Semiconductor chip terminal test system
Through the chip conveyor system driven by a plate conveyor belt and electric push rod, combined with thermal conductivity and dust removal components, the efficient conveying, dust removal and heat dissipation problems of the semiconductor chip test system are solved, and efficient and integrated chip testing is achieved.
Patent Information
- Application Number
- CN202510734494.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-04
- Publication Date
- 2025-08-15
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The existing semiconductor chip test systems have problems such as high equipment investment costs, low test throughput, fragmented process flow, and poor thermal management of probes, which are difficult to meet the high throughput and high precision detection needs.
A chip conveyor system driven by a plate conveyor belt and electric push rod is combined with thermal conductivity components, dust removal components and cutting components to achieve efficient chip conveying, dust removal and heat dissipation, and integrate the test process.
It improves the efficiency and accuracy of chip testing, reduces equipment costs, simplifies process flow, extends the service life of the probe, and improves the integration of the test system.
Smart Images
Figure CN120490772A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of semiconductor chip testing, in particular to a semiconductor chip terminal testing system. Background Art
[0002] Semiconductor chips are core components of modern electronic devices, and their quality inspection process directly affects product reliability and yield. Traditional testing systems generally use a discrete loading and unloading structure with a robotic arm and a vacuum suction cup. This has the following technical bottlenecks: First, the material handling system consisting of a precision manipulator and an independent suction cup module not only has high equipment investment costs, but also can only handle a single chip at a time. This operation method seriously restricts test throughput and is difficult to adapt to the large-scale testing needs of wafer-level packaging or high-density chips. Second, the dust removal process is physically separated from the testing process in the existing production line layout, requiring a separate dust removal platform and a secondary positioning device, resulting in a fragmented process flow. The additional material turnover process not only reduces equipment integration but also affects the production line cycle. Third, there is a lack of effective thermal management solutions for the Joule heat generated by the contact resistance of the probe during high-frequency testing. Long-term heat accumulation can easily lead to problems such as increased probe oxidation and contact impedance drift, directly affecting test accuracy and probe service life.
[0003] More specific technical defects are reflected in the following aspects: (1) Traditional manipulators adopt a serial operation mode, and there are a large number of invalid strokes in the complete action cycle of chip picking, positioning, and placement. The vacuum adsorption system has strict requirements on the flatness of the chip surface, and is prone to adsorption failure when facing ultra-thin or special-shaped packaged chips; (2) Independent dust removal stations need to be equipped with a dedicated air path system and filtering device. The dust removal airflow direction is arranged orthogonally to the chip conveying path, and there are dust removal dead corners and in-situ processing cannot be achieved, which increases the equipment footprint; (3) Conventional air-cooled heat dissipation solutions have technical pain points such as disordered airflow organization and unclear heat dissipation paths. The probe operating temperature fluctuates by up to ±15°C, seriously affecting the stability of semiconductor parameter testing. These systematic defects make it difficult for existing testing equipment to meet the technical requirements of advanced process chips for high-throughput and high-precision online testing. Summary of the Invention
[0004] In view of the problems existing in the prior art, the object of the present invention is to provide a semiconductor chip terminal testing system to overcome the defects of the background technology.
[0005] In order to solve the background technical problems, the present invention adopts the following technical solutions; a semiconductor chip terminal testing system, comprising a base plate and a plate conveyor, the plate conveyor is installed on the base plate, a group of detection slots for placing chips are opened inside the plate conveyor, a top plate is installed on the top of the base plate, an electric push rod is installed on the top plate, the bottom end of the electric push rod is fixedly connected to the detection plate, a group of probes are installed on the detection plate, a test body is installed on the top of the top plate, the test body is connected to the detection plate through two wires, a heat conduction component is provided on the outside of the detection plate, a water tank is installed on the top of the top plate, a dust removal component is installed on the water tank, and a blanking component is provided on the outside of the detection plate.
[0006] As a further description of the above technical solution: the heat-conducting assembly includes a heat-absorbing block, a heat-conducting rod and a heat-radiating plate. The heat-absorbing block is sleeved on the outside of the electric push rod, and the bottom of the heat-absorbing block is installed on the outside of the detection plate. One end of the heat-conducting rod is fixedly connected to the outside of the heat-absorbing block, and the other end of the heat-conducting rod passes through the top plate and the water tank and is slidably connected to the inside of the water tank. The outside of the heat-radiating plate is installed on the top end of the heat-conducting rod.
[0007] As a further description of the above technical solution: the dust removal assembly includes a piston plate, an air intake pipe, an exhaust pipe, a nozzle and two one-way valves. The outer side of the piston plate is slidably connected to the interior of the water tank. The outer side of the piston plate is fixedly connected to two connecting rods. One end of the connecting rod is fixedly connected to the outer side of the heat release plate. One end of the air intake pipe and the exhaust pipe passes through and is fixedly connected to the interior of the water tank. The two one-way valves are respectively installed to the outside of the air intake pipe and the exhaust pipe. The installation directions of the two one-way valves are opposite. The other end of the exhaust pipe passes through and is fixedly connected to the interior of the nozzle. The bottom of the nozzle is installed to the top of the base plate.
[0008] As a further description of the above technical solution: the unloading assembly includes a connecting plate, a piston rod and a folded tube, one side of the connecting plate is fixedly connected to the outer side of the detection plate, the other side of the connecting plate is fixedly connected to the top of the piston rod, the bottom end of the piston rod passes through and is slidably connected to the inside of the folded tube, one end of the folded tube passes through and extends to the inside of the bottom plate, two groups of air holes of different sizes are opened inside the plate conveyor belt, the inner diameter of the air holes on the back is larger than the inner diameter of the air holes on the front, one end of the folded tube is connected to the detection groove through the air holes, and a material guide slope is provided on the bottom plate.
[0009] As a further description of the above technical solution: the middle of the exhaust pipe is fixedly connected to a hose connected thereto, one end of the hose passes through and is fixedly connected to an exhaust box, the exhaust box is sleeved to the outside of the probe, and one side of the exhaust box is fixedly connected to the bottom of the detection board.
[0010] As a further description of the above technical solution: a cooler is installed on the water tank, and the connection between the heat conducting rod and the water tank is sealed; a ventilation groove is opened on the back of the water tank, and the piston plate is always located above the ventilation groove; A water supply pipe connected to the water tank is installed on the front of the water tank, and the water supply pipe is located above the ventilation tank; A control panel is installed on the front of the test body.
[0011] Compared with the prior art, the advantages of the present invention are: (1) This solution then uses an external motor to drive the plate conveyor to move intermittently, so that it drives the chip to move to the bottom of the test plate, thereby improving the test loading efficiency. During the downward movement of the electric push rod, the test plate will drive the connecting plate to move downward, so that the piston rod will follow the movement, thereby squeezing the gas inside the folded tube. The gas inside the folded tube will then be discharged along the two air holes. During the discharge process, the gas will push the chip inside the test tank, and because the two groups of air holes are of different sizes, the inner diameter of the back air holes is larger than the inner diameter of the front air holes, so the gas discharge volume of the back air holes is greater than that of the front air holes. Then the chip will move toward the front during the blowing process, and then be introduced into the material guide slope for unloading and discharge. Users can also set corresponding protective cloth and soft pads on the material guide slope according to the chip situation.
[0012] (2) In this scheme, when the electric push rod moves downward, the heat release plate will move downward, thereby causing the connecting rod to drive the piston plate to move downward. At this time, there is a negative pressure between the piston plate and the top wall of the water tank. At this time, the external gas will be introduced into the water tank along the air inlet pipe and the one-way valve installed on its outside. Since the installation positions of the two one-way valves are opposite, the one-way valve on the exhaust pipe cannot introduce gas during the vacuum operation. Then, when the electric push rod is reset, the piston plate will follow suit and reset, thereby leading the gas inside the water tank out along the exhaust pipe. Since the installation positions of the two one-way valves are opposite, the one-way valve on the air inlet pipe cannot exhaust the gas. The gas then is ejected outward by the nozzle, that is, the top of the chip on the left side of the test chip is blown to remove dust, reducing the accumulation of dust on the outside of the chip and ensuring the test effect.
[0013] (3) This solution uses a heat-absorbing block to absorb the heat on the detection plate and the probe, and then conducts the heat along the heat-conducting rod to the heat-releasing plate. The water source inside the water tank is used to dissipate heat from the heat-releasing plate, thereby reducing the operating temperature of the detection plate and the probe, thereby ensuring the test effect and service life of the probe. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 It is a side cross-sectional schematic diagram of the water tank and piston plate structure of the present invention; Figure 3 It is a top exploded schematic diagram of the exhaust box and probe structure of the present invention; Figure 4 It is a side cross-sectional schematic diagram of the folded tube and plate conveyor belt structure of the present invention; Figure 5 The structure of the present invention Figure 1 A magnified schematic diagram of the middle part A; Figure 6 This is a schematic diagram of the explosion of the detection plate and heat absorption block structure of the present invention; Figure 7 It is a bottom view schematic diagram of the plate conveyor belt and the air hole structure of the present invention.
[0015] Description of the numbers in the figure: 1. Bottom plate; 2. Top plate; 3. Electric push rod; 4. Detection plate; 5. Probe; 6. Test body; 7. Unloading assembly; 71. Connecting plate; 72. Piston rod; 73. Folding tube; 8. Heat conduction assembly; 81. Heat absorption block; 82. Heat conduction rod; 83. Heat release plate; 9. Dust removal assembly; 91. Piston plate; 92. Inlet pipe; 93. Exhaust pipe; 94. Nozzle; 95. One-way valve; 10. Detection tank; 11. Water tank; 12. Plate conveyor; 13. Connecting rod; 14. Air hole; 15. Material guide slope; 16. Hose; 17. Exhaust box; 18. Refrigerator; 19. Ventilation tank. DETAILED DESCRIPTION
[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings in the embodiments of the present invention; Example 1 See also Figure 1-7 A semiconductor chip terminal testing system includes a base plate 1 and a plate conveyor 12. The plate conveyor 12 is installed on the base plate 1. A group of detection slots 10 for placing chips are opened inside the plate conveyor 12. A top plate 2 is installed on the top of the base plate 1. An electric push rod 3 is installed on the top plate 2. The bottom end of the electric push rod 3 is fixedly connected to the detection board 4. A group of probes 5 are installed on the detection board 4. A test body 6 is installed on the top of the top plate 2. The test body 6 is connected to the detection board 4 through two wires. A heat conduction component 8 is provided on the outside of the detection board 4. A water tank 11 is installed on the top of the top plate 2. A dust removal component 9 is installed on the water tank 11. A blanking component 7 is provided on the outside of the detection board 4.
[0017] In the present invention, the test slot 10 on the plate conveyor 12 is used to place the chip, and then an external motor is used to drive the plate conveyor 12 to move intermittently, so that it drives the chip to move to the bottom of the test plate 4, thereby improving the test loading efficiency. When the chip moves to the test area, the electric push rod 3 on the top plate 2 is started to drive the test plate 4 and the probe 5 downward so that the probe 5 contacts the chip. The chip is tested and analyzed with the test body 6. If the chip has no quality problems, the subsequent process can be carried out normally. If the chip has quality problems, the staff can pick it up. The setting of the heat conduction component 8 can conduct the heat on the probe 5 during the test into the interior of the water tank 11 for heat dissipation treatment, thereby ensuring its detection effect and service life. After the test is completed, the electric push rod 3 will reset. During the reset process, the plate conveyor 12 is started again, and the electric push rod 3 will drive the dust removal component 9 to discharge the gas inside the water tank 11 to blow and remove dust from the chip to be tested. At the same time, when the electric push rod 3 moves downward for testing, the unloading component 7 will be driven to unload the tested chip.
[0018] Example 2 Based on the above embodiments, please refer to Figure 1-6 The heat-conducting assembly 8 includes a heat-absorbing block 81, a heat-conducting rod 82 and a heat-radiating plate 83. The heat-absorbing block 81 is sleeved on the outside of the electric push rod 3, and the bottom of the heat-absorbing block 81 is installed on the outside of the detection plate 4. One end of the heat-conducting rod 82 is fixedly connected to the outside of the heat-absorbing block 81, and the other end of the heat-conducting rod 82 passes through the top plate 2 and the water tank 11 and is slidably connected to the inside of the water tank 11. The outside of the heat-radiating plate 83 is installed on the top of the heat-conducting rod 82; the heat-absorbing block 81 is used to absorb the heat on the detection plate 4 and the probe 5, and then the heat is introduced into the heat-radiating plate 83 along the heat-conducting rod 82, and the water source inside the water tank 11 is used to dissipate heat for the heat-radiating plate 83, thereby reducing the operating temperature of the detection plate 4 and the probe 5, thereby ensuring the test effect and service life of the probe 5.
[0019] Among them: the dust removal assembly 9 includes a piston plate 91, an air intake pipe 92, an exhaust pipe 93, a nozzle 94 and two one-way valves 95. The outer side of the piston plate 91 is slidably connected to the interior of the water tank 11. The outer side of the piston plate 91 is fixedly connected to two connecting rods 13. One end of the connecting rod 13 is fixedly connected to the outer side of the heat release plate 83. One end of the air intake pipe 92 and the exhaust pipe 93 both pass through and are fixedly connected to the interior of the water tank 11. The two one-way valves 95 are respectively installed to the outer sides of the air intake pipe 92 and the exhaust pipe 93. The installation directions of the two one-way valves 95 are opposite. The other end of the exhaust pipe 93 passes through and is fixedly connected to the interior of the nozzle 94. The bottom of the nozzle 94 is installed to the top of the base plate 1.
[0020] When the electric push rod 3 moves downward, the heat release plate 83 will move downward, thereby causing the connecting rod 13 to drive the piston plate 91 to move downward. At this time, there is a negative pressure between the piston plate 91 and the top wall of the water tank 11. At this time, the external gas will be introduced into the water tank 11 along the air inlet pipe 92 and the one-way valve 95 installed on its outside. Since the installation positions of the two one-way valves 95 are opposite, the one-way valve 95 on the exhaust pipe 93 cannot introduce gas during the air extraction operation. Then, when the electric push rod 3 is reset, the piston plate 91 will follow and reset, thereby leading the internal gas of the water tank 11 along the exhaust pipe 93. Since the installation positions of the two one-way valves 95 are opposite, the one-way valve 95 on the air inlet pipe 92 cannot discharge the gas at this time. The gas then is ejected outward by the nozzle 94, that is, the top of the chip on the left side of the test chip is blown and dusted, reducing the accumulation of dust on the outside of the chip and ensuring the test effect.
[0021] See also Figure 1-4 , wherein: the blanking assembly 7 includes a connecting plate 71, a piston rod 72 and a folded tube 73, one side of the connecting plate 71 is fixedly connected to the outer side of the detection plate 4, the other side of the connecting plate 71 is fixedly connected to the top of the piston rod 72, the bottom end of the piston rod 72 passes through and is slidably connected to the inside of the folded tube 73, one end of the folded tube 73 passes through and extends to the inside of the bottom plate 1, two groups of air holes 14 of different sizes are opened inside the plate conveyor 12, the inner diameter of the air holes 14 on the back is larger than the inner diameter of the air holes 14 on the front, one end of the folded tube 73 is connected to the detection groove 10 through the air holes 14, and a material guide slope 15 is provided on the bottom plate 1.
[0022] During the downward movement of the electric push rod 3, the detection plate 4 will drive the connecting plate 71 to move downward, so that the piston rod 72 will follow the movement, thereby squeezing the gas inside the folded tube 73, and then the gas inside the folded tube 73 will be discharged along the two air holes 14. During the discharge process, the gas will push the chip inside the detection slot 10, and because the two groups of air holes 14 are of different sizes, the inner diameter of the back air holes 14 is larger than the inner diameter of the front air holes 14, so the gas discharge volume of the back air holes 14 is greater than that of the front air holes 14. Then the chip will move toward the front during the blowing process, and then be introduced into the material guide slope 15 for unloading and discharge. Users can also set corresponding protective cloth and soft pads on the material guide slope 15 according to the chip situation.
[0023] See also Figure 1-3 , wherein: the middle part of the exhaust pipe 93 is fixedly connected to a hose 16 communicating therewith, one end of the hose 16 passes through and is fixedly connected to an exhaust box 17, the exhaust box 17 is sleeved to the outside of the probe 5, and one side of the exhaust box 17 is fixedly connected to the bottom of the detection board 4.
[0024] When the gas is discharged along the exhaust pipe 93, part of the gas is introduced into the exhaust box 17 through the hose 16, and the gas is used to blow the outside of the probe 5, which can reduce the temperature of the probe 5 and reduce the occurrence of dust adhesion on the outside, thereby ensuring the use effect of the probe 5.
[0025] See also Figure 1 , wherein: a refrigerator 18 is installed on the water tank 11, and the connection between the heat conducting rod 82 and the water tank 11 is sealed.
[0026] In the present invention, the user can choose whether to turn on the refrigerator 18 according to the chip test quantity and the external temperature. The refrigerator 18 is used to reduce the temperature of the water source inside the water tank 11 to increase the heat dissipation effect. During each up and down movement of the heat release plate 83, it can also adjust the water source temperature so that the water source that absorbs heat inside the water tank 11 and the water source after cooling by the refrigerator 18 are quickly mixed to ensure uniformity and heat treatment effect. Since the connection between the heat conducting rod 82 and the water tank 11 is sealed, the occurrence of water leakage can be reduced.
[0027] See also Figure 1-2 , wherein: a ventilation groove 19 is opened on the back of the water tank 11, and the piston plate 91 is always located above the ventilation groove 19.
[0028] In the present invention, the ventilation groove 19 is provided so that the gas between the piston plate 91 and the bottom wall of the water tank 11 can flow normally along the ventilation groove 19 during the up and down movement of the piston plate 91, thereby ensuring the smoothness of the entire movement.
[0029] See also Figure 1 , wherein: a water supply pipe connected to the water tank 11 is installed on the front side, and the water supply pipe is located above the ventilation groove 19.
[0030] A control panel is installed on the front of the test body 6.
[0031] In the present invention, the user can use the control panel to control the electrical components inside the entire device, and later use the water supply pipe to replenish the water source inside the water tank 11.
[0032] It should be noted that the circuit connection relationships of the devices in this application all belong to simple series and parallel connection circuits. There is no innovation in the circuit connection. Those skilled in the art can implement it relatively easily. It belongs to the existing technology and will not be elaborated on.
[0033] Specifically, the test slot 10 on the plate conveyor 12 is used to place the chip, and then an external motor is used to drive the plate conveyor 12 to move intermittently, so that it drives the chip to move to the bottom of the test plate 4. When the chip moves to the test area, the electric push rod 3 on the top plate 2 is started to drive the test plate 4 and the probe 5 to move downward, so that the probe 5 contacts the chip, and the test body 6 is used to test and analyze the chip. If the chip has no quality problems, the subsequent process can be carried out normally. If the chip has quality problems, the staff can pick it up and use the heat absorption block 81 to absorb the heat on the test plate 4 and the probe 5. Then the heat is introduced into the heat release plate 83 along the heat conducting rod 82. The heat dissipation plate 83 is treated by the water source inside the water tank 11, thereby reducing the operating temperature of the detection plate 4 and the probe 5, so as to ensure the test effect and service life of the probe 5. When the electric push rod 3 moves downward, the heat dissipation plate 83 will move downward, so that the connecting rod 13 drives the piston plate 91 to move downward. At this time, there is a negative pressure between the piston plate 91 and the top wall of the water tank 11. At this time, the external air will be introduced into the water tank 11 along the air inlet pipe 92 and the one-way valve 95 installed on its outside. Since the installation positions of the two one-way valves 95 are opposite, the one-way valve 95 on the exhaust pipe 93 cannot introduce gas during the air extraction operation. Then, after the test is completed, the electric push rod 3 will reset; Similarly, the piston plate 91 will be reset accordingly, thereby leading the gas inside the water tank 11 out along the exhaust pipe 93. Since the installation positions of the two one-way valves 95 are opposite, similarly, the one-way valve 95 on the air inlet pipe 92 cannot discharge the gas at this time, and the gas then guided out is sprayed outward by the nozzle 94, that is, the top of the chip on the left side of the test chip is blown to remove dust, and when the gas is discharged along the exhaust pipe 93, part of the gas is introduced into the exhaust box 17 through the hose 16, and the gas is used to blow the outside of the probe 5, which can reduce the temperature of the probe 5 and reduce the occurrence of dust adhesion on the outside, thereby ensuring the use effect of the probe 5. At the same time, when the electric push rod 3 moves downward to perform the test operation, the detection plate 4 will drive the connecting plate 71 to move downward, so that the piston rod 72 follows the movement, thereby squeezing the gas inside the folded tube 73, and then the gas inside the folded tube 73 will be blown out along the The two air holes 14 are used for discharge. During the discharge process, the gas will push the chip inside the detection groove 10. Since the two groups of air holes 14 are of different sizes, the inner diameter of the back air holes 14 is larger than the inner diameter of the front air holes 14. Therefore, the gas discharge volume of the back air holes 14 is larger than that of the front air holes 14. Then the chip will move toward the front during the blowing process, and then be introduced into the guide slope 15 for discharge. The user can also set corresponding protective cloth and soft pad on the guide slope 15 according to the chip situation. The entire device uses a plate conveyor 12 and a detection groove 10 to transport the chips, which is more suitable for large-scale testing of chips. During the test process, the dust removal and discharge processing of the batch of chips can be completed simultaneously. At the same time, the probe 5 can also be subjected to real-time heat dissipation processing to ensure its test effect, simplify multiple processes, have high integration, reduce test costs and improve test efficiency.
[0034] The above description is merely a preferred embodiment of the present invention; however, the scope of protection of the present invention is not limited thereto. Any person skilled in the art who, within the technical scope disclosed by the present invention, makes equivalent substitutions or modifications based on the technical solutions and improved concepts of the present invention shall be covered by the scope of protection of the present invention.
Claims
1. A semiconductor chip terminal testing system, comprising a base plate (1) and a plate conveyor (12), wherein the plate conveyor (12) is mounted on the base plate (1), and a group of test slots (10) for placing chips are provided inside the plate conveyor (12), characterized in that: A top plate (2) is installed on the top of the bottom plate (1), an electric push rod (3) is installed on the top plate (2), a detection plate (4) is fixedly connected to the bottom end of the electric push rod (3), a group of probes (5) are installed on the detection plate (4), a test body (6) is installed on the top of the top plate (2), the test body (6) is connected to the detection plate (4) through two wires, a heat conduction component (8) is provided on the outside of the detection plate (4), a water tank (11) is installed on the top of the top plate (2), a dust removal component (9) is installed on the water tank (11), a blanking component (7) is provided on the outside of the detection plate (4), and a control panel is installed on the front of the test body (6).
2. A semiconductor chip terminal testing system according to claim 1, characterized in that: The heat-conducting assembly (8) includes a heat-absorbing block (81), a heat-conducting rod (82) and a heat-releasing plate (83). The heat-absorbing block (81) is sleeved on the outside of the electric push rod (3). The bottom of the heat-absorbing block (81) is installed on the outside of the detection plate (4). One end of the heat-conducting rod (82) is fixedly connected to the outside of the heat-absorbing block (81). The other end of the heat-conducting rod (82) passes through the top plate (2) and the water tank (11) and is slidably connected to the inside of the water tank (11). The outside of the heat-releasing plate (83) is installed on the top of the heat-conducting rod (82).
3. A semiconductor chip terminal testing system according to claim 2, characterized in that: The dust removal assembly (9) comprises a piston plate (91), an air intake pipe (92), an exhaust pipe (93), a nozzle (94) and two one-way valves (95). The outer side of the piston plate (91) is slidably connected to the inside of the water tank (11). The outer side of the piston plate (91) is fixedly connected to two connecting rods (13). One end of the connecting rod (13) is fixedly connected to the outside of the heat release plate (83). One end of each of the air intake pipe (92) and the exhaust pipe (93) passes through and is fixedly connected to the inside of the water tank (11). The two one-way valves (95) are respectively installed on the outer sides of the air intake pipe (92) and the exhaust pipe (93). The installation directions of the two one-way valves (95) are opposite. The other end of the exhaust pipe (93) passes through and is fixedly connected to the inside of the nozzle (94). The bottom of the nozzle (94) is installed to the top of the base plate (1).
4. The semiconductor chip terminal testing system according to claim 1, wherein: The blanking assembly (7) includes a connecting plate (71), a piston rod (72) and a folded tube (73), one side of the connecting plate (71) is fixedly connected to the outer side of the detection plate (4), the other side of the connecting plate (71) is fixedly connected to the top of the piston rod (72), the bottom end of the piston rod (72) passes through and is slidably connected to the inside of the folded tube (73), one end of the folded tube (73) passes through and extends to the inside of the bottom plate (1), two groups of air holes (14) of different sizes are opened inside the plate conveyor (12), the inner diameter of the air hole (14) on the back is larger than the inner diameter of the air hole (14) on the front, one end of the folded tube (73) is connected to the detection groove (10) through the air hole (14), and a material guide slope (15) is provided on the bottom plate (1).
5. The semiconductor chip terminal testing system according to claim 3, wherein: A hose (16) is fixedly connected to the middle of the exhaust pipe (93), one end of the hose (16) passes through and is fixedly connected to an exhaust box (17), the exhaust box (17) is sleeved on the outside of the probe (5), and one side of the exhaust box (17) is fixedly connected to the bottom of the detection plate (4).
6. The semiconductor chip terminal testing system according to claim 2, wherein: A refrigerator (18) is installed on the water tank (11), and a sealing treatment is performed on the connection between the heat conducting rod (82) and the water tank (11).
7. The semiconductor chip terminal testing system according to claim 3, characterized in that: A ventilation groove (19) is provided on the back of the water tank (11), and the piston plate (91) is always located above the ventilation groove (19).
8. The semiconductor chip terminal testing system according to claim 7, characterized in that: A water supply pipe communicating with the water tank (11) is installed on the front side of the water tank (11), and the water supply pipe is located above the ventilation groove (19).