Ultrahigh vacuum evaporation device convenient to machine

Abstract

The invention provides an ultrahigh vacuum evaporation device convenient to machine. The ultrahigh vacuum evaporation device comprises a first magnetic push rod conveying device, a second magnetic push rod conveying device, a preparation chamber, a cleaning chamber, an evaporation chamber and an oxidation chamber, the evaporation chamber comprises an evaporation cavity, an evaporation assembly, an evaporation detection assembly, a second turnover driving device and a third grabbing device, it is ensured that the evaporation surface is absolutely perpendicular to an evaporation source through the mechanisms, and the film layer uniformity and the thickness extreme precision are achieved in combination with the evaporation detection assembly; meanwhile, the evaporation assembly is of a movable multi-crucible evaporation source design, rapid and accurate switching and alignment of different evaporation materials are achieved, efficient sequential evaporation or co-evaporation is supported, and the process flexibility and the productivity are remarkably improved; and each anti-adhesion plate and the crucible covering plate effectively prevent the evaporation material from polluting the chamber and key components such as a probe, an observation window and a subsequent wafer, so that the maintenance requirement is greatly reduced, and the long-term stable operation of equipment and the purity of a film layer are guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of vacuum evaporation machines, and more specifically, to an ultra-high vacuum evaporation device that is easy to process. Background Art

[0002] Vacuum evaporation technology is widely used in fields such as semiconductors and optical devices. It requires evaporating metals or compounds onto the surface of a substrate in an ultra-high vacuum environment. Traditional evaporation equipment has the following bottlenecks:

[0003] (1) Low efficiency of multi-material evaporation: Switching the evaporation source requires breaking the vacuum and replacing the crucible, which is time-consuming and has a high risk of contamination, affecting the stability of mass production.

[0004] (2) Weak pollution control: Evaporation materials are easily splashed onto the inner wall of the chamber, observation window and sensor, resulting in an increase in equipment failure rate and maintenance frequency.

[0005] In order to overcome the above limitations, it is urgent to develop an ultra-high vacuum evaporation device that is easy to process and integrates high-precision positioning, multi-source rapid switching, enhanced anti-pollution and real-time monitoring. Summary of the Invention

[0006] In view of this, in order to solve the above problems, the present invention proposes an ultra-high vacuum evaporation device that is easy to process and integrates high-precision positioning, multi-source rapid switching, enhanced anti-pollution and real-time monitoring.

[0007] A super-high vacuum evaporation device that is easy to process includes a first magnetic push rod conveying device 1, a second magnetic push rod conveying device 2, and a preparation chamber 3, a cleaning chamber 4, an evaporation chamber 5, and an oxidation chamber 6 that are sequentially connected. The first magnetic push rod conveying device 1 is provided at the input end of the preparation chamber 3, and the second magnetic push rod conveying device 2 is provided at the output end of the oxidation chamber 6. The first magnetic push rod conveying device 1 sequentially conveys wafers to the preparation chamber 3 and the cleaning chamber 4 for processing. The second magnetic push rod conveying device 2 receives the wafers in the cleaning chamber 4 and sequentially conveys them to the evaporation chamber 5 and the oxidation chamber 6 for processing. The evaporation chamber 5 includes an evaporation chamber body 51, an evaporation component 52, an evaporation detection component 53, a second flip drive device 54, The third grabbing device 55, the output end of the cleaning processing chamber 41 is connected to the input end of the evaporation chamber 51, an evaporation component 52 is provided at the bottom of the evaporation chamber 51, and an evaporation detection component 53 is provided on the inner wall of the evaporation chamber 51. The evaporation detection component 53 is used to monitor the evaporation data of the evaporation component 52, and a second flip driving device 54 is provided on one side of the evaporation chamber 51. The driving end of the second flip driving device 54 is provided with a third grabbing device 55. When the second magnetic push rod conveying device 2 receives the wafer in the cleaning chamber 4 and conveys the wafer to the evaporation chamber 51, the third grabbing device 55 grabs the material body, and after grabbing, the evaporation chamber 51 below performs vacuum coating on the material body. At the same time, the evaporation detection component 53 monitors the evaporation data in real time to improve the film thickness accuracy.

[0008] In some embodiments, the third grabbing device 55 includes a grabbing mounting seat 71, a grabbing driving device 72, a grabbing frame 73, and a driving clamping plate 74. The driving end of the second flipping driving device 54 is provided with a grabbing mounting seat 71, a grabbing driving device 72 is provided above the grabbing mounting seat 71, a grabbing frame 73 is fixedly provided below the grabbing driving device 72, and a driving clamping plate 74 is provided below the grabbing frame 73. The driving clamping plate 74 and the bottom of the grabbing frame 73 form a grabbing chamber. The grabbing chamber is used to clamp the first supporting platform 15 that supports the material body. The driving plate is connected to the driving end of the grabbing driving device 72. The grabbing driving device 72 drives the driving clamping plate 74 to perform vertical movement and circular rotation along the grabbing frame 73. Among them, the first aspect: the design of the grabbing chamber formed under the driving clamp 74 and the grabbing frame 73 provides a mechanical and reliable clamping method, which can firmly accommodate and restrain the wafer carrier to prevent it from falling off during the grabbing, flipping and rotation process; the second aspect: the grabbing drive device 72 drives the driving clamp 74 to perform vertical movement and circular rotation along the grabbing frame 73, so that the grabbing device has the functions of lifting and rotation. The lifting is used to adjust the height when connecting with the push rod, and the rotation is used to adjust the carrier angle or may be used for fine-tuning at the work station.

[0009] Furthermore, the circular rotation motion of the grabbing drive device 72 includes a precise positioning mode; after the third grabbing device 55 grabs the wafer carrier, the grabbing drive device 72 performs a continuous rotation of 0°-360°, and the position is fed back in real time through the rotation angle sensor; the inner wall of the evaporation chamber 51 is preset with multiple positioning mark points, and when the third grabbing device 55 rotates to the target mark point, the driving clamp 74 locks the angle so that the evaporation surface of the wafer carrier is precisely perpendicular to the evaporation source of the evaporation component 52.

[0010] Furthermore, the drive clamping plate 74 is crescent-shaped, with its ends serving as guides and facilitating transport. First, the crescent shape provides excellent guidance for the wafer carrier as it enters the gripping chamber, facilitating smooth entry and minimizing the risk of collisions and jams. Second, the crescent shape prevents the clamping plate from forming sharp corners at the edge of the gripping chamber opening, reducing the possibility of accidental interference with the carrier or other components during movement or gripping. Third, the crescent design reduces weight and optimizes space while maintaining sufficient gripping area and strength.

[0011] In some embodiments, the evaporation assembly 52 includes a sliding shutter device 521, an evaporation frame 522, a first anti-fog plate 523, an evaporation crucible assembly 524, and a crucible drive device 525. The evaporation frame 522 is located at the bottom of the evaporation chamber 51, with the first anti-fog plate 523 located above it. Evaporation holes 5232 are located in the middle of the first anti-fog plate 523. A slide rail is located below the evaporation frame 522, and the evaporation crucible assembly 524 is located between the first anti-fog plate 523 and the slide rail. A crucible drive device 525 is located at one end of the slide rail, and its drive end is connected to the evaporation crucible assembly 524. The first anti-fog plate 523 located above the evaporation frame 522 primarily prevents the evaporated material from splashing and depositing on the upper wall of the evaporation chamber 5 and other non-target areas, thereby keeping the chamber clean and extending maintenance cycles.

[0012] Furthermore, the evaporation crucible assembly 524 includes a slider 5241, with multiple crucible cavities spaced apart on its upper surface. A crucible cover plate 526 is positioned above the slider 5241. The crucible cover plate 526 has a single evaporation source opening 5261, which corresponds to the evaporation holes 5232 of the first anti-deposition plate 523. The evaporation crucible assembly 524 includes the slider 5241, with multiple crucible cavities spaced apart on the slider 5241, each corresponding to an evaporation hole, and the design of the crucible drive device 525 connected to the evaporation crucible assembly 524. This design allows for convenient, rapid, and precise alignment of different evaporation sources (placed in different crucible cavities) with the evaporation holes 5232 by driving the slider 5241 on the slide rail, enabling sequential or co-evaporation of multiple materials and improving process flexibility.

[0013] Furthermore, a sliding shutter device 521 is disposed on the side of the evaporation chamber 5, with its lower portion corresponding to the upper portion of the evaporation holes 5232 of the first anti-fog plate 523. This serves to shield the evaporation source during non-processing periods or when wafers are being replaced. The lower portion of the sliding shutter device 521 corresponds to the upper portion of the evaporation holes of the first anti-fog plate 523, shielding the evaporation source during non-processing periods or when wafers are being replaced. This effectively prevents the evaporation source material from continuing to volatilize and contaminate the chamber or subsequent wafers during non-evaporation periods (such as wafer replacement or equipment standby), protecting the evaporation source itself and improving system stability and film purity.

[0014] In some embodiments, two evaporation detection holes 5231 are further provided at intervals on the sides of the first anti-fog plate 523. The evaporation detection assembly 53 includes a crystal oscillator probe 531, a second anti-fog plate 532, and a third anti-fog plate 533. A crystal oscillator probe 531 is provided on one side of the inner wall of the evaporation chamber 51. The crystal oscillator probe 531 is aligned with a detection evaporation hole 5231 for in-situ monitoring of evaporation data and avoiding impact of the main evaporation flow.

[0015] In some embodiments, the evaporation chamber 5 is further provided with an observation component, which includes an observation window 56 and a reflector 57. A second anti-fog plate 532 is provided above the side of the crystal oscillator probe 531, a reflector 57 is provided on the other side of the inner wall of the evaporation chamber 51, and a third anti-fog plate 533 is provided above the side of the reflector 57. An observation window 56 is provided on the corresponding surface of the evaporation chamber 5 and the reflector 57. The reflector 57 reflects the evaporation state to the observation window 56, and the third anti-fog plate 533 prevents the evaporated material from contaminating the observation window 56. Among them, firstly, the scene in the evaporation area (especially near the main evaporation hole) is reflected to the observation window 56 by the reflector 57, so that the operator can safely, conveniently and intuitively observe the real-time status of the evaporation process outside the chamber without having to directly face the high-temperature evaporation source and strong light; secondly, a second anti-fog plate 532 is provided above the side of the crystal oscillator probe 531, and a third anti-fog plate 533 is provided above the side of the reflector 57. These anti-fog plates effectively prevent the evaporated material from splashing toward the observation window 56 and the reflector 57, significantly reducing the deposition of the evaporated material on the observation window 56 and the reflector 57, maintaining the clarity of observation, and extending the cleaning cycle of the observation window 56 and the reflector 57; thirdly, it is convenient for the operator to monitor whether the evaporation source is working normally (such as whether it is arcing or in a molten state), whether the plasma is stable, etc., which helps to detect abnormalities in a timely manner.

[0016] Beneficial effects of the present invention: The present invention proposes an ultra-high vacuum evaporation device that is easy to process, comprising a first magnetic push rod conveying device 1, a second magnetic push rod conveying device 2, and a preparation chamber 3, a cleaning chamber 4, an evaporation chamber 5, and an oxidation chamber 6 connected in sequence. The evaporation chamber 5 comprises an evaporation chamber 51, an evaporation component 52, an evaporation detection component 53, a second flip drive device 54, and a third material grabbing device 55. The above-mentioned mechanism ensures that the evaporation surface is absolutely perpendicular to the evaporation source, and combined with the evaporation detection component 53, the ultimate precision of film uniformity and thickness is achieved; at the same time, the evaporation component 52 is a movable multi-crucible evaporation source design, which realizes fast and precise switching and alignment of different evaporation materials, supports efficient sequential evaporation or co-evaporation, and significantly improves process flexibility and production capacity; each anti-fouling plate and crucible cover plate 526 effectively prevents the evaporation material from contaminating the chamber, key components such as probes, observation windows and subsequent wafers, greatly reduces maintenance requirements, and ensures long-term stable operation of the equipment and film purity. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a diagram of the overall structure of the ultra-high vacuum evaporation device of the present invention that is easy to process.

[0018] Figure 2 The figure is a schematic structural diagram of the evaporation chamber of the ultra-high vacuum evaporation device which is easy to process according to the present invention.

[0019] Figure 3 The figure is a schematic structural diagram of the evaporation component of the ultra-high vacuum evaporation device which is easy to process according to the present invention.

[0020] Figure 4 The figure is a schematic structural diagram of the evaporation component of the ultra-high vacuum evaporation device which is easy to process according to the present invention.

[0021] Figure 5 This is a structural schematic diagram of the grabbing state of the third grabbing device of the ultra-high vacuum evaporation device that is easy to process according to the present invention.

[0022] Figure 6 This is a structural schematic diagram of the third material grabbing device of the ultra-high vacuum evaporation device that is easy to process according to the present invention in a released state.

[0023] Description of main component symbols

[0024] First magnetic push rod conveying device 1, second magnetic push rod conveying device 2, preparation chamber 3, cleaning chamber 4, evaporation chamber 5, evaporation chamber 51, evaporation component 52, sliding shutter device 521, evaporation frame 522, first anti-adhesion plate 523, detection evaporation hole 5231, evaporation evaporation hole 5232, evaporation crucible group 524, slider 5241, crucible drive device 525, crucible cover plate 526, evaporation source port 5261, evaporation detection component 53, crystal oscillator probe 531, second anti-adhesion plate 532, third anti-adhesion plate 533, second flip drive device 54, third grabbing device 55, observation window 56, reflector 57, oxidation chamber 6, grabbing mounting seat 71, grabbing drive device 72, grabbing frame 73, drive clamp 74.

[0025] The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION Example 1:

[0026] like Figure 1 The figure shows the overall structure of the ultra-high vacuum evaporation device that is easy to process according to the present invention. An ultra-high vacuum evaporation device that is easy to process comprises a first magnetic push rod conveying device 1, a second magnetic push rod conveying device 2, and a preparation chamber 3, a cleaning chamber 4, an evaporation chamber 5, and an oxidation chamber 6 that are sequentially connected. The first magnetic push rod conveying device 1 is provided at the input end of the preparation chamber 3, and the second magnetic push rod conveying device 2 is provided at the output end of the oxidation chamber 6. The first magnetic push rod conveying device 1 sequentially conveys wafers to the preparation chamber 3 and the cleaning chamber 4 for processing. The second magnetic push rod conveying device 2 receives the wafers in the cleaning chamber 4 and sequentially conveys them to the evaporation chamber 5 and the oxidation chamber 6 for processing. Figure 2 The figure shows a schematic diagram of the structure of the evaporation chamber of the ultra-high vacuum evaporation device for easy processing of the present invention. The evaporation chamber 5 includes an evaporation chamber 51, an evaporation component 52, an evaporation detection component 53, a second flip drive device 54, and a third gripping device 55. The output end of the cleaning processing chamber 41 is connected to the input end of the evaporation chamber 51. The evaporation component 52 is provided at the bottom of the evaporation chamber 51, and the evaporation detection component 53 is provided on the inner wall of the evaporation chamber 51. The evaporation detection component 53 is used to monitor the evaporation data of the evaporation component 52. A second flip drive device 54 is provided on one side of the evaporation chamber 51. The driving end of the second flip drive device 54 is provided with a third gripping device 55. When the second magnetic push rod conveying device 2 receives the wafer in the cleaning chamber 4 and transports it to the evaporation chamber 51, the third gripping device 55 grabs the wafer. After the wafer is grabbed, the evaporation chamber 51 below performs vacuum coating on the wafer. At the same time, the evaporation detection component 53 monitors the evaporation data in real time to improve the film thickness accuracy.

[0027] like Figure 5As shown, it is a structural schematic diagram of the grabbing state of the third grabbing device of the ultra-high vacuum evaporation device which is easy to process according to the present invention; Figure 6 The figure shows a schematic diagram of the structure of the third gripping device of the ultra-high vacuum evaporation device for easy processing according to the present invention in a released state. The third gripping device 55 includes a gripping mounting seat 71, a gripping drive device 72, a gripping frame 73, and a driving clamping plate 74. The gripping mounting seat 71 is provided at the driving end of the second flipping drive device 54. The gripping mounting seat 71 is provided above the gripping drive device 72. The gripping frame 73 is fixedly provided below the gripping drive device 72. The driving clamping plate 74 is provided below the gripping frame 73. The driving clamping plate 74 and the gripping frame 73 form a gripping chamber below the gripping frame 73. The gripping chamber is used to clamp the first supporting platform 15 for supporting the material body. The driving plate is connected to the driving end of the gripping drive device 72. The gripping drive device 72 drives the driving clamping plate 74 to move vertically and rotate in a circle along the gripping frame 73. Among them, the first aspect: the design of the grabbing chamber formed under the driving clamp 74 and the grabbing frame 73 provides a mechanical and reliable clamping method, which can firmly accommodate and restrain the wafer carrier to prevent it from falling off during the grabbing, flipping and rotation process; the second aspect: the grabbing drive device 72 drives the driving clamp 74 to perform vertical movement and circular rotation along the grabbing frame 73, so that the grabbing device has the functions of lifting and rotation. The lifting is used to adjust the height when connecting with the push rod, and the rotation is used to adjust the carrier angle or may be used for fine-tuning at the work station.

[0028] The circular rotation motion of the grabbing drive device 72 includes a precise positioning mode; after the third grabbing device 55 grabs the wafer carrier, the grabbing drive device 72 performs a continuous rotation of 0°-360°, and the position is fed back in real time through the rotation angle sensor; a plurality of positioning mark points are preset on the inner wall of the evaporation chamber 51, and when the third grabbing device 55 rotates to the target mark point, the driving clamp 74 locks the angle so that the evaporation surface of the wafer carrier is precisely perpendicular to the evaporation source of the evaporation component 52.

[0029] The drive clamping plate 74 is crescent-shaped, with its ends serving as guides and facilitating transport. First, the crescent shape provides excellent guidance for the wafer carrier as it enters the gripping chamber, facilitating smooth entry and minimizing the risk of collisions and jams. Second, the crescent shape prevents the clamping plate from forming sharp corners at the edge of the gripping chamber opening, reducing the possibility of accidental interference with the carrier or other components during movement or gripping. Third, the crescent design reduces weight and optimizes space while maintaining sufficient gripping area and strength.

[0030] like Figure 3-Figure 4The figure shows a schematic diagram of the structure of the evaporation assembly of the ultra-high vacuum evaporation device of the present invention, which is easy to process. The evaporation assembly 52 includes a sliding shutter device 521, an evaporation frame 522, a first anti-fog plate 523, an evaporation crucible assembly 524, and a crucible drive device 525. The evaporation frame 522 is located at the bottom of the evaporation chamber 51, with the first anti-fog plate 523 located above it. The first anti-fog plate 523 has an evaporation hole 5232 located in the middle. A slide rail is located below the evaporation frame 522, and the evaporation crucible assembly 524 is located between the first anti-fog plate 523 and the slide rail. A crucible drive device 525 is located at one end of the slide rail, and its drive end is connected to the evaporation crucible assembly 524. The first anti-fog plate 523 is located above the evaporation frame 522. The first anti-fog plate 523 is mainly used to prevent the evaporated material from splashing and depositing on the upper wall of the evaporation chamber 5 and other non-target areas, keeping the chamber clean and extending the maintenance cycle.

[0031] The evaporation crucible assembly 524 includes a slider 5241 with multiple crucible cavities spaced apart on its upper surface. A crucible cover plate 526 is positioned above the slider 5241. The crucible cover plate 526 has a single evaporation source opening 5261, which corresponds to the evaporation holes 5232 of the first anti-deposition plate 523. The evaporation crucible assembly 524 includes the slider 5241 with multiple crucible cavities spaced apart on its upper surface, each corresponding to an evaporation hole. The design of the crucible drive device 525 connected to the evaporation crucible assembly 524 allows for convenient, rapid, and precise alignment of different evaporation sources (placed in different crucible cavities) with the evaporation holes 5232 by driving the slider 5241 on the rails, enabling sequential or co-evaporation of multiple materials and improving process flexibility.

[0032] The sliding shutter device 521 is located on the side of the evaporation chamber 5, with its lower portion aligned above the evaporation holes 5232 of the first anti-fog plate 523. This serves to shield the evaporation source during non-processing periods or when wafers are being replaced. The lower portion of the sliding shutter device 521 corresponds to the upper portion of the evaporation holes of the first anti-fog plate 523, effectively preventing the evaporation source material from volatilizing and contaminating the chamber or subsequent wafers during non-deposition periods (such as wafer replacement or equipment standby). This protects the evaporation source itself, improving system stability and film purity.

[0033] Two evaporation detection holes 5231 are also provided at intervals on the sides of the first anti-fog plate 523. The evaporation detection assembly 53 includes a crystal oscillator probe 531, a second anti-fog plate 532, and a third anti-fog plate 533. A crystal oscillator probe 531 is provided on one side of the inner wall of the evaporation chamber 51. The crystal oscillator probe 531 is aligned with one of the evaporation detection holes 5231 for in-situ monitoring of evaporation data and avoiding impact of the main evaporation flow.

[0034] The evaporation chamber 5 is also provided with an observation component, which includes an observation window 56 and a reflector 57. A second anti-fog plate 532 is provided above the side of the crystal oscillator probe 531, a reflector 57 is provided on the other side of the inner wall of the evaporation chamber 51, and a third anti-fog plate 533 is provided above the side of the reflector 57. An observation window 56 is provided on the corresponding surface of the evaporation chamber 5 and the reflector 57. The reflector 57 reflects the evaporation state to the observation window 56, and the third anti-fog plate 533 prevents the evaporated material from contaminating the observation window 56. Among them, firstly, the scene in the evaporation area (especially near the main evaporation hole) is reflected to the observation window 56 by the reflector 57, so that the operator can safely, conveniently and intuitively observe the real-time status of the evaporation process outside the chamber without having to directly face the high-temperature evaporation source and strong light; secondly, a second anti-fog plate 532 is provided above the side of the crystal oscillator probe 531, and a third anti-fog plate 533 is provided above the side of the reflector 57. These anti-fog plates effectively prevent the evaporated material from splashing toward the observation window 56 and the reflector 57, significantly reducing the deposition of the evaporated material on the observation window 56 and the reflector 57, maintaining the clarity of observation, and extending the cleaning cycle of the observation window 56 and the reflector 57; thirdly, it is convenient for the operator to monitor whether the evaporation source is working normally (such as whether it is arcing or in a molten state), whether the plasma is stable, etc., which helps to detect abnormalities in a timely manner.

[0035] Working principle of the present invention:

[0036] (1) Wafer input and pre-processing: First, the first magnetic push rod conveyor 1 delivers the wafer into the preparation chamber 3 for preliminary processing, such as vacuuming and pre-heating. Second, the push rod device pushes the wafer from the preparation chamber 3 into the cleaning chamber 4 for surface cleaning.

[0037] (2) Wafer transfer and entry into the evaporation chamber: First, after the processing in the cleaning chamber 4 is completed, the second magnetic push rod conveying device 2 receives the wafer at the output end of the cleaning chamber 4. Then, the second magnetic push rod conveying device 2 transports the received wafer to the input end of the evaporation chamber 51 of the evaporation chamber 5.

[0038] (3) Grasping and precise positioning of wafers in the evaporation chamber: First, the second flip drive device 54 on the side of the evaporation chamber 51 drives the third grabbing device 55 to move to the appropriate position. Secondly, the grabbing drive device 72 of the third grabbing device 55 drives the crescent-shaped driving clamp 74 so that it and the grabbing chamber formed below the grabbing frame 73 firmly clamp the first carrier 15 that supports the wafer. Then, the grabbing drive device 72 executes the precise positioning mode: it drives the driving clamp 74 together with the wafer carrier to rotate continuously from 0° to 360°. Then, during the rotation process, the built-in rotation angle sensor feeds back the position information in real time. Finally, when it rotates to the target positioning mark point preset on the inner wall of the evaporation chamber 51, the driving clamp 74 locks the angle to ensure that the evaporation surface of the wafer and the evaporation source of the evaporation component 52 below are precisely perpendicular.

[0039] (4) Evaporation source preparation and evaporation process: First, according to the desired evaporation material, the crucible drive device 525 drives the slider 5241 of the evaporation crucible group 524 to move on the slide rail, accurately aligning the selected crucible hole containing the evaporation material with the evaporation hole 5232 on the first anti-adhesion plate 523 (at this time, the single evaporation source port 5261 of the crucible cover plate 526 also corresponds to this hole). Secondly, the sliding shutter device 521 located on the side of the evaporation chamber 5 is moved away to expose the evaporation hole 5232. Then, the evaporation source heats the material in the selected crucible hole, causing it to evaporate or sublime. Then, the material vapor generated by evaporation is ejected upward through the evaporation hole 5232 and deposited on the evaporation surface of the wafer that has been precisely positioned vertically to form a thin film.

[0040] (5) Real-time monitoring and process observation: First, the crystal oscillator probe 531 of the evaporation detection assembly 53 monitors the evaporation rate and deposited film thickness in real time through the detection evaporation hole 5231 on the side of the first anti-fog plate 523, and feeds the data back to the control system. Second, the control system accurately controls the evaporation process based on the monitoring data, such as adjusting the evaporation power and time, to ensure film thickness accuracy. At the same time, the operator can safely and clearly monitor the evaporation process status in real time through the observation window 56 on the evaporation chamber 5 with the help of the evaporation area reflected by the reflector 57. The second anti-fog plate 532 and the third anti-fog plate 533 effectively protect the observation window 56 and the reflector 57 from contamination.

[0041] (6) Chamber protection mechanism: First, the first anti-fog plate 523 blocks most of the evaporation material that splashes upward, protecting the upper wall of the evaporation chamber 5. Second, during non-evaporation periods, such as when changing wafers or when the equipment is in standby mode, the sliding shield device 521 quickly moves to block the top of the evaporation hole 5232 to prevent contamination. Finally, the crucible cover plate 526 is designed to only expose the evaporation source port 5261 corresponding to the active crucible cavity, reducing the volatilization of other materials.

[0042] (7) Wafer output and subsequent processing: First, after the evaporation process is completed, the third gripper 55 releases the first carrier 15 carrying the coated wafer. Next, the second magnetic push rod conveyor 2 receives the wafer. Then, the second magnetic push rod conveyor 2 conveys the wafer to the oxidation chamber 6 for subsequent processing, such as oxidation or annealing. Finally, the processed wafer is removed from the output end of the oxidation chamber 6.

[0043] Beneficial effects of the present invention: The present invention proposes an ultra-high vacuum evaporation device that is easy to process, comprising a first magnetic push rod conveying device 1, a second magnetic push rod conveying device 2, and a preparation chamber 3, a cleaning chamber 4, an evaporation chamber 5, and an oxidation chamber 6 connected in sequence. The evaporation chamber 5 comprises an evaporation chamber 51, an evaporation component 52, an evaporation detection component 53, a second flip drive device 54, and a third material grabbing device 55. The above-mentioned mechanism ensures that the evaporation surface is absolutely perpendicular to the evaporation source, and combined with the evaporation detection component 53, the ultimate precision of film uniformity and thickness is achieved; at the same time, the evaporation component 52 is a movable multi-crucible evaporation source design, which realizes fast and precise switching and alignment of different evaporation materials, supports efficient sequential evaporation or co-evaporation, and significantly improves process flexibility and production capacity; each anti-fouling plate and crucible cover plate 526 effectively prevents the evaporation material from contaminating the chamber, key components such as probes, observation windows and subsequent wafers, greatly reduces maintenance requirements, and ensures long-term stable operation of the equipment and film purity.

[0044] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. An ultra-high vacuum evaporation device that is easy to process, comprising a first magnetic push rod conveying device (1), a second magnetic push rod conveying device (2), and a preparation chamber (3), a cleaning chamber (4), an evaporation chamber (5), and an oxidation chamber (6) that are sequentially connected. The first magnetic push rod conveying device (1) is provided at the input end of the preparation chamber (3), and the second magnetic push rod conveying device (2) is provided at the output end of the oxidation chamber (6). The first magnetic push rod conveying device (1) sequentially conveys wafers to the preparation chamber (3) and the cleaning chamber (4) for processing. The second magnetic push rod conveying device (2) receives wafers in the cleaning chamber (4) and sequentially conveys them to the evaporation chamber (5) and the oxidation chamber (6) for processing. The evaporation chamber (5) comprises an evaporation chamber body (51), an evaporation component (52), an evaporation detection component (53), a second flip drive device ( 54), a third material grabbing device (55), the output end of the cleaning processing chamber (41) is connected to the input end of the evaporation chamber (51), an evaporation component (52) is provided at the bottom of the evaporation chamber (51), an evaporation detection component (53) is provided on the inner wall of the evaporation chamber (51), the evaporation detection component (53) is used to monitor the evaporation data of the evaporation component (52), a second flip drive device (54) is provided on one side of the evaporation chamber (51), and a third material grabbing device (55) is provided at the driving end of the second flip drive device (54), when the second magnetic push rod conveying device (2) receives the wafer in the cleaning chamber (4) and conveys the wafer to the evaporation chamber (51), the third material grabbing device (55) grabs the material body, and after grabbing, the evaporation chamber (51) below performs vacuum coating on the material body, and at the same time, the evaporation detection component (53) monitors the evaporation data in real time to improve the film thickness accuracy.

2. The ultra-high vacuum evaporation device according to claim 1, wherein: The third material grabbing device (55) includes a material grabbing mounting seat (71), a material grabbing driving device (72), a material grabbing frame (73), and a driving clamp (74). The driving end of the second flip driving device (54) is provided with a material grabbing mounting seat (71), a material grabbing driving device (72) is provided above the material grabbing mounting seat (71), a material grabbing frame (73) is fixedly provided below the material grabbing driving device (72), a driving clamp (74) is provided below the material grabbing frame (73), and a material grabbing chamber is formed between the driving clamp (74) and the bottom of the material grabbing frame (73). The material grabbing chamber is used to clamp the first supporting platform (15) for supporting the material body. The driving plate is connected to the driving end of the material grabbing driving device (72), and the material grabbing driving device (72) drives the driving clamp (74) to perform vertical movement and circular rotation along the material grabbing frame (73).

3. The ultra-high vacuum evaporation device according to claim 2, wherein: The circular rotation motion of the grabbing drive device (72) includes a precise positioning mode; after the third grabbing device (55) grabs the wafer carrier, the grabbing drive device (72) performs a continuous rotation of 0°-360°, and the position is fed back in real time through the rotation angle sensor; a plurality of positioning marking points are preset on the inner wall of the evaporation chamber (51), and when the third grabbing device (55) rotates to the target marking point, the driving clamp (74) locks the angle so that the evaporation surface of the wafer carrier is precisely perpendicular to the evaporation source of the evaporation component (52).

4. The ultra-high vacuum evaporation device according to claim 2, wherein: The driving splint (74) is a crescent-shaped structure, and both ends of the crescent-shaped structure serve as a guide and facilitate transportation.

5. The ultra-high vacuum evaporation device according to claim 1 , wherein: The evaporation assembly (52) comprises a sliding shield device (521), an evaporation frame (522), a first anti-adhesion plate (523), an evaporation crucible group (524), and a crucible driving device (525); the evaporation frame (522) is arranged at the bottom of the evaporation cavity (51), the first anti-adhesion plate (523) is arranged above it, and an evaporation evaporation hole (5232) is arranged in the middle of the first anti-adhesion plate (523); a slide rail is arranged below the evaporation frame (522), the evaporation crucible group (524) is arranged between the first anti-adhesion plate (523) and the slide rail, and a crucible driving device (525) is arranged at one end of the slide rail, and the driving end of the slide rail is connected to the evaporation crucible group (524).

6. The ultra-high vacuum evaporation device according to claim 5, wherein: The evaporation crucible group (524) comprises a slider (5241), a plurality of crucible holes are arranged at intervals on the upper surface of the slider (5241), and a crucible cover plate (526) is arranged above the slider (5241); the crucible cover plate (526) is provided with a single evaporation source port (5261), and the evaporation source port corresponds to the vapor deposition evaporation hole (5232) of the first anti-deposition plate (523).

7. The ultra-high vacuum evaporation device according to claim 5, wherein: The sliding shield device (521) is arranged on the side of the evaporation chamber (5), with its lower portion corresponding to the upper portion of the evaporation hole (5232) of the first anti-deposition plate (523), and serves to shield the evaporation source during non-processing periods or when replacing wafers.

8. The ultra-high vacuum evaporation device according to claim 5, wherein: Two evaporation detection holes (5231) are further provided at intervals on the side of the first anti-adhesion plate (523). The evaporation detection assembly (53) comprises a crystal oscillator probe (531), a second anti-adhesion plate (532), and a third anti-adhesion plate (533). A crystal oscillator probe (531) is provided on one side of the inner wall of the evaporation cavity (51). The crystal oscillator probe (531) is aligned with one of the evaporation detection holes (5231) for in-situ monitoring of evaporation data and avoiding impact of the main evaporation flow.

9. The ultra-high vacuum evaporation device according to claim 5, wherein: The evaporation chamber (5) is further provided with an observation component, which includes an observation window (56) and a reflector (57). A second anti-adhesion plate (532) is provided above the side of the crystal oscillator probe (531), a reflector (57) is provided on the other side of the inner wall of the evaporation chamber (51), and a third anti-adhesion plate (533) is provided above the side of the reflector (57). An observation window (56) is provided on the corresponding surface of the evaporation chamber (5) and the reflector (57). The reflector (57) reflects the evaporation state to the observation window (56), and the third anti-adhesion plate (533) prevents the evaporation material from contaminating the observation window (56).

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