Active heat dissipation mechanism

Abstract

The invention relates to an active heat dissipation mechanism, which comprises a heat conduction panel main body made of a heat conduction material, and the interior of the heat conduction panel main body is provided with a refrigerant flowing space which is used for refrigerant filling and flowing and has a preset thickness, the heat conduction panel main body comprises one side heat conduction panel and the other side heat conduction panel which respectively form one surface and the other surface of the thickness part side; a plurality of joining parts respectively formed on the one-side heat-conducting panel and the other-side heat-conducting panel and used for joining the one-side heat-conducting panel and the other-side heat-conducting panel in the refrigerant flow space; and an absorber disposed in the refrigerant flow space and configured to absorb a liquid-phase refrigerant in the refrigerant, in which the plurality of joining parts penetrate through the absorber in the thickness direction and are joined to each other, thereby providing an advantage of significantly improving heat dissipation performance.

Description

Technical Field

[0001] The present invention relates to an active heat dissipation apparatus, and more particularly, to an active heat dissipation apparatus that can actively conduct heat generated by a heat-generating device (e.g., an electronic device) through a phase change of a refrigerant that is more effective than the heat-conducting material properties of the refrigerant itself, thereby improving heat dissipation performance. Background Art

[0002] Wireless communication technologies, such as Multiple-Input Multiple-Output (MIMO) technology, significantly increase data transmission capacity by using multiple antennas. It is a spatial multiplexing technology in which the transmitter sends different data through different transmitting antennas and the receiver distinguishes the transmitted data through appropriate signal processing.

[0003] Therefore, as the number of transmitting and receiving antennas increases, the channel capacity also increases, allowing for more data to be transmitted. For example, if the number of antennas is increased to 10, the channel capacity can be increased approximately tenfold compared to a conventional single-antenna system using the same frequency band. In transceivers employing MIMO technology as described above, the number of transmitters and filters increases accordingly as the number of antennas increases.

[0004] As the number of transmitters and filters increases, the number of heating elements also increases. To prevent the performance of antenna devices in MIMO technology from being degraded, a heat dissipation structure that can effectively dissipate heat generated by multiple heating elements needs to be studied in advance.

[0005] In particular, in recent years, research has been actively conducted on effectively cooling the heat of operating systems in not only antenna devices but also electrically driven electronic devices in order to optimize their performance while preventing explosion accidents caused by overheating.

[0006] However, in order to facilitate heat exchange between the working system and the external air, a structure is adopted, that is, through a material with high thermal conductivity, the heat is transferred from the internal heating element (heating body) to the outside as much as possible, and then heat is exchanged with the external air to achieve heat dissipation. However, there is a problem of the thermal conductivity limit of the cooling medium material itself. Summary of the Invention

[0007] Technical issues The present invention aims to provide an active heat dissipation device capable of improving the heat dissipation performance of a heat-generating device (electronic device).

[0008] Furthermore, another object of the present invention is to provide a heat dissipation device having excellent manufacturability.

[0009] The technical problems of the present invention are not limited to the problems described above, and other technical problems not mentioned can be clearly understood by those skilled in the art through the following description.

[0010] Technical Solution According to an embodiment of the active heat dissipation mechanism of the present invention, it includes: a heat-conducting panel body, which is made of a heat-conducting material, and a refrigerant flow space of a predetermined thickness for refrigerant filling and flowing is formed inside the heat-conducting panel body, and the heat-conducting panel body includes a side heat-conducting panel and a side heat-conducting panel, which respectively form one surface and the other surface of the thickness portion side; a plurality of joints, which are respectively formed on the one side heat-conducting panel and the other side heat-conducting panel and are used to join the one side heat-conducting panel and the other side heat-conducting panel in the refrigerant flow space; and an absorber, which is arranged in the refrigerant flow space and is used to absorb liquid-phase refrigerant in the refrigerant, wherein the plurality of joints penetrate the absorber in the thickness direction and are joined to each other.

[0011] The invention may further include: a plurality of absorber fixing parts, which are provided on at least one of the one side heat-conducting panel and the other side heat-conducting panel and are used to fix the absorber.

[0012] Furthermore, the plurality of absorber fixing portions may be arranged to support an outer side surface of at least one of the one side surface and the other side surface of the absorber.

[0013] Furthermore, the absorber may be arranged in parallel with and spaced apart from the one side heat transfer panel and the other side heat transfer panel at a middle portion of a thickness portion of the refrigerant flow space.

[0014] In addition, the absorber fixing portion formed on the one side heat-conducting panel among the multiple absorber fixing portions can support the side opposite to the one side heat-conducting panel among the one side and the other side of the absorber, and the absorber fixing portion formed on the other side heat-conducting panel among the multiple absorber fixing portions can support the other side opposite to the other side heat-conducting panel among the one side and the other side of the absorber.

[0015] In addition, the plurality of absorber fixing portions may be supported at the same position by one absorber fixing portion protruding from the one heat conducting panel toward the other heat conducting panel and another absorber fixing portion protruding from the other heat conducting panel toward the one heat conducting panel.

[0016] Furthermore, the plurality of absorber fixing portions may be supported without penetrating one surface of the absorber.

[0017] In addition, the absorber may include: a one-side absorption member, closely disposed on the inner surface of the one-side heat-conducting panel in the refrigerant flow space; and an other-side absorption member, closely disposed on the inner surface of the other-side heat-conducting panel in the refrigerant flow space.

[0018] In addition, the multiple absorber fixing parts may include: a one-side absorber fixing part, which protrudes from the one-side heat-conducting panel toward the other-side heat-conducting panel; and an other-side absorber fixing part, which protrudes from the other-side heat-conducting panel toward the one-side heat-conducting panel, wherein the one-side absorber fixing part passes through the one-side absorbent member to support the other-side absorbent member, and the other-side absorber fixing part passes through the other-side absorbent member to support the one-side absorbent member.

[0019] Furthermore, a plurality of joint through-holes may be formed in the absorbent body so that the plurality of joints can penetrate and connect with each other.

[0020] Furthermore, the plurality of joining portions and the plurality of absorber fixing portions may be arranged alternately and repeatedly in parallel along any straight line direction of the heat transfer panel body.

[0021] Furthermore, when at least one end of the heat conducting panel body forms a pressed end adjacent to a heat generating element to be radiated when the one heat conducting panel and the other heat conducting panel are joined, at least a portion of the absorber may be arranged in a straight line along the pressed end.

[0022] In addition, when the portions of the one side heat conducting panel and the other side heat conducting panel excluding the pressed end portions are defined as heat dissipation plate portions, the remaining portion of the absorber can be bent toward the portion of the heat dissipation plate portion that is relatively lower based on the direction of gravity and extended in a straight line.

[0023] In addition, the one side heat conducting panel and the other side heat conducting panel may be provided with at least one chamber partition, which divides the refrigerant flow space into at least two areas after the one side heat conducting panel and the other side heat conducting panel are joined and are joined to each other during the joining.

[0024] Furthermore, in at least two of the refrigerant flow spaces partitioned by the chamber partition, the absorbers may be arranged in a number corresponding to the number of each of the refrigerant flow spaces.

[0025] Furthermore, the pressing end portion may be provided with a refrigerant charging port, the refrigerant charging port being in communication with the refrigerant flow space so as to be charged with the refrigerant.

[0026] In addition, the invention may further include a caulking member which is inserted into the refrigerant charging port after the refrigerant is charged, and then seals the refrigerant flow space by squeezing the refrigerant charging port.

[0027] Furthermore, after the caulking member is inserted into the refrigerant charging port, the refrigerant charging port including the caulking member may be cut to match an outer end of the press-in end portion.

[0028] Furthermore, when the end portion opposite to the press-fit end portion is defined as a heat dissipation end portion, a reinforcing rib for enhancing rigidity may be formed along the end portion of the heat dissipation end portion.

[0029] In addition, the reinforcing rib may include: a reinforcing rib groove on one side, which is recessed from the heat-conducting panel on one side toward the outside of the refrigerant flow space; and a reinforcing rib groove on the other side, which is recessed from the heat-conducting panel on the other side toward the outside of the refrigerant flow space.

[0030] Technical Effects According to an embodiment of the active heat dissipation mechanism of the present invention, active heat conduction can be achieved through the phase change of the refrigerant, thereby significantly improving the overall heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a perspective view showing an example of an active heat dissipation mechanism combined with an antenna device in an electronic device.

[0032] Figure 2 It shows Figure 1 An exploded perspective view of the active heat dissipation mechanism in a separated state in the structure.

[0033] Figure 3 FIG. 1 is a perspective view showing an active heat dissipation mechanism according to an embodiment of the present invention.

[0034] Figure 4 yes Figure 3 Exploded three-dimensional diagram.

[0035] Figure 5 yes Figure 3 Expanded view of the state before joining.

[0036] Figure 6 yes Figure 4 The main view (a) and the cross-sectional views taken along line AA and line BB ((b) and (c)) and their local enlarged views.

[0037] Figure 7 It is along Figure 6 A three-dimensional cross-sectional view taken along line AA and a partial enlarged view thereof.

[0038] Figure 8 200B, 200C, and 200D are three-dimensional diagrams illustrating active heat dissipation mechanisms according to another embodiment of the present invention.

[0039] Figure 9 yes Figure 8 (a) is an exploded perspective view of another embodiment 200B.

[0040] Figure 10 yes Figure 8 (a) is an expanded view of another embodiment 200B in a state before joining.

[0041] Figure 11a yes Figure 8 Another embodiment 200B shown in (a) includes a front view (a), a cross-sectional view taken along line CC (b), a three-dimensional cross-sectional view (c), and a partially enlarged view (d).

[0042] Figure 11b yes Figure 8 A main view (a) of another embodiment 200B shown in (a), a cross-sectional view (b) taken along line DD, a three-dimensional cross-sectional view (c), and a partial enlarged view (d) thereof.

[0043] Description of Reference Signs 100: Antenna device 110: Heat dissipation housing body 200A, 200B, etc.: Active heat dissipation mechanism 200A-1: Heat conduction panel on one side 200A-2: The other side of the heat conduction panel 201: press into the end 203: heat dissipation end portion 241a, etc.: multiple joints 251a etc.: Multiple absorber fixing parts 260A, 260B: absorber T: Baseline DETAILED DESCRIPTION

[0044] Hereinafter, an embodiment of the active heat dissipation mechanism according to the present invention will be described in detail with reference to the accompanying drawings.

[0045] It should be noted that when assigning reference numerals to the constituent elements of each drawing, identical constituent elements, even if shown in different drawings, are assigned the same reference numerals whenever possible. Furthermore, when describing embodiments of the present invention, if a detailed description of a related well-known configuration or function is judged to hinder understanding of the embodiments of the present invention, such detailed description will be omitted.

[0046] When describing the constituent elements of the embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish the constituent elements from other constituent elements, and do not limit the nature, sequence, or order of the constituent elements through their terms. In addition, unless otherwise explicitly defined, all terms used in this document (including technical and scientific terms) have the meanings commonly understood by ordinary technicians in the technical field to which this invention belongs. Terms defined in general dictionaries should be interpreted as consistent with their meanings in the relevant technical context and should not be interpreted as idealized or overly formalized unless explicitly defined in this application.

[0047] Figure 1 is a perspective view showing an example of an active heat dissipation mechanism combined with an antenna device in an electronic device, Figure 2 It shows Figure 1 An exploded perspective view of the active heat dissipation mechanism in a separated state in the structure.

[0048] Generally speaking, electronic devices generate a predetermined amount of system operating heat during electrical operation, and their performance depends on how quickly this heat can be dissipated. This includes semiconductors, where performance depends on cooling rates. Other electronic devices include antennas for communications, displays, electric vehicle batteries, energy storage systems (ESS), artificial intelligence (AI), and other electrical and electronic devices.

[0049] In the following, for easier understanding, the antenna device in the electronic device is described as a specific embodiment.

[0050] like Figure 1 As shown, the antenna device 100 using the active heat dissipation mechanism 200 according to an embodiment of the present invention includes: a heat dissipation housing body 110, which forms a storage space open to the front and is constructed in a rectangular parallelepiped shape that is approximately long in the vertical direction and has a thin front-to-back storage width.

[0051] Although not shown in the accompanying drawings, a motherboard serving as a substrate for a power amplifier unit (PAU) and a digital transceiver unit (DTU) may be stacked inside the accommodation space of the heat dissipation housing body 110 , using a clamshell as a medium. Multiple micro bellows filter (MBF) components are mounted on the front surface of the motherboard, and a type of heating element is mounted on the back surface of the motherboard.

[0052] Among them, a radio frequency integrated circuit (RFIC) component or a power amplifier (PA) component mounted on a motherboard can be defined as a heat-generating component that generates a large amount of heat during operation. However, it should be noted that in the embodiments of the present invention, only an antenna device is used as an example of an electronic device, and the heat-generating component is not limited to the configuration described above.

[0053] A radome panel 50 is provided on the front surface of the accommodation space of the heat dissipation housing body 110 , which can protect the radiating element as the antenna element from external influences while allowing the radiating element to radiate smoothly.

[0054] On the other hand, the back of the heat dissipation housing body 110 may be provided with an active heat dissipation mechanism 200 according to an embodiment of the present invention.

[0055] The active heat dissipation mechanism 200 according to an embodiment of the present invention is constructed in the form of heat dissipation fins, but strictly speaking, it is different from the fixed heat dissipation fins 200C-1 and 200C-2 described later, and is characterized in that it is configured as a thin vapor chamber type whose interior must include an absorber for absorbing liquid refrigerant in the refrigerant.

[0056] Generally speaking, a wick member having a liquid-absorbing core structure with multiple holes is provided inside the steam chamber, but the active heat dissipation mechanism 200 according to the embodiment of the present invention is not limited to the wick member. In particular, under the premise of being able to absorb liquid-phase refrigerant, it can be a concept of all absorption members including non-woven fabric materials that are easier to set up and are very light and can raise the liquid (liquid-phase refrigerant) in the direction against gravity through a predetermined capillary phenomenon.

[0057] More specifically, a trench structure 170 is provided on the back of the heat dissipation housing body 110, and the central part between the left end and the right end is empty, and the active heat dissipation mechanism 200 according to an embodiment of the present invention is arranged on the left and right sides of the trench structure 170, tilted upward toward the left end and the right end, respectively.

[0058] On the other hand, according to an embodiment of the present invention, the active heat dissipation mechanism 200 can be set in multiple numbers, and all are formed into the same specifications of rectangles formed in the same length direction. Thus, the fixed heat dissipation fins 200C-1 and 200C-2 can be configured on the back side of the heat dissipation housing body 110 that is not occupied by it.

[0059] Among them, such as Figure 1 and Figure 2As shown, the fixed heat dissipation fins 200C-1 and 200C-2 may include: upper fixed heat dissipation fins 200C-1, which are arranged on the upper side of the back portion of the heat dissipation housing body 110 that is not occupied by the active heat dissipation mechanism 200 according to an embodiment of the present invention; and lower fixed heat dissipation fins 200C-2, which are arranged on the left and right lower sides of the back portion of the heat dissipation housing body 110 that is not occupied by the active heat dissipation mechanism 200 according to an embodiment of the present invention.

[0060] The area on the back of the heat dissipation housing body 110 where the groove structure 170 is located and the area (inverted triangular area) 130 where the upper fixed heat dissipation fin 200C-1 of the fixed heat dissipation fins 200C-1 and 200C-2 are located can be filled with refrigerant. Specifically, a refrigerant flow space (not shown) can be embedded in the back of the heat dissipation housing body 110 to facilitate the filling of the refrigerant.

[0061] In this case, an absorber can be provided, especially in the area corresponding to the groove structure 170, which is made of any material selected from non-woven fabrics or non-woven fabrics combined with a woven fabric of copper wire material, so that the filled liquid-phase refrigerant can be more easily vaporized due to the heat conducted by the heating element 140.

[0062] The refrigerant filled in the refrigerant flow space on the back side of the heat dissipation housing body 110 causes a temperature change due to the heat conducted by the heating element. After undergoing a phase change (vaporizing into a gas state) in the evaporation zone (vaporization zone) located at the relatively lower part defined by the groove structure 170, it moves to the inverted triangle area 130 located at the relatively upper part as the condensation zone (condensation zone) provided with the upper solid heat dissipation fin 200C-1, and then undergoes a phase change again (liquefaction into a liquid state) through condensation, and then moves downward under the action of gravity and capillary phenomenon, thereby repeating the above process to achieve the heat dissipation function.

[0063] For reference, the refrigerant filled into the interior of the active heat dissipation mechanism 200 according to an embodiment of the present invention described later and the refrigerant filled into the refrigerant flow space corresponding to the above-mentioned inverted triangle area 130 and the groove structure 170 are independent, and refrigerants of different specifications can be filled according to the same specifications or the heat generation and installation position of the heating elements.

[0064] On the other hand, Figure 1 and Figure 2 As shown, a press-in portion 150 may be formed on the back of the heat dissipation housing body 110 for extruding a plurality of active heat dissipation mechanisms 200 according to an embodiment of the present invention.

[0065] As mentioned above, the active heat dissipation mechanism 200 according to an embodiment of the present invention is centered on the groove structure 170 and is tilted upward toward the left and right ends. Therefore, the pressing portion 150 can also be set to multiple, and each is in a "V" shape based on the groove structure 170.

[0066] However, in order to press-fit the active heat dissipation mechanism 200 according to an embodiment of the present invention onto the back side of the heat dissipation housing body 110, it is not limited to the form of a press-fit portion 150. Alternatively, a hole may be provided on the inner side of the press-fit portion 150 that passes through the front and back of the back side of the heat dissipation housing body 110, so that the press-fit end portion 201 of the active heat dissipation mechanism 200 is in direct surface thermal contact with the heating surface of the heating element.

[0067] Figure 3 is a perspective view showing an active heat dissipation mechanism according to an embodiment of the present invention, Figure 4 yes Figure 3 Exploded perspective diagram, Figure 5 yes Figure 3 The expanded view of the state before joining, Figure 6 yes Figure 4 The main view (a) and the cross-sectional views taken along the AA and BB lines ((b) and (c)) and their partial enlarged views, Figure 7 It is along Figure 6 The three-dimensional cross-sectional view taken along line AA and its partial enlarged view.

[0068] Reference Figures 3 to 7 The active heat dissipation mechanism 200A according to an embodiment of the present invention has the same characteristics as those described in the following references. Figures 8 to 11b The common features of the active heat dissipation mechanism 200B according to another embodiment of the present invention include: heat-conducting panel bodies 200A-1, 200A-2, 200B-1, 200B-2, multiple joints (such as 241a) for joining them together, an absorber 260, and multiple absorber fixing portions (such as 251a). To avoid confusion, the common features of the first embodiment 200A and the second embodiment 200B will be described with reference to the reference numerals associated with "the first embodiment 200A."

[0069] like Figure 5 As shown, the heat-conducting panel bodies 200A-1 and 200A-2 are composed of a single component of a heat-conducting material (for example, a metal material), and integrally include a heat-conducting panel 200A-1 on one side and a heat-conducting panel 200A-2 on the other side, which are bent in a manner to form a refrigerant flow space (not marked with a reference numeral) of a predetermined thickness for refrigerant filling and flow, and respectively form one surface and the other surface on the thickness side.

[0070] However, the heat transfer panel bodies 200A-1 and 200A-2 do not necessarily need to be formed from a single metal panel and then bent in the manner described above to form the refrigerant flow space. In other words, the refrigerant flow space can also be formed by joining the edges of the heat transfer panel 200A-1 and the heat transfer panel 200A-2, which are formed from two metal panels.

[0071] Among them, when the above-mentioned bending method is adopted for manufacturing, in the refrigerant flow space, the one side heat-conducting panel 200A-1 and the other side heat-conducting panel 200A-2 composed of a single metal panel component can be formed into a bending (folding) so that one end of the one side heat-conducting panel 200A-1 in the width direction and the other end of the other side heat-conducting panel 200A-2 in the width direction are connected to each other with an arbitrary reference line T separating their centers as the center.

[0072] When the above-mentioned joining method is used for manufacturing, it can be understood that the one side heat-conducting panel 200A-1 and the other side heat-conducting panel 200A-2 composed of two metal panels are directly joined together to form a refrigerant flow space.

[0073] In this case, in the refrigerant flow space, one surface formed by the one-side heat transfer panel 200A-1 and the other surface of the other-side heat transfer panel 200A-2 may respectively form a thickness portion having a predetermined thickness.

[0074] The refrigerant flow space can be defined as the space where refrigerant is charged and flows through refrigerant charging ports 205A and 205B, described later. In the refrigerant flow space, when the liquid refrigerant receives a predetermined amount of heat from the heat generating body (heating element), it undergoes a phase change (transforms into a gaseous refrigerant) and flows. Simultaneously, it exchanges heat with the external air through the outer surfaces of heat transfer panels 200A-1 and 200A-2. It then undergoes another phase change (transforms into a liquid refrigerant) and flows in the direction of gravity, that is, toward the heat generating element. This process repeats itself.

[0075] On the other hand, Figures 3 to 7 As shown, multiple joints (241a, etc.) are respectively formed on one side heat conduction panel 200A-1 and the other side heat conduction panel 200A-2, which play the role of joining one side heat conduction panel 200A-1 and the other side heat conduction panel 200A-2 in the refrigerant flow space when joining.

[0076] Among them, multiple joints (241a, etc.) can be formed simultaneously when a mother material panel composed of a single metal panel component or a mother material panel composed of two metal panel components is manufactured into the heat conductive panel body 200A-1, 200A-2 by using a stamping process of a stamping die.

[0077] The absorber 260A includes a plurality of holes, which are arranged at appropriate positions in the refrigerant flow space. Through heat exchange with the external air, the liquid refrigerant that has undergone phase change (converted to liquid phase) is absorbed, so that the heat conducted through the predetermined heating element is easily evaporated, or as described later, through a predetermined capillary phenomenon, the liquid refrigerant is caused to flow in a direction opposite to the direction of gravity.

[0078] The absorber 260A may be made of a thin non-woven fabric, but is not limited thereto. Any material may be used as long as it satisfies the absorption rate of the liquid refrigerant and the flow force caused by capillary force.

[0079] On the other hand, in the active heat dissipation mechanism 200A according to one embodiment of the present invention, as described later, the absorber 260A can be formed by dividing the refrigerant flow space along the vertical direction in the figure by the chamber partition 204-1. ” shape or “ " shape is configured in each refrigerant flow space.

[0080] The absorbers 260A-U and 260A-D as described above are respectively arranged in a part of the refrigerant flow space, and the liquid refrigerant located on the lower side relative to the direction of gravity is transported to the upper side relative to the direction of gravity by capillary force, so that the liquid refrigerant is evenly distributed in the entire pressing end 201 near the heating part of the heating element, thereby promoting the evaporation of the refrigerant.

[0081] On the other hand, Figure 6 and Figure 7 As shown, a plurality of absorber fixing portions ( 251 a , etc.) disposed inside the refrigerant flow space may be provided on at least one of the one side heat transfer panel 200A- 1 and the other side heat transfer panel 200A- 2 and serve to fix the absorber 260A.

[0082] Similar to the above-mentioned multiple joining parts (241a, etc.), by utilizing the stamping process of the stamping mold, multiple absorber fixing parts (251a, etc.) can also be formed together when the mother material panel composed of a single metal panel component or the mother material panel composed of two metal panel components is manufactured into the heat-conducting panel main body 200A-1, 200A-2.

[0083] like Figures 3 to 7 As shown, when refrigerant flow spaces are formed by bending the two surfaces of each of the one side heat transfer panel 200A-1 and the other side heat transfer panel 200A-2, a plurality of joints (241a, etc.) protrude from portions corresponding to the refrigerant flow spaces.

[0084] The plurality of joints (241a, etc.) are formed such that the front end surfaces are face-joined at the middle portion of the thickness portion of the refrigerant flow space where the front end surfaces protrude from each other, and the face-joined portions can be joined to each other by various joining methods such as welding. The joining method is not limited to welding, but if welding is used, laser welding may be more preferred.

[0085] On the other hand, as described above, a plurality of joints (241a, etc.) can penetrate the absorber 260A arranged in the refrigerant flow space in the thickness direction and be joined to each other so that each front end face is face-joined and joined in a predetermined joining manner. To this end, a plurality of joint through holes 261b can be formed in the absorber 260A so that the plurality of joints (241a, etc.) penetrate each other and are face-joined.

[0086] In this case, the size of the plurality of joint through holes 261b is preferably at least larger than the diameter of the front end surfaces of the plurality of joints (241a, etc.) so as to be protected from the welding heat generated when the plurality of joints (241a, etc.) are welded together while the one side heat conduction panel 200A-1 and the other side heat conduction panel 200A-2 are welded together.

[0087] In contrast, according to the embodiment, the plurality of absorber fixing portions ( 251 a , etc.) can be supported without penetrating a surface of the absorber 260A, and therefore, there is no need to provide a hole structure in the absorber 260A for the plurality of absorber fixing portions ( 251 a , etc.) to penetrate.

[0088] However, in another embodiment of the present invention (e.g., 200B) described later, when two absorbers 260B-a and 260B-b are provided, and any of the multiple absorber fixing portions 251-1 and 251-2 penetrates the adjacent absorbers, it is naturally necessary to provide an additional hole structure penetrating therethrough. This will be described in more detail later.

[0089] like Figures 3 to 5 As shown, the aforementioned multiple joining portions ( 241 a , etc.) and multiple absorber fixing portions ( 251 a , etc.) may be arranged alternately and repeatedly in parallel along any straight line direction of the heat conduction panel bodies 200A- 1 and 200A- 2 .

[0090] More specifically, if the active heat dissipation mechanism 200A of an embodiment of the present invention is actually provided with the absorber 260A, the following description will be given: Figure 3 As shown, the heat conducting panel bodies 200A-1 and 200A-2 are provided to form two surfaces of a portion having a predetermined thickness, that is, the heat conducting panel 200A-1 on one side and the heat conducting panel 200A-2 on the other side form heat dissipation surfaces respectively.

[0091] In the heat-conducting panel 200A-1 on one side and the heat-conducting panel 200A-2 on the other side, the multiple joints 241a to 241c can be arranged at predetermined intervals along the left-right direction (i.e., the "column" direction) in the drawing. Similarly, the multiple joints 243a to 243e can be arranged at predetermined intervals along the up-down direction (i.e., the "row" direction) in the drawing.

[0092] Furthermore, in the one-side heat conduction panel 200A-1 and the other-side heat conduction panel 200A-2, the plurality of absorber fixing portions 251a to 251d are arranged at predetermined intervals along the horizontal direction (i.e., the "column" direction) in the drawings, and may be alternately arranged between the respective bonding portions 241a to 241c arranged along the "column" direction (or at the end of the row) among the aforementioned plurality of bonding portions (241a, etc.). Similarly, the plurality of absorber fixing portions 253a to 253e may be arranged at predetermined intervals along the vertical direction (i.e., the "row" direction) in the drawings, and may be alternately arranged between the respective bonding portions 243a to 243e arranged along the "row" direction (or at the end of the row) among the aforementioned plurality of bonding portions (241, etc.).

[0093] In particular, in the active heat dissipation mechanism 200A according to an embodiment of the present invention, even without considering the multiple joining portions (241a, etc.), the multiple absorber fixing portions (251a, etc.) do not need to be provided over the entire area of ​​the one side heat conduction panel 200A-1 and the other side heat conduction panel 200A-2.

[0094] For example, Figure 4 As shown, when the heat conductive panel 200A-1 and the heat conductive panel 200A-2 are joined, at least one end of the heat conductive panel bodies 200A-1 and 200A-2 can form a press-in end 201 positioned adjacent to the heat-dissipating element. The press-in end 201 can be defined as an end positioned relatively low relative to the direction of gravity. In this case, the absorber 260A only needs to be positioned at least partially in a straight line along the press-in end 201.

[0095] Therefore, in the refrigerant flow space, the plurality of absorber fixing portions ( 251 a and the like) for fixing the absorber 260A only need to be formed at the location where the absorber 260A is arranged.

[0096] That is, Figure 4 As shown, when the absorbent body 260A is formed in a long strip shape adjacent to the press-in end 201 side along the "row" direction, and at the same time extends in a long strip shape along the "column" direction at the lower end or the upper end, multiple absorbent body fixing parts (251a, etc.) can be formed only in the area where the absorbent body 260A is configured.

[0097] In addition, according to an embodiment of the present invention, the active heat dissipation mechanism 200A is provided with a plurality of joints (241a, etc.) evenly distributed on the heat-conducting panel 200A-1 on one side and the heat-conducting panel 200A-2 on the other side, so that they can be evenly joined to each other after bending (folding), thereby preventing deformation caused by the internal pressure of the refrigerant flow space.

[0098] In which, when the portion of the heat-conducting panel 200A-1 on one side and the heat-conducting panel 200A-2 on the other side except the pressed-in end portion 201 is defined as a heat dissipation plate portion (not marked with a reference numeral), the remaining portion of the absorber 260A can be bent to a portion of the heat-conducting plate portion that is located relatively lower than the direction of gravity and extends in a straight line.

[0099] For example, when the active heat dissipation mechanism 200A according to one embodiment of the present invention is in the shape of a long rectangle whose length in the vertical direction is greater than its width in the front-to-back direction, the absorber 260A can be configured such that the pressed-in end portion 201 at one end portion in the width direction is formed in the shape of a long strip, and is located at the lower end of the longitudinal direction on the relative lower side with respect to the direction of gravity in the vertical length direction, is horizontally bent in the front-to-back direction and extends a predetermined length to the rear, roughly in the shape of a " ” shape or “ "shape.

[0100] On the other hand, the active heat dissipation mechanism 200A according to one embodiment of the present invention is different from another embodiment (200B, etc.) described later in that the absorber 260A is arranged parallel to and spaced apart from the one side heat conduction panel 200A-1 and the other side heat conduction panel 200A-2 in the middle of the thickness portion of the refrigerant flow space.

[0101] That is, the active heat dissipation mechanism 200B according to another embodiment of the present invention is composed of two parts, namely, a one-side absorption member 260B-a and a second-side absorption member 260B-b (see FIG. Figure 9 ), and differs from active heat dissipation mechanism 200A according to an embodiment of the present invention in that one side absorption member 260B-a is disposed in close contact with the inner surface of heat-conducting panel 200B-1 on one side of the refrigerant flow space, while the other side absorption member 260B-b is disposed in close contact with the inner surface of heat-conducting panel 200B-2 on the other side of the refrigerant flow space. Active heat dissipation mechanism 200B according to another embodiment of the present invention will be described in more detail below.

[0102] As described above, in the case of the active heat dissipation mechanism 200A according to an embodiment of the present invention, in which the absorber 260A is arranged in the middle of the thickness portion of the refrigerant flow space, when system heat is provided from the heating element adjacent to the press-in end 201, the portion of the absorber 260A arranged close to the press-in end 201 side absorbs and stores as much liquid-phase refrigerant as possible, thereby promoting phase change (transformation into gas-phase refrigerant).

[0103] In addition, the absorber 260A portion, which is spaced apart from the press-in end 201 side and relatively close to the heat dissipation end 203 side, serves to maximize heat transfer capacity by providing a position where, when a phase change (conversion to liquid refrigerant) occurs after heat exchange between the inner surfaces of the heat transfer panel 200A-1 on one side of the gas-phase refrigerant and the heat transfer panel 200A-2 on the other side, the gas-phase refrigerant can be immediately condensed and absorbed when the phase change occurs to the liquid-phase refrigerant.

[0104] When the liquid refrigerant that undergoes phase change due to condensation of the gas phase refrigerant is absorbed by the absorber 260A, it flows back down along the direction of gravity and is transported to the side of the pressing end 201, thereby significantly improving the overall heat transfer capacity of the refrigerant.

[0105] In addition, when the refrigerant flow space is divided into a predetermined number by the chamber partition 204-1 described later, and absorbers 260A-U, 260A-D are arranged in each refrigerant flow space, the evaporation time in the evaporation area and the condensation time in the condensation area can be shortened by overcoming the heat transfer capacity limit and boiling limit of the refrigerant, thereby increasing the overall phase change cycle number of the refrigerant, thereby creating the advantage of accelerated heat dissipation.

[0106] like Figure 6 and Figure 7 As shown, in an active heat dissipation mechanism 200A according to an embodiment of the present invention, when the end opposite to the above-mentioned press-in end 201 is defined as a heat dissipation end 203, a reinforcing rib 270 for enhancing rigidity can be formed along the end of the heat dissipation end 203.

[0107] Similar to the formation process of the above-mentioned multiple joining parts (241a, etc.) and multiple absorber fixing parts (251a, etc.), when the stamping process of the stamping mold is utilized, the reinforcing ribs 270 can also be formed together when the single metal panel-shaped mother material panel is manufactured into the heat-conducting panel body 200A-1, 200A-2.

[0108] The reinforcing ribs 270 serve to enhance rigidity to prevent bending caused by external pressure that may occur when the active heat dissipation mechanism 200A according to an embodiment of the present invention is attached to the back surface of the heat dissipation housing body 110 in the form of heat dissipation fins.

[0109] Among them, such as Figure 6 As shown, the reinforcing rib 270 may include: a reinforcing rib groove 270-1 on one side, which is recessed from the heat-conducting panel 200A-1 on one side toward the outside of the refrigerant flow space; and a reinforcing rib groove 270-2 on the other side, which is recessed from the heat-conducting panel 200A-2 on the other side toward the outside of the refrigerant flow space.

[0110] By forming the one side reinforcing rib groove 270 - 1 and the other side reinforcing rib groove 270 - 2 symmetrically, a predetermined closed loop cross section can be formed when the one side heat conducting panel 200A- 1 and the other side heat conducting panel 200A- 2 are joined and overlapped.

[0111] On the other hand, Figure 3 As shown, the active heat dissipation mechanism 200A according to an embodiment of the present invention may further include at least one chamber partition 204 - 1 .

[0112] The chamber partition 204-1 is provided on one side heat conducting panel 200A-1 and the other side heat conducting panel 200A-2, and can divide the refrigerant flow space into at least two areas when the one side heat conducting panel 200A-1 and the other side heat conducting panel 200A-2 are connected to each other.

[0113] For example, in the embodiments of the active heat dissipation mechanism (e.g., 200A) according to the present invention, when a refrigerant is filled within the mechanism and heat is dissipated through phase change (heat flow), the thinner the thickness, the larger the heat dissipation area, and the higher the performance. However, due to the inherent limitations of the refrigerant's heat transfer capacity, there are inevitable limitations in expanding the heat dissipation area, i.e., achieving a larger area.

[0114] Among them, the above-mentioned chamber partition 204-1 maximizes the heat dissipation area while taking into account the heat transfer capacity of the refrigerant, and separates the refrigerant flow space used to fill each refrigerant into multiple chambers. Therefore, on the basis of the heat transfer capacity of the original refrigerant, it can not only maintain the overall heat dissipation performance, but also achieve a large-scale heat dissipation area.

[0115] like Figures 3 to 7 As shown, the chamber partition 204-1 described above can be extended along the left and right directions in the drawing, so that the refrigerant flow space filled with refrigerant along the upper and lower sides in the drawing is divided into two. Similar to another embodiment 200B, 200C, and 200D described later, two 204-1, 204-2, three 204-1 to 204-3, and four 204-1 to 204-4 can also be set.

[0116] In this case, of course, the number of refrigerant charging ports ( 205A and the like) capable of charging refrigerant into each refrigerant flow space may also be formed to correspond to the number of the chambers.

[0117] The chamber partition 204-1 includes a side chamber partition rib 204-1a formed on one side of the heat conducting panel 200A-1 and another side chamber partition rib 204-1b formed on the other side of the heat conducting panel 200A-2, and when the heat conducting panel bodies 200A-1 and 200A-2 are joined, they face each other, thereby completely separating the adjacent refrigerant flow space.

[0118] In addition, if Figure 4 As shown, when the refrigerant flow space is divided into two by the chamber partition 204-1, two absorbers 260A may be provided, which correspond to the number of the refrigerant flow spaces divided by the chamber partition 204-1 (refer to FIG. Figure 4 Figure numerals 260A-U, 260A-D).

[0119] This is because, in another embodiment 200B of the present invention described later (see Figure 9 ), when the refrigerant flow space is divided into three by the two chamber partitions 204-1 and 204-2, three absorbers 260B-1 to 260B-3 are provided, so the same principle is applied.

[0120] Furthermore, as described below Figure 8 As shown in (b), the refrigerant flow space can be divided into four by the three chamber partitions 204-1, 204-2, and 204-3, as shown in FIG. Figure 8 As shown in (c), the refrigerant flow space may be divided into five parts by four chamber partitions 204-1 to 204-4. In this case, one absorber may be provided in each refrigerant flow space.

[0121] Among them, the number of chamber partitions (204-1, etc.) formed and the number of refrigerant flow spaces are designed, as described above, in consideration of the heat transfer capability of the refrigerant used, and can serve as a determining factor in being able to shorten the amount of protrusion from the back side of the heat dissipation housing body 110.

[0122] Furthermore, as described above, when a plurality of refrigerant flow spaces are divided and formed by chamber partitions ( 204 - 1 , etc.), the refrigerant charging ports ( 205A, etc.) for charging refrigerant may also be formed in the same number as the number of refrigerant flow spaces.

[0123] Among them, the active heat dissipation mechanism 200A according to one embodiment of the present invention and the active heat dissipation mechanism 200B according to another embodiment of the present invention described later, although not shown in the drawings, may also include: a caulking member (not shown), which is inserted into the refrigerant filling port (205A, etc.) after the refrigerant is filled in each refrigerant flow space, and then the refrigerant flow space is sealed by squeezing the refrigerant filling port (205A, etc.).

[0124] The caulking member is made of a material that deforms under the action of external force. It is squeezed from the outside by the caulking process of squeezing the inlet part of the refrigerant charging port (205A, etc.), thereby preventing the internal refrigerant from leaking out.

[0125] Before performing the caulking process of sealing the inlet portion of the refrigerant charging port ( 205A, etc.) using a caulking member, a vacuuming process of decompressing the refrigerant flow space to achieve vacuumization may be preferentially performed.

[0126] Among them, after the caulking component is inserted into the refrigerant filling port (205A, etc.), in order to facilitate the above-mentioned pressing portion 150 to be pressed in with a smooth interference fit, the refrigerant filling port (205A, etc.) including the caulking component can be cut to match the outer end of the pressing end portion 201.

[0127] Figure 8 200B, 200C, and 200D are three-dimensional diagrams showing active heat dissipation mechanisms according to another embodiment of the present invention. Figure 9 yes Figure 8 (a) is an exploded perspective view of another embodiment 200B, Figure 10 yes Figure 8 (a) is an expanded view of another embodiment 200B in a state before joining, Figure 11a yes Figure 8 Another embodiment 200B shown in (a) is a front view (a), a cross-sectional view taken along line CC (b), a three-dimensional cross-sectional view (c), and a partial enlarged view (d). Figure 11b yes Figure 8 A main view (a) of another embodiment 200B shown in (a), a cross-sectional view (b) taken along line DD, a three-dimensional cross-sectional view (c), and a partial enlarged view (d) thereof.

[0128] like Figure 8 As shown, other embodiments 200B, 200C, and 200D of the present invention are embodiments that are implemented differently according to the differences in the number of refrigerant flow spaces separated by chamber partitions (204-1, etc.). The detailed description of the technical features that are common with the previously described embodiment 200A of the present invention will be omitted below, and the technical features that are different will be mainly described.

[0129] In addition, in other embodiments of the present invention, the embodiment indicated by the figure mark 200B and the embodiments indicated by the figure marks 200C and 200D are the same in structure except for the number of refrigerant flow spaces. Therefore, the following will only describe in detail another embodiment of the present invention indicated by the figure mark 200B in combination with the drawings.

[0130] like Figures 8 to 11b As shown, the active heat dissipation mechanism 200B according to another embodiment of the present invention may be implemented as an absorber 260B consisting of two parts, namely, a one-side absorption member 260B-a and an other-side absorption member 260B-b.

[0131] More specifically, the absorber 260B may include: a one-side absorption member 260B-a, which is closely attached to the inner surface of the heat-conducting panel 200B-1 on one side in the refrigerant flow space; and an other-side absorption member 260B-b, which is closely attached to the inner surface of the heat-conducting panel 200B-2 on the other side in the refrigerant flow space.

[0132] As described above, the active heat dissipation mechanism 200B according to another embodiment of the present invention has the advantage of maximizing the reflux transmission force of the refrigerant by dividing the absorber 260B that utilizes capillary force to exert heat transfer capability into two parts and arranging them on one side heat conduction panel 200B-1 and the other side heat conduction panel 200B-2 respectively.

[0133] The refrigerant reflux force refers to the reflux rate at which the liquid refrigerant rapidly flows back to the injection end portion 201 due to phase change. The improvement in the refrigerant reflux force has the advantage of preventing the absorber 260B from drying out.

[0134] In the active heat dissipation mechanism 200A according to one embodiment of the present invention, the absorber 260A is a single component, which is arranged in parallel with the inner surfaces of the one side heat-conducting panel 200A-1 and the other side heat-conducting panel 200A-2, respectively, and is spaced apart in the middle (center) of the thickness portion forming the refrigerant flow space. The difference is that in the active heat dissipation mechanism 200B according to another embodiment of the present invention, the two absorbers 260B-a and 260B-b are respectively arranged in close contact with the inner surfaces of the one side heat-conducting panel 200B-1 and the other side heat-conducting panel 200B-2.

[0135] In addition, in an active heat dissipation mechanism 200B according to another embodiment of the present invention, Figure 11a and Figure 11bAs shown, the multiple absorber fixing parts 251-1 and 251-2 may include: a one-side absorber fixing part 251-1, which protrudes from one side heat conduction panel 200B-1 toward the other side heat conduction panel 200B-2; and the other-side absorber fixing part 251-2, which protrudes from the other side heat conduction panel 200B-2 toward the one side heat conduction panel 200B-1.

[0136] Among them, one side absorbent body fixing part 251-1 can pass through one side absorbent member 260B-a and protrude to support the other side absorbent member 260B-b, and the other side absorbent body fixing part 251-2 can pass through the other side absorbent member 260B-b and protrude to support one side absorbent member 260B-a.

[0137] Therefore, fixing portion through-holes (not denoted by reference numerals) may be formed in the one side absorbent member 260B-a and the other side absorbent member 260B-b, respectively, for the other side absorbent body fixing portion 251-2 and the one side absorbent body fixing portion 251-1 to penetrate therethrough.

[0138] On the other hand, in one embodiment 200A of the present invention, a plurality of joints (241a, etc.) and a plurality of absorber fixing portions (251a, etc.) are alternately and repeatedly arranged in a plurality of rows and columns (rows and columns) on both sides of the heat conduction panel main bodies 200A-1 and 200A-2, respectively. However, in an active heat dissipation mechanism (200B, etc.) according to another embodiment of the present invention, a plurality of joints 241 and a plurality of absorber fixing portions 251 are alternately and repeatedly arranged in a plurality of rows and columns. Figure 11a In the embodiment, the elements are arranged alternately and repeatedly, not in the up-down direction (rows) or the left-right direction (columns), but in the left-right diagonal direction.

[0139] In addition, in order to prevent the plurality of joints 241 from being damaged by heat when being joined to each other, a plurality of joint through holes (not marked with reference numerals, see FIG. Figure 6 261b).

[0140] On the other hand, in the active heat dissipation mechanism 200B according to another embodiment of the present invention, unlike the embodiment 200A in which the absorber 260A is only partially adjacent to the press-in end 201 side, it can be arranged in the remaining parts of the one side absorption member 260B-a and the other side absorption member 260B-b except the press-in end 201, that is, the entire refrigerant flow space corresponding to the heat dissipation plate part.

[0141] As described above, the absorber 260B is uniformly supported by utilizing the plurality of joint portions 241 uniformly distributed on the one side heat conduction panel 200B-1 and the other side heat conduction panel 200B-2 and the plurality of absorber fixing portions (251a, etc.) formed simultaneously during the pressing process. Thus, the absorber 260B can be stably fixed to the refrigerant flow space even without providing additional fixing elements.

[0142] For example, in order to fix the absorber 260B (including the absorber 260A of one embodiment), if additional spacers, pillars, wires, powders or screen meshes are used, additional joining processes, sintering processes, bonding processes or flattening processes are required. However, by utilizing multiple joining parts 241 and multiple absorber fixing parts 251 formed simultaneously during the pressing process of the heat-conducting panel body, stable fixation can be achieved. Therefore, it has the advantages of being able to relatively reduce the number of parts, shorten the process steps, and realize the large area of ​​the active heat dissipation mechanism 200A, 200B itself.

[0143] According to the active heat dissipation mechanism (200A, 200B, etc.) of the embodiment of the present invention, Figure 1 and Figure 2 As shown, the press-in end portion 201 can be pressed into and coupled to a plurality of press-in portions 150 formed on the back side of the heat dissipation housing body 110 by press-in fitting.

[0144] Although not shown in the figure, to improve thermal conductivity, it is preferred that the press-fit portion 150 be treated with thermal epoxy before insertion. Even if the press-fit portion 150 is not provided as a press-fit portion, the surface of the heating element may also be treated with thermal epoxy.

[0145] As described above, the active heat dissipation mechanism (200A, 2000B, etc.) according to the embodiments of the present invention is provided with an absorber similar to a known heat dissipation component, i.e., a liquid-absorbing core member provided inside a vapor chamber, while the refrigerant is filled in the refrigerant flow space for the internal refrigerant flow. The absorber not only functions as a known heat dissipation fin, but also constructs an active heat conduction system based on the phase change of the refrigerant, breaking through the limits of the thermal conductive materials of traditional heat dissipation fins, thereby providing the advantage of maximizing heat dissipation performance.

[0146] Among them, since the closer to the pressing end 201 side, the easier and more active the liquid refrigerant is to undergo phase change (transform into gas phase refrigerant in gas state) due to the heat conducted from the heating element, the absorber is preferably installed as close to the pressing end 201 side as possible.

[0147] However, the absorber does not necessarily have to be installed only near the pressing end 201 side, and it can also be installed in the entire evaporation area where the refrigerant can evaporate so that it is evenly distributed.

[0148] Reference Figure 1 and Figure 2 The press-fit portion 150 formed on the back of the heat dissipation housing body 110 is, with the groove structure 170 as a reference, gradually inclined upward toward one end in the left-right width direction, forming a "V" shape. Therefore, in the active heat dissipation mechanism (200A, 200B, etc.) according to the embodiments of the present invention, when the press-fit end portion 201 is fixed to the press-fit portion 150, it can be divided into an "upper side" and a "lower side" area. The "upper side" refers to the upper side relative to the direction of gravity, while the "lower side" refers to the lower side relative to the direction of gravity.

[0149] The heat generated by the heating element is first conducted to the side of the press-in end 201, and the liquid-phase refrigerant absorbed by the absorbers 260A and 260B undergoes a phase change (converts into a gas-phase refrigerant) due to the conducted heat. The gas-phase refrigerant actively flows in the entire refrigerant flow space and exchanges heat with the external air through the outer side surfaces of the heat-conducting panels 200A-1 and 200B-1 on one side including the heat dissipation end 203 and the heat-conducting panels 200A-2 and 200B-2 on the other side, and then re-condenses and undergoes a phase change (converts into a liquid-phase refrigerant).

[0150] The refrigerant that has changed its phase into liquid refrigerant is absorbed by the absorbers 260A and 260B and moves downward in the direction of gravity, and then moves to the side of the pressing end 201 which serves as an evaporation area, thereby repeating the above-mentioned phase change, thereby constructing a system that effectively discharges the heat generated by the heating element.

[0151] On the other hand, in the active heat dissipation mechanism ( 200A, 200B, etc.) according to the embodiment of the present invention, the base panel material constituting the heat conduction panel body may be made of stainless steel (SUS).

[0152] As described above, when the base material panel is made of SUS material, the refrigerant filled inside can also be distilled water. Since a refrigerant such as distilled water with higher latent heat and sensible heat can be used, and has excellent surface tension, the diversity of material selection for the absorbers 260A and 260B is also increased.

[0153] For reference, among refrigerant types, H2O (distilled water) has advantages over other refrigerants in terms of price, latent heat of vaporization, and surface tension. However, distilled water causes a chemical reaction with aluminum, which is commonly used as a material for heat sink fins, making its use difficult.

[0154] So far, the active heat dissipation mechanism ( 200A, 200B, etc.) according to the embodiment of the present invention has been described by taking the case where the heat dissipation housing body 110 of the antenna device, which is a typical device of electronic equipment, as an example.

[0155] However, the active heat dissipation mechanism (200A, 200B, etc.) according to the embodiment of the present invention is not limited to application only to antenna devices. Although not shown in the figure, it can serve as a medium for physical connection between electric vehicle batteries and the cooling water module that cools them. It can also be applied to the heat dissipation fins of display devices or televisions with large heat generation, and can also be applied to cooling elements of energy storage devices (ESS), semiconductors and AI devices, thereby ensuring very high versatility.

[0156] In particular, to address the heating issues of high-density, high-integration, high-performance, and state-of-the-art semiconductor components, the one-side heat-conducting panels 200A-1, 200B-1 and the other-side heat-conducting panels 200A-2, 200B-2, which have heat dissipation surfaces that can directly contact the surface over a large area, can be actively utilized. This has the advantage of easily constructing a natural cooling system without the need for other electrical components such as a compressor.

[0157] This can also be used as a heat dissipation solution for various system chips such as insulated gate bipolar transistors (IGBTs), field-programmable gate arrays (FPGAs), power integrated circuits (Power ICs), driver integrated circuits (Drive ICs), central processing units (CPUs), and graphics processing units (GPUs), and has the effect of reducing the weight and volume of the entire product.

[0158] The above describes in detail an embodiment of the active heat dissipation mechanism according to the present invention with reference to the accompanying drawings. However, the embodiments of the present invention are not necessarily limited to the above embodiment. Those skilled in the art will readily appreciate that various modifications within the scope of the present invention are possible. Therefore, the true scope of the present invention should be determined by the claims.

[0159] Industrial Applicability The present invention provides an active heat dissipation mechanism that can improve heat dissipation performance by actively conducting heat generated from a heat-generating device (eg, electronic equipment) through a phase change of a refrigerant that is more efficient than the heat-conducting material properties of the refrigerant itself.

Claims

1. An active heat dissipation mechanism, characterized in that: include: A heat-conducting panel body is made of a heat-conducting material, wherein a refrigerant flow space of a predetermined thickness for charging and flowing refrigerant is formed inside the heat-conducting panel body, and the heat-conducting panel body includes a first heat-conducting panel and a second heat-conducting panel forming one surface and the other surface of the thickness portion, respectively; a plurality of joints, respectively formed on the one side heat-conducting panel and the other side heat-conducting panel and used to join the one side heat-conducting panel and the other side heat-conducting panel in the refrigerant flow space; as well as an absorber, disposed in the refrigerant flow space and configured to absorb liquid refrigerant in the refrigerant, The plurality of joining portions penetrate the absorbent body in a thickness direction and are joined to each other.

2. The active heat dissipation mechanism according to claim 1, characterized in that: Also includes: A plurality of absorber fixing portions are provided on at least one of the one side heat conducting panel and the other side heat conducting panel and are used to fix the absorber.

3. The active heat dissipation mechanism according to claim 2, characterized in that: The plurality of absorber fixing portions are arranged to support the outer side surface of at least one of the one side surface and the other side surface of the absorber.

4. The active heat dissipation mechanism according to claim 2, characterized in that: The absorber is disposed in parallel with and spaced apart from the one side heat transfer panel and the other side heat transfer panel at a middle portion of a thickness portion of the refrigerant flow space.

5. The active heat dissipation mechanism according to claim 4, characterized in that: The absorber fixing portion formed on the one side heat conduction panel among the plurality of absorber fixing portions supports the one side opposite to the one side heat conduction panel among the one side and the other side of the absorber. The absorber fixing portion formed on the other-side heat transfer panel among the plurality of absorber fixing portions supports the other side surface, which is opposite to the other-side heat transfer panel, of the one side surface and the other side surface of the absorber.

6. The active heat dissipation mechanism according to claim 4, characterized in that: The plurality of absorber fixing portions are respectively supported at the same position by one absorber fixing portion protruding from the one heat conducting panel toward the other heat conducting panel and another absorber fixing portion protruding from the other heat conducting panel toward the one heat conducting panel.

7. The active heat dissipation mechanism according to claim 2, characterized in that: The plurality of absorber fixing portions support the absorber without penetrating through one surface of the absorber.

8. The active heat dissipation mechanism according to claim 2, characterized in that: The absorbent body comprises: a side absorbing member, arranged in close contact with the inner surface of the side heat-conducting panel in the refrigerant flow space; and The other-side absorbing member is arranged in close contact with the inner surface of the other-side heat-conducting panel in the refrigerant flow space.

9. The active heat dissipation mechanism according to claim 7, characterized in that: The plurality of absorber fixing parts include: a one-side absorber fixing portion protruding from the one-side heat-conducting panel toward the other-side heat-conducting panel; and The other side absorber fixing portion protrudes from the other side heat conduction panel toward the one side heat conduction panel, The one side absorbent body fixing portion passes through the one side absorbent member and supports the other side absorbent member. The other-side absorbent body fixing portion passes through the other-side absorbent member to support the one-side absorbent member.

10. The active heat dissipation mechanism according to claim 2, characterized in that: A plurality of joint through holes are formed in the absorbent body so that the plurality of joints can penetrate each other and be in surface contact with each other.

11. The active heat dissipation mechanism according to claim 2, characterized in that: The plurality of joining portions and the plurality of absorber fixing portions are arranged alternately and repeatedly in parallel along any straight line direction of the heat conduction panel body.

12. The active heat dissipation mechanism according to claim 2, characterized in that: When at least one end of the heat conducting panel body forms a pressed end adjacent to a heat generating element to be radiated heat when the one heat conducting panel and the other heat conducting panel are joined, at least a portion of the absorber is arranged in a straight line along the pressed end.

13. The active heat dissipation mechanism according to claim 12, characterized in that: When the portions of the one side heat conducting panel and the other side heat conducting panel excluding the press-fit end portions are defined as heat dissipation plate portions, The remaining portion of the absorber is bent toward a portion of the heat dissipation plate portion that is relatively lower based on the direction of gravity and extends in a straight line.

14. The active heat dissipation mechanism according to claim 1, characterized in that: At least one chamber partition is provided on the one heat conducting panel and the other heat conducting panel. The at least one chamber partition divides the refrigerant flow space into at least two areas after the one heat conducting panel and the other heat conducting panel are joined together.

15. The active heat dissipation mechanism according to claim 14, characterized in that: In at least two of the refrigerant flow spaces partitioned by the chamber partition, the absorbers are arranged in a number corresponding to the number of each of the refrigerant flow spaces.

16. The active heat dissipation mechanism according to claim 12, characterized in that: The pressing end portion is provided with a refrigerant charging port, and the refrigerant charging port is communicated with the refrigerant flow space so as to be charged with the refrigerant.

17. The active heat dissipation mechanism according to claim 16, characterized in that: Also includes: A caulking member is inserted into the refrigerant charging port after the refrigerant is charged, and then seals the refrigerant flow space by squeezing the refrigerant charging port.

18. The active heat dissipation mechanism according to claim 17, characterized in that: After the caulking member is inserted into the refrigerant charging port, the refrigerant charging port including the caulking member is cut to match the outer end of the press-in end portion.

19. The active heat dissipation mechanism according to claim 12, characterized in that: When the end opposite to the press-fit end is defined as the heat dissipation end, A reinforcing rib is formed along the end of the heat dissipation end portion for enhancing rigidity.

20. The active heat dissipation mechanism according to claim 19, characterized in that: The reinforcing ribs include: A reinforcing rib groove on one side is formed by being recessed from the heat-conducting panel on one side toward the outside of the refrigerant flow space; and The reinforcing rib groove on the other side is formed by being recessed from the heat-conducting panel on the other side toward the outside of the refrigerant flow space.

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