Integrated multilayer inductor

Abstract

The application discloses an integrated multilayer inductor and relates to the technical field of inductors. The integrated multilayer inductor comprises a pin, the top of the pin is provided with a coil, the coil and the pin are fixedly connected with a connecting component, and the outer wall of the pin is fixedly connected with an auxiliary assembly. The integrated multilayer inductor, through the setting of the first auxiliary mechanism in the embodiment, when welding, the first bearing is extruded by the head of a soldering iron, a series of mechanical structure linkages enable the clamping plate to clamp the molten solder wire, this design effectively avoids the problem that the solder wire is randomly scattered after melting, greatly improves the firmness of welding, the clamping action of the clamping plate limits the molten solder wire, enables the solder wire to fill in the connecting position of the pin and the pad, thereby enhancing the stability and reliability of the welding point, and ensuring that the multilayer inductor can be stably connected with a circuit board after installation, and reducing the risk of circuit failure caused by insecure welding.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of inductors, in particular to an integrated multilayer inductor. BACKGROUND

[0002] The integrated multilayer inductor is an advanced electronic component, which is usually composed of alternating stacks of multiple conductive coils and insulating layers, uses a multilayer structure to increase inductance and reduce volume, can achieve high integration, and is based on the principle of electromagnetic induction. When current passes through the coil, a magnetic field is generated and energy is stored, which hinders current changes, has high inductance, low resistance, good high-frequency characteristics and anti-interference ability, can effectively reduce electromagnetic radiation, and is widely used in power management, radio frequency circuits, automotive electronics, industrial control and other fields of electronic products such as mobile phones and computers, and plays an important role in filtering, energy storage, voltage conversion and other aspects.

[0003] Patent application No. CN105575625A discloses a multilayer inductor, which comprises a main body, inner electrodes arranged in the main body and connected to each other by conductive paths, wherein the width of the inner electrodes has two or more different values in the range of 35-55 μm, and the inner electrodes include a first inner electrode and a second inner electrode having a width different from that of the first inner electrode.

[0004] The above patent adjusts the width of the inner electrodes of the multilayer inductor to change the inductance and prevent the loss of magnetic flux, but when the multilayer inductor is installed, the required inductor is usually welded at the required position. Because the liquid after the melting of the welding wire spreads, the welding firmness is reduced. SUMMARY

[0005] In view of the deficiencies of the prior art, the present application provides an integrated multilayer inductor to solve the problems raised in the background art.

[0006] To achieve the above purpose, the present application is realized by the following technical scheme: an integrated multilayer inductor, comprising a pin, a coil is arranged on the top of the pin, a connecting component is fixedly connected between the coil and the pin, and an auxiliary assembly is fixedly connected to the outer wall of the pin.

[0007] Preferably, the auxiliary assembly is a first auxiliary mechanism.

[0008] Preferably, the first auxiliary mechanism comprises a placing hole, the placing hole is arranged on the outer wall of the pin, one end of the first spring is fixedly connected with the outer wall of the pin, the other end of the first spring is fixedly connected with the first bearing, the outer wall of the first bearing is rotatably connected with two first horizontal plates, the other end of the outer wall of the first horizontal plate away from the first bearing is rotatably connected with the second bearing, the outer wall of the second bearing is rotatably connected with the second horizontal plate, the other end of the outer wall of the second horizontal plate away from the second bearing is rotatably connected with the third bearing, and the outer wall of the third bearing is rotatably connected with the clamping plate, the first spring plays a key self-adaptive role in the design of the first embodiment, when the iron head is lifted, the elastic pulling of the first spring lifts the first bearing to reset, and then the second horizontal plate pulls the clamping plate to make the two clamping plates close to each other to clamp the solder wire, this process can not only automatically complete the clamping operation of the solder wire, but also can adapt to different thicknesses of the solder wire and different welding positions and angles due to the elastic property of the spring, even in a complex welding environment, the effective clamping of the solder wire can be ensured, the welding firmness is further improved, and the convenience and efficiency of the welding operation are improved.

[0009] Preferably, the second horizontal plate is inserted into the placing hole.

[0010] Preferably, the auxiliary assembly is a second auxiliary mechanism.

[0011] Preferably, the second auxiliary mechanism comprises a welding hole, the welding hole is arranged on the outer wall of the pin, and the bottom of the pin is provided with a friction groove.

[0012] Preferably, the outer wall of the pin is fixedly connected with a placing rack, the bottom of the placing rack is fixedly connected with a second spring, the bottom of the second spring is fixedly connected with a soldering plate, the bottom of the soldering plate is fixedly connected with a suction disc, both ends of the soldering plate are fixedly connected with fourth bearings, the outer wall of the fourth bearing is rotatably connected with a baffle, and the outer wall of the baffle and the soldering plate are fixedly connected with third springs.

[0013] Preferably, the soldering plate is internally provided with a cavity and a hole at both ends, and the soldering plate is provided with a flux.

[0014] The application provides an integrated multilayer inductor.

[0015] 1. The integrated multilayer inductor, by setting the first auxiliary mechanism in embodiment one, when the soldering iron tip extrudes the first bearing during welding, a series of mechanical structure linkage enables the clamping plate to clamp the melted solder wire, which effectively avoids the problem of random scattering of the melted solder wire, greatly improves the firmness of welding, and the clamping action of the clamping plate limits the melted solder wire, enabling the solder wire to fill the connection between the pin and the pad, thereby enhancing the stability and reliability of the welding point, ensuring that the multilayer inductor can be stably connected to the circuit board after installation, reducing the risk of circuit failure caused by insecure welding.

[0016] 2. The integrated multilayer inductor, the first spring plays a key adaptive role in the design of embodiment one, when the soldering iron tip is lifted, the elasticity of the first spring pulls the first bearing to reset, and then the second cross plate pulls the clamping plate, making the two clamping plates close to each other to clamp the solder wire. This process not only automatically completes the clamping operation of the solder wire, but also adapts to different thicknesses of solder wire and different welding positions and angles due to the elastic properties of the spring. Even in complex welding environments, effective clamping of the solder wire can be ensured, further improving the firmness of welding and improving the convenience and efficiency of welding operations.

[0017] 3. The integrated multilayer inductor, by setting the second auxiliary mechanism in embodiment two, when the pin is attached to the circuit board, the suction cup and the circuit board are extruded to make the flux in the flux plate flow out. The flux can reduce the surface tension between the solder and the welded metal, increasing the flowability of the solder, so that the solder wire can better fill the gap between the pin and the pad after melting, reducing welding defects and significantly improving the firmness of welding. Moreover, under normal conditions, the third spring blocks the flux plate at both ends, preventing the flux from flowing out, ensuring that the flux is released accurately during welding.

[0018] 4. The integrated multilayer inductor, by placing the soldering iron tip and the solder wire into the welding hole during the welding process in embodiment two, the melted solder wire flows between the friction groove and the circuit board, increasing the friction area with the pin. A larger friction area means that the welding point can withstand greater external forces, thereby enhancing the mechanical strength of the welding point and improving the firmness of the welding. By changing the physical structure of the welding point, the multilayer inductor can be more stably fixed to the circuit board after welding and installation. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 The inductor structure diagram of the present application;

[0020] Figure 2 The axial side perspective structure diagram of embodiment one of the present application;

[0021] Figure 3 For example one of the present application Figure 2 Amplification structure diagram of A part in example one of the present application

[0022] Figure 4 For example one of the present application

[0023] Figure 5 For example one of the present application Figure 4 Amplification structure diagram of B part in example one of the present application

[0024] Figure 6 For example two of the present application

[0025] Figure 7 For example two of the present application Figure 6 Amplification structure diagram of C part in example two of the present application

[0026] Figure 8 For example two of the present application

[0027] In the figure: 1, coil; 2, connecting part; 3, pin; 4, first auxiliary mechanism; 41, placing hole; 42, first spring; 43, first bearing; 44, first cross plate; 45, second bearing; 46, second cross plate; 47, third bearing; 48, clamping plate; 5, second auxiliary mechanism; 51, welding hole; 52, friction groove; 53, second spring; 54, placing frame; 55, soldering plate; 56, suction cup; 57, third spring; 58, fourth bearing; 59, baffle. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all embodiments.

[0029] Examples of the described embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary and are intended to explain the present application, and cannot be understood as a limitation of the present application.

[0030] Example one, please refer to Figures 1-5 The present application provides a technical solution: integrated multilayer inductor, including pin 3, the top of pin 3 is provided with coil 1, coil 1 and pin 3 between fixedly connected with connecting part 2, the outer wall of pin 3 is fixedly connected with auxiliary assembly;

[0031] Coil 1 is fixed on pin 3 through connecting part 2.

[0032] The auxiliary assembly is first auxiliary mechanism 4.

[0033] The first auxiliary mechanism 4 comprises a placing hole 41 which is arranged on the outer wall of the pin 3, one end of the first spring 42 is fixedly connected with the outer wall of the pin 3, the other end of the first spring 42 is fixedly connected with the first bearing 43, the outer wall of the first bearing 43 is rotatably connected with two first cross plates 44, the other end of the outer wall of each of the first cross plates 44 away from the first bearing 43 is rotatably connected with the second bearing 45, the outer wall of each of the second bearings 45 is rotatably connected with the second cross plate 46, the other end of the outer wall of each of the second cross plates 46 away from the second bearing 45 is rotatably connected with the third bearing 47, and the outer wall of each of the third bearings 47 is rotatably connected with the clamping plate 48.

[0034] The second cross plate 46 is inserted into the placing hole 41.

[0035] Preparation

[0036] Preparation materials and tools: Inductor, soldering iron, solder wire, tweezers, wire cutters, multimeter, etc. The power of the soldering iron is generally 25W to 40W, which is more suitable for soldering inductors.

[0037] Check the element: Use a multimeter to check the resistance and other parameters of the inductor to ensure that the inductor is not damaged. At the same time, check whether the pin 3 of the inductor is oxidized or deformed, and clean and reshape it if necessary.

[0038] Clean the soldering surface: Use sandpaper or special cleaning agents to remove the oxidation layer and dirt on the pin 3 of the inductor and the soldering part of the circuit board, ensuring that the soldering surface is clean and bright to ensure good soldering effect.

[0039] Plan the layout: According to the design and space requirements of the circuit board, determine the installation position and direction of the inductor to ensure that it does not interfere with other elements and is convenient for soldering operation.

[0040] Soldering operation

[0041] Heat the soldering iron: Insert the soldering iron into the power socket and turn on the power switch. Wait for the soldering iron to heat to the appropriate temperature. You can use an iron tip thermometer to measure the temperature of the iron tip, which is generally around 300-350 degrees for soldering electronic components.

[0042] Apply solder: During the heating process of the soldering iron, place the solder wire on the iron tip to allow the solder wire to melt and evenly cover the iron tip, forming a thin layer of solder.

[0043] Fix the inductor: Use tweezers or other tools to place the inductor on the designated position on the circuit board, ensuring that the pin of the inductor is aligned with the solder pad on the circuit board.

[0044] Soldering pin 3: Contact the connection between the soldering iron tip and the inductor pin 3 and the circuit board pad, heat them at the same time. When the temperature reaches the melting point of the solder, send the solder wire to the soldering site, let the solder wire melt and flow into the gap between the pin and the pad, the soldering iron tip presses the first bearing 43, and then the first bearing 43 is forced to drop, which drives the position of one end of the first horizontal plate 44 to drop. The other end of the first horizontal plate 44 will be pressed to the second horizontal plate 46 during the descending process. The placement hole 41 limits the movement range of the second horizontal plate 46, and then the second horizontal plate 46 presses the clamp plate 48. At this time, the solder wire is placed on the position of the soldering iron tip, and the melted solder wire is located in the placement hole 41. Then lift the soldering iron tip, and the elasticity of the first spring 42 will pull the first bearing 43 to lift and reset, and then pull the clamp plate 48 through the second horizontal plate 46. When the two clamp plates 48 are close to each other, the melted solder wire is clamped.

[0045] Check the solder joint: After soldering, immediately use tweezers or other tools to gently pull the inductor pin 3 and check whether the solder joint is firm, whether there are problems such as virtual welding, missing welding, short circuit, etc.

[0046] Clean the soldering site: Use a wet cloth or special cleaner to clean the soldering site to remove residual flux and welding slag and other impurities to prevent them from corroding the circuit board or affecting the performance of other components.

[0047] Example two, please refer to Figures 1-8 The application provides another technical solution: an integrated multi-layer inductor, which comprises a pin 3, a coil 1 arranged at the top of the pin 3, a connecting component 2 fixedly connected between the coil 1 and the pin 3, and an auxiliary assembly

[0048] The auxiliary assembly is a second auxiliary mechanism 5.

[0049] The second auxiliary mechanism 5 comprises a welding hole 51, which is arranged on the outer wall of the pin 3, and a friction groove 52 arranged at the bottom of the pin 3.

[0050] The outer wall of the pin 3 is fixedly connected with a placement rack 54, the bottom of the placement rack 54 is fixedly connected with a second spring 53, the bottom of the second spring 53 is fixedly connected with a soldering plate 55, the bottom of the soldering plate 55 is fixedly connected with a suction disc 56, both ends of the soldering plate 55 are fixedly connected with fourth bearings 58, the outer walls of the fourth bearings 58 are rotatably connected with baffle plates 59, and the outer walls of the baffle plates 59 are fixedly connected with third springs 57.

[0051] The soldering plate 55 is a cavity, and both ends of the soldering plate 55 are provided with holes.

[0052] Preparation

[0053] Preparation of materials and tools: need to prepare inductor, electric iron, solder wire, tweezers, wire cutters, multimeter, etc. The power of electric iron is generally twenty-five to forty watts, which is suitable for welding inductors.

[0054] Check the element: use a multimeter to check the resistance and other parameters of the inductor to ensure that the inductor is not damaged. At the same time, check whether the pin 3 of the inductor is oxidized or deformed, and clean and reshape it if necessary.

[0055] Clean the welding surface: use sandpaper or special cleaner to remove the oxidation layer and dirt on the pin 3 of the inductor and the welding part of the circuit board, ensuring that the welding surface is clean and bright to ensure good welding effect.

[0056] Layout planning: according to the design and space requirements of the circuit board, determine the installation position and direction of the inductor, ensure that it does not interfere with other elements, and facilitate welding operation.

[0057] Welding operation

[0058] Heat the soldering iron: plug the soldering iron into the power socket, turn on the power switch, and wait for the soldering iron to heat to the appropriate temperature. You can use an iron tip thermometer to measure the temperature of the iron tip, which is usually around three hundred to three hundred and fifty degrees for welding electronic components.

[0059] Apply solder: during the heating process of the soldering iron, place the solder wire on the iron tip, allowing the solder wire to melt and evenly cover the iron tip, forming a thin layer of solder.

[0060] Fix the inductor: use tweezers or other tools to place the inductor on the designated position on the circuit board, ensuring that the pin of the inductor is aligned with the solder pad on the circuit board.

[0061] When the pin 3 is in contact with the circuit board, the flux plate 55 is arranged at the bottom position of the pin 3, at this time the suction cup 56 is squeezed with the circuit board, the outer wall part of the suction cup 56 is in the cavity of the flux plate 55, at this time the suction cup 56 is squeezed with the circuit board, the suction cup 56 is inflated, then the suction cup 56 squeezes the flux in the flux plate 55, and then the suction cup 56 continues to press and squeeze the gas between the suction cup 56 and the circuit board, at this time the suction cup 56 is adsorbed on the circuit board;

[0062] Under normal circumstances, the elasticity of the third spring 57 makes the baffle 59 block at both ends of the flux plate 55, preventing the flux from flowing out;

[0063] Soldering pin 3: Contact the soldering iron tip to the connection between the inductor pin 3 and the circuit board pad, and heat them at the same time. When the temperature reaches the melting point of the solder, send the solder wire to the soldering site, let the solder wire melt and flow into the gap between the pin and the pad. Place the soldering iron tip and the solder wire into the soldering hole 51, then melt the solder wire, at this time the solder wire melts and flows between the friction groove 52 and the circuit board, thereby increasing the friction area with pin 3.

[0064] Check the solder joint: After soldering, immediately use tweezers or other tools to gently pull the inductor pin 3 and check if the solder joint is firm, and whether there are problems such as virtual welding, missing welding, short circuit, etc.

[0065] Clean the soldering site: Use a wet cloth or special cleaner to clean the soldering site, remove residual flux and welding slag and other impurities, prevent them from corroding the circuit board or affecting the performance of other components.

[0066] The above is only the preferred specific implementation of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art, according to the technical solution and the inventive concept of the present application, can make equivalent replacement or change within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.

Claims

1. Integrated multilayer inductor comprising a pin (3), characterized in that: The top of the pin (3) is provided with a coil (1), the coil (1) and the pin (3) are fixedly connected with a connecting component (2), the outer wall of the pin (3) is fixedly connected with an auxiliary assembly; The auxiliary assembly is a first auxiliary mechanism (4); the first auxiliary mechanism (4) comprises a placing hole (41), the placing hole (41) is arranged on the outer wall of the pin (3), one end of a first spring (42) is fixedly connected with the outer wall of the pin (3), the other end of the first spring (42) is fixedly connected with a first bearing (43), the outer wall of the first bearing (43) is rotatably connected with two first cross plates (44), the other end of the first cross plate (44) away from the first bearing (43) is rotatably connected with a second bearing (45), the outer wall of the second bearing (45) is rotatably connected with a second cross plate (46), the other end of the second cross plate (46) away from the second bearing (45) is rotatably connected with a third bearing (47), and the outer wall of the third bearing (47) is rotatably connected with a clamping plate (48).

2. The integrated multilayer inductor of claim 1, wherein: The second cross plate (46) is inserted into the placing hole (41).

Images