Simulation welding spot generation method and device, computer equipment and storage medium

Abstract

The invention relates to a simulation welding spot generation method and device, computer equipment and a storage medium. The method comprises the steps that welding spot components in a target model and connecting pieces corresponding to the welding spot components are obtained; according to the geometric information of the welding spot component, the center line of the welding spot component is determined; determining a search cylinder corresponding to the welding spot component according to the center line and the cylinder parameters; based on the search cylinder, determining a via hole of which the central point is located in the search cylinder on the connecting piece as a target via hole; and performing simulation welding on the target via hole according to the welding spot information to generate a target welding spot, and by adopting the method provided by the invention, the problem of low welding spot generation efficiency in the prior art can be improved.

Description

Technical Field

[0001] The present application relates to the field of simulation design technology, and in particular to a method, device, computer equipment and storage medium for generating simulated solder joints. Background Art

[0002] During the vehicle development process, it is necessary to establish a simulation model for simulation analysis. The creation of the simulation model is usually completed based on CAD (Computer Aided Drafting) software. The simulation analysis of the simulation model can also be completed based on CAE (Computer Aided Engineering) software. Before the simulation analysis, the CAD data corresponding to the simulation model needs to be converted into CAE data. CAE pre-processing software is also used to complete some pre-processing work, such as filling vias and generating solder joints for solder joint components in the CAD data. However, there are many vias on the parts, making it difficult to quickly identify the vias corresponding to the solder joint components and quickly generate solder joints. Summary of the Invention

[0003] Based on this, a method, device, computer equipment and storage medium for generating simulated solder joints are provided to improve the problem of low solder joint generation efficiency in the prior art.

[0004] In one aspect, a method for generating a simulated solder joint is provided, the method comprising:

[0005] Obtaining a solder joint component and a connector corresponding to the solder joint component in a target model;

[0006] Determining a center line of the solder joint component according to geometric information of the solder joint component;

[0007] Determining a search cylinder corresponding to the solder joint component according to the center line and cylinder parameters;

[0008] Based on the search cylinder, determining a via hole on the connector whose center point is located on the search cylinder as a target via hole;

[0009] Simulate welding of the target via hole according to the soldering point information to generate a target soldering point.

[0010] In one embodiment, determining the center line of the solder joint component according to the geometric information of the solder joint component includes:

[0011] Obtaining an axial cross-section of the solder joint component;

[0012] Based on the contour line of the axial cross section, a symmetric midline of the contour line is determined as a center line of the welding point component.

[0013] In one embodiment, the solder joint component is a simulated screw, and determining the symmetric midline of the contour line as the center line of the solder joint component includes:

[0014] Based on the contour lines of the shaft cross section, determining line segments from all contour lines;

[0015] According to the length of the line segments, two of the longest line segments are determined from the plurality of line segments as target line segments, wherein the target line segments are parallel rod contour lines in the simulated screw;

[0016] The symmetrical midline between the two target line segments is determined as the center line of the solder joint component.

[0017] In one embodiment, determining line segments from all contour lines comprises:

[0018] Get the length of each contour line and the endpoint distance between the two endpoints of each contour line;

[0019] Based on a comparison between the line length and the endpoint distance, a contour line having the same line length as the endpoint distance is determined to be the line segment.

[0020] In one embodiment, determining the search cylinder corresponding to the solder joint component includes:

[0021] Obtaining the midpoints corresponding to the two target line segments, and determining the intersection of the line connecting the midpoints and the center line as the center of the search cylinder;

[0022] The search cylinder is constructed along the center line according to the center of the search cylinder, the diameter of the search cylinder and the height of the search cylinder, wherein the diameter of the search cylinder is the maximum diameter of the via hole and the height of the search cylinder is determined according to the length of the solder joint component.

[0023] In one embodiment, obtaining the solder joint components and the connectors corresponding to the solder joint components in the target model includes:

[0024] Acquire a model structure tree of a target model, wherein the model structure tree indicates a hierarchical relationship between the solder joint components and the connectors;

[0025] The soldering point component and the connecting piece corresponding to the soldering point component are determined according to the node name in the hierarchical relationship of the model structure tree.

[0026] In one embodiment, generating a target solder joint includes:

[0027] Creating a blank weld nugget according to the center of gravity position of the weld point component;

[0028] The blank weld core is set according to the weld information to obtain the target weld, wherein the weld information includes one or more of weld core connection information, weld diameter of the target via, weld material, weld name, weld connection mode and weld connection type.

[0029] In another embodiment, a device for generating a simulated solder joint is provided, the device comprising:

[0030] An acquisition module, configured to acquire solder joint components and connectors corresponding to the solder joint components in a target model;

[0031] A configuration module, configured to determine a center line of the solder joint component based on geometric information of the solder joint component; and determine a search cylinder corresponding to the solder joint component based on the center line and cylinder parameters;

[0032] A search module, configured to determine, based on the search cylinder, a via hole on the connector whose center point is located on the search cylinder as a target via hole;

[0033] The execution module is used to simulate welding on the target via hole according to the welding point information to generate a target welding point.

[0034] On the other hand, a computer device is provided, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the method according to any one of claims 1 to 7 when executing the computer program.

[0035] A computer-readable storage medium is also provided, on which a computer program is stored. When the computer program is executed by a processor, the method described above is implemented.

[0036] The above-mentioned method, device, computer equipment and storage medium for generating simulated solder joints determine the center line of the solder joint component through the geometric information of the solder joint component, and construct a search cylinder corresponding to the solder joint component based on the center line. The search cylinder is used to search and identify vias whose center points are within the coverage range of the search cylinder, so as to quickly find the target vias corresponding to the solder joint component, thereby improving the efficiency of solder joint generation. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 This is a schematic diagram of the conversion between FDS CAD data and FDS CAE data;

[0038] Figure 2 1 is a flow chart of a method for generating a simulated solder joint in one embodiment;

[0039] Figure 3 is a schematic diagram of a model structure tree in one embodiment;

[0040] Figure 4 A schematic diagram of an embodiment in which the solder joint component is a simulated screw;

[0041] Figure 5 is a schematic diagram of via filling in one embodiment;

[0042] Figure 6 A schematic diagram of a generation process of a simulated solder joint in another embodiment;

[0043] Figure 7 is a structural block diagram of a device for generating simulated solder joints in one embodiment;

[0044] Figure 8 FIG. 1 is a diagram showing the internal structure of a computer device in one embodiment. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solutions and advantages of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0046] In automotive CAE simulation analysis, weld simulation analysis plays an extremely important role, because welds are one of the most common connection methods in the body structure, which directly affects the safety, durability, lightweight design and NVH (Noise, Vibration, Harshness) performance of the entire vehicle.

[0047] When converting CAD data into CAE model, it is necessary to use pre-processing software to process the solder joint components in the CAD data, such as identifying the vias where the solder joint components are located, filling the vias, and maintaining the solder joint information. For example, the solder joint components are FDS components, such as Figure 1 As shown, FDS CAD data needs to be converted into FDS CAE data. In related technologies, this process is done manually, which is inefficient.

[0048] The present application provides a method for generating simulated solder joints, which can realize automatic identification of solder joint components, automatic filling of vias, and automatic maintenance of solder joint related information by developing automated scripts, thereby realizing automated generation and significantly shortening the solder joint generation time.

[0049] In one embodiment, the method for generating a simulated solder joint is as follows: Figure 2 As shown, the following steps are included:

[0050] Step 110: Obtain the solder joint components and the connectors corresponding to the solder joint components in the target model.

[0051] The target model is, for example, a simulation model constructed based on CAD, including solder joint components and various components to be connected. In this embodiment, the target model is imported using the pre-processing software ANSA, and the pre-processing process is completed based on ANSA.

[0052] In the ANSA pre-processing software, the target model is shown as follows: Figure 3 The model structure tree shown in the figure indicates the hierarchical relationship between each connector and solder joint component. For example, in the target model "DSYS001639-RN01", the node name starts with FDS, which identifies the component as FDS, that is, the solder joint component to be processed. The node with the node name "WDSYS001639-RL01" is its parent group, and the node with the node name "DSYS001639-RN01" is its grandparent group. "DSSY002160-RN01" and "DSSY002161-RN01" under the grandparent group are the corresponding connectors.

[0053] In some achievable manners, the node names of the nodes in the target model are formulated according to specific naming rules, and the automated script can determine the solder joint components and the connectors corresponding to the solder joint components through the names of the nodes.

[0054] In the target model, the solder joint component corresponds to the target via setting.

[0055] Step 120 : determining the center line of the solder joint component based on the geometric information of the solder joint component.

[0056] In the actual implementation process, based on the 3D solid model of the solder joint component, its geometric information is analyzed, such as the length, width, radius, end face center coordinates, main vector components of the axial extension direction of the solder joint, center of gravity position, etc., and the center line of the solder joint component is obtained by fusion of multiple data. Generally, the solder joint component is an axisymmetric structure, typically Figure 4 As shown, the solder joint component is in the form of an ideal simulated screw (without threads), including a head and a rod, and the center line is the axis of the simulated screw rod.

[0057] Step 130: Determine the search cylinder corresponding to the solder joint component based on the center line and the cylinder parameters.

[0058] For example, along the center line of the solder joint component, a cylindrical search space with the same length as the solder joint component and the same diameter as the via hole is constructed as the search cylinder. Generally, the constructed search cylinder is required to cover the main structure of the solder joint component. Therefore, the cylinder parameters (including length, diameter, etc.) can be determined based on the geometric parameters of the solder joint component, that is, the corresponding via hole.

[0059] Step 140 : Based on the search cylinder, determine that the via hole on the connector whose center point is located on the search cylinder is the target via hole.

[0060] The same solder joint component corresponds to multiple connectors, and there may be several vias on each connector. It is necessary to identify the vias corresponding to the solder joint component. In some feasible implementations, the automated script accesses the geometric or mesh data in ANSA, calculates the center point coordinates based on the coordinates of the surrounding mesh data, and identifies the center points of each via.

[0061] By comparing whether the coordinates of the center point are covered by the search cylinder, it is determined whether it is the target via corresponding to the solder joint component.

[0062] Step 150 , performing simulated welding on the target via hole according to the solder point information to generate a target solder point.

[0063] In the actual simulation welding process, all target vias corresponding to the solder joint components need to be filled with vias, such as Figure 5 As shown. A weld core is generated at the original target via hole location, and the weld point information is set to generate the target weld point.

[0064] In the above embodiment, steps 110 to 150 are implemented based on an automated script, automatically completing data acquisition and processing. The constructed search cylinder identifies the target vias corresponding to the solder joint components, quickly identifying the vias requiring simulated soldering. In complex simulation models, the correspondence between holes and components can be accurately matched, avoiding confusion and improving recognition efficiency, thereby improving the efficiency of solder joint generation. Furthermore, the script automatically traverses all solder joint components and generates corresponding search cylinders, eliminating the need for manual inspection of each component, significantly improving processing efficiency.

[0065] The above process is further explained below:

[0066] Regarding step 120 , in a feasible implementation, an axial cross section of the solder joint component is obtained; based on a contour line of the axial cross section, a symmetric midline of the contour line is determined as the center line of the solder joint component.

[0067] The automated script can extract the contour line of the axial section by cutting the plane of the weld component along the axial direction, identify the contour line vertex or edge point set, and extend the symmetry center line along the axial direction to form the center line of the weld.

[0068] In actual implementation, if the solder joint component is a simulated screw, the center line can be determined in the following way:

[0069] Based on the contour line of the shaft section, a line segment is determined from all the contour lines; according to the length of the line segment, the two longest line segments are determined from multiple line segments as target line segments; the symmetrical midline between the two target line segments is determined as the center line of the weld component.

[0070] For example, in the simulated screw, the center line is in the same direction as the rod, and based on the length of the rod, a typical line segment corresponding to the rod in the shaft section is identified as the target line segment, such as Figure 4 Con1 and con2 are target line segments, and con1 and con2 are parallel rod contour lines in the simulated screw. The symmetric midline of the two target line segments con1 and con2 is further identified, and the symmetric midline can be used as the center line of the solder joint component.

[0071] Moreover, generally, the line segment corresponding to the rod portion is the longest line segment among all line segments. Therefore, all line segments are sorted according to their lengths and the two longest ones are selected.

[0072] Contour lines may also contain line types such as arcs. The following also describes how the automated script identifies line segments in contour lines:

[0073] The line length of each contour line and the endpoint distance corresponding to the two endpoints of each contour line are obtained; based on the comparison between the line length and the endpoint distance, the contour line with the same line length and endpoint distance is determined to be a line segment.

[0074] By comparing the lengths, line segments in the contour line can be quickly identified. In some feasible methods, a certain tolerance can be set (for example, a deviation of 0.01 times the line length). When the deviation between the line length of the contour line and the endpoint distance is not greater than the tolerance, the contour line is still considered to be a line segment, thereby avoiding deviations caused by software measurement accuracy, coordinate conversion, etc.

[0075] Regarding step 130, how to determine the search cylinder corresponding to the solder joint component exemplarily includes the following steps:

[0076] Get the midpoints of the two target line segments con1 and con2, and determine the intersection of the line connecting the midpoints and the center line as the center of the search cylinder. Construct a search cylinder along the center line based on the center, diameter, and height of the search cylinder. The diameter of the search cylinder is the maximum diameter of the via, and the height of the search cylinder is determined by the length of the solder joint component.

[0077] For example, for Figure 4For the solder joint component shown, the height of the search cylinder is calculated as (D1 + L1) * 1.1, where D1 is the length of the target line segment, and L1 is the minimum distance between the endpoint of the target line segment and the simulated screw head. A tolerance of 0.1 is set, so the value is multiplied by 1.1. In other possible implementations, the height of the search cylinder can be the entire length of the solder joint component or the length of a major portion, as required.

[0078] The diameter of the search cylinder is set according to the maximum diameter of the via. Generally, in a vehicle simulation model, the maximum diameter of the via is 11 mm.

[0079] With the intersection of the midpoint line and the center line as the center, (D1+L1)*1.1 as the height and 11mm as the diameter, a search cylinder is constructed along the center line to cover the vias corresponding to the solder joint components.

[0080] For step 150, it includes creating a blank weld core according to the center of gravity position of the weld component; setting the blank weld core according to the weld information to obtain the target weld, and the weld information includes one or more of the weld core connection information, the weld diameter of the target via, the weld material, the weld name, the weld connection method and the weld connection type.

[0081] In ANSA, weld information can usually be set in the connection manager. The weld core connection information includes the various components of the model connected by the weld. The weld diameter is usually set to 6mm. The weld material is assigned through the weld material ID (Identity document) in the modeling specification. The weld name is assigned according to the modeling specification. The weld connection type is set according to the solver and modeling specification requirements. The CAE weld connection mode is set according to the modeling specification (one of the three types: common node, contact, and RBE3).

[0082] like Figure 6 FIG. 1 illustrates a process of implementing solder joint generation using an automated script in one embodiment.

[0083] S1. Model structure tree maintenance:

[0084] a. Get the solder joint component. Read the model structure tree and identify the component as a solder joint component by the word FDS at the beginning of the component name. To avoid missed recognition or misrecognition due to mixed case and the word FDS in the middle of the component, the regular expression (^FDS.*?) is used to obtain the parent group name (^W.*?) of the component to complete the solder joint component identification.

[0085] b. Get the corresponding connectors of the solder point components. Based on the solder point components, reverse engineer the grandparent group (DSYS001639-RN01) and traverse all components in this group whose names are not (^W.*?) to find the corresponding connectors of the solder point components.

[0086] c. Display the obtained solder joint components and corresponding connectors separately.

[0087] S2. Weld core generation and via identification and filling:

[0088] a. Create a blank weld nugget (white-connection) based on the center of gravity of the weld component obtained in step S1 (this weld nugget does not contain connection information);

[0089] b. Construct a search cylinder C1. Obtain all the contour lines con of the central axis section of the solder joint component. Use the ANSA pre-simulation software to read the length of the contour line con and calculate the distance between the two end points of the line segment. Determine whether it is a straight line by judging whether they are equal. Discard all non-straight contour lines and sort the remaining line segments by length. Take the longest two con1 and con2. Use the symmetric midline of con1 and con2 as the center line of the cylinder, (D1+L1)*1.1 as the height of the cylinder, and design the maximum diameter of the via hole to be 11mm as the diameter of the cylinder to construct a search cylinder C1.

[0090] c. Import the mesh generated by the connector and update the structure tree according to the component name, keeping the model structure tree unchanged.

[0091] d. Identify and fill vias. Use software such as ANSA to identify all vias on the connector. Determine if the hole is the target via for the solder joint component by checking whether its center point is within search cylinder C1. Fill all holes that are target vias.

[0092] S3. Solder point generation:

[0093] a. Use the height of the search cylinder as the diameter and all mesh components displayed on the interface as search targets to search for blank weld core connection information and complete the filling of weld core connection information;

[0094] b. Set the diameter of the solder joint to 6mm;

[0095] c. Create a solder joint property keyword. Assign the solder joint material using the solder joint material ID in the modeling specification. Set the property name to the name of the solder joint component and assign the ID according to the modeling specification.

[0096] d. Set the weld connection type according to the solver and modeling specifications, and complete the CAE weld connection method settings according to the modeling specifications;

[0097] e. Complete CAE weld point type settings according to modeling specifications;

[0098] f. Call the relevant function to complete the automatic generation of solder joints, and maintain the generated solder joints in the corresponding solder joint components in step S1.

[0099] It should be understood that although Figure 2 、 Figure 6 The steps in the flowchart are shown in sequence as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this document, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. In addition, Figure 2 、 Figure 6 At least part of the steps may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least part of the sub-steps or stages of other steps.

[0100] In one embodiment, Figure 7 As shown, a device for generating a simulated solder joint is provided, comprising: an acquisition module 210, a configuration module 220, a search module 230 and an execution module 240, wherein:

[0101] An acquisition module 210 is used to acquire solder joint components and connectors corresponding to the solder joint components in a target model;

[0102] Configuration module 220, for determining the center line of the solder joint component according to the geometric information of the solder joint component; and determining the search cylinder corresponding to the solder joint component according to the center line and the cylinder parameters;

[0103] A search module 230 is configured to determine, based on a search cylinder, a via hole on a connector whose center point is located within the search cylinder as a target via hole;

[0104] The execution module 240 is configured to simulate welding of the target via hole according to the welding point information to generate a target welding point.

[0105] The above-mentioned simulated solder joint generation device determines the center line of the solder joint component through the geometric information of the solder joint component, and constructs a search cylinder corresponding to the solder joint component based on the center line. By searching through the search cylinder, the vias whose center points are within the coverage range of the search cylinder are identified, so that the target vias corresponding to the solder joint component can be quickly found, thereby improving the efficiency of solder joint generation.

[0106] In one embodiment, the configuration module 220 obtains an axial cross section of the solder joint component; based on a contour line of the axial cross section, determines a symmetric midline of the contour line as a center line of the solder joint component.

[0107] In one embodiment, the configuration module 220 determines line segments from all contour lines based on the contour line of the shaft section; determines the two longest line segments from multiple line segments as target line segments based on the length of the line segments, and the target line segments are parallel rod contour lines in the simulated screw; and determines the symmetrical midline between the two target line segments as the center line of the weld component.

[0108] The configuration module 220 obtains the line length of each contour line and the endpoint distance corresponding to the two endpoints of each contour line; based on the comparison between the line length and the endpoint distance, the contour line with the same line length and endpoint distance is determined as a line segment.

[0109] In another embodiment, the configuration module 220 obtains the midpoints corresponding to the two target line segments, and determines the intersection of the midpoint line and the center line as the center of the search cylinder; based on the center of the search cylinder, the diameter of the search cylinder and the height of the search cylinder, a search cylinder is constructed along the center line, wherein the diameter of the search cylinder is the maximum diameter of the via hole, and the height of the search cylinder is determined according to the length of the solder joint component.

[0110] In one embodiment, the acquisition module 210 acquires a model structure tree of the target model, which indicates the hierarchical relationship between solder joint components and connectors; and determines the solder joint components and the connectors corresponding to the solder joint components based on the node names in the hierarchical relationship of the model structure tree.

[0111] In another embodiment, the execution module 240 creates a blank weld core based on the center of gravity position of the weld component; sets the blank weld core based on the weld information to obtain the target weld, and the weld information includes one or more of the weld core connection information, the weld diameter of the target via, the weld material, the weld name, the weld connection method, and the weld connection type.

[0112] The specific definition of the device for generating simulated solder joints can be found in the definition of the method for generating simulated solder joints described above and will not be repeated here. The various modules in the aforementioned device for generating simulated solder joints can be implemented in whole or in part through software, hardware, or a combination thereof. The aforementioned modules can be embedded in or independent of a processor in a computer device in hardware form, or can be stored in a memory in a computer device in software form, so that the processor can call and execute the corresponding operations of the aforementioned modules.

[0113] In one embodiment, a computer device is provided. The computer device may be a terminal, and its internal structure diagram may be as follows: Figure 8As shown. The computer device includes a processor, a memory, a network interface, a display screen and an input device connected via a system bus. The processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The network interface of the computer device is used to communicate with an external terminal via a network connection. When the computer program is executed by the processor, a method for generating a simulated solder joint is implemented. The display screen of the computer device can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer device can be a touch layer covering the display screen, or a button, trackball or touchpad provided on the computer device housing, or an external keyboard, touchpad or mouse.

[0114] Those skilled in the art will understand that Figure 8 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than shown in the figure, or combine certain components, or have a different component arrangement.

[0115] In one embodiment, a computer device is provided, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the following steps are performed:

[0116] Obtain the solder joint components and the connectors corresponding to the solder joint components in the target model;

[0117] Determine the center line of the solder joint component according to the geometric information of the solder joint component;

[0118] Determine the search cylinder corresponding to the weld point component based on the center line and cylinder parameters;

[0119] Based on the search cylinder, the via hole on the connector whose center point is located on the search cylinder is determined as the target via hole;

[0120] Perform simulation welding on the target vias according to the solder joint information to generate the target solder joints.

[0121] In one embodiment, when the processor executes the computer program, the processor further implements the following steps:

[0122] Get the axial cross section of the weld component;

[0123] Based on the contour line of the shaft section, the symmetric midline of the contour line is determined as the center line of the weld component.

[0124] In one embodiment, when the processor executes the computer program, the processor further implements the following steps:

[0125] Based on the contour lines of the shaft section, line segments are determined from all contour lines;

[0126] According to the length of the line segment, the two longest line segments are determined from the multiple line segments as target line segments, and the target line segments are parallel to the rod contour lines in the simulated screw;

[0127] The symmetrical midline between the two target line segments is determined as the center line of the solder joint component.

[0128] In one embodiment, when the processor executes the computer program, the processor further implements the following steps:

[0129] Get the length of each contour line and the endpoint distance between the two endpoints of each contour line;

[0130] Based on the comparison between the line length and the endpoint distance, the contour line with the same line length and endpoint distance is determined to be a line segment.

[0131] In one embodiment, when the processor executes the computer program, the processor further implements the following steps:

[0132] Get the midpoints of the two target line segments, and determine the intersection of the line connecting the midpoints and the center line as the center of the search cylinder;

[0133] A search cylinder is constructed along the center line according to the center, diameter and height of the search cylinder, wherein the diameter of the search cylinder is the maximum diameter of the via hole, and the height of the search cylinder is determined according to the length of the solder joint component.

[0134] In one embodiment, when the processor executes the computer program, the processor further implements the following steps:

[0135] Obtain a model structure tree of the target model, where the model structure tree indicates the hierarchical relationship between the weld components and the connectors;

[0136] Determine the solder joint components and the connectors corresponding to the solder joint components based on the node names in the hierarchical relationship of the model structure tree.

[0137] In one embodiment, when the processor executes the computer program, the processor further implements the following steps:

[0138] Create blank weld nuggets based on the center of gravity of the weld component;

[0139] A blank weld core is set according to the weld information to obtain a target weld. The weld information includes one or more of weld core connection information, weld diameter of a target via hole, weld material, weld name, weld connection mode, and weld connection type.

[0140] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the following steps are implemented:

[0141] Obtain the solder joint components and the connectors corresponding to the solder joint components in the target model;

[0142] Determine the center line of the solder joint component according to the geometric information of the solder joint component;

[0143] Determine the search cylinder corresponding to the weld point component based on the center line and cylinder parameters;

[0144] Based on the search cylinder, the via hole on the connector whose center point is located on the search cylinder is determined as the target via hole;

[0145] Perform simulation welding on the target vias according to the solder joint information to generate the target solder joints.

[0146] In one embodiment, when the computer program is executed by a processor, the following steps are further implemented:

[0147] Get the axial cross section of the weld component;

[0148] Based on the contour line of the shaft section, the symmetric midline of the contour line is determined as the center line of the weld component.

[0149] In one embodiment, when the computer program is executed by a processor, the following steps are further implemented:

[0150] Based on the contour lines of the shaft section, line segments are determined from all contour lines;

[0151] According to the length of the line segment, the two longest line segments are determined from the multiple line segments as target line segments, and the target line segments are parallel to the rod contour lines in the simulated screw;

[0152] The symmetrical midline between the two target line segments is determined as the center line of the solder joint component.

[0153] In one embodiment, when the computer program is executed by a processor, the following steps are further implemented:

[0154] Get the length of each contour line and the endpoint distance between the two endpoints of each contour line;

[0155] Based on the comparison between the line length and the endpoint distance, the contour line with the same line length and endpoint distance is determined to be a line segment.

[0156] In one embodiment, when the computer program is executed by a processor, the following steps are further implemented:

[0157] Get the midpoints of the two target line segments, and determine the intersection of the line connecting the midpoints and the center line as the center of the search cylinder;

[0158] A search cylinder is constructed along the center line according to the center, diameter and height of the search cylinder, wherein the diameter of the search cylinder is the maximum diameter of the via hole, and the height of the search cylinder is determined according to the length of the solder joint component.

[0159] In one embodiment, when the computer program is executed by a processor, the following steps are further implemented:

[0160] Obtain a model structure tree of the target model, where the model structure tree indicates the hierarchical relationship between the weld components and the connectors;

[0161] Determine the solder joint components and the connectors corresponding to the solder joint components based on the node names in the hierarchical relationship of the model structure tree.

[0162] In one embodiment, when the computer program is executed by a processor, the following steps are further implemented:

[0163] Create blank weld nuggets based on the center of gravity of the weld component;

[0164] A blank weld core is set according to the weld information to obtain a target weld. The weld information includes one or more of weld core connection information, weld diameter of a target via hole, weld material, weld name, weld connection mode, and weld connection type.

[0165] Those skilled in the art will appreciate that all or part of the processes in the above-mentioned embodiments can be implemented by instructing the relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0166] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0167] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art could make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A method for generating a simulated solder joint, characterized in that: include: Obtaining a solder joint component and a connector corresponding to the solder joint component in a target model; Determining a center line of the solder joint component according to geometric information of the solder joint component; Determining a search cylinder corresponding to the solder joint component according to the center line and cylinder parameters; Based on the search cylinder, determining a via hole on the connector whose center point is located on the search cylinder as a target via hole; Simulate welding of the target via hole according to the soldering point information to generate a target soldering point.

2. The method for generating a simulated solder joint according to claim 1, wherein: Determining the center line of the solder joint component according to the geometric information of the solder joint component includes: Obtaining an axial cross-section of the solder joint component; Based on the contour line of the axial cross section, a symmetric midline of the contour line is determined as a center line of the welding point component.

3. The method for generating a simulated solder joint according to claim 2, wherein: The soldering point component is a simulated screw, and determining the symmetric midline of the contour line as the center line of the soldering point component includes: Based on the contour lines of the shaft cross section, determining line segments from all contour lines; According to the length of the line segments, two of the longest line segments are determined from the plurality of line segments as target line segments, wherein the target line segments are parallel rod contour lines in the simulated screw; The symmetrical midline between the two target line segments is determined as the center line of the solder joint component.

4. The method for generating a simulated solder joint according to claim 3, wherein: The step of determining line segments from all contour lines comprises: Get the length of each contour line and the endpoint distance between the two endpoints of each contour line; Based on a comparison between the line length and the endpoint distance, a contour line having the same line length as the endpoint distance is determined to be the line segment.

5. The method for generating a simulated solder joint according to claim 3, wherein: The determining of the search cylinder corresponding to the solder joint component includes: Obtaining the midpoints corresponding to the two target line segments, and determining the intersection of the line connecting the midpoints and the center line as the center of the search cylinder; The search cylinder is constructed along the center line according to the center of the search cylinder, the diameter of the search cylinder and the height of the search cylinder, wherein the diameter of the search cylinder is the maximum diameter of the via hole and the height of the search cylinder is determined according to the length of the solder joint component.

6. The method for generating a simulated solder joint according to claim 1, wherein: The step of obtaining the solder joint components and the connectors corresponding to the solder joint components in the target model includes: Acquire a model structure tree of the target model, wherein the model structure tree indicates a hierarchical relationship between the solder joint components and the connectors; The soldering point component and the connecting piece corresponding to the soldering point component are determined according to the node name in the hierarchical relationship of the model structure tree.

7. The method for generating a simulated solder joint according to claim 1, wherein: Generating a target solder joint includes: Creating a blank weld nugget according to the center of gravity position of the weld point component; The blank weld core is set according to the weld information to obtain the target weld, wherein the weld information includes one or more of weld core connection information, weld diameter of the target via, weld material, weld name, weld connection mode and weld connection type.

8. A device for generating simulated solder joints, characterized in that: The device comprises: An acquisition module, configured to acquire solder joint components and connectors corresponding to the solder joint components in a target model; A configuration module, configured to determine a center line of the solder joint component based on geometric information of the solder joint component; and determine a search cylinder corresponding to the solder joint component based on the center line and cylinder parameters; A search module, configured to determine, based on the search cylinder, a via hole on the connector whose center point is located on the search cylinder as a target via hole; The execution module is used to simulate welding on the target via hole according to the welding point information to generate a target welding point.

9. A computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the computer program, the method according to any one of claims 1 to 7 is implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the method according to any one of claims 1 to 7 is implemented.

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