Mirror surface electronic device

Abstract

The mirror surface electronic device comprises a first substrate, a circuit layer, a plurality of electronic units, a second substrate, a reflection layer, a first light absorption layer and an adhesion layer. The circuit layer is disposed on the first substrate. The plurality of electronic units are arranged on the first substrate and electrically connected with the circuit layer. The second substrate is opposite to the first substrate and comprises a light-transmitting area and a light-reflecting area, the light-transmitting area is adjacent to the light-reflecting area, and the light-transmitting area overlaps the plurality of electronic units. The reflecting layer is arranged on the side, adjacent to the first substrate, of the second substrate and located in the light reflecting area. The first light absorbing layer is arranged on the side, away from the second substrate, of the reflecting layer. The adhesive layer is disposed between the first light absorbing layer and the plurality of electronic units. In a sectional view of the mirror surface electronic device, the width of the first light absorbing layer is smaller than or equal to that of the reflecting layer, and the width of the first light absorbing layer is larger than or equal to 50% of that of the reflecting layer. The mirror surface electronic device provided by the invention can improve the quality of a displayed picture.

Description

Technical Field

[0001] The present disclosure relates to a mirror electronic device, and more particularly to a mirror electronic device applied to an electronic device. Background Art

[0002] In conventional mirror-surface electronic devices, to increase reflectivity when not in use, a multilayer film with high reflectivity is attached to the outer surface of the substrate of the mirror-surface electronic device. However, the presence of such a multilayer film can affect the light emitted by the electronic units within the mirror-surface electronic device, resulting in relatively poor light extraction efficiency and image quality. Summary of the Invention

[0003] Some embodiments of the present disclosure are directed to a mirror electronic device that can improve the quality of displayed images.

[0004] According to some embodiments of the present disclosure, a mirror electronic device is provided, which includes a first substrate, a circuit layer, a plurality of electronic units, a second substrate, a reflective layer, a first light absorbing layer and an adhesive layer. The circuit layer is arranged on the first substrate. A plurality of electronic units are arranged on the first substrate and are electrically connected to the circuit layer. The second substrate is relative to the first substrate and includes a light-transmitting area and a light-reflecting area, wherein the light-transmitting area is adjacent to the light-reflecting area, and the light-transmitting area overlaps a plurality of electronic units. The reflective layer is arranged on a side of the second substrate adjacent to the first substrate and is located in the light-reflecting area. The first light absorbing layer is arranged on a side of the reflective layer away from the second substrate. The adhesive layer is arranged between the first light absorbing layer and the plurality of electronic units. In the cross-sectional view of the mirror electronic device, the width of the first light absorbing layer is less than or equal to the width of the reflective layer, and the width of the first light absorbing layer is greater than or equal to 50% of the width of the reflective layer.

[0005] Based on this, the mirror electronic device provided by the present disclosure defines a light-transmitting area and a light-reflecting area through the setting of a reflective layer. Through the above design, the setting of the reflective layer can reduce the possibility of affecting the light emitted by multiple electronic units in the mirror electronic device, thereby increasing the light extraction efficiency of the mirror electronic device when it is in the turned-on state and improving the quality of its display image.

[0006] In order to make the above features and advantages of the present disclosure more clearly understood, embodiments are given below with reference to the accompanying drawings for detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1A is a partial cross-sectional schematic diagram of the mirror electronic device according to the first embodiment of the present disclosure;

[0008] Figure 1B is a partial cross-sectional schematic diagram of a mirror electronic device according to a second embodiment of the present disclosure;

[0009] Figure 1C is a partial cross-sectional schematic diagram of a mirror electronic device according to a third embodiment of the present disclosure;

[0010] Figure 1D is a partial cross-sectional schematic diagram of a mirror electronic device according to a fourth embodiment of the present disclosure;

[0011] Figure 1E is a partial cross-sectional schematic diagram of a mirror electronic device according to a fifth embodiment of the present disclosure;

[0012] Figure 1F is a partial cross-sectional schematic diagram of a mirror electronic device according to a sixth embodiment of the present disclosure;

[0013] Figure 1G is a partial cross-sectional schematic diagram of a mirror electronic device according to a seventh embodiment of the present disclosure;

[0014] Figure 1H is a partial cross-sectional schematic diagram of a mirror electronic device according to an eighth embodiment of the present disclosure;

[0015] Figure 1I is a partial cross-sectional schematic diagram of a mirror electronic device according to a ninth embodiment of the present disclosure;

[0016] Figure 1J is a partial cross-sectional schematic diagram of a mirror electronic device according to a tenth embodiment of the present disclosure;

[0017] Figure 1K is a partial cross-sectional schematic diagram of the mirror electronic device according to the eleventh embodiment of the present disclosure;

[0018] Figure 1L is a partial cross-sectional schematic diagram of a mirror electronic device according to a twelfth embodiment of the present disclosure;

[0019] Figure 1M is a partial cross-sectional schematic diagram of a mirror electronic device according to a thirteenth embodiment of the present disclosure;

[0020] Figure 1N is a partial cross-sectional schematic diagram of a mirror electronic device according to a fourteenth embodiment of the present disclosure;

[0021] Figure 1O is a partial cross-sectional schematic diagram of a mirror electronic device according to a fifteenth embodiment of the present disclosure;

[0022] Figure 1P is a partial cross-sectional schematic diagram of a mirror electronic device according to a sixteenth embodiment of the present disclosure;

[0023] Figure 1Q is a partial cross-sectional schematic diagram of a mirror electronic device according to a seventeenth embodiment of the present disclosure;

[0024] Figure 1R is a partial cross-sectional schematic diagram of a mirror electronic device according to an eighteenth embodiment of the present disclosure;

[0025] Figure 1S is a partial cross-sectional schematic diagram of a mirror electronic device according to a nineteenth embodiment of the present disclosure;

[0026] Figure 1T is a partial cross-sectional schematic diagram of a mirror electronic device according to the twentieth embodiment of the present disclosure;

[0027] Figure 1U is a partial cross-sectional schematic diagram of a mirror electronic device according to the twenty-first embodiment of the present disclosure;

[0028] Figure 1V FIG2 is a partial cross-sectional schematic diagram of a mirror electronic device according to the twenty-second embodiment of the present disclosure. DETAILED DESCRIPTION

[0029] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0030] The present disclosure will be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that, for ease of understanding and simplicity, many of the drawings in this disclosure depict only portions of electronic devices, and certain components in the drawings are not drawn to scale. Furthermore, the number and dimensions of components in the drawings are for illustrative purposes only and are not intended to limit the scope of this disclosure.

[0031] Throughout this disclosure and the claims that follow, certain words will be used to refer to specific components. It will be understood by those skilled in the art that electronic device manufacturers may refer to the same components by different names. This document does not intend to distinguish between components that have the same function but different names. In the following description and claims, words such as "include," "contain," and "have" are open-ended words and should therefore be interpreted as meaning "including but not limited to..." Therefore, when the terms "include," "contain," and / or "have" are used in the description of this disclosure, they specify the presence of corresponding features, regions, steps, operations, and / or components, but do not exclude the presence of one or more corresponding features, regions, steps, operations, and / or components.

[0032] Directional terms used herein, such as "up," "down," "front," "back," "left," "right," etc., are used only with reference to the directions in the accompanying drawings. Therefore, the directional terms used are for illustrative purposes only and are not intended to limit the present disclosure. In the accompanying drawings, each figure illustrates the general characteristics of the methods, structures, and / or materials used in particular embodiments. However, these figures should not be construed as defining or limiting the scope or nature of the embodiments. For example, the relative sizes, thicknesses, and positions of various layers, regions, and / or structures may be reduced or exaggerated for clarity.

[0033] When a component (e.g., a layer or region) is referred to as being "on another component," it can be directly on the other component, or other components may be present between the two components. On the other hand, when a component is referred to as being "directly on another component," no components are present between the two components unless otherwise specified in the specification. Furthermore, when a component is referred to as being "on another component," the two components have a top-to-bottom relationship in a plan view, and the component may be above or below the other component, depending on the orientation of the device.

[0034] The terms "equal to" or "same as," "substantially" or "approximately" are generally interpreted as within 20% of a given value or range, or within 10%, 5%, 3%, 2%, 1% or 0.5% of a given value or range.

[0035] The use of ordinal numbers such as "first" and "second" in the specification and claims to modify an element does not, by itself, imply or indicate any prior ordinal number of the element(s), nor does it indicate the order of one element relative to another, or the order of manufacturing methods. Such ordinal numbers are used solely to clearly distinguish one element from another with the same name. The claims and the specification may not use the same terminology; thus, the first element in the specification may be the second element in the claim.

[0036] It should be noted that the following embodiments may be implemented by replacing, recombining, or combining features from several different embodiments to create other embodiments without departing from the spirit of the present disclosure. Features from various embodiments may be mixed and matched as long as they do not violate the spirit of the invention or conflict with each other.

[0037] The electrical connections or electrical connections described in this disclosure may refer to direct connections or indirect connections. In the case of direct connections, the endpoints of two circuit components are directly connected or connected to each other by a conductor segment. In the case of indirect connections, there is a switch, diode, capacitor, inductor, other suitable components, or a combination of the above components between the endpoints of the two circuit components, but it is not limited to these.

[0038] In this disclosure, thickness, length, width, and area can be measured using an optical microscope, while thickness can be measured using cross-sectional images obtained through an electron microscope, but this is not a limitation. Furthermore, any two values ​​or directions used for comparison may have a certain degree of error. If a first value is equal to a second value, this implies that there may be an error of approximately 10% between the first and second values. If a first direction is perpendicular to a second direction, the angle between the first and second directions may be between 80 and 100 degrees. If the first direction is parallel to the second direction, the angle between the first and second directions may be between 0 and 10 degrees.

[0039] The electronic device described in the present disclosure can be applied to a display device, a light-emitting device, a backlight device, an antenna device, a sensing device or a splicing device, or a temporary substrate for assisting electronic units to be placed at a specific spacing, but is not limited thereto. The electronic device can be a bendable or flexible electronic device. The display device can be a non-self-luminous display device or a self-luminous display device. The antenna device can be a liquid crystal antenna device or a non-liquid crystal antenna device, and the sensing device can be a sensing device for sensing capacitance, light, heat or ultrasound, but is not limited thereto. The electronic device can include electronic units such as passive components and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. The diode can include a light-emitting diode or a photodiode. The light-emitting diode (LED) can include, for example, an organic light-emitting diode (OLED), a sub-millimeter light-emitting diode (mini LED), a micro LED or a quantum dot light-emitting diode (quantum dot LED), but is not limited thereto. The splicing device can be, for example, a display splicing device or an antenna splicing device, but is not limited thereto. It should be noted that the electronic device can be any of the aforementioned arrangements and combinations, but is not limited thereto. In addition, the shape of the electronic device can be rectangular, circular, polygonal, a shape with curved edges, or other suitable shapes.

[0040] Figure 1A FIG. 1 is a partial cross-sectional diagram of the mirror electronic device according to the first embodiment of the present disclosure.

[0041] Please refer to Figure 1A In this embodiment, the mirror electronic device 10a includes a substrate SB1, a circuit layer CL, a plurality of electronic units EU, a substrate SB2, a reflective layer 100a, and an adhesive layer AL.

[0042] The substrate SB1, for example, has a first surface SB1_S1 and a second surface SB1_S2 opposite the first surface SB1_S1. In some embodiments, the material of the substrate SB1 may include glass, plastic, or a combination thereof. For example, the material of the substrate SB1 may include quartz, sapphire, silicon (Si), germanium (Ge), silicon carbide (SiC), gallium nitride (GaN), silicon germanium (SiGe), polymethyl methacrylate (PMMA), polycarbonate (PC), polyimide (PI), polyethylene terephthalate (PET), or other suitable materials or combinations thereof. In the present embodiment, the material of the substrate SB1 is glass, but the present disclosure is not limited thereto.

[0043] The circuit layer CL is disposed on the first surface SB1_S1 of the substrate SB1. In some embodiments, the circuit layer CL may include a plurality of transistors (not shown), a plurality of conductive lines (not shown), and a plurality of insulating layers (not shown), but the disclosure is not limited thereto.

[0044] The plurality of electronic units EU are, for example, disposed on the first surface SB1_S1 of the substrate SB1 and are electrically connected to the circuit layer CL. In some embodiments, the plurality of electronic units EU can be disposed on the substrate SB1 by mass transfer, but the present disclosure is not limited thereto. Any of the plurality of electronic units EU can, for example, emit light of various suitable colors (e.g., red, green, and blue) or UV light, but the present disclosure is not limited thereto. In some embodiments, the plurality of electronic units EU can include self-luminous materials. For example, in the present embodiment, the plurality of electronic units EU can be light-emitting diodes (LEDs), such as organic light-emitting diodes (LEDs), micro LEDs, sub-millimeter LEDs (mini LEDs), quantum dot (QD) LEDs, or a combination thereof, but the present disclosure is not limited thereto. In some embodiments, the plurality of electronic units EU can include a red light-emitting unit EU1, a green light-emitting unit EU2, and a blue light-emitting unit EU3. That is, the red light-emitting unit EU1, the green light-emitting unit EU2, and the blue light-emitting unit EU3 can respectively emit red light, green light, and blue light. However, the present disclosure is not limited thereto. In other embodiments, each of the plurality of electronic units EU may emit blue light or ultraviolet light.

[0045] The substrate SB2, for example, has a first surface SB2_S1 and a second surface SB2_S2 opposite the first surface SB2_S1. In this embodiment, the substrate SB2 is opposite to the substrate SB1. Specifically, the first surface SB2_S1 of the substrate SB2 faces the first surface SB1_S1 of the substrate SB1. In this embodiment, the substrate SB2 includes a light-transmitting region R1 and a light-reflecting region R2. The light-transmitting region R1 is, for example, adjacent to the light-reflecting region R2, and the light-transmitting region R1 overlaps with a plurality of electronic units EU. The description of the light-transmitting region R1 and the light-reflecting region R2 will be described in detail in the following embodiments and will not be repeated here.

[0046] The material of the substrate SB2 may be the same as or similar to that of the substrate SB1 . Therefore, the remaining technical contents of the substrate SB2 may refer to the description of the substrate SB1 in the aforementioned embodiment and will not be repeated here.

[0047] The reflective layer 100a is, for example, disposed on a side of the substrate SB1 adjacent to the substrate SB2, and is, for example, located in the reflective region R2. In this embodiment, the reflective layer 100a is disposed on the first surface SB1_S1 of the substrate SB1 and between adjacent electronic units EU. Specifically, the reflective layer 100a can be used to define, for example, a translucent region R1 and a reflective region R2 of the substrate SB2, wherein the translucent region R1 is an area where the reflective layer 100a is not disposed, and the reflective region R2 is an area where the reflective layer 100a is disposed. From another perspective, the translucent region R1 of the substrate SB2 overlaps with multiple electronic units EU in the top-view direction z of the mirror electronic device 10a, and the reflective region R2 of the substrate SB2 does not overlap with multiple electronic units EU in the top-view direction z of the mirror electronic device 10a. In this embodiment, the material of the reflective layer 100a includes a metal material with high reflectivity. For example, the material of the reflective layer 100a may include aluminum (Al), molybdenum (Mo), chromium (Cr), silver (Ag), iron (Fe), gold (Au), nickel (Ni), other suitable metal materials, or alloys thereof, but the present disclosure is not limited thereto. In some embodiments, the reflective layer 100a includes a single metal layer or a stack of multiple metal layers. For example, the reflective layer 100a may be a stack of silver and aluminum, but the present disclosure is not limited thereto.

[0048] An adhesive layer AL is, for example, disposed between substrates SB1 and SB2 to bond substrates SB1 and SB2 to each other. The adhesive layer AL may comprise, for example, an optically clear resin (OCR) or an optically clear adhesive (OCA). For example, the adhesive layer AL may be made of acrylic resin, silicone resin, epoxy resin, or other suitable materials, or combinations thereof, but the present disclosure is not limited thereto. In other embodiments, the mirror electronic device 10a may not include the adhesive layer AL. In other words, an air gap may be formed between substrates SB1 and SB2.

[0049] In this embodiment, the mirror electronic device 10a further includes a passivation layer PAS. The passivation layer PAS is disposed, for example, between the reflective layer 100a and the circuit layer CL in a top-view direction z of the mirror electronic device 10a to provide electrical insulation between the reflective layer 100a and the circuit layer CL. In some embodiments, the passivation layer PAS may be made of an inorganic material (e.g., silicon oxide, silicon nitride, silicon oxynitride, or a stacked layer of at least two of these materials), but the present disclosure is not limited thereto.

[0050] Based on the above, in this embodiment, when viewed from above along the direction z of the mirror-surface electronic device 10a, the light-transmitting region R1 of the substrate SB2 overlaps with the multiple electronic units EU, while the light-reflecting region R2 of the substrate SB2 does not overlap with the multiple electronic units EU. This design improves the reflectivity of the mirror-surface electronic device 10a and reduces the likelihood of light being affected by the multiple electronic units EU, thereby increasing the light extraction efficiency of the mirror-surface electronic device 10a of this embodiment.

[0051] Figure 1B This is a partial cross-sectional diagram of the mirror electronic device of the second embodiment of the present disclosure. It should be noted that, Figure 1B The embodiments can be used Figure 1A The component numbers and partial contents of the embodiments are the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0052] Please refer to Figure 1B The main difference between the mirror electronic device 10b of this embodiment and the mirror electronic device 10a is that the material of the reflective layer 100b includes a stack of multiple high-refractive-index layers and low-refractive-index layers.

[0053] In detail, in the present embodiment, the reflective layer 100b may be a laminate, wherein the laminate may, for example, include alternately stacked high refractive index layers (not shown) and low refractive index layers (not shown). In some embodiments, the total number of the plurality of high refractive index layers and the plurality of low refractive index layers may be greater than or equal to 6. For example, the reflective layer 100b may include six layers of film in which the high refractive index layers and the low refractive index layers overlap with each other; or the reflective layer 100b may, for example, include ten layers of film in which the high refractive index layers and the low refractive index layers overlap with each other, but the present disclosure is not limited thereto. In some embodiments, the high refractive index layer may, for example, have a refractive index between 2.0 and 2.5, and may include silicon nitride (SiN x ), niobium oxide (Nb2O5), titanium oxide (TiO2), tantalum oxide (Ta2O5), or other suitable materials. The low refractive index layer may, for example, have a refractive index between 1.0 and 1.5 and may include silicon dioxide (SiO2), magnesium fluoride (MgF2), calcium fluoride (CaF2), or other suitable materials. In some embodiments, the thickness of a single high refractive index layer or low refractive index layer may be between 10 nm and 500 nm, but the present disclosure is not limited thereto.

[0054] Figure 1C This is a partial cross-sectional diagram of the mirror electronic device of the third embodiment of the present disclosure. It should be noted that, Figure 1C The embodiments can be used Figure 1A The component numbers and partial contents of the embodiments are the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0055] Please refer to Figure 1C The main difference between the mirror electronic device 10c of this embodiment and the mirror electronic device 10a is that the reflective layer 100c is disposed on the first surface SB2_S1 of the substrate SB2.

[0056] Figure 1D This is a partial cross-sectional view of the mirror electronic device of the fourth embodiment of the present disclosure. Figure 1D The embodiments can be used Figure 1C The component numbers and partial contents of the embodiments are the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0057] Please refer to Figure 1D The main difference between the mirror electronic device 10d and the mirror electronic device 10c of this embodiment is that the mirror electronic device 10d further includes a light absorbing layer 200a.

[0058] The light absorbing layer 200a is, for example, disposed on the substrate SB1 and positioned between adjacent electronic units EU. In this embodiment, the light absorbing layer 200a overlaps the reflective layer 100 in the top-view direction z of the mirror electronic device 10d. The provision of the light absorbing layer 200a can reduce optical crosstalk caused by light emitted from adjacent electronic units EU. The light absorbing layer 200a can, for example, comprise a suitable light-shielding material. For example, the material of the light absorbing layer 200a can include black resin or a low-reflectivity metal material, but the present disclosure is not limited thereto.

[0059] Figure 1E FIG. 1 is a partial cross-sectional view of a mirror electronic device according to the fifth embodiment of the present disclosure. Figure 1E The embodiments can be used Figure 1C The component numbers and partial contents of the embodiments are the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0060] Please refer to Figure 1E The main difference between the mirror electronic device 10e and the mirror electronic device 10c of this embodiment is that the mirror electronic device 10e further includes a light absorbing layer 200b.

[0061] The light absorbing layer 200b is, for example, disposed on the substrate SB2 and, for example, located in the reflective region R2 of the substrate SB2. In this embodiment, the light absorbing layer 200b is directly disposed on the side of the reflective layer 100c away from the substrate SB2 and overlaps the reflective layer 100c in the top-view direction z of the mirror electronic device 10e. The provision of the light absorbing layer 200b can reduce the phenomenon of optical crosstalk caused by light emitted by adjacent electronic units EU. The light absorbing layer 200b can, for example, include a suitable light-shielding material. For example, the material of the light absorbing layer 200b can include a black resin or a metal material with low reflectivity, but the present disclosure is not limited thereto.

[0062] The width W1 of the light absorbing layer 200b in the direction x is, for example, less than or equal to the width W2 of the reflective layer 100c in the direction x, to reduce the possibility of the light absorbing layer 200b affecting the light emitted by the multiple electronic units EU. In this embodiment, in the cross-sectional view of the mirror electronic device 10e in the direction x, the width W1 of the light absorbing layer 200b is less than or equal to the width W2 of the reflective layer 100c, and the width W1 of the light absorbing layer 200b is greater than or equal to 50% of the width W2 of the reflective layer 100c, but the present disclosure is not limited to this. In some embodiments, the distance between a single side edge of the light absorbing layer 200b and the corresponding side edge of the reflective layer 100c in the direction x is between 1 μm and 5 μm, but the present disclosure is not limited to this.

[0063] Figure 1FThis is a partial cross-sectional view of the mirror electronic device of the sixth embodiment of the present disclosure. It should be noted that, Figure 1F The embodiments can be used Figures 1C to 1E The component numbers and partial contents of the embodiments are the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0064] Please refer to Figure 1F The main difference between the mirror electronic device 10f of this embodiment and the mirror electronic device 10c is that the mirror electronic device 10f also includes a light absorbing layer 200a and a light absorbing layer 200b. The technical details of the light absorbing layer 200a and the light absorbing layer 200b can be referred to the previous embodiment and will not be repeated here.

[0065] Figure 1G FIG. 1 is a partial cross-sectional view of the mirror electronic device according to the seventh embodiment of the present disclosure. Figure 1G The embodiments can be used Figure 1C The component numbers and partial contents of the embodiments are the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0066] Please refer to Figure 1G The main difference between the mirror electronic device 10g and the mirror electronic device 10c of this embodiment is that the mirror electronic device 10g further includes a color filter layer CF.

[0067] In this embodiment, a color filter layer CF is disposed on a side of the substrate SB2 adjacent to the substrate SB1 and located within the light-transmitting region R1 of the substrate SB2. Specifically, the color filter layer CF is disposed on the first surface SB2_S1 of the substrate SB2 and between adjacent reflective layers 100c. The color filter layer CF, for example, includes a plurality of filter units, each of which overlaps corresponding electronic units EU on the first surface SB2_S1 of the substrate SB2. Specifically, in this embodiment, the color filter layer CF may include a red filter unit CF1, a green filter unit CF2, and a blue filter unit CF3, which respectively overlap the red light-emitting unit EU1, the green light-emitting unit EU2, and the blue light-emitting unit EU3 in the top-view direction z of the mirror electronic device 10g. The provision of the color filter layer CF further absorbs ambient light incident on the mirror electronic device 10g, thereby improving the ambient light contrast of the mirror electronic device 10g.

[0068] Figure 1H This is a partial cross-sectional diagram of the mirror electronic device of the eighth embodiment of the present disclosure. It should be noted that, Figure 1H The embodiments can be used Figure 1G and Figure 1DThe component numbers and partial contents of the embodiments are the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0069] Please refer to Figure 1H The main difference between the mirror electronic device 10h and the mirror electronic device 10g of this embodiment is that the mirror electronic device 10h further includes a light absorbing layer 200a. The technical details of the light absorbing layer 200a can be referred to the above embodiment and will not be repeated here.

[0070] Figure 1I This is a partial cross-sectional view of the mirror electronic device of the ninth embodiment of the present disclosure. Figure 1I The embodiments can be used Figure 1G and Figure 1E The component numbers and partial contents of the embodiments are the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0071] Please refer to Figure 1I The main difference between the mirror electronic device 10i and the mirror electronic device 10g of this embodiment is that the mirror electronic device 10i further includes a light absorbing layer 200b. The technical details of the light absorbing layer 200b can be found in the previous embodiment and will not be repeated here.

[0072] Figure 1J FIG. 1 is a partial cross-sectional view of the mirror electronic device according to the tenth embodiment of the present disclosure. Figure 1J The embodiments can be used Figure 1G and Figure 1F The component numbers and partial contents of the embodiments are the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0073] Please refer to Figure 1J The main difference between the mirror electronic device 10j and the mirror electronic device 10g of this embodiment is that the mirror electronic device 10j also includes a light absorbing layer 200a and a light absorbing layer 200b. The technical details of the light absorbing layer 200a and the light absorbing layer 200b can be referred to the previous embodiment and will not be repeated here.

[0074] Figure 1K FIG. 1 is a partial cross-sectional view of the mirror electronic device according to the eleventh embodiment of the present disclosure. Figure 1K The embodiments can be used Figure 1C The component numbers and partial contents of the embodiments are the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0075] Please refer to Figure 1KThe main difference between the mirror surface electronic device 10 k and the mirror surface electronic device 10 c of this embodiment is that the mirror surface electronic device 10 k further includes an adhesion layer AD1 and an adhesion layer AD2 .

[0076] The adhesion layer AD1 and the adhesion layer AD2 are, for example, disposed on a side of the substrate SB2 adjacent to the substrate SB1. In the present embodiment, the adhesion layer AD1 and the adhesion layer AD2 form a laminate with the reflective layer 100c, for example, in the top-view direction z of the mirror electronic device 10k. In detail, the adhesion layer AD1 is disposed between the reflective layer 100c and the substrate SB2, and the adhesion layer AD2 is disposed between the reflective layer 100c and the substrate SB1. The reflective layer 100c can be, for example, disposed on the substrate SB2 through the adhesion layer AD1, and can, for example, be used to buffer the reflective layer 100c and the substrate SB2. In some embodiments, the material of the adhesion layer AD1 and the adhesion layer AD2 may include a transparent conductive oxide. For example, the material of the adhesion layer AD1 and the adhesion layer AD2 may include indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium oxide (IGO) or other suitable transparent conductive oxides, but the present disclosure is not limited thereto. In addition, in some embodiments, the adhesion layer AD1 may be omitted depending on demand or design requirements. Figure 1K Adhesion layer AD2 in.

[0077] Figure 1L This is a partial cross-sectional view of the mirror electronic device of the twelfth embodiment of the present disclosure. It should be noted that, Figure 1L The embodiments can be used Figure 1K and Figure 1I The component numbers and partial contents of the embodiments are the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0078] Please refer to Figure 1L The main difference between the mirror electronic device 101 and the mirror electronic device 10k in this embodiment is that the mirror electronic device 101 further includes a light absorbing layer 200b, wherein an adhesive layer AD2 is disposed between the reflective layer 100c and the light absorbing layer 200b. This allows the light absorbing layer 200b to be disposed on the reflective layer 100c, for example, via the adhesive layer AD2. The technical details regarding the light absorbing layer 200b can be found in the previous embodiment and will not be further elaborated here.

[0079] Figure 1M This is a partial cross-sectional view of the mirror electronic device according to the thirteenth embodiment of the present disclosure. Figure 1M The embodiments can be used Figure 1K and Figure 1H The component numbers and partial contents of the embodiments are the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0080] Please refer to Figure 1M The main difference between the mirror electronic device 10m of this embodiment and the mirror electronic device 10k is that the mirror electronic device 10m further includes a light absorbing layer 200a. The technical content of the light absorbing layer 200a can be referred to the above embodiment and will not be repeated here. In addition, in some embodiments, the light absorbing layer 200a can be omitted according to the needs or design requirements. Figure 1M Adhesion layer AD2 in.

[0081] Figure 1N FIG1 is a partial cross-sectional view of the mirror electronic device according to the fourteenth embodiment of the present disclosure. Figure 1N The embodiments can be used Figure 1K and Figure 1J The component numbers and partial contents of the embodiments are the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0082] Please refer to Figure 1N The main difference between the mirror electronic device 10n and the mirror electronic device 10k is that the mirror electronic device 10n also includes a light absorbing layer 200a and a light absorbing layer 200b. The technical details of the light absorbing layer 200a and the light absorbing layer 200b can be found in the previous embodiment and will not be repeated here.

[0083] Figure 1O FIG1 is a partial cross-sectional view of the mirror electronic device of the fifteenth embodiment of the present disclosure. It should be noted that, Figure 1O The embodiments can be used Figure 1K and Figure 1G The component numbers and partial contents of the embodiments are the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0084] Please refer to Figure 1O The main difference between the mirror electronic device 10o and the mirror electronic device 10k in this embodiment is that the mirror electronic device 10o further includes a color filter layer CF. The technical details of the color filter layer CF can be referred to the above embodiment and will not be repeated here. In addition, in some embodiments, the color filter layer CF can be omitted according to the needs or design requirements. Figure 1O Adhesion layer AD2 in.

[0085] Figure 1P FIG1 is a partial cross-sectional view of the mirror electronic device of the sixteenth embodiment of the present disclosure. It should be noted that, Figure 1P The embodiments can be used Figure 1L and Figure 1G The component numbers and partial contents of the embodiments are the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0086] Please refer to Figure 1P The main difference between the mirror electronic device 10p of this embodiment and the mirror electronic device 101 is that the mirror electronic device 10p further includes a color filter layer CF. The technical details of the color filter layer CF can be found in the previous embodiment and will not be repeated here.

[0087] Figure 1Q This is a partial cross-sectional view of the mirror electronic device according to the seventeenth embodiment of the present disclosure. Figure 1Q The embodiments can be used Figure 1M and Figure 1G The component numbers and partial contents of the embodiments are the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0088] Please refer to Figure 1Q The main difference between the mirror electronic device 10q and the mirror electronic device 10m in this embodiment is that the mirror electronic device 10q further includes a color filter layer CF. The technical details of the color filter layer CF can be referred to the above embodiments and will not be described here. In addition, in some embodiments, the color filter layer CF can be omitted according to the needs or design requirements. Figure 1Q Adhesion layer AD2 in.

[0089] Figure 1R FIG1 is a partial cross-sectional view of the mirror electronic device of the eighteenth embodiment of the present disclosure. It should be noted that, Figure 1R The embodiments can be used Figure 1N and Figure 1G The component numbers and partial contents of the embodiments are the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0090] Please refer to Figure 1R The main difference between the mirror electronic device 10r and the mirror electronic device 10n in this embodiment is that the mirror electronic device 10r further includes a color filter layer CF. The technical details of the color filter layer CF can be found in the previous embodiment and will not be repeated here.

[0091] Figure 1S FIG1 is a partial cross-sectional view of the mirror electronic device of the nineteenth embodiment of the present disclosure. It should be noted that, Figure 1S The embodiments can be used Figure 1G The component numbers and partial contents of the embodiments are the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0092] Please refer to Figure 1SThe main difference between the mirror electronic device 10s and the mirror electronic device 10g of this embodiment is that the mirror electronic device 10s further includes a pixel definition layer PDL, a light conversion layer LS, a scattering layer SC, and a barrier layer BANK.

[0093] The pixel definition layer (PDL) is, for example, disposed on a side of the circuit layer CL away from the substrate SB1 and between adjacent electronic units EU. In some embodiments, the pixel definition layer (PDL) can be used to define the location of each of the plurality of electronic units EU, but the present disclosure is not limited thereto. The pixel definition layer (PDL) can comprise, for example, a transparent material, a light-shielding material, or a reflective material. For example, the material of the pixel definition layer (PDL) can comprise a transparent organic photoresist, a white organic photoresist, or a black organic photoresist, but the present disclosure is not limited thereto.

[0094] The light conversion layer LS is, for example, disposed on a side of the color filter layer CF away from the substrate SB2 and includes a light conversion layer LS1 and a light conversion layer LS2. Furthermore, in this embodiment, each of the plurality of electronic units EU is a light-emitting unit that emits light of the same color. For example, each of the plurality of electronic units EU is a blue light-emitting unit EU3, but the present disclosure is not limited thereto.

[0095] For example, the light conversion layer LS1 and the light conversion layer LS2 overlap the corresponding filter units in the top-view direction z of the mirror electronic device 10s, and each overlaps the corresponding electronic unit. Specifically, in this embodiment, the light conversion layer LS1 overlaps the red filter unit CF1 and the corresponding blue light-emitting unit EU3 in the top-view direction z of the mirror electronic device 10s, and the light conversion layer LS2 overlaps the green filter unit CF2 and the corresponding blue light-emitting unit EU3 in the top-view direction z of the mirror electronic device 10s. In some embodiments, the materials of the light conversion layer LS1 and the light conversion layer LS2 may each include quantum dot materials, phosphorescent materials, fluorescent materials, other suitable wavelength conversion materials, or combinations thereof. In other words, the light conversion layer LS1 and the light conversion layer LS2 may each convert the blue light emitted by the blue light-emitting unit EU3 into light having another wavelength. In this embodiment, the color of the light having another wavelength converted by the light conversion layer LS1 and the light conversion layer LS2 may substantially correspond to the color of the red filter unit CF1 and the green filter unit CF2.

[0096] The scattering layer SC is also, for example, disposed on a side of the color filter layer CF facing away from the substrate SB2, and overlaps the corresponding filter units and electronic units. In this embodiment, the scattering layer SC overlaps the blue filter unit CF3 and the corresponding blue light-emitting unit EU3 in the top-view direction z of the mirror electronic device 10s. In some embodiments, the scattering layer SC may include an organic material and titanium dioxide particles therein to scatter the blue light emitted by the blue light-emitting unit EU3, but the present disclosure is not limited thereto.

[0097] The barrier layer BANK is, for example, disposed on the side of the reflective layer 100c facing away from the substrate SB2. In some embodiments, the barrier layer BANK can be used to define the locations of the light conversion layer LS1, the light conversion layer LS2, and the scattering layer SC, but the present disclosure is not limited thereto. Furthermore, the barrier layer BANK can overlap the corresponding reflective layer 100c, for example, in the top-down direction z of the mirror electronic device 10s. In this embodiment, the reflective layer 100c is disposed between the barrier layer BANK and the substrate SB2. The barrier layer BANK can, for example, comprise a suitable organic or inorganic material, but the present disclosure is not limited thereto.

[0098] Figure 1T FIG. 2 is a partial cross-sectional view of the mirror electronic device according to the twentieth embodiment of the present disclosure. Figure 1T The embodiment can be used Figure 1S and Figure 1I The component numbers and partial contents of the embodiments are the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0099] Please refer to Figure 1T The main difference between the mirror electronic device 10t of this embodiment and the mirror electronic device 10s is that the mirror electronic device 10t further includes a light absorbing layer 200b. The light absorbing layer 200b is disposed between the reflective layer 100c and the barrier layer BANK in the top view direction z of the mirror electronic device 10t. The technical details of the light absorbing layer 200b can be found in the previous embodiment and will not be further described here.

[0100] Figure 1U FIG2 is a partial cross-sectional view of the mirror electronic device according to the twenty-first embodiment of the present disclosure. Figure 1U The embodiments can be used Figure 1S and Figure 1B The component numbers and partial contents of the embodiments are the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0101] Please refer to Figure 1UThe main difference between the mirror electronic device 10u of this embodiment and the mirror electronic device 10s is that the mirror electronic device 10u includes a reflective layer 100b instead of a reflective layer 100c, and the reflective layer 100b is made of a stack of high-refractive-index layers and low-refractive-index layers. The technical details of the reflective layer 100b can be found in the previous embodiment and will not be repeated here.

[0102] Figure 1V FIG2 is a partial cross-sectional view of the mirror electronic device according to the twenty-second embodiment of the present disclosure. Figure 1V The embodiments can be used Figure 1U and Figure 1I The component numbers and partial contents of the embodiments are the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

[0103] Please refer to Figure 1V The main difference between the mirror electronic device 10v and the mirror electronic device 10u in this embodiment is that the mirror electronic device 10v further includes a light absorbing layer 200b. The light absorbing layer 200b is disposed between the reflective layer 100b and the barrier layer BANK in the top view direction z of the mirror electronic device 10v. The technical details regarding the light absorbing layer 200b can be found in the previous embodiment and will not be further elaborated here.

[0104] In summary, the mirror electronic device of some embodiments disclosed herein is defined to include a light-transmitting area and a light-reflecting area through the provision of a reflective layer, wherein in the top-view direction of the mirror electronic device, the light-transmitting area overlaps a plurality of electronic units, and the light-reflecting area does not overlap a plurality of electronic units. Through the above-mentioned design, when the mirror electronic device of some embodiments disclosed herein is applied to a vehicle electronic device, the reflectivity of the mirror electronic device in an unopened state can be improved, so as to facilitate the user to observe the surrounding environment at the rear and / or side of the vehicle. In addition, by providing the reflective layer, the possibility of affecting the light emitted by the plurality of electronic units in the mirror electronic device can be reduced, thereby increasing the light output efficiency of the mirror electronic device when in an open state, and improving the quality of its display image.

[0105] Furthermore, some embodiments of the mirror electronic device disclosed herein further include a light-absorbing layer disposed on a side of the reflective layer away from the substrate, with the width of the light-absorbing layer designed to be less than or equal to the width of the reflective layer and greater than or equal to 50% of the width of the reflective layer. The provision of the light-absorbing layer prevents the light-absorbing layer from overlapping with the light-transmitting region when viewed from above. This reduces optical crosstalk between adjacent electronic units in the mirror electronic device disclosed herein, further improving the quality of the image displayed when the mirror electronic device is turned on.

[0106] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A mirror electronic device, characterized in that: include: a first substrate; a circuit layer, disposed on the first substrate; a plurality of electronic units, disposed on the first substrate and electrically connected to the circuit layer; a second substrate, opposite to the first substrate, comprising a light-transmitting area and a light-reflecting area, wherein the light-transmitting area is adjacent to the light-reflecting area, and the light-transmitting area overlaps the plurality of electronic units; a reflective layer, disposed on a side of the second substrate adjacent to the first substrate and located in the reflective area; a first light absorbing layer, disposed on a side of the reflective layer away from the second substrate; as well as an adhesive layer disposed between the first light absorbing layer and the plurality of electronic units; In the cross-sectional view of the mirror electronic device, the width of the first light absorption layer is smaller than or equal to the width of the reflective layer, and the width of the first light absorption layer is greater than or equal to 50% of the width of the reflective layer.

2. The mirror electronic device according to claim 1, wherein: The first light absorbing layer is directly disposed on a side of the reflective layer away from the second substrate.

3. The mirror electronic device according to claim 1, wherein: Also includes: The second light absorbing layer is disposed on the circuit layer and located between two adjacent electronic units.

4. The mirror electronic device according to claim 1, wherein: The reflective layer includes a single metal layer or a stack of multiple metal layers.

5. The mirror electronic device according to claim 1, wherein: The reflective layer includes a stack of multiple high-refractive-index layers and low-refractive-index layers.

6. The mirror electronic device according to claim 1, wherein: Also includes: The color filter layer is disposed on the side of the second substrate adjacent to the first substrate and is located in the light-transmitting area.

7. The mirror electronic device according to claim 6, wherein: Also includes: The light conversion layer is disposed on a side of the color filter layer away from the second substrate.

8. The mirror electronic device according to claim 6, wherein: Also includes: The scattering layer is disposed on a side of the color filter layer away from the second substrate.

9. The mirror electronic device according to claim 7, wherein: Also includes: The barrier layer is disposed on a side of the color filter layer away from the second substrate, wherein the barrier layer overlaps the reflective layer in a top-view direction of the mirror electronic device.

10. The mirror electronic device according to claim 1, wherein: Also includes: a first adhesion layer, disposed on the side of the second substrate adjacent to the first substrate and located between the reflective layer and the second substrate; as well as The second adhesion layer is disposed on the side of the second substrate adjacent to the first substrate and is located between the reflective layer and the first light absorbing layer.

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