Manufacturing method of color conversion layer group, light-emitting panel and manufacturing method of light-emitting panel

Abstract

The invention discloses a manufacturing method of a color conversion layer group, a light-emitting panel and a manufacturing method of the light-emitting panel. The light-emitting panel comprises a target substrate, a light-emitting unit and a color conversion layer set, the light-emitting unit is arranged on the target substrate, the color conversion layer set comprises a color conversion unit and a shading unit, the color conversion unit is arranged on the side, away from the target substrate, of the light-emitting unit, and the shading unit comprises mixed adsorption particles and shading materials. The shading unit is connected with the color conversion unit, and the shading unit is arranged around the peripheral side of the color conversion unit. Therefore, the shading unit is arranged around the peripheral side of the color conversion unit and comprises the adsorption particles and the shading material which are mixed, light rays passing through the color conversion unit can be shaded through the shading material of the shading unit, the problem of optical crosstalk is solved, and the color conversion layer group can be adsorbed and transferred through the adsorption particles in the shading material, so that the color conversion effect is improved. And the manufacturing difficulty of the light-emitting panel is simplified.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a method for manufacturing a color conversion layer group, a light-emitting panel and a method for manufacturing the same. Background Art

[0002] With the continuous development of modern display technology, light emitting diodes (LEDs) are widely used in display modules and display devices due to their energy-saving and high efficiency, long life, excellent light quality and environmental protection.

[0003] When light emitting diodes are used to make a light emitting panel, a color conversion unit is usually fabricated on the light emitting unit. However, current light emitting units emit light directly through the color conversion unit, which can easily cause problems such as crosstalk between the converted light and other light. Summary of the Invention

[0004] The main purpose of this application is to provide a method for manufacturing a color conversion layer group, a light-emitting panel and a manufacturing method thereof, aiming to solve the above-mentioned technical problems existing in the prior art.

[0005] To solve the above problems, the present application provides a light-emitting panel, which includes a target substrate, a light-emitting unit and a color conversion layer group. The light-emitting unit is arranged on the target substrate. The color conversion layer group includes a color conversion unit and a shading unit. The color conversion unit is arranged on the side of the light-emitting unit away from the target substrate. The shading unit includes mixed adsorption particles and shading material. The shading unit is connected to the color conversion unit, and the shading unit is arranged around the circumference of the color conversion unit.

[0006] In some embodiments, the number of the light-emitting units and the color conversion layer groups are both multiple, and the multiple light-emitting units are arranged at intervals on the target substrate. The color conversion units of at least two color conversion layer groups are different, and each color conversion layer group is arranged on the side of a light-emitting unit away from the target substrate.

[0007] In some embodiments, the light emitting panel includes an encapsulation layer, which is coated on the target substrate and covers the light emitting units and the color conversion layer group.

[0008] In some embodiments, the color conversion unit is a mixture of transparent colloid and color conversion material.

[0009] To solve the above problems, the present application provides a method for manufacturing a color conversion layer group of a light-emitting panel as described above, wherein the method for manufacturing the color conversion layer group includes: depositing a color conversion layer on a film-forming substrate; dividing the color conversion layer into a plurality of color conversion units; depositing a shading layer between the plurality of color conversion units; and dividing a portion of the shading layer between two adjacent color conversion units to form the color conversion layer group.

[0010] In some embodiments, the step of depositing a color conversion layer on the film-forming substrate includes: depositing a sacrificial layer on the film-forming substrate; and depositing the color conversion layer on the sacrificial layer, wherein the sacrificial layer can undergo thermal decomposition.

[0011] In order to solve the above problems, the present application provides a method for manufacturing a light-emitting panel as described above, and the method for manufacturing a light-emitting panel includes: controlling a transfer device to adsorb the shading unit of the color conversion layer group; controlling the transfer device to drive the color conversion layer group to move to the color conversion unit of the color conversion layer group to adhere to the light-emitting unit; controlling the transfer device to drive the color conversion layer group and the light-emitting unit to move to the target substrate so that the light-emitting unit and the target substrate are electrically connected.

[0012] In some embodiments, the color conversion unit is set on the film-forming substrate through a sacrificial layer. After the step of controlling the transfer device to adsorb the shading unit of the color conversion layer group, the light-emitting panel manufacturing method includes: irradiating the film-forming substrate with a laser on the side away from the sacrificial layer to cause thermal decomposition of the sacrificial layer; when the sacrificial layer is thermally decomposed, controlling the transfer device to drive the color conversion layer group to move so that the color conversion layer group is separated from the film-forming substrate.

[0013] In some embodiments, the method for manufacturing the light-emitting panel includes: controlling the transfer device to adsorb the shading unit of another color conversion layer group; controlling the transfer device to drive the other color conversion layer group to move to the color conversion unit of the other color conversion layer group to adhere to the other light-emitting unit; controlling the transfer device to drive the other color conversion layer group and the other light-emitting unit to move to the target substrate so that the other light-emitting unit and the target substrate are electrically connected.

[0014] In some embodiments, after the step of controlling the transfer device to drive the color conversion layer group and the light-emitting unit to move to the target substrate so that the light-emitting unit and the target substrate are electrically connected, the light-emitting panel manufacturing method includes: coating an encapsulation layer on the target substrate so that the encapsulation layer covers the light-emitting unit and the color conversion layer group.

[0015] Compared to the prior art, the light-emitting panel of the present application includes a target substrate, a light-emitting unit, and a color conversion layer group. The light-emitting unit is disposed on the target substrate. The color conversion layer group includes a color conversion unit and a shading unit. The color conversion unit is disposed on the side of the light-emitting unit facing away from the target substrate. The shading unit includes a mixture of adsorbent particles and a shading material. The shading unit is connected to the color conversion unit and is disposed around the circumference of the color conversion unit. Through the above embodiment, the color conversion unit is disposed on the side of the light-emitting unit facing away from the target substrate. The shading unit is connected to the color conversion unit and is disposed around the circumference of the color conversion unit. The shading unit includes a mixture of adsorbent particles and a shading material. The shading material of the shading unit can block light passing through the color conversion unit, thereby improving the problem of light crosstalk. The adsorbent particles in the shading material can also adsorb and transfer the color conversion layer group, simplifying the manufacturing difficulty of the light-emitting panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 This is a schematic structural diagram of an embodiment of a light-emitting panel provided by the present application;

[0018] Figure 2 This is a schematic flow chart of an embodiment of a method for manufacturing a color conversion layer group provided by the present application;

[0019] Figure 3 is based on Figure 2 Schematic diagram of the manufacturing structure corresponding to the manufacturing method shown;

[0020] Figure 4 This is a flow chart of an embodiment of a method for manufacturing a light-emitting panel provided by the present application;

[0021] Figure 5 yes Figure 4 Schematic diagram of the manufacturing structure of the color conversion layer group adsorbed by the transfer device in the manufacturing method shown;

[0022] Figure 6 yes Figure 4 A schematic diagram of the manufacturing structure of transferring the color conversion layer group to the target substrate by a transfer device in the manufacturing method shown.

[0023] Reference numerals: light-emitting panel 10 ; target substrate 100 ; light-emitting unit 200 ; color conversion layer group 300 ; color conversion unit 310 ; light-shielding unit 320 ; encapsulation layer 400 ; film-forming substrate 11 ; sacrificial layer 12 ; color conversion layer 13 ; light-shielding layer 14 ; transfer device 15 . DETAILED DESCRIPTION

[0024] The following embodiments of the technical solution of the present application will be described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application and are therefore only examples and are not intended to limit the scope of protection of the present application.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned figure descriptions are intended to cover non-exclusive inclusions.

[0026] In the description of the embodiments of this application, the technical terms "first" and "second" are used only to distinguish different objects and should not be understood to indicate or imply relative importance or implicitly specify the quantity, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.

[0027] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0028] In the description of the embodiments of this application, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0029] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0030] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0031] In the description of the embodiments of the present application, unless otherwise expressly specified or limited, technical terms such as "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; internal connections between two components or interactions between two components. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application based on specific circumstances.

[0032] With the continuous development of modern display technology, light emitting diodes (LEDs) are widely used in display modules and display devices due to their energy-saving and high efficiency, long life, excellent light quality and environmental protection.

[0033] When light emitting diodes are used to make a light emitting panel, a color conversion unit is usually fabricated on the light emitting unit. However, current light emitting units emit light directly through the color conversion unit, which can easily cause problems such as crosstalk between the converted light and other light.

[0034] In order to solve the technical problems existing in the related art, this application provides a light-emitting panel, see Figure 1 , Figure 1 This is a schematic structural diagram of an embodiment of a light-emitting panel provided in this application.

[0035] The light-emitting panel 10 includes a target substrate 100, a light-emitting unit 200 and a color conversion layer group 300. The light-emitting unit 200 is arranged on the target substrate 100. The color conversion layer group 300 includes a color conversion unit 310 and a shading unit 320. The color conversion unit 310 is arranged on the side of the light-emitting unit 200 away from the target substrate 100. The shading unit 320 includes mixed adsorption particles and shading material. The shading unit 320 is connected to the color conversion unit 310 and is arranged around the circumference of the color conversion unit 310.

[0036] The target substrate 100 may be a driving substrate for the light-emitting panel 10. The target substrate 100 may include driving electrodes that may be electrically connected to the light-emitting units 200, so that the target substrate 100 can drive the light-emitting units 200 to emit light via the driving electrodes. The light-emitting units 200 may be light-emitting chips, such as light-emitting diodes, which can emit light under the influence of the target substrate 100. The color conversion unit 310 is disposed on the side of the light-emitting units 200 facing away from the target substrate 100, so that the light emitted by the light-emitting units 200 can be received through the color conversion unit 310. The color conversion unit 310 may be formed of a color-converting material, such as quantum dot material or color group material. Specifically, the color conversion unit 310 can convert the light emitted by the light-emitting units 200 into light of other colors, such as red, green, or blue light. When the color conversion layer assembly 300 is required to emit blue light, and the light emitted by the light-emitting unit 200 is blue light, the color conversion unit 310 can be made of a transparent material and does not need to convert the color of the light emitted by the light-emitting unit 200. The light-shielding unit 320 can be annular and arranged around the color conversion unit 310 in the stacking direction of the light-emitting unit 200 and the color conversion unit 310. The light-shielding unit 320 can be used to block light emitted from the sides of the color conversion unit 310, thereby ensuring that all light emitted by the color conversion unit 310 is emitted along the stacking direction. The light-shielding unit 320 can be composed of a mixture of black resin and adsorbent particles, with the adsorbent particles comprising between 10% and 30% of the light-shielding unit 320. The black resin primarily serves a light-shielding function, and the adsorbent particles can include, but are not limited to, charged particles and / or magnetic particles. For example, the charged particles can include black charged particles. The adsorbent particles can be used to allow the color conversion layer assembly 300 to be adsorbed by other equipment, thereby transferring the color conversion layer assembly 300, thereby reducing the manufacturing difficulty of the light-emitting panel 10.

[0037] Through the above embodiment, the color conversion unit 310 is arranged on the side of the light-emitting unit 200 away from the target substrate 100, and the shading unit 320 is connected to the color conversion unit 310. The shading unit 320 is arranged around the circumference of the color conversion unit 310, and the shading unit 320 includes mixed adsorption particles and shading materials. The shading material of the shading unit 320 can block the light passing through the color conversion unit 310, thereby improving the problem of light crosstalk, and can adsorb and transfer the color conversion layer group 300 through the adsorption particles in the shading material, thereby simplifying the manufacturing difficulty of the light-emitting panel 10.

[0038] Furthermore, there are multiple light-emitting units 200 and multiple color conversion layer groups 300. The multiple light-emitting units 200 are spaced apart on the target substrate 100. The color conversion units 310 of at least two color conversion layer groups 300 are different, and each color conversion layer group 300 is disposed on the side of a light-emitting unit 200 facing away from the target substrate 100. The target substrate 100 may be provided with a large number of driving electrodes. Each light-emitting unit 200 and each color conversion layer group may have a one-to-one correspondence, that is, one light-emitting unit 200 and one color conversion layer group 300 may be considered a light-emitting module. The multiple light-emitting modules are spaced apart on the target substrate 100, so that the target substrate 100 can synchronously drive the multiple light-emitting modules to emit light. The different color conversion units 310 of at least two color conversion layer groups 300 can cause the light emitted by the at least two light-emitting modules to have different colors. For example, three adjacent light-emitting modules may emit red, green, and blue light, respectively. Since the circumference of each color conversion layer group 300 is provided with a light-shielding material, the crosstalk between the lights emitted by different light-emitting modules can be improved.

[0039] In some embodiments, the color conversion unit 310 comprises a mixture of a transparent colloid and a color conversion material. The transparent colloid may comprise between 10% and 30% of the color conversion unit 310. The transparent colloid can improve the adhesion of the color conversion unit 310 to the light-emitting unit 200 and the light-shielding unit 320, facilitating transfer of the light-emitting unit 200 and the color conversion layer assembly 300 as a single light-emitting module.

[0040] In some embodiments, the light-emitting panel 10 includes an encapsulation layer 400, which is applied to the target substrate 100 and covers the light-emitting units 200 and the color conversion layer group 300. The encapsulation layer 400 can be made of a resin material and can cover both the light-emitting units 200 and the color conversion layer group 300, thereby providing encapsulation and protection for the light-emitting units 200 and the color conversion layer group 300. In some embodiments, the encapsulation layer 400 can also be made of a black resin material to prevent light crosstalk between the light-emitting units 200 and reduce reflection of ambient light.

[0041] In order to solve the technical problems existing in the related art, the present application also provides a method for manufacturing a color conversion layer group 300, see Figure 2 and Figure 3 , Figure 2 This is a flow chart of an embodiment of a method for manufacturing the color conversion layer group 300 provided in this application. Figure 3 is based on Figure 2 Schematic diagram of the production structure corresponding to the production method shown.

[0042] Step S201 : depositing a color conversion layer 13 on the film-forming substrate 11 .

[0043] The film-forming substrate 11 may include but is not limited to a glass substrate or a transparent resin substrate. The film-forming substrate 11 allows light to pass through. A color conversion layer material may be deposited on the entire surface of the film-forming substrate 11 based on a semiconductor process technology to form a color conversion layer 13 on the film-forming substrate 11.

[0044] Step S202 : dividing the color conversion layer 13 into a plurality of color conversion units 310 .

[0045] The color conversion layer 13 can be divided into a plurality of color conversion units 310 through processes such as exposure and development. The sizes of the divided color conversion units 310 can be set according to actual conditions. For example, the size of each color conversion unit 310 can be set based on the size of the predetermined matching light-emitting unit 200, and then a plurality of color conversion units 310 can be divided in the color conversion layer 13 according to the set size of each color conversion unit 310.

[0046] Step S203 : depositing a light shielding layer 14 between the color conversion units 310 .

[0047] The color conversion units 310 are spaced apart, and a light-shielding layer 14 can be deposited between the color conversion units 310. The light-shielding layer 14 can include a mixture of black resin and adsorbent particles. The adsorbent particles can comprise between 10% and 30% of the light-shielding layer 14. The black resin primarily serves to block light, and the adsorbent particles can include, but are not limited to, charged particles and / or magnetic particles. For example, the charged particles can include black charged particles. The adsorbent particles can be used to allow the color conversion layer group 300 to be adsorbed by other equipment, thereby transferring the color conversion layer group 300, thereby reducing the manufacturing difficulty of the light-emitting panel 10.

[0048] Step S204 : dividing a portion of the light shielding layer 14 between two adjacent color conversion units 310 to form a color conversion layer group 300 .

[0049] The light-shielding layer 14 between each two color conversion units 310 can be partially segmented through exposure and development processes, thereby forming a light-shielding unit 320 on the periphery of each color conversion unit 310. The size of the light-shielding unit 320 can be customized based on actual needs. The color conversion units 310 are composed of a mixture of transparent colloid and color conversion material. The transparent colloid can comprise between 10% and 30% of the color conversion units 310. The transparent colloid can be used to improve the adhesion of the color conversion units 310 to the light-shielding units 320, facilitating the transfer of the color conversion units 310 and light-shielding units 320 as a whole.

[0050] Through the above-mentioned embodiment, part of the shading layer 14 between two adjacent color conversion units 310 is divided to form a color conversion layer group 300, which facilitates the shading unit 320 and the color conversion unit 310 to be regarded as an integral structure of a color conversion layer group 300. The shading material of the shading unit 320 can block the light passing through the color conversion unit 310, thereby improving the problem of light crosstalk. In addition, the color conversion layer group 300 can be adsorbed and transferred by the adsorption particles in the shading material, thereby simplifying the manufacturing difficulty of the light-emitting panel 10.

[0051] Furthermore, the step of depositing the color conversion layer 13 on the film-forming substrate 11 includes: depositing a sacrificial layer 12 on the film-forming substrate 11; and depositing the color conversion layer 13 on the sacrificial layer 12, wherein the sacrificial layer 12 is capable of thermal decomposition. The sacrificial layer 12 is made of a material such as gallium nitride that is thermally decomposed under laser irradiation. The thermal decomposition of the sacrificial layer 12 allows the color conversion unit 310 to be separated from the film-forming substrate 11.

[0052] In order to solve the technical problems existing in the related art, the present application also provides a method for manufacturing a light emitting panel 10, see Figure 4 、 Figure 5 and Figure 6 , Figure 4 This is a flow chart of an embodiment of a method for manufacturing the light-emitting panel 10 provided in this application. Figure 5 yes Figure 4 The manufacturing method shown is a schematic diagram of the manufacturing structure of the color conversion layer group 300 adsorbed by the transfer device 15. Figure 6 yes Figure 4 The manufacturing method shown is a schematic diagram of the manufacturing structure of transferring the color conversion layer group 300 to the target substrate 100 by the transfer device 15.

[0053] Step S401 : controlling the transfer device 15 to absorb the light shielding unit 320 of the color conversion layer set 300 .

[0054] The transfer device 15 can adsorb the shading unit 320 of the color conversion layer group 300. The adsorption characteristics of the transfer device 15 can be determined according to the characteristics of the adsorption particles doped in the shading unit 320. For example, when the shading unit 320 is doped with charged particles, the transfer device 15 can adsorb the shading unit 320 in an energized state, or when the shading unit 320 is doped with magnetic particles, the transfer device 15 can have a magnetic attraction function and can magnetically attract the shading unit 320. Specifically, the transfer device 15 can move in a three-dimensional space to contact and adsorb the shading unit 320 of the color conversion layer group 300. For example, when the shading unit 320 is doped with charged particles, the transfer device 15 can move toward the shading unit 320 in an uncharged state. When the transfer device 15 moves and contacts the shading unit 320, the control device is energized to adsorb the shading unit 320.

[0055] Step S402 : controlling the transfer device 15 to move the color conversion layer set 300 to the color conversion unit 310 of the color conversion layer set 300 to adhere to the light emitting unit 200 .

[0056] The light-emitting unit 200 is initially located on the temporary substrate and is moved while the transfer device 15 adsorbs the color conversion layer group 300, driving the color conversion layer group 300 to move to a position where the color conversion unit 310 and the chip unit of the temporary substrate are bonded until the color conversion unit 310 and the light-emitting unit 200 are bonded, so that the color conversion layer group 300 and the light-emitting unit 200 can be driven to move simultaneously by the transfer device 15.

[0057] Step S403 : controlling the transfer device 15 to move the color conversion layer set 300 and the light emitting unit 200 to the target substrate 100 so that the light emitting unit 200 and the target substrate 100 are electrically connected.

[0058] After the transfer device 15 drives the color conversion layer group 300 to move to the color conversion unit 310 of the color conversion layer group 300 to adhere the light-emitting unit 200, the transfer device 15 can continue to maintain the state of adsorbing the shading unit 320, and then simultaneously drive the color conversion layer group 300 and the adhered light-emitting unit 200 to move above the target substrate 100, and make the electrode of the light-emitting unit 200 correspond to the electrode of the target substrate 100, and then disconnect the adsorption state of the transfer device 15 and the shading unit 320, so that the color conversion layer group 300 and the light-emitting unit 200 are separated from the transfer device 15 under the action of their own gravity, and fall so that the electrode of the light-emitting unit 200 is connected to the driving electrode.

[0059] Through the above-mentioned embodiment, the color conversion unit 310 can be transferred to the side of the light-emitting unit 200 away from the target substrate 100, and the shading unit 320 is connected to the color conversion unit 310. The shading unit 320 is arranged around the circumference of the color conversion unit 310, and the shading unit 320 includes mixed adsorption particles and shading materials. The shading material of the shading unit 320 can block the light passing through the color conversion unit 310, thereby improving the problem of light crosstalk, and the adsorption particles in the shading material can adsorb and transfer the color conversion layer group 300, thereby simplifying the manufacturing difficulty of the light-emitting panel 10.

[0060] Furthermore, after the color conversion unit 310 is disposed on the film-forming substrate 11 via the sacrificial layer 12 and the transfer device 15 is controlled to absorb the light-shielding unit 320 of the color conversion layer assembly 300, the method for manufacturing the light-emitting panel 10 includes: irradiating the side of the film-forming substrate 11 facing away from the sacrificial layer 12 with a laser to thermally decompose the sacrificial layer 12; while the sacrificial layer 12 is thermally decomposed, controlling the transfer device 15 to move the color conversion layer assembly 300 to separate the color conversion layer assembly 300 from the film-forming substrate 11. In this embodiment, the sacrificial layer 12 is deposited on the film-forming substrate 11, and the color conversion unit 310 is deposited on the sacrificial layer 12. The sacrificial layer 12 is made of a material such as gallium nitride that can thermally decompose under laser irradiation. In this embodiment, after the transfer device 15 absorbs the light-shielding unit 320 of the color conversion layer assembly 300, laser irradiation may be performed on the side of the film-forming substrate 11 facing away from the color conversion layer assembly 300, thereby thermally decomposing the sacrificial layer 12 at the location corresponding to the color conversion layer assembly 300 absorbed by the transfer device 15. When the sacrificial layer 12 is thermally decomposed, the color conversion layer assembly 300 is separated from the film-forming substrate 11 , and the transfer device 15 can absorb the color conversion layer assembly 300 to move the color conversion layer assembly 300 .

[0061] In some embodiments, the method for manufacturing the light-emitting panel 10 includes: controlling the transfer device 15 to adsorb the shading unit 320 of another color conversion layer group 300; controlling the transfer device 15 to drive the other color conversion layer group 300 to move to the color conversion unit 310 of the other color conversion layer group 300 to adhere to the other light-emitting unit 200; controlling the transfer device 15 to drive the other color conversion layer group 300 and the other light-emitting unit 200 to move to the target substrate 100 so that the other light-emitting unit 200 and the target substrate 100 are electrically connected. In some embodiments, the number of transfer devices 15 can be multiple, and the multiple transfer devices 15 can move sequentially or in parallel. For example, the number of transfer devices 15 can be two, namely a first transfer device 15 and a second transfer device 15. The first transfer device 15 adsorbs the shading unit 320 of the first color conversion layer group 300, and drives the first color conversion layer group 300 to move to the color conversion unit 310 of the first color conversion layer group 300 to adhere to the first light-emitting unit 200. Then the first transfer device 15 drives the first color conversion layer group 300 and the first light-emitting unit 200 to move to the target substrate 100 to electrically connect the first light-emitting unit 200 and the target substrate 100. At the same time, the second transfer device 15 absorbs the shading unit 320 of the second color conversion layer group 300 and drives the second color conversion layer group 300 to move to the color conversion unit 310 of the second color conversion layer group 300 to adhere to the second light-emitting unit 200. Then, the second transfer device 15 drives the second color conversion layer group 300 and the second light-emitting unit 200 to move to the target substrate 100 to electrically connect the second light-emitting unit 200 and the target substrate 100. The color conversion unit 310 of the first color conversion layer group 300 and the color conversion unit 310 of the second color conversion layer group 300 can be the same or different. In other embodiments, the number of transfer devices 15 can be one. After the transfer device 15 electrically connects one color conversion layer group 300 and the light-emitting unit 200 to the target substrate 100, the transfer device 15 returns to the initial position and transfers the target to another color conversion layer group 300 to move the other color conversion layer group 300 and the other light-emitting unit 200 to be electrically connected to the target substrate 100, wherein the color conversion unit 310 of the previous color conversion layer group 300 and the color conversion unit 310 of the subsequent color conversion layer group 300 can be the same or different.

[0062] In some embodiments, after controlling the transfer device 15 to move the color conversion layer assembly 300 and the light-emitting units 200 to the target substrate 100 to electrically connect the light-emitting units 200 and the target substrate 100, the method for manufacturing the light-emitting panel 10 includes applying an encapsulation layer 400 on the target substrate 100 so that the encapsulation layer 400 covers the light-emitting units 200 and the color conversion layer assembly 300. After the target substrate 100 and the color conversion layer assembly 300 are electrically connected, the encapsulation layer 400 can be applied to the target substrate 100 so that the encapsulation layer 400 covers the light-emitting units 200 and the color conversion layer assembly 300. The encapsulation layer 400 can be made of a resin material and can cover both the light-emitting units 200 and the color conversion layer assembly 300, thereby providing encapsulation and protection for the light-emitting units 200 and the color conversion layer assembly 300. In some embodiments, the encapsulation layer 400 can also be made of a black resin material to prevent light crosstalk between the light-emitting units 200 and reduce reflection of ambient light.

[0063] In summary, the color conversion unit 310 is arranged on the side of the light-emitting unit 200 away from the target substrate 100, and the shading unit 320 is connected to the color conversion unit 310. The shading unit 320 is arranged around the circumference of the color conversion unit 310, and the shading unit 320 includes mixed adsorption particles and shading materials. The shading material of the shading unit 320 can block the light passing through the color conversion unit 310, thereby improving the problem of light crosstalk, and can adsorb and transfer the color conversion layer group 300 through the adsorption particles in the shading material, thereby simplifying the manufacturing difficulty of the light-emitting panel 10.

[0064] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A light-emitting panel, characterized in that: The light emitting panel comprises: target substrate; a light emitting unit, disposed on the target substrate; The color conversion layer group includes a color conversion unit and a shading unit. The color conversion unit is arranged on the side of the light-emitting unit away from the target substrate. The shading unit includes mixed adsorption particles and shading material. The shading unit is connected to the color conversion unit and is arranged around the circumference of the color conversion unit.

2. The light emitting panel according to claim 1, wherein: There are multiple light-emitting units and multiple color conversion layer groups, and the multiple light-emitting units are arranged on the target substrate at intervals. The color conversion units of at least two color conversion layer groups are different, and each color conversion layer group is arranged on the side of a light-emitting unit away from the target substrate.

3. The light emitting panel according to claim 1, wherein: The light emitting panel includes an encapsulation layer, which is coated on the target substrate and covers the light emitting units and the color conversion layer group.

4. The light emitting panel according to any one of claims 1 to 3, characterized in that: The color conversion unit is a mixture of transparent colloid and color conversion material.

5. A method for manufacturing a color conversion layer group of a light-emitting panel according to any one of claims 1 to 4, characterized in that: The method for manufacturing the color conversion layer group includes: depositing a color conversion layer on a film-forming substrate; dividing the color conversion layer into a plurality of color conversion units; depositing a light shielding layer between the plurality of color conversion units; A portion of the light shielding layer between two adjacent color conversion units is divided to form the color conversion layer group.

6. The method for manufacturing a color conversion layer group according to claim 5, characterized in that: The step of depositing a color conversion layer on a film-forming substrate comprises: depositing a sacrificial layer on the film-forming substrate; The color conversion layer is deposited on the sacrificial layer, wherein the sacrificial layer is capable of thermal decomposition.

7. A method for manufacturing a light-emitting panel according to any one of claims 1 to 4, characterized in that: The manufacturing method of the light-emitting panel includes: Controlling the transfer device to absorb the light-shielding unit of the color conversion layer group; Controlling the transfer device to drive the color conversion layer group to move to the color conversion unit of the color conversion layer group to adhere to the light-emitting unit; The transfer device is controlled to drive the color conversion layer group and the light-emitting unit to move to the target substrate so that the light-emitting unit and the target substrate are electrically connected.

8. The method for manufacturing a light emitting panel according to claim 7, wherein: After the color conversion unit is disposed on the film-forming substrate via a sacrificial layer, and the control transfer device adsorbs the light-shielding unit of the color conversion layer group, the light-emitting panel manufacturing method includes: irradiating the film-forming substrate with a laser on a side facing away from the sacrificial layer to thermally decompose the sacrificial layer; When the sacrificial layer is thermally decomposed, the transfer device is controlled to drive the color conversion layer group to move, so as to separate the color conversion layer group from the film-forming substrate.

9. The method for manufacturing a light-emitting panel according to claim 7, wherein: The light-emitting panel manufacturing method includes: Controlling the transfer device to absorb the light-shielding unit of another color conversion layer group; Controlling the transfer device to drive the other color conversion layer group to move to the color conversion unit of the other color conversion layer group to adhere to the other light-emitting unit; The transfer device is controlled to drive the other color conversion layer group and the other light-emitting unit to move to the target substrate so that the other light-emitting unit and the target substrate are electrically connected.

10. The method for manufacturing a light emitting panel according to any one of claims 7 to 9, characterized in that: After the step of controlling the transfer device to drive the color conversion layer group and the light-emitting unit to move to the target substrate so that the light-emitting unit and the target substrate are electrically connected, the light-emitting panel manufacturing method includes: An encapsulation layer is coated on the target substrate so that the encapsulation layer covers the light emitting unit and the color conversion layer group.

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