Vapor chamber processing method and vapor chamber

Abstract

A vapor chamber machining method comprises the steps that a lower cover plate with a first welding face and an upper cover plate with a second welding face are provided, and the first welding face is matched with the second welding face; processing a plurality of first grooves in the first welding surface; forming a dielectric layer on the first welding surface; a first clamping piece is machined in each first groove, a plurality of second clamping pieces are machined on the second welding face, and the second clamping pieces correspond to the first clamping pieces one to one; clamping the lower cover plate and the upper cover plate through a plurality of first clamping pieces and a plurality of second clamping pieces, so that the first welding surface is opposite to the second welding surface; and the lower cover plate and the upper cover plate are heated, so that the dielectric layer, the first clamping piece and the second clamping piece are melted, and the first clamping piece and the second clamping piece which are clamped with each other are melted and filled in the corresponding first grooves, so that the lower cover plate and the upper cover plate are welded. The vapor chamber is manufactured through the machining method. According to the vapor chamber machining method and the vapor chamber, the machining and welding quality of the vapor chamber can be improved.

Description

Technical Field

[0001] The present application relates to the field of processing and manufacturing technology, and in particular to a heat spreader processing method and a heat spreader. Background Art

[0002] During the manufacturing process of the heat spreader, it is usually necessary to weld and package two metal plates to form a closed cavity, which is used to accommodate the working fluid to achieve phase change heat transfer. In order to improve the heat dissipation efficiency, the heat spreader usually uses a thinner metal plate (such as copper foil), but the thin plate is prone to plastic deformation during processing or transportation, which manifests as defects such as warping and edge bending. The deformed plate is difficult to flatten again by conventional methods, and it is easy to be misaligned during subsequent clamping and positioning, which leads to quality defects such as assembly failure, weld position offset, and weld cracking in the welding process. In addition, when applying brazing material (such as solder paste) to the deformed area, if the coating amount is insufficient, the weld strength will not meet the standard, and excessive coating may cause solder overflow, which not only affects the appearance quality of the heat spreader, but may also block the micro-channel structure and ultimately reduce the heat transfer performance. Summary of the Invention

[0003] In view of the above, it is necessary to propose a heat spreader processing method and a heat spreader to improve the processing and welding quality of the heat spreader.

[0004] A first aspect of the present application provides a vapor chamber processing method, comprising: Providing a lower cover plate having a first welding surface and an upper cover plate having a second welding surface, wherein the first welding surface and the second welding surface are adapted to each other; Processing a plurality of first grooves on the first welding surface; forming a dielectric layer on the first welding surface; A first clamping member is machined in each of the first grooves, and a plurality of second clamping members are machined on the second welding surface, wherein the plurality of second clamping members correspond one to one with the plurality of first clamping members; Clamping the lower cover plate and the upper cover plate together through a plurality of the first clamping members and a plurality of the second clamping members so that the first welding surface and the second welding surface face each other; The lower cover plate and the upper cover plate are heated to melt the dielectric layer, the first clamping member and the second clamping member, and the first clamping member and the second clamping member that are clamped to each other are melted and filled into the corresponding first groove to weld the lower cover plate and the upper cover plate.

[0005] The above-mentioned heat spreader processing method processes a plurality of first grooves on the first welding surface of the lower cover plate and forms a dielectric layer, then processes a first clip in the first groove, and simultaneously processes a second clip corresponding to the first clip on the second welding surface of the upper cover plate, and achieves precise pre-positioning of the upper and lower cover plates by the snap-fitting of the first clip and the second clip, followed by heating and melting welding. The above-mentioned heat spreader processing method uses the mechanical interlocking of the first clip and the second clip to precisely align the lower cover plate and the upper cover plate before welding, avoiding the misalignment of the lower cover plate and the upper cover plate due to deformation, eliminating the precision fixture positioning step required for traditional welding, reducing manual adjustment time, and improving production efficiency. The first clip and the second clip melt after heating and completely fill the first groove, ensuring that there is no gap on the welding surface, improving the airtightness and strength of the internal cavity of the heat spreader, and improving the processing and welding quality.

[0006] In some embodiments, the step of machining the plurality of first grooves on the first welding surface includes machining a regular concave structure on the first welding surface by laser to form the plurality of first grooves.

[0007] In some embodiments, the step of forming the dielectric layer on the first welding surface includes: blocking the first groove by a blocking member to form the dielectric layer outside the first groove of the first welding surface, and then forming a second groove based on the first groove.

[0008] In some embodiments, the steps of processing the first clip in each first groove and processing multiple second clips on the second welding surface include: forming the first clip in the first groove by 3D printing, and forming the second clip on the second welding surface by 3D printing, the first clip includes a first connecting portion extending perpendicular to the upper cover and a first clip parallel to the lower cover, the first clip is connected to an end of the first connecting portion away from the bottom of the first groove, the second clip includes a second connecting portion extending perpendicular to the upper cover and a second clip parallel to the upper cover, the second clip is connected to an end of the second connecting portion away from the second welding surface.

[0009] In some embodiments, the sum of the volumes of the first clamping member and the corresponding second clamping member is equal to the volume of the corresponding second groove.

[0010] In some embodiments, the dielectric layer, the first clamping member, and the second clamping member are made of the same material, and the melting points of the dielectric layer, the first clamping member, and the second clamping member are lower than those of the lower cover plate and the upper cover plate.

[0011] In some embodiments, the lower cover plate and the upper cover plate are made of copper, and the dielectric layer, the first clamping member, and the second clamping member are all made of tin.

[0012] In some embodiments, the step of clamping the lower cover plate and the upper cover plate through multiple first clamping parts and multiple second clamping parts includes: vacuum adsorbing the lower cover plate, placing the upper cover plate on the lower cover plate, and making the second welding surface opposite to the first welding surface, clamping multiple first clamping parts and multiple second clamping parts one by one, so that the first clamping portion of each first clamping part is clamped to the second clamping portion of the corresponding second clamping part.

[0013] In some embodiments, the step of heating the lower cover plate and the upper cover plate to melt the dielectric layer, the first clamp and the second clamp to weld the lower cover plate and the upper cover plate includes: clamping the lower cover plate and the upper cover plate by a heat-conducting jig, and heating the heat-conducting jig until the dielectric layer, the first clamp and the second clamp are melted.

[0014] A second aspect of the present application provides a heat spreader, which is manufactured by the heat spreader processing method described in any of the above embodiments. The heat spreader includes a lower cover plate having a first welding surface, an upper cover plate having a second welding surface, and a dielectric layer. The first welding surface is arranged on the side of the lower cover plate facing the upper cover plate, the second welding surface is arranged on the side of the upper cover plate facing the lower cover plate, and the dielectric layer is arranged between the first welding surface and the second welding surface.

[0015] The above-mentioned heat spreader is obtained by the heat spreader processing method of the first aspect of the present application, which has at least the same advantages as the heat spreader processing method of the first aspect, and the heat spreader has high welding quality and good air tightness. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic flow chart of the heat spreader processing method provided in an embodiment of the present application.

[0017] Figure 2 This is a schematic diagram of the structure of the heat sink provided in an embodiment of the present application.

[0018] Figure 3 for Figure 2 The schematic diagram of the structure of the lower cover plate and the baffle of the heat spreader is shown.

[0019] Figure 4 for Figure 3 The structure diagram shown is a schematic diagram of the lower cover plate after the dielectric layer and the first clamping member are processed.

[0020] Figure 5 for Figure 1 The upper cover of the heat spreader is shown as a schematic structural diagram from another angle after the second clamping piece is processed.

[0021] Figure 6 for Figure 4 The lower cover shown is Figure 5 The schematic diagram of the structure of the upper cover plates being snapped together is shown.

[0022] Figure 7 for Figure 6 Schematic diagram of the enlarged structure of position VII shown.

[0023] Figure 8 for Figure 6 Schematic diagram of the enlarged structure of position VIII shown.

[0024] Figure 9 Schematic diagram of the structure of the heat sink and heat conducting fixture provided in the embodiment of the present application.

[0025] Explanation of the main component symbols: heat sink 100, lower cover 10, first welding surface 11, first groove 12, second groove 13, first main body 14, first opening 15, upper cover 20, second welding surface 21, second main body 22, second opening 23, dielectric layer 30, first clamping part 40, first connecting part 41, first clamping part 42, second clamping part 50, second connecting part 51, second clamping part 52, baffle 60, heat conducting fixture 70, lower heating plate 71, upper heating plate 72. DETAILED DESCRIPTION

[0026] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be understood as limiting the present application.

[0027] In the description of the present application, it should be understood that the terms indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present application, it should be noted that the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0028] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be directly connected or indirectly connected through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances. Some embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0029] The embodiments of the present application are further described below with reference to the accompanying drawings.

[0030] See Figure 1 and Figure 2 An embodiment of the present application provides a heat spreader processing method, which is used to process and manufacture a heat spreader 100 , which includes at least a lower cover plate 10 and an upper cover plate 20 .

[0031] Please also see Figure 3 、 Figure 4 and Figure 5 The heat sink processing method provided in the embodiment of the present application includes the following steps S10 to S60.

[0032] Step S10 : providing a lower cover plate 10 having a first welding surface 11 and an upper cover plate 20 having a second welding surface 21 , wherein the first welding surface 11 and the second welding surface 21 are adapted to each other.

[0033] Specifically, the lower cover plate 10 includes a first main body portion 14 and a first welding surface 11. The first main body portion 14 is generally plate-shaped or sheet-shaped. The first main body portion 14 is provided with a first opening 15. The first welding surface 11 is arranged around the edge of the first main body portion 14 and may protrude from the surface of the first main body portion 14. The upper cover plate 20 includes a second main body portion 22 and a second welding surface 21. The second main body portion 22 is generally plate-shaped or sheet-shaped. It is understood that the second main body portion 22 has a substantially identical structure to the first main body portion 14. The second main body portion 22 is provided with a second opening 23. The second opening 23 and the first opening 15 combine to form an opening of the vapor chamber 100, which is used to inject liquid into the vapor chamber 100. The second welding surface 21 is arranged around the edge of the second main body portion 22. The second welding surface 21 is structurally compatible with the first welding surface 11 and may protrude from the surface of the second main body portion 22. Obviously, this is not a limitation of the embodiments of the present application.

[0034] Step S20 , machining a plurality of first grooves 12 on the first welding surface 11 .

[0035] For details, see Figure 3 The number of the first grooves 12 can be four, six, seven, eight, etc., and multiple first grooves 12 are arranged at intervals. The number and position of the first grooves 12 can be set according to actual needs. For example, one is set at a position opposite to the first opening 15 on the first welding surface 11, and two or three are set at two positions adjacent to the first opening 15, etc., which are not limited here.

[0036] Step S30 , forming a dielectric layer 30 on the first welding surface 11 .

[0037] For details, see Figure 3 and Figure 4 The dielectric layer 30 can be formed on the first welding surface 11 by electroplating or other methods. Of course, the dielectric layer 30 can also be formed on the first welding surface 11 by other methods such as coating, which is not limited here.

[0038] In step S40 , a first clamping member 40 is machined in each first groove 12 , and a plurality of second clamping members 50 are machined on the second welding surface 21 . The plurality of second clamping members 50 correspond to the plurality of first clamping members 40 on a one-to-one basis.

[0039] For details, see Figure 4 and Figure 5 The number of the first clips 40 is consistent with the number of the first grooves 12, for example, there can be four, six, seven, eight, etc., and each first groove 12 is provided with a first clip 40. The number and position of the second clips 50 are consistent with the number and position of the first clips 40, and the number of the second clips 50 can be four, six, seven, eight, etc., so that the second clips 50 are easily coupled to the first clips 40.

[0040] In step S50 , the lower cover plate 10 and the upper cover plate 20 are fastened together by using a plurality of first fastening members 40 and a plurality of second fastening members 50 so that the first welding surface 11 and the second welding surface 21 face each other.

[0041] For details, please refer to Figure 6 、 Figure 7 and Figure 8 , cover the upper cover 20 on the lower cover 10, and clamp each second clamping member 50 with the corresponding first clamping member 40. In this way, the lower cover 10 and the upper cover 20 can be accurately aligned. Even if the lower cover 10 or the upper cover 20 is deformed, the lower cover 10 and the upper cover 20 can be aligned by the clamping action of the first clamping member 40 and the second clamping member 50, thereby improving the positioning accuracy.

[0042] In step S60 , the lower cover plate 10 and the upper cover plate 20 are heated to melt the dielectric layer 30 , the first clamping member 40 and the second clamping member 50 . The first clamping member 40 and the second clamping member 50 that are clamped to each other are melted and filled into the corresponding first groove 12 , thereby welding the lower cover plate 10 and the upper cover plate 20 .

[0043] For details, see Figure 6 and Figure 9 After heating the lower cover plate 10 and the upper cover plate 20 that are clamped together, the dielectric layer 30 melts and then welds the lower cover plate 10 and the upper cover plate 20 together. At the same time, the first clamping parts 40 and the second clamping parts 50 that are clamped to each other melt and fill the corresponding first grooves 12, ensuring that there is no gap between the first welding surface 11 and the second welding surface 21, thereby improving the airtightness and strength of the internal cavity of the heat spreader 100.

[0044] Thus, by executing steps S10-S60, a plurality of first grooves 12 are machined on the first welding surface 11 of the lower cover plate 10 to form a dielectric layer 30. A first clip 40 is then machined within the first groove 12, and a second clip 50 corresponding to the first clip 40 is simultaneously machined on the second welding surface 21 of the upper cover plate 20. The upper and lower cover plates 10 are precisely pre-positioned and then heated and melt-welded by the snap-fit ​​engagement of the first clip 40 and the second clip 50. The heat spreader processing method provided in the embodiment of the present application utilizes the mechanical interlocking of the first clip 40 and the second clip 50 to precisely align the lower cover plate 10 and the upper cover plate 20 before welding, thereby avoiding misalignment of the lower and upper cover plates 10 due to deformation. This eliminates the need for the precise fixture positioning step required for conventional welding, reduces manual adjustment time, and improves production efficiency. After heating, the first clamping member 40 and the second clamping member 50 melt and completely fill the first groove 12, ensuring that there is no gap on the welding surface, improving the airtightness and strength of the internal cavity of the heat spreader 100, and improving the processing and welding quality.

[0045] In some embodiments, see Figure 3 When a plurality of first grooves 12 are machined on the first welding surface 11, the following step S201 is specifically performed.

[0046] In step S201 , a regular concave structure is machined on the first welding surface 11 by laser to form a plurality of first grooves 12 .

[0047] Specifically, when laser processing the first groove 12 on the first welding surface 11, the surface of the first welding surface 11 can be cleaned first. For example, oil, rust, and impurities on the first welding surface 11 can be removed using a chemical cleaner (such as acetone or alcohol) or a physical method (such as sandblasting) to ensure that the first welding surface 11 is clean and flat. The lower cover plate 10 is then secured to the laser processing platform using a clamp, vacuum suction, or other means to ensure that the lower cover plate 10 remains stable during processing. The laser is then activated according to the set parameters and path to process the metal surface.

[0048] In this embodiment, the regular recessed structure can be a rectangular parallelepiped groove, a cube groove, a cylindrical groove, etc., to facilitate the calculation of the volume of the first groove 12. The specific dimensions of the first groove 12, such as length, width, and height, can be set according to the specific structure of the first welding surface 11 or according to actual needs, and are not limited here.

[0049] In some embodiments, see Figure 3 、 Figure 4 and Figure 5 The dielectric layer 30 , the first clip 40 and the second clip 50 are made of the same material, and the melting points of the dielectric layer 30 , the first clip 40 and the second clip 50 are lower than those of the lower cover 10 and the upper cover 20 .

[0050] The melting points of the dielectric layer 30, the first clamping member 40, and the second clamping member 50 are lower than those of the lower cover 10 and the upper cover 20. During welding, the dielectric layer 30, the first clamping member 40, and the second clamping member 50 can be melted by simply controlling the temperature near their melting points, without having to heat the lower cover 10 and the upper cover 20 to their melting points. This significantly reduces the welding temperature requirement, simplifies the welding process, reduces reliance on high-temperature equipment, and reduces welding difficulty and cost.

[0051] In some embodiments, see Figure 6 The lower cover plate 10 and the upper cover plate 20 are made of copper, and the dielectric layer 30, the first clamping member 40 and the second clamping member 50 are all made of tin.

[0052] Copper has a melting point of approximately 1085°C, while tin has a melting point of approximately 232°C. Choosing tin as the material for dielectric layer 30, first clamping member 40, and second clamping member 50 allows the welding process to be completed near tin's melting point, avoiding high-temperature damage to the copper lower cover plate 10 and upper cover plate 20. This not only reduces the welding difficulty, but also reduces the requirements for welding equipment and production costs. Copper and tin have good welding compatibility, forming a good metallurgical bond with copper, resulting in a high-strength joint after welding. Furthermore, dielectric layer 30 has good thermal conductivity, meeting the requirements for use in vapor chamber 100.

[0053] During the heating process, tin and copper react. When the temperature is below 150°C or the reaction time is short, tin and copper react to form Cu6Sn5, which is located on the tin side of the tin-copper interface. When the temperature is above 150°C or the reaction time is long, Cu3Sn is formed, which is located between Cu6Sn5 and copper. Cu3Sn is a monoclinic or orthorhombic crystal with a denser structure, which can achieve a better bonding effect between copper and tin.

[0054] In some embodiments, see Figure 3 and Figure 4 When the dielectric layer 30 is formed on the first welding surface 11, the following step S301 is specifically performed.

[0055] In step S301 , the first groove 12 is blocked by the blocking member 60 to form a dielectric layer 30 outside the first groove 12 on the first welding surface 11 , thereby forming a second groove 13 on the basis of the first groove 12 .

[0056] The stopper 60 can be a block-shaped structure that matches the structure of the first groove 12 to shield the first groove 12 when the dielectric layer 30 is formed. After the dielectric layer 30 is formed on the first welding surface 11, the dielectric layer 30 itself has a certain thickness, so a second groove 13 is formed on the basis of the first groove 12. It can be understood that the first clamping member 40 and the second clamping member 50 will fill the second groove 13 after melting.

[0057] In this embodiment, the dielectric layer 30 is formed on the first welding surface 11 by taking the case where the material of the lower cover plate 10 is copper and the material of the dielectric layer 30 is tin as an example. Of course, this is not a limitation of the embodiment of the present application. Specifically, the following steps S3011 to S3018 are performed.

[0058] Step 3011 , fix the lower cover 10 , install the lower cover 10 and the stopper 60 on the lead frame, and fix the lower cover 10 and the stopper 60 .

[0059] Step 3012: plastic encapsulation: plastic encapsulation is performed on the lead frame to protect the non-tinned portion of the lower stopper 60 and prevent the non-tinned portion from being corroded by the tin plating solution.

[0060] Step 3013, baking, placing the encapsulated lead frame in an oven, and baking the lead frame to remove the moisture and organic matter remaining in the encapsulation process and improve the adhesion and stability of the encapsulation layer.

[0061] Step 3014, chemical soft glue, immersing the baked lead frame into a chemical soft glue solution. The chemical soft glue can remove tiny scratches and impurities on the first welding surface 11, making the surface of the first welding surface 11 smoother and providing a good base for subsequent tinning.

[0062] Step 3015, pre-treatment: Place the lead frame after chemical soft glue treatment in a degreasing tank with a 30g / L potassium hydroxide solution. The temperature is controlled at (40±5)°C and the treatment time is 10-15 minutes. The chemical reaction removes oil and organic impurities from the surface of the copper sheet, ensuring the surface cleanliness of the copper sheet and improving the adhesion of the tin plating layer. The degreased lead frame is washed with water to remove the degreasing solution and impurities remaining on the surface of the first welding surface 11, ensuring the surface of the first welding surface 11 is clean. The washed lead frame is immersed in a deoxidizing solution to remove the oxide layer on the surface of the copper sheet, exposing the copper substrate and providing a good contact surface for electroplating. The deoxidized lead frame is rinsed to ensure that there is no residual deoxidizing solution on the surface of the first welding surface 11.

[0063] Step 3016, pre-dip: Dip the washed lead frame into a pre-dip solution containing 1%-3% methanesulfonic acid at a temperature of (35±5)°C. Pre-dip forms a uniform active layer on the copper sheet, improving the wettability of the electroplating solution and the uniformity of the tinning layer.

[0064] Step 3017, electroplating, places the pre-impregnated lead frame into an electroplating tank. The electroplating solution consists of 50 g / L tin methanesulfonate, 200 g / L methanesulfonic acid, and 50 ml / L additives. The temperature is controlled at (45 ± 5) °C. A uniform tin layer is deposited on the surface of the copper sheet through an electrochemical reaction.

[0065] Step 3018: Post-processing: Rinse the electroplated lead frame to remove any residual plating solution from the first soldering surface 11. Immerse the rinsed lead frame in a tin protective solution containing a 5% tin protective agent (benzotriazole) at a temperature of (40±5)°C. The tin protective agent forms a dense protective film that prevents oxidation of the tin layer during subsequent processing and storage. Rinse the lead frame with water to remove any residual tin protective solution from the first soldering surface 11. Blow dry the rinsed lead frame to ensure that no residual moisture remains on the surface of the first soldering surface 11 to prevent any water marks from affecting the appearance and performance of the tin layer. Place the dried lead frame in an oven and bake it to further solidify the tin protective film, improving the adhesion and corrosion resistance of the tin layer.

[0066] In some embodiments, see Figure 4 and Figure 5 When the first clamping member 40 is machined in each first groove 12 and the plurality of second clamping members 50 are machined on the second welding surface 21 , the following step S401 is specifically performed.

[0067] S401 , forming a first clamping member 40 in the first groove 12 by 3D printing, and forming a second clamping member 50 on the second welding surface 21 by 3D printing.

[0068] Processing the first and second clips 40, 50 using 3D printing technology enables high-precision manufacturing, ensuring that the size and shape of the first and second clips 40, 50 are completely consistent with the design. This allows the first and second clips 40, 50 to perfectly match, reducing welding defects caused by component misalignment during welding. 3D printing technology offers rapid prototyping, high precision, and personalized customization. Processing the first and second clips 40, 50 using 3D printing can significantly shorten processing cycles and improve production efficiency. Furthermore, 3D printing allows for the rapid adjustment of the shape and size of the first and second clips 40, 50 according to different design requirements, enhancing processing flexibility.

[0069] Please also see Figure 6 and Figure 7 The first clamping member 40 includes a first connecting portion 41 extending perpendicular to the upper cover 20 and a first clamping portion 42 arranged parallel to the lower cover 10. The first clamping portion 42 is connected to an end of the first connecting portion 41 away from the bottom of the first groove 12. The second clamping member 50 includes a second connecting portion 51 extending perpendicular to the upper cover 20 and a second clamping portion 52 arranged parallel to the upper cover 20. The second clamping portion 52 is connected to an end of the second connecting portion 51 away from the second welding surface 21.

[0070] In this example, see Figure 8 The first clamping member 40 may further include two first connecting portions 41 and a first clamping portion 42 , the two first connecting portions 41 are spaced apart, and the first clamping portion 42 is connected to the ends of the two first connecting portions 41 away from the bottom of the first groove 12 .

[0071] In some embodiments, see Figure 3 、 Figure 4 and Figure 5 The sum of the volumes of the first clip 40 and the corresponding second clip 50 is equal to the volume of the corresponding second groove 13. By precisely controlling the volumes of the first clip 40 and the second clip 50 to match the volume of the second groove 13, the structural integrity after welding is ensured. During the welding process, the first clip 40 and the second clip 50 can completely fill the second groove 13, forming an integral welding layer with the dielectric layer 30, thereby enhancing the mechanical strength and structural stability of the welded part. Precise volume matching makes the structure denser after welding, reduces the occurrence of welding defects such as pores and lack of fusion, and thus significantly improves the welding quality. The uniformity and density of the welding layer are guaranteed, further enhancing the connection strength between the lower cover plate 10 and the upper cover plate 20.

[0072] In some embodiments, see Figure 6 、 Figure 7 and Figure 8When the lower cover 10 and the upper cover 20 are fastened together by the plurality of first fastening members 40 and the plurality of second fastening members 50 , the following step S501 is specifically performed.

[0073] In step 501, the upper cover plate 20 is placed on the lower cover plate 10 by vacuum adsorption, and the second welding surface 21 is opposite to the first welding surface 11. The multiple first clamping members 40 and the multiple second clamping members 50 are clamped one by one, so that the first clamping portion 42 of each first clamping member 40 is clamped to the second clamping portion 52 of the corresponding second clamping member 50.

[0074] Fixing the lower cover plate 10 by vacuum adsorption can ensure that the lower cover plate 10 remains stable during the clamping process without displacement or shaking, providing a basis for the precise placement of the upper cover plate 20 and reducing the clamping error caused by the instability of the lower cover plate 10.

[0075] When the second clip 50 of the upper cover 20 is engaged with the first clip 40, the second clip 50 corresponding to the first clip 40 having two first connecting portions 41 is first inserted between the two first connecting portions 41 to initially position the second clip 50. The second clips 52 of the other second clips 50 are then engaged with the first clips 42 of the corresponding first clips 40. In this way, the first clips 40 and the second clips 50 are engaged in a one-to-one correspondence.

[0076] It can be understood that in this embodiment, the first clamping portions 42 of multiple first clamping members 40 located on the same side of the first welding surface 11 have the same extension direction, and the first clamping portions 42 of the first clamping members 40 located on opposite sides of the first welding surface 11 have opposite extension directions, which can improve the stability of the clamping.

[0077] The second clamping member 50 cooperates with the first clamping member 40 to pull the deformed position of the lower cover 10 and the upper cover 20, thereby improving the alignment accuracy of the lower cover 10 and the upper cover 20. The clamping connection between the first clamping member 40 and the second clamping member 50 provides a mechanical fixation method for the lower cover 10 and the upper cover 20. Before welding, this clamping connection can ensure the relative position between the two cover plates is fixed, preventing component displacement due to external forces or vibration during processing.

[0078] In some embodiments, see Figure 6 and Figure 9 When the lower cover plate 10 and the upper cover plate 20 are heated to melt the dielectric layer 30 , the first clamping member 40 and the second clamping member 50 to weld the lower cover plate 10 and the upper cover plate 20 , the following step S601 is specifically performed.

[0079] In step S601 , the lower cover plate 10 and the upper cover plate 20 are clamped by a heat conducting fixture 70 , and the heat conducting fixture 70 is heated until the dielectric layer 30 , the first clamping member 40 and the second clamping member 50 are melted.

[0080] Specifically, the thermal jig 70 includes a lower heating plate 71 and an upper heating plate 72, which cooperate to clamp the lower cover 10 and upper cover 20, which are connected by the first clamping member 40 and the second clamping member 50. The thermal jig 70 can provide uniform heat distribution, ensuring that the lower cover 10 and upper cover 20 are heated evenly during the welding process. It can effectively avoid local overheating or overcooling, reduce the occurrence of welding defects (such as pores and lack of fusion), and thus improve welding quality. Heating through the thermal jig 70 can more accurately control the welding temperature. Due to the excellent thermal conductivity of the thermal jig 70, it can quickly transfer heat to the welding area. At the same time, the temperature can be precisely controlled by adjusting the heating power or time, ensuring that the welding process is carried out within the optimal temperature range.

[0081] An embodiment of the present application also provides a heat spreader 100, which is manufactured by the above-mentioned heat spreader processing method. The heat spreader 100 includes a lower cover plate 10 having a first welding surface 11, an upper cover plate 20 having a second welding surface 21, and a dielectric layer 30. The first welding surface 11 is arranged on the side of the lower cover plate 10 facing the upper cover plate 20, the second welding surface 21 is arranged on the side of the upper cover plate 20 facing the lower cover plate 10, and the dielectric layer 30 is arranged between the first welding surface 11 and the second welding surface 21.

[0082] The vapor chamber 100 provided in the embodiment of the present application is obtained by the above-mentioned vapor chamber processing method, which has at least the same advantages as the processing method of the vapor chamber 100, and furthermore, the vapor chamber 100 has high welding quality and good air tightness.

[0083] It will be apparent to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above, and that the present application can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present application is defined by the appended claims rather than the foregoing description, and all variations that come within the meaning and range of equivalents of the claims are intended to be embraced herein.

[0084] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A heat sink processing method, characterized in that: include: Providing a lower cover plate having a first welding surface and an upper cover plate having a second welding surface, wherein the first welding surface and the second welding surface are adapted to each other; Processing a plurality of first grooves on the first welding surface; forming a dielectric layer on the first welding surface; A first clamping member is machined in each of the first grooves, and a plurality of second clamping members are machined on the second welding surface, wherein the plurality of second clamping members correspond one to one with the plurality of first clamping members; Clamping the lower cover plate and the upper cover plate together through a plurality of the first clamping members and a plurality of the second clamping members so that the first welding surface and the second welding surface face each other; The lower cover plate and the upper cover plate are heated to melt the dielectric layer, the first clamping member and the second clamping member, and the first clamping member and the second clamping member that are clamped to each other are melted and filled into the corresponding first groove to weld the lower cover plate and the upper cover plate.

2. The method for processing a vapor chamber according to claim 1, wherein: The step of machining a plurality of the first grooves on the first welding surface includes machining a regular concave structure on the first welding surface by laser to form the plurality of the first grooves.

3. The method for processing a vapor chamber according to claim 1, wherein: The step of forming the dielectric layer on the first welding surface includes: blocking the first groove by a blocking member to form the dielectric layer outside the first groove of the first welding surface, and then forming a second groove on the basis of the first groove.

4. The method for processing a vapor chamber according to claim 3, wherein: The steps of processing the first clip in each of the first grooves and processing multiple second clips on the second welding surface include: forming the first clip in the first groove by 3D printing, and forming the second clip on the second welding surface by 3D printing, the first clip includes a first connecting portion extending perpendicular to the upper cover and a first clip arranged parallel to the lower cover, the first clip is connected to an end of the first connecting portion away from the bottom of the first groove, the second clip includes a second connecting portion extending perpendicular to the upper cover and a second clip arranged parallel to the upper cover, the second clip is connected to an end of the second connecting portion away from the second welding surface.

5. The method for processing a vapor chamber according to claim 4, wherein: The sum of the volumes of the first clamping member and the corresponding second clamping member is equal to the volume of the corresponding second groove.

6. The method for processing a vapor chamber according to claim 1, wherein: The dielectric layer, the first clamping component, and the second clamping component are made of the same material, and the melting points of the dielectric layer, the first clamping component, and the second clamping component are lower than those of the lower cover plate and the upper cover plate.

7. The method for processing a vapor chamber according to claim 1, wherein: The lower cover plate and the upper cover plate are made of copper, and the dielectric layer, the first clamping member, and the second clamping member are all made of tin.

8. The method for processing a vapor chamber according to claim 4, wherein: The step of clamping the lower cover plate and the upper cover plate through the plurality of first clamping members and the plurality of second clamping members includes: placing the upper cover plate on the lower cover plate by vacuum adsorption, and making the second welding surface face the first welding surface, clamping the plurality of first clamping members and the plurality of second clamping members in a one-to-one correspondence, so that the first clamping portion of each first clamping member is clamped to the second clamping portion of the corresponding second clamping member.

9. The method for processing a vapor chamber according to claim 1, wherein: The step of heating the lower cover plate and the upper cover plate to melt the dielectric layer, the first clamping member, and the second clamping member to weld the lower cover plate and the upper cover plate includes: clamping the lower cover plate and the upper cover plate by a heat-conducting jig, and heating the heat-conducting jig until the dielectric layer, the first clamping member, and the second clamping member are melted.

10. A heat sink, characterized in that: The heat spreader is manufactured by the heat spreader processing method described in any one of claims 1 to 9, and the heat spreader includes a lower cover plate having a first welding surface, an upper cover plate having a second welding surface, and a dielectric layer, the first welding surface is arranged on the side of the lower cover plate facing the upper cover plate, the second welding surface is arranged on the side of the upper cover plate facing the lower cover plate, and the dielectric layer is arranged between the first welding surface and the second welding surface.

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