferably 20 times or less than the width W13E of each of the wiring portions 312E-1.

[0210] The width W24E of the groove portion 32E-2 is preferably greater than the width W14E of the wiring portion 312E-2. Specifically, the width W24E of the groove portion 32E-2 is preferably greater than 1.0 times the width W14E of the wiring portion 312E-2. For example, the width W24E of the groove portion 32E-2 is preferably 1.1 times or greater than the width W14E of the wiring portion 312E-2, may be 1.5 times or greater than the width W14E, or may be 2.0 times or greater than the width W14E. Furthermore, the width W24E of the groove portion 32E-2 is preferably 20 times or less than the width W14E of the wiring portion 312E-2.

[0211] The depth D3E of each of the groove portions 32E-1 is preferably greater than the thickness T3E of each of the wiring portions 312E-1. That is, the depth D3E of each of the groove portions 32E-1 is preferably greater than 1.0 times the thickness T3E of each of the wiring portions 312E-1. For example, the depth D3E of each of the groove portions 32E-1 is preferably 1.1 times or more the thickness T3E of each of the wiring portions 312E-1, may be 1.5 times or more the thickness T3E, or may be 2.0 times or more the thickness T3E. In addition, the depth D3E of each of the groove portions 32E-1 is preferably 20 times or less the thickness T3E of each of the wiring portions 312E-1.

[0212] The depth D4E of the recessed portion 32E-2 is preferably greater than the thickness T4E of the wiring portion 312E-2. Specifically, the depth D4E of the recessed portion 32E-2 is preferably greater than 1.0 times the thickness T4E of the wiring portion 312E-2. For example, the depth D4E of the recessed portion 32E-2 is preferably 1.1 times or greater than the thickness T4E of the wiring portion 312E-2, may be 1.5 times or greater than the thickness T4E, or may be 2.0 times or greater than the thickness T4E. Furthermore, the depth D4E of the recessed portion 32E-2 is preferably 20 times or less than the thickness T4E of the wiring portion 312E-2.

[0213] In this manner, as viewed in the Z direction, the area of the wiring portion 311E-2 is larger than the area of each of the wiring portions 311E-1, and the area of the wiring portion 312E-2 is larger than the area of each of the wiring portions 312E-1. Therefore, the wiring portions 311E-2 and 312E-2 each serve as an alignment mark, and thus the intermediate connection member 300E is aligned with respect to the intermediate connection member 300E. Figure 9C The alignment accuracy of the wiring board 221 is improved. In addition, since the area of each of the wiring portions 311E-2 and 312E-2 is large when viewed in the Z direction, the self-alignment effect of the intermediate connecting member 300E relative to the wiring board 221 is improved when the intermediate connecting member 300E is bonded to the wiring board 221 with solder.

[0214] In the sixth embodiment, wiring portion 311E-2, which has a width of W12E and a thickness of T2E and is included in the plurality of wiring portions 311E-0, and wiring portion 312E-2, which has a width of W14E and a thickness of T4E and is included in the plurality of wiring portions 312E-0, are displaced relative to each other in the X direction. That is, in the plurality of wiring portions 311E-0 and the plurality of wiring portions 312E-0, the distance between wiring portions 311E-2 and 312E-2 is greater than the distance between any two of the other wiring portions. Therefore, during the manufacturing process of the camera module in the sixth embodiment, the alignment accuracy of the intermediate connecting member 300E relative to the wiring board 221 is further improved. Furthermore, when the intermediate connecting member 300E is bonded to the wiring board 221 using solder, the self-alignment effect of the intermediate connecting member 300E relative to the wiring board 221 is further enhanced. Furthermore, during the manufacturing process of the intermediate connecting member 300E, the alignment accuracy when bonding the insulating substrate corresponding to the insulating substrate portion 321E and the insulating substrate corresponding to the insulating substrate portion 322E is further improved.

[0215] It should be noted that while the wiring portions 311E-2 and 312E-2 have been described as each serving as an alignment mark, the configuration is not limited thereto. For example, a configuration may be employed in which the wiring portion 312E-2 and the groove portion 32E-2 are omitted, and only the wiring portion 311E-2 is used as an alignment mark. Furthermore, in the intermediate connection member 300E, the wiring portion group 312E, i.e., the plurality of wiring portions 312E-0, may be omitted. In this case as well, the wiring portion 311E-2 may serve as an alignment mark.

[0216] Furthermore, while it is preferred that the width W12E of the wiring portion 311E-2 is greater than the width W11E of each of the wiring portions 311E-1 and the thickness T2E of the wiring portion 311E-2 is greater than the thickness T1E of each of the wiring portions 311E-1, the configuration is not limited thereto. For example, in the case where the width W12E of the wiring portion 311E-2 is greater than the width W11E of each of the wiring portions 311E-1, the thickness T2E of the wiring portion 311E-2 may be equal to or less than the thickness T1E of each of the wiring portions 311E-1. In this case, it is preferred that the width W22E of the groove portion 31E-2 is greater than the width W21E of each of the groove portions 31E-1 and the depth D2E of the groove portion 31E-2 is equal to or less than the depth D1E of each of the groove portions 31E-1. Similarly, in the case where the thickness T2E of the wiring portion 311E-2 is greater than the thickness T1E of each of the wiring portions 311E-1, the width W12E of the wiring portion 311E-2 can be equal to or less than the width W11E of each of the wiring portions 311E-1. In this case, it is preferable that the depth D2E of the groove portion 31E-2 is greater than the depth D1E of each of the groove portions 31E-1 and the width W22E of the groove portion 31E-2 is equal to or less than the width W21E of each of the groove portions 31E-1. That is, it is sufficient for the groove portion 31E-2 to be a groove portion having a width greater than the width of each of the groove portions 31E-1 (i.e., greater than the width of each of the wiring portions 311E-1) and / or a thickness greater than the depth of each of the groove portions 31E-1 (i.e., greater than the thickness of each of the wiring portions 311E-1). In these cases, the wiring portion 311E-2 can also serve as an alignment mark.

[0217] Similarly, while it is preferred that the width W14E of the wiring portion 312E-2 is greater than the width W13E of each of the wiring portions 312E-1 and the thickness T4E of the wiring portion 312E-2 is greater than the thickness T3E of each of the wiring portions 312E-1, the configuration is not limited thereto. For example, in the case where the width W14E of the wiring portion 312E-2 is greater than the width W13E of each of the wiring portions 312E-1, the thickness T4E of the wiring portion 312E-2 may be equal to or less than the thickness T3E of each of the wiring portions 312E-1. In this case, it is preferred that the width W24E of the groove portion 32E-2 is greater than the width W23E of each of the groove portions 32E-1 and the depth D4E of the groove portion 32E-2 is equal to or less than the depth D3E of each of the groove portions 32E-1. Similarly, when the thickness T4E of the wiring portion 312E-2 is greater than the thickness T3E of each of the wiring portions 312E-1, the width W14E of the wiring portion 312E-2 may be equal to or less than the width W13E of each of the wiring portions 312E-1. In this case, it is preferable that the depth D4E of the groove portion 32E-2 is greater than the depth D3E of each of the groove portions 32E-1 and the width W24E of the groove portion 32E-2 is equal to or less than the width W23E of each of the groove portions 32E-1. In other words, it is sufficient for the groove portion 32E-2 to be a groove portion having a width greater than the width of each of the groove portions 32E-1 (i.e., greater than the width of each of the wiring portions 312E-1) and / or a thickness greater than the depth of each of the groove portions 32E-1 (i.e., greater than the thickness of each of the wiring portions 312E-1). In these cases, the wiring portion 312E-2 can also serve as an alignment mark.

[0218] In addition, although the case where the wiring portion group 311E (i.e., the plurality of wiring portions 311E-0) includes one wiring portion 311E-2 has been described, the configuration is not limited thereto, and the wiring portion group 311E may include two or more wiring portions 311E-2. In this case, it is preferred that the two wiring portions located at the respective ends in the X direction of the plurality of wiring portions 311E-0 are each a wiring portion 311E-2.

[0219] Similarly, although the case where the wiring portion group 312E (i.e., the plurality of wiring portions 312E-0) includes one wiring portion 312E-2 has been described, the configuration is not limited thereto, and the wiring portion group 312E may include two or more wiring portions 312E-2. In this case, it is preferred that the two wiring portions located at the respective ends in the X direction of the plurality of wiring portions 312E-0 are each a wiring portion 312E-2.

[0220] In addition, although the case where each of the plurality of wiring portions 311E-0 is a conductive wire has been described, the configuration is not limited thereto. As long as each of the plurality of wiring portions 311E-0 is formed of a conductive material, the plurality of wiring portions 311E-0 may be of any form. Thus, for example, a configuration may be employed in which a portion or all of the plurality of wiring portions 311E-0 is formed of a conductor pattern.

[0221] Similarly, although the case where each of the plurality of wiring portions 312E-0 is a conductive wire has been described, the configuration is not limited thereto. As long as each of the plurality of wiring portions 312E-0 is formed of a conductive material, the plurality of wiring portions 312E-0 may be of any form. Thus, for example, a configuration may be employed in which a portion or all of the plurality of wiring portions 312E-0 is formed of a conductor pattern.

[0222] Figure 17A and Figure 17B 1 and 300E-2 are respectively explanatory diagrams of modified examples of intermediate connection members 300E-1 and 300E-2. Although the sixth embodiment has described the case where the wiring portions 311E-2 and 312E-2 are arranged in the groove portions 31E-2 and 32E-2, respectively, the configuration is not limited thereto, and Figure 16A One or both of the wiring portions 311E-2 and 312E-2 shown may be omitted. Figure 17A and Figure 17B In the modified example of , both the wiring portions 311E- 2 and 312E- 2 are omitted. Figure 17A The groove portions 31E-2 and 32E-2 of the intermediate connection member 300E-1 are shown not to be filled with anything, and each serves as an alignment mark.

[0223] also, Figure 17B The groove portions 31E-2 and 32E-2 of the intermediate connection member 300E-2 are shown to be filled with insulators 324E and 325E, respectively. The insulators 324E and 325E are each formed of a different material or color from the insulating substrate portions 321E and 322E and each serve as an alignment mark.

[0224] Seventh embodiment

[0225] Next, an intermediate connecting member of a seventh embodiment will be described. Figure 18Ais a perspective view of an intermediate connecting member 300F according to the seventh embodiment. Note that the intermediate connecting member 300F of the seventh embodiment has a configuration in which an insulating substrate portion 321F is used in place of the insulating substrate portions 321E and 322E and the insulating layer portion 323E of the intermediate connecting member 300E of the sixth embodiment. In the manufacturing method of the intermediate connecting member 300F of the seventh embodiment, the step of bonding the insulating substrate portions 321E and 322E together is omitted from the manufacturing method of the intermediate connecting member 300E of the sixth embodiment.

[0226] Similar to the sixth embodiment, intermediate connecting member 300F includes wiring portion assembly 311E and wiring portion assembly 312E. Furthermore, intermediate connecting member 300F includes insulating substrate portion 321F. Insulating substrate portion 321F serves as a first insulating substrate portion. Insulating substrate portion 321F is formed from the same material (e.g., glass epoxy resin) as insulating substrate portions 321 and 322 described in the first embodiment.

[0227] In the seventh embodiment, the wiring portion group 311E includes a plurality of wiring portions 311E-0 as a plurality of first wiring portions. For example, in the present embodiment, the wiring portion group 311E includes seven wiring portions 311E-0. The material of each of the wiring portions 311E-0 is a conductive material such as copper. The plurality of wiring portions 311E-0 include at least one (e.g., six) wiring portions 311E-1 and at least another (e.g., one) wiring portion 311E-2. The wiring portion group 312E is arranged at a position away from the wiring portion group 311E in the Y direction. The wiring portion group 312E includes a plurality of wiring portions 312E-0 as a plurality of second wiring portions. For example, in the present embodiment, the wiring portion group 312E includes seven wiring portions 312E-0. The plurality of wiring portions 312E-0 include at least one (e.g., six) wiring portions 312E-1 and at least another (e.g., one) wiring portion 312E-2.

[0228] In the manufacturing process of the camera module in the seventh embodiment, it is preferred that the intermediate connecting member 300F is provided with a Figure 9C Alignment marks are shown for alignment accuracy between the wiring boards 221. By providing the intermediate connection member 300F with alignment marks, wiring portions can be arranged with high accuracy in the camera module.

[0229] Therefore, in the seventh embodiment, the wiring portion 311E-2 among the plurality of wiring portions 311E-0 and the wiring portion 312E-2 among the plurality of wiring portions 312E-0 serve as alignment marks. The wiring portion 311E-2 is a wiring portion located at an end portion in the X direction among the plurality of wiring portions 311E-0. The wiring portion 312E-2 is a wiring portion located at an end portion in the X direction among the plurality of wiring portions 312E-0. The wiring portions 311E-1, 311E-2, 312E-1, and 312E-2 each have the width and thickness described in the sixth embodiment.

[0230] Each of the wiring portions 311E-0 and 312E-0 is formed of, for example, a conductive wire. In the seventh embodiment, a plurality of wiring portions 311E-0 and a plurality of wiring portions 312E-0 are arranged on the same insulating substrate portion 321F. The configuration of the insulating substrate portion 321F on which the wiring portions 311E-0 and 312E-0 are arranged will be described in detail below. Figure 18A 321F is an explanatory diagram of an insulating substrate portion 321F according to the seventh embodiment. Figure 18B 32 is a plan view of the insulating substrate portion 321F as viewed in the Z direction. The insulating substrate portion 321F has a surface 3211F and a surface 3212F opposite to the surface 3211F in the Y direction.

[0231] Multiple wiring portions 311E-0 are arranged on surface 3211F, and multiple wiring portions 312E-0 are arranged on surface 3212F. That is, multiple wiring portions 311E-0 are arranged on outer surface 3211F of insulating substrate portion 321F, and multiple wiring portions 312E-0 are arranged on outer surface 3212F of insulating substrate portion 321F. It should be noted that an insulating layer (not shown) may be provided on each of surfaces 3211F and 3212F.

[0232] A plurality of groove portions 31E-0, constructed in substantially the same manner as in the sixth embodiment and corresponding to the plurality of wiring portions 311E-0, are defined in the surface 3211F. The plurality of groove portions 31E-0 are defined at intervals in the X direction. Each groove portion 31E-0 extends in the Z direction. The plurality of groove portions 31E-0 includes a plurality of groove portions 31E-1 corresponding to the plurality of wiring portions 311E-1 and a groove portion 31E-2 corresponding to the wiring portion 311E-2. The groove portion 31E-2 serves as a first groove portion. Each of the wiring portions 311E-1 is arranged in a corresponding one of the groove portions 31E-1. The wiring portion 311E-2 is arranged in the groove portion 31E-2.

[0233] A plurality of groove portions 32E-0, constructed in substantially the same manner as in the sixth embodiment and corresponding to the plurality of wiring portions 312E-0, are defined in the surface 3212F. The plurality of groove portions 32E-0 are defined at intervals in the X direction. Each groove portion 32E-0 extends in the Z direction. The plurality of groove portions 32E-0 includes a plurality of groove portions 32E-1 corresponding to the plurality of wiring portions 312E-1 and a groove portion 32E-2 corresponding to the wiring portion 312E-2. The groove portion 32E-2 serves as a second groove portion. Each of the wiring portions 312E-1 is arranged in a corresponding one of the groove portions 32E-1. The wiring portion 312E-2 is arranged in the groove portion 32E-2.

[0234] In the seventh embodiment, the groove portion 31E- 1 , the groove portion 31E- 2 , the group portion 32E- 1 , and the groove portion 32E- 2 each have the width and depth described in the sixth embodiment.

[0235] In this manner, as viewed in the Z direction, the area of the wiring portion 311E-2 is larger than the area of each of the wiring portions 311E-1, and the area of the wiring portion 312E-2 is larger than the area of each of the wiring portions 312E-1. Therefore, the wiring portions 311E-2 and 312E-2 each serve as an alignment mark, and thus the intermediate connection member 300F is aligned with respect to the intermediate connection member 300F. Figure 9C The alignment accuracy of the wiring board 221 is improved. In addition, since the area of each of the wiring portions 311E-2 and 312E-2 is large when viewed in the Z direction, the self-alignment effect of the intermediate connecting member 300F relative to the wiring board 221 is improved when the intermediate connecting member 300F is bonded to the wiring board 221 with solder.

[0236] In the seventh embodiment, the wiring portion 311E-2 included in the plurality of wiring portions 311E-0 and the wiring portion 312E-2 included in the plurality of wiring portions 312E-0 are displaced relative to each other in the X direction. That is, in the plurality of wiring portions 311E-0 and the plurality of wiring portions 312E-0, the distance between the wiring portions 311E-2 and 312E-2 is greater than the distance between any two of the other wiring portions. Therefore, during the manufacturing process of the camera module in the seventh embodiment, the alignment accuracy of the intermediate connecting member 300F relative to the wiring board 221 is further improved.

[0237] Note that modifications similar to the modified example of the sixth embodiment apply to the seventh embodiment.

[0238] Eighth embodiment

[0239] Next, an intermediate connecting member of an eighth embodiment will be described. Figure 19is a perspective view of an intermediate connection member 300G according to an eighth embodiment.

[0240] The intermediate connecting member 300G includes a wiring portion assembly 311G and a wiring portion assembly 312G. Furthermore, the intermediate connecting member 300G includes an insulating substrate portion 321G serving as a first insulating substrate portion. The insulating substrate portion 321G is formed of the same material (e.g., glass epoxy resin) as the insulating substrate portions 321 and 322 described in the first embodiment.

[0241] In the eighth embodiment, the wiring portion group 311G includes a plurality of wiring portions 311G-0 as a plurality of first wiring portions. For example, in the present embodiment, the wiring portion group 311G includes seven wiring portions 311G-0. The material of each of the wiring portions 311G-0 is a conductive material such as copper. The plurality of wiring portions 311G-0 include at least one (e.g., six) wiring portions 311G-1 and at least one (e.g., one) wiring portion 311G-2. The wiring portion group 312G is arranged at a position away from the wiring portion group 311G in the Y direction. The wiring portion group 312G includes a plurality of wiring portions 312G-0 as a plurality of second wiring portions. For example, in the present embodiment, the wiring portion group 312G includes seven wiring portions 312G-0. The plurality of wiring portions 312G-0 include at least one (e.g., six) wiring portions 312G-1 and at least one (e.g., one) wiring portion 312G-2.

[0242] In the manufacturing process of the camera module in the eighth embodiment, it is preferred that the intermediate connecting member 300G is provided with a Figure 9C Alignment marks are shown for alignment accuracy between the wiring boards 221. By providing the intermediate connection member 300G with alignment marks, wiring portions can be arranged with high accuracy in the camera module.

[0243] Therefore, in the eighth embodiment, the wiring portion 311G-2 among the plurality of wiring portions 311G-0 and the wiring portion 312G-2 among the plurality of wiring portions 312G-0 are used as alignment marks. The wiring portion 311G-2 is a wiring portion located at the end portion in the X direction among the plurality of wiring portions 311G-0. The wiring portion 312G-2 is a wiring portion located at the end portion in the X direction among the plurality of wiring portions 312G-0. Each of the wiring portions 311G-1, 311G-2, 312G-1, and 312G-2 has the width and thickness described in the sixth embodiment.

[0244] The plurality of wiring portions 311G- 0 and the plurality of wiring portions 312G- 0 are each composed of, for example, a conductor pattern. In the eighth embodiment, the plurality of wiring portions 311G- 0 and the plurality of wiring portions 312G- 0 are arranged on the same insulating substrate portion 321G.

[0245] The insulating substrate portion 321G has a surface 3211G and a surface 3212G opposite to the surface 3211G in the Y direction. A plurality of wiring portions 311G-0 are arranged on the surface 3211G, and a plurality of wiring portions 312G-0 are arranged on the surface 3212G. In other words, the plurality of wiring portions 311G-0 are arranged on the outer surface 3211G of the insulating substrate portion 321G, and the plurality of wiring portions 312G-0 are arranged on the outer surface 3212G of the insulating substrate portion 321G. It should be noted that an insulating layer (not shown) may be provided on each of the surfaces 3211G and 3212G.

[0246] In this manner, as viewed in the Z direction, the area of the wiring portion 311G-2 is larger than the area of each of the wiring portions 311G-1, and the area of the wiring portion 312G-2 is larger than the area of each of the wiring portions 312G-1. Therefore, the wiring portions 311G-2 and 312G-2 each serve as an alignment mark, and thus the intermediate connection member 300G is aligned with respect to the intermediate connection member 300G. Figure 9C The alignment accuracy of the wiring board 221 is improved. In addition, since the area of each of the wiring portions 311G-2 and 312G-2 is large when viewed in the Z direction, the self-alignment effect of the intermediate connecting member 300G relative to the wiring board 221 is improved when the intermediate connecting member 300G is bonded to the wiring board 221 with solder.

[0247] In the eighth embodiment, the wiring portion 311G-2 included in the plurality of wiring portions 311G-0 and the wiring portion 312G-2 included in the plurality of wiring portions 312G-0 are displaced relative to each other in the X direction. That is, in the plurality of wiring portions 311G-0 and the plurality of wiring portions 312G-0, the distance between the wiring portions 311G-2 and 312G-2 is greater than the distance between any two of the other wiring portions. Therefore, during the manufacturing process of the camera module in the eighth embodiment, the alignment accuracy of the intermediate connecting member 300G relative to the wiring board 221 is further improved.

[0248] It should be noted that although the eighth embodiment has been described in which both the wiring portions 311G-2 and 312G-2 function as alignment marks, the configuration is not limited thereto. For example, a configuration may be employed in which the wiring portion 312G-2 is omitted and only the wiring portion 311G-2 is used as an alignment mark. Furthermore, in the intermediate connection member 300G, the wiring portion group 312G, i.e., the plurality of wiring portions 312G-0, may be omitted. In this case as well, the wiring portion 311G-2 may function as an alignment mark.

[0249] In addition, the width and / or thickness of each of the wiring portions 311G-2 and 312G-2 in the eighth embodiment can also be modified in a manner similar to the modified example of the width and / or thickness of each of the wiring portions 311D-2 and 312D-2 in the fifth embodiment.

[0250] In addition, although the case where the wiring portion group 311G (i.e., the plurality of wiring portions 311G-0) includes one wiring portion 311G-2 has been described, the configuration is not limited thereto, and the wiring portion group 311G may include two or more wiring portions 311G-2. In this case, it is preferred that the two wiring portions located at the respective ends in the X direction of the plurality of wiring portions 311G-0 are each a wiring portion 311G-2.

[0251] Similarly, although the case where the wiring portion group 312G (i.e., the plurality of wiring portions 312G-0) includes one wiring portion 312G-2 has been described, the configuration is not limited thereto, and the wiring portion group 312G may include two or more wiring portions 312G-2. In this case, it is preferred that the two wiring portions located at the respective ends in the X direction of the plurality of wiring portions 312G-0 are each a wiring portion 312G-2.

[0252] Figure 20A and Figure 20B The diagrams are respectively explanatory diagrams of intermediate connection members 300G-1 and 300G-2 of modified examples. Figure 20A The intermediate connecting member 300G-1 of the modified example is shown. Intermediate connecting member 300G-1 includes an insulating substrate portion 321G-1, multiple wiring portions 311G-1, and multiple wiring portions 312G-1. Insulating substrate portion 321G-1 has a surface 3211G-1 including a groove portion 31G-2, and a surface 3212G-1 including a groove portion 32G-2. Surface 3212G-1 opposes surface 3211G-1 in the Y direction. Groove portion 31G-2 serves as a first groove portion, and groove portion 32G-2 serves as a second groove portion.

[0253] The groove portion 31G-2 is preferably a groove portion having a width greater than the width W11G of each of the wiring portions 311G-1 and / or a depth greater than the thickness T1G of each of the wiring portions 311G-1. Figure 20A In the intermediate connection member 300G-1 of the illustrated modified example, the width W22G of the groove portion 31G-2 in the X direction is greater than the width W11G of each of the wiring portions 311G-1 in the X direction. In addition, the depth D2G of the groove portion 31G-2 in the Y direction is greater than the thickness T1G of each of the wiring portions 311G-1 in the Y direction.

[0254] The groove portion 32G-2 is preferably a groove portion having a width greater than the width W13G of each of the wiring portions 312G-1 and / or a depth greater than the thickness T3G of each of the wiring portions 312G-1. Figure 20A In the intermediate connection member 300G-1 of the illustrated modified example, the width W24G of the groove portion 32G-2 in the X direction is greater than the width W13G of each of the wiring portions 312G-1 in the X direction. Furthermore, the depth D4G of the groove portion 32G-2 in the Y direction is greater than the thickness T3G of each of the wiring portions 312G-1 in the Y direction.

[0255] According to the above configuration, the groove portions 31G-2 and 32G-2 can each be used as an alignment mark, and thus improve the alignment of the intermediate connection member 300G-1 with respect to the intermediate connection member 300G-1. Figure 9C The alignment accuracy of the wiring board 221 is shown.

[0256] The groove portions 31G-2 and 32G-2 are preferably shifted from each other in the X direction. Note that the groove portion 32G-2 may be omitted in the intermediate connection member 300G-1. In addition, the insulating substrate portion 321G-1 may have a plurality of groove portions 31G-2 or a plurality of groove portions 32G-2.

[0257] Will describe Figure 20B The intermediate connection member 300G-2 of the illustrated modification example is similar to the intermediate connection member 300G-1, and includes an insulating substrate portion 321G-1, a plurality of wiring portions 311G-1, and a plurality of wiring portions 312G-1. Figure 20B The groove portions 31G-2 and 32G-2 of the intermediate connection member 300G-2 are shown to be filled with insulators 324G and 325G, respectively. The insulators 324G and 325G are each formed of a different material or color from the insulating substrate portion 321G-1 and each serve as an alignment mark.

[0258] According to the above configuration, the insulators 324G and 325G can each serve as an alignment mark, and thus improve the alignment of the intermediate connection member 300G-2 with respect to the intermediate connection member 300G-2. Figure 9C The alignment accuracy of the wiring board 221 is shown.

[0259] The groove portions 31G-2 and 32G-2 are preferably shifted relative to each other in the X direction. It should be noted that the groove portion 32G-2 and the insulator 325G may be omitted in the intermediate connection member 300G-2. In addition, the insulating substrate portion 321G-1 may have a plurality of groove portions 31G-2 or a plurality of groove portions 32G-2.

[0260] The present invention is not limited to the above-described embodiments and can be modified in various ways within the technical concept of the present invention. For example, multiple embodiments may be combined. In addition, some elements of at least one embodiment may be deleted or replaced. In addition, new matters may be added to at least one embodiment. For example, in the sixth to eighth embodiments, at least a portion of the multiple wiring portions 312, excluding their two end faces in the Z direction, may be covered with an insulating film (e.g., a solder resist film provided on the insulating substrate portion 321). The insulating film suppresses short circuits and corrosion in the multiple wiring portions 312. Furthermore, the effects described in the embodiments are merely an enumeration of the most preferred effects achievable by the present invention, and the effects of the present invention are not limited to those described in the embodiments. It should be noted that the disclosure of this specification is not limited to matters explicitly described in this specification and includes all matters that can be understood from this specification and the accompanying drawings. Furthermore, the disclosure of this specification includes a supplementary set of each individual concept described in this specification. That is, for example, if this specification includes the description "A is B," it can be said that this specification discloses "A is not B," even if the explicit description of "A is not B" is omitted. This is because the description of "A is B" assumes that the case of "A is not B" has also been considered.

[0261] Although the above embodiments describe the case where the electronic component is an image sensor or a storage element as an example, the configuration is not limited to this. For example, the electronic component may be a semiconductor device for image processing or a power integrated circuit (IC). For example, the electronic component may be a semiconductor device for communication or a control IC. In addition, although the electronic module is described as an example where the electronic module is a camera module, the configuration is not limited to this. For example, the electronic module may be a memory module, a signal processing module, a power module, a communication module, or a control module.

[0262] In addition, although the case where the electronic device is a digital camera has been described as an example, the construction is not limited thereto. For example, the electronic device may be a mobile communication device. For example, the electronic device may be an information device such as a smartphone or a personal computer, or a communication device such as a modem or a router. Alternatively, the electronic device may be an office device such as a printer or a copier, a medical device such as a radiographic device, a magnetic imaging device, an ultrasonic imaging device, or an endoscope, an industrial device such as a robot or a semiconductor manufacturing device, or a transportation device such as a car, an airplane, or a ship. In the case of providing wiring within a limited space in the housing of the electronic device, the size of the electronic device can be reduced and the arrangement density of the wiring can be increased by using an intermediate connecting member 300. The electronic module of the present invention is applicable to various electronic devices.

[0263] While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.

Claims

1. An electronic module, comprising: a first circuit unit including a first electronic component; a second circuit unit, the second circuit unit including a second electronic component and disposed opposite to the first circuit unit; as well as an intermediate connecting member disposed between the first circuit unit and the second circuit unit, wherein the intermediate connection member includes a wiring portion electrically connecting the first circuit unit and the second circuit unit, and Here, at least a portion of the wiring portion is positioned between the first electronic component and the second circuit unit.

2. The electronic module according to claim 1, wherein: The intermediate connection member is bonded to the first circuit unit via solder.

3. The electronic module according to claim 1, wherein: The intermediate connection member is bonded to the second circuit unit via solder.

4. The electronic module according to claim 1, wherein: The first circuit unit includes a first wiring board on which the first electronic component is mounted.

5. The electronic module according to claim 1, wherein: The second circuit unit includes a second wiring board on which the second electronic component is mounted. The electronic module according to claim 1 , wherein: The intermediate connection member includes an insulating substrate portion formed of glass epoxy resin.

7. The electronic module according to claim 5, wherein: The second electronic component is positioned between the second wiring board and the first circuit unit.

8. The electronic module according to claim 5, wherein: The second electronic component is positioned between the first electronic component and the second wiring board.

9. The electronic module according to any one of claims 1 to 8, wherein: The intermediate connection member mechanically connects the first circuit unit and the second circuit unit outside the wiring portion.

10. The electronic module according to any one of claims 1 to 8, wherein: The intermediate connecting member includes a plurality of intermediate connecting members.

11. The electronic module according to any one of claims 1 to 8, wherein: The first electronic component is an image sensor, a memory element, a semiconductor device for image processing, a power supply IC, a semiconductor device for communication, or a control IC.

12. The electronic module according to any one of claims 1 to 8, wherein: The second electronic component is an image sensor, a memory element, a semiconductor device for image processing, a power supply IC, a semiconductor device for communication, or a control IC.

13. The electronic module according to any one of claims 1 to 8, wherein: The first electronic component is an image sensor.

14. The electronic module according to any one of claims 1 to 8, in, The first circuit unit includes a substrate, and The first electronic component is positioned between the substrate and the first wiring board.

15. The electronic module according to claim 14, wherein: The first circuit unit includes a frame disposed between the substrate and the first wiring board.

16. The electronic module according to claim 14, wherein: The substrate is made of glass.

17. The electronic module according to any one of claims 1 to 8, wherein: The second electronic component is a memory element.

18. An electronic device, comprising: shell; as well as The electronic module according to any one of claims 1 to 17, wherein the electronic module is arranged in the housing. The electronic device according to claim 18 , wherein the electronic device is an imaging device. 20 . The electronic device according to claim 18 , wherein the electronic device is information equipment, communication equipment, office equipment, medical equipment, industrial equipment, or transportation equipment.

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