A film heater and method of assembly thereof

Abstract

This invention discloses a membrane heater and its assembly method, including a heating film, a PCB board assembly, a package housing, and an insulating insertion module. The insulating body of the insulating insertion module has multiple bent copper leads and multiple straight copper leads at both ends. The heating film has multiple solder pads, the PCB board assembly has multiple copper ring solder holes, and the package housing has positioning insertion holes penetrating the front and back. The ends of the bent copper leads protruding from the insulating body are bent towards the solder pads. This invention, through the setting of the insulating insertion module, not only improves welding accuracy but also creates conditions for subsequent reflow soldering and wave soldering, thereby improving the overall assembly efficiency of the membrane heater and simplifying the assembly equipment, achieving cost reduction and efficiency improvement. Furthermore, it avoids the problem of short circuits caused by the difficulty in controlling the distance between adjacent solder points in existing welding methods that involve pressing wires together with welding equipment, thus improving the insulation and pressure resistance performance of the membrane heater.

Description

Technical Field

[0001] This invention mainly relates to the field of membrane heater assembly and processing technology, specifically a membrane heater and its assembly method. Background Technology

[0002] A membrane heater is a flexible heater mainly composed of a heating membrane, a PCB board assembly, and a packaging shell. It offers advantages such as uniform heating, fast response, energy saving, and environmental friendliness. It can be used in various industries, such as water-cooled heating in new energy vehicles and equipment de-icing in aerospace.

[0003] In existing membrane heaters, the heating film and PCB board are connected by wire harnesses (commonly known as wire stripping). Before welding, the wires need to be stripped at both ends to expose the copper wires inside. After stripping, the two ends of the wire harness are welded to the heating film and the PCB board respectively. When welding to the heating film, the multiple wires of the wire harness need to be aligned with multiple pads on the heating film. Then, the welding equipment presses the copper wires of the multiple wires together and welds them to the pads. The welding process for the wire harness to the PCB board is the same.

[0004] The above-mentioned assembly method for membrane heaters has the following disadvantages:

[0005] 1. When mass-producing wire harnesses using the wire-spinning method, the required machining accuracy of the wire harness dimensions is high, and the wire harness wire-spinning path is difficult to control, making it unsuitable for mass production. Furthermore, because precise stripping equipment is required to strip the wire harness twice at both ends, the assembly efficiency is low and the final assembly equipment cost is high.

[0006] 2. When soldering the wire harness to the heating film and PCB board, a high soldering temperature is required, which can easily cause soldering damage or even damage to the heating film and PCB board.

[0007] 3. When welding wire harnesses, tooling is required for clamping. Since the wire harnesses are cylindrical, they are prone to shifting when clamped. Furthermore, the increased area after flattening makes it difficult to control the spacing between adjacent solder joints, and may even cause short circuits between adjacent solder joints. If the spacing between adjacent solder joints is too small, an electric arc may easily be generated between the two solder joints, indirectly causing circuit problems and resulting in unstable insulation and compressive strength of the membrane heater. Summary of the Invention

[0008] The present invention addresses the problem of overly simplistic solutions in existing technologies by providing a significantly different solution. It primarily offers a membrane heater and its assembly method, thereby resolving the technical problems mentioned in the background section. These problems arise because the welding method for the heating membrane and PCB assembly of existing membrane heaters is limited by the use of wire harnesses, resulting in poor welding accuracy, easy damage to the welding of the heating membrane and PCB assembly, and the tendency for arcing between solder joints to cause short circuits.

[0009] The technical solution adopted by the present invention to solve the above-mentioned technical problems is as follows:

[0010] A membrane heater includes a heating membrane and a PCB board assembly, and further includes:

[0011] The packaging housing has a front positioning structure for positioning the heating film on its front side and a back positioning structure for positioning the PCB assembly on its back side.

[0012] An insulating insert module is used to electrically connect the heating film to the PCB board assembly. The insulating body of the insulating insert module has multiple bent copper leads and multiple straight copper leads at both ends.

[0013] The heating film has multiple pads, and the PCB assembly has multiple copper ring solder holes.

[0014] The encapsulation housing is provided with positioning holes that penetrate the front and back sides. The insulating insertion module is connected to the positioning holes to align the multiple bent copper leads with the multiple solder pads and to align the multiple straight copper leads with the multiple copper ring solder holes.

[0015] The electrical connection between the bent copper pin and the corresponding straight copper pin is located inside the insulating body, and the end of the bent copper pin exposed outside the insulating body is bent towards the direction of the solder pad.

[0016] Furthermore, the insulating body of the insulating insertion module includes a short handle and a long handle, the short handle is perpendicular to the long handle, one end of the short handle is connected to one end of the long handle, the bent copper foot is located at the end of the short handle, the straight copper foot is located at the end of the long handle, and the size of the long handle is adapted to the size of the positioning insertion hole.

[0017] The long handle is inserted into the positioning hole until the short handle presses the heating film onto the package housing, so that the ends of the multiple straight copper leads pass through the corresponding multiple copper ring solder holes, and the ends of the multiple bent copper leads press onto the corresponding multiple solder pads.

[0018] Furthermore, the curved copper foot and the corresponding straight copper foot are integrally formed from copper strips. The copper strips protrude from one end of the short handle to form the curved copper foot, and the copper strips protrude from one end of the long handle to form the straight copper foot.

[0019] Furthermore, both sides of the front of the packaging shell are provided with positioning screws through threaded holes, and multiple solder pads are located in the welding area at one end of the heating film. Both sides of the short shank and both sides of the heating film located in the welding area are provided with round holes. The positioning screws pass through the round holes and press and fix the short shank and the heating film.

[0020] Furthermore, the plurality of straight copper feet includes several high-voltage copper feet and several low-voltage copper feet, and the low-voltage copper feet and high-voltage copper feet are staggered in a direction perpendicular to the plane of the plurality of copper strips. The positional distribution of the plurality of copper ring solder holes is adapted to the positional distribution of the plurality of straight copper feet.

[0021] Furthermore, the encapsulation housing is made of metal, and the front of the encapsulation housing is provided with an embedding groove for embedding the heating film. The positioning hole is located at the front end of the encapsulation housing, and one end of the positioning hole is located in the embedding groove and between the front end of the heating film and PCB board assembly and the front wall of the embedding groove. The multiple high-voltage copper feet are staggered from the multiple low-voltage copper feet in a direction away from the front wall of the embedding groove.

[0022] The present invention also provides a method for assembling a membrane heater, comprising the following steps:

[0023] S01. Fix the heating film to the set position on the front of the package housing through the front positioning structure, and fix the PCB assembly to the set position on the back of the package housing through the back positioning structure.

[0024] S02. Place the package housing face up and insert the long handle of the insulating insertion module into the positioning socket on the package housing.

[0025] S03. Use positioning bolts to make the short shank fit against the heating film and fix it on the packaging shell;

[0026] S04. Keep the package housing facing upwards while conveying the package housing. The package housing containing the heating film, PCB board assembly and insulating insertion module passes through the reflow soldering equipment and wave soldering equipment. The reflow soldering equipment is used to solder multiple bent copper leads to multiple corresponding pads, and the wave soldering equipment is used to solder multiple straight copper leads to multiple corresponding copper ring solder holes.

[0027] Further, S02 includes:

[0028] S021. Inspect the insulating insert module to be assembled, and inspect the position of multiple bent copper pins and multiple straight copper pins of the insulating insert module in the width direction of the insulating insert module, as well as the position of the multiple straight copper pins in the direction perpendicular to the plane in which the multiple straight copper pins are arranged.

[0029] S022. Position and move the qualified insulating insert module to the assembly position, so that the long handle of the insulating insert module at the assembly position is aligned with the positioning hole on the package housing that has been positioned at the assembly position.

[0030] S023. Drive the insulating insertion module toward the package housing, so that the long handle is inserted into the positioning socket until the short handle of the insulating insertion module contacts the heating film, and multiple straight copper feet are inserted into the corresponding copper ring solder holes on the PCB assembly.

[0031] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0032] 1. This invention utilizes an insulating insert module with multiple bent copper leads and multiple straight copper leads as an electrical connector between the heating film and the PCB board assembly. The insulating insert module is inserted into the positioning holes on the package housing. Combined with the design that the bent copper leads are perpendicular to the straight copper leads, the positioning of the insulating insert module can be achieved. This not only improves the welding accuracy but also creates conditions for subsequent reflow soldering and wave soldering, thereby improving the overall assembly efficiency of the film heater and simplifying the assembly equipment, achieving the goal of cost reduction and efficiency improvement.

[0033] 2. This invention uses an insulated insert module to connect the heating film and the PCB board assembly, avoiding the problem of short circuits caused by arcing between adjacent solder joints, which is common in existing welding methods that use welding equipment to press the wires together. This is beneficial to improving the insulation and compressive strength of the film heater.

[0034] The present invention will be explained in detail below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of the front structure of the packaging shell of the present invention;

[0036] Figure 2 for Figure 1 AA cross-section view;

[0037] Figure 3 for Figure 2 Enlarged view of point B in the middle;

[0038] Figure 4 This is a schematic diagram of the back structure of the packaging shell of the present invention;

[0039] Figure 5 This is a front view of the insulated insert module;

[0040] Figure 6 A top view of the insulated insert module;

[0041] Figure 7 This is a side view of the insulated insert module.

[0042] Numbering on the map:

[0043] 1. Heating film; 2. PCB board assembly; 3. Encapsulation housing; 4. Insulating insertion module; 5. Solder pad; 6. Copper ring solder hole; 7. Positioning insertion hole; 8. Copper strip; 9. Positioning screw; 10. Round hole; 11. Embedded groove;

[0044] 401. Curved copper foot; 402. Straight copper foot; 403. Short handle; 404. Long handle;

[0045] 4021, high voltage copper pin; 4022, low voltage copper pin. Detailed Implementation

[0046] To facilitate understanding of the present invention, a more comprehensive description of the present invention will be given below with reference to the accompanying drawings, which illustrate several embodiments of the present invention. However, the present invention can be implemented in different forms and is not limited to the embodiments described in the text. Rather, these embodiments are provided to make the disclosure of the present invention more thorough and complete.

[0047] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0048] Please refer to the following carefully. Figures 1-7 A membrane heater includes a heating membrane 1 and a PCB board assembly 2, and further includes:

[0049] The encapsulation housing 3 has a front positioning structure for positioning the heating film 1 on its front side and a back positioning structure for positioning the PCB assembly on its back side.

[0050] The insulating insert module 4 is used to electrically connect the heating film 1 to the PCB board assembly 2. The insulating body of the insulating insert module 4 has multiple bent copper feet 401 and multiple straight copper feet 402 at both ends.

[0051] Among them, the heating film 1 has multiple solder pads 5, and the PCB assembly 2 has multiple copper ring solder holes 6;

[0052] The encapsulation housing 3 is provided with positioning holes 7 that penetrate the front and back sides. The insulating insertion module 4 is inserted into the positioning holes 7 to align multiple bent copper feet 401 with multiple solder pads 5 and to align multiple straight copper feet 402 with multiple copper ring solder holes 6.

[0053] The electrical connection between the bent copper foot 401 and the corresponding straight copper foot 402 is located inside the insulating body, and the end of the bent copper foot 401 exposed from the insulating body is bent towards the direction of the solder pad 5.

[0054] The front and back positioning structures refer to existing methods and structures for fixing the heating film 1 and the PCB board assembly 2. For example, they can be fixed by adhesive, screws, or clips. The specific configuration can be made according to actual production conditions and needs. To facilitate the demonstration of the internal structure of the film heater, the encapsulated housing 3 is shown in its unencapsulated state.

[0055] Specifically, the package housing 3 containing the heating film 1 and the PCB board assembly 2 is placed face up. Then, the insulating insertion module 4 is inserted into the positioning hole 7 on the package housing 3. The positioning hole 7 limits the position of the insulating insertion module 4, enabling multiple bent copper leads 401 to align with multiple pads 5 on the heating film 1, and multiple straight copper leads 402 to align with multiple copper ring solder holes 6 on the PCB board assembly 2. Since the soldering head is perpendicular to the straight copper leads 402, when the soldering head contacts the pads 5, it restricts the further insertion of the insulating insertion module 4 into the positioning hole 7. At this time, the straight copper leads 402 pass through the corresponding copper ring solder holes 6.

[0056] After the insulating insertion module 4 is assembled, the package housing 3 is transported to the welding equipment, where multiple bent copper leads 401 are welded to multiple pads 5, and multiple straight copper leads 402 are welded to multiple copper ring solder holes 6. Since the package housing 3 is facing upwards, the insulating insertion module 4 is positioned using the positioning holes 7 and the bent copper leads 401. Therefore, during the welding process, multiple bent copper leads 401 can be welded to multiple pads 5 simultaneously using reflow soldering equipment, and multiple straight copper leads 402 can be welded to multiple copper ring solder holes 6 simultaneously using wave soldering equipment. Because of the combined reflow and wave soldering method, the package housing 3 does not need to be flipped when transported from the reflow soldering equipment to the wave soldering equipment, resulting in high welding efficiency and preventing welding damage to the heating film 1 and PCB assembly 2 caused by reflow soldering and wave soldering.

[0057] Furthermore, the use of an insulating insert module 4 to connect the heating film 1 and the PCB assembly 2, with the module positioned via positioning holes 7 and bent copper leads 401, improves the positioning accuracy of the bent copper leads 401 and straight copper leads 402. Moreover, the insulating insert module 4 facilitates reflow soldering and wave soldering, avoiding the problems associated with existing methods that use soldering equipment to compress wires. These methods are prone to wire displacement during the soldering process, and the increased area of ​​the flattened wires leads to insufficient spacing between adjacent solder joints, potentially causing short circuits. In short, this invention, by using an insulating insert module 4 to connect the heating film 1 and the PCB assembly 2, also improves the insulation and compressive strength of the film heater.

[0058] This invention utilizes an insulating insert module 4 with multiple bent copper leads 401 and multiple straight copper leads 402 as an electrical connector between the heating film 1 and the PCB assembly 2. The insulating insert module 4 is inserted into the positioning holes 7 on the packaging shell 3. Combined with the design that the bent copper leads 401 are perpendicular to the straight copper leads 402, the positioning of the insulating insert module 4 can be achieved under the assembly condition that the heating film 1 is facing upward. This not only helps to improve the welding accuracy, but also creates conditions for subsequent reflow soldering and wave soldering, thereby improving the overall assembly efficiency of the film heater and simplifying the assembly equipment, achieving the purpose of cost reduction and efficiency improvement.

[0059] The insulating body of the insulating insertion module 4 includes a short handle 403 and a long handle 404. The short handle 403 is perpendicular to the long handle 404. One end of the short handle 403 is connected to one end of the long handle 404. A bent copper foot 401 is located at the end of the short handle 403, and a straight copper foot 402 is located at the end of the long handle 404. The size of the long handle 404 is adapted to the size of the positioning insertion hole 7.

[0060] The long handle 404 is inserted into the positioning socket 7 until the short handle 403 presses the heating film 1 onto the package housing 3, so that the ends of the multiple straight copper feet 402 pass through the corresponding multiple copper ring solder holes 6, and the ends of the multiple bent copper feet 401 are pressed onto the corresponding multiple solder pads 5.

[0061] On the one hand, compared to the planar structure of the plate-shaped insulating insert module 4, the L-shaped three-dimensional structure of the insulating insert module 4 has higher structural strength and greater stability, and is less prone to bending deformation. On the other hand, during the assembly process, the L-shaped insulating insert module 4 not only facilitates the clamping and positioning of the assembly equipment, but also allows for positioning using the short handle 403 when the long handle 404 is inserted into the positioning socket 7. This facilitates the determination of whether the insulating insert module 4 is properly assembled during the assembly process, thereby improving the positioning and assembly accuracy of the insulating insert module 4.

[0062] Among them, the bent copper foot 401 and the corresponding straight copper foot 402 are integrally formed by copper strip 8. The copper strip 8 is exposed at one end of the short handle 403 to form the bent copper foot 401, and the copper strip 8 is exposed at one end of the long handle 404 to form the straight copper foot 402.

[0063] The injection-molded insulating parts are preferably integrally injection molded by injecting molten insulating material into an injection mold with multiple copper strips 8 arranged in a single piece. Compared with connecting the straight copper feet 402 and the bent copper feet 401 through conductive connectors, the integral injection molding method has the advantages of high dimensional and shape accuracy, which is beneficial for subsequent assembly. Moreover, it avoids the problems of open circuit and arc erosion breakdown that can easily occur at the connection point between the bent copper feet 401 and the straight copper feet 402 through wire connectors, which helps to extend the service life of the insulating insert module 4 and improve the insulation and compressive strength of the insulating insert module 4.

[0064] A further optimization of the above embodiment is that positioning screws 9 are provided on both sides of the front of the packaging shell 3 through threaded holes, multiple solder pads 5 are located in the welding area at one end of the heating film 1, and round holes 10 are provided on both sides of the short shank 403 and both sides of the heating film 1 located in the welding area. The positioning screws 9 pass through the round holes 10 and press and fix the short shank 403 and the heating film 1.

[0065] The short shank 403 is fixed by the positioning screw 9, thereby fixing the insulating insert module 4 at the position where the straight copper foot 402 passes through the copper ring solder hole 6 and the bent copper foot 401 contacts the solder pad 5.

[0066] The multiple straight copper feet 402 include several high-voltage copper feet 4021 and several low-voltage copper feet 4022, and the low-voltage copper feet 4022 and the high-voltage copper feet 4021 are staggered in a direction perpendicular to the plane of the multiple copper strips 8. The positional distribution of the multiple copper ring solder holes 6 is adapted to the positional distribution of the multiple straight copper feet 402.

[0067] By staggering the high-voltage copper pin 4021 and the low-voltage copper pin 4022, the distance between the low-voltage copper pin 4022 and the high-voltage copper pin 4021 is increased, which helps to prevent the generation of electric arc between the high-voltage copper pin 4021 and the low-voltage copper pin 4022.

[0068] Furthermore, the front of the package housing 3 is provided with an embedding groove 11 for embedding the heating film 1. The positioning hole 7 is located at the front end of the package housing 3, and one end of the positioning hole 7 is located in the embedding groove 11 and between the front end of the heating film 1 and the PCB board assembly 2 and the front wall of the embedding groove 11. Multiple high-voltage copper feet 4021 are staggered from multiple low-voltage copper feet 4022 in a direction away from the front wall of the embedding groove 11.

[0069] When the encapsulation housing 3 is made of metal, the high-voltage copper pin 4021 is far from the metal insert groove 11 wall, which helps prevent arcing between the end of the high-voltage copper pin 4021 and the encapsulation housing 3, thus improving the insulation and pressure resistance performance of the membrane heater. Furthermore, when the insulating insert module 4 is arranged in an "L" shape, a relatively wide short stalk 403 provides insulation between the bent copper pin 401 and the front wall of the insert groove 11, further preventing arcing between the bent copper pin 401 and the encapsulation housing 3, thereby further improving the insulation and pressure resistance performance of the membrane heater.

[0070] It is important to note that the staggered design of the high-voltage copper ring solder holes 6 and low-voltage copper ring solder holes 6 on the PCB assembly 2 improves the insulation and pressure resistance of the membrane heater. However, in the existing case where the heating film 1 is electrically connected to the PCB assembly 2 via a wire harness, at least two welding operations are required at the high-voltage copper ring solder holes 6 and the low-voltage copper ring solder holes 6, reducing production efficiency and significantly increasing welding difficulty, requiring high welding precision from the welding equipment. In contrast, by using the insulating insert module 4 of this application to connect the heating film 1 and the PCB assembly 2, the insulating insert module 4 is assembled and fixed to the packaging shell 3 with high precision via positioning insert holes 7 and positioning screws 9. Wave soldering can be used to simultaneously weld the high-voltage copper pin 4021 to the high-voltage copper ring solder hole 6 and the low-voltage copper pin 4022 to the low-voltage copper ring solder hole 6, resulting in high welding efficiency and reduced welding difficulty.

[0071] Furthermore, since the insulating insert module 4 is assembled and fixed to the packaging housing 3 with high precision, reflow soldering can be used to weld the bent copper leads 401 to the pads 5. After the bent copper leads 401 to the pads 5 are welded to the packaging housing 3 with the front side facing up using reflow soldering equipment, the straight copper leads 402 are subsequently welded to the copper ring solder holes 6 using wave soldering. This eliminates the need to flip the packaging housing 3, thus simplifying the welding process and assembly equipment, and improving the overall assembly efficiency of the membrane heater.

[0072] In summary, this application, through in-depth analysis and research of existing membrane heaters, takes the improvement direction of facilitating assembly and processing, enhancing insulation and compressive strength, and avoiding welding damage as its starting point. Building upon the existing practice of using wire harnesses to connect the heating film 1 and the PCB assembly 2, it innovatively employs a specially designed insulating insert module 4 to connect the heating film 1 and the PCB assembly 2. By adopting the insulating insert module 4 of this application, the problems of low assembly and processing efficiency, high assembly equipment cost, easy welding damage to the heating film 1 and the PCB assembly 2, and insufficient insulation and compressive strength between the welding wire harnesses and between the wire harness solder joints of the membrane heater are solved with only minor modifications to the structure of the heating film 1 and the PCB assembly 2.

[0073] Furthermore, in addressing the aforementioned technical problems, this application finds that by using the insulating insert module 4 as the electrical connector between the heating film 1 and the PCB assembly 2, it also solves the problem of space requirements and occupation caused by the arrangement and assembly of wire harnesses in existing film heaters, which limits the structural layout adjustment and size reduction of the film heater. In other words, the insulating insert module 4 also has the advantage of requiring less space for installation and assembly, facilitating structural layout adjustment and size reduction of the film heater.

[0074] The present invention also discloses an assembly method for a membrane heater, comprising the following steps:

[0075] S01. The heating film 1 is fixed to the set position on the front of the packaging shell 3 through the front positioning structure, and the PCB assembly 2 is fixed to the set position on the back of the packaging shell 3 through the back positioning structure.

[0076] S02. Place the package housing 3 with the front side facing up, and insert the long handle 404 of the insulating insertion module 4 into the positioning insertion hole 7 on the package housing 3.

[0077] S03. Use positioning bolts to attach the short handle 403 to the heating film 1 and fix it to the encapsulation housing 3;

[0078] S04. Keep the package housing 3 facing upwards and transport the package housing 3 so that the package housing 3 containing the heating film 1, PCB board assembly 2 and insulating insertion module 4 passes through the reflow soldering equipment and wave soldering equipment. The reflow soldering equipment is used to solder multiple bent copper feet 401 to the corresponding multiple solder pads 5, and the wave soldering equipment is used to solder multiple straight copper feet 402 to the corresponding multiple copper ring solder holes 6.

[0079] S02 includes:

[0080] S021. Inspect the insulating insert module 4 to be assembled, and inspect the position of the multiple bent copper pins 401 and multiple straight copper pins 402 in the width direction of the insulating insert module 4, and the position of the multiple straight copper pins 402 in the direction perpendicular to the plane in which the multiple straight copper pins 402 are arranged.

[0081] S022. Position and move the qualified insulating insert module 4 to the assembly position, so that the long handle 404 of the insulating insert module 4 in the assembly position is aligned with the positioning hole 7 on the encapsulation housing 3 that has been positioned in the assembly position.

[0082] S023, drive the insulating insertion module 4 to move towards the package housing 3, so that the long handle 404 is inserted into the positioning insertion hole 7 until the short handle 403 of the insulating insertion module 4 contacts the heating film 1, and the multiple straight copper feet 402 are inserted into the corresponding multiple copper ring solder holes 6 on the PCB assembly 2.

[0083] By inspecting the positions of multiple bent copper pins 401 and multiple straight copper pins 402 of the insulating insert module 4 before assembly, the bending of the bent copper pins 401 and straight copper pins 402 during transportation, loading and other processes can be avoided, thus preventing them from affecting subsequent assembly.

[0084] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make possible changes and modifications to the technical solutions of the present invention by utilizing the methods and techniques disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solutions of the present invention shall fall within the protection scope of the technical solutions of the present invention.

Claims

1. A membrane heater, comprising a heating membrane (1) and a PCB board assembly (2), characterized in that, Also includes: The encapsulation housing (3) has a front positioning structure for positioning the heating film (1) on its front side and a back positioning structure for positioning the PCB assembly on its back side. An insulating insert module (4) is used to electrically connect the heating film (1) to the PCB board assembly (2). The insulating body of the insulating insert module (4) is provided with multiple bent copper feet (401) and multiple straight copper feet (402) at both ends. The heating film (1) has multiple pads (5), and the PCB assembly (2) has multiple copper ring solder holes (6). The encapsulation housing (3) is provided with a positioning socket (7) that runs through the front and back. The insulating insertion module (4) is inserted into the positioning socket (7) to align the multiple bent copper feet (401) with the multiple pads (5) and to align the multiple straight copper feet (402) with the multiple copper ring solder holes (6). The electrical connection between the bent copper foot (401) and the corresponding straight copper foot (402) is located inside the insulating body, and the end of the bent copper foot (401) exposed from the insulating body is bent towards the direction of the pad (5). The insulating body of the insulating insertion module (4) includes a short handle (403) and a long handle (404). The short handle (403) is perpendicular to the long handle (404). One end of the short handle (403) is connected to one end of the long handle (404). The bent copper foot (401) is located at the end of the short handle (403), and the straight copper foot (402) is located at the end of the long handle (404). The size of the long handle (404) is adapted to the size of the positioning insertion hole (7). The plurality of straight copper feet (402) include several high-voltage copper feet (4021) and several low-voltage copper feet (4022), and the low-voltage copper feet (4022) and the high-voltage copper feet (4021) are staggered in a direction perpendicular to the plane of the plurality of copper strips (8), and the positional distribution of the plurality of copper ring welding holes (6) is adapted to the positional distribution of the plurality of straight copper feet (402).

2. A membrane heater according to claim 1, characterized in that: The bent copper foot (401) and the corresponding straight copper foot (402) are integrally formed by copper strip (8). The copper strip (8) is exposed at one end of the short handle (403) to form the bent copper foot (401), and the copper strip (8) is exposed at one end of the long handle (404) to form the straight copper foot (402).

3. A membrane heater according to claim 1, characterized in that: The front sides of the encapsulation housing (3) are provided with positioning screws (9) through threaded holes. Multiple solder pads (5) are located in the welding area at one end of the heating film (1). The short shank (403) and the heating film (1) are provided with round holes (10) on both sides. The positioning screws (9) pass through the round holes (10) and press and fix the short shank (403) and the heating film (1).

4. A membrane heater according to claim 1, characterized in that: The encapsulation housing (3) is made of metal. The front of the encapsulation housing (3) is provided with an embedding groove (11) for embedding the heating film (1). The positioning hole (7) is located at the front end of the encapsulation housing (3). One end of the positioning hole (7) is located in the embedding groove (11) and between the front end of the heating film (1) and the PCB board assembly (2) and the front wall of the embedding groove (11). The multiple high-voltage copper feet (4021) are staggered from the multiple low-voltage copper feet (4022) in a direction away from the front wall of the embedding groove (11).

5. A method for assembling a membrane heater as described in claim 4, characterized in that, Includes the following steps: S01. Fix the heating film (1) to the set position on the front of the package housing (3) through the front positioning structure, and fix the PCB assembly (2) to the set position on the back of the package housing (3) through the back positioning structure. S02. Place the package housing (3) face up and insert the long handle (404) of the insulating insertion module (4) into the positioning hole (7) on the package housing (3); S03. Use positioning bolts to attach the short handle (403) to the heating film (1) and fix it to the encapsulation housing (3); S04. Keep the package housing (3) facing upwards and transport the package housing (3) so that the package housing (3) containing the heating film (1), PCB board assembly (2) and insulating insertion module (4) passes through the reflow soldering equipment and wave soldering equipment. The reflow soldering equipment is used to weld multiple bent copper feet (401) to the corresponding multiple pads (5), and the wave soldering equipment is used to weld multiple straight copper feet (402) to the corresponding multiple copper ring solder holes (6).

6. The assembly method of a membrane heater according to claim 5, characterized in that, The S02 includes: S021. Inspect the insulating insert module (4) to be assembled, and inspect the position of multiple bent copper pins (401) and multiple straight copper pins (402) of the insulating insert module (4) in the width direction of the insulating insert module (4), and the position of the multiple straight copper pins (402) in the direction perpendicular to the plane in which the multiple straight copper pins (402) are arranged. S022. Position and move the qualified insulating insert module (4) to the assembly position, so that the long handle (404) of the insulating insert module (4) at the assembly position is aligned with the positioning hole (7) on the package housing (3) that is positioned at the assembly position. S023, drive the insulating insert module (4) to move toward the package housing (3), so that the long handle (404) is inserted into the positioning socket (7) until the short handle (403) of the insulating insert module (4) contacts the heating film (1) and the multiple straight copper feet (402) are inserted into the corresponding multiple copper ring solder holes (6) on the PCB assembly (2).

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