Circulation device for chip testing

Abstract

According to the circulation device for chip testing provided by the invention, the feeding mechanism, the receiving mechanism, the pre-warming mechanism, the tray temporary storage mechanism and the transfer station are intensively arranged in the Y-direction front side functional area of the carrying table, and the overhead transfer mechanism is arranged above the functional area to transfer chips and trays; the testing mechanism is arranged in the rear functional area, and the shuttle transfer mechanism which can be in butt joint with the overhead transfer mechanism is arranged to realize the transfer of the chip before and after the test. Therefore, only one overhead transfer mechanism and one shuttling transfer mechanism are needed to be matched to realize the full-process circulation of the chips and the trays, the mechanical structure of the three-temperature test sorting machine is greatly simplified, and the manufacturing cost is reduced. Meanwhile, a variable-pitch chip taking and placing assembly is arranged on the overhead transfer mechanism, a plurality of chips can be transferred at the same time, adaptive pitch variation can be carried out, switching transfer is carried out on the chips to be tested and the tested chips in combination with a double-layer carrying disc, high transfer efficiency is achieved, and therefore the test efficiency of the chips is greatly improved.

Description

Technical Field

[0001] The present invention relates to the field of chip testing, and in particular to a chip testing circulation device. Background Art

[0002] Three-temperature test and sorting machines are widely used in chip manufacturing and testing fields. They simulate low-temperature, normal-temperature, and high-temperature environments to perform performance testing and quality sorting on chips with higher performance requirements (such as automotive-grade chips).

[0003] Due to the limitations of the mechanical structure itself and the limitations of the conventional layout, the current three-temperature test sorting machine's flow device has the following problems: the existing general use of divided areas and different loading and unloading components to load and unload chips respectively, and a separate set of tray moving arms is used to transfer the tray, which has a high cost; the horizontal layout area is large, the transfer path is long, and the overall volume of the equipment is large; there are many connection steps for multiple sets of loading and unloading components, and the transfer rate is low.

[0004] In view of this, it is necessary to improve the existing chip test circulation device to solve the above problems. It should be noted that the above introduction to the background technology is only for the convenience of providing a clear and complete description of the technical solutions of this application and facilitating the understanding of those skilled in the art. It should not be assumed that the above technical solutions are well known to those skilled in the art simply because they are described in the background technology section of this application. Summary of the Invention

[0005] The purpose of the present invention is to disclose a chip testing transfer device to solve the problems of the conventional three-temperature test sorting machine's transfer device having a complex structure, low transfer efficiency and high cost.

[0006] To achieve the above-mentioned purpose, the present invention provides a chip testing flow device, which is equipped with several functional mechanisms and transfer stations arranged in the functional area on the front side of the carrier Y, a testing mechanism arranged in the functional area on the rear side of the carrier Y and located directly behind the transfer station, and a shuttle transfer mechanism and an overhead transfer mechanism arranged on the carrier, wherein: The test mechanism is equipped with a test seat and a floating test module arranged above the test seat, and the floating test module is equipped with an adsorption member for adsorbing the chip; The shuttle mechanism has at least two layers of carriers, and the at least two layers of carriers are configured to move back and forth between the transfer station and the test mechanism. The carriers are configured to carry chips and pass through between the test seat and the floating test module; The overhead transfer mechanism is configured with a moving component, which is overhead arranged above the functional area on the front side of the carrier Y and moves along the XY direction. The moving component is configured with a tray picking and placing component that can be raised and lowered along the Z direction, at least two groups of chip picking and placing components that can be raised and lowered along the Z direction, and an X-direction slide rail, wherein at least one group of the chip picking and placing components is slidably connected to the X-direction slide rail, and the sliding stroke of the chip picking and placing components on the X-direction slide rail is controlled to adjust the spacing between adjacent chip picking and placing components.

[0007] As a further improvement of the present invention, at least two layers of the carriers have no overlapping area in the Z direction, and at the transfer station, the projections of at least two layers of the carriers on the XY plane have no overlapping area, and the height of the carrier located on the Y forward side is higher than the height of the carrier located on the Y rear side.

[0008] As a further improvement of the present invention, the shuttle transfer mechanism is equipped with a temperature control component connected to at least one layer of the carrier, and the height of the carrier equipped with the temperature control component in the Z direction is lower than the carrier not equipped with the temperature control component.

[0009] As a further improvement of the present invention, the functional mechanism includes a preheating mechanism, and the preheating mechanism, the shuttle transfer mechanism and the floating test module are all configured with a temperature control component for temperature control, so that the chip to be tested, which has been preheated by the preheating mechanism, can maintain a constant temperature during the process of being transferred to the test seat for testing through the carrier and the floating test module.

[0010] As a further improvement of the present invention, the circulation device is equipped with a height measuring sensor assembly, which is arranged on the Y forward side of the testing mechanism, and the end face height of the bottom end of the height measuring sensor assembly is higher than the upper end face height of the topmost carrier.

[0011] As a further improvement of the present invention, the functional mechanism includes a feeding mechanism, a receiving mechanism and a pre-heating mechanism, the feeding mechanism and the receiving mechanism are configured with a tray for carrying chips in batches, the tray is provided with a plurality of first accommodating slots for accommodating chips; the pre-heating mechanism is configured with a temperature-adjustable pre-heating tray, the pre-heating tray is provided with a plurality of second accommodating slots for accommodating chips; the carrier is provided with a plurality of third accommodating slots for accommodating chips; The distance between adjacent chip placement components along the X direction changes in the process of being driven by the moving component to move to the material tray, the pre-heating tray or the carrier tray, corresponding to the distance between adjacent first accommodating grooves, adjacent second accommodating grooves or adjacent third accommodating grooves.

[0012] As a further improvement of the present invention, the functional mechanism also includes a tray temporary storage mechanism, the feeding mechanism and the receiving mechanism are arranged on the Y-front side and arranged in sequence along the direction, the preheating mechanism, the transfer station and the tray temporary storage mechanism are arranged on the Y-rear side and arranged in sequence along the X direction, and the tray picking and placing assembly is configured to transfer the tray according to a preset tray flow path.

[0013] As a further improvement of the present invention, the functional mechanism includes a feeding mechanism and a receiving mechanism, each of which is provided with a silo for accommodating material trays, a lifting mechanism provided below the silo for driving the material trays to be lifted and lowered, and a positioning assembly for positioning the material tray on the top layer when it is lifted to a preset position; The positioning assembly includes support members arranged on both sides of the top of the silo in the X direction, an end positioning member arranged at the front end of the silo Y and / or a side positioning member arranged on one side of the silo in the X direction.

[0014] As a further improvement of the present invention, the overhead transfer mechanism is equipped with an XY-axis guide frame, the XY-axis guide frame includes a Y-axis guide assembly arranged on the carrier and an X-axis guide assembly overhead connected to the Y-axis guide assembly, and the moving assembly is arranged on the X-axis guide assembly; the X-axis guide assembly is equipped with a vacuum generator, the chip pick-and-place assembly and the tray pick-and-place assembly are both equipped with an adsorption module and a Z-axis drive assembly for driving the adsorption module to move up and down along the Z-axis, and the vacuum generator provides a vacuum source for adsorption to the adsorption module.

[0015] As a further improvement of the present invention, the chip pick-and-place assembly is configured with a first adsorption module and a first Z-direction drive assembly, the first adsorption module includes a suction rod, an adapter provided at the upper end of the suction rod, and a suction nozzle provided at the lower end of the suction rod, the suction rod is connected to the vacuum generator via the adapter through a vacuum tube, the first Z-direction drive assembly includes a first power source, a first belt transmission assembly driven by the first power source, and a first sliding assembly driven by the first belt transmission assembly, the suction rod is linked to the first sliding assembly, and the first belt transmission assembly and the first sliding assembly are both arranged to extend along the Z-axis; The tray picking and placing assembly is configured with a second adsorption module and a second Z-direction drive assembly. The second Z-direction drive assembly includes a second power source and a second sliding assembly driven by the second power source. The second sliding assembly is linked to the second adsorption module. The second sliding assembly is extended along the Z-axis. The central area of ​​the tray is provided with an adsorption portion for positioning and adsorption by the second adsorption module.

[0016] Compared with the prior art, the present invention has the following beneficial effects: The chip testing circulation device provided by the present invention has a high transfer efficiency. The device is configured by centrally arranging a feeding mechanism, a receiving mechanism, a preheating mechanism, a tray temporary storage mechanism, and a transfer station in the Y-front functional area of ​​the carrier, and arranging an overhead transfer mechanism above the Y-front functional area to transfer chips and trays. The device is configured by arranging a testing mechanism in the rear functional area and directly behind the transfer station, and arranging at least two layers of trays that can be docked with the overhead transfer mechanism to shuttle between the transfer station and the testing mechanism to achieve chip transfer before and after testing. The device is integrated with a variable-distance chip pick-up and placement component and a tray pick-up and placement component on the moving component on the overhead transfer mechanism, so that multiple chips can be transferred simultaneously and the distance can be adaptively changed for trays, preheating trays, and carriers with chip accommodating slots set at different spacings. The same moving component can be used to achieve timely circulation of empty trays.

[0017] The horizontal layout of the flow device is compact, and it only requires at least one overhead transfer mechanism and one shuttle transfer mechanism to realize the full-process flow of chips and trays in chip testing. It greatly simplifies the mechanical structure of the three-temperature test sorting machine and reduces the cost. The moving stroke of the overhead transfer mechanism and the shuttle transfer mechanism is short, which saves transfer time and greatly improves the chip testing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of the layout of a chip testing circulation device provided by the present invention; Figure 2 A schematic diagram of the three-dimensional structure of a chip testing circulation device provided by the present invention; Figure 3 for Figure 2 A schematic diagram of the three-dimensional structure of the circulation device shown in another angle; Figure 4 A schematic diagram of the three-dimensional structure of a feeding mechanism and a receiving mechanism provided by the present invention; Figure 5 A schematic diagram of the three-dimensional structure of an overhead transfer mechanism provided by the present invention; Figure 6 A schematic diagram of the three-dimensional structure of the second moving assembly in the overhead transfer mechanism provided by the present invention; Figure 7 This is a schematic diagram of the top view of a feeding tray; Figure 8 It is a structural schematic diagram of a pre-heating mechanism; Figure 9 for Figure 3 An enlarged schematic diagram of the shuttle transfer mechanism; Figure 10A shuttle transfer mechanism provided by the present invention is configured with two carriers as an embodiment, and is a side view schematic diagram of the configuration of the carriers at the transfer station and the test station. DETAILED DESCRIPTION

[0019] The present application is described in detail below with reference to the various embodiments shown in the accompanying drawings, but it should be noted that these embodiments are not limitations of the present application, and any equivalent transformations or substitutions in functions, methods, or structures made by ordinary technicians in this field based on these embodiments are within the scope of protection of the present application.

[0020] Combine Figures 1 to 7 The present application provides a chip testing transfer device 100 suitable for use in a three-temperature test sorting machine. By transferring the chips through the transfer device 100, the chips are pre-heated, tested, screened, and sorted. In the three-dimensional coordinate system illustrated in the accompanying drawings, the X-axis corresponds to the horizontal direction of this embodiment, the Y-axis corresponds to the horizontal direction of this embodiment, and the Z-axis corresponds to the vertical direction, i.e., the height direction, in this embodiment.

[0021] Ginseng Figures 1 to 3 As shown, the flow device 100 is configured with a first functional area, a second functional area and a third functional area arranged in sequence along the Y direction. The first functional area is arranged in sequence along the X direction for a feeding station for chip loading and at least two receiving stations for chip unloading. The second functional area is arranged in sequence along the X direction for a pre-heating station for chip pre-heating, a transfer station for transferring chips before and after testing, and a temporary storage station for temporarily storing material trays. The third functional area is arranged with a test station for testing chips.

[0022] A feeding mechanism 10 is provided at the feeding station, a preheating mechanism 20 is provided at the preheating station, a testing mechanism 30 is provided at the testing station, a material tray temporary storage mechanism 40 is provided at the temporary storage station, and a material receiving mechanism 50 is provided at the receiving station.

[0023] In this embodiment, due to the influence of the mechanical mechanism, the feeding mechanism 10, the receiving mechanism 50, the preheating mechanism 20, and the tray temporary storage mechanism 40 have a relatively low height in the Z direction, while the testing mechanism 30 has a relatively high height in the Z direction, and the chips cannot be taken and placed from above the testing mechanism 30. In order to arrange the various functional areas as reasonably and compactly as possible and to enable the flow of chips (not shown) and trays 80 between multiple stations using as few transfer mechanisms as possible, the transfer device 100 provided in this application sets the transfer station between the preheating station and the temporary storage station in the second functional area, and the testing station is set directly behind the transfer station along the Y direction. As a result, the reciprocating transfer of chips between the transfer station and the testing station can be achieved by only setting up a shuttle transfer mechanism 60, and the shuttle transfer mechanism 60 is configured to have a relatively low height in the Z direction. Furthermore, by simply setting up an overhead transfer mechanism 70 with a gantry structure, the chips and trays 80 can be efficiently transferred between the feeding mechanism 10, the preheating mechanism 20, the shuttle transfer mechanism 60, the tray temporary storage mechanism 40 and the receiving mechanism 50.

[0024] In one embodiment, the functional mechanisms on the feeding station, receiving station, pre-warming station, transfer station, testing station, and temporary storage station, the overhead transfer mechanism 70, and the shuttle transfer mechanism 60 can be arranged on the same carrier.

[0025] In another embodiment, for example, since a lifting mechanism 12 is provided below the feeding mechanism 10 and the receiving mechanism 50, resulting in a relatively high relative height of the feeding mechanism 10 and the receiving mechanism 50, in order to reduce the Z-direction displacement of the overhead transfer mechanism 70 during the transfer process, two platforms with a height difference between the front and rear sides can be provided to reduce the relative height difference between the feeding mechanism 10 and the receiving mechanism 50 and the pre-heating, shuttle transfer mechanism 60 and the tray temporary storage mechanism 40. Specifically, refer to Figure 2 As shown, a first carrier 110 is provided in the front area, and a second carrier 120 is provided in the rear area. The height of the first carrier 110 in the Z direction is lower than the height of the second carrier 120 in the Z direction. The first carrier 110 is used to arrange the workstations and their functional mechanisms of the above-mentioned first functional area, and the second carrier 120 is used to arrange the workstations and their functional mechanisms of the above-mentioned second functional area.

[0026] Combine Figures 2 to 4 As shown, the feeding mechanism 10 and the receiving mechanism 50 are both equipped with a material bin for placing the material tray 80 . The material bin of the feeding mechanism 10 is defined as a feeding bin 101 , and the material bin of the receiving mechanism 50 is defined as a receiving bin 501 .

[0027] Before the circulation device 100 is put into operation, a tray 80 containing chips to be tested is placed in advance in the feeding bin 101. It is preferred to stack multiple trays 80 during loading to reduce the number of loading and unloading operations. Only one empty tray 80 needs to be placed in advance in the receiving bin 501. During operation, when the trays 80 in the receiving bin 501 are full of chips, an empty tray 80 is added through the circulation device 100 and stacked on top of the full trays 80.

[0028] In one embodiment, the circulation device 100 is further configured with multiple lifting mechanisms 12 for driving the material trays 80 within the silos of the feeding mechanism 10 and the receiving mechanism 50 to rise and fall. These lifting mechanisms 12 are respectively disposed below the feeding silo 101 and the receiving silo 501. The lifting mechanisms 12 disposed below the feeding mechanism 10 can push the stack of material trays 80 upward from the bottommost material tray 80, thereby pushing the topmost material tray 80 to a predetermined height. The lifting mechanisms 12 disposed below the feeding mechanism 10 can support the stack of material trays 80 from the bottommost material tray 80 and lower the topmost material tray 80 to a predetermined height. For example, the lifting mechanisms 12 are equipped with a lifting plate 121 that can be raised and lowered in the Z direction. The lifting plate 121 can extend through the bottom of the feeding silo 101 or the receiving silo 501. The bottommost material tray 80 is placed on the upper end surface of the lifting plate 121, thereby enabling the lifting plate to raise and lower the stack of material trays 80.

[0029] Both the feeding mechanism 10 and the receiving mechanism 50 are equipped with a positioning assembly 13 for supporting and positioning the topmost material tray 80 when it is raised to a preset position. This assembly is suitable for various sizes of material trays 80 and provides high positioning stability. In one embodiment, the positioning assembly 13 includes a plurality of support members 131 arranged on both sides of the top of the silo in the X direction and an end positioning member 132 arranged at the front end of the silo in the Y direction. The support members 131 are used to support the topmost material tray 80, and the end positioning member 132 can move relative to the silo in the Y direction to move away from or closer to the end of the material tray 80. Furthermore, the positioning assembly 13 can also be equipped with a side positioning member 133 located on one side of the silo in the X direction. The side positioning member 133 can move relative to the silo in the X direction to move away from or closer to the side of the material tray 80.

[0030] The circulation device 100 is equipped with at least two receiving stations, that is, at least two receiving mechanisms 50. For example, in one embodiment, the circulation device 100 is equipped with three receiving mechanisms 50, wherein the first receiving mechanism 51 is used to receive chips that meet the inspection standards, the second receiving mechanism 52 is used to receive chips that do not meet the inspection standards, and the third receiving mechanism 53 is used as a backup. For example, the third receiving mechanism 53 can cooperate with the first receiving mechanism 51 to receive chips that meet the inspection standards.

[0031] Ginseng Figure 7As shown, the material tray 80 is used to carry chips in batches, and a plurality of first receiving grooves 811 for accommodating chips are configured on the material tray 80, and the first receiving grooves 811 are arranged in an array along the X and Y directions. For material trays 80 of the same specifications, the sizes of the first receiving grooves 811 are preferably the same, so as to carry chips that match the size of the first receiving grooves 811 in batches. The spacing between adjacent first receiving grooves 811 is also preferably the same to facilitate the batch loading and unloading and transfer of chips. The first receiving groove 811 has an annular first positioning structure 812 for positioning the chip. Furthermore, the central area of ​​the material tray 80 is also provided with an adsorption portion 821, for example, formed by an annular second positioning structure 822, which is used for positioning the material tray 80 when the overhead transfer mechanism 70 adsorbs it.

[0032] Combine Figure 2 、 Figure 3 and Figure 8 As shown, the preheating mechanism 20 is equipped with a preheating tray 21, a first mounting base 22 for placing the preheating tray 21, and a first temperature control assembly for controlling the temperature of the preheating tray 21. The first temperature control assembly includes a first cooling unit 24 for cooling the preheating tray 21 and a first heating unit 23 for heating the preheating tray 21. During low-temperature chip testing, the first cooling unit 24 cools the preheating tray 21, providing a low-temperature environment (generally below 0°C) for the chips placed on it. During high-temperature chip testing, the first heating unit 23 heats the preheating tray 21, providing a high-temperature environment (generally above 25°C) for the chips placed on it.

[0033] In one embodiment, the first cooling unit 24, the first heating unit 23, and the pre-heating tray 21 are stacked from bottom to top along the Z-axis, with the first cooling unit 24 fixed to the first fixing base 22. The first cooling unit 24 is constructed with a cooling channel for circulating refrigerant. The input and output ports of the cooling channel are connected to the refrigeration system, which provides refrigerant at a preset temperature. The first heating unit 23 includes a heating plate and several groups of resistance wires evenly distributed on the heating plate. Positioning the first heating unit 23 above the first cooling unit 24, that is, placing it closer to the pre-heating tray 21, allows for better temperature control of the pre-heating tray 21. For example, if the preset pre-heating temperature is -40°C and the previous test temperature is -45°C, the pre-heating tray 21 can be directly heated to -40°C using the heating plate. This allows for faster temperature control than increasing the temperature by adjusting the refrigerant temperature in the first cooling unit 24.

[0034] The pre-warming plate 21 is provided with a plurality of second accommodating slots 211 for accommodating chips. The second accommodating slots 211 are arranged in an array along the X and Y directions. For pre-warming plate 21 of the same specifications, the second accommodating slots 211 are preferably of the same size to batch pre-warm chips that match the size of the second accommodating slots 211. The spacing between adjacent second accommodating slots 211 is also preferably uniform to facilitate positioning calculations during chip transfer.

[0035] To enable the flow device 100 to be applied to the testing of chips of various sizes, in one embodiment, the preheating plate 21 is detachable relative to the first fixing seat 22 so that preheating plates 21 of different sizes can be used for preheating chips of different sizes.

[0036] Combine Figure 1 、 Figure 3 、 Figure 9 and Figure 10 As shown, the shuttle transfer mechanism 60 includes a first movable assembly 602 disposed on a Y-guide rail assembly 601, and the first movable assembly 602 is configured to reciprocate between the transfer station and the test station. The first movable assembly 602 is configured with at least two layers of carriers 61, and at least two layers of carriers 61 do not have overlapping areas in the Z direction to avoid interference between the carriers 61 during the reciprocating movement. At least one of the carriers 61 is used to place the chip to be tested, where the chip to be tested refers to the chip that is transferred from the preheating plate 21 after preheating and further needs to be transferred to the testing mechanism 30 for testing; at least one carrier 61 is used to place the tested chip, where the tested chip refers to the chip that is transferred from the testing mechanism 30 after testing and further needs to be transferred to the receiving mechanism 50 for receiving.

[0037] The upper surface of the carrier 61 is recessed with third accommodating grooves 610 for accommodating chips. Multiple third accommodating grooves 610 can be arranged along the X direction, or in multiple rows along the Y direction. To facilitate measurement of the height of the carrier 61 and the height and flatness of the inserted chips, preferably, multiple height sensors 302 are fixed to the Y-forward side of the bracket 301 of the test mechanism 30. The height sensors 302 are movable along the Y direction. During the debugging phase, the carrier 61 is moved to the Y-forward side of the bracket 301, and the position of the height sensors 302 is adjusted laterally. The relative height of the carrier 61 and the relative height of the third accommodating grooves 610 before and after the chips are inserted are measured, and the test data is transmitted to the controller.

[0038] In one embodiment, the first moving assembly 602 is configured to secure and slide the carrier 61 onto a base (not shown). The base is slidably connected to the Y-guide rail assembly 601. For carriers 61 of the same specifications, the size and spacing of the third receiving slots 610 are preferably the same. To enable the transfer device 100 to test chips of various sizes, the carrier 61 is preferably detachable from the base, allowing carriers 61 of different sizes to be used for different chip sizes.

[0039] To prevent rapid temperature loss during the transfer of preheated chips from the carrier 61 to the test station for testing, in one embodiment, the first moving assembly 602 is further configured with a second temperature control assembly (not shown) for compensating the temperature of the carrier 61. The second temperature control assembly includes a second cooling unit and a second heating unit. When performing low-temperature testing on the chips, the second cooling unit provides the same low temperature as the preheating plate 21 to the chips on the carrier 61, allowing the chips to maintain a constant low temperature during transfer from the carrier 61 to the test station. When performing high-temperature testing on the chips, the second heating unit provides the same high temperature as the preheating plate 21 to the chips on the carrier 61, allowing the chips to maintain a constant high temperature during transfer from the carrier 61 to the test station.

[0040] During the transfer station, the projections of at least two layers of carriers 61 on the XY plane do not overlap. The carrier 61 located on the Y-forward side is higher than the carrier located on the Y-rearward side, preventing interference with the overhead transfer mechanism 70 during transfer. Furthermore, the lower layer of carriers 61 is configured to receive chips under test that have been preheated on the preheating plate 21, while the upper layer of carriers 61 is configured to receive tested chips. When removing tested chips, the overhead transfer mechanism 70 has a relatively short docking distance with the upper layer of carriers 61. A second temperature control assembly (not shown) need only be positioned below the lower layer of carriers 61 that support the chips under test. Its structural arrangement mirrors the arrangement of the first temperature control assembly below the preheating plate 21.

[0041] Specifically, for example, combining Figure 9 and Figure 10The diagram illustrates a two-layer carrier 61 configuration. At the transfer station, the shorter carrier 61 is positioned on the Y-axis rearward, defined as the lower carrier 611. The taller carrier 61 is positioned on the Y-axis forward, defined as the upper carrier 612. The lower carrier 611 is mounted on a first base 6110, while the upper carrier 612 is mounted on a second base 6120. The Y-guide rail assembly 601 is configured with a first Y-guide rail 6011 and a second Y-guide rail 6012. The first base 6110 is slidably connected to the first Y-guide rail 6011, the second Y-guide rail 6012 is fixed to the first base 6110, and the second base 6120 is slidably connected to the second Y-guide rail 6011. Two independent drive mechanisms drive the displacement of the first base 6110 and the second base 6120, respectively, thereby controlling the reciprocating movement of the lower carrier 611 and the upper carrier 612 between the transfer station and the testing station according to a predetermined travel range.

[0042] In other alternative embodiments, the first moving component 602 may also be configured with three or more carriers 61 , and the switching mode of movement between the multiple carriers 61 is configured according to actual needs.

[0043] Combine Figures 1 to 3 As shown, the test mechanism 30 includes a test seat 31 and a floating test module 32 located above the test seat 31. The test seat 31 is connected to a test device (not shown) for implementing chip testing and verification. During chip testing, the floating test module 32 is pressed against the test seat 31 to hold the chip between the lower end surface of the floating test module 32 and the test seat 31, providing a certain amount of pressure on the chip to be tested to ensure the stability of the test and the reliability of the data. The floating test module 32 is fixed to the bracket 301. Since the floating test module 32 needs to be suspended above the test seat 31 along the Z direction and the floating test module 32 needs to be moved up and down by setting a Z guide rail, the test mechanism 30 has a relatively high relative height along the Z direction.

[0044] The floating test module 32 is equipped with an adsorption member (not shown) for adsorbing chips. After a batch of chips are tested, the first movable component 602 is moved between the test seat 31 and the floating test module 32. The tested chip on the test seat 31 is first adsorbed into the third receiving groove 610 of the carrier 61 by the adsorption member, and then the chip to be tested in another third receiving groove 610 on the carrier 61 is adsorbed onto the test seat 31 by the adsorption member, while providing a stable holding force when the chip is tested on the test seat 31.

[0045] In the above-mentioned embodiment of setting up a double-layer carrier, the cooperation of the upper carrier 612 and the lower carrier 611 for chip test transfer can be, for example, adopted as follows: when a batch of chips are tested, the chips to be tested on the material tray 80 in the feeding mechanism 10 are transferred to the pre-heating tray 21 through the chip pick-up and placement component 71, and then the chips to be tested that have been preheated by the pre-heating tray 21 are first transferred to the lower carrier 611 through the chip pick-up and placement component 71, and the lower carrier 611 carrying the chips to be tested and the empty upper carrier 612 are pre-moved along the Y-axis to the rear side to a position close to the test seat 31; when the test of the batch of chips is completed, the tested chips on the test seat 31 are first adsorbed by the adsorption part of the floating test module 32, and then the upper carrier 612 and the lower carrier 611 are driven to be stacked up and down The test module 31 is moved between the test seat 31 and the floating test module 32, and the tested chip on the test seat 31 is placed in the third receiving groove 610 of the upper carrier 612 through the adsorption part of the floating test module 32. The upper carrier 612 moves backward along the Y direction to the initial position of the transfer station. The floating test module 32 adsorbs the chip to be tested in the third receiving groove 610 of the lower carrier 611 to the test seat 31, and the lower carrier 611 moves forward along the Y direction and resets to the initial position of the transfer station. The tested chip on the upper carrier 612 is transferred to the corresponding material tray 80 of the receiving bin 501 according to the test results through the chip picking and placing component 71. This is a movement cycle of the shuttle transfer mechanism 60 to transfer the chips to be tested and the tested chips between the transfer station and the test station.

[0046] After the lower carrier plate 611 and the upper carrier plate 612 are reset to the transfer station, the tested chips on the upper carrier plate 612 are transferred to the corresponding material tray 80 of the receiving material bin 501 according to the test results through the chip picking and placing component 71, and then the next batch of preheated chips to be tested are transferred from the preheating tray 21 to the lower carrier plate 611.

[0047] In one embodiment, the floating test module 32 is further configured with a third temperature control assembly (not shown) for controlling the temperature of the adsorbent. The third temperature control assembly includes a third cooling unit and a third heating unit. During testing, the floating test module 32 is pressed against the upper end surface of the chip. When performing a low-temperature test on the chip, the third cooling unit is used to control the temperature of the adsorbent at a low temperature, providing the chip with a low temperature that matches the preset low-temperature test conditions. When performing a high-temperature test on the chip, the third heating unit is used to control the temperature of the floating test module 32 at a high temperature, providing the chip with a high temperature that matches the preset high-temperature test conditions. The third temperature control assembly is positioned above the adsorbent, and its structural arrangement is similar to the arrangement of the first temperature control assembly below the temperature plate 21, including an arrangement in which the third heating unit is closer to the adsorbent than the third cooling unit.

[0048] Combine Figures 1 to 6As shown, the overhead transfer mechanism 70 includes an XY-axis guide frame and a second movable assembly 701 mounted on the XY-axis guide frame. In one embodiment, the XY-axis guide frame utilizes a gantry structure and is equipped with an X-axis guide assembly 702 and a Y-axis guide assembly 703 mounted on at least one end of the X-axis guide assembly 702. The XY-axis guide frame enables the second movable assembly 701 to move above the feeding mechanism 10, preheating mechanism 20, shuttle transfer mechanism 60, tray storage mechanism 40, and receiving mechanism 50, and to be positioned directly above the adsorption portion 821 of the chip to be tested or the tray 80 to be retrieved. Furthermore, the second movable assembly 701 is equipped with a chip pick-up and placement assembly 71 and a tray pick-up and placement assembly 72. These two assemblies move along the Z-axis to respectively retrieve and place the chip and tray 80.

[0049] It should be noted that the placement of the trays 80 mentioned in this embodiment refers to the placement of empty trays 80. When all chips on the trays 80 on the top layer of the feeding bin 101 have been tested and transferred to the receiving mechanism 50, the tray placement assembly 72 will transfer the hole trays 80 to the tray temporary storage mechanism 40. When the trays 80 on the top layer of any receiving bin 501 in the receiving mechanism 50 are filled with tested chips, the tray placement assembly 72 will transfer the empty trays 80 on the tray temporary storage mechanism 40 to the top layer of the bin 11. Figure 2 and Figure 3 As shown, in one embodiment, the tray temporary storage mechanism 40 includes a third fixed seat (not marked) for placing the empty tray 80, and a limiting structure (not marked) for limiting the empty tray 80 is provided on the third fixed seat.

[0050] The second moving component 701 is configured with a first substrate 73 slidably connected to the X-axis guide component 702 and a vacuum generator 74 arranged on the first substrate 73. The chip picking and placing component 71 and the tray picking and placing component 72 are both configured with an adsorption module and a Z-direction driving component for driving the adsorption module to move up and down along the Z-axis, and the vacuum generator 74 provides a vacuum source for adsorption to the adsorption module.

[0051] Combine Figure 5 and Figure 6 As shown, the chip pick-and-place assembly 71 is configured with a first adsorption module 711 and a first Z-direction driving assembly for driving the first adsorption module 711 to move along the Z-direction.

[0052] The first adsorption module 711 includes a suction rod 7111 , an adapter 7112 provided at the upper end of the suction rod 7111 , and a suction nozzle 7113 provided at the lower end of the suction rod 7111 . The suction rod 7111 is connected to the vacuum generator 74 via the adapter 7112 through a vacuum tube.

[0053] In one embodiment, the first Z-axis drive assembly is configured to be fixed to the first connecting seat 712 of the first base plate 73, and the first power source 713 and the first Z-axis transmission assembly 714 are fixed to the first connecting seat 712. The first Z-axis transmission assembly is transmission-connected between the first power source 713 and the first adsorption module 711, wherein the first Z-axis transmission assembly is driven by the first sliding assembly 715 driven by the first belt assembly 714. The first belt assembly 714 includes a first main pulley 7141, a first belt 7142, and a first slave pulley 7143. The first sliding assembly 715 includes a first adapter block 7151 and a first slide bar 7152 for connecting the first adapter block 7151 and the suction rod 7111. The first slide bar 7152 is slidably connected to the first connecting seat 712 along the Z-axis.

[0054] The first power source 713 drives the first adapter block 7151 to move back and forth up and down along the Z axis through the first main pulley 7141, the first belt 7142 and the first slave pulley 7143, and synchronously drives the suction nozzle 7113 to move back and forth up and down along the Z axis through the first sliding component 715.

[0055] In one embodiment, at least two chip pick-and-place assemblies 71 are configured on the second moving assembly 701 to simultaneously absorb at least two chips. Since, in most cases, the spacing between adjacent first receiving slots 811 on the material tray 80, the spacing between adjacent second receiving slots 211 on the pre-heating plate 21, and the spacing between adjacent third receiving slots 610 on the carrier 61 are not equal, if at least two chip pick-and-place assemblies 71 are required to simultaneously transfer at least two chips between the material tray 80, the pre-heating plate 21, the lower carrier 611, and the upper carrier 612, the relative distance along the X-axis between the at least two chip pick-and-place assemblies 71 must be variable during the transfer process.

[0056] Therefore, the second moving assembly 701 is further configured with an X-direction sliding assembly 75, and the X-direction guide rail 751 of the X-direction sliding assembly 75 is fixed to the first substrate 73. If N chip pick-and-place assemblies 71 are provided, then N-1 chip pick-and-place assemblies 71 are slidably connected to the X-direction guide rail 751 of the X-direction sliding assembly 75. By controlling the sliding stroke of the chip pick-and-place assemblies 71 on the X-direction guide rail 751, the spacing between adjacent chip pick-and-place assemblies 71 can be adjusted. For example, Figure 6 The figure shows a schematic diagram of two chip pick-and-place components 71, wherein the chip pick-and-place component 71 located on the left side in the X direction is directly fixed to the first substrate 73, and the chip pick-and-place component 71 located on the right side in the X direction is connected to the first substrate 73 through an X-direction sliding component 75. By driving the chip pick-and-place component 71 located on the right side in the X direction to slide along the X direction, the distance between the two chip pick-and-place components 71 along the X direction can be adjusted, thereby adjusting the distance between the two suction nozzles 7113 for adsorbing chips along the X direction.

[0057] The second moving assembly 701 and the first moving assembly 602 are configured to dock vertically at the transfer station, allowing the chip placement assembly 71 to place chips to be tested and transfer tested chips. The tray placement assembly 72 is configured to transfer empty trays 80 from the upper layer of the feeding mechanism 10 to the tray temporary storage mechanism 40 for temporary storage and to provide empty trays 80 to the receiving mechanism 50. The tray placement assembly 72 is equipped with a second suction module 721 and a second Z-axis drive assembly for driving the second suction module 721 in the Z direction.

[0058] The second Z-direction drive assembly is equipped with a second power source (not shown) and a second sliding assembly 722 driven by the second power source (not shown). The second sliding assembly 722 is linked to the second suction module 721. The second sliding assembly 722 extends along the Z-direction and can reciprocate in this direction, synchronously driving the second suction module 721 to reciprocate in this direction. The second suction module 721 is connected to the vacuum generator 74 via a vacuum tube, allowing the second suction module 721 to facilitate the placement and removal of the tray 80.

[0059] Specifically, when the second adsorption module 721 adsorbs the material tray 80, it first needs to be positioned at the adsorption portion 821 in the central area of ​​the material tray 80, and then the material tray 80 is adsorbed by vacuum negative pressure.

[0060] In one embodiment, the second sliding assembly 722 is configured with a second connecting seat (not shown), which is fixed to the first substrate 73 so that the first substrate 73 drives the second sliding assembly 722 and the second adsorption module 721 to move in XY directions.

[0061] In order to achieve precise control of the displacement of the second movable component 701 in the X and Y directions, a first distance measuring component (not shown) is configured on the X-axis guide component 702. The first distance measuring component includes a first displacement sensor arranged at one end of the X-axis guide component 702 and a second displacement sensor arranged on the first substrate 73. The movement distance of the second movable component 701 in the X direction is controlled by calculating the relative displacement of the second displacement sensor relative to the first displacement sensor. A second distance measuring component (not shown) is configured on the Y-axis guide component 703. The second distance measuring component includes a third displacement sensor arranged at the limit end of the Y-axis guide component 703 and a fourth displacement sensor arranged at the connection end between the X-axis guide component 702 and the Y-axis guide component 703. The movement distance of the second movable component 701 in the Y direction is controlled by calculating the relative displacement of the fourth displacement sensor relative to the third displacement sensor.

[0062] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the present invention. They are not intended to limit the scope of protection of the present invention. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the present invention should be included in the scope of protection of the present invention.

[0063] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0064] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A chip testing circulation device, characterized in that: The transfer device is configured with several functional mechanisms and transfer stations arranged in the functional area on the front side of the carrier Y, a testing mechanism arranged in the functional area on the rear side of the carrier Y and located directly behind the transfer station, and a shuttle transfer mechanism and an overhead transfer mechanism arranged on the carrier, wherein: The test mechanism is equipped with a test seat and a floating test module arranged above the test seat, and the floating test module is equipped with an adsorption member for adsorbing the chip; The shuttle mechanism is equipped with at least two layers of carriers, which are configured to move back and forth between the transfer station and the test mechanism. The carriers are configured to carry chips and pass through between the test seat and the floating test module. The overhead transfer mechanism is configured with a moving component, which is overhead arranged above the functional area on the front side of the carrier Y and moves along the XY direction. The moving component is configured with a tray picking and placing component that can be raised and lowered along the Z direction, at least two groups of chip picking and placing components that can be raised and lowered along the Z direction, and an X-direction slide rail, wherein at least one group of the chip picking and placing components is slidably connected to the X-direction slide rail, and the sliding stroke of the chip picking and placing components on the X-direction slide rail is controlled to adjust the spacing between adjacent chip picking and placing components.

2. The chip testing circulation device according to claim 1, characterized in that: At least two layers of the carriers have no overlapping area in the Z direction. At the transfer station, the projections of at least two layers of the carriers on the XY plane have no overlapping area, and the height of the carrier located on the Y forward side is higher than the height of the carrier located on the Y rear side.

3. The chip testing circulation device according to claim 1, characterized in that: The shuttle transfer mechanism is equipped with a temperature control component connected to at least one layer of the carrier, and the height of the carrier equipped with the temperature control component in the Z direction is lower than that of the carrier not equipped with the temperature control component.

4. The chip testing circulation device according to claim 1, wherein: The functional mechanism includes a preheating mechanism, and the preheating mechanism, the shuttle transfer mechanism and the floating test module are all equipped with a temperature control component for temperature control, so as to maintain a constant temperature of the chip to be tested after being preheated by the preheating mechanism during the process of being transferred to the test seat for testing through the carrier and the floating test module.

5. The chip testing circulation device according to claim 1, characterized in that: The circulation device is equipped with a height measuring sensor assembly, which is arranged on the Y-forward side of the testing mechanism. The height of the bottom end surface of the height measuring sensor assembly is higher than the height of the upper end surface of the uppermost carrier.

6. The chip testing circulation device according to claim 1, characterized in that: The functional mechanism includes a feeding mechanism, a receiving mechanism and a pre-heating mechanism. The feeding mechanism and the receiving mechanism are configured with a tray for carrying chips in batches, and the tray is provided with a plurality of first accommodating slots for accommodating chips; the pre-heating mechanism is configured with a temperature-adjustable pre-heating plate, and the pre-heating plate is provided with a plurality of second accommodating slots for accommodating chips; the carrier is provided with a plurality of third accommodating slots for accommodating chips; The distance between adjacent chip placement components along the X direction changes in the process of being driven by the moving component to move to the material tray, the pre-heating tray or the carrier tray, corresponding to the distance between adjacent first accommodating grooves, adjacent second accommodating grooves or adjacent third accommodating grooves.

7. The chip testing circulation device according to claim 6, characterized in that: The functional mechanism also includes a tray temporary storage mechanism, the feeding mechanism and the receiving mechanism are arranged on the Y-front side and arranged in sequence along the direction, the pre-heating mechanism, the transfer station and the tray temporary storage mechanism are arranged on the Y-rear side and arranged in sequence along the X-direction, and the tray picking and placing assembly is configured to transfer the tray according to a preset tray flow path.

8. The chip testing circulation device according to claim 1, characterized in that: The functional mechanism includes a feeding mechanism and a receiving mechanism, each of which is provided with a silo for accommodating material trays, a lifting mechanism provided below the silo for driving the material trays to be lifted, and a positioning assembly for positioning the material tray on the top layer when it is lifted to a preset position; The positioning assembly includes support members arranged on both sides of the top of the silo in the X direction, an end positioning member arranged at the front end of the silo Y and / or a side positioning member arranged on one side of the silo in the X direction.

9. The chip testing circulation device according to claim 1, characterized in that: The overhead transfer mechanism is equipped with an XY-axis guide frame, the XY-axis guide frame includes a Y-axis guide assembly provided on the carrier and an X-axis guide assembly overhead connected to the Y-axis guide assembly, and the moving assembly is provided on the X-axis guide assembly; The X-axis guide assembly is equipped with a vacuum generator, and the chip pick-and-place assembly and the tray pick-and-place assembly are both equipped with an adsorption module and a Z-axis drive assembly for driving the adsorption module to move up and down along the Z-axis, and the vacuum generator provides a vacuum source for adsorption to the adsorption module.

10. The chip testing circulation device according to claim 9, characterized in that: The chip pick-and-place assembly is configured with a first adsorption module and a first Z-axis drive assembly. The first adsorption module includes a suction rod, an adapter provided at the upper end of the suction rod, and a suction nozzle provided at the lower end of the suction rod. The suction rod is connected to the vacuum generator via a vacuum tube via the adapter. The first Z-axis drive assembly includes a first power source, a first belt transmission assembly driven by the first power source, and a first sliding assembly driven by the first belt transmission assembly. The suction rod is linked to the first sliding assembly, and both the first belt transmission assembly and the first sliding assembly are arranged to extend along the Z axis. The tray picking and placing assembly is configured with a second adsorption module and a second Z-direction drive assembly. The second Z-direction drive assembly includes a second power source and a second sliding assembly driven by the second power source. The second sliding assembly is linked to the second adsorption module. The second sliding assembly is extended along the Z-axis. The central area of ​​the tray is provided with an adsorption portion for positioning and adsorption by the second adsorption module.

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