Testing device of packaging module and manufacturing method thereof

Abstract

The invention relates to a testing device of a packaging module and a manufacturing method thereof. The testing device of the packaging module comprises a circuit board, a socket and a conductive connection pad, the circuit board has a plurality of contacts. The socket is located on the circuit board. The conductive connection pad comprises a three-dimensional step structure and a plurality of elastic conductive columns. The three-dimensional step structure is located in the containing groove of the socket and comprises a plurality of annular steps. The annular steps are concentric rectangles arranged in sequence, and the heights of the annular steps are changed in sequence from the center points of the concentric rectangles to the direction of the socket. The elastic conductive columns are distributed on the annular steps at intervals, and each elastic conductive column is inserted in the three-dimensional stepped structure and electrically contacts one of the contacts and the packaging module. By means of the structure, the warping shape of the object to be tested can be matched, the opportunity of poor connection performance between the elastic conductive column and the solder ball of the object to be tested is reduced, and therefore an accurate test result is provided.

Description

Technical Field

[0001] The present invention relates to a testing device, and more particularly to a testing device for a packaged module and a manufacturing method thereof. Background Art

[0002] Generally speaking, during the testing phase, a DUT (such as a packaged module) is placed in a test bench, so that two ends of each retractable probe in the test bench contact the solder balls of the DUT above and the contacts of the circuit board below.

[0003] However, when the warping of the DUT increases due to temperature rise, the industry needs to adjust the height of the telescopic probe. Otherwise, poor connection performance will occur between the telescopic probe and the solder balls of the DUT, thereby affecting the test results of the DUT.

[0004] Therefore, how to effectively solve the above-mentioned inconveniences and defects is one of the important research and development topics and has become a goal that needs to be improved in the current related fields. Summary of the Invention

[0005] An object of the present invention is to provide a testing device for a packaged module and a manufacturing method thereof, so as to solve the difficulties mentioned in the prior art.

[0006] One embodiment of the present invention provides a test device for a packaging module. The test device includes a circuit board, a socket, and a conductive pad. The circuit board has a plurality of contacts. The socket is located on the circuit board, and the socket has a receiving groove. The conductive pad includes a three-dimensional stepped structure and a plurality of elastic conductive pillars. The three-dimensional stepped structure is located in the receiving groove and includes a plurality of annular steps. These annular steps are concentric rectangles arranged in sequence, and their heights change in sequence from the center point of the concentric rectangles toward the socket. These elastic conductive pillars are distributed at intervals on these annular steps. Each elastic conductive pillar is inserted into the three-dimensional stepped structure and electrically contacts one of the contacts and the packaging module respectively.

[0007] According to one or more embodiments of the present invention, in the above-mentioned testing device for the package module, the three-dimensional step structure is in a raised shape, and the heights of the annular steps decrease sequentially from the center point toward the socket.

[0008] According to one or more embodiments of the present invention, in the above-mentioned testing device for the package module, the three-dimensional step structure is concave, and the heights of the annular steps increase sequentially from the center point toward the socket.

[0009] According to one or more embodiments of the present invention, in the above-mentioned testing device for the package module, the bottom of the three-dimensional step structure facing away from the annular steps is a plane facing the circuit board.

[0010] According to one or more embodiments of the present invention, in the above-mentioned testing device for the packaging module, one end of each elastic conductive column extends out from the bottom of the three-dimensional stepped structure and electrically contacts one of the contacts, and the end surface of the other end is flush with the surface of the three-dimensional stepped structure to contact a solder ball of the packaging module.

[0011] According to one or more embodiments of the present invention, in the aforementioned packaging module testing device, the conductive pad includes an insulating body and an internal support. The insulating body has a plurality of first through-holes spaced apart from each other. The internal support is embedded in the insulating body and has a plurality of second through-holes spaced apart from each other. Each second through-hole is coaxially aligned and connected to one of the first through-holes. Each elastic conductive post is located within one of the first through-holes and one of the second through-holes.

[0012] According to one or more embodiments of the present invention, in the above-mentioned packaging module testing device, the three-dimensional stepped structure includes a first rectangular block, a second rectangular block, and a third rectangular block. The first rectangular block has a first opening, the second rectangular block has a second opening, a portion of the second rectangular block is embedded in the first opening, and a portion of the third rectangular block is embedded in the second opening. The area of ​​the first rectangular block is equal to the area of ​​the accommodating groove, the area of ​​the second rectangular block is smaller than the area of ​​the first rectangular block, larger than the area of ​​the third rectangular block, and equal to the area of ​​the first opening, the area of ​​the third rectangular block is equal to the area of ​​the second opening, and the height of the second rectangular block is greater than the height of the first rectangular block and smaller than the height of the third rectangular block.

[0013] According to one or more embodiments of the present invention, in the aforementioned package module testing device, the elastic conductive posts include at least one first elastic conductive post, at least one second elastic conductive post, and at least one third elastic conductive post. The first, second, and third elastic conductive posts are arranged sequentially from the socket toward the center, with the first elastic conductive post located at the outermost edge of the annular steps, and the third elastic conductive post located at the innermost edge of the annular steps. The length of the second elastic conductive post is between the lengths of the first and third elastic conductive posts.

[0014] According to one or more embodiments of the present invention, in the aforementioned testing device for the package module, each elastic conductive column includes a soft column and a plurality of conductive particles, and the conductive particles are spaced apart and distributed within the soft column.

[0015] One embodiment of the present invention provides a method for manufacturing a test device. This manufacturing method includes the following steps. Provide a circuit board, a socket, a first rectangular block, a second rectangular block, and a third rectangular block, wherein the height of the second rectangular block is between the height of the first rectangular block and the height of the third rectangular block. Fix the socket on the circuit board so that the socket surrounds multiple contacts of the circuit board. Place the first rectangular block into a receiving groove of the socket so that the multiple first elastic conductive pillars in the first rectangular block can respectively contact a portion of these contacts. Place the second rectangular block into a first opening of the first rectangular block so that the multiple second elastic conductive pillars in the second rectangular block can respectively contact another portion of these contacts. Place the third rectangular block into the second opening of the second rectangular block so that the multiple third elastic conductive pillars in the third rectangular block can respectively contact another portion of these contacts. In this way, the first rectangular block, the second rectangular block, and the third rectangular block together form a three-dimensional staircase structure including multiple annular steps.

[0016] Thus, through the above structure, the present disclosure can adapt to the warped shape of the object under test, reduce the chance of poor connection performance between the elastic conductive pillars and the solder balls of the object under test, and thus provide accurate test results.

[0017] The above description is only used to illustrate the problems to be solved by the present invention, the technical means to solve the problems, and the effects produced, etc. The specific details of the present invention will be introduced in detail in the following embodiments and related drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] To make the above and other objects, features, advantages and embodiments of the present invention more apparent, the accompanying drawings are described as follows:

[0019] Figure 1 A perspective view of a testing device according to an embodiment of the present invention;

[0020] Figure 2 for Figure 1 A top view of the test device;

[0021] Figure 3 for Figure 2 A cross-sectional view taken along line segment AA;

[0022] Figure 4 for Figure 1 An exploded view of a test device and a first packaging module;

[0023] Figure 5 is an exploded view of a testing device and a second packaging module according to an embodiment of the present invention;

[0024] Figure 6 An exploded view of a conductive pad of a testing device according to an embodiment of the present invention;

[0025] Figure 7 is a cross-sectional view of a conductive pad of a testing device according to an embodiment of the present invention;

[0026] Figure 8 is a flow chart of a method for manufacturing a testing device according to an embodiment of the present invention;

[0027] Figure 9A and Figure 9B They are Figure 8 Schematic diagram of the top view and cross-sectional view of step 801;

[0028] Figure 10A and Figure 10B They are Figure 8 A schematic diagram of the top view and the cross-sectional view of step 802;

[0029] Figure 11A and Figure 11B They are Figure 8 Exploded views of step 803 from top and cross-sectional directions; and

[0030] Figure 12A and Figure 12B They are Figure 8 Exploded view of step 804 in top and cross-sectional directions.

[0031]

Explanation of symbols

[0032] 10,11: Test equipment

[0033] 100: Circuit board

[0034] 101: Back

[0035] 102: Top

[0036] 110:Contact

[0037] 110A: Contact of the first part

[0038] 110B: Contact of the second part

[0039] 110C: The third part of the connection

[0040] 200: socket

[0041] 210: accommodating tank

[0042] 300, 301, 302: Conductive pads

[0043] 310, 390: three-dimensional stepped structure

[0044] 311: First Step

[0045] 312: The Second Step

[0046] 313: The third step

[0047] 314: bottom

[0048] 320: first rectangular block

[0049] 321: First Opening

[0050] 330: Second rectangular block

[0051] 331: Second opening

[0052] 340: The third rectangular block

[0053] 350: Insulation body

[0054] 351: The First Guankou

[0055] 360: Internal bracket

[0056] 361: The Second Guankou

[0057] 370: Elastic conductive column

[0058] 370A: First end

[0059] 370B: Second end

[0060] 371: first elastic conductive column

[0061] 372: Second elastic conductive column

[0062] 373: The third elastic conductive column

[0063] 381:Soft cylinder

[0064] 382: Conductive particles

[0065] 400: first packaging module

[0066] 410: Solder ball

[0067] 500: Second packaging module

[0068] 510: Solder ball

[0069] 801~805: Steps

[0070] AA: Line segment

[0071] C: Center point

[0072] H1,H2,H3:Height

[0073] L1, L2, L3, L4, L5, L6: Length

[0074] X, Y, Z: axis DETAILED DESCRIPTION

[0075] The following drawings illustrate various embodiments of the present invention. For clarity, many practical details are included in the following description. However, it should be understood that these practical details are not intended to limit the present invention. In other words, these practical details are not essential to the various embodiments of the present invention. Furthermore, to simplify the drawings, some commonly used structures and components are depicted in simplified schematic form.

[0076] Figure 1 FIG. 1 is a perspective view of a testing device 10 according to an embodiment of the present invention. Figure 2 for Figure 1 FIG. 1 is a top view of the test device 10 . Figure 3 for Figure 2 The cross-sectional view made along line segment AA. Figures 1 to 3 As shown in this embodiment, the test device 10 includes a circuit board 100, a socket 200 and a conductive pad 300. The circuit board 100 has a plurality of contacts 110 ( Figure 3 ). In this embodiment, the circuit board 100 is a rectangular plate having a back surface 101 and a top surface 102 opposite to each other. These contacts 110 are distributed at intervals on the top surface 102 of the circuit board 100. Furthermore, these contacts 110 are arranged on the top surface 102 of the circuit board 100 in an array manner, however, the present invention is not limited to this. The conductive pad 300 includes a three-dimensional stepped structure 310 and a plurality of elastic conductive columns 370. The three-dimensional stepped structure 310 is located on the top surface 102 of the circuit board 100 and is matchedly embedded in the receiving groove 210 of the socket 200. The three-dimensional stepped structure 310 has a pyramid or trapezoidal shape, and the three-dimensional stepped structure 310 includes a plurality of annular steps (for example, the first step 311 to the third step 313). These annular steps are concentric rectangles arranged in sequence. The innermost annular step (e.g., the third step 313) has a center point C. These annular steps (e.g., the first step 311 to the third step 313) all surround the center point C, and these annular steps sequentially change their height from the center point C toward the socket 200 (e.g., the outside of the conductive pad 300). The three-dimensional step structure 310 includes a soft material such as silicone or rubber, however, the present invention is not limited to this. These elastic conductive pillars 370 are distributed at intervals on these annular steps (e.g., the first step 311 to the third step 313). In other words, each annular step (e.g., the first step 311 to the third step 313) is configured with a plurality of elastic conductive pillars 370, and these elastic conductive pillars 370 are symmetrically distributed on these annular steps (e.g., the first step 311 to the third step 313).

[0077] More specifically, in this embodiment, the distribution of these elastic conductive pillars 370 is similar to the distribution of the aforementioned contacts 110 on the circuit board 100. Each elastic conductive pillar 370 (e.g., the first elastic conductive pillar 371, the second elastic conductive pillar 372, and the third elastic conductive pillar 373) is inserted into the three-dimensional stepped structure 310. Each elastic conductive pillar 370 extends along a longitudinal axis (e.g., the Z-axis) and has a first end 370A and a second end 370B opposite each other. The first end 370A of the elastic conductive pillar 370 extends out of the side of the three-dimensional stepped structure 310 facing away from the annular steps (hereinafter referred to as the bottom 314) and directly contacts or at least electrically contacts one of the contacts 110 on the circuit board 100. The end surface of the second end 370B is flush with the surface of the three-dimensional stepped structure 310 (e.g., the first step 311 to the third step 313).

[0078] More specifically, in this embodiment, the three-dimensional stepped structure 310 is convex. The annular steps (e.g., the first step 311 through the third step 313) decrease in height from the center point C toward the socket 200 (i.e., the outside of the conductive pad 300). Furthermore, the annular steps (e.g., the first step 311 through the third step 313) are located only on the side of the three-dimensional stepped structure 310 facing away from the circuit board 100. However, the present invention is not limited thereto. The bottom 314 of the three-dimensional stepped structure 310, facing away from the annular steps, is a flat surface facing the circuit board 100 and is intended to be placed on the top surface 102 of the circuit board 100.

[0079] For example, the annular steps are sequentially referred to as the third step 313 (i.e., the innermost step), the second step 312, and the first step 311 (i.e., the outermost step) from the center point C toward the socket 200 (i.e., the outside of the conductive pad 300). The elastic conductive posts 370 include one or more first elastic conductive posts 371, one or more second elastic conductive posts 372, and one or more third elastic conductive posts 373. The first elastic conductive posts 371, the second elastic conductive posts 372, and the third elastic conductive posts 373 are arranged sequentially from the socket 200 (i.e., the outside of the conductive pad 300) toward the center point C. In other words, the first elastic conductive posts 371 are distributed on the first step 311, and the third elastic conductive posts 373 are distributed on the third step 313. The length L2 of the second elastic conductive posts 372 is greater than the length L1 of the first elastic conductive posts 371 and less than the length L3 of the third elastic conductive posts 373.

[0080] Furthermore, in this embodiment, each elastic conductive column 370 includes a flexible column 381 and a plurality of conductive particles 382. These conductive particles 382 are prefabricated within the flexible column 381 and are spaced apart within the flexible column 381. The flexible column 381 may comprise a flexible material such as silicone or rubber. The conductive particles 382 may comprise a metal such as copper or aluminum. However, the present invention is not limited thereto.

[0081] Figure 4 for Figure 1 The exploded view of the test device 10 and the first packaging module 400 is shown. Figure 4 As shown, the testing device 10 of this embodiment is suitable for a first package module 400 having a warped cross-section (i.e., a weeping curve). Therefore, when a user places the first package module 400 into the receiving slot 210 of the socket 200, the annular steps (e.g., the first step 311 to the third step 313) of the three-dimensional stepped structure 310 can respectively match the warped shape of the first package module 400, thereby docking with the first package module 400, allowing the plurality of solder balls 410 of the first package module 400 to directly contact the second ends 370B of the elastic conductive pillars 370.

[0082] Next, when the first packaging module 400 begins to vertically press down on the three-dimensional stepped structure 310, such that the bottom 314 of the three-dimensional stepped structure 310 faces the top surface 102 of the circuit board 100, due to the flexibility of the three-dimensional stepped structure 310 and the flexible pillars 381, the compression causes the conductive particles 382 within each flexible pillar 381 to approach each other and begin to electrically connect, thereby achieving electrical continuity between the first packaging module 400 and the circuit board 100. This reduces the chance of poor connection performance between the elastic conductive pillars 370 and the solder balls 410 of the first packaging module 400, thereby providing accurate test results. Furthermore, because the bottom 314 of the three-dimensional stepped structure 310 is planar, the force applied by the first end 370A of the elastic conductive pillar 370 to each contact 110 is more uniform, preventing displacement.

[0083] Figure 5 FIG. 1 is an exploded view of a testing device 11 and a second packaging module 500 according to an embodiment of the present invention. Figure 5As shown, the test device 11 of this embodiment is substantially similar to the test device 10 described above, with the difference being that the test device 11 of this embodiment is suitable for use with a second package module 500 having a curved cross-section (i.e., a smiling curve). In this embodiment, the three-dimensional stepped structure 390 is concave, and the annular steps (e.g., the first step 311A, the second step 313B, and the third step 313A) increase in height sequentially from the center point C toward the socket 200. More specifically, the length L5 of the second elastic conductive pillar 372 is greater than the length L4 of the first elastic conductive pillar 371 and less than the length L6 of the third elastic conductive pillar 373.

[0084] In this way, when the user places the second packaging module 500 into the accommodating groove 210 of the socket 200, the annular steps of the three-dimensional step structure 390 (for example, the first step 311 to the third step 313) can respectively match the warped shape of the second packaging module 500, thereby docking with the second packaging module 500, so that the several solder balls 510 of the second packaging module 500 directly contact the second ends 370B of the above-mentioned elastic conductive pillars 370 one by one.

[0085] Figure 6 This is an exploded view of conductive pads 301 of a test device according to an embodiment of the present invention. This embodiment is substantially similar to the test device 10 described above, differing in that conductive pads 301 are not integrally formed but are assembled sequentially. This allows for the provision of corresponding components to accommodate varying package module sizes and curvature requirements.

[0086] For example, if Figure 6 As shown, the three-dimensional stepped structure 310 includes a first rectangular block 320, a second rectangular block 330, and a third rectangular block 340. The first rectangular block 320 has a first opening 321, which is located, for example, at the centroid of the first rectangular block 320. First elastic conductive pillars 371 are embedded in and arranged on the first rectangular block 320, and spaced apart around the first opening 321. A portion of the second rectangular block 330 is inserted into the first opening 321, while the remaining portion extends outside the first opening 321. The second rectangular block 330 has a second opening 331, which is located, for example, at the centroid of the second rectangular block 330. Second elastic conductive pillars 372 are embedded in and arranged on the second rectangular block 330, and spaced apart around the second opening 331. A portion of the third rectangular block 340 is inserted into the second opening 331, while the remaining portion extends outside the second opening 331. Third elastic conductive pillars 373 are embedded in and arranged on the third rectangular block 340.

[0087] Please refer to Figure 3 and Figure 6As shown, the first rectangular block 320 is removably placed in the receiving groove 210 of the socket 200 and placed on the top surface 102 of the circuit board 100 (refer to Figure 3 ), and the first rectangular block 320 located in the receiving groove 210 is in direct contact with or at least quite close to the socket 200 (reference Figure 3 ). More specifically, the area of ​​the first rectangular block 320 is equal to the area of ​​the receiving groove 210 (refer to Figure 3 ), the area of ​​the second rectangular block 330 is smaller than the area of ​​the first rectangular block 320, larger than the area of ​​the third rectangular block 340, and equal to or approximately equal to the area of ​​the first opening 321, the area of ​​the third rectangular block 340 is equal to the area of ​​the second opening 331, and the height H2 of the second rectangular block 330 is larger than the height H1 of the first rectangular block 320, and smaller than the height H3 of the third rectangular block 340, however, the present invention is not limited thereto.

[0088] Figure 7 FIG. 1 is a cross-sectional view of a conductive pad 302 of a test device according to an embodiment of the present invention. Figure 7 As shown, the conductive pad 302 of this embodiment is substantially the same as the conductive pad 300 described above, except that the conductive pad 302 includes an insulating body 350 and an internal support 360. The insulating body 350 has a plurality of first through-holes 351 spaced apart. These first through-holes 351 are spaced apart along the plane direction of the XY axis. The internal support 360 is embedded in the insulating body 350 to support the accommodating groove 210 ( Figure 3 ) inside the conductive pad 302. The internal bracket 360 has a plurality of second through-holes 361 spaced apart. The second through-holes 361 are spaced apart along the plane direction of the XY axis. Each second through-hole 361 is coaxially aligned and connected to one of the first through-holes 351, and each elastic conductive column 370 is located in one of the first through-holes 351 and one of the second through-holes 361. For example, the material of the internal bracket 360 is an insulating hard material (such as wood or plastic). It should be understood that this embodiment mainly describes its internal features, and the three-dimensional stepped structure on its surface is not illustrated here.

[0089] Figure 8 FIG. 1 is a flow chart of a method for manufacturing a test device according to an embodiment of the present invention. Figure 8As shown, in this embodiment, the manufacturing method of the test device includes steps 801 to 805 as follows. In step 801, a circuit board, a socket, a first rectangular block, a second rectangular block and a third rectangular block are provided. In step 802, the socket is fixed on the circuit board so that the socket surrounds a plurality of contacts on the circuit board. In step 803, the first rectangular block is placed into the socket so that the first elastic conductive pillars of the first rectangular block can respectively contact a portion of the contacts. In step 804, the second rectangular block is inserted into the first opening of the first rectangular block so that the second elastic conductive pillars of the second rectangular block can respectively contact another portion of the contacts. In step 805, the third rectangular block is inserted into the second opening of the second rectangular block so that the third elastic conductive pillars of the third rectangular block can respectively contact another portion of the contacts.

[0090] Figure 9A and Figure 9B They are Figure 8 Schematic diagram of the top view and cross-sectional view of step 801. More specifically, as Figure 9A and Figure 9B As shown, in step 801 , the contacts 110 of the circuit board 100 are arranged on the top surface 102 of the circuit board 100 in an array to match the distribution of the solder balls and the elastic conductive pillars of the package module.

[0091] It should be understood that the size, type, and function of the contacts 110 of the circuit board 100 are not significantly different. However, for ease of description, the contacts 110 of the circuit board 100 are divided into first, second, and third sections, 110A, 110B, and 110C, based on their locations. The contacts 110A of the first section surround the contacts 110B and 110C of the second section, and the contacts 110B of the second section surround the contacts 110C of the third section. It should be understood that the circuit board 100, socket 200, first rectangular block 320, second rectangular block 330, and third rectangular block 340 described herein are the same as those of the above embodiment and will not be further described herein.

[0092] Figure 10A and Figure 10B They are Figure 8 Schematic diagram of the top view and cross-sectional view of step 802. Figure 10A and Figure 10BAs shown, more specifically, in step 802, the socket 200 is fixed to the top surface 102 of the circuit board 100 so that the socket 200 surrounds all the contacts 110 of the circuit board 100 (i.e., the contacts 110A of the first portion, the contacts 110B of the second portion, and the contacts 110C of the third portion). That is, all the contacts 110 of the circuit board 100 (i.e., the contacts 110A of the first portion, the contacts 110B of the second portion, and the contacts 110C of the third portion) are located within the receiving groove 210 of the socket 200.

[0093] Figure 11A and Figure 11B They are Figure 8 The exploded view of the top view and the cross-sectional view of step 803 is shown. Figure 10A and Figure 11A As shown, more specifically, in step 803, the first rectangular block 320 is removably placed into the receiving groove 210 of the socket 200, so that the first rectangular block 320 contacts the socket 200, and the first elastic conductive pillars 371 respectively contact the contact points 110A ( Figure 11B In addition, the second portion of the contact 110B and the third portion of the contact 110C are all exposed from the first opening 321 of the first rectangular block 320 ( Figure 11A ).

[0094] Figure 12A and Figure 12B They are Figure 8 The exploded view of the top view and the cross-sectional view of step 804 is shown. Figure 11A and Figure 12A As shown, more specifically, in step 804, the second rectangular block 330 is removably inserted into the first opening 321 of the first rectangular block 320, so that the second rectangular block 330 directly contacts the first rectangular block 320, and the second elastic conductive pillars 372 of the second rectangular block 330 contact the second portion of the contact 110B one by one. In addition, the third portion of the contact 110C is fully exposed from the second opening 331 of the second rectangular block 330 ( Figure 12A It should be understood that the second rectangular block 330 can be fixed to the first rectangular block 320 by adhesive when necessary.

[0095] like Figure 12A and Figure 12B As shown, more specifically, in step 805, the third rectangular block 340 is removably inserted into the second opening 331 of the second rectangular block 330, so that the third elastic conductive pillars 373 of the third rectangular block 340 are respectively in contact with the contact points 110C of the third portion ( Figure 3 It should be understood that the third rectangular block 340 can be fixed to the second rectangular block 330 by adhesive when necessary.

[0096] Thus, through the above structure, the present disclosure can adapt to the warped shape of the object under test, reduce the chance of poor connection performance between the elastic conductive pillars and the solder balls of the object under test, and thus provide accurate test results.

[0097] Finally, the embodiments disclosed above are not intended to limit the present invention. Any skilled artisan may make various modifications and alterations without departing from the spirit and scope of the present invention, and all such modifications and alterations would be protected by the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A testing device for a packaged module, characterized in that: Include: a circuit board having a plurality of contacts; a socket located on the circuit board, and having a receiving groove; and A conductive pad comprising: a three-dimensional stepped structure located in the receiving groove, comprising a plurality of annular steps, wherein the plurality of annular steps are sequentially arranged concentric rectangles and their heights sequentially change from a center point of the concentric rectangles toward the socket; as well as A plurality of elastic conductive pillars are spaced and distributed on the plurality of annular steps. Each of the plurality of elastic conductive pillars is inserted into the three-dimensional step structure and electrically contacts one of the plurality of contacts and the packaging module respectively.

2. The packaging module testing device according to claim 1, wherein: The three-dimensional step structure is in a raised shape, and the heights of the plurality of annular steps decrease in sequence from the center point toward the socket.

3. The packaging module testing device according to claim 1, wherein: The three-dimensional stepped structure is concave, and the plurality of annular steps increase in height in sequence from the center point toward the socket.

4. The packaging module testing device according to claim 1, wherein: The bottom of the three-dimensional stepped structure facing away from the plurality of annular steps is a plane facing the circuit board.

5. The packaging module testing device according to claim 1, wherein: One end of each of the plurality of elastic conductive pillars extends out from the bottom of the three-dimensional stepped structure and electrically contacts one of the plurality of contacts, and the end surface of the other end is flush with the surface of the three-dimensional stepped structure for contacting a solder ball of the packaging module.

6. The packaging module testing device according to claim 1, wherein: The conductive pad includes: An insulating body having a plurality of first through-holes distributed at intervals; and An internal bracket is embedded in the insulating body and has a plurality of second through-holes distributed at intervals, and each of the plurality of second through-holes is coaxially aligned and connected to one of the plurality of first through-holes. Each of the plurality of elastic conductive pillars is located in one of the plurality of first through-holes and one of the plurality of second through-holes.

7. The packaging module testing device according to claim 1, wherein: The three-dimensional staircase structure includes a first rectangular block, a second rectangular block and a third rectangular block. The first rectangular block has a first opening, the second rectangular block has a second opening, a portion of the second rectangular block is embedded in the first opening, and a portion of the third rectangular block is embedded in the second opening. The area of ​​the first rectangular block is equal to the area of ​​the accommodating groove, the area of ​​the second rectangular block is smaller than the area of ​​the first rectangular block, larger than the area of ​​the third rectangular block, and equal to the area of ​​the first opening, the area of ​​the third rectangular block is equal to the area of ​​the second opening, and the height of the second rectangular block is greater than the height of the first rectangular block and smaller than the height of the third rectangular block.

8. The packaging module testing device according to claim 1, wherein: wherein the plurality of elastic conductive posts comprise at least one first elastic conductive post, at least one second elastic conductive post, and at least one third elastic conductive post, the first elastic conductive post, the second elastic conductive post, and the third elastic conductive post being arranged in sequence from the socket toward the center point, the first elastic conductive post being located at an outermost portion of the plurality of annular steps, and the third elastic conductive post being located at an innermost portion of the plurality of annular steps; The length of the second elastic conductive column is between the length of the first elastic conductive column and the length of the third elastic conductive column.

9. The packaging module testing device according to claim 1, wherein: Each of the plurality of elastic conductive columns comprises a soft column and a plurality of conductive particles, and the plurality of conductive particles are distributed in the soft column at intervals.

10. A method for manufacturing a testing device, characterized in that: Include: A circuit board, a socket, a first rectangular block, a second rectangular block, and a third rectangular block are provided, wherein the height of the second rectangular block is between the height of the first rectangular block and the height of the third rectangular block; Fixing the socket on the circuit board so that the socket surrounds a plurality of contacts of the circuit board; The first rectangular block is placed into a receiving groove of the socket, so that the first elastic conductive pillars in the first rectangular block can respectively contact a portion of the plurality of contacts; placing the second rectangular block into a first opening of the first rectangular block, so that the plurality of second elastic conductive pillars in the second rectangular block can respectively contact the plurality of contact points of another portion; as well as The third rectangular block is placed into a second opening of the second rectangular block, so that the third elastic conductive pillars in the third rectangular block can respectively contact another part of the plurality of contacts. The first rectangular block, the second rectangular block and the third rectangular block together form a three-dimensional staircase structure including a plurality of annular steps.

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