Joint test method and device, electronic equipment and storage medium

Abstract

The invention discloses a joint test method and device, electronic equipment and a storage medium. The method comprises the following steps: acquiring first test demand information for performing a joint test on a plurality of components; a wiring matrix matched with the first test demand information is constructed, the wiring matrix comprises a plurality of backbone networks, a plurality of components and a plurality of wiring devices, and each backbone network is connected with the components deployed in the corresponding test area through the wiring device deployed in the corresponding test area, so that the test demand information is obtained; a plurality of components with the same type and different models are deployed in each test area; constructing a wiring strategy matched with the wiring matrix according to the first test demand information, wherein the wiring strategy is used for representing a wiring relationship between the backbone network and the component; and according to the wiring strategy, controlling on-off of a plurality of wiring devices in the wiring matrix so as to carry out joint test on a plurality of components connected to the same backbone network. Therefore, according to the method provided by the invention, switching configuration of a plurality of components can be realized, and the efficiency of the joint test is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of control system simulation testing, and in particular relates to a joint testing method, device, electronic device and storage medium. Background Art

[0002] In control system R&D test projects, multiple components often need to be tested together. In related technologies, wiring systems are often used to switch between multiple components based on test requirements, thereby enabling joint testing.

[0003] However, related technologies rely on a single wiring solution, requiring switching configurations for components of a single type or model, reducing the efficiency of joint testing. Furthermore, wiring is accomplished through dedicated equipment, resulting in a single test scenario and a lack of reusability. New test scenarios require changes to physical connections, increasing the cost and reducing the efficiency of joint testing. Summary of the Invention

[0004] The embodiments of the present application provide a method, apparatus, electronic device, and storage medium for joint testing, which can implement switching configuration of multiple components and improve the efficiency of joint testing.

[0005] In a first aspect, an embodiment of the present application provides a method for joint testing, the method comprising: obtaining first test requirement information for joint testing of multiple components; constructing a wiring matrix matching the first test requirement information, wherein the wiring matrix comprises multiple backbone networks, multiple components, and multiple wiring devices, and each backbone network is connected to the components deployed in the test area through the wiring devices deployed in the corresponding test area, and multiple components of the same type but different models are deployed in each test area; constructing a wiring strategy matching the wiring matrix according to the first test requirement information, wherein the wiring strategy is used to characterize the wiring relationship between the backbone network and the components; and controlling the on and off of multiple wiring devices in the wiring matrix according to the wiring strategy to jointly test multiple components connected to the same backbone network.

[0006] In the second aspect, an embodiment of the present application provides a device for joint testing, which includes: a requirement acquisition module for acquiring first test requirement information for joint testing of multiple components; a matrix construction module for constructing a wiring matrix matching the first test requirement information, wherein the wiring matrix includes multiple backbone networks, multiple components and multiple wiring devices, and each backbone network is connected to the components deployed in the corresponding test area through the wiring devices deployed in the corresponding test area, and multiple components of the same type but different models are deployed in each test area; a strategy construction module for constructing a wiring strategy matching the wiring matrix according to the first test requirement information, wherein the wiring strategy is used to characterize the wiring relationship between the backbone network and the components; a testing module for controlling the on and off of multiple wiring devices in the wiring matrix according to the wiring strategy, so as to jointly test multiple components connected to the same backbone network.

[0007] In a third aspect, an embodiment of the present application provides an electronic device comprising: a processor and a memory storing computer program instructions; when the processor executes the computer program instructions, the method for joint testing as described in the first aspect is implemented.

[0008] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium having computer program instructions stored thereon. When the computer program instructions are executed by a processor, the method for joint testing as described in the first aspect is implemented.

[0009] In a fifth aspect, an embodiment of the present application provides a computer program product. When the instructions in the computer program product are executed by a processor of an electronic device, the electronic device performs the joint testing method as described in the first aspect.

[0010] As can be seen from the above content, in the embodiment of the present application, a matrix thinking is adopted to construct a wiring matrix. By controlling the on and off of the wiring equipment, the switching configuration of multiple components can be realized, thereby improving the efficiency of the joint testing of multiple components. In addition, in the embodiment of the present application, the wiring matrix includes multiple backbone networks, and the wiring relationship between each backbone network and the component is configured by the wiring equipment, so that different backbone networks can be connected to different components. Through the backbone network, multiple component combinations can be jointly tested in parallel, further improving the efficiency of the joint test. Finally, in the embodiment of the present application, since the wiring matrix is ​​composed of backbone networks, components and wiring equipment, when the test requirements change, it is only necessary to adaptively adjust the wiring matrix without changing the physical connection, which reduces the cost of joint testing and improves the efficiency of joint testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0012] Figure 1 This is a flow chart of a joint testing method provided by one embodiment of the present application;

[0013] Figure 2 This is a schematic diagram of the structure of a wiring device provided by an embodiment of the present application;

[0014] Figure 3 This is a schematic diagram of the network topology of a wiring matrix provided by an embodiment of the present application;

[0015] Figure 4 This is a flow chart of a matrix wiring method provided by one embodiment of the present application;

[0016] Figure 5 This is a schematic diagram of the connection relationship between the backbone network and the relays of the wiring equipment in the test area provided by one embodiment of the present application;

[0017] Figure 6 is a schematic diagram of a display interface of a joint testing system provided by one embodiment of the present application;

[0018] Figure 7 is a structural schematic diagram of a joint testing device provided in another embodiment of the present application;

[0019] Figure 8 This is a structural diagram of an electronic device provided in yet another embodiment of the present application. DETAILED DESCRIPTION

[0020] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating the examples of the present application.

[0021] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, the elements defined by the phrase "comprising..." do not exclude the presence of other identical elements in the process, method, article, or device comprising the elements.

[0022] For ease of understanding, before explaining the solution provided in this application, the background of the solution provided in this application is first explained.

[0023] In control system R&D testing projects, such as flight control systems and industrial control systems, integrated control system simulation and verification technology has a significant impact on the authenticity and scientific nature of aircraft design verification. Control system integrated verification typically employs an iterative approach, initially replacing real components with simulated ones. If the simulated components pass verification, the simulated components are then replaced with the corresponding real components. Manually plugging and unplugging cables between these components can easily lead to human error, resulting in test failures.

[0024] In related technologies, wiring system products are used to dynamically and in real time switch real components and simulated components according to test needs, effectively reducing human errors caused by manual switching and improving the work efficiency of control system testers.

[0025] The use of a wiring system presupposes a well-designed configuration. In recent years, with the continuous advancement of computer technology and the development of artificial intelligence, matrix algorithms have been increasingly studied and applied. Therefore, it is worth considering applying matrix algorithms or matrixization methods to control system simulation testing, enabling the design of complex experimental configurations and applying simulation testing methods to control systems.

[0026] However, the wiring schemes used in related technologies are relatively simple, enabling only the switching configuration of one real or simulated component of a certain type and model, and not the switching configuration of multiple real or simulated components, resulting in low versatility. Furthermore, traditional wiring is a dedicated device network designed for a specific model or test scenario, lacking reusability and requiring modification of the physical wiring state for secondary use.

[0027] To solve the problems of the prior art, the present invention provides a method, apparatus, electronic device, and storage medium for joint testing. The following first introduces the joint testing method provided by the present invention. The method provided by the present invention can be applied to a joint testing system.

[0028] Figure 1 A flow chart of a joint testing method provided in one embodiment of the present application is shown.

[0029] like Figure 1 As shown, the method includes steps S101 to S104:

[0030] Step S101: obtaining first test requirement information for joint testing of multiple components.

[0031] In step S101, any one of the multiple components may be a real component or a simulated component. In addition, the first test requirement information for the joint testing of the multiple components may include, but is not limited to, information such as test combinations and test contents corresponding to the multiple components. A test combination is a combination of at least some of the multiple components. For example, if the multiple components include component 1, component 2, component 3, and component 4, the test combination may be a combination of any two, three, or four of the four components.

[0032] Step S102: constructing a wiring matrix matching the first test requirement information.

[0033] In step S102, the wiring matrix includes multiple backbone networks, multiple components, and multiple wiring devices. Each backbone network is connected to the components deployed in the corresponding test area via the wiring devices deployed in the test area. Each test area is deployed with multiple components of the same type but different models. The backbone network can be a network on a 1553B bus, and the test area is the area where the components are deployed. In this embodiment of the present application, the test area can be set according to different types of control systems. For example, the test area can include but is not limited to an automated operation room, a control room, and a workstation.

[0034] In addition, in the embodiment of the present application, the wiring device can be a device with a single-pole double-throw relay, which realizes signal switching by controlling the on and off of the single-pole double-throw relay. In one example, Figure 2 Shows a schematic diagram of the wiring equipment structure. Figure 2As can be seen, the wiring equipment includes four single-pole double-throw relays, namely K1, K2, K3, and K4. K1 and K3 are used to control the input and output connections of real components to the backbone network, while K2 and K4 are used to control the input and output connections of simulated components to the backbone network. Bypass acquisition lines are set between K1 and K2, and between K3 and K4 to control the on and off of each relay. In this embodiment of the application, the wiring equipment can receive control commands sent by the host computer via a 1000M Ethernet interface to control relays K1, K2, K3, and K4 to achieve various wiring combinations.

[0035] In one embodiment, in a control system experiment, 1553B bus communication requires four models of real components to be tested simultaneously, taking A bus (B bus is similar) as an example. Figure 3 The network topology of the wiring matrix is ​​shown in Figure 3 In the 1553B bus (A bus), there are 5 independent networks, namely Figure 3 Test Networks 1, 2, 3, 4, and 5 each connect couplers distributed in the automated operation room, control room, Areas A, B, C, D, and E via a 1553B backbone network. Termination resistors are added to the couplers in the control room and Area E to form the backbone network. The couplers in the control room, automated operation room, and five workstation areas feature single-strand coupler interfaces, enabling each workstation to simultaneously connect up to four real components. Access to the test network for components in each test area is controlled by 1553B automated wiring equipment.

[0036] Step S103: constructing a wiring strategy that matches the wiring matrix according to the first test requirement information.

[0037] In step S103, the wiring strategy is used to characterize the wiring relationship between the backbone network and the components. It should be noted that in the embodiment of the present application, each wiring device has multiple channels, for example, each wiring device is provided with 48 channels. In each test area, one end of the 48 channels of the wiring device is connected to multiple backbone networks respectively, for example, channels 1-12 are connected to backbone network 1, channels 13-24 are connected to backbone network 2, channels 25-36 are connected to backbone network 3, and channels 37-48 are connected to backbone network 4; the other end of the 48 channels can be connected to the components, so that the connection between the components and the backbone network can be achieved by controlling the on and off of the channels.

[0038] Step S104: controlling the on and off of multiple wiring devices in the wiring matrix according to the wiring strategy to perform joint testing on multiple components connected to the same backbone network.

[0039] In step S104, after determining the wiring strategy and the wiring matrix, the joint test system can control the on and off of the channels of each wiring device in the wiring matrix according to the wiring strategy to connect the components that need to be jointly tested in the same backbone network, that is, in an embodiment of the present application, the components connected to the same backbone network are a test combination, and a combined test is required.

[0040] Based on the scheme defined by the above steps S101 to S104, it can be known that in the embodiment of the present application, a wiring matrix is ​​constructed using matrix thinking, and by controlling the on and off of the wiring equipment, the switching configuration of multiple components can be realized, thereby improving the efficiency of the joint testing of multiple components. In addition, in the embodiment of the present application, the wiring matrix includes multiple backbone networks, and the wiring relationship between each backbone network and the component is configured by the wiring equipment, so that different backbone networks can be connected to different components. Through the backbone network, multiple component combinations can be combined for parallel joint testing, further improving the efficiency of the joint testing. Finally, in the embodiment of the present application, since the wiring matrix is ​​composed of backbone networks, components and wiring equipment, when the test requirements change, it is only necessary to adaptively adjust the wiring matrix without changing the physical connection, which reduces the cost of joint testing and improves the efficiency of joint testing.

[0041] In one embodiment, Figure 4 A flowchart of the matrix wiring method is shown. Figure 4 It can be seen that the process mainly includes the following steps:

[0042] Step S401, use matrix thinking to design the hardware connection configuration, based on the number of test networks of the control system and the number of real components and simulated components participating in the joint test, consider the number of wiring devices used, that is, whether the total number of channels of the wiring devices can meet the configuration requirements of the entire test network, and draw a topological structure diagram or schematic diagram using the wiring devices according to the configuration requirements to obtain the wiring matrix.

[0043] Step S402: formulate a wiring strategy represented by a wiring rule table based on the sorted schematic diagram, and use this table to organize the rules of matrix wiring as one of the inputs of the joint test system.

[0044] Step S403 , summarize the top-level switching view of the joint test system, and plan and layout the software interface with components as switching units, that is, design the interface layout of multiple real components or simulated components to be switched.

[0045] Step S404: Perform verification testing on the wiring matrix to ensure that the wiring configuration can be used normally.

[0046] The following combination Figure 4 The specific implementation of the method provided in the embodiment of the present application is introduced.

[0047] After obtaining first test requirement information for joint testing of multiple components, the joint test system may construct a wiring matrix matching the first test requirement information.

[0048] Specifically, the joint test system obtains a test combination for jointly testing multiple components from the first test requirement information; then, based on the correlation between the number of combinations and the number of backbone networks, determines the number of target backbone networks corresponding to the number of combinations of the test combination; then, based on the component distribution information of the multiple components, determines the number of test areas where the multiple components are deployed and the number of components deployed in each test area; then, based on the number of components corresponding to each test area and the number of channels corresponding to each wiring device, determines the number of wiring devices deployed in each test area; finally, deploys test components corresponding to the number of components in each test area and wiring devices corresponding to the number of wiring devices in each test area, and connects the wiring devices in multiple test areas through the backbone network corresponding to the target number of backbone networks to form a wiring matrix.

[0049] In the above embodiment, the number of target backbone networks can be determined based on the number of test combinations. For example, when the number of test combinations is large, multiple target backbone networks can be deployed. In addition, to improve the stability of the joint test system, the number of backbone networks deployed is generally greater than the number of backbone networks required for the joint test. For example, if the joint test requires four backbone networks, five backbone networks are generally deployed.

[0050] In the above embodiment, the component distribution information includes at least one of the following: the component type of each component (for example, 4 different types of components), the number of component types (for example, 4 component types, then the number of component types is 4), the number of components corresponding to each component type (for example, each component type corresponds to 5 components), and the component models contained in each component type (for example, each component type corresponds to multiple component models).

[0051] It should be noted that in order to ensure the comprehensiveness of the joint testing of multiple components, in an embodiment of the present application, the components deployed in each test area have the same component type. For example, the components deployed in test area 1 are all component type 1, wherein the components in test area 1 have different component models.

[0052] In one embodiment, after determining the number of backbone networks, the joint testing system can determine the number of test areas in which the multiple components are deployed and the number of components deployed in each test area based on component distribution information of the multiple components.

[0053] Specifically, the joint test system obtains the upper limit value of the number of components carried by each test area, and obtains the number of component types from the component distribution information; when the number of components of all component types is less than or equal to the upper limit value of the component number, the number of component types is determined as the number of areas, and components of different component types are deployed in different test areas; the number of components corresponding to each component type is determined as the number of components deployed in each test area.

[0054] It should be noted that each test area has an upper limit on the number of components it can support, i.e., the maximum number of components it can support. To ensure the normal operation of the joint test system, the number of components deployed in each test area should be less than or equal to the upper limit. In the embodiments of the present application, the upper limit on the number of components in different test areas can be different or the same, and the number of components deployed in different test areas can be the same or different. The following example uses the example of different test areas having the same upper limit on the number of components.

[0055] As an example, in an embodiment of the present application, the components deployed in the same test area have the same component type. For example, the upper limit of the number of components corresponding to the test area is 5, the number of components corresponding to component type 1 is 4, and the number of components corresponding to component type 2 is 3. All components of component type 1 can be deployed in the same test area, and all components of component type 2 can be deployed in another test area.

[0056] When the number of components of the target component type is greater than the upper limit of the component number, the target value is determined based on the ratio between the number of components of the target component type and the upper limit of the component number; the sum of the number of component types and the target value is calculated to obtain the number of areas; the ratio of the number of components of the target component type to the target value is calculated to obtain the number of components corresponding to the test area where the components of the target component type are deployed.

[0057] In the above embodiment, the target component type is any one of multiple component types.

[0058] As an example, the number of components corresponding to component type 3 is 10, the upper limit of the component number is 5, and the ratio of the number of components of the target component type to the upper limit of the component number is 2. The target value can be the value obtained by adding one to the above ratio, that is, the target value is 3, and the number of areas is the number of component types plus 3. For example, if the number of component types is 4, then the number of test areas to be deployed is 7, among which component type 3 is deployed in 3 test areas, and each test area deploys 3 or 4 components of component type 3.

[0059] Furthermore, after determining the number of test areas and the number of components deployed in each test area, the joint test system can also determine the number of wiring devices based on the number of components in each test area. As an example, each wiring device has a certain number of channels. For example, in an embodiment of the present application, each test area deploys 4 components and 5 backbone networks. Each wiring device has 48 channels, and each component requires 3 channels. Therefore, at least 2 wiring devices need to be deployed in each test area. In addition, to improve the stability of the joint test system, a redundant number of wiring devices are usually deployed. For example, in the above example, 3 or 4 wiring devices can be deployed.

[0060] After obtaining the number of backbone networks, the number of test areas, the number of components deployed in each test area, and the number of wiring devices in the wiring device, a wiring matrix can be constructed according to the test requirements.

[0061] After constructing a wiring matrix that matches the first test requirement information, the joint test system also switches the wiring relationship between each backbone network and components deployed in multiple test areas, performs path tests on components in different areas, and obtains path test results.

[0062] It should be noted that in the embodiments of the present application, in the absence of real components, auxiliary test equipment, simulated real parts, or simulated components can be deployed in the test area to replace the real components to be switched. After completing the basic test, the path test of each 1553B station and room is carried out according to the test steps, and the test results are recorded. As an example, the path test of Room 1 and Station E can be carried out according to the path test table shown in Table 1. Table 1 only shows the path test table corresponding to 1553B Bus A Backbone Network 1 and 1553B Bus A Backbone Network 2. The path test of other backbone networks is similar and will not be illustrated one by one here.

[0063] Table 1

[0064]

[0065] Furthermore, after the wiring matrix is ​​constructed, the joint test system can control the on and off of multiple wiring devices in the wiring matrix according to the wiring strategy.

[0066] As an example, a wiring strategy is used to represent the switching logic of a wiring device. It can be set based on matrix wiring requirements to indicate the switching status of relays in each wiring device. Table 2 shows the wiring strategy for backbone network 1 in room 1, where three models of ID101 components are deployed.

[0067] Table 2

[0068]

[0069] In Table 2, the FromLRU daughter card corresponds to the first input terminal of the wiring device, such as Figure 2 The input end corresponding to the real component in the ToLRU daughter card corresponds to the first output end of the wiring device, such as Figure 2 The output terminal of the real component corresponds to the output terminal of the ToSim sub-card; the ToSim sub-card corresponds to the second output terminal of the wiring device, such as Figure 2 The output terminal corresponding to the simulation component.

[0070] In addition, in Table 2, state 0 indicates that the channel is in an off state; state 1 indicates that the channel is in an on state.

[0071] In one embodiment, when the wiring strategy indicates that none of the components in the first test area are connected to the first backbone network, the first channel of the first distribution device is controlled to be turned on; when the wiring strategy indicates that the first component in the first test area is connected to the first backbone network, the second channel of the first distribution device is controlled to be turned on.

[0072] In the above embodiment, the first distribution device is a distribution device deployed in the first test area and connected to the first backbone network. The first test area is any one of multiple test areas, and the first backbone network is any one of multiple backbone networks. The distribution device has multiple channels, and the first channel is used to connect the input and output ends of the first backbone network in the first test area; the first component is connected to the first backbone network through the second channel of the first distribution device, and the first component is any one of the multiple components deployed in the first test area.

[0073] In one example, Figure 5 The schematic diagram shows the connection relationship between the backbone network and the relays of the wiring equipment in the test area, where Figure 5 In the test area, the test area can be an automatic operation room, control room, area A, area B, area C, area D and area E. Four types of components are deployed in this test area, and all five backbone networks pass through this test area ( Figure 5 Only 4 backbones are shown).

[0074] by Figure 5 As an example, the relay connection corresponding to the test network 1 in the test network 1 is divided into direct connection (i.e. Figure 5As shown in the figure, there are two branches: without coupler) and with coupler (referring to the component with coupler connection). If any type of component in the current test area is not connected to the backbone network, the direct connection branch is used, and the wiring matrix ignores the components at this workstation and directly connects to the input end of the backbone network of the next test area; if there are components in the current test area connected to the backbone network, the switching coupler branch is used. For example, if the model 1 component is connected to the backbone network 1, the input and output ends of the wiring device are connected to the input and output ends of the model 1 component; if the model 2 component is connected to the backbone network 1, the input and output ends of the wiring device are connected to the input and output ends of the model 2 component, and so on.

[0075] It should be noted that in a test of the same model in a certain test area, it can only be connected to one backbone network at most to ensure that each backbone network is independently connected. For example, if model 1 components are deployed in test area 1 and if model 1 components are connected to backbone network 1, model 2 components will no longer be connected to backbone network 2.

[0076] In addition, it should be noted that in order to avoid the impact of shielding layer damage on signal transmission, in the embodiment of the present application, the hardware wiring in the joint test system is combined with the metal casing through the shielding layer on the cable to form a shielding network.

[0077] Furthermore, after the wiring is completed, the joint test system can also display the wiring status corresponding to the wiring matrix under the wiring strategy through a display interface.

[0078] In the above embodiment, the display interface includes multiple groups of display controls, each group of display controls corresponds to a backbone network, each group of display controls includes multiple sub-display controls, and each sub-display control corresponds to a test area.

[0079] In one example, Figure 6 A schematic diagram of the display interface of the joint test system is shown. Figure 6 In the example, each backbone network corresponds to a set of display components. Each display component set includes multiple sub-display controls. These sub-display controls indicate whether a component connected to the backbone network exists within the corresponding test area. If so, they display information related to the component connected to the backbone network. For example, the first sub-display control corresponding to backbone network 3 indicates that component model 3 in room 1 is connected to backbone network 3; the second sub-display control indicates that workstation A is directly connected to the backbone network; and the sixth sub-display control indicates that component model 4 in workstation E is connected to backbone network 3.

[0080] In one embodiment, the display interface of the joint test system can not only display the connection status of wiring devices in each test area to the user, but also respond to user commands. Specifically, in response to a control selection command, the display interface determines a target control from multiple sub-display controls displayed on the display interface, and determines the target backbone network and target test area corresponding to the target control. In response to a target control switch command, the display interface determines a target component from multiple components deployed in the target test area and switches the connection relationship between the target component and the target backbone network.

[0081] In an example, the user wants to connect the model 1 component in station A to backbone network 1, so the user selects the sub-display control corresponding to station A through the display interface of the joint test system. At this time, the wiring interface corresponding to station A pops up on the display interface, and the user can select the model 1 component in the wiring interface to connect the model 1 component to backbone network 1.

[0082] In one embodiment, after jointly testing multiple components connected to the same backbone network, the joint testing system can also obtain second test requirement information for jointly testing the multiple components; based on the second test requirement information, adjust the backbone network, components and one or more wiring devices in the wiring matrix to obtain an adjusted wiring matrix; construct a target wiring strategy that matches the adjusted wiring matrix according to the second test requirement information; and control the on and off of multiple wiring devices in the adjusted wiring matrix according to the target wiring strategy.

[0083] In the above embodiment, the second test requirement information is different from the first test requirement information. That is, in the embodiment of the present application, after the wiring matrix is ​​constructed, if the test requirements change in subsequent applications, the wiring matrix and wiring strategy can be adjusted without rebuilding the wiring matrix. Therefore, the method provided by the embodiment of the present application can make the joint test system highly versatile.

[0084] Support, complete the introduction of the method provided in the embodiment of this application.

[0085] From the above introduction, it can be seen that the embodiment of the present application proposes a multi-system matrix simulation test method. Through reasonable hardware configuration scheme planning, it is easy to build a simulation test system suitable for switching configurations of multiple real components or simulated components, which has high versatility.

[0086] The present application also provides a joint testing device, such as Figure 7 As shown, the apparatus 700 includes: a demand acquisition module 701 , a matrix construction module 702 , a strategy construction module 703 and a testing module 704 .

[0087] A requirement acquisition module 701 is used to acquire first test requirement information for joint testing of multiple components;

[0088] a matrix construction module 702 configured to construct a wiring matrix matching the first test requirement information, wherein the wiring matrix includes a plurality of backbone networks, a plurality of components, and a plurality of wiring devices, each backbone network being connected to a component deployed in a corresponding test area via a wiring device deployed in the corresponding test area, and each test area being deployed with a plurality of components of the same type but different models;

[0089] A strategy construction module 703 is configured to construct a wiring strategy that matches the wiring matrix according to the first test requirement information, wherein the wiring strategy is used to characterize the wiring relationship between the backbone network and the components;

[0090] The test module 704 is used to control the on and off of multiple wiring devices in the wiring matrix according to the wiring strategy, so as to perform joint testing on multiple components connected to the same backbone network.

[0091] In one example, the matrix construction module includes: a combination acquisition module, a first quantity determination module, a second quantity determination module, a third quantity determination module, and a wiring module. Among them, the combination acquisition module is used to obtain a test combination for jointly testing multiple components from the first test requirement information; the first quantity determination module is used to determine the target backbone network number corresponding to the combination number of the test combination based on the correlation between the combination number and the backbone network number; the second quantity determination module is used to determine the number of test areas where multiple components are deployed and the number of components deployed in each test area based on the component distribution information of the multiple components, wherein the component distribution information includes at least one of the following: the component type of each component, the number of component types, the number of components corresponding to each component type, and the component models contained in each component type, and the components deployed in each test area have the same component type; the third quantity determination module is used to determine the number of wiring devices deployed in each test area based on the number of components corresponding to each test area and the number of channels corresponding to each wiring device; the wiring module is used to deploy test components corresponding to the number of components in each test area and wiring devices corresponding to the number of wiring devices in each test area, and connect the wiring devices in multiple test areas through the backbone network corresponding to the target backbone network number to form a wiring matrix.

[0092] In one example, the second quantity determination module is specifically used to obtain the upper limit value of the number of components carried by each test area, and obtain the number of component types from the component distribution information; when the number of components of all component types is less than or equal to the upper limit value of the component number, the number of component types is determined as the area number, and components of different component types are deployed in different test areas; the number of components corresponding to each component type is determined as the number of components of the components deployed in each test area.

[0093] In one example, the second quantity determination module is also used to determine the target value based on the ratio between the number of components of the target component type and the upper limit of the component number when the number of components of the target component type is greater than the upper limit of the component number, wherein the target component type is any one of multiple component types; calculate the sum of the number of component types and the target value to obtain the number of areas; calculate the ratio of the number of components of the target component type to the target value to obtain the number of components corresponding to the test area where the components of the target component type are deployed.

[0094] In one example, the joint testing device also includes: a path test module, which is used to switch the wiring relationship between each backbone network and components deployed in multiple test areas after constructing a wiring matrix that matches the first test requirement information, perform path tests on components in different areas, and obtain path test results.

[0095] In one example, the test module is specifically used to control the first channel of the first distribution device to be turned on when the wiring strategy indicates that none of the components in the first test area are connected to the first backbone network, wherein the first distribution device is a distribution device deployed in the first test area and connected to the first backbone network, the first test area is any one of a plurality of test areas, the first backbone network is any one of a plurality of backbone networks, the distribution device has multiple channels, and the first channel is used to connect the input and output ends of the first backbone network in the first test area; when the wiring strategy indicates that the first component in the first test area is connected to the first backbone network, the second channel of the first distribution device is controlled to be turned on, wherein the first component is connected to the first backbone network through the second channel of the first distribution device, and the first component is any one of the plurality of components deployed in the first test area.

[0096] In one example, the joint testing device also includes: a display module, which is used to display the wiring status corresponding to the wiring matrix under the wiring strategy through a display interface after controlling the on and off of multiple wiring devices in the wiring matrix according to the wiring strategy, wherein the display interface includes multiple groups of display controls, each group of display controls corresponds to a backbone network, and each group of display controls includes multiple sub-display controls, and each sub-display control corresponds to a test area.

[0097] In one example, the display module is also used to respond to a control selection instruction after displaying the wiring status corresponding to the wiring matrix under the wiring strategy through a display interface, determine the target control from multiple sub-display controls displayed on the display interface, and determine the target backbone network and target test area corresponding to the target control; respond to a switching instruction for the target control, determine the target component from multiple components deployed in the target test area, and switch the wiring relationship between the target component and the target backbone network.

[0098] In one example, the joint testing device also includes: an adjustment module for obtaining second test requirement information for joint testing of multiple components after joint testing of multiple components connected to the same backbone network, wherein the second test requirement information is different from the first test requirement information; adjusting the backbone network, components, and one or more wiring devices in the wiring matrix based on the second test requirement information to obtain an adjusted wiring matrix; constructing a target wiring strategy that matches the adjusted wiring matrix according to the second test requirement information; and controlling the on and off of multiple wiring devices in the adjusted wiring matrix according to the target wiring strategy.

[0099] The joint testing device provided in the embodiment of the present application can implement each process implemented in the aforementioned method embodiment. To avoid repetition, it will not be described here.

[0100] Those skilled in the art can clearly understand that, for the convenience and brevity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0101] Figure 8 A schematic diagram of the hardware structure of an electronic device provided in an embodiment of the present application is shown.

[0102] The electronic device may include a processor 801 and a memory 802 storing computer program instructions.

[0103] Specifically, the processor 801 may include a central processing unit (CPU), or an application-specific integrated circuit (ASIC), or may be configured to implement one or more integrated circuits of the embodiments of the present application.

[0104] The memory 802 may include a large capacity memory for data or instructions. By way of example and not limitation, the memory 802 may include a hard disk drive (HDD), a floppy disk drive, a flash memory, an optical disk, a magneto-optical disk, a magnetic tape, or a universal serial bus (USB) drive, or a combination of two or more of these. Where appropriate, the memory 802 may include removable or non-removable (or fixed) media. Where appropriate, the memory 802 may be inside or outside the integrated gateway disaster recovery device. In a specific embodiment, the memory 802 is a non-volatile solid-state memory.

[0105] The memory may include read-only memory (ROM), random access memory (RAM), magnetic disk storage media devices, optical storage media devices, flash memory devices, electrical, optical or other physical / tangible memory storage devices. Thus, generally, the memory includes one or more tangible (non-transitory) computer-readable storage media (e.g., memory devices) encoded with software including computer-executable instructions, and when the software is executed (e.g., by one or more processors), it is operable to perform the operations described with reference to the method according to an aspect of the present disclosure.

[0106] The processor 801 implements any one of the joint testing methods in the above embodiments by reading and executing computer program instructions stored in the memory 802 .

[0107] In one example, the electronic device may further include a communication interface 803 and a bus 810. Figure 8 As shown, the processor 801, the memory 802, and the communication interface 803 are connected via a bus 810 and communicate with each other.

[0108] The communication interface 803 is mainly used to implement communication between various modules, devices, units and / or equipment in the embodiments of the present application.

[0109] Bus 810 comprises hardware, software or both, couples the parts of electronic equipment to each other.For example, and not limitation, bus can comprise accelerated graphics port (AGP) or other graphics bus, enhanced industry standard architecture (EISA) bus, front side bus (FSB), hypertransport (HT) interconnection, industry standard architecture (ISA) bus, infinite bandwidth interconnection, low pin count (LPC) bus, memory bus, micro channel architecture (MCA) bus, peripheral component interconnection (PCI) bus, PCI-Express (PCI-X) bus, serial advanced technology attachment (SATA) bus, video electronics standard association local (VLB) bus or other suitable bus or two or more of these combinations.In suitable cases, bus 810 can comprise one or more buses.Although the present application embodiment describes and shows specific bus, the application considers any suitable bus or interconnection.

[0110] In addition, in conjunction with the joint testing method in the above embodiments, embodiments of the present application may provide a computer-readable storage medium for implementation. The computer-readable storage medium stores computer program instructions; when the computer program instructions are executed by a processor, any of the joint testing methods in the above embodiments is implemented.

[0111] In addition, in combination with the joint testing method in the above embodiments, the present application embodiment can provide a computer program product for implementation. When the instructions in the computer program product are executed by the processor of the electronic device, the electronic device executes and implements any of the joint testing methods in the above embodiments.

[0112] It should be understood that the present application is not limited to the specific configurations and processes described above and illustrated in the figures. For the sake of brevity, a detailed description of known methods is omitted here. In the above embodiments, several specific steps are described and illustrated as examples. However, the method process of the present application is not limited to the specific steps described and illustrated. Those skilled in the art can make various changes, modifications, and additions, or change the order of the steps after understanding the spirit of the present application.

[0113] The functional modules shown in the above-described block diagram can be implemented as hardware, software, firmware or a combination thereof. When implemented in hardware, it can be, for example, an electronic circuit, an application specific integrated circuit (ASIC), appropriate firmware, a plug-in unit, a function card or the like. When implemented in software, the elements of the present application are programs or code segments that are used to perform the required tasks. The program or code segment can be stored in a machine-readable medium, or transmitted on a transmission medium or a communication link by a data signal carried in a carrier wave. "Machine-readable medium" can include any medium that can store or transmit information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROMs, flash memories, erasable ROMs (EROMs), floppy disks, CD-ROMs, optical disks, hard disks, optical fiber media, radio frequency (RF) links, etc. The code segment can be downloaded via a computer network such as the Internet, an intranet, etc.

[0114] It should also be noted that the exemplary embodiments mentioned in this application describe some methods or systems based on a series of steps or devices. However, this application is not limited to the order of the above steps. In other words, the steps can be performed in the order mentioned in the embodiments, or in a different order, or several steps can be performed simultaneously.

[0115] The above reference is made to the flowcharts and / or block diagrams of the method, device, electronic device and storage medium for joint testing according to the embodiments of the present disclosure, which describe various aspects of the present disclosure. It should be understood that each box in the flowchart and / or block diagram and the combination of each box in the flowchart and / or block diagram can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device to produce a machine so that these instructions executed by the processor of the computer or other programmable data processing device enable the implementation of the function / action specified in one or more boxes of the flowchart and / or block diagram. Such a processor can be, but is not limited to, a general-purpose processor, a special-purpose processor, a special application processor or a field programmable logic circuit. It is also understood that each box in the block diagram and / or flowchart and the combination of the boxes in the block diagram and / or flowchart can also be implemented by dedicated hardware that performs the specified function or action, or can be implemented by a combination of dedicated hardware and computer instructions.

[0116] The above description is only a specific embodiment of the present application. Those skilled in the art will clearly understand that for the convenience and brevity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the scope of protection of the present application is not limited thereto. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the scope of protection of the present application.

Claims

1. A joint testing method, characterized in that: include: Acquire first test requirement information for joint testing of multiple components; Constructing a wiring matrix that matches the first test requirement information, wherein the wiring matrix includes multiple backbone networks, the multiple components, and multiple wiring devices, each backbone network is connected to the components deployed in the test area through the wiring devices deployed in the corresponding test area, and multiple components of the same type but different models are deployed in each test area; Constructing a wiring strategy that matches the wiring matrix according to the first test requirement information, wherein the wiring strategy is used to characterize the wiring relationship between the backbone network and the components; The on and off of multiple wiring devices in the wiring matrix are controlled according to the wiring strategy to perform joint testing on multiple components connected to the same backbone network.

2. The method according to claim 1, characterized in that The constructing of a wiring matrix matching the first test requirement information includes: Acquire a test combination for jointly testing the multiple components from the first test requirement information; Determining the target backbone network number corresponding to the combination number of the test combination according to the correlation between the combination number and the backbone network number; Determining, based on component distribution information of the multiple components, the number of test areas in which the multiple components are deployed and the number of components deployed in each test area, wherein the component distribution information includes at least one of the following: a component type of each component, the number of component types, the number of components corresponding to each component type, and component models included in each component type, and the components deployed in each test area have the same component type; Determining the number of wiring devices deployed in each test area based on the number of components corresponding to each test area and the number of channels corresponding to each wiring device; Deploy test components corresponding to the number of components in each test area and wiring devices corresponding to the number of wiring devices in each test area, and connect the wiring devices in multiple test areas through backbone networks corresponding to the number of target backbone networks to form the wiring matrix.

3. The method according to claim 2, characterized in that The determining, based on the component distribution information of the multiple components, the number of test areas in which the multiple components are deployed and the number of components deployed in each test area includes: Obtaining an upper limit value of the number of components carried by each test area, and obtaining the number of component types from the component distribution information; When the number of components of all component types is less than or equal to the upper limit of the number of components, the number of component types is determined as the number of areas, and components of different component types are deployed in different test areas; The number of components corresponding to each component type is determined as the number of components deployed in each test area.

4. The method according to claim 3, characterized in that The method further comprises: If the number of components of a target component type is greater than the upper limit of the component number, determining a target value according to a ratio between the number of components of the target component type and the upper limit of the component number, wherein the target component type is any one of a plurality of component types; Calculating the sum of the number of component types and the target value to obtain the number of regions; The ratio of the number of components of the target component type to the target value is calculated to obtain the number of components corresponding to the test area where components of the target component type are deployed.

5. The method according to claim 1, characterized in that The controlling the on and off of the plurality of wiring devices in the wiring matrix according to the wiring strategy includes: When the wiring strategy indicates that no components in the first test area are connected to the first backbone network, controlling a first channel of a first distribution device to be turned on, wherein the first distribution device is a distribution device deployed in the first test area and connected to the first backbone network, the first test area is any one of a plurality of test areas, the first backbone network is any one of the plurality of backbone networks, the distribution device has a plurality of channels, and the first channel is used to connect an input end and an output end of the first backbone network in the first test area; When the wiring strategy indicates that the first component in the first test area is connected to the first backbone network, the second channel of the first distribution device is controlled to be turned on, wherein the first component is connected to the first backbone network through the second channel of the first distribution device, and the first component is any one of multiple components deployed in the first test area.

6. The method according to any one of claims 1 to 5, characterized in that After controlling the on and off of the plurality of wiring devices in the wiring matrix according to the wiring strategy, the method further includes: In response to a control selection instruction, determining a target control from a plurality of sub-display controls displayed on a display interface, and determining a target backbone network and a target test area corresponding to the target control; In response to a switching instruction for the target control, a target component is determined from a plurality of components deployed in the target test area, and a wiring relationship between the target component and the target backbone network is switched.

7. The method according to any one of claims 1 to 5, characterized in that After the joint testing of the plurality of components connected to the same backbone network is performed, the method further comprises: Acquire second test requirement information for performing a joint test on the plurality of components, wherein the second test requirement information is different from the first test requirement information; Adjusting one or more of the backbone network, components, and wiring devices in the wiring matrix based on the second test requirement information to obtain an adjusted wiring matrix; constructing a target wiring strategy that matches the adjusted wiring matrix according to the second test requirement information; The on and off of multiple wiring devices in the adjusted wiring matrix are controlled according to the target wiring strategy.

8. A joint testing device, characterized in that: include: A requirement acquisition module, configured to acquire first test requirement information for joint testing of multiple components; a matrix construction module, configured to construct a wiring matrix matching the first test requirement information, wherein the wiring matrix includes a plurality of backbone networks, the plurality of components, and a plurality of wiring devices, each backbone network being connected to a component deployed in a corresponding test area via a wiring device deployed in the corresponding test area, and each test area being deployed with a plurality of components of the same type but different models; a strategy construction module, configured to construct a wiring strategy matching the wiring matrix according to the first test requirement information, wherein the wiring strategy is used to characterize the wiring relationship between the backbone network and the components; The test module is used to control the on and off of multiple wiring devices in the wiring matrix according to the wiring strategy, so as to jointly test multiple components connected to the same backbone network.

9. An electronic device, characterized in that: The electronic device includes: a processor and a memory storing computer program instructions; When the processor executes the computer program instructions, the joint testing method according to any one of claims 1 to 7 is implemented.

10. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer program instructions, which, when executed by a processor, implement the joint testing method according to any one of claims 1 to 7.

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