Lightweight radio frequency assembly based on impact resistance ball grid array

Abstract

The invention provides a ball grid array lightweight radio frequency assembly based on impact resistance, and relates to the technical field of radio frequency. The radio frequency assembly comprises a substrate, a side plate, a support plate, an elastic member, a pop support ball, a chip silicon substrate and a BGA solder ball. The side plate is installed on the substrate, a plurality of supporting plates are arranged in the substrate, elastic pieces are arranged between the supporting plates and the substrate, every two adjacent supporting plates are connected through a pop supporting ball, the chip silicon substrate is installed on the supporting plates, and the substrate is connected with an external structure through a BGA welding ball. Through various structures, the stability of the radio frequency assembly is enhanced, and an anti-impact mechanical structure is utilized to construct a shielding structure, so that the weight and the manufacturing cost of the radio frequency assembly are reduced.

Description

Technical Field

[0001] The present invention relates to the field of radio frequency technology, and in particular to a lightweight radio frequency component based on an impact-resistant ball grid array. Background Art

[0002] In the actual operating environment of traditional circuits, such as aircraft in the aerospace field experiencing atmospheric turbulence and high-speed maneuvers, and military equipment experiencing complex electromagnetic confrontation and severe mechanical vibration scenarios, circuits not only have to withstand strong acceleration shocks, but also face severe electromagnetic interference challenges.

[0003] Traditional RF components utilize metal cavity isolation. Under strong impact, their heavy weight causes a dramatic increase in the equivalent weight of the circuit, severely compromising device stability. Manufacturing requires high-precision machining and expensive materials, resulting in high costs. Furthermore, metal cavities are prone to introducing electromagnetic interference. In phase-locked frequency conversion circuits, this significantly interferes with the phase-locked loop's precise locking of the signal phase and the frequency conversion of the frequency conversion module, significantly reducing circuit performance, particularly signal isolation. Under complex conditions such as strong impact, it is difficult to meet the stringent circuit performance requirements of modern high-performance electronic equipment. Therefore, a lightweight RF component based on an impact-resistant ball grid array is urgently needed to address these issues. Summary of the Invention

[0004] The problem to be solved by the present invention is that the stability of the traditional radio frequency components is seriously damaged under complex conditions such as strong impact.

[0005] To solve the above problems, the present invention provides a lightweight radio frequency component based on an impact-resistant ball grid array, comprising a substrate, a side plate, a support plate, an elastic member, a pop support ball, a chip silicon base and a BGA solder ball;

[0006] The side plates are mounted on a substrate, a plurality of support plates are arranged inside the substrate, elastic parts are arranged between the support plates and the substrate, two adjacent support plates are connected by pop balls, the chip silicon base is mounted on the support plate, and the substrate is connected to the external structure by BGA solder balls.

[0007] Optionally, a groove is etched around the BGA solder ball on the substrate;

[0008] The circuit board is a flexible circuit board.

[0009] Optionally, a high-Q value filtering circuit is provided on the silicon substrate of the chip;

[0010] A resonant cavity is etched on the support plate;

[0011] The support plate includes a composite material layer, a metal material layer and a magnetic material layer. The composite material layer is covered with the metal material layer, and the metal material layer is covered with the magnetic material layer. The composite material layer is the outer layer of the support plate, and the magnetic material layer is the inner layer of the support plate.

[0012] Optionally, the magnetic material of the magnetic material layer is Permalloy, the metal material in the metal material layer is copper, and the composite material in the composite material layer is any one of silicon carbide-based composite materials, graphene-reinforced composite materials, nanocomposites and metal-polymer multilayer composite materials.

[0013] Optionally, a MEMS sensor and an adaptive filtering circuit are provided inside the packaging space formed by the substrate and the side panels.

[0014] Optionally, the BGA solder balls are made of Sn-Ag-Cu-Ti alloy material; redundant BGA solder balls are arranged inside the substrate surrounded by the outer BGA solder balls, and the arrangement spacing of the outer BGA solder balls is smaller than the arrangement spacing of the inner redundant BGA solder balls.

[0015] Optionally, the substrate includes a carbon fiber layer and a metal belt, the carbon fiber layer is made of honeycomb carbon fiber reinforced polymer, and the metal belt is embedded inside.

[0016] Optionally, the substrate includes a low-loss layer, the material of the low-loss layer is liquid crystal polymer, and a periodic EBG structure is provided in the substrate.

[0017] Optionally, a flow channel and a graphene film are integrated in the substrate.

[0018] Optionally, a ground shielding ring and a built-in shielding ring are provided on the substrate;

[0019] The ground shielding ring is a double-layer grounded BGA solder ball arranged around the BGA solder ball that transmits the radio frequency signal;

[0020] The built-in shielding ring is a metal tape layer and a composite material layer arranged in the substrate.

[0021] The present invention provides a lightweight radio frequency component based on an impact-resistant ball grid array. Compared with the existing technology, it has the following advantages:

[0022] Elastic elements are cleverly added between the chip silicon substrate and the baseplate, as well as at the connection areas between different functional modules. These elements effectively absorb and disperse mechanical stress during strong acceleration impacts through their elastic deformation. Pop-up balls are placed between multiple support plates to prevent collisions under strong impacts. This multifaceted structure enhances the stability of the RF component. Furthermore, because the chip silicon substrate is mounted between two support plates and surrounded by pop-up balls, a shielding structure is formed around the silicon substrate. This impact-resistant mechanical structure creates a shielding structure, reducing the weight and manufacturing cost of the RF component. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 A schematic diagram of a shock-resistant elastically supported BGA package architecture provided by an embodiment of the present invention;

[0025] Figure 2 A schematic diagram of a support plate structure provided by an embodiment of the present invention;

[0026] Figure 3 A schematic diagram of a substrate structure provided by an embodiment of the present invention;

[0027] Figure 4 A schematic diagram of another substrate structure provided by an embodiment of the present invention.

[0028] Description of reference numerals:

[0029] 1. Base plate; 2. Side plate; 3. Support plate; 4. Elastic part; 5. Pop ball; 6. Chip silicon base; 7. BGA solder ball; 11. Carbon fiber layer; 12. Metal strip; 13. Honeycomb carbon fiber foam sandwich; 14. Low-loss layer; 31. Composite material layer; 32. Metal material layer; 33. Magnetic material layer. DETAILED DESCRIPTION

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this application more clear, the technical solutions in the embodiments of this application are clearly and completely described. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0031] In order to better understand the above technical solution, the above technical solution will be described in detail below with reference to the accompanying drawings and specific implementation methods.

[0032] like Figure 1 As shown, an embodiment of the present application provides a lightweight RF component based on an impact-resistant ball grid array, including a substrate 1, a side plate 2, a support plate 3, an elastic member 4, a pop ball 5, a chip silicon base 6 and a BGA solder ball 7;

[0033] The side panel 2 is installed on the substrate 1 by parallel seam welding using a parallel seam welding machine. A plurality of support plates 3 are provided inside the substrate 1. An elastic member 4 is provided between the support plate 3 and the substrate 1. Two adjacent support plates 3 are connected by pop balls 5. The chip silicon base 6 is installed on the support plate 3. The substrate 1 is connected to the external structure through BGA solder balls 7.

[0034] Specifically, the elastic member 4 can be an elastic bracket, a spring or a spring, etc., and its material can be a specially customized high-elasticity, high-damping rubber material. The above structure constitutes the elastic support BGA packaging architecture of the RF component. Figure 1 In the figure, both ends of the uppermost and lowermost support plates are fixedly connected to the elastic members, and the middle support plate is connected to the upper and lower support plates via the pop balls 5.

[0035] In this embodiment, elastic members are cleverly added between the chip silicon base 6 and the substrate 1 and at the connection areas of different functional modules. They can effectively absorb and disperse mechanical stress by virtue of their own elastic deformation at the moment of strong acceleration impact. Pop balls 5 are set between multiple support plates 3 to prevent multiple support plates 3 from colliding under strong impact. The size and shape of the pop balls 5 at different positions can be different according to needs, for example Figure 1 In the example, the pop balls 5 between the upper support plates 3 are significantly larger than those between the lower support plates 3, thereby enabling graded absorption of impact and vibration. This multi-faceted structure enhances the stability of the RF component. Furthermore, since the chip silicon substrate 6 is mounted between the two support plates 3 and the pop balls 5 are positioned around the chip silicon substrate 6, a shielding structure is formed around the chip silicon substrate 6. This shielding structure, constructed using an impact-resistant mechanical structure, eliminates the need for additional shielding components (such as metal covers), reducing the weight and manufacturing cost of the RF component.

[0036] In addition to the aforementioned elastically supported BGA package architecture, other aspects are also employed to enhance the stability and anti-interference shielding of RF components. These include flexible interconnect and stress-relief circuit design, a reinforced straight-ball solder joint array layout, integrated multi-layer composite shielding and high-Q filtering, and adaptive filter adjustment based on microelectromechanical systems (MEMS). These aspects are discussed below.

[0037] In an optional embodiment of the present application, the flexible interconnection and stress relief circuit design is specifically as follows: on the substrate 1, grooves are etched around the BGA solder balls 7; and the circuit board in the chip silicon base 6 is a flexible circuit board.

[0038] Specifically, a flexible printed circuit (FPC) with exceptional flexibility and excellent electrical performance was selected to replace some of the traditional rigid circuit connections. A stress relief structure was carefully designed around the BGA solder balls 7, a transition fillet was added between the solder joints and the pads, and microgrooves were etched in the substrate area near the solder joints.

[0039] In this embodiment, flexible interconnection technology is used in the key signal transmission path of the phase-locked frequency conversion circuit. A flexible printed circuit board (FPC) with excellent flexibility and good electrical performance is selected to replace some traditional rigid line connections. The FPC can flexibly bend and deform in accordance with the changes in mechanical stress during the impact process, effectively avoiding the risk of line breakage caused by stress concentration. At the same time, a stress relief structure is carefully designed around the BGA solder ball 7, a transition fillet is added between the solder joint and the pad, and micro-grooves are etched in the substrate area near the solder joint, so that the stress generated by the strong impact is preferentially released at these preset structures, fully guaranteeing the reliability of the solder joint in a complex stress environment.

[0040] In an optional embodiment of the present application, the enhanced straight ball solder joint array layout specifically utilizes a Sn-Ag-Cu-Ti alloy material by ingeniously adding special alloying elements to the solder joint material. Redundant BGA solder balls 7 are disposed within the substrate 1, surrounded by the peripheral BGA solder balls 7. The peripheral BGA solder balls 7 are arranged at a smaller pitch than the redundant BGA solder balls 7 within the substrate 1.

[0041] Specifically, the BGA solder balls are densely arranged around the periphery to enhance edge impact resistance, while redundant solder balls are used internally to disperse stress. Precisely controlling soldering parameters creates a highly consistent, mechanically strong, straight solder joint array. Finite element analysis simulates impact loads during the layout of this enhanced straight solder joint array to optimize the number and placement of redundant solder balls, and EDA tools are used to design a non-uniform solder ball layout.

[0042] In this embodiment, the BGA's straight-ball solder joint design is improved, significantly increasing the density and strength of the solder joints. By precisely controlling the soldering parameters, a highly consistent array of straight-ball solder joints with exceptional mechanical strength is created. Special alloying elements, such as indium (In) and bismuth (Bi), are cleverly added to the solder joint material to significantly enhance the solder joint's toughness and fatigue resistance. When subjected to strong acceleration shocks, the high-density solder joint array can collaboratively share mechanical stress, effectively preventing single solder joints from cracking or falling off due to excessive stress, and comprehensively ensuring the reliability of the electrical connections between the various modules of the phase-locked frequency conversion circuit.

[0043] In an optional embodiment of the present application, the multi-layer composite shielding and high Q value filtering integrated design is specifically as follows: a high Q value filtering circuit is provided on the chip silicon base 6; a resonant cavity is etched on the support plate 3; Figure 2 As shown, the support plate 3 includes a composite material layer 31, a metal material layer 32 and a magnetic material layer 33. The composite material layer 31 is covered with the metal material layer 32, and the metal material layer 32 is covered with the magnetic material layer 33. The composite material layer 31 is the outer layer of the support plate 3, and the magnetic material layer 33 is the inner layer of the support plate 3.

[0044] Specifically, the two support plates 3 form a shielding layer. A high-Q filter circuit is integrated between the shielding layers. By etching a resonant cavity of a specific shape within the shielding layer and loading high-quality capacitors and inductors, a highly efficient filter is constructed for interference signals in different frequency bands. This deeply integrates electromagnetic shielding with high-Q filtering functions.

[0045] The magnetic material of the magnetic material layer 33 is Permalloy, which effectively shields low-frequency magnetic field interference; the metal material in the metal material layer 32 is copper, which strongly shields high-frequency electric field interference; the composite material in the composite material layer 31 is selected from any one of silicon carbide-based composite materials, graphene-reinforced composite materials, nanocomposites and metal-polymer multilayer composite materials.

[0046] The substrate 1 is provided with a ground shield ring and an internal shield ring. The ground shield ring consists of a double layer of grounded BGA solder balls 7 arranged around the BGA solder balls 7 that transmit RF signals. This double layer of grounded solder balls around the RF signal solder balls creates a Faraday cage effect. The internal shield ring consists of a metal tape layer and a composite material layer embedded within the substrate 1. The internal shield ring isolates high-frequency crosstalk by embedding a high-conductivity metal layer and a copper-graphene composite material within the substrate.

[0047] In an optional embodiment of the present application, the substrate 1 includes a carbon fiber layer 11 and a metal belt 12. The carbon fiber layer 11 is made of a honeycomb carbon fiber reinforced polymer and has the metal belt 12 embedded therein. Figure 3 As shown, the substrate 1 includes a carbon fiber layer 11 , which is a carbon fiber reinforced polymer; a honeycomb carbon fiber foam interlayer 13 , and an embedded metal tape 12 .

[0048] In an optional embodiment of the present application, the substrate 1 includes a low-loss layer 14, the material of the low-loss layer 14 is liquid crystal polymer, and a periodic EBG structure is provided in the substrate 1. Figure 4As shown, substrate 1 includes a low-loss layer 14, made of liquid crystal polymer (LCP) with a low dissipation factor (Df) <0.002, to reduce signal attenuation. A periodic EBG structure is designed within substrate 1 to suppress electromagnetic coupling in specific frequency bands. A metal strip 12 is also embedded within low-loss layer 14.

[0049] In an optional embodiment of the present application, a flow channel and a graphene film are integrated into the substrate 1. The integration of micro-channels and a highly thermally conductive graphene film in the substrate 1 ensures heat dissipation of the RF device. After the design is completed, ANSYS Multiphysics is used to jointly simulate mechanical impact, thermal distribution, and electromagnetic fields to verify the design robustness.

[0050] The above-mentioned various substrates 1 can be selected according to actual needs. Some substrates 1 focus on lightweight, some substrates 1 focus on signal transmission protection, and some substrates 1 focus on high integration and heat dissipation.

[0051] By employing this technical solution, electromagnetic shielding and high-Q filtering are deeply integrated. The innermost layer utilizes high-permeability magnetic materials, such as Permalloy, to effectively shield low-frequency magnetic interference. The middle layer utilizes high-conductivity metal materials, such as copper, to effectively shield high-frequency electric interference. The outermost layer utilizes a composite material that combines mechanical protection with electromagnetic shielding. High-Q filtering circuits are cleverly integrated between the shielding layers. By etching a specifically shaped resonant cavity within the shielding layer and loading it with high-quality capacitors and inductors, highly efficient filters are constructed to target interference signals in different frequency bands. These filters can accurately filter out interference signals outside the operating frequency band of the phase-locked frequency conversion circuit, significantly improving signal purity.

[0052] In an optional embodiment of the present application, the adaptive filtering adjustment based on microelectromechanical systems (MEMS) is specifically to introduce advanced microelectromechanical systems (MEMS) technology, and a MEMS sensor and an adaptive filtering circuit are arranged inside the packaging space formed by the substrate 1 and the side panel 2.

[0053] Specifically, the MEMS sensor monitors the electromagnetic interference (EMI) in the circuit's environment in real time. When it detects changes in interference signal parameters such as frequency and amplitude, it quickly feeds this information back to the adaptive filtering circuit. Based on this feedback, the adaptive filtering circuit automatically adjusts filter parameters, such as the filter's center frequency and bandwidth, to ensure efficient filtering of interference signals in varying EMI environments, maintaining stable operation of the phase-locked frequency conversion circuit.

[0054] In summary, this impact-resistant ball grid array lightweight RF signal isolation technology solves the problem of traditional metal cavity isolation solutions. Under strong impact, its heavy weight causes the equivalent weight of the circuit to increase dramatically, seriously damaging the stability of the equipment; and in manufacturing, it requires high-precision processing and expensive materials, resulting in high costs.

[0055] In summary, compared with the existing technology, the present invention has the following beneficial effects:

[0056] Compared with the existing technology, the technical solution of this application has the following beneficial effects:

[0057] 1. Improve impact resistance and stability

[0058] Verified by a large number of rigorous simulated strong acceleration shock experiments, the structural design using the technology of the present invention can still maintain stable operation when the impact intensity reaches 5-10 times the tolerance limit of traditional technology. The incidence of circuit failure is significantly reduced compared with traditional technology, providing a solid guarantee for the reliable operation of equipment in extremely harsh shock environments.

[0059] 2. Lightweight

[0060] Compared with traditional metal cavity isolation solutions, this invention successfully reduces the weight of phase-locked frequency conversion circuits by 80% by leveraging BGA lightweight design and the clever application of new materials. This effectively meets the urgent needs of weight-sensitive fields such as aerospace and mobile military equipment, and significantly improves the mobility and energy utilization efficiency of the equipment.

[0061] 3. Enhance signal isolation and filtering performance

[0062] The integrated design of multi-layer composite shielding and high-Q filtering, along with MEMS adaptive filtering, enhances signal isolation and filtering performance. It can attenuate interference signals outside the target frequency band by over 80dB, effectively improving the signal-to-noise ratio and boosting frequency synthesis accuracy by 40%. This optimizes signal quality, laying a solid foundation for applications requiring extremely high signal quality, such as communications and radar.

[0063] 4. Cost-effectiveness

[0064] By abandoning the complex and expensive metal cavity processing process, simplifying the manufacturing process, and rationally selecting cost-controlled new materials, the technical solution of the present invention reduces the overall manufacturing cost of the phase-locked frequency conversion circuit by 50%, showing cost advantages in large-scale production.

[0065] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0066] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A lightweight radio frequency component based on an impact-resistant ball grid array, characterized in that: It comprises a base plate (1), a side plate (2), a support plate (3), an elastic member (4), a pop support ball (5), a chip silicon base (6) and a BGA solder ball (7); The side plates (2) are mounted on a substrate (1); a plurality of support plates (3) are arranged inside the substrate (1); elastic members (4) are arranged between the support plates (3) and the substrate (1); two adjacent support plates (3) are connected via pop balls (5); the chip silicon base (6) is mounted on the support plates (3); and the substrate (1) is connected to an external structure via BGA solder balls (7).

2. The impact-resistant ball grid array lightweight radio frequency component according to claim 1, characterized in that: On the substrate (1), a groove is etched around the BGA solder ball (7); The circuit board in the chip silicon base (6) is a flexible circuit board.

3. The impact-resistant ball grid array lightweight radio frequency component according to claim 1, characterized in that: A high-Q value filter circuit is provided on the chip silicon base (6); A resonant cavity is etched on the support plate (3); The support plate (3) comprises a composite material layer (31), a metal material layer (32) and a magnetic material layer (33); the composite material layer (31) is covered with the metal material layer (32); the metal material layer (32) is covered with the magnetic material layer (33); the composite material layer (31) is the outer layer of the support plate (3); and the magnetic material layer (33) is the inner layer of the support plate (3).

4. The impact-resistant ball grid array lightweight radio frequency component according to claim 3, characterized in that: The magnetic material of the magnetic material layer (33) is Permalloy, the metal material in the metal material layer (32) is copper, and the composite material in the composite material layer (31) is selected from any one of silicon carbide-based composite materials, graphene-reinforced composite materials, nanocomposites, and metal-polymer multilayer composite materials.

5. The impact-resistant ball grid array lightweight radio frequency component according to claim 1, characterized in that: A MEMS sensor and an adaptive filtering circuit are arranged inside the packaging space formed by the substrate (1) and the side plate (2).

6. The impact-resistant ball grid array lightweight radio frequency component according to claim 1, characterized in that: The BGA solder balls (7) are made of Sn-Ag-Cu-Ti alloy material; redundant BGA solder balls (7) are arranged inside the substrate (1) surrounded by the peripheral BGA solder balls (7), and the arrangement spacing of the peripheral BGA solder balls (7) is smaller than the arrangement spacing of the inner redundant BGA solder balls (7).

7. The impact-resistant ball grid array lightweight radio frequency component according to claim 1, characterized in that: The substrate (1) comprises a carbon fiber layer (11) and a metal belt (12); the carbon fiber layer (11) is made of honeycomb carbon fiber reinforced polymer and has the metal belt (12) embedded therein.

8. The impact-resistant ball grid array lightweight radio frequency component according to claim 1, characterized in that: The substrate (1) comprises a low-loss layer (14), the material of the low-loss layer (14) is liquid crystal polymer, and a periodic EBG structure is provided in the substrate (1).

9. The impact-resistant ball grid array lightweight radio frequency component according to claim 1, characterized in that: The substrate (1) is integrated with a flow channel and a graphene film.

10. The impact-resistant ball grid array lightweight radio frequency component according to any one of claims 1 to 9, characterized in that: A ground shielding ring and a built-in shielding ring are provided on the substrate (1); The ground shielding ring is a double-layer grounded BGA solder ball (7) arranged around the BGA solder ball (7) that transmits the radio frequency signal; The built-in shielding ring is a metal belt layer and a composite material layer arranged in the substrate (1).

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