Heat pipe embedded copper substrate for LED automobile lamp and production process of heat pipe embedded copper substrate
Through the design and production process of copper substrates embedded with heat pipes, the problems of heat pipe welding complexity and insufficient thermal conductivity of LED car lights are solved, and efficient and stable thermal conductivity and simplified process flow are achieved, which is suitable for the production of copper substrates for LED car lights.
Patent Information
- Application Number
- CN202510857285.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-25
- Publication Date
- 2025-09-19
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The existing heat pipe welding process of LED automotive lights is complex, inefficient, and has poor consistency. The traditional copper substrate pretreatment process is complex and has insufficient thermal conductivity, which cannot meet the needs of high-power, small-volume LED lights.
A copper substrate design with embedded heat pipes is adopted. Through stamping, molding and hot pressing bonding processes, combined with limiting bosses and AD film layers, the photolithography etching process is avoided, the thermal conductivity is improved and the heat pipe welding process is simplified.
It achieves efficient and stable thermal conductivity, improves production efficiency and consistency, reduces costs, and is environmentally friendly. The thermal conductivity coefficient is more than 250 times that of traditional thermoelectric separation copper substrates.
Smart Images
Figure CN120676596A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of copper substrates, in particular to the technical field of a copper substrate embedded with a heat pipe for an LED automobile lamp and a production process thereof. Background Art
[0002] Currently, there are two major development trends in LED automotive lights: high power and small size. These development trends place increasingly stringent requirements on thermal conductivity and heat dissipation design. Traditional thermoelectric separation copper substrates can no longer meet the requirements. Heat pipe technology has been widely used as a supplement or auxiliary. However, the current application of heat pipe technology mostly adopts the method of welding the heat pipe to the finished copper substrate with soldered LEDs or soldering the LEDs to the FPC and then soldering or bonding them to the heat pipes. The process is complicated and the heat pipe welding process is basically manual operation, with low efficiency, poor consistency, unstable quality and other problems. At the same time, the traditional thermoelectric separation copper substrate requires the process of boss development and boss etching in the copper substrate pretreatment link, and the process operation is complicated. Summary of the Invention
[0003] The purpose of the present invention is to solve the problems in the prior art and propose a copper substrate embedded with heat pipes for LED automotive lamps and its production process. The copper substrate can avoid the photolithography and etching processes of the copper plate, improve efficiency, save costs, and be more environmentally friendly. It avoids the manual operation process of existing heat pipe welding and has the advantages of high efficiency, good consistency and stable quality. The copper substrate has high thermal conductivity.
[0004] To achieve the above-mentioned objectives, the present invention proposes a copper substrate embedded with a heat pipe for an LED automobile lamp, comprising a copper substrate body, a fitting groove, a front limiting boss, a rear limiting boss, a heat pipe body, an upper molded boss, a lower molded boss, a top boss, a bottom boss, an AD film layer, a circuit layer and an LED light source patch, wherein the copper substrate body is provided with a fitting groove, the interior of the fitting groove is symmetrically provided with a front limiting boss and a rear limiting boss, the heat pipe body is molded and embedded in the fitting groove, the upper part of the heat pipe body is provided with an upper molded boss and a lower molded boss at positions corresponding to the front limiting boss and the rear limiting boss, the lower part of the heat pipe body is provided with a top boss and a bottom boss, the outer side of the copper substrate body is provided with an AD film layer, the outer side of the AD film layer is provided with a circuit layer, the copper substrate body, the AD film layer and the circuit layer are pressed together in sequence, and the outer side of the circuit layer is welded with an LED light source patch.
[0005] Preferably, the front limiting boss and the rear limiting boss have the same shape and size, the front limiting boss is a rectangular boss, and the front limiting boss and the rear limiting boss are respectively molded together with the heat pipe body by interference fit.
[0006] Preferably, the upper molded boss is protrudingly arranged above the top outer side surface of the copper base body, and the lower molded boss is protrudingly arranged below the bottom outer side surface of the copper base body.
[0007] Preferably, a plurality of heat sink pads are provided at the bottom of the LED light source patch, and the upper molded boss and the lower molded boss correspond to the positions of the heat sink pads of the LED light source patch on the corresponding side respectively.
[0008] Preferably, the top boss is protruding above the top outer side of the copper base body, and the bottom boss is protruding below the bottom outer side of the copper base body. Heat sinks are respectively attached to the outer sides of the top boss and the bottom boss.
[0009] Preferably, the shape of the heat pipe body before molding and fitting is cylindrical, and the diameter of the heat pipe body is smaller than the minimum distance between the front limiting boss and the rear limiting boss.
[0010] The present invention proposes a production process for a copper substrate embedded with heat pipes for LED automotive lamps, comprising the following steps: S1, copper base plate forming, select copper plate, use stamping equipment to stamp out a copper base plate body with a fitting groove in the middle and front and rear limiting bosses; S2, trimming the copper substrate body, grinding and polishing the burrs and burrs on the edge of the copper substrate body and the inside of the fitting groove, and then sending the copper substrate body to the leveling equipment for surface flatness; S3. Molding and fitting the heat pipe and the copper substrate. Select a cylindrical heat pipe body, adjust the fitting groove positions of the heat pipe body and the copper substrate body to correspond to each other, and then fix them in place. Use a molding device to fit the heat pipe into the fitting groove. S4. Simultaneously mold the flat surface and the boss. Replace the molding die of the molding equipment to flatten the surfaces of the heat pipe body and the copper base plate body. Simultaneously, the molding die molds the upper molded boss and the top boss on the top of the heat pipe body. Simultaneously, the molding die molds the lower molded boss and the bottom boss on the bottom of the heat pipe body to form a semi-finished copper base plate. S5. Hot pressing and bonding: through windows are respectively opened on the AD film layer and the circuit layer at positions corresponding to the upper molded boss, the lower molded boss, the top boss, and the bottom boss. The AD film layer and the circuit layer are sequentially attached to the outer side of the semi-finished copper substrate, and the semi-finished copper substrate is fed into a hot pressing device for hot pressing and bonding together to form a thermoelectric separation copper substrate. S6. Solder the LED light source chip on the circuit layer of the thermoelectric separation copper substrate to complete the processing of the copper substrate.
[0011] Preferably, in step S3, the diameter of the heat pipe body is greater than the thickness of the copper substrate body, and the diameter of the heat pipe body is smaller than the minimum width in the fitting groove.
[0012] Preferably, in step S4, the heat pipe body and the gap portion of the fitting groove are fixed together by welding.
[0013] Beneficial effects of the present invention: The present invention combines the copper substrate body, the interlocking groove, the front limit boss, the rear limit boss, the heat pipe body, the upper molded boss, the lower molded boss, the top boss, the bottom boss, the AD film layer, the circuit layer and the LED light source patch. After experimental optimization, the setting of the front limit boss and the rear limit boss is to ensure that the upper molded boss and the lower molded boss on the heat pipe body can form more precise external dimensions during molding. The manufactured copper substrate has an ultra-high thermal conductivity coefficient, and its equivalent thermal conductivity coefficient is more than 250 times that of the traditional thermoelectric separation copper substrate. It can circumvent the photolithography and etching process of the copper plate, improve efficiency, save costs, and is more environmentally friendly. It circumvents the existing manual operation process of heat pipe welding, has the advantages of high efficiency, good consistency and stable quality, and the copper substrate has high thermal conductivity efficiency.
[0014] The features and advantages of the present invention will be described in detail through embodiments with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 This is a schematic structural diagram of a copper substrate body and a heat pipe body of a copper substrate embedded with a heat pipe for an LED automobile lamp according to the present invention; Figure 2 This is a multi-angle schematic diagram of the interlocking structure of the copper substrate body and the heat pipe body of a copper substrate embedded with a heat pipe for an LED automobile lamp of the present invention; Figure 3 This is a schematic diagram of the structure of a double-sided copper substrate with thermal and electrical separation and a copper substrate embedded with heat pipes for LED automobile lamps according to the present invention; Figure 4 This is a process flow chart of a copper substrate embedded with heat pipes for LED automobile lamps according to the present invention.
[0016] In the figure: 11-copper substrate body, 111-embedding groove, 1111-front limiting boss, 1112-rear limiting boss, 12-heat pipe body, 121-upper molded boss, 122-lower molded boss, 123-top boss, 124-bottom boss, 2-AD film layer, 3-circuit layer, 4-LED light source patch. DETAILED DESCRIPTION
[0017] Example 1 See Figure 1 、 Figure 2 、 Figure 3 and Figure 4The present invention provides a copper substrate embedded with a heat pipe for LED automobile lamps, comprising a copper substrate body 11, an embedding groove 111, a front limiting boss 1111, a rear limiting boss 1112, a heat pipe body 12, an upper molded boss 121, a lower molded boss 122, a top boss 123, a bottom boss 124, an AD film layer 2, a circuit layer 3 and an LED light source patch 4. The copper substrate body 11 is provided with an embedding groove 111, and the embedding groove 111 is provided with a The interior of the copper substrate body 11 is symmetrically provided with a front limiting boss 1111 and a rear limiting boss 1112. The heat pipe body 12 is molded and embedded in the fitting groove 111. The upper portion of the heat pipe body 12 is provided with an upper molded boss 121 and a lower molded boss 122 corresponding to the positions of the front limiting boss 1111 and the rear limiting boss 1112. The lower portion of the heat pipe body 12 is provided with a top boss 123 and a bottom boss 124. The outer surface of the copper substrate body 11 is provided with a heat pipe body 12. An AD film layer 2 is provided on the side, and a circuit layer 3 is provided on the outside of the AD film layer 2. The copper substrate body 11, AD film layer 2 and circuit layer 3 are pressed together in sequence, and an LED light source patch 4 is welded on the outside of the circuit layer 3. The front limiting boss 1111 and the rear limiting boss 1112 have the same shape and size. The front limiting boss 1111 is a rectangular boss. The front limiting boss 1111 and the rear limiting boss 1112 are respectively molded together with the heat pipe body 12 by interference fit. The upper molded boss 121 is protruding above the top outer side surface of the copper substrate body 11, and the lower molded boss 122 is protruding below the bottom outer side surface of the copper substrate body 11. A number of heat sink pads are provided at the bottom of the LED light source patch 4, and the upper molded boss 121 and the lower molded boss 122 correspond to the positions of the heat sink pads of the LED light source patch 4 on the corresponding side respectively.
[0018] The present invention proposes a production process for a copper substrate embedded with heat pipes for LED automotive lamps, comprising the following steps: S1, forming the copper substrate: select a copper plate and use a stamping machine to stamp out a copper substrate body 11 having an interlocking groove 111 and a front limiting boss 1111 and a rear limiting boss 1112 in the middle; S2, trimming the copper substrate body 11, grinding and polishing the burrs and fins on the edge of the copper substrate body 11 and the inside of the fitting groove 111, and then sending the copper substrate body 11 to a leveling device for surface smoothing; S3. Molding the heat pipe and the copper substrate together. Select a cylindrical heat pipe body 12, adjust the positions of the heat pipe body 12 and the fitting groove 111 of the copper substrate body 11 to correspond with each other, and then limit and fix them. Use a molding device to fit the heat pipe into the fitting groove 111. S4. Simultaneously mold the flat surface and the boss. Replace the molding die of the molding equipment to flatten the surfaces of the heat pipe body 12 and the copper base plate body 11. The molding die simultaneously molds the upper molded boss 121 and the top boss 123 on the top of the heat pipe body 12. The molding die simultaneously molds the lower molded boss 122 and the bottom boss 124 on the bottom of the heat pipe body 12. The heat pipe body 12 and the gap between the fitting groove 111 are welded together to form a semi-finished copper base plate. S5. Hot pressing and bonding: through-windows are respectively opened on the AD film layer 2 and the circuit layer 3 at positions corresponding to the upper molded boss 121, the lower molded boss 122, the top boss 123, and the bottom boss 124. The AD film layer 2 and the circuit layer 3 are sequentially attached to the outer side of the semi-finished copper substrate, and the semi-finished copper substrate is fed into a hot pressing device for hot pressing and bonding to form a thermoelectric separation copper substrate. S6, welding the LED light source patch 4, welding the LED light source patch 4 on the circuit layer 3 of the thermoelectric separation copper substrate, and completing the processing of the copper substrate.
[0019] Example 2 See Figure 1 、 Figure 2 、 Figure 3 and Figure 4 The present invention provides a copper substrate embedded with a heat pipe for an LED automobile lamp, comprising a copper substrate body 11, an embedding groove 111, a front limiting boss 1111, a rear limiting boss 1112, a heat pipe body 12, an upper molded boss 121, a lower molded boss 122, a top boss 123, a bottom boss 124, an AD film layer 2, a circuit layer 3 and an LED light source patch 4. The copper substrate body 11 is provided with an embedding groove 111, and the front limiting boss 1111 and the rear limiting boss 1112 are symmetrically arranged inside the embedding groove 111. The heat pipe body 12 is molded and embedded in the embedding groove 111, and the upper part of the heat pipe body 12 is provided with an upper molded boss 121 and a lower molded boss 122 at the positions corresponding to the front limiting boss 1111 and the rear limiting boss 1112. A top boss 123 and a bottom boss 124 are provided at the lower part, an AD film layer 2 is provided on the outer side of the copper substrate body 11, a circuit layer 3 is provided on the outer side of the AD film layer 2, the copper substrate body 11, the AD film layer 2 and the circuit layer 3 are pressed together in sequence, and an LED light source patch 4 is welded on the outer side of the circuit layer 3, the upper molded boss 121 is protruded above the top outer side surface of the copper substrate body 11, the lower molded boss 122 is protruded below the bottom outer side surface of the copper substrate body 11, the top boss 123 is protruded above the top outer side surface of the copper substrate body 11, the bottom boss 124 is protruded below the bottom outer side surface of the copper substrate body 11, and heat sinks are respectively fitted on the outer sides of the top boss 123 and the bottom boss 124.
[0020] The present invention proposes a production process for a copper substrate embedded with heat pipes for LED automotive lamps, comprising the following steps: S1, forming the copper substrate: select a copper plate and use a stamping machine to stamp out a copper substrate body 11 having an interlocking groove 111 and a front limiting boss 1111 and a rear limiting boss 1112 in the middle; S2, trimming the copper substrate body 11, grinding and polishing the burrs and fins on the edge of the copper substrate body 11 and the inside of the fitting groove 111, and then sending the copper substrate body 11 to a leveling device for surface smoothing; S3. Molding the heat pipe and the copper substrate together. Select a cylindrical heat pipe body 12. The diameter of the heat pipe body 12 is greater than the thickness of the copper substrate body 11, and the diameter of the heat pipe body 12 is smaller than the minimum width of the embedding groove 111. Adjust the positions of the heat pipe body 12 and the embedding groove 111 of the copper substrate body 11 to correspond with each other, and then limit and fix them. Use a molding device to embed the heat pipe into the embedding groove 111. S4. Simultaneously mold the flat surface and the boss. Replace the molding die of the molding equipment to flatten the surfaces of the heat pipe body 12 and the copper substrate body 11. The molding die simultaneously molds the upper molded boss 121 and the top boss 123 on the top of the heat pipe body 12. The molding die simultaneously molds the lower molded boss 122 and the bottom boss 124 on the bottom of the heat pipe body 12 to form a semi-finished copper substrate. S5. Hot pressing and bonding: through-windows are respectively opened on the AD film layer 2 and the circuit layer 3 at positions corresponding to the upper molded boss 121, the lower molded boss 122, the top boss 123, and the bottom boss 124. The AD film layer 2 and the circuit layer 3 are sequentially attached to the outer side of the semi-finished copper substrate, and the semi-finished copper substrate is fed into a hot pressing device for hot pressing and bonding to form a thermoelectric separation copper substrate. S6, welding the LED light source patch 4, welding the LED light source patch 4 on the circuit layer 3 of the thermoelectric separation copper substrate, and completing the processing of the copper substrate.
[0021] Example 3 See Figure 1 、 Figure 2 、 Figure 3 and Figure 4The present invention provides a copper substrate embedded with a heat pipe for LED automobile lamps, comprising a copper substrate body 11, an embedding groove 111, a front limiting boss 1111, a rear limiting boss 1112, a heat pipe body 12, an upper molded boss 121, a lower molded boss 122, a top boss 123, a bottom boss 124, an AD film layer 2, a circuit layer 3 and an LED light source patch 4. The copper substrate body 11 is provided with an embedding groove 111, and the embedding groove 111 is provided with a front limiting boss 1111, a rear limiting boss 1112, a heat pipe body 12, an upper molded boss 121, a lower molded boss 122, a top boss 123, a bottom boss 124, an AD film layer 2, a circuit layer 3 and an LED light source patch 4. 1 is symmetrically provided with a front limiting boss 1111 and a rear limiting boss 1112. A heat pipe body 12 is molded and embedded in the fitting groove 111. An upper molded boss 121 and a lower molded boss 122 are provided at the upper portion of the heat pipe body 12 corresponding to the positions of the front limiting boss 1111 and the rear limiting boss 1112. A top boss 123 and a bottom boss 124 are provided at the lower portion of the heat pipe body 12. The outer side of the copper substrate body 11 is provided with a heat pipe body 12. An AD film layer 2 is provided, and a circuit layer 3 is provided on the outside of the AD film layer 2. The copper substrate body 11, the AD film layer 2 and the circuit layer 3 are pressed together in sequence, and an LED light source patch 4 is welded on the outside of the circuit layer 3. A number of heat sink pads are provided on the bottom of the LED light source patch 4. The upper molded boss 121 and the lower molded boss 122 respectively correspond to the positions of the heat sink pads of the LED light source patch 4 on the corresponding side. The top boss 123 is protruded above the top outer side surface of the copper substrate body 11, and the bottom boss 124 is protruded below the bottom outer side surface of the copper substrate body 11. Radiators are respectively fitted on the outside of the top boss 123 and the bottom boss 124. The shape of the heat pipe body 12 before molding and fitting is cylindrical, and the diameter of the heat pipe body 12 is smaller than the minimum spacing between the front limit boss 1111 and the rear limit boss 1112.
[0022] The present invention proposes a production process for a copper substrate embedded with heat pipes for LED automotive lamps, comprising the following steps: S1, forming the copper substrate: select a copper plate and use a stamping machine to stamp out a copper substrate body 11 having an interlocking groove 111 and a front limiting boss 1111 and a rear limiting boss 1112 in the middle; S2, trimming the copper substrate body 11, grinding and polishing the burrs and fins on the edge of the copper substrate body 11 and the inside of the fitting groove 111, and then sending the copper substrate body 11 to a leveling device for surface smoothing; S3. Molding the heat pipe and the copper substrate together. Select a cylindrical heat pipe body 12. The diameter of the heat pipe body 12 is greater than the thickness of the copper substrate body 11, and the diameter of the heat pipe body 12 is smaller than the minimum width of the embedding groove 111. Adjust the positions of the heat pipe body 12 and the embedding groove 111 of the copper substrate body 11 to correspond with each other, and then limit and fix them. Use a molding device to embed the heat pipe into the embedding groove 111. S4. Simultaneously mold the flat surface and the boss. Replace the molding die of the molding equipment to flatten the surfaces of the heat pipe body 12 and the copper base plate body 11. The molding die simultaneously molds the upper molded boss 121 and the top boss 123 on the top of the heat pipe body 12. The molding die simultaneously molds the lower molded boss 122 and the bottom boss 124 on the bottom of the heat pipe body 12. The heat pipe body 12 and the gap between the fitting groove 111 are welded together to form a semi-finished copper base plate. S5. Hot pressing and bonding: through-windows are respectively opened on the AD film layer 2 and the circuit layer 3 at positions corresponding to the upper molded boss 121, the lower molded boss 122, the top boss 123, and the bottom boss 124. The AD film layer 2 and the circuit layer 3 are sequentially attached to the outer side of the semi-finished copper substrate, and the semi-finished copper substrate is fed into a hot pressing device for hot pressing and bonding to form a thermoelectric separation copper substrate. S6, welding the LED light source patch 4, welding the LED light source patch 4 on the circuit layer 3 of the thermoelectric separation copper substrate, and completing the processing of the copper substrate.
[0023] The present invention combines a copper substrate body 11, an engaging groove 111, a front limiting boss 1111, a rear limiting boss 1112, a heat pipe body 12, an upper molded boss 121, a lower molded boss 122, a top boss 123, a bottom boss 124, an AD film layer 2, a circuit layer 3 and an LED light source patch 4. After experimental optimization, the front limiting boss 1111 and the rear limiting boss 1112 are arranged to ensure that the upper molded boss 121 and the lower molded boss 122 on the heat pipe body 12 can form more precise external dimensions during molding. The manufactured copper substrate has an ultra-high thermal conductivity coefficient, and its equivalent thermal conductivity coefficient is more than 250 times that of the traditional thermoelectric separation copper substrate. It can avoid the photolithography and etching process of the copper plate, improve efficiency, save costs, and is more environmentally friendly. It avoids the manual operation process of the existing heat pipe welding, has the advantages of high efficiency, good consistency and stable quality, and the copper substrate has high thermal conductivity efficiency.
[0024] The above embodiments are intended to illustrate the present invention, not to limit the present invention. Any solution that is a simple transformation of the present invention falls within the protection scope of the present invention.
Claims
1. A copper substrate embedded with heat pipes for LED automotive lamps, characterized by: The invention comprises a copper substrate body (11), an engaging groove (111), a front limiting boss (1111), a rear limiting boss (1112), a heat pipe body (12), an upper molded boss (121), a lower molded boss (122), a top boss (123), a bottom boss (124), an AD film layer (2), a circuit layer (3) and an LED light source patch (4), wherein the copper substrate body (11) is provided with an engaging groove (111) running through the copper substrate body (11), the front limiting boss (1111) and the rear limiting boss (1112) are symmetrically provided inside the engaging groove (111), the heat pipe body (12) is molded and embedded in the engaging groove (111), and the heat pipe body (12) is molded and embedded in the engaging groove (111). 2), an upper molded boss (121) and a lower molded boss (122) are provided at positions corresponding to the front limit boss (1111) and the rear limit boss (1112) on the upper part of the heat pipe body (12), a top boss (123) and a bottom boss (124) are provided on the lower part of the heat pipe body (12), an AD film layer (2) is provided on the outer side of the copper substrate body (11), a circuit layer (3) is provided on the outer side of the AD film layer (2), the copper substrate body (11), the AD film layer (2) and the circuit layer (3) are pressed together in sequence, and an LED light source patch (4) is welded on the outer side of the circuit layer (3).
2. The copper substrate embedded with heat pipes for LED automotive lamps according to claim 1, characterized in that: The front limiting boss (1111) and the rear limiting boss (1112) have the same shape and size; the front limiting boss (1111) is a rectangular boss; the front limiting boss (1111) and the rear limiting boss (1112) are respectively interference-fitted and molded together with the heat pipe body (12).
3. The copper substrate embedded with heat pipes for LED automotive lamps according to claim 1, characterized in that: The upper die-stamping boss (121) is protrudingly arranged above the top outer side surface of the copper base plate body (11), and the lower die-stamping boss (122) is protrudingly arranged below the bottom outer side surface of the copper base plate body (11).
4. The copper substrate embedded with heat pipes for LED automotive lamps according to claim 1, characterized in that: A plurality of heat sink pads are provided at the bottom of the LED light source patch (4), and the upper molded boss (121) and the lower molded boss (122) correspond to the positions of the heat sink pads of the corresponding side LED light source patch (4) respectively.
5. The copper substrate embedded with heat pipes for LED automotive lamps according to claim 1, characterized in that: The top boss (123) is protrudingly arranged above the top outer side surface of the copper base plate body (11), and the bottom boss (124) is protrudingly arranged below the bottom outer side surface of the copper base plate body (11). Heat sinks are respectively fitted on the outer sides of the top boss (123) and the bottom boss (124).
6. The copper substrate embedded with heat pipes for LED automotive lamps according to claim 1, characterized in that: The shape of the heat pipe body (12) before molding and fitting is cylindrical, and the diameter of the heat pipe body (12) is smaller than the minimum distance between the front limiting boss (1111) and the rear limiting boss (1112).
7. A process for producing a copper substrate embedded with heat pipes for LED automotive lamps, comprising the following steps: S1, forming the copper base plate, selecting a copper plate, and using a stamping device to stamp out a copper base plate body (11) having a fitting groove (111) in the middle, a front limiting boss (1111), and a rear limiting boss (1112); S2, trimming the copper substrate body (11), grinding and polishing the burrs and burrs on the edge of the copper substrate body (11) and inside the fitting groove (111), and then sending the copper substrate body (11) into a leveling device for surface leveling; S3, the heat pipe and the copper substrate are molded and embedded, a cylindrical heat pipe body (12) is selected, the embedding grooves (111) of the heat pipe body (12) and the copper substrate body (11) are adjusted to correspond to each other, and then limited and fixed, and the heat pipe is embedded into the embedding groove (111) using a molding device; S4, synchronously molding the plane and the boss, replacing the molding die of the molding equipment, flattening the surfaces of the heat pipe body (12) and the copper base plate body (11), and synchronously molding the upper molding boss (121) and the top boss (123) on the top of the heat pipe body (12) with the molding die, and synchronously molding the lower molding boss (122) and the bottom boss (124) on the bottom of the heat pipe body (12) with the molding die, to manufacture a semi-finished copper base plate; S5, hot pressing and bonding, respectively opening through windows at positions corresponding to the upper molded boss (121), the lower molded boss (122), the top boss (123) and the bottom boss (124) on the AD film layer (2) and the circuit layer (3), sequentially attaching the AD film layer (2) and the circuit layer (3) to the outer side surface of the semi-finished copper substrate, sending them into a hot pressing device for hot pressing and bonding together, and manufacturing a thermoelectric separation copper substrate; S6, welding the LED light source patch (4), welding the LED light source patch (4) on the circuit layer (3) of the thermoelectric separation copper substrate, and completing the processing of the copper substrate.
8. The copper substrate embedded with heat pipes for LED automotive lamps according to claim 7, characterized in that: In step S3, the diameter of the heat pipe body (12) is greater than the thickness of the copper substrate body (11), and the diameter of the heat pipe body (12) is smaller than the minimum width in the fitting groove (111).
9. The copper substrate embedded with heat pipes for LED automotive lamps according to claim 7, characterized in that: In step S4, the heat pipe body (12) and the gap portion of the fitting groove (111) are welded and fixed together.