Composite heat dissipation material with high infrared radiation and high thermal conductivity as well as preparation method and application of composite heat dissipation material

Abstract

The invention relates to a composite heat dissipation material with high infrared radiation and high heat conductivity as well as a preparation method and application of the composite heat dissipation material. An organic binder and an inorganic binder are mixed according to a certain proportion, ferrite, h-BN powder, a curing agent, a silane coupling agent and other components are added under mechanical stirring to obtain slurry, the slurry is subjected to vacuum defoaming and then spin-coated on the surface of a cleaned substrate, and the heat dissipation coating with excellent performance is obtained after drying. The heat dissipation coating has the characteristics of high infrared emission and high heat conductivity, is suitable for heat dissipation of microelectronic devices such as high-performance chips, can effectively reduce the working temperature to guarantee stable operation of the microelectronic devices, and can prolong the service life of the electronic devices.

Description

Technical Field

[0001] The present invention relates to the field of composite functional materials and radiation heat dissipation technology, and in particular to a composite heat dissipation material with both high infrared radiation and high thermal conductivity, and a preparation method and application thereof. Background Art

[0002] With the continuous advancement of technology, electronic devices are rapidly developing towards integration and high performance. Electronic devices generate heat during use. Excessive temperatures not only reduce operating efficiency but can also cause hardware failures, seriously affecting the reliability and service life of electronic devices. Therefore, overcoming the heat dissipation problem of electronic components has become a core task in promoting the continuous innovation and development of electronic devices.

[0003] Currently, common electronic device cooling technologies primarily include convection and conduction, such as air cooling and liquid cooling. While these methods can meet the cooling needs of electronic devices to a certain extent, they suffer from high energy consumption, high costs, and complex structures, making them difficult to adapt to the growing heat dissipation requirements of electronic devices.

[0004] In recent years, with the rise of green and low-carbon concepts, infrared radiation cooling technology has attracted widespread attention from researchers. Infrared radiation cooling utilizes the conversion of heat and light energy, primarily transferring heat to the outside world as thermal radiation through the 8-14 μm atmospheric window. It offers unique advantages such as zero pollution, no additional energy consumption, and no mechanical operation, significantly improving the heat dissipation efficiency of electronic components.

[0005] The key to infrared radiation heat dissipation technology lies in materials. Existing infrared radiation heat dissipation coatings often use a single organic or inorganic binder during the preparation process, making it difficult to achieve a balanced thermal conductivity and infrared emissivity. Furthermore, some heat dissipation coatings have poor mechanical properties, limiting their practical application. Summary of the Invention

[0006] In order to solve the above problems, the present invention provides a composite heat dissipation material with both high infrared radiation and high thermal conductivity. Generally, the material is composed of a binder, a heat dissipation filler, a silane coupling agent, and may also contain a curing agent.

[0007] In the above solution, the binder is a composite binder, which is formed by mixing and compounding an organic binder and an inorganic binder.

[0008] In the above solution, the heat dissipation filler is a composite filler, which is a mixture of boron nitride and ferrite.

[0009] In the above scheme, the composition of the composite heat dissipation material in parts by mass includes: 10-40 parts of organic binder, 1-10 parts of inorganic binder, no more than 10 parts of boron nitride powder, no more than 10 parts of ferrite powder, 0.1-10 parts of silane coupling agent, and no more than 6 parts of curing agent.

[0010] In the above solution, the organic binder is selected from at least one of polyvinylidene fluoride-hexafluoropropylene (PVDF-HFP), polydimethylsiloxane (PDMS), polymethyl methacrylate (PMMA), polyimide (PI), polytetrafluoroethylene (PTFE), and high-density polyethylene (HDPE).

[0011] In the above solution, the inorganic binder is selected from at least one of sodium silicate (Na2O·nSiO2), potassium silicate (K2O·nSiO2), lithium silicate (Li2O·nSiO2), and silica sol (mSiO2·nH2O).

[0012] In the above scheme, the mass ratio of the organic binder to the inorganic binder is 3:1-16:1. When the mass ratio exceeds this optimal range, the thermal conductivity of the coating decreases; when the mass ratio falls below this optimal range, the mechanical properties of the coating deteriorate. Compared to inorganic binders (such as Na2O·nSiO2, with a full-band emissivity of 97.36%), an excess of organic binder (such as PDMS, with a full-band emissivity of 86.24%) reduces the overall emissivity of the coating.

[0013] In the above scheme, the boron nitride is specifically hexagonal boron nitride (h-BN). H-BN is a two-dimensional honeycomb lattice nanomaterial composed of covalently bonded boron and nitrogen atoms. It has a high in-plane thermal conductivity of 30-200 W / (m·K). However, the infrared emissivity of h-BN powder is generally less than 85%, so it needs to be compounded with ferrite.

[0014] In the above embodiment, the ferrite is selected from at least one of Fe3O4, CoFe2O4, MgFe2O4, MnFe2O4, and NiFe2O4, preferably Fe3O4. Ferrites have an isometric crystal system and are generally represented by the chemical formula MFe2O4, where M typically represents a divalent metal such as Mg, Mn, Ni, Fe, or Co. Studies have shown that ferrites such as Fe3O4 and CoFe2O4 not only exhibit excellent chemical stability but also generally exhibit infrared emissivity exceeding 90% at room temperature.

[0015] In the above solution, the mass ratio of boron nitride to ferrite in the heat dissipation filler is between 0.5:1 and 20:1. When the mass ratio is above this optimal range, the emissivity of the coating is significantly reduced, and the radiation performance is also degraded, due to the high emissivity of the Fe3O4 powder (98.33% across the entire wavelength range) and the low emissivity of the h-BN powder (83.84% across the entire wavelength range). When the mass ratio is below this optimal range, the h-BN powder, as a thermally conductive element, cannot form a complete thermal network within the coating, resulting in a decrease in the coating's thermal conductivity.

[0016] In the above scheme, the silane coupling agent is selected from at least one of γ-aminopropyltriethoxysilane (KH-550), γ-glycidyloxypropyltrimethoxysilane (KH-560), γ-methacryloxypropyltrimethoxysilane (KH-570), methyltrimethoxysilane (Z-6070), vinyltriethoxysilane (A-151), and vinyltrimethoxysilane (A-171).

[0017] In the above scheme, the curing agent is selected from polyurethane acrylate (PUA), ethylenediamine (C2H8N2), methylvinylcyclosiloxane ([(CH3)(CH2CH2)SiO] n ), benzoyl peroxide (C 14 H 10 O4), phenol formaldehyde-diethylenetriamine phenalkamine (C 16 H 27 NO4) at least one.

[0018] As a supporting method, the present invention also provides a method for preparing the above-mentioned composite heat dissipation material with both high infrared radiation and high thermal conductivity, comprising: uniformly mixing an adhesive, ferrite, h-BN, a curing agent, a silane coupling agent, etc. to obtain a slurry, and using the slurry to form a film on a substrate to obtain a composite heat dissipation coating material with high infrared radiation and high thermal conductivity.

[0019] In the above scheme, the material mixing method is mechanical stirring at a rotation speed of 300-600 rpm.

[0020] In the above scheme, the prepared slurry is vacuum degassed and then formed into a film by spin coating. The obtained wet film is dried at 80-120° C. The drying time under this condition is 1-2 h.

[0021] In the above solution, the substrate is specifically a metal heat sink (such as a copper sheet), and before film formation, the surface of the metal heat sink has no heat dissipation coating, or a graphene heat dissipation film is prepared in advance.

[0022] As a supplement, the present invention also provides the application of the above-mentioned composite heat dissipation material with both high infrared radiation and high thermal conductivity as a heat dissipation coating in microelectronic devices such as high-performance chips and high-power electronic components.

[0023] The inorganic binders used in this invention are all silicate-based inorganic binders, containing metal oxides and Si-O bonds, both of which exhibit high absorption and emission in the infrared region. This invention utilizes both organic and inorganic binders. In the composite system, the inorganic binder (such as potassium silicate) and the organic binder (such as PDMS) are physically mixed, intertwined, and interwoven, forming a three-dimensional network structure that resembles a "rigid-flexible" system. Compared to heat dissipation coatings using only organic binders, organic-inorganic composite binder coatings exhibit improved thermal conductivity, infrared absorption, and emission; and compared to heat dissipation coatings using only inorganic binders, organic-inorganic composite binder coatings exhibit superior mechanical properties. This invention utilizes h-BN and ferrite as heat dissipation fillers, along with both organic and inorganic binders, to prepare the heat dissipation coating. This ensures both high thermal conductivity and high emissivity across the entire wavelength range, ultimately synergistically improving the coating's heat dissipation performance in low-temperature environments (below 100°C).

[0024] Compared with existing similar products or technologies, the advantages and progress of this invention are mainly reflected in the following aspects: (1) Excellent heat dissipation performance. By optimizing and improving the formula, taking into account both high infrared radiation and high thermal conductivity, the heat dissipation coating produced has an emissivity of up to 96.16% in the full band and a maximum temperature difference of up to 7.7 °C. It can not only effectively reduce the operating temperature of electronic components to ensure their stable operation, but also extend the service life of electronic equipment. It also improves the heat dissipation performance of commercial graphene heat sinks by nearly 26%.

[0025] (2) The raw materials are cheap and readily available, and the preparation process is simple. The raw materials required for the present invention are relatively cheap and readily available. The process of preparing the composite heat dissipation coating does not require expensive reagents or equipment, and there are no complicated processes or steps, which is conducive to large-scale promotion and application.

[0026] (3) Compared with existing heat dissipation methods such as air cooling and liquid cooling, the low-temperature and high-efficiency infrared radiation heat dissipation coating proposed in the present invention has a series of advantages such as space saving, no installation and maintenance, etc. It also has the characteristics of wide application, safety and reliability, easy use, and good heat dissipation effect. It has great application prospects in the field of thermal management of microelectronic devices with limited space and urgent cooling needs.

[0027] (4) The preparation method of the heat dissipation coating in the present invention has the advantages of simplicity, high efficiency, low cost, and low energy consumption, and is particularly suitable for large-scale batch production and application.

[0028] (5) The heat dissipation performance test of the coating in the present invention is carried out in an acrylic cover, eliminating the influence of air convection. The main heat dissipation method of the coating is radiation heat dissipation. Therefore, the temperature of the external object outside the substrate can be no less than the temperature of the thermal radiation heat dissipation coating. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is the infrared spectral emissivity curve of Fe3O4 nanoparticles.

[0030] Figure 2 is the infrared spectral emissivity curve of h-BN nanoparticles.

[0031] Figure 3 This is the microstructure of Fe3O4 nanoparticles.

[0032] Figure 4 This is the microstructure of h-BN nanoparticles.

[0033] Figure 5 This is the temperature change curve of the GE-Cu heat dissipation coating under indoor simulated electronic component heat dissipation conditions.

[0034] Figure 6 This is the temperature change curve of the IR-GE-Cu heat dissipation coating under indoor simulated electronic component heat dissipation conditions.

[0035] Figure 7 This is the temperature change curve of the IR-Cu heat dissipation coating under indoor simulated electronic component heat dissipation conditions.

[0036] Figure 8 This is a comparison chart of the infrared emissivity of GE-Cu, IR-GE-Cu, and IR-Cu heat dissipation coatings.

[0037] Figure 9 This is the surface microstructure of the IR-Cu heat dissipation coating. DETAILED DESCRIPTION

[0038] To enable those skilled in the art to fully understand the technical solutions and beneficial effects of the present invention, the following is further described in detail with reference to specific embodiments and accompanying drawings. It should be emphasized that the following embodiments are merely preferred embodiments of the present invention and do not constitute any limitation of the present invention. The present invention may also have many other embodiments. Any simple improvements or replacements based on the gist of the present invention will fall within the scope of protection of the present invention.

[0039] The preparation method of the composite heat dissipation material with both high infrared radiation and high thermal conductivity provided by the present invention is as follows: Organic binders (PVDF-HFP, PDMS, PMMA, PI, PTFE, HDPE, etc.) and inorganic binders (Na2O·nSiO2, K2O·nSiO2, Li2O·nSiO2, mSiO2·nH2O, etc.) were fully mixed in a mass ratio of 3:1-16:1. h-BN and ferrite (Fe3O4, CoFe2O4, etc.) powders (mass ratio of 0.5:1-20:1) were added in sequence under mechanical stirring (speed 300-600 rpm). Then, curing agents (PUA, C2H8N2, [(CH3)(CH2CH2)SiO] n 、C 14 H 10 O4、C 16 H 27 NO4, etc.) and a silane coupling agent (KH-550, KH-560, KH-570, Z-6070, A-151, A-171, etc.) are continuously stirred (rotating speed 300-600 rpm) to obtain a uniform slurry. The slurry is vacuum defoamed for 5-15 minutes and then evenly spin-coated onto the surface of a clean substrate. The substrate is dried at 80-120 ° C for 1-2 hours to finally obtain a heat dissipation coating with both high infrared radiation and high thermal conductivity.

[0040] Example 1 1) Weigh 3.00 g of PDMS and 0.390 g of K2O·nSiO2 into a beaker and mechanically stir at 600 rpm / min for 10 min to obtain an organic-inorganic composite binder.

[0041] 2) Maintaining mechanical stirring, add 0.195 g h-BN powder, 0.390 g Fe₃O₄ powder, 0.117 g KH-560, and 0.600 g methylvinylcyclosiloxane to the organic-inorganic composite binder in this order. Continue mechanical stirring for 30 minutes to ensure uniform mixing. Then, vacuum degassing is performed for 10 minutes to obtain a uniform radiant heat dissipation slurry.

[0042] 3) An unpolished copper sheet measuring 40*40*1 mm was adsorbed onto a spin coater. The radiative heat dissipation slurry was then evenly spin-coated onto the copper sheet at 1000 rpm / min. The copper sheet was then dried in a drying oven at 120°C for 1 hour. Finally, a heat dissipation coating with both high infrared radiation and high thermal conductivity was obtained, designated IR-1.

[0043] Example 2 1) Weigh 3.00 g of PDMS and 0.390 g of K2O·nSiO2 into a beaker and mechanically stir at 600 rpm / min for 10 min to obtain an organic-inorganic composite binder.

[0044] 2) Maintaining mechanical stirring, add 0.390 g of Fe₃O₄ powder, 0.117 g of KH-560, and 0.600 g of methylvinylcyclosiloxane (Note: Compared to Example 1, less h-BN was added) to the organic-inorganic composite binder in this order. Continue mechanical stirring for 30 minutes to thoroughly mix the materials, followed by vacuum degassing for 10 minutes to obtain a uniform radiant heat dissipation slurry.

[0045] 3) An unpolished copper sheet measuring 40*40*1 mm was adsorbed onto a spin coater. The radiative heat dissipation slurry was then evenly spin-coated onto the copper sheet at 1000 rpm / min. The copper sheet was then dried in a drying oven at 120°C for 1 hour. Finally, a heat dissipation coating with both high infrared radiation and high thermal conductivity was obtained, designated IR-2.

[0046] Example 3 1) Weigh 3.00 g of PDMS and 0.390 g of K2O·nSiO2 into a beaker and mechanically stir at 600 rpm / min for 10 min to obtain an organic-inorganic composite binder.

[0047] 2) Maintaining mechanical stirring, add 0.195 g h-BN powder, 0.117 g KH-560, and 0.600 g methylvinylcyclosiloxane to the organic-inorganic composite binder in this order (Note: Compared to Example 1, less Fe₃O₄ was added). Continue mechanical stirring for 30 minutes to thoroughly mix the materials. Then, vacuum degassing was performed for 10 minutes to obtain a uniform radiant heat dissipation slurry.

[0048] 3) An unpolished copper sheet measuring 40*40*1 mm was adsorbed onto a spin coater. The radiative heat dissipation slurry was then evenly spin-coated onto the copper sheet at a speed of 1000 rpm / min. The copper sheet was then dried in a drying oven at 120°C for 1 hour. Finally, a heat dissipation coating with both high infrared radiation and high thermal conductivity was obtained, designated IR-3.

[0049] Example 4 1) Weigh 2.34 g of PMMA and 0.780 g of Na2O·nSiO2 into a beaker and mechanically stir at 300 rpm / min for 10 min to obtain an organic-inorganic composite binder.

[0050] 2) While maintaining mechanical stirring, add 0.390 g h-BN powder, 0.195 g CoFe2O4 powder, 0.078 g KH-570, and 0.420 g benzoyl peroxide to the organic-inorganic composite binder in that order. Continue mechanical stirring for 40 minutes to ensure uniform mixing. Then, vacuum degassing for 10 minutes will yield a uniform radiant heat dissipation slurry.

[0051] 3) An unpolished copper sheet measuring 40*40*1 mm was adsorbed onto a spin coater. The radiative heat dissipation slurry was then evenly spin-coated onto the copper sheet at a speed of 1000 rpm / min. The copper sheet was then dried in a drying oven at 80°C for 2 h. Finally, a heat dissipation coating with both high infrared radiation and high thermal conductivity was obtained, designated IR-4.

[0052] Example 5 1) Weigh 3.120 g of PVDF-HFP and 0.195 g of Li2O·nSiO2 into a beaker and mechanically stir at 400 rpm / min for 10 min to obtain an organic-inorganic composite binder.

[0053] 2) Maintaining mechanical stirring, add 0.780 g h-BN powder, 0.039 g MgFe2O4 powder, 0.039 g KH-550, and 0.390 g polyurethane acrylate to the organic-inorganic composite binder in this order. Continue mechanical stirring for 50 minutes to ensure uniform mixing. Then, vacuum degassing for 5 minutes will yield a uniform radiant heat dissipation slurry.

[0054] 3) An unpolished copper sheet measuring 40*40*1 mm was adsorbed onto a spin coater. The radiant heat dissipation slurry was then evenly spin-coated onto the copper sheet at 1000 rpm / min. The copper sheet was then dried in a drying oven at 100°C for 1.25 h. Finally, a heat dissipation coating with both high infrared radiation and high thermal conductivity was obtained, designated IR-5.

[0055] Example 6 1) Weigh 3.00 g of PTFE and 0.585 g of mSiO2·nH2O into a beaker and mechanically stir at 500 rpm / min for 10 min to obtain an organic-inorganic composite binder.

[0056] 2) While maintaining mechanical stirring, add 0.585 g h-BN powder, 0.780 g MnFe₂O₄ powder, 0.156 g Z-6070, and 0.585 g ethylenediamine to the organic-inorganic composite binder in this order. Continue mechanical stirring for 45 minutes to ensure uniform mixing. Then, vacuum degassing is performed for 10 minutes to obtain a uniform radiant heat dissipation slurry.

[0057] 3) An unpolished copper sheet measuring 40*40*1 mm was adsorbed onto a spin coater. The radiative heat dissipation slurry was then evenly spin-coated onto the copper sheet at 1000 rpm / min. The copper sheet was then dried in a drying oven at 90°C for 1.5 hours. Finally, a heat dissipation coating with both high infrared radiation and high thermal conductivity was obtained, designated IR-6.

[0058] Example 7 1) Weigh 3.30 g of HDPE and 0.390 g of Na2O·nSiO2 into a beaker and mechanically stir the mixture at 550 rpm / min for 10 min to obtain an organic-inorganic composite binder.

[0059] 2) Maintaining mechanical stirring, add 0.390 g h-BN powder, 0.585 g MnFe₂O₄ powder, and 0.156 g A-151 (Note: Compared to Example 1, no curing agent was added) to the organic-inorganic composite binder in this order. Continue mechanical stirring for 50 minutes to thoroughly mix the materials, followed by vacuum degassing for 10 minutes to obtain a uniform radiant heat dissipation slurry.

[0060] 3) An unpolished copper sheet measuring 40*40*1 mm was adsorbed onto a spin coater. The radiative heat dissipation slurry was then evenly spin-coated onto the copper sheet at a speed of 1000 rpm / min. The copper sheet was then dried in a drying oven at 120°C for 1 hour. Finally, a heat dissipation coating with both high infrared radiation and high thermal conductivity was obtained, designated IR-7.

[0061] Example 8 1) Weigh 3.00 g of PI and 0.390 g of Na2O·nSiO2 into a beaker and mechanically stir the mixture at 600 rpm / min for 10 min to obtain an organic-inorganic composite binder.

[0062] 2) Maintaining mechanical stirring, add 0.780 g h-BN powder, 0.039 g MnFe2O4 powder, 0.156 g A-171, and 0.420 g phenol formaldehyde-diethylenetriamine phenalkamine to the organic-inorganic composite binder in this order. Continue mechanical stirring for 20 minutes to thoroughly mix the materials, followed by vacuum degassing for 10 minutes to obtain a uniform radiant heat dissipation slurry.

[0063] 3) An unpolished copper sheet measuring 40*40*1 mm was adsorbed onto a spin coater. The radiant heat dissipation slurry was then evenly spin-coated onto the copper sheet at a speed of 1000 rpm / min. The copper sheet was then dried in a drying oven at 120°C for 1 hour. Finally, a heat dissipation coating with both high infrared radiation and high thermal conductivity was obtained, designated IR-8.

[0064] In order to fully understand the various properties of the heat dissipation coatings prepared in various embodiments, samples were taken and the following tests were performed: (1) Emissivity test of heat dissipation coating The emissivity of the heat dissipation coatings prepared in Examples 1-3 at 2.5-25 μm (i.e., full band) was measured using an INVENIO S FT-IR and an A562 integrating sphere accessory from Bruker, Japan. The average emissivity at 3-5 μm, 8-14 μm, and 2.5-25 μm was calculated, and the results are shown in Table 1 below.

[0065] Table 1 Comparison of emissivity of different heat dissipation coating samples in different bands

[0066] As shown in Table 1, the emissivity of the heat dissipation coating sample IR-1 prepared in Example 1 is higher than 95% in all three bands, and the emissivity in the full band is as high as 96.16%. In comparison, the heat dissipation coating sample IR-2 prepared in Example 2 lacks the h-BN component, resulting in an emissivity higher than 95% in all three bands. However, its emissivity in the 3-5 μm and 2.5-25 μm bands is lower than that of Example 1, and its emissivity in the full band is only 95.79%. Similarly, the heat dissipation coating sample IR-3 prepared in Example 3 lacks the Fe3O4 component, resulting in an emissivity lower than 95% in all three bands, especially in the 3-5 μm band, with an emissivity of only 68.94%, and an emissivity of only 91.72% in the full band.

[0067] In summary, while both heat dissipation coating samples IR-1 and IR-2 exhibit emissivity exceeding 95% across all three wavelengths, IR-1 exhibits higher emissivity across all wavelengths due to the inclusion of h-BN. Furthermore, compared to IR-3, IR-1 exhibits higher emissivity across all wavelengths due to the inclusion of Fe₃O₄, and its emissivity is significantly higher in the 3-5μm band than IR-3. These results demonstrate that the combined use of h-BN and Fe₃O₄ ensures high emissivity across all wavelengths, improving the coating's heat dissipation performance.

[0068] (2) Emissivity test of raw materials Fe3O4 and h-BN The emissivity of raw materials Fe3O4 and h-BN in 2.5-25 μm (i.e. full band) was measured using the INVENIO S FT-IR and the A562 integrating sphere accessory of Bruker Japan. The average emissivity in 3-5 μm, 8-14 μm and 2.5-25 μm was calculated. The results are as follows: Figure 1-2 shown.

[0069] from Figure 1 It can be seen that the emissivity of Fe3O4 nanoparticles in the three bands is higher than 98%, the emissivity in the full band is 98.33%, and the emissivity in the 8-14 μm band is as high as 99.03%, which shows that the addition of Fe3O4 nanoparticles can greatly improve the emissivity of the heat dissipation coating.

[0070] from Figure 2 As can be seen in the figure, the emissivity of h-BN nanoparticles in all three bands is above 76%, with an emissivity of 83.84% across the entire band. However, its emissivity in the 3-5 μm band is only 76.97%. Therefore, compared to the heat dissipation coating containing only Fe₃O₄ nanoparticles, the addition of h-BN nanoparticles alone results in a lower emissivity in the 3-5 μm band, which corresponds to the emissivity test results of the heat dissipation coating sample IR-3.

[0071] (3) Scanning electron microscopy (SEM) test of raw materials Fe3O4 and h-BN The surface morphology of raw materials Fe3O4 and h-BN were analyzed using JEOL JSM-IT800 field emission scanning electron microscope (FESEM) from JEOL Ltd. The results are as follows: Figure 3-4 As shown in the figure, it can be seen that the Fe3O4 ferrite nanoparticles have an irregular cubic structure, while the h-BN nanoparticles have a lamellar structure.

[0072] (4) Heat dissipation performance test A layer of thermal grease was evenly coated on the back of the copper sheet with the heat dissipation coating prepared in Example 1, and this surface was then attached to the surface of an electronic heating component to form an organic-inorganic radiation heat dissipation coating-copper sheet heat dissipation device, designated IR-Cu. The heat dissipation coating on the copper sheet was replaced with a commercial graphene heat dissipation film, and then thermal grease was applied to the back of this film and attached to the surface of an electronic heating component to form a commercial graphene heat dissipation film-copper sheet heat dissipation device, designated GE-Cu. Following the method described in Example 1, a layer of IR-1 heat dissipation coating (same thickness as in Example 1) was further applied to the surface of the graphene heat dissipation film in GE-Cu to form an organic-inorganic radiation heat dissipation coating-commercial graphene heat dissipation film-copper sheet heat dissipation device, designated IR-GE-Cu. No heat dissipation coating was applied to one side of the copper sheet, and thermal grease was applied to the other side before being attached to the surface of an electronic heating component to form a blank control heat dissipation device. The emissivity of the four heat dissipation devices (GE-Cu, IR-GE-Cu, IR-Cu and blank control) in the range of 2.5-25 μm (i.e., full band) was measured using the INVENIO S FT-IR and the A562 integrating sphere accessory from Bruker Japan. The average emissivity in the range of 3-5 μm, 8-14 μm and 2.5-25 μm was calculated. The results are shown in the figure below. Figure 8 As shown in Table 2.

[0073] Table 2 Comparison of emissivity of different heat dissipation components in different bands

[0074] As shown in Table 2, the emissivity of GE-Cu in all three bands is less than 90%, and its emissivity across the entire band is only 76.56%. In contrast, the emissivities of IR-GE-Cu and IR-Cu in all three bands are greater than 94%, and their emissivity across the entire band is as high as 96.18%. Furthermore, compared to GE-Cu, IR-GE-Cu has a much higher emissivity across all three bands. While IR-GE-Cu and IR-Cu coatings have the same emissivity across the entire band, IR-Cu has a higher emissivity in the 3-5 μm and 8-14 μm bands. These results demonstrate that applying an IR coating to the surface of a commercial graphene heat dissipation film can significantly increase its emissivity across the entire band, contributing to improved heat dissipation performance.

[0075] The surface microstructure of the coating of IR-Cu and blank control heat dissipation device is as follows Figure 9 As shown in the figure, the distribution of Fe3O4 and h-BN particles on the coating surface is relatively uniform, which can conduct heat more evenly, allowing IR-GE-Cu and IR-Cu to work stably in various thermal environments.

[0076] In addition, we also tested the heat dissipation performance of four heat dissipation devices (GE-Cu, IR-GE-Cu, IR-Cu and blank control) below 100°C. The specific test process is as follows: at room temperature, with acrylic covers blocking air convection, the above heat dissipation devices were attached to the heating surface of the electronic device. When the electronic device was working, the temperature changes of the heating surface were monitored. The results are as follows: Figure 5 (GE-Cu), Figure 6 (IR-GE-Cu), Figure 7 (IR-Cu) shown.

[0077] contrast Figure 5-7 It can be found that below 100°C, the heat dissipation performance of GE-Cu, IR-GE-Cu, and IR-Cu is superior to that of the blank control (temperature differences of 5.9°C, 7.7°C, and 7.4°C, respectively). The emissivity of the coatings in these three heat dissipation devices (emissivity in the 2.5-25 μm band is 76.56%, 95.28%, and 95.65%, respectively) is higher than that of the blank control (emissivity in the 2.5-25 μm band is 9.44%). IR-GE-Cu has the best heat dissipation performance, with a temperature difference of 7.7°C and an infrared emissivity of 95.28% in the 2.5-25 μm band, demonstrating its excellent performance in infrared radiation heat dissipation.

[0078] In summary, the heat dissipation coating prepared according to the method of the present invention has the characteristics of high infrared emission and high thermal conductivity. The infrared emissivity in the 8-14 μm band at room temperature reaches 95%, and the infrared emissivity in the 2.5-25 μm band reaches 96%. The corresponding IR-GE-Cu coating has the best heat dissipation performance below 100 ° C, with a temperature difference of up to 7.7 ° C. The infrared emissivity in the 2.5-25 μm band is 95.28%. It is suitable for heat dissipation of microelectronic devices such as high-performance chips and high-power electronic components. While effectively reducing the operating temperature of the device to ensure its stable operation, it can also extend the service life of the device.

Claims

1. A composite heat dissipation material with both high infrared radiation and high thermal conductivity, characterized by: The material is in the form of a film or a coating, and its composition includes a binder, a heat dissipation filler, and a silane coupling agent. The binder is selected from at least one of an organic binder and an inorganic binder, and the heat dissipation filler is selected from at least one of boron nitride and ferrite.

2. The composite heat dissipation material according to claim 1, wherein: The material also includes a curing agent, which is selected from at least one of polyurethane acrylate, ethylenediamine, methylvinylcyclosiloxane, benzoyl peroxide, and phenol formaldehyde-diethylenetriamine phenalkamine.

3. The composite heat dissipation material according to claim 2, wherein: The material comprises, by weight, 10-40 parts of an organic binder, 1-10 parts of an inorganic binder, no more than 10 parts of boron nitride, no more than 10 parts of ferrite, 0.1-10 parts of a silane coupling agent, and no more than 6 parts of a curing agent.

4. The composite heat dissipation material according to claim 1, wherein: The mass ratio of the organic binder to the inorganic binder is preferably 3:1-16:1, and the mass ratio of boron nitride to ferrite is preferably 0.5:1-20:

1.

5. The composite heat dissipation material according to claim 1, wherein: The organic binder is selected from at least one of polyvinylidene fluoride-hexafluoropropylene, polydimethylsiloxane, polymethyl methacrylate, polyimide, polytetrafluoroethylene, and high-density polyethylene; the inorganic binder is selected from at least one of sodium silicate, potassium silicate, lithium silicate, and silica sol; the boron nitride is specifically hexagonal boron nitride; the ferrite is selected from at least one of Fe3O4, CoFe2O4, MgFe2O4, MnFe2O4, and NiFe2O4; and the silane coupling agent is selected from at least one of γ-aminopropyltriethoxysilane, γ-glycidyloxypropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, methyltrimethoxysilane, vinyltriethoxysilane, and vinyltrimethoxysilane.

6. A method for preparing a composite heat dissipation material having both high infrared radiation and high thermal conductivity, characterized in that The method comprises: uniformly mixing an adhesive, ferrite, boron nitride, a curing agent and a silane coupling agent to obtain a slurry, and forming a film on a substrate using the slurry to obtain a composite heat dissipation material.

7. The method according to claim 6, wherein: When preparing the slurry, stir the materials to mix evenly at a stirring speed of 300-600 rpm.

8. The method according to claim 6, wherein: The prepared slurry is vacuum defoamed and then formed into a film by spin coating. The obtained wet film is fully dried at 80-120°C.

9. The method according to claim 6, wherein: The substrate is specifically a metal heat sink, and before film formation, the surface of the substrate has no heat dissipation coating or is provided with a graphene heat dissipation film.

10. Use of the composite heat dissipation material with high infrared radiation and high thermal conductivity according to any one of claims 1 to 5 in microelectronic devices.

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