A film expanding mechanism and a memory stick master chip die bonding machine

Abstract

The application relates to the technical field of semiconductor packaging, in particular to a film expanding mechanism and a memory bar master control chip die bonding machine. The memory bar master control chip die bonding machine comprises a working machine, a eutectic system, a first feeding system, a second feeding system and a visual positioning system. The eutectic system comprises a die bonding support table, a two-dimensional motion module connected below the die bonding support table, a glue dispensing mechanism arranged above the die bonding support table and a die bonding heating assembly arranged on the die bonding support table. A plate groove is arranged on the die bonding support table. The die bonding heating assembly comprises a material loading top plate and a heating piece arranged in the material loading top plate. The material loading top plate is located in the plate groove. The first feeding system comprises a chip feeding table, a two-dimensional moving module and a die picking device. The two-dimensional moving module is used for driving the chip feeding table to move. The die picking device comprises a thimble mechanism and a chip material conveying mechanism. The application realizes the integration of eutectic die bonding and glue die bonding functions on one device.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor packaging, and in particular to a film expansion mechanism and a memory bar main control chip bonding machine. Background Art

[0002] In the field of semiconductor packaging and electronic manufacturing, die bonding is a key process step in the chip packaging process. Its purpose is to pick up the bare chip from the blue film and accurately bond it to a carrier such as a lead frame, substrate or PCB.

[0003] Currently, common die-bonding methods include eutectic and adhesive bonding. Eutectic bonding is suitable for PCBs with solder. By heating, the pre-printed solder on the PCB melts and forms a secure connection with the chip. This method offers excellent thermal conductivity and high bonding strength, making it widely used in power devices and high-reliability products. Adhesive bonding, on the other hand, is suitable for solderless PCBs. Adhesive bonding typically involves dispensing adhesives such as silver paste and epoxy resin, followed by mounting and curing. It offers process flexibility and low cost, making it suitable for flexible substrates or temperature-sensitive components.

[0004] However, most current die-bonding equipment is designed and configured for only a single die-bonding method. This single-function design forces companies to separately purchase and maintain multiple types of die-bonding equipment to meet different product needs. This not only increases equipment investment and plant space occupation, but also increases the complexity of production management and process switching. In addition, after the blue diaphragm is installed on the film expansion mechanism, the placement angle of the blue diaphragm deviates from the operating position of the remaining mechanisms, making it impossible to accurately align the chip with other processing or testing equipment. Operational errors during chip removal can result in inaccurate chip placement or poor die-bonding quality. Summary of the Invention

[0005] In order to integrate both eutectic bonding and adhesive bonding functions on a die bonding device, it is convenient to quickly switch between different die bonding modes according to product characteristics in the same production line while improving the die bonding quality. This application provides a film expansion mechanism and a memory module main control chip die bonding machine.

[0006] On the one hand, the present application provides a film expansion mechanism, which adopts the following technical solutions:

[0007] A film expansion mechanism includes a ring expansion seat, a material carrier ring, and a first drive assembly. The ring expansion seat includes a correction base ring and a film expansion ring fixed to one end of the correction base ring. The material carrier ring is provided with a clamping cavity for accommodating a blue film sheet. The material carrier ring is also provided with a feed port connected to the clamping cavity.

[0008] The material carrying ring is sleeved outside the film expanding ring, and the first driving component is used to drive the material carrying ring to rise and fall;

[0009] The correction base ring is rotatably connected to the chip feeding table, and the chip feeding table is provided with a second driving component for driving the correction base ring to rotate.

[0010] By adopting the above technical solution, a film expansion mechanism is added to the first feeding system, and the first drive component drives the carrier ring to rise and fall. The first drive component drives the carrier ring to rise and fall, so that the carrier ring set outside the film expansion ring automatically tensions the blue film inside the blue diaphragm when it descends, eliminating the problems of low efficiency and uneven tension of manual film expansion; the flatness of the chip on the blue diaphragm is improved, which is beneficial for the subsequent ejector mechanism to lift the chip and the crystal retrieval device to pick up and transport the chip from the blue diaphragm in subsequent operations. The second drive component drives the correction base ring to rotate, driving the carrier ring to rotate horizontally to adjust the matrix direction of the chip on the blue diaphragm, so that the rows and columns of chips are aligned with the crystal retrieval path, solving the crystal retrieval positioning error caused by the angle deviation of the blue diaphragm placement, and improving the recognition accuracy of the visual positioning system.

[0011] Optionally, the first drive assembly includes a first drive member, a first gear, a second gear, a first transmission ring belt, and a screw-nut pair; a plurality of the screw-nut pairs are arranged at intervals around the axis of the correction base ring, and the nuts in the screw-nut pairs are rotatably connected to the correction base ring;

[0012] One end of the screw in the screw nut pair is fixed to the carrier ring, and the other end is passed through the correction base ring;

[0013] The first gear is rotatably connected to the correction base ring, a first transmission wheel is coaxially fixed to the first gear, and the inner nut of the screw nut pair and the first transmission wheel are both engaged with the first transmission ring belt;

[0014] The second gear is slidably arranged on one side of the first gear. A third driving member is further provided on the chip feeding table. The third driving member is used to drive the second gear to slide, so that the second gear engages with or disengages from the first gear.

[0015] By adopting the above technical solution, the carrier ring is driven to rise and fall synchronously by multiple screw-nut pairs, and combined with the second transmission ring belt linkage nut, uniform tensioning of the blue film around the blue diaphragm is achieved; and the design of the second gear slidingly engaging or disengaging from the first gear can disconnect the transmission connection between the first gear and the second gear when the correction base ring rotates, so that the first drive component and the second drive component can remain independent during operation, so that the rotation of the correction base ring and the lifting and lowering action of the carrier ring will not interfere with each other, thereby improving the long-term reliability of the film expansion mechanism.

[0016] Optionally, the second driving assembly includes a second driving member, a transmission gear ring, a second transmission wheel and a second transmission belt, the second transmission wheel is rotatably connected to the chip feeding table, and the transmission gear ring is sleeved and fixed outside the correction base ring;

[0017] The transmission gear ring and the second transmission wheel are both engaged with the second transmission belt, and the second driving member is used to drive the second transmission wheel to rotate.

[0018] By adopting the above technical solution and a synchronous transmission design in which the transmission gear ring is meshed with the second transmission ring belt, it is ensured that the torque is evenly distributed when the correction base ring rotates, avoiding the tearing of the blue film in the blue diaphragm sheet caused by local overload. At the same time, the transmission belt structure reduces mechanical vibration and maintains the stability of the blue film in the tensioned state.

[0019] On the other hand, the present application provides a memory stick main control chip bonding machine, which adopts the following technical solution:

[0020] A memory bar main control chip bonding machine, comprising:

[0021] Operating machines;

[0022] The eutectic system includes a crystal bonding platform, a two-dimensional motion module connected to the bottom of the crystal bonding platform, a dispensing mechanism arranged above the crystal bonding platform, and a crystal bonding heating component arranged on the crystal bonding platform; the crystal bonding platform is provided with a sheet material channel, the two-dimensional motion module is arranged on the working machine, and is used to drive the crystal bonding platform to move; the crystal bonding heating component includes a loading top plate and a heating element arranged in the loading top plate, and the loading top plate is located in the sheet material channel;

[0023] The first feeding system includes a chip feeding table, a two-dimensional movable module, and a crystal retrieval device. The two-dimensional movable module is arranged on the working machine and is used to drive the chip feeding table to move. The crystal retrieval device includes a pin mechanism and a chip transport mechanism. The pin mechanism is used to lift the chip, and the chip transport mechanism is used to move the lifted chip to the crystal bonding platform.

[0024] The above-mentioned film expansion mechanism is arranged on the chip feeding table;

[0025] The second feeding system includes a material box and a plate pushing mechanism, wherein the plate pushing mechanism is used to convey the PCB board in the material box to the material loading top plate;

[0026] The visual positioning system includes a first visual detector and a second visual detector. The first visual detector is arranged above the ejector mechanism, and the second visual detector is arranged above the solid crystal supporting platform.

[0027] By adopting the above technical solution, the unified processing of eutectic bonding and adhesive bonding functions is achieved by integrating the operating machine, eutectic system, first feeding system, second feeding system and visual positioning system. The bonding heating component of the eutectic system works in conjunction with the dispensing mechanism to drive the two-dimensional motion module to move the bonding platform to adjust the position of the sheet material channel in different operation steps to receive or move the PCB board. The crystal retrieval device of the first feeding system lifts the chip through the ejector mechanism, and then the chip transport mechanism transfers it to the PCB board on the bonding platform. The second feeding system pushes the PCB board to the heating component. The first visual detector and the second visual detector can assist in locating the position of the chip and PCB board to improve the bonding accuracy. It solves the problems of complex production line switching and equipment redundancy caused by single-function equipment, reduces the number of equipment purchased, saves factory space, simplifies the complexity of production switching, and improves the bonding efficiency of the main control chip of the memory bar.

[0028] Optionally, a lifting source is provided on the solid crystal supporting platform, and the lifting source is used to drive the loading top plate to move in the vertical direction; a cover plate is fixed above the loading top plate, and a eutectic position hole is opened on the cover plate.

[0029] By adopting this technical solution, a lifting source is installed on the die-bonding platform to drive the vertical movement of the loading plate, allowing the PCB to be precisely lifted to a preset height for soldering during the eutectic process. The loading plate cooperates with the cover plate to clamp and position the PCB, improving the stability of the PCB during die bonding. Eutectic positioning holes are provided on the cover plate to facilitate precise positioning and completion of the eutectic bonding operation. Furthermore, the lifting source provides height adjustment to accommodate PCBs of varying thicknesses.

[0030] Optionally, a plurality of adsorption holes are provided on the top surface of the loading top plate, and an adsorption air pipe is connected to one side of the loading top plate, each of the adsorption holes is connected to the adsorption air pipe, and the adsorption air pipe is connected to a negative pressure source.

[0031] By adopting the above technical solution, adsorption holes are set on the top surface of the loading top plate and connected to the adsorption air pipe and the negative pressure source. The negative pressure source generates suction through the adsorption holes to adsorb and fix the PCB board in the groove, pushing the PCB board to remain in place during processing to prevent movement or offset, ensuring the position consistency of the PCB board during the dispensing or die bonding process, improving the die bonding quality and reducing the scrap rate.

[0032] Optionally, a lifting port is provided on the chip feeding table, and an ejector mechanism is located in the lifting port; the ejector mechanism includes a first lifting module and an ejector, and the first lifting module is fixed on the working machine; the lifting end in the first lifting module is connected to the ejector for driving the ejector to lift and lower.

[0033] By adopting the above technical solution, the ejector mechanism drives the ejector pins through the first lifting module to lift the chip on the blue diaphragm within the lifting port range, breaking through the traditional suction nozzle directly pulling the blue film in the blue diaphragm to take the material, which causes the defect of chip displacement; and the ejector pin mechanism is combined with the first visual detector to achieve precise lifting of the chip, providing a basis for crystal retrieval for subsequent chip transportation.

[0034] Optionally, the chip transport mechanism includes a transport swing frame, a second lifting module and a rotation source, the transport swing frame is fixed with a swing arm, and a suction nozzle is fixed at one end of the swing arm away from the transport swing frame;

[0035] The second lifting module and the rotation source are both arranged on the operating machine. The second lifting module is used to drive the material transport swing frame to rise and fall, and the rotation source is used to drive the material transport swing frame to rotate.

[0036] By adopting the above technical solution, the second lifting module drives the swing frame to rise and fall, the rotating source drives the swing frame to rotate, and the second lifting module drives the material transport swing frame to rise and fall to adjust the height position of the suction nozzle, which is convenient for picking up and putting down the chip. The rotating source drives the material transport swing frame to rotate so that the suction nozzle can carry the chip between different positions, realizing the function of moving the lifted chip from the chip feeding table to the crystal bonding carrier table, thereby ensuring the accurate transportation of the chip in the crystal bonding process.

[0037] Optionally, the dispensing mechanism includes a third lifting module and a glue gun arranged on one side of the third lifting module, and the third lifting module is used to drive the glue gun to rise and fall.

[0038] Optionally, the glue gun is tilted relative to the crystal bonding platform, and the glue gun includes a glue dispensing needle close to one end of the crystal bonding platform, and the glue dispensing needle is vertical at one end close to the sheet material channel.

[0039] By adopting the above technical solution, the glue gun is tilted relative to the die bonding platform, which makes it easier for the second visual detector to monitor the eutectic station on the PCB board. The glue gun's dispensing needle is vertically positioned close to the end of the sheet material channel, so that the dispensing needle can be pushed close to the PCB board at the optimal angle, accurately controlling the amount of glue applied to adapt to the adhesive die bonding mode, avoiding glue splashing or insufficient glue, improving dispensing efficiency and bonding strength, and supporting on-demand switching between eutectic die bonding and adhesive die bonding in a single operation.

[0040] In summary, this application has at least one of the following beneficial effects:

[0041] 1. The memory module main control chip die bonder in this application integrates eutectic bonding and adhesive bonding by providing a eutectic system and a dispensing mechanism. This allows different types of die bonding operations to be completed on the same device, avoiding the increased costs and management difficulties associated with excessive equipment, significantly improving resource utilization and production efficiency.

[0042] 2. The memory module main control chip die bonder in this application uses the eutectic system and feeding system to work together, and cooperates with the visual positioning system for accurate identification and positioning, which can ensure the accurate position of the chip during the die bonding process, thereby improving the accuracy and stability of the die bonding.

[0043] 3. The memory stick main control chip bonding machine in this application has a film expansion mechanism, a correction base ring and its driving assembly arranged on the chip feeding table, which can effectively expand and correct the blue film; by expanding the film, the chips on the blue film can be distributed more evenly and flatly, which is convenient for the crystal retrieval device to perform crystal retrieval operations; by rotating the correction base ring, the position and angle of the chip on the blue film can be adjusted to ensure the accurate placement of the chip, thereby improving the accuracy of chip feeding. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 This is a schematic diagram of the overall structure of a memory bar main control chip die bonding machine according to an embodiment of the present application;

[0045] Figure 2 Schematic diagram of the exploded structure of the die bonding platform and the die bonding heating assembly in the embodiment of the present application;

[0046] Figure 3 This is a structural diagram of the dispensing mechanism in the embodiment of the present application;

[0047] Figure 4 This is a schematic structural diagram of the second feeding system in an embodiment of the present application;

[0048] Figure 5 This is a structural diagram of the film expansion mechanism in an embodiment of the present application;

[0049] Figure 6 Schematic diagram of the explosion structure of the membrane expansion mechanism in the embodiment of the present application;

[0050] Figure 7 This is a schematic structural diagram of the ejector mechanism in an embodiment of the present application;

[0051] Figure 8 This is a schematic structural diagram of a chip transport mechanism in an embodiment of the present application;

[0052] Explanation of reference numerals: 1. operating machine; 11. motor base; 2. eutectic system; 21. solid crystal supporting platform; 211. material carrier; 2111. sheet material channel; 212. cover plate; 2121. eutectic position hole; 213. limit baffle; 22. two-dimensional motion module; 23. dispensing mechanism; 231. third lifting module; 232. glue gun; 2321. dispensing needle; 24. solid crystal heating assembly; 241. Loading top plate; 2411, adsorption hole; 242, heating element; 243, lifting source; 25, adsorption air pipe; 26, negative pressure source; 3, first feeding system; 31, chip feeding table; 311, lifting port; 312, transmission slide; 32, two-dimensional moving module; 33, ejector mechanism; 331, first lifting module; 332, ejector; 34, chip transport mechanism; 341, transport swing rack; 342, first Second lifting module; 343, rotation source; 344, swing arm; 345, suction nozzle; 4, film expanding mechanism; 41, ring expanding seat; 411, base ring; 412, film expanding ring; 42, loading ring; 421, clamping chamber; 422, feed port; 43, first drive assembly; 431, first drive member; 432, first gear; 433, second gear; 434, first transmission belt; 435, screw nut pair; 436, first transmission wheel; 437, third drive member; 44, second drive assembly; 441, second drive member; 442, transmission gear ring; 443, second transmission wheel; 444, second transmission belt; 5, second feeding system; 51, material box; 511, storage channel; 52, sheet material pushing mechanism; 521, push rod; 6, visual positioning system; 61, first visual detector; 62, second visual detector. DETAILED DESCRIPTION

[0053] The following is combined with Figure 1 -Attached Figure 8 This application is described in further detail.

[0054] Reference Figure 1 The embodiment of the present application provides a memory stick main control chip bonding machine. The memory stick main control chip bonding machine provided by the embodiment of the present application includes an operating machine 1, a eutectic system 2, a first feeding system 3, a second feeding system 5 and a visual positioning system 6, wherein each system cooperates with each other to jointly complete the bonding operation of the memory stick main control chip, achieving the effect of simultaneously realizing eutectic bonding and adhesive bonding functions on one bonding machine, solving the problem that the existing bonding equipment has a single function, which requires enterprises to purchase multiple types of equipment, reducing equipment investment and factory space occupancy, and simplifying the complexity of production management and process switching.

[0055] Reference Figure 1 and Figure 2The eutectic system 2 includes a solid crystal support platform 21, a two-dimensional motion module 22 connected to the bottom of the solid crystal support platform 21, a dispensing mechanism 23 arranged above the solid crystal support platform 21, and a solid crystal heating component 24 arranged on the solid crystal support platform 21. The solid crystal support platform 21 includes a carrier 211, and the carrier 211 is equipped with a rectangular plate channel 2111 for accommodating the PCB board. The solid crystal heating component 24 includes a carrier top plate 241 and a heating element 242 fixed in the carrier top plate 241. The carrier top plate 241 is located in the plate channel 2111. The material top plate is used to support the PCB board. The heating element 242 can be a resistance wire heater or a ceramic heating tube, etc. It can heat the carrier top plate 241, thereby realizing the heating requirement of the PCB board during the eutectic solid crystal process, so that the solder pre-printed on the PCB board melts, facilitating the formation of a firm connection with the chip in subsequent operations. In practical applications, the heating temperature and time of the heating element 242 can be precisely controlled according to different die bonding process requirements. In order to enable the loading top plate 241 to stably support the PCB board, a plurality of adsorption holes 2411 are provided on the upper end surface of the loading top plate 241; a negative pressure cavity is processed in the loading top plate 241, and the negative pressure cavity is connected to the adsorption air pipe 25. Each adsorption hole 2411 is connected to the adsorption air pipe 25 through the negative pressure cavity, and one end of the adsorption air pipe 25 is connected to the negative pressure source 26. The negative pressure source 26 can be a vacuum pump, etc. When the negative pressure source 26 is started, the adsorption holes 2411 will generate suction to firmly adsorb the PCB board on the loading top plate 241, preventing the PCB board from shifting during the die bonding process, and further improving the accuracy and stability of the die bonding.

[0056] Reference Figure 2 A lifting source 243 is fixed on the solid crystal support platform 21, and the lifting source 243 is located below the loading top plate 241. The lifting source 243 can be a cylinder, an electric push rod 521 or a hydraulic cylinder. The lifting end of the lifting source 243 is connected to the loading top plate 241, and can drive the loading top plate 241 to move in the vertical direction. A cover plate 212 is provided above the loading top plate 241, and the cover plate 212 is fixedly connected to the carrier 211. A plurality of eutectic position holes 2121 are opened on the cover plate 212. When eutectic solid crystal operation is required, the lifting source 243 drives the loading top plate 241 to rise, so that the loading top plate 241 and the cover plate 212 clamp the PCB board, so that the eutectic position on the PCB board can be exposed through the eutectic position holes 2121, which is convenient for the contact between the chip and the PCB board and the solid crystal operation. This design can better control the contact pressure and position accuracy between the PCB board and the chip, and improve the quality of eutectic solid crystal.

[0057] Reference Figure 1The two-dimensional motion module 22 is fixed on the operating machine 1. It can drive the solid crystal support platform 21 to move two-dimensionally on the horizontal plane to adjust the position of the PCB board so that different eutectic stations on the PCB board can be moved to the glue outlet position of the dispensing mechanism 23, so that the dispensing mechanism 23 can perform glue dispensing operations on all eutectic stations on the PCB board. The two-dimensional motion module 22 can adopt a motor-driven ball screw pair structure to achieve the movement of the solid crystal support platform 21 in the X-axis and Y-axis directions by precisely controlling the rotation of the motor; it can also adopt a linear motor drive method to improve the accuracy and speed of the movement. In this embodiment, the two-dimensional motion module 22 is driven by a linear motor.

[0058] Reference Figure 3 The dispensing mechanism 23 can apply adhesive materials, such as silver paste and epoxy resin, to the eutectic station of the PCB board during the gluing and die bonding process. The dispensing mechanism 23 includes a third lifting module 231 and a glue gun 232 disposed on one side of the third lifting module 231. The glue gun 232 is fixedly connected to the lifting end of the third lifting module 231 via a bracket. The glue gun 232 is tilted relative to the die bonding platform 21 and includes a dispensing needle 2321 located near one end of the die bonding platform 21. The end of the dispensing needle 2321 near the sheet material channel 2111 is vertical. This tilted setting allows the dispensing needle 2321 to be closer to the PCB board, improving the accuracy and uniformity of dispensing. The third lifting module 231 uses a lifting cylinder. In other embodiments, a screw slider mechanism driven by a stepper motor can also be used to precisely control the lifting height of the glue gun 232. The dispensing mechanism 23 can perform dispensing operations on the PCB board as needed. The dispensing mechanism 23 may be equipped with a precise peristaltic pump or a piezoelectric dispensing valve to control the glue extrusion amount and dispensing accuracy to ensure uniform application of the adhesive material.

[0059] Reference Figure 1 and Figure 4The second feeding system 5 is located at one end of the material carrier 211 away from the dispensing mechanism 23. The second feeding system 5 includes a material box 51 and a sheet material pushing mechanism 52. The material box 51 is slidably connected to the workbench through a vertical slide rail, and the vertical slide rail is also provided with a ball screw drive mechanism to drive the material box 51 to slide, so as to adjust the vertical position of the material box 51. The material box 51 includes a plurality of material storage channels 511. In this embodiment, the material box 51 includes two material storage channels 511. The sheet material pushing mechanism 52 is used to transport the PCB board in the material box 51 to the loading top plate 241. The sheet material pushing mechanism 52 can adopt a sheet material loader or a cylinder-driven pushing structure. In this embodiment, a sheet material loader is specifically selected. The blank loader includes two sliding push rods 521, each corresponding to a material storage channel 511. The push rods 521 extend and retract within the blank loader to push PCBs from the different material storage channels 511 in the magazine 51 and transport them to the loading plate 241. A protective cover protects the sheet pushing mechanism 52 to ensure its normal operation.

[0060] Reference Figure 1 and Figure 2 A limit baffle 213 is also fixed to the end of the loading rack 211 away from the material box 51. When the second feeding system 5 pushes the PCB board onto the loading top plate 241, the limit baffle 213 can be against the PCB board to prevent the PCB board from sliding off the loading baffle.

[0061] Reference Figure 1 and Figure 5 The first feeding system 3 includes a chip feeding table 31, a two-dimensional mobile module 32 and a crystal retrieval device. The chip feeding table 31 is used to support the blue film sheet, which includes a sheet of blue film and a chip adhered to the surface of the blue film. The two-dimensional mobile module 32 is fixed on the operating machine 1 and is used to drive the chip feeding table 31 to move, so that the crystal retrieval device can accurately pick up chips at different positions on the blue film. The two-dimensional mobile module 32 can also use a structure similar to the two-dimensional motion module 22, and can be driven by a ball screw pair or a linear motor.

[0062] Reference Figure 5 and Figure 6A film expansion mechanism 4 is installed on the chip feeding platform 31. The film expansion mechanism 4 includes an expansion ring seat 41, a carrier ring 42, and a first drive assembly 43. The expansion ring seat 41 includes a correction base ring 411 and a film expansion ring 412 fixed to one end of the correction base ring 411. A circular lifting port 311 is provided on the chip feeding platform 31. The carrier ring 42, the lifting port 311, and the expansion ring seat 41 are coaxially arranged. A clamping cavity 421 for accommodating a blue diaphragm is provided on the inner ring wall of the carrier ring 42. A feed port 422 connected to the clamping cavity 421 is also provided on the outer wall of the carrier ring 42. The blue diaphragm can be inserted into the clamping cavity 421 through the feed port 422. The carrier ring 42 is sleeved outside the film expansion ring 412, and the inner diameter of the carrier ring 42 is larger than the outer diameter of the film expansion ring 412. The first driving assembly 43 can drive the carrier ring 42 to move up and down. When the carrier ring 42 descends, the blue film will be stretched to tighten the blue film, which is convenient for subsequent crystal retrieval operations.

[0063] Reference Figure 6 The first drive assembly 43 includes a first driving member 431, a first gear 432, a second gear 433, a first transmission ring belt 434, and a screw nut pair 435. Multiple screw nut pairs 435 are spaced apart around the axis of the correction base ring 411. The nuts in the screw nut pair 435 are rotatably connected to the correction base ring 411 via bearings. One end of the screw in the screw nut pair 435 is fixed to the carrier ring 42, and the other end is inserted into the correction base ring 411 and threadedly connected to the nut in the screw nut pair 435. The first gear 432 is rotatably connected to the correction base ring 411 via a rotating shaft. A first transmission wheel 436 is also coaxially fixed to the lower end of the first gear 432. The nut in the screw nut pair 435 and the first transmission wheel 436 are both meshed with the first transmission ring belt 434. A transmission slide 312 is slidably connected to the chip feeding platform 31 via a horizontal slide rail, and the second gear 433 is rotatably connected to the transmission slide 312 via a rotating shaft. The first driving member 431 is fixed on the transmission slide 312. The first driving member 431 can be a motor. The first driving member 431 is connected to the second gear 433 through a set of synchronous belt transmission components to indirectly drive the second gear 433 to rotate.

[0064] Reference Figure 6 A third driving member 437 is also fixed to the chip feeding table 31. The third driving member 437 can be a pneumatic cylinder, an electric cylinder, etc. The telescopic section of the third driving member 437 is fixedly connected to the transmission slide 312 to drive the transmission slide 312 to slide. Starting the third driving member 437 can indirectly drive the second gear 433 to move toward or away from the first gear 432, so that the second gear 433 engages or disengages from the first gear 432. When it is necessary to drive the carrier ring 42 to rise or fall, the third driving member 437 drives the second gear 433 to engage with the first gear 432, and the second driving member 441 drives the screw nut pair 435 to move through the second transmission ring belt 444, thereby realizing the lifting and lowering of the carrier ring 42.

[0065] Reference Figure 5 and Figure 6 The correction base ring 411 is rotatably connected to the chip feeding platform 31, and a second drive assembly 44 is provided on the chip feeding platform 31. The second drive assembly 44 includes a second driving member 441, a transmission gear ring 442, a second transmission wheel 443, and a second transmission belt 444. The second transmission wheel 443 is rotatably connected to the chip feeding platform 31 via a rotating shaft. The transmission gear ring 442 is sleeved and embedded outside the correction base ring 411 and is fixedly connected to the correction base ring 411. In this embodiment, two second transmission wheels 443 are arranged at intervals, and the transmission gear ring 442 and the two second transmission wheels 443 are all engaged with the second transmission belt 444. The second driving member 441 can optionally be a motor, and the output shaft of the second driving member 441 is coaxially fixed to one of the second transmission wheels 443. Driven by the second driving member 441, the second transmission belt 444 can drive the transmission gear ring 442 to rotate, thereby causing the correction base ring 411 to rotate within a certain range, thereby correcting the position of the blue diaphragm and ensuring the accuracy of the crystal retrieval position. When the blue diaphragm position needs to be corrected, the third driving member 437 drives the second gear 433 to disengage from the first gear 432. In actual use, it is necessary to control the rotation range of the correction base ring 411 so that the rotation of the correction base ring 411 does not affect the subsequent engagement of the first gear 432 and the second gear 433.

[0066] Reference Figure 1 and Figure 7 The crystal retrieval device includes a pin mechanism 33 and a chip transport mechanism 34. The pin mechanism 33 is located in the lifting port 311 and includes a first lifting module 331 and a pin 332. The first lifting module 331 is fixed to the two-dimensional moving module 32. The first lifting module 331 can be a hydraulic lifting module or a ball screw lifting module driven by a servo motor. The lifting end of the first lifting module 331 is fixedly connected to the pin 332 to drive the pin 332 to move up and down. When the chip needs to be removed, the first lifting module 331 drives the pin 332 to rise, lifting the chip from the blue film, making it easier for the chip transport mechanism 34 to obtain the chip.

[0067] Reference Figure 1 and Figure 8The chip transport mechanism 34 is located above the chip feeding table 31 and includes a transport swing frame 341, a second lifting module 342 and a rotation source 343. The transport swing frame 341 is fixedly connected to a swing arm 344 by welding or bolts. A suction nozzle 345 is fixed to the end of the swing arm 344 away from the transport swing frame 341. The suction nozzle 345 can be connected to the negative pressure source 26 through a hose. A motor base 11 is fixed on the operating machine 1, the second lifting module 342 is located in the motor base 11, and the rotation source 343 is fixed to the top of the motor base 11. The second lifting module 342 can also adopt a hydraulic lifting module or a ball screw lifting module driven by a servo motor, and the rotation source 343 adopts a rotary motor. The output end of the rotation source 343 is fixedly connected to the second lifting module 342, and the lifting end of the second lifting module 342 is fixedly connected to the transport swing frame 341. During the process of taking out and transporting the chip, the second lifting module 342 controls the height of the suction nozzle 345 , and the rotation source 343 controls the angle of the suction nozzle 345 , so that the suction nozzle 345 can accurately absorb and transport the chip.

[0068] Reference Figure 1 and Figure 7 The visual positioning system 6 includes a first visual detector 61 and a second visual detector 62 fixed on the workbench. The first visual detector 61 is located above the chip feeding table 31 and is arranged opposite the ejector mechanism 33; the first visual detector 61 is coupled to the two-dimensional moving module 32 to control the operation of the two-dimensional moving module 32, so that the two-dimensional moving module 32 can drive the chips at different positions on the blue to move above the ejector pin 332 of the ejector mechanism 33, ensuring that the ejector mechanism 33 can smoothly lift the chip, and the chip transport mechanism 34 can accurately pick up the lifted chip. Figure 1 and Figure 2 The second visual detector 62 is located above the die-bonding platform 21 and faces the cover plate 212. It is coupled to the two-dimensional motion module 22 to control the operation of the two-dimensional movement module 32, allowing each of the different eutectic holes 2121 on the cover plate 212 to be moved below the dispensing needle 2321 of the glue gun 232, ensuring that the glue gun 232 can dispense glue to each eutectic hole 2121. Both the first visual detector 61 and the second visual detector 62 can use high-definition cameras.

[0069] The implementation principle of the memory stick main control chip bonding machine in this embodiment is as follows: through the coordinated work of various systems, the integration of eutectic bonding and adhesive bonding functions is achieved. During the operation, the second feeding system 5 transports the PCB board to the loading top plate 241 of the eutectic system 2, the first feeding system 3 picks up the chip on the bonding support platform 21 and transports it to the PCB board, and the visual positioning system 6 accurately identifies the position of the chip and the PCB board. If the eutectic bonding method is adopted, the bonding heating component 24 heats the PCB board to melt the solder and firmly connect the chip to the PCB board; if the adhesive bonding method is adopted, the adhesive material is applied to the PCB board through the eutectic position hole 2121 by the dispensing mechanism 23, and then the chip is transported to the glue coating position for curing. This integrated design effectively solves the problem of single function of existing bonding equipment, improves production efficiency and reduces production costs.

[0070] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A film expansion mechanism, characterized in that: include: An expansion ring seat (41), a material carrying ring (42), and a first driving assembly (43), wherein the expansion ring seat (41) includes a correction base ring (411) and a film expansion ring (412) fixed to one end of the correction base ring (411), a material holding cavity (421) for accommodating a blue film is provided in the material carrying ring (42), and a material feed port (422) connected to the material holding cavity (421) is further provided on the material carrying ring (42); The material carrying ring (42) is sleeved outside the membrane expansion ring (412), and the first driving component (43) is used to drive the material carrying ring (42) to rise and fall; The correction base ring (411) is rotatably connected to the chip feeding platform (31), and the chip feeding platform (31) is provided with a second driving component (44) for driving the correction base ring (411) to rotate; The first drive assembly (43) comprises a first drive member (431), a first gear (432), a second gear (433), a first transmission belt (434), and a screw nut pair (435); A plurality of the screw nut pairs (435) are arranged at intervals around the axis of the correction base ring (411), and the nuts in the screw nut pairs (435) are rotatably connected to the correction base ring (411); One end of the screw in the screw nut pair (435) is fixed to the loading ring (42), and the other end is inserted into the correction base ring (411); The first gear (432) is rotatably connected to the correction base ring (411), a first transmission wheel (436) is coaxially fixed to the first gear (432), and the inner nut of the screw nut pair (435) and the first transmission wheel (436) are both engaged with the first transmission ring belt (434); The second gear (433) is slidably arranged on one side of the first gear (432), and a third driving member (437) is also arranged on the chip feeding platform (31). The third driving member (437) is used to drive the second gear (433) to slide, so that the second gear (433) engages with or disengages from the first gear (432).

2. A film expansion mechanism according to claim 1, characterized in that: The second drive assembly (44) includes a second drive member (441), a transmission gear ring (442), a second transmission wheel (443) and a second transmission belt (444), wherein the second transmission wheel (443) is rotatably connected to the chip feeding table (31), and the transmission gear ring (442) is sleeved and fixed outside the correction base ring (411); The transmission gear ring (442) and the second transmission wheel (443) are both engaged with the second transmission ring belt (444), and the second driving member (441) is used to drive the second transmission wheel (443) to rotate.

3. A memory bar main control chip bonding machine, characterized in that: include: Operating machine (1); A eutectic system (2) comprises a solid crystal support platform (21), a two-dimensional motion module (22) connected to the bottom of the solid crystal support platform (21), a dispensing mechanism (23) arranged above the solid crystal support platform (21), and a solid crystal heating component (24) arranged on the solid crystal support platform (21); a plate material channel (2111) is arranged on the solid crystal support platform (21); the two-dimensional motion module (22) is arranged on the operating machine (1) and is used to drive the solid crystal support platform (21) to move; the solid crystal heating component (24) comprises a loading top plate (241) and a heating element (242) arranged in the loading top plate (241); the loading top plate (241) is located in the plate material channel (2111); The first feeding system (3) includes a chip feeding table (31), a two-dimensional moving module (32) and a crystal retrieval device, wherein the two-dimensional moving module (32) is arranged on the working machine (1) and is used to drive the chip feeding table (31) to move; the crystal retrieval device includes a pin mechanism (33) and a chip transport mechanism (34), wherein the pin mechanism (33) is used to lift the chip, and the chip transport mechanism (34) is used to move the lifted chip to the solid crystal support platform (21); The film expanding mechanism (4) according to any one of claims 1 to 2, wherein the film expanding mechanism (4) is arranged on the chip feeding table (31); A second feeding system (5) comprises a material box (51) and a plate pushing mechanism (52), wherein the plate pushing mechanism (52) is used to transport the PCB board in the material box (51) to the loading top plate (241); The visual positioning system (6) comprises a first visual detector (61) and a second visual detector (62), wherein the first visual detector (61) is arranged above the ejector mechanism (33), and the second visual detector (62) is arranged above the solid crystal supporting platform (21).

4. The memory bar main control chip die bonding machine according to claim 3, characterized in that: A lifting source (243) is provided on the solid crystal bearing platform (21), and the lifting source (243) is used to drive the material loading top plate (241) to move in a vertical direction; A cover plate (212) is fixed above the material loading top plate (241), and a eutectic position hole (2121) is provided on the cover plate (212).

5. The memory bar main control chip die bonding machine according to claim 3, characterized in that: The top surface of the loading top plate (241) is provided with a plurality of adsorption holes (2411), and one side of the loading top plate (241) is connected to an adsorption air pipe (25), each of the adsorption holes (2411) is connected to the adsorption air pipe (25), and the adsorption air pipe (25) is connected to a negative pressure source (26).

6. The memory bar main control chip die bonding machine according to claim 3, characterized in that: The chip feeding platform (31) is provided with a lifting port (311), and the ejector mechanism (33) is located in the lifting port (311); the ejector mechanism (33) includes a first lifting module (331) and an ejector (332), and the first lifting module (331) is fixed on the operating machine (1); the lifting end in the first lifting module (331) is connected to the ejector (332) for driving the ejector (332) to move up and down.

7. The memory bar main control chip die bonding machine according to claim 3, characterized in that: The chip transport mechanism (34) comprises a transport swing frame (341), a second lifting module (342) and a rotation source (343); a swing arm (344) is fixed on the transport swing frame (341); a suction nozzle (345) is fixed on one end of the swing arm (344) away from the transport swing frame (341); The second lifting module (342) and the rotation source (343) are both arranged on the operating machine (1); the second lifting module (342) is used to drive the material transport swing frame (341) to rise and fall, and the rotation source (343) is used to drive the material transport swing frame (341) to rotate.

8. The memory bar main control chip die bonding machine according to claim 7, characterized in that: The glue dispensing mechanism (23) comprises a third lifting module (231) and a glue gun (232) arranged on one side of the third lifting module (231), wherein the third lifting module (231) is used to drive the glue gun (232) to move up and down.

9. The memory bar main control chip die bonding machine according to claim 8, characterized in that: The glue gun (232) is tilted relative to the crystal solidifying support platform (21), and the glue gun (232) comprises a glue dispensing needle (2321) close to one end of the crystal solidifying support platform (21), and the end of the glue dispensing needle (2321) close to the sheet material channel (2111) is vertical.

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