Semiconductor component transfer device and transfer method thereof

Abstract

The present invention provides a semiconductor component transfer device and a transfer method thereof, which belong to the field of semiconductor component transfer technology. The semiconductor component transfer device includes a machine and a feed belt, the feed belt is symmetrically installed on the surface of the machine, and a transfer mechanism is installed on the surface of the machine, and the transfer mechanism includes an installation box, a placement plate, a drive disk and a first loading rack. The present invention sets a transfer mechanism, and drives the placement plate to rotate forty-five degrees each time by a motor. When the abutment ring contacts the groove portion, the first clamp is located on the surface of the placement plate, and the first clamp moves down to place the package base on the mold base surface. Then, when the package base moves to the bottom of the second loading rack, the semiconductor component is inserted into the package base by the second clamp. Then, the semiconductor component continues to transfer. When it reaches the bottom of the third loading rack, the package shell is sleeved on the surface of the semiconductor component by the third clamp, thereby realizing automatic transfer of the semiconductor component and improving packaging efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor component transfer, and in particular to a semiconductor component transfer device and a transfer method thereof. Background Art

[0002] Semiconductor components, as core components of modern electronic products, are widely used in communications, computers, automobiles, consumer electronics, and other fields. With the continuous advancement of electronic technology and the rapid development of integrated circuit technology, the size of semiconductor components has continued to shrink, their functions have continued to increase, and their manufacturing processes have become increasingly refined. To meet these high-precision and high-demand manufacturing processes, semiconductor component transfer devices have emerged. As an indispensable part of the semiconductor production line, transfer devices can efficiently and accurately complete the task of transferring components from the production line to different processes. The manufacture of semiconductor components typically involves multiple complex process steps, such as photolithography, etching, doping, metallization, and packaging. These steps often require high-precision process control and need to be performed in a clean environment to ensure product quality.

[0003] In the process of packaging semiconductor components, manual assembly line operations are usually used to insert semiconductor components into the packaging base in sequence, and the packaging shell is placed on the surface of the packaging base. During this process, a conveyor belt is used to transfer the semiconductor components, which can easily cause the semi-finished products of the package to shift or even fall off, and the packaging efficiency is low. Summary of the Invention

[0004] In order to remedy the above deficiencies, the present invention provides a semiconductor component transfer device and a transfer method thereof that overcome the above technical problems or at least partially solve the above problems.

[0005] The present invention is achieved in that:

[0006] The present invention provides a semiconductor component transfer device, comprising a machine platform and a feed belt, wherein the feed belt is symmetrically mounted on the machine platform surface for conveying raw materials, and a transfer mechanism is mounted on the machine platform surface for transferring semiconductor components, wherein the transfer mechanism comprises:

[0007] An installation box, the installation box is fixedly mounted on the surface of the machine, a motor is fixedly mounted in the inner cavity of the installation box, a rotating shaft is fixedly mounted on the output end of the motor, and a placement plate is fixedly mounted on the other end of the rotating shaft;

[0008] A placement plate, wherein the placement plate is symmetrically fixedly mounted with a placement disc surface, and a mold base is mounted on the placement plate surface for placing the package base;

[0009] A driving disk, the driving disk is fixedly mounted on the bottom of the placement plate, and a side wall of the driving disk is provided with a groove portion and a protrusion portion;

[0010] A first loading rack is fixedly mounted on the surface of the machine, a first slide is slidably mounted in the inner cavity of the first loading rack, a first electric telescopic rod is fixedly mounted on the surface of the first slide, and a first clamp is fixedly mounted on the telescopic end of the first electric telescopic rod for grabbing the packaging base.

[0011] In a preferred solution, a push rod is slidably installed in the first loading rack, one end of the push rod is fixedly connected to the first slide, a first spring is sleeved on the surface of the push rod, one end of the first spring is fixedly connected to the first loading rack, and the other end of the first spring is fixedly connected to the first slide, for driving the first slide to move toward the placement tray.

[0012] In a preferred solution, a connecting plate is fixedly installed at the other end of the push rod, a first connecting rod is slidably installed in the inner cavity of the first loading rack, one end of the first connecting rod is fixedly connected to the connecting plate, and an abutment ring is installed at the other end of the first connecting rod, and the abutment ring is in contact with the side wall of the driving disk.

[0013] In a preferred embodiment, a second loading rack is fixedly mounted on the surface of the machine, a second clamp is installed in the inner cavity of the second loading rack for grabbing semiconductor components, a third loading rack is fixedly mounted on the surface of the machine, a third clamp is installed in the inner cavity of the third loading rack for grabbing the packaging shell.

[0014] In a preferred solution, a positioning mechanism is installed on the surface of the placement plate for positioning the packaging base, and the positioning mechanism includes a positioning plate and a first tooth plate. The positioning plate is symmetrically slidably installed on the surface of the placement plate, and a slide rail is symmetrically fixedly installed on the surface of the placement plate. The positioning plate is slidably installed on the surface of the slide rail, and the first tooth plate is symmetrically fixedly installed on the bottom of the positioning plate. A first gear is rotatably installed in the inner cavity of the placement plate, and the two first tooth plates are engaged with the first gear.

[0015] In a preferred solution, a second tooth plate is slidably installed in the inner cavity of the placement plate, the second tooth plate is meshed with the first gear, a pressure plate is fixedly installed on the side wall of the second tooth plate, a sliding rod is symmetrically fixedly installed in the inner cavity of the placement plate, the pressure plate and the sliding rod are slidably connected, a second spring is sleeved on the surface of the sliding rod, one end of the second spring is fixedly connected to the placement plate, and the other end of the second spring is fixedly connected to the pressure plate, which is used to drive the second tooth plate to move up, and pressure blocks are fixedly installed at both ends of the first clamp to drive the pressure plate to move down.

[0016] In a preferred solution, a limiting plate is symmetrically and slidingly installed in the inner cavity of the positioning plate, a clamping block is fixedly installed on the side wall of the limiting plate, a third spring is fixedly installed in the inner cavity of the positioning plate, one end of the third spring is fixedly connected to the positioning plate, and the other end of the third spring is fixedly connected to the limiting plate, which is used to drive the clamping block to move outward, the surface of the positioning plate is wedge-shaped, and extrusion blocks are fixedly installed on both sides of the third clamp to drive the positioning plate to move.

[0017] In a preferred solution, a blanking mechanism is installed on the surface of the machine table for unloading the packaged semiconductor components. The blanking mechanism includes a blanking rack and a fourth clamp. The blanking rack is fixedly installed on the surface of the machine table. A second slide is slidably installed in the inner cavity of the blanking rack. A second electric telescopic rod is fixedly installed on the surface of the second slide. A mounting seat is fixedly installed on the telescopic end of the second electric telescopic rod. A rotating roller is rotatably installed in the inner cavity of the mounting seat. A fourth clamp is fixedly installed on the bottom of the rotating roller for grabbing the packaged semiconductor components.

[0018] In a preferred solution, a second gear is fixedly mounted on the side wall of the rotating roller, and a third gear plate is fixedly mounted on the side wall of the unloading rack. The third gear plate is matched with the second gear and is used to drive the rotating roller to rotate.

[0019] A semiconductor component transfer method, applicable to the above-mentioned semiconductor component transfer device, comprises the following steps:

[0020] S1: Transfer; Place the package base, semiconductor components and package shell on the surface of each feeding belt in turn, and use the motor to drive the rotating shaft and the placement disk to rotate, and each time it rotates forty-five degrees, under the action of the first spring, the driving abutment ring is tightly attached to the side wall of the driving disk, and when the abutment ring contacts the protrusion, the first connecting rod and the push rod push the first clamp to be located on the surface of the feeding belt, and then the first clamp is driven downward by the first electric telescopic rod to grab the package base, and when the abutment ring contacts the groove, the first clamp is driven to be located on the placement plate surface by the first spring, and the first clamp is driven downward again by the first electric telescopic rod to place the package base on the mold base surface, and then when the package base moves to the bottom of the second loading rack, the semiconductor component is inserted into the package base by the second clamp, and then the semiconductor component continues to transfer. When it reaches the bottom of the third loading rack, the package shell is sleeved on the surface of the semiconductor component by the third clamp, and the semiconductor component is automatically transferred;

[0021] S2: Positioning; when the first clamp is located on the surface of the placement plate and the first clamp is driven to move downward by the first electric telescopic rod to place the package base on the mold base surface, the pressing block squeezes the pressing plate, thereby driving the pressing plate to move downward, driving the second tooth plate to move downward, and driving the two first tooth plates to move away through the first gear, driving the positioning plates on both sides to move away, so that the package base can be placed on the mold base surface, and then the first electric telescopic rod is reset, the pressing block is separated from the pressing plate, and the second spring is reset, so that the positioning plate can be driven to position the package base to prevent displacement during the transfer process; when the semiconductor component is transferred to the bottom of the third loading rack and the package shell is sleeved on the surface of the semiconductor component by the third clamp, the squeezing block first contacts the wedge-shaped part of the positioning plate and drives the positioning plates on both sides to move away to ensure that the package shell can be smoothly inserted, and under the action of the third spring, the driving clamp maintains the positioning of the package base;

[0022] S3: unloading; when the packaged semiconductor components move to the bottom of the unloading rack, the second electric telescopic rod drives the mounting seat to move downward, and the packaged semiconductor components are grabbed and unloaded by the fourth clamp. When the fourth clamp moves toward the surface of the feed belt, the second gear engages with the third gear plate, thereby driving the rotating roller to drive the fourth clamp to rotate one hundred and eighty degrees counterclockwise, placing the packaged semiconductor components on the surface of the feed belt for unloading, and completing the face change of the packaged semiconductor components.

[0023] The present invention provides a semiconductor component transfer device and a transfer method thereof, the beneficial effects of which include:

[0024] 1. By setting up a transfer mechanism, the motor drives the rotating shaft and the placement plate to rotate, and each time it rotates forty-five degrees, when the abutment ring contacts the protrusion, the first clamp is pushed to the surface of the feed belt, and the package base is grabbed by moving the first clamp downward. When the abutment ring contacts the groove, the first clamp is located on the surface of the placement plate, and the first clamp moves downward to place the package base on the surface of the mold base. Then, when the package base moves to the bottom of the second loading rack, the semiconductor component is inserted into the package base through the second clamp. Then, the semiconductor component continues to transfer. When it reaches the bottom of the third loading rack, the package shell is sleeved on the surface of the semiconductor component through the third clamp, thereby realizing automatic transfer of semiconductor components and improving packaging efficiency.

[0025] 2. By setting a positioning mechanism, when the first electric telescopic rod drives the first clamp to move downward, the pressure block squeezes the pressure plate, and drives the two first tooth plates to move away through the first gear, driving the positioning plates on both sides to move away, so that the package base can be placed on the mold base surface; then the first electric telescopic rod is reset, the pressure block is separated from the pressure plate, and the second spring is reset, and the positioning plate can be driven to position the package base to prevent displacement during the transfer process; when the semiconductor component is transferred to the bottom of the third loading rack, the third clamp descends to put the package shell on the surface of the semiconductor component, and the positioning plates on both sides are driven to move away to ensure that the package shell can be inserted smoothly. Under the action of the third spring, the clamp can be driven to maintain the positioning of the package base to avoid displacement of the package base during the insertion of the package shell, thereby ensuring the quality of the package.

[0026] 3. By setting up a unloading mechanism, when the packaged semiconductor components move to the bottom of the unloading rack, the second electric telescopic rod drives the mounting seat to move downward, and the fourth clamp is used to grab and unload the packaged semiconductor components. When the fourth clamp moves toward the surface of the feed belt, the second gear engages with the third gear plate, thereby driving the rotating roller to drive the fourth clamp to rotate 180 degrees counterclockwise, placing the packaged semiconductor components on the surface of the feed belt for unloading, and completing the face change of the packaged semiconductor components, which is convenient for subsequent marking operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and should not be considered as limiting the scope. A person of ordinary skill in the art can also derive other relevant drawings based on these drawings without inventive effort.

[0028] Figure 1 is a front perspective view provided by an embodiment of the present invention;

[0029] Figure 2 A top view of an embodiment of the present invention;

[0030] Figure 3 A cross-sectional view of an installation box provided for an embodiment of the present invention;

[0031] Figure 4 A three-dimensional diagram of a placement plate provided in an embodiment of the present invention;

[0032] Figure 5 A cross-sectional view of a placement plate provided for an embodiment of the present invention;

[0033] Figure 6 Provided for the embodiments of the present invention Figure 5 Enlarged view of point A in the middle;

[0034] Figure 7 A three-dimensional diagram of a first loading rack provided in an embodiment of the present invention;

[0035] Figure 8 A side view of an embodiment of the present invention is provided;

[0036] Figure 9 Provided for the embodiments of the present invention Figure 8 Enlarged view of point B in the middle;

[0037] Figure 10 A three-dimensional diagram of a blanking rack provided in an embodiment of the present invention.

[0038] In the figure: 1, machine; 2, feeding belt; 3, transfer mechanism; 301, installation box; 302, motor; 303, rotating shaft; 304, placement plate; 305, placement plate; 306, mold base; 307, driving plate; 308, groove portion; 309, protrusion; 310, first loading rack; 311, first slide; 312, first electric telescopic rod; 313, first clamp; 314, push rod; 315, first spring; 316, connecting plate; 317, first connecting rod; 318, abutting ring; 319, second loading rack; 320, second clamp; 321, third loading rack; 3 22. Third clamp; 4. Positioning mechanism; 401. Positioning plate; 402. Slide rail; 403. First tooth plate; 404. First gear; 405. Second tooth plate; 406a. Pressing plate; 406b. Pressing block; 407. Slide rod; 408. Second spring; 409. Limiting plate; 410. Clamping block; 411. Third spring; 412. Extrusion block; 5. Unloading mechanism; 501. Unloading rack; 502. Second slide; 503. Second electric telescopic rod; 504. Mounting seat; 505. Rotating roller; 506. Fourth clamp; 507. Second gear; 508. Third tooth plate. DETAILED DESCRIPTION

[0039] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0040] Reference Figures 1-10As shown, the present invention provides a technical solution: a semiconductor component transfer device, comprising a machine 1 and a feeding belt 2, the feeding belt 2 is symmetrically mounted on the surface of the machine 1 for conveying raw materials, a transfer mechanism 3 is mounted on the surface of the machine 1 for transferring semiconductor components, the transfer mechanism 3 comprises an installation box 301, a placement plate 305, a drive disk 307 and a first loading rack 310, the installation box 301 is fixedly mounted on the surface of the machine 1, a motor 302 is fixedly mounted on the inner cavity of the installation box 301, a rotating shaft 303 is fixedly mounted on the output end of the motor 302, a placement disk 304 is fixedly mounted on the other end of the rotating shaft 303, the placement plate 305 is symmetrically fixedly mounted on the surface of the placement disk 304, a mold base 306 is mounted on the surface of the placement plate 305 for placing a package base, and when in use, the package base is placed on the surface of the mold base 306, and the motor 302 drives the rotating shaft 303 and the placement disk 304 to rotate, so that it can be transferred.

[0041] Reference Figure 1-Figure 7 As shown, in a preferred embodiment, the drive disk 307 is fixedly mounted on the bottom of the placement plate 305, and the side wall of the drive disk 307 is provided with a groove portion 308 and a protrusion portion 309, and the first loading rack 310 is fixedly mounted on the surface of the machine 1, and the first loading rack 310 has a first slide 311 slidingly mounted in the inner cavity, and a first electric telescopic rod 312 is fixedly mounted on the surface of the first slide 311, and a first clamp 313 is fixedly mounted on the telescopic end of the first electric telescopic rod 312 for grabbing the packaging base. When the first clamp 313 moves to the surface of the feeding belt 2, the first clamp 313 is driven downward by the first electric telescopic rod 312 to grab the packaging base, and then when the first clamp 313 moves to the surface of the placement plate 305, the first clamp 313 is driven downward again by the first electric telescopic rod 312 to place the packaging base on the surface of the mold base 306.

[0042] Reference Figure 1-Figure 7As shown, in a preferred embodiment, a push rod 314 is slidably installed in the first loading rack 310, one end of the push rod 314 is fixedly connected to the first slide 311, a first spring 315 is sleeved on the surface of the push rod 314, one end of the first spring 315 is fixedly connected to the first loading rack 310, the other end of the first spring 315 is fixedly connected to the first slide 311, and is used to drive the first slide 311 to move toward the placement plate 304, the other end of the push rod 314 is fixedly installed with a connecting plate 316, and a first connecting rod 317 is slidably installed in the inner cavity of the first loading rack 310, one end of the first connecting rod 317 is fixedly connected to the connecting plate 316, and the other end of the first connecting rod 317 is installed with an abutment ring 318, which contacts the side wall of the driving disk 307. 15, the driving abutment ring 318 is tightly attached to the side wall of the driving disk 307, and the placement disk 304 is driven to rotate forty-five degrees each time by the motor 302. When the abutment ring 318 contacts the protrusion 309, the first clamp 313 is pushed to the surface of the feeding belt 2 through the first connecting rod 317 and the push rod 314. When the abutment ring 318 contacts the groove portion 308, the first clamp 313 is driven to the surface of the placement plate 305 through the first spring 315. A second loading rack 319 is fixedly installed on the surface of the machine 1, and a second clamp 320 is installed in the inner cavity of the second loading rack 319 for grabbing semiconductor components. A third loading rack 321 is fixedly installed on the surface of the machine 1, and a third clamp 322 is installed in the inner cavity of the third loading rack 321 for grabbing the packaging shell.

[0043] In a preferred embodiment, when in use, the package base, semiconductor components and package shell are placed on the surface of each feeding belt 2 in sequence, and the motor 302 drives the rotating shaft 303 and the placement plate 304 to rotate, and each time it rotates forty-five degrees, under the action of the first spring 315, the driving abutment ring 318 is tightly attached to the side wall of the driving plate 307, and when the abutment ring 318 contacts the protrusion 309, the first connecting rod 317 and the push rod 314 push the first clamp 313 to be located on the surface of the feeding belt 2, and then the first clamp 313 is driven downward by the first electric telescopic rod 312 to grab the package base. When the abutment ring 318 is in contact with the protrusion 309, the first clamp 313 is pushed to be located on the surface of the feeding belt 2. When 18 contacts the groove portion 308, the first clamp 313 is driven by the first spring 315 to be located on the surface of the placement plate 305, and the first clamp 313 is driven downward again by the first electric telescopic rod 312 to place the package base on the surface of the mold base 306. Then, when the package base moves to the bottom of the second loading rack 319, the semiconductor component is inserted into the package base through the second clamp 320. Then, the semiconductor component continues to be transferred. When it reaches the bottom of the third loading rack 321, the package shell is sleeved on the surface of the semiconductor component through the third clamp 322, thereby realizing automatic transfer of the semiconductor component and improving packaging efficiency.

[0044] Reference Figures 1-9As shown, in a preferred embodiment, a positioning mechanism 4 is installed on the surface of the placement plate 304 for positioning the packaging base, and the positioning mechanism 4 includes a positioning plate 401 and a first tooth plate 403. The positioning plate 401 is symmetrically slidably installed on the surface of the placement plate 305 for positioning the packaging base, and a slide rail 402 is symmetrically fixedly installed on the surface of the placement plate 304. The positioning plate 401 is slidably installed on the surface of the slide rail 402. The first tooth plate 403 is symmetrically fixedly installed on the bottom of the positioning plate 401, and a first gear 404 is rotatably installed in the inner cavity of the placement plate 305. The two first tooth plates 403 are engaged with the first gear 404 to drive the positioning plates 401 on both sides to move relative to each other.

[0045] Reference Figures 1-9 As shown, in a preferred embodiment, a second tooth plate 405 is slidably installed in the inner cavity of the placement plate 305, the second tooth plate 405 is meshed with the first gear 404, a pressure plate 406a is fixedly installed on the side wall of the second tooth plate 405, a slide rod 407 is symmetrically fixedly installed in the inner cavity of the placement plate 305, the pressure plate 406a is slidably connected to the slide rod 407, a second spring 408 is sleeved on the surface of the slide rod 407, one end of the second spring 408 is fixedly connected to the placement plate 305, and the other end of the second spring 408 is fixedly connected to the pressure plate 406a, which is used to drive the second tooth plate 405 to move upward, and a pressure block 406b is fixedly installed at both ends of the first clamp 313 to drive the pressure plate 406a to move downward. When the first clamp 313 313 is located on the surface of the placement plate 305 and drives the first clamp 313 to move downward through the first electric telescopic rod 312. When the package base is placed on the surface of the mold base 306, the pressure block 406b squeezes the pressure plate 406a, thereby driving the pressure plate 406a to move downward, driving the second tooth plate 405 to move downward, and driving the two first tooth plates 403 to move away through the first gear 404, driving the positioning plates 401 on both sides to move away, and the package base can be placed on the surface of the mold base 306. Then the first electric telescopic rod 312 is reset, the pressure block 406b is separated from the pressure plate 406a, and the second spring 408 is reset, which can drive the positioning plate 401 to position the package base to prevent displacement during the transfer process.

[0046] Reference Figures 1-9As shown, in a preferred embodiment, the inner cavity of the positioning plate 401 is symmetrically slidably installed with a limit plate 409, the side wall of the limit plate 409 is fixedly installed with a clamping block 410, and the inner cavity of the positioning plate 401 is fixedly installed with a third spring 411. One end of the third spring 411 is fixedly connected to the positioning plate 401, and the other end of the third spring 411 is fixedly connected to the limit plate 409, which is used to drive the clamping block 410 to move outward and perform secondary positioning on the packaging base. The surface of the positioning plate 401 is wedge-shaped, and the extrusion blocks 410 are fixedly installed on both sides of the third clamp 322. 2. It is used to drive the positioning plate 401 to move. When the semiconductor component is transferred to the bottom of the third loading rack 321 and the third clamp 322 is lowered to put the packaging shell on the surface of the semiconductor component, the extrusion block 412 first contacts the wedge-shaped part of the positioning plate 401 and drives the positioning plates 401 on both sides to move away, ensuring that the packaging shell can be smoothly inserted. Under the action of the third spring 411, the clamping block 410 can be driven to maintain the positioning of the packaging base, avoiding the packaging base from shifting during the insertion of the packaging shell, thereby ensuring the packaging quality.

[0047] In a preferred embodiment, when the first clamp 313 is located on the surface of the placement plate 305 and the first electric telescopic rod 312 drives the first clamp 313 to move downward, and the package base is placed on the surface of the mold base 306, the pressing block 406b squeezes the pressing plate 406a, thereby driving the pressing plate 406a to move downward, driving the second tooth plate 405 to move downward, and driving the two first tooth plates 403 to move away from each other through the first gear 404, driving the positioning plates 401 on both sides to move away from each other, and thus the package base is placed on the surface of the mold base 306. Then, the first electric telescopic rod 312 is reset, and the pressing block 406b is separated from the pressing plate 406a. When the second spring 408 is reset, the positioning plate 401 can be driven to position the package base to prevent displacement during the transfer process; when the semiconductor component is transferred to the bottom of the third loading rack 321 and the third clamp 322 is lowered to put the package shell on the surface of the semiconductor component, the extrusion block 412 first contacts the wedge-shaped part of the positioning plate 401 and drives the positioning plates 401 on both sides to move away, ensuring that the package shell can be smoothly inserted. Under the action of the third spring 411, the clamping block 410 can be driven to maintain the positioning of the package base, avoiding displacement of the package base during the insertion of the package shell, thereby ensuring the packaging quality.

[0048] Reference Figures 1-10As shown, in a preferred embodiment, a blanking mechanism 5 is installed on the surface of the machine 1 for blanking the packaged semiconductor components. The blanking mechanism 5 includes a blanking rack 501 and a fourth clamp 506. The blanking rack 501 is fixedly installed on the surface of the machine 1. A second slide 502 is slidably installed in the inner cavity of the blanking rack 501. A second electric telescopic rod 503 is fixedly installed on the surface of the second slide 502. A mounting seat 504 is fixedly installed at the telescopic end of the second electric telescopic rod 503. A rotating roller 505 is rotatably installed in the inner cavity of the mounting seat 504. A fourth clamp 506 is fixedly installed at the bottom of the rotating roller 505 for grabbing the packaged semiconductor components. When the packaged semiconductor components move to the bottom of the blanking rack 501, the fourth clamp 506 is fixedly installed at the bottom of the rotating roller 505 for grabbing the packaged semiconductor components. The second electric telescopic rod 503 drives the mounting seat 504 to move downward, and the packaged semiconductor components are grabbed and unloaded through the fourth clamp 506. A second gear 507 is fixedly installed on the side wall of the rotating roller 505, and a third tooth plate 508 is fixedly installed on the side wall of the unloading rack 501. The third tooth plate 508 is adapted to the second gear 507 and is used to drive the rotating roller 505 to rotate. When the fourth clamp 506 moves toward the surface of the feeding belt 2, the second gear 507 engages with the third tooth plate 508, thereby driving the rotating roller 505 to drive the fourth clamp 506 to rotate one hundred and eighty degrees counterclockwise, placing the packaged semiconductor components on the surface of the feeding belt 2 for unloading, and completing the face change of the packaged semiconductor components, which is convenient for subsequent marking operations.

[0049] In a preferred embodiment, when the packaged semiconductor components move to the bottom of the unloading rack 501, the mounting seat 504 is driven downward by the second electric telescopic rod 503, and the packaged semiconductor components are grabbed and unloaded by the fourth clamp 506. When the fourth clamp 506 moves toward the surface of the feed belt 2, the second gear 507 engages with the third gear plate 508, thereby driving the rotating roller 505 to drive the fourth clamp 506 to rotate one hundred and eighty degrees counterclockwise, placing the packaged semiconductor components on the surface of the feed belt 2 for unloading, and completing the face change of the packaged semiconductor components, which is convenient for subsequent marking operations.

[0050] Specifically, the working principle of this semiconductor component transfer device is as follows: when in use, the package base, semiconductor components and package shell are placed on the surface of each feeding belt 2 in turn, and the motor 302 drives the rotating shaft 303 and the placement plate 304 to rotate, and each rotation is forty-five degrees. Under the action of the first spring 315, the driving abutment ring 318 is tightly attached to the side wall of the driving plate 307. When the abutment ring 318 contacts the protrusion 309, the first connecting rod 317 and the push rod 314 push the first clamp 313 to the surface of the feeding belt 2, and then the first clamp 313 is driven downward by the first electric telescopic rod 312 to grab the package base. When the abutment ring 318 contacts the groove portion 308, the first clamp 313 is driven to be located on the surface of the placement plate 305 by the first spring 315, and the first clamp 313 is driven downward again by the first electric telescopic rod 312 to place the package base on the surface of the mold base 306. Then, when the package base moves to the bottom of the second loading rack 319, the semiconductor component is inserted into the package base through the second clamp 320. Then, the semiconductor component continues to be transferred. When it reaches the bottom of the third loading rack 321, the package shell is sleeved on the surface of the semiconductor component through the third clamp 322, thereby realizing automatic transfer of semiconductor components and improving packaging efficiency.

[0051] When the first clamp 313 is located on the surface of the placement plate 305 and the first electric telescopic rod 312 drives the first clamp 313 to move downward, and the package base is placed on the surface of the mold base 306, the pressing block 406b squeezes the pressing plate 406a, thereby driving the pressing plate 406a to move downward, driving the second tooth plate 405 to move downward, and driving the two first tooth plates 403 to move away through the first gear 404, driving the two side positioning plates 401 to move away, and the package base is placed on the surface of the mold base 306. Then, the first electric telescopic rod 312 is reset, the pressing block 406b is separated from the pressing plate 406a, and the second spring 40 8 reset, the positioning plate 401 can be driven to position the package base to prevent displacement during the transfer process; when the semiconductor component is transferred to the bottom of the third loading rack 321, and the third clamp 322 is lowered to put the package shell on the surface of the semiconductor component, the extrusion block 412 first contacts the wedge-shaped part of the positioning plate 401, and drives the positioning plates 401 on both sides to move away, ensuring that the package shell can be smoothly inserted, and under the action of the third spring 411, the clamping block 410 can be driven to maintain the positioning of the package base, avoiding the package base from being offset during the insertion of the package shell, thereby ensuring the packaging quality.

[0052] When the packaged semiconductor components move to the bottom of the unloading rack 501, the second electric telescopic rod 503 drives the mounting seat 504 to move downward, and the packaged semiconductor components are grabbed and unloaded by the fourth clamp 506. When the fourth clamp 506 moves toward the surface of the feeding belt 2, the second gear 507 engages with the third gear plate 508, thereby driving the rotating roller 505 to drive the fourth clamp 506 to rotate one hundred and eighty degrees counterclockwise, placing the packaged semiconductor components on the surface of the feeding belt 2 for unloading, and completing the face change of the packaged semiconductor components, which is convenient for subsequent marking operations.

[0053] A semiconductor component transfer method, applicable to the above-mentioned semiconductor component transfer device, comprises the following steps:

[0054] S1: Transfer; Place the package base, semiconductor components and package shell on the surface of each feeding belt 2 in turn, and drive the rotating shaft 303 and the placement plate 304 to rotate by the motor 302, and rotate forty-five degrees each time. Under the action of the first spring 315, the driving abutment ring 318 is tightly attached to the side wall of the driving plate 307. When the abutment ring 318 contacts the protrusion 309, the first clamp 313 is pushed to the surface of the feeding belt 2 by the first connecting rod 317 and the push rod 314. Then, the first clamp 313 is driven downward by the first electric telescopic rod 312 to grab the package base. When the abutment ring 3 When the first clamp 313 contacts the groove portion 308, the first spring 315 drives the first clamp 313 to be positioned on the surface of the placement plate 305. The first electric telescopic rod 312 drives the first clamp 313 downward again to place the package base on the surface of the mold base 306. Then, when the package base moves to the bottom of the second loading rack 319, the semiconductor component is inserted into the package base by the second clamp 320. Then, the semiconductor component continues to be transferred. When it reaches the bottom of the third loading rack 321, the package shell is sleeved on the surface of the semiconductor component by the third clamp 322, and the semiconductor component is automatically transferred.

[0055] S2: Positioning; When the first clamp 313 is located on the surface of the placement plate 305 and the first electric telescopic rod 312 drives the first clamp 313 to move downward, and the package base is placed on the surface of the mold base 306, the pressing block 406b squeezes the pressing plate 406a, thereby driving the pressing plate 406a to move downward, driving the second tooth plate 405 to move downward, and driving the two first tooth plates 403 to move away through the first gear 404, driving the positioning plates 401 on both sides to move away, and the package base can be placed on the surface of the mold base 306, then the first electric telescopic rod 312 is reset, and the pressing block 4 06b is released from the pressure plate 406a, and the second spring 408 is reset, which drives the positioning plate 401 to position the package base to prevent deviation during the transfer process; when the semiconductor component is transferred to the bottom of the third loading rack 321 and the third clamp 322 is lowered to put the package shell on the surface of the semiconductor component, the squeezing block 412 first contacts the wedge-shaped portion of the positioning plate 401 and drives the positioning plates 401 on both sides to move away, ensuring that the package shell can be smoothly inserted. Under the action of the third spring 411, the driving clamping block 410 maintains the positioning of the package base;

[0056] S3: unloading; when the packaged semiconductor components move to the bottom of the unloading rack 501, the second electric telescopic rod 503 drives the mounting seat 504 to move downward, and the packaged semiconductor components are grabbed and unloaded by the fourth clamp 506. When the fourth clamp 506 moves toward the surface of the feeding belt 2, the second gear 507 engages with the third gear plate 508, thereby driving the rotating roller 505 to drive the fourth clamp 506 to rotate one hundred and eighty degrees counterclockwise, placing the packaged semiconductor components on the surface of the feeding belt 2 for unloading, and completing the face change of the packaged semiconductor components.

[0057] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A semiconductor component transfer device, comprising a machine (1) and a feed belt (2), wherein the feed belt (2) is symmetrically mounted on the surface of the machine (1) and is used to transport raw materials, characterized in that: A transfer mechanism (3) is mounted on the surface of the machine (1) for transferring semiconductor components. The transfer mechanism (3) comprises: An installation box (301), the installation box (301) is fixedly installed on the surface of the machine (1), a motor (302) is fixedly installed in the inner cavity of the installation box (301), a rotating shaft (303) is fixedly installed at the output end of the motor (302), and a placement plate (304) is fixedly installed at the other end of the rotating shaft (303); A placement plate (305), the placement plate (305) being symmetrically fixedly mounted with a placement tray (304) surface, and a mold base (306) being mounted on the surface of the placement plate (305) for placing a package base; A driving disk (307), the driving disk (307) is fixedly mounted on the bottom of the placement plate (305), and a side wall of the driving disk (307) is provided with a groove portion (308) and a protrusion portion (309); A first loading rack (310) is fixedly mounted on the surface of the machine platform (1); a first slide (311) is slidably mounted in the inner cavity of the first loading rack (310); a first electric telescopic rod (312) is fixedly mounted on the surface of the first slide (311); a first clamp (313) is fixedly mounted on the telescopic end of the first electric telescopic rod (312) for grasping the packaging base.

2. The semiconductor component transfer device according to claim 1, characterized in that: A push rod (314) is slidably installed in the first loading rack (310), one end of the push rod (314) is fixedly connected to the first slide (311), a first spring (315) is sleeved on the surface of the push rod (314), one end of the first spring (315) is fixedly connected to the first loading rack (310), and the other end of the first spring (315) is fixedly connected to the first slide (311), and is used to drive the first slide (311) to move toward the placement tray (304).

3. The semiconductor component transfer device according to claim 2, characterized in that: A connecting plate (316) is fixedly installed at the other end of the push rod (314), a first connecting rod (317) is slidably installed in the inner cavity of the first loading rack (310), one end of the first connecting rod (317) is fixedly connected to the connecting plate (316), and an abutment ring (318) is installed at the other end of the first connecting rod (317), and the abutment ring (318) is in contact with the side wall of the driving disk (307).

4. The semiconductor component transfer device according to claim 3, characterized in that: A second loading rack (319) is fixedly mounted on the surface of the machine (1), and a second clamp (320) is mounted in the inner cavity of the second loading rack (319) for grabbing semiconductor components. A third loading rack (321) is fixedly mounted on the surface of the machine (1), and a third clamp (322) is mounted in the inner cavity of the third loading rack (321) for grabbing packaging shells.

5. The semiconductor component transfer device according to claim 4, characterized in that: The surface of the placement plate (304) is installed with a positioning mechanism (4) for positioning the packaging base, and the positioning mechanism (4) includes a positioning plate (401) and a first tooth plate (403). The positioning plate (401) is symmetrically slidably installed on the surface of the placement plate (305). The surface of the placement plate (304) is symmetrically fixed with a slide rail (402). The positioning plate (401) is slidably installed on the surface of the slide rail (402). The bottom of the positioning plate (401) is symmetrically fixed with a first tooth plate (403). The inner cavity of the placement plate (305) is rotatably installed with a first gear (404), and the two first tooth plates (403) are both engaged with the first gear (404).

6. The semiconductor component transfer device according to claim 5, characterized in that: A second tooth plate (405) is slidably installed in the inner cavity of the placement plate (305), and the second tooth plate (405) is meshed with the first gear (404). A pressure plate (406a) is fixedly installed on the side wall of the second tooth plate (405). A sliding rod (407) is symmetrically fixedly installed in the inner cavity of the placement plate (305). The pressure plate (406a) is slidably connected to the sliding rod (407). A second spring (408) is sleeved on the surface of the sliding rod (407). One end of the second spring (408) is fixedly connected to the placement plate (305), and the other end of the second spring (408) is fixedly connected to the pressure plate (406a) for driving the second tooth plate (405) to move upward. Pressure blocks (406b) are fixedly installed at both ends of the first clamp (313) for driving the pressure plate (406a) to move downward.

7. The semiconductor component transfer device according to claim 6, characterized in that: A limiting plate (409) is symmetrically and slidably mounted in the inner cavity of the positioning plate (401), a clamping block (410) is fixedly mounted on the side wall of the limiting plate (409), a third spring (411) is fixedly mounted in the inner cavity of the positioning plate (401), one end of the third spring (411) is fixedly connected to the positioning plate (401), and the other end of the third spring (411) is fixedly connected to the limiting plate (409), and is used to drive the clamping block (410) to move outward, the surface of the positioning plate (401) is wedge-shaped, and extrusion blocks (412) are fixedly mounted on both sides of the third clamp (322), and are used to drive the positioning plate (401) to move.

8. The semiconductor component transfer device according to claim 7, characterized in that: The surface of the machine (1) is provided with a blanking mechanism (5) for blanking packaged semiconductor components. The blanking mechanism (5) comprises a blanking rack (501) and a fourth clamp (506). The blanking rack (501) is fixedly mounted on the surface of the machine (1). A second slide (502) is slidably mounted in the inner cavity of the blanking rack (501). A second electric telescopic rod (503) is fixedly mounted on the surface of the second slide (502). A mounting seat (504) is fixedly mounted on the telescopic end of the second electric telescopic rod (503). A rotating roller (505) is rotatably mounted in the inner cavity of the mounting seat (504). A fourth clamp (506) is fixedly mounted on the bottom of the rotating roller (505) for grabbing packaged semiconductor components.

9. The semiconductor component transfer device according to claim 8, characterized in that: A second gear (507) is fixedly mounted on the side wall of the rotating roller (505), and a third tooth plate (508) is fixedly mounted on the side wall of the unloading rack (501). The third tooth plate (508) is adapted to the second gear (507) and is used to drive the rotating roller (505) to rotate.

10. A semiconductor component transfer method, applicable to the semiconductor component transfer device according to claim 9, characterized in that: The steps include: S1: Transfer; Place the package base, semiconductor components and package shell on the surface of each feeding belt (2) in turn, and drive the rotating shaft (303) and the placement disk (304) to rotate by the motor (302), and rotate forty-five degrees each time. Under the action of the first spring (315), the driving abutment ring (318) is pressed against the side wall of the driving disk (307). When the abutment ring (318) contacts the protrusion (309), the first clamp (313) is pushed to the surface of the feeding belt (2) by the first connecting rod (317) and the push rod (314). Then, the first clamp (313) is driven downward by the first electric telescopic rod (312) to grab the package base. When the abutment ring (318) contacts the protrusion (309), the first clamp (313) is pushed downward by the first electric telescopic rod (312) to grab the package base. When the connecting ring (318) contacts the groove portion (308), the first clamp (313) is driven to be located on the surface of the placement plate (305) by the first spring (315), and the first clamp (313) is driven downward again by the first electric telescopic rod (312), and the package base is placed on the surface of the mold base (306). Then, when the package base moves to the bottom of the second loading rack (319), the semiconductor component is inserted into the package base by the second clamp (320), and then the semiconductor component continues to be transferred. When it reaches the bottom of the third loading rack (321), the package shell is sleeved on the surface of the semiconductor component by the third clamp (322), and the semiconductor component is automatically transferred; S2: Positioning; when the first clamp (313) is located on the surface of the placement plate (305) and is driven to move downward by the first electric telescopic rod (312), the package base is placed on the surface of the mold base (306), the pressing block (406b) presses the pressing plate (406a), thereby driving the pressing plate (406a) to move downward, driving the second tooth plate (405) to move downward, and driving the two first tooth plates (403) to move away through the first gear (404), driving the positioning plates (401) on both sides to move away, so that the package base can be placed on the surface of the mold base (306), and then the first electric telescopic rod (312) is reset, the pressing block (406b) is separated from the pressing plate (406a), and the second spring (408) is reset, so that the positioning plate (401) can be driven to position the package base to prevent displacement during the transfer process; When the semiconductor component is transferred to the bottom of the third loading rack (321) and the third clamp (322) is lowered to sleeve the package shell onto the surface of the semiconductor component, the extrusion block (412) first contacts the wedge-shaped portion of the positioning plate (401) and drives the positioning plates (401) on both sides to move away from each other, ensuring that the package shell can be smoothly inserted. Under the action of the third spring (411), the clamping block (410) is driven to maintain the positioning of the package base; S3: unloading; when the packaged semiconductor components move to the bottom of the unloading rack (501), the second electric telescopic rod (503) drives the mounting seat (504) to move downward, and the packaged semiconductor components are grabbed and unloaded by the fourth clamp (506). When the fourth clamp (506) moves toward the surface of the feeding belt (2), the second gear (507) engages with the third gear plate (508), thereby driving the rotating roller (505) to drive the fourth clamp (506) to rotate one hundred and eighty degrees counterclockwise, placing the packaged semiconductor components on the surface of the feeding belt (2) for unloading, and completing the face change of the packaged semiconductor components.

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