A circumferential welding device and welding method for automatic position changing of a semiconductor heating disc

Abstract

The application discloses a kind of circumferential welding device and welding method of semiconductor heating disc automatic transposition, it is related to welding equipment field.In the present application, a plurality of swing frames are driven to reciprocate staggered swing by swing driving assembly, when swing frame rotates and swings, semiconductor heating disc and connecting reinforcement can be clamped and fixed by the jaw of the clamping driving assembly at both ends, so that swing frame drives semiconductor heating disc and connecting reinforcement to rotate synchronously, and then welding torch is used to circumferentially weld semiconductor heating disc and connecting reinforcement in rotating conveying;By the cooperation of reciprocating swing mechanism and clamping mechanism, the automatic transposition welding of semiconductor heating disc and connecting reinforcement can be realized, the circumferential welding of semiconductor heating disc and connecting reinforcement can be completed at one time, the circumferential welding efficiency of semiconductor heating disc is improved, and the welding torch is located outside the moving track of the clamping mechanism, so that the clamping mechanism does not interfere with the welding torch when rotating and swinging with swing frame, to ensure that the welding process proceeds normally.

Description

Technical Field

[0001] This invention belongs to the field of welding equipment, and more specifically, it relates to a circumferential welding device and welding method for automatic repositioning of semiconductor heating plates. Background Technology

[0002] A semiconductor heating plate is a device that generates a heating effect through the special properties of semiconductor materials. Its core component is a semiconductor material, such as silicon or silicon carbide, which has high thermal and electrical conductivity, effectively converting electrical energy into heat energy. During the manufacturing process of a semiconductor heating plate, connecting reinforcements are welded onto its circumference to ensure a secure connection between its various parts and to improve its overall robustness.

[0003] In the prior art, when performing circumferential welding on a semiconductor heating plate and connecting reinforcement, a clamping mechanism is required to clamp and fix the semiconductor heating plate and connecting reinforcement together along the outer circumference. When the welding torch is welding along the circumferential direction of the semiconductor heating plate and connecting reinforcement, it is impossible to weld at the clamping position. Therefore, after completing one round of welding, the clamping position of the clamping mechanism on the semiconductor heating plate needs to be adjusted before welding can continue on the unwelded positions, which makes the welding process more cumbersome and reduces the welding efficiency of the semiconductor heating plate. Summary of the Invention

[0004] In view of the problems in related technologies, the present invention proposes a circumferential welding device and welding method for automatic repositioning of semiconductor heating plates, so as to overcome the above-mentioned technical problems existing in the existing related technologies.

[0005] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution:

[0006] This invention relates to a circumferential welding device for automatic repositioning of semiconductor heating plates, comprising a welding cabinet and a welding worktable installed inside the welding cabinet. A reciprocating swing mechanism is installed on the top surface of the welding worktable. The reciprocating swing mechanism includes a swing drive assembly and multiple swing frames. The centers of the multiple swing frames are all located on the same axis. The swing drive assembly can drive the multiple swing frames to swing back and forth alternately. Each swing frame has a clamping mechanism fixedly installed at both ends.

[0007] The clamping mechanism includes a support plate, a gripper, and a clamping drive assembly. The support plate is fixedly installed above the end of the swing frame. The gripper is installed on the inner end of the support plate through the clamping drive assembly. The clamping drive assembly can drive the gripper to close and clamp when the swing frame rotates and swings, and can drive the gripper to open and release when the swing frame rotates and swings back to reset.

[0008] A welding torch is also fixedly installed on the top surface of the welding workbench, and the welding torch is located outside the movement trajectory of the clamping mechanism.

[0009] Furthermore, the swing drive assembly includes a motor, which is fixedly mounted on the top surface of the welding workbench. A connecting rod is driven to the output end of the motor, and a slider is rotatably mounted on the top surface of one end of the connecting rod.

[0010] Furthermore, the swing drive assembly also includes a bracket, which is fixedly installed on the top surface of the welding workbench and located on one side of the motor. A slide rail is located on one side of the upper end of the bracket, and a slide bar is slidably installed at the bottom end of the slide rail. A rack is fixedly installed at the bottom end of the slide bar, and a guide frame perpendicular to the rack is fixedly installed at the bottom end of the rack. A guide groove is provided on the inner ring of the guide frame, and the slider is slidably engaged in the guide groove.

[0011] Furthermore, a rotating shaft is rotatably mounted on the upper end of the bracket, a gear that meshes with and is connected to a rack and pinion is fixedly mounted on the bottom end of the rotating shaft, and the swing frame is fixedly mounted on the top end of the rotating shaft.

[0012] Furthermore, a driving bevel gear is fixedly installed at the lower end of the rotating shaft, and a rotating sleeve is movably sleeved at the upper end of the rotating shaft. The rotating sleeve is rotatably connected to the bracket. The swing frame is fixedly installed at the top end of the rotating sleeve, and a driven bevel gear is fixedly installed at the bottom end of the rotating sleeve. A transmission bevel gear is also rotatably installed on the bracket, and the transmission bevel gear is meshed and connected between the driving bevel gear and the driven bevel gear.

[0013] Furthermore, the clamping drive assembly includes a cylinder and a clamping positioning seat. The cylinder is fixedly installed on the top surface of the support plate, and the clamping positioning seat is embedded in the inner end of the support plate. Connecting rods are slidably clamped at both the upper and lower ends of the clamping positioning seat. The gripper is fixedly installed at the outer end of the connecting rod, and a guide post is fixedly installed at the inner end of the connecting rod.

[0014] The clamping and positioning seat has a sliding plate inside, and the sliding plate has inclined guide grooves arranged symmetrically on the upper and lower sides. The guide posts are all slidably engaged in the interior of the corresponding inclined guide grooves. The telescopic end of the cylinder extends into the interior of the clamping and positioning seat and is fixedly connected to one end of the sliding plate.

[0015] Furthermore, a circumferentially distributed support rod is fixedly installed at the top of the welding workbench, a support ring seat is fixedly installed at the top of the support rod, a sliding groove is opened on the top surface of the support ring seat, and a support block that is slidably engaged in the sliding groove is fixedly installed on the bottom surface of the outer end of the support plate.

[0016] Furthermore, a limiting groove is provided on the top surface of the inner end of the support plate, and an arc-shaped limiting surface that matches the outer circumferential surface of the semiconductor heating plate is provided on the side wall of the limiting groove.

[0017] Furthermore, multiple support rollers are rotatably mounted at the bottom of the limiting groove.

[0018] This invention also discloses a welding method, the specific steps of which are as follows:

[0019] First, align and attach the semiconductor heating plate and the connecting reinforcement, then place them horizontally and position them between the grippers. Next, close the grippers at both ends of one of the swing frames, thereby clamping and positioning the semiconductor heating plate and the connecting reinforcement through the two closed grippers.

[0020] Then, the two swing frames are driven to swing back and forth alternately by the swing drive component. When the swing frame holding the semiconductor heating plate and the connecting reinforcement swings, the swing frame drives the semiconductor heating plate and the connecting reinforcement to rotate through the jaws at both ends. At this time, the welding torch is used to weld the circumferential surface of the rotating semiconductor heating plate and the connecting reinforcement.

[0021] When the swing frame reaches the swing endpoint and begins to swing back to reset, the clamping drive assembly on it drives the jaws to open and release the clamping of the semiconductor heating plate and the connecting reinforcement, while the jaws at both ends of the other swing frame close to continue to clamp and position the semiconductor heating plate and the connecting reinforcement.

[0022] Then, the swing frame, which is disconnected from the semiconductor heating plate and the connecting reinforcement, rotates in the opposite direction to reset, while the swing frame, which is clamped to the semiconductor heating plate and the connecting reinforcement, begins to rotate and swing, driving the semiconductor heating plate and the connecting reinforcement to continue to rotate and change position, so that the welding torch can continuously perform circumferential welding on the semiconductor heating plate and the connecting reinforcement.

[0023] The present invention has the following beneficial effects:

[0024] 1. In this invention, multiple swing frames can be driven to reciprocate and alternately swing via a swing drive assembly. When the swing frame rotates, the clamping drive assemblies at both ends drive the grippers to clamp and fix the semiconductor heating plate and connecting reinforcement, so that the swing frame drives the semiconductor heating plate and connecting reinforcement to rotate synchronously. Then, the welding torch performs circumferential welding on the rotating semiconductor heating plate and connecting reinforcement. When the swing frame swings in the opposite direction to reset, the clamping drive assemblies at both ends drive the grippers to release the grippers on the semiconductor heating plate and connecting reinforcement, so as not to drive the semiconductor heating plate and connecting reinforcement to rotate in the opposite direction. Thus, through the cooperation of the reciprocating swing mechanism and the clamping mechanism, the automatic repositioning welding of the semiconductor heating plate and connecting reinforcement can be realized, and the circumferential welding of the semiconductor heating plate and connecting reinforcement can be completed in one go, improving the circumferential welding efficiency of the semiconductor heating plate. Moreover, the welding torch is located outside the movement trajectory of the clamping mechanism, so that when the clamping mechanism rotates with the swing frame, it will not interfere with the welding torch, ensuring that the welding process proceeds normally.

[0025] 2. In this invention, by setting up multiple swing frames and corresponding clamping mechanisms, when one swing frame rotates in the opposite direction to reset and its clamping mechanism loosens its grip on the semiconductor heating plate, the clamping mechanism on another swing frame simultaneously clamps and fixes the semiconductor heating plate, and drives the semiconductor heating plate to rotate and position. Through the cooperation of multiple swing frames and clamping mechanisms, the semiconductor heating plate is always in a clamped and positioned state during the transposition and conveying process, thereby improving the stability of the semiconductor heating plate clamping and conveying. At the same time, it can continuously convey and weld the semiconductor heating plate without interruption, which is beneficial to improving the welding efficiency of the semiconductor heating plate.

[0026] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of the invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the invention. For those skilled in the art, the drawings can be obtained from these drawings without creative effort.

[0028] Figure 1 This is one of the three-dimensional structural schematic diagrams of the welding device of the present invention;

[0029] Figure 2 This is a second three-dimensional structural schematic diagram of the welding device of the present invention;

[0030] Figure 3 For the present invention Figure 2 A magnified schematic diagram of the structure at point A;

[0031] Figure 4 This is one of the three-dimensional structural schematic diagrams of the welding workbench of the present invention;

[0032] Figure 5 For the present invention Figure 4 A magnified schematic diagram of the structure at point B;

[0033] Figure 6 For the present invention Figure 4 A magnified schematic diagram of the structure at point C;

[0034] Figure 7 This is the second three-dimensional structural schematic diagram of the welding workbench of the present invention;

[0035] Figure 8 For the present invention Figure 7 A magnified schematic diagram of the structure at point D;

[0036] Figure 9 This is the third three-dimensional structural schematic diagram of the welding workbench of the present invention.

[0037] In the diagram: 1. Welding cabinet; 2. Welding workbench; 3. Reciprocating swing mechanism; 31. Motor; 32. Swing frame; 33. Guide frame; 34. Connecting rod; 35. Slider; 36. Guide groove; 37. Driving bevel gear; 38. Rotating shaft; 39. Driven bevel gear; 310. Rotating sleeve; 311. Transmission bevel gear; 312. Bracket; 313. Slide rail; 314. Slide bar; 315. Rack; 316. Gear; 4. Clamping mechanism; 41. Support plate; 42. Clamping claw; 43. Support rod; 44. Support ring seat; 45. Slide groove; 46. Support block; 47. Cylinder; 48. Clamping positioning seat; 49. Slide plate; 410. Inclined guide groove; 411. Guide column; 412. Connecting rod; 413. Limiting groove; 414. Support roller; 5. Welding torch. Detailed Implementation

[0038] The technical solutions of the embodiments of the invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the invention, and not all embodiments. Based on the embodiments of the invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the invention.

[0039] In the description of this invention, it should be understood that the terms "opening", "upper", "lower", "top", "middle", "inner", etc., which indicate orientation or positional relationship, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the invention.

[0040] Example 1

[0041] Please see Figures 1-3 As shown, this invention is a circumferential welding device for automatic repositioning of semiconductor heating plates, including a welding cabinet 1 and a welding worktable 2 installed inside the welding cabinet 1. A reciprocating swing mechanism 3 is installed on the top surface of the welding worktable 2. The reciprocating swing mechanism 3 includes a swing drive assembly and multiple swing frames 32. The centers of the multiple swing frames 32 are all located on the same axis. The swing drive assembly can drive the multiple swing frames 32 to swing back and forth alternately. A clamping mechanism 4 is fixedly installed at both ends of each swing frame 32. The clamping mechanism 4 includes a support plate 41, a jaw 42 and a clamping drive assembly. The support plate 41 is fixedly installed above the end of the swing frame 32. The jaw 42 is installed on the inner end of the support plate 41 through the clamping drive assembly. The clamping drive assembly can drive the jaw 42 to close and clamp when the swing frame 32 rotates and swings, and can drive the jaw 42 to open and release when the swing frame 32 rotates and swings back to reset. A welding torch 5 is also fixedly installed on the top surface of the welding worktable 2, and the welding torch 5 is located outside the movement trajectory of the clamping mechanism 4.

[0042] Two swing frames 32 are provided. During welding, the semiconductor heating plate and the connecting reinforcement are first aligned and placed horizontally, with the semiconductor heating plate and the connecting reinforcement positioned between the clamps 42. Then, the clamps 42 at both ends of one swing frame 32 are closed, thereby clamping and positioning the semiconductor heating plate and the connecting reinforcement through the two closed clamps 42. Then, the two swing frames 32 are driven to swing back and forth alternately by the swing drive assembly. When the swing frame 32 holding the semiconductor heating plate and the connecting reinforcement swings, the swing frame 32 drives the semiconductor heating plate and the connecting reinforcement to rotate through the clamps 42 at both ends. At this time, the welding torch 5 is used to weld the rotating semiconductor heating plate and the connecting reinforcement. Welding is performed on the circumferential surface of the component; when the swing frame 32 reaches the swing endpoint and begins to swing back to reset, the clamping drive assembly on it drives the jaws 42 to open and loosen their grip on the semiconductor heating plate and the connecting reinforcement, while the jaws 42 at both ends of the other swing frame 32 close to continue to clamp and position the semiconductor heating plate and the connecting reinforcement; then the swing frame 32 that is disconnected from the semiconductor heating plate and the connecting reinforcement rotates and swings back to reset, while the swing frame 32 that is clamped to the semiconductor heating plate and the connecting reinforcement begins to rotate and swing, and drives the semiconductor heating plate and the connecting reinforcement to continue to rotate and change position, so that the welding torch 5 can continuously perform circumferential welding on the semiconductor heating plate and the connecting reinforcement;

[0043] The automatic repositioning and welding of the semiconductor heating plate and connecting reinforcement can be achieved through the cooperation of the reciprocating swing mechanism 3 and the clamping mechanism 4. The circumferential welding of the semiconductor heating plate and the connecting reinforcement can be completed in one go, which improves the circumferential welding efficiency of the semiconductor heating plate. Moreover, the welding torch 5 is located outside the movement trajectory of the clamping mechanism 4, so that when the clamping mechanism 4 rotates with the swing frame 32, it will not interfere with the welding torch 5, ensuring that the welding process can proceed normally. Through the cooperation of the two swing frames 32 and the clamping mechanism 4, the semiconductor heating plate is always in a clamped and positioned state during the repositioning and conveying process, thereby improving the stability of the semiconductor heating plate clamping and conveying. At the same time, the semiconductor heating plate can be continuously conveyed and welded without interruption, further improving the welding efficiency of the semiconductor heating plate.

[0044] Example 2

[0045] Please see Figures 1-4 , Figures 6-9 As shown, the difference between this embodiment and the above embodiment is that the swing drive assembly includes a motor 31, which is fixedly installed on the top surface of the welding workbench 2. A connecting rod 34 is driven and installed at the output end of the motor 31, and a slider 35 is rotatably installed on the top surface of one end of the connecting rod 34. The swing drive assembly also includes a bracket 312, which is fixedly installed on the top surface of the welding workbench 2 and located on one side of the motor 31. A slide rail 313 is located on one side of the upper end of the bracket 312, and the bottom end of the slide rail 313... A slider 314 is slidably mounted, and a rack 315 is fixedly mounted at the bottom end of the slider 314. A guide frame 33, which is perpendicular to the rack 315, is fixedly mounted at the bottom end of the rack 315. A guide groove 36 is provided on the inner ring of the guide frame 33, and the slider 35 is slidably locked in the guide groove 36. A rotating shaft 38 is also rotatably mounted on the upper end of the bracket 312. A gear 316 that meshes and drives with the rack 315 is fixedly mounted at the bottom end of the rotating shaft 38, and a swing frame 32 is fixedly mounted at the top end of the rotating shaft 38.

[0046] When the motor 31 is working, it drives the slider 35 to make a circular motion through the connecting rod 34. When the slider 35 makes a circular motion, it cooperates with the guide groove 36 to drive the guide frame 33 to move back and forth. At the same time, the guide frame 33 drives the rack 315 to move back and forth. When the rack 315 moves back and forth, it meshes with the drive gear 316 to rotate back and forth, so that the gear 316 drives the rotating shaft 38 to rotate back and forth. When the rotating shaft 38 rotates back and forth, it drives the swing frame 32 at the top to swing back and forth. During the swinging process, the swing frame 32 transports and changes the semiconductor heating plate through the cooperation of the clamping mechanism 4.

[0047] Furthermore, a driving bevel gear 37 is fixedly installed at the lower end of the rotating shaft 38, and a rotating sleeve 310 is movably sleeved at the upper end of the rotating shaft 38. The rotating sleeve 310 is rotatably connected to the bracket 312. A swing frame 32 is fixedly installed at the top of the rotating sleeve 310, and a driven bevel gear 39 is fixedly installed at the bottom end of the rotating sleeve 310. A transmission bevel gear 311 is also rotatably installed on the bracket 312. The transmission bevel gear 311 is meshed and connected between the driving bevel gear 37 and the driven bevel gear 39.

[0048] The rotating shaft 38 moves through the driven bevel gear 39 and the rotating sleeve 310, so that there is no interference between the rotating shaft 38 and the rotating sleeve 310. When the rotating shaft 38 rotates and drives the swing frame 32 at its top to rotate and swing, the rotating shaft 38 drives the driving bevel gear 37 to rotate synchronously. At this time, the driving bevel gear 37 drives the driven bevel gear 39 to rotate in the opposite direction through the meshing transmission bevel gear 311, so that the rotating sleeve 310 rotates in the opposite direction relative to the rotating shaft 38. In turn, the rotating sleeve 310 drives the swing frame 32 at its top to rotate in the opposite direction to the swing frame 32 at the top of the rotating shaft 38. Thus, through the two swing frames 32 rotating in opposite directions and cooperating with the clamping mechanism 4, the semiconductor heating plate can be continuously driven to transport and change positions.

[0049] Example 3

[0050] Please see Figures 1-5 As shown, the difference between this embodiment and the above embodiment is that the clamping drive assembly includes a cylinder 47 and a clamping positioning seat 48. The cylinder 47 is fixedly installed on the top surface of the support plate 41, and the clamping positioning seat 48 is embedded in the inner end of the support plate 41. The upper and lower ends of the clamping positioning seat 48 are slidably fitted with connecting rods 412. The outer end of the connecting rod 412 is fixedly fitted with a gripper 42, and the inner end of the connecting rod 412 is fixedly fitted with a guide post 411. A slide plate 49 is slidably installed inside the clamping positioning seat 48. The slide plate 49 has inclined guide grooves 410 arranged symmetrically on the upper and lower sides. The guide posts 411 are slidably engaged inside the corresponding inclined guide grooves 410. The telescopic end of the cylinder 47 extends into the interior of the clamping positioning seat 48 and is fixedly connected to one end of the slide plate 49.

[0051] When the semiconductor heating plate needs to be clamped, the cylinder 47 extends, pushing the slide plate 49 inward. At this time, the slide plate 49 guides the two sets of guide posts 411 at the upper and lower ends to close through the inclined guide grooves 410 that are symmetrically distributed at the top and bottom. At the same time, the guide posts 411 drive the two jaws 42 at the upper and lower ends to move and close to clamp through the connecting rod 412. Correspondingly, when it is necessary to loosen the clamping of the semiconductor heating plate, the cylinder 47 retracts, pulling the slide plate 49 outward. At this time, the slide plate 49 guides the two sets of guide posts 411 at the upper and lower ends to open through the inclined guide grooves 410 that are symmetrically distributed at the top and bottom. At the same time, the guide posts 411 drive the two jaws 42 at the upper and lower ends to move and open through the connecting rod 412.

[0052] Furthermore, a support rod 43 distributed in a circular pattern is fixedly installed on the top of the welding workbench 2. A support ring seat 44 is fixedly installed on the top of the support rod 43. A groove 45 is opened on the top surface of the support ring seat 44. A support block 46 that is slidably locked in the groove 45 is fixedly installed on the bottom surface of the outer end of the support plate 41.

[0053] The support plate 41 is supported by the support rod 43, the support ring seat 44 and the support block 46, which can improve the stability of the support plate 41 when it rotates and moves with the swing frame 32. This can improve the stability of the semiconductor heating plate transfer and conveying, and thus help improve the welding accuracy of the semiconductor heating plate.

[0054] Furthermore, a limiting groove 413 is provided on the top surface of the inner end of the support plate 41. An arc-shaped limiting surface that matches the outer circumferential surface of the semiconductor heating plate is provided on the side wall of the limiting groove 413. When the semiconductor heating plate is welded, the outer circumference of the semiconductor heating plate can be slidably engaged in the limiting groove 413. At the same time, the outer circumferential surface of the semiconductor heating plate slides tightly against the arc-shaped limiting surface. Thus, the limiting groove 413 can not only provide auxiliary support for the semiconductor heating plate and improve the stability of the semiconductor heating plate during transposition and transportation, but also limit and center the semiconductor heating plate, improve the positioning accuracy of the semiconductor heating plate, and thus improve the welding accuracy of the semiconductor heating plate.

[0055] Furthermore, multiple support rollers 414 are rotatably installed at the bottom of the limiting groove 413. The support rollers 414 provide rolling support to the bottom surface of the semiconductor heating plate, reducing the frictional resistance during the repositioning and conveying of the semiconductor heating plate, making the repositioning and conveying of the semiconductor heating plate more labor-saving.

[0056] Example 4

[0057] This embodiment discloses a circumferential welding method for automatic repositioning of semiconductor heating plates, the specific steps of which are as follows:

[0058] First, align and attach the semiconductor heating plate and the connecting reinforcement, then place them horizontally and position them between the grippers 42. Then, close the grippers 42 at both ends of one of the swing frames 32, thereby clamping and positioning the semiconductor heating plate and the connecting reinforcement through the two closed grippers 42.

[0059] Then, the two swing frames 32 are driven to swing back and forth alternately by the swing drive component. When the swing frame 32 holding the semiconductor heating plate and the connecting reinforcement swings, the swing frame 32 drives the semiconductor heating plate and the connecting reinforcement to rotate through the grippers 42 at both ends. At this time, the welding torch 5 welds the circumferential surface of the rotating semiconductor heating plate and the connecting reinforcement.

[0060] When the swing frame 32 reaches the swing end position and begins to swing back to reset, the clamping drive assembly on it drives the jaws 42 to open and release the clamping of the semiconductor heating plate and the connecting reinforcement. At the same time, the jaws 42 at both ends of the other swing frame 32 close to continue to clamp and position the semiconductor heating plate and the connecting reinforcement.

[0061] Afterwards, the swing frame 32, which is disconnected from the semiconductor heating plate and the connecting reinforcement, rotates and swings back to reset, while the swing frame 32, which is clamped to the semiconductor heating plate and the connecting reinforcement, begins to rotate and swing, driving the semiconductor heating plate and the connecting reinforcement to continue to rotate and change position, so that the welding torch 5 can continuously perform circumferential welding on the semiconductor heating plate and the connecting reinforcement.

[0062] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0063] The preferred embodiments of the invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention.

Claims

1. A circumferential welding device for automatic repositioning of semiconductor heating plates, comprising a welding cabinet and a welding worktable installed inside the welding cabinet, characterized in that: The top surface of the welding workbench is equipped with a reciprocating swing mechanism, which includes a swing drive assembly and multiple swing frames. The centers of the multiple swing frames are all located on the same axis. The swing drive assembly can drive the multiple swing frames to swing back and forth alternately. Each swing frame is fixedly equipped with a clamping mechanism at both ends. The clamping mechanism includes a support plate, a gripper, and a clamping drive assembly. The support plate is fixedly installed above the end of the swing frame. The gripper is installed on the inner end of the support plate through the clamping drive assembly. The clamping drive assembly can drive the gripper to close and clamp when the swing frame rotates and swings, and can drive the gripper to open and release when the swing frame rotates and swings back to reset. A welding torch is also fixedly installed on the top surface of the welding workbench, and the welding torch is located outside the movement trajectory of the clamping mechanism.

2. The circumferential welding device for automatic repositioning of semiconductor heating plates according to claim 1, characterized in that: The swing drive assembly includes a motor, which is fixedly mounted on the top surface of the welding workbench. A connecting rod is driven to the output end of the motor, and a slider is rotatably mounted on the top surface of one end of the connecting rod.

3. The circumferential welding device for automatic repositioning of semiconductor heating plates according to claim 2, characterized in that: The swing drive assembly also includes a bracket, which is fixedly installed on the top surface of the welding workbench and located on one side of the motor. A slide rail is located on one side of the upper end of the bracket. A slide bar is slidably installed at the bottom end of the slide rail. A rack is fixedly installed at the bottom end of the slide bar. A guide frame is fixedly installed at the bottom end of the rack, which is perpendicular to the rack. A guide groove is provided on the inner ring of the guide frame, and the slider is slidably engaged in the guide groove.

4. The circumferential welding device for automatic repositioning of semiconductor heating plates according to claim 3, characterized in that: The upper end of the bracket is also rotatably mounted with a rotating shaft, the bottom end of the rotating shaft is fixedly mounted with a gear that meshes with and drives a rack and pinion, and the top end of the rotating shaft is fixedly mounted with the swing frame.

5. The circumferential welding device for automatic repositioning of semiconductor heating plates according to claim 4, characterized in that: A driving bevel gear is fixedly installed at the lower end of the rotating shaft, and a rotating sleeve is movably sleeved at the upper end of the rotating shaft. The rotating sleeve is rotatably connected to the bracket. The swing frame is fixedly installed at the top of the rotating sleeve, and a driven bevel gear is fixedly installed at the bottom of the rotating sleeve. A transmission bevel gear is also rotatably installed on the bracket. The transmission bevel gear is meshed and connected between the driving bevel gear and the driven bevel gear.

6. The circumferential welding device for automatic repositioning of semiconductor heating plates according to claim 1, characterized in that: The clamping drive assembly includes a cylinder and a clamping positioning seat. The cylinder is fixedly installed on the top surface of the support plate, and the clamping positioning seat is embedded in the inner end of the support plate. Connecting rods are slidably clamped at both the upper and lower ends of the clamping positioning seat. The jaws are fixedly installed at the outer ends of the connecting rods, and guide posts are fixedly installed at the inner ends of the connecting rods. The clamping and positioning seat has a sliding plate inside, and the sliding plate has inclined guide grooves arranged symmetrically on the upper and lower sides. The guide posts are all slidably engaged in the interior of the corresponding inclined guide grooves. The telescopic end of the cylinder extends into the interior of the clamping and positioning seat and is fixedly connected to one end of the sliding plate.

7. The circumferential welding device for automatic repositioning of semiconductor heating plates according to claim 1, characterized in that: The top of the welding workbench is fixedly equipped with a circumferentially distributed support rod, and the top of the support rod is fixedly equipped with a support ring seat. The top surface of the support ring seat is provided with a sliding groove, and the bottom surface of the outer end of the support plate is fixedly equipped with a support block that is slidably engaged in the sliding groove.

8. The circumferential welding device for automatic repositioning of semiconductor heating plates according to claim 1, characterized in that: The top surface of the inner end of the support plate is provided with a limiting groove, and the side wall of the limiting groove is provided with an arc-shaped limiting surface that matches the outer circumferential surface of the semiconductor heating plate.

9. A circumferential welding device for automatic repositioning of a semiconductor heating plate according to claim 8, characterized in that: Multiple support rollers are rotatably mounted at the bottom of the limiting groove.

10. A welding method using the circumferential welding apparatus with automatic semiconductor heating plate repositioning as described in any one of claims 1-9, characterized in that, The specific steps are as follows: First, align and attach the semiconductor heating plate and the connecting reinforcement, then place them horizontally and position them between the grippers. Next, close the grippers at both ends of one of the swing frames, thereby clamping and positioning the semiconductor heating plate and the connecting reinforcement through the two closed grippers. Then, the two swing frames are driven to swing back and forth alternately by the swing drive component. When the swing frame holding the semiconductor heating plate and the connecting reinforcement swings, the swing frame drives the semiconductor heating plate and the connecting reinforcement to rotate through the jaws at both ends. At this time, the welding torch is used to weld the circumferential surface of the rotating semiconductor heating plate and the connecting reinforcement. When the swing frame reaches the swing endpoint and begins to swing back to reset, the clamping drive assembly on it drives the jaws to open and release the clamping of the semiconductor heating plate and the connecting reinforcement, while the jaws at both ends of the other swing frame close to continue to clamp and position the semiconductor heating plate and the connecting reinforcement. Then, the swing frame, which is disconnected from the semiconductor heating plate and the connecting reinforcement, rotates in the opposite direction to reset, while the swing frame, which is clamped to the semiconductor heating plate and the connecting reinforcement, begins to rotate and swing, driving the semiconductor heating plate and the connecting reinforcement to continue to rotate and change position, so that the welding torch can continuously perform circumferential welding on the semiconductor heating plate and the connecting reinforcement.

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