Method for producing a conductor arrangement

Abstract

The invention relates to a method for producing a conductor device (30) by means of a printing device (2) which is configured for use in a fused deposition system. In order to achieve improved heat resistance and dielectric strength of the conductor arrangement (30), it is proposed that the printing device (2) has a first printing head (4) and a second printing head (6), the method comprising the following steps: first extrusion (A) of an electrically insulating material (20) by means of the first printing head (4) to form an insulating layer (32) of the conductor arrangement (30); a second extrusion (C) of the metallic material (22) by means of a second print head (6) in order to form a conductor layer (36) of the conductor arrangement (30) on the insulating layer (32), the electrically insulating material (20) and / or the metallic material (22) being melted, in particular completely, during the extrusion (A, C).

Description

Technical Field

[0001] The invention relates to a method for producing a conductor arrangement by means of a printing device, which is configured for use in a fused deposition system.

[0002] Furthermore, the invention relates to a conductor arrangement which is produced using such a method.

[0003] Furthermore, the invention relates to a control unit having means for carrying out such a method.

[0004] Furthermore, the invention relates to a computer program product for performing such a method when run in a control unit.

[0005] Furthermore, the invention relates to a printing device for producing a conductor arrangement, which is configured for use in a fused deposition system. Background Art

[0006] Such conductor arrangements can be, for example, coils, which can also be used in rotating electrical machines, particularly engines or generators. Furthermore, the heat resistance and dielectric strength of such conductor arrangements depend on the insulator used. For example, coils are typically wound from copper enameled wire, but copper enameled wire has limitations, for example, in terms of heat resistance and breakdown voltage. Therefore, alternative manufacturing methods for such conductor arrangements are of interest to improve their heat resistance and dielectric strength.

[0007] Additive manufacturing of three-dimensional printed objects offers improved flexibility with regard to geometry and materials. Additive manufacturing can be performed, for example, using fused deposition methods. Popular fused deposition methods are, for example, fused deposition modeling (FDM) or fused filament fabrication (FFF).

[0008] US Patent No. 10,828,698 B2 describes an additive manufacturing method in which coils of connecting and separating filaments are fed into a print head. Both the connecting and separating filaments contain metal or ceramic powder and a binder. The filaments are heated on the coils and over a jump height to a temperature at which they bend without softening or breaking. The jump height is approximately linear, like a building board. The material is then degreased and sintered.

[0009] Publication WO 2022 / 269575 A1 describes a system for additive manufacturing, comprising a frame, a CNC plate connected to the frame, and a metal delivery mechanism coupled to deliver metal droplets onto the CNC plate. The metal delivery mechanism is configured to move controllably over the CNC plate to produce an object. The metal delivery mechanism includes a first spray head, which is functionally coupled to the CNC plate to controllably deliver metal droplets onto the CNC plate and is fluidically connected to a container containing metal.

[0010] Publication US2019 / 013497 A1 describes a printing system having an axial extrusion head that extrude cores, outer shells, and / or wrapped cores to generate complex structures without modification. The axial extrusion head can include a distribution channel having an input and an output and a suction chamber that surrounds the distribution channel. Summary of the Invention

[0011] The object of the present invention is to specify a method for producing a conductor arrangement by means of an additive method, with which improved thermal resistance and dielectric strength of the conductor arrangement are achieved.

[0012] According to the present invention, this object is achieved by a method for manufacturing a conductor arrangement by means of a printing device, which is configured for use in a fused deposition system, wherein the printing device has a first print head and a second print head, wherein the printing device has a molding device, which is arranged between the first print head and the second print head, wherein the method comprises the following steps: extruding an electrically insulating material for a first time by means of the first print head to form an insulating layer of the conductor arrangement, molding the insulating layer after the first extrusion to form a concave recess in the insulating layer, extruding a metal material for a second time by means of the second print head to form a conductor layer of the conductor arrangement on the insulating layer, wherein the electrically insulating material and / or the metal material is in particular completely melted during extrusion, and wherein the second extrusion of the metal material is carried out in the concave recess of the insulating layer.

[0013] Furthermore, according to the invention, this object is achieved by a conductor arrangement produced by such a method.

[0014] Furthermore, according to the invention, this object is achieved by a control unit having means for carrying out such a method.

[0015] Furthermore, according to the invention, this object is achieved by computer program software for carrying out such a method when run in a control unit.

[0016] Furthermore, according to the present invention, the object is achieved by a printing device for producing a conductor arrangement, which is configured for use in a fused deposition system, having a first print head and a second print head, wherein the printing device has a forming device, which is arranged between the first print head and the second print head, wherein the first print head is configured to extrude an electrically insulating material for forming an insulating layer of the conductor arrangement, wherein the second print head is configured to extrude a metal material for forming a conductor layer of the conductor arrangement, wherein the first print head is configured such that the electrically insulating material and / or the second print head is configured such that the metal material is, in particular, completely melted during extrusion, wherein the forming device is configured to form a concave recess in the insulating layer after extrusion of the electrically insulating material.

[0017] Advantages and preferred embodiments of the method can then be expediently communicated to the conductor arrangement, the control unit, the computer program product and the printing device.

[0018] The present invention is based on the concept of producing not only the conductor layer but also the insulation layer of a conductor arrangement using a fused deposition method, wherein the electrically insulating material of the insulator and / or the metallic material of the conductor are, in particular, completely melted during extrusion. The electrically insulating material of the insulator is extruded using a first print head to form the insulation layer, while the metallic material of the conductor is extruded using a second print head to form the conductor layer on the insulation layer. Furthermore, the metallic material may include silver, tin, copper, aluminum, or alloys thereof. In particular, aluminum alloys or solder may be used as the metallic material. Furthermore, high-temperature thermoplastics may be used as the electrical insulation material, optionally with additives. Using dedicated print heads for the conductor and insulator allows for flexible printing of structures of the conductor arrangement with improved heat resistance and dielectric strength. In particular, the fused deposition method, which extrudes the metallic material of the conductor to form the conductor layer on the insulation layer, allows for flexible production of multi-layered conductor arrangements, which has a positive impact on heat resistance and dielectric strength. Furthermore, additive manufacturing using the fused deposition method allows for varying conductor cross-sections, which is particularly advantageous for coil heads, but also for concave coil geometries.

[0019] The control unit enables dynamic adjustment of the print head, thereby enabling the rapid and cost-effective realization of complex conductor arrangements by extrusion. The control unit's means for executing the method include, for example, a digital logic module, particularly a microprocessor, a microcontroller, an FPGA (field programmable gate array), or an ASIC (application-specific integrated circuit), configured to operate an arrangement for material extrusion.

[0020] Furthermore, the concave recess of the insulating layer can have a semicircular, semi-elliptical or segmented cross section. For example, a metallic material, which can have a low viscosity during extrusion, can be introduced into the concave recess of the insulating layer or at least held there until solidification, thereby facilitating extrusion.

[0021] Another embodiment provides for the first and second extrusions to be performed synchronously. Synchronous extrusion is understood to mean that the extrusion occurs during the printing process using the first and second print heads. This allows for an optimized connection between the conductor layer and the insulation layer, which has a positive impact on the thermal resistance and dielectric strength of the conductor arrangement. Furthermore, synchronous extrusion saves production time.

[0022] Another embodiment provides that the method includes, as a further step, a first extrusion of an electrically insulating material by means of a first print head to form the insulating layer of the conductor arrangement on the conductor layer, wherein the outer surface of the conductor layer is completely in contact with the electrically insulating material. The conductor layer is thus completely surrounded by the insulating layer in the region of the outer surface, thereby achieving high thermal resistance and dielectric strength.

[0023] Another embodiment provides that the extrusion of the electrically insulating material and the metallic material is carried out helically to form a helical winding of the coil. In addition, such a coil can be provided for the winding of a rotating electrical machine, in particular a tooth-wound coil winding.

[0024] Another embodiment provides for supplying an inert gas into the extrusion region of the respective layer during the first and / or second extrusion. The inert gas may comprise, for example, argon or nitrogen to prevent oxidation of the extruded material. Furthermore, the suitable supply of inert gas allows the extruded material to be cooled to a defined temperature range.

[0025] Another embodiment provides that the electrically insulating material contains glass. For example, the electrically insulating material is quartz glass or borosilicate glass. By using such glass, an optimized dielectric strength and partial discharge resistance of the conductor arrangement are achieved.

[0026] Another embodiment provides that the metal material contains copper, aluminum, silver or an alloy thereof. Such metal materials have low electrical resistance, thereby generating very little heat loss and very little thermal load.

[0027] Another embodiment provides that the first and / or second print head has a nozzle containing platinum and / or molybdenum. These metals have very high melting points and enable the extrusion of materials with high melting points. Furthermore, these materials are advantageous because other metals, such as steel, can corrode the metal via diffusion processes, for example, against molten glass.

[0028] Another embodiment provides that the filaments in the extrusion head are heated by induction during extrusion. Heating by induction in the extrusion head is efficient and enables precise adjustment of high extrusion temperatures.

[0029] Another embodiment provides that the insulating layer is cooled after the first extrusion so that the molding occurs at a viscosity that is at least 10 times, particularly at least 100 times, and even more particularly at least 1000 times lower. For example, the viscosity of the molten glass during extrusion is η = 102 dPa·s. Molding occurs, for example, at a viscosity in the range of 103 dPa·s to 107 dPa·s, particularly 104 dPa·s to 106 dPa·s. The lower viscosity makes the glass more viscous, which can achieve a more stable molding result. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The present invention will be described and explained in detail below based on the embodiments shown in the drawings.

[0031] Here it is shown:

[0032] Figure 1 A schematic diagram showing a printing device,

[0033] Figure 2 A schematic diagram showing a method for producing a conductor arrangement,

[0034] Figure 3 A schematic enlarged diagram showing the method during the second extrusion of the conductor layer,

[0035] Figure 4 A schematic enlarged view showing the method during the first extrusion of the insulating layer,

[0036] Figure 5 A schematic enlarged view showing the method during the molding of an insulator. DETAILED DESCRIPTION

[0037] The exemplary embodiments described below are preferred embodiments of the present invention. In these exemplary embodiments, the components described in the exemplary embodiments each represent features of the present invention that are to be considered independently of one another, each independently improves the present invention, and are therefore also considered part of the present invention individually or in combinations other than those shown. Furthermore, the described embodiments can also be supplemented by other already described features of the present invention.

[0038] In the different figures, the same reference numerals have the same meaning.

[0039] Figure 1 A printing apparatus 2 is shown having a first print head 4, a second print head 6, and a molding device 8 disposed between the first print head 4 and the second print head 6. The printing apparatus 2 is configured for use in a fused deposition system. The print heads 4, 6 each have an extruder 10 and a nozzle 12. The nozzle 12 may comprise, for example, platinum and / or molybdenum and have an induction coil 14 configured to heat a filament 16 in the nozzle 12. The print heads 4, 6 are configured for synchronous extrusion in a printing direction 18.

[0040] By way of example, the first print head 4 is configured to extrude an electrically insulating material 20, such as glass, in particular quartz glass or borosilicate glass, while the second print head 6 is configured to extrude a metallic material 22, such as copper, aluminum, silver, or an alloy thereof. Alternatively, the first print head 4 can be configured to extrude the metallic material 22, while the second print head 6 is configured to extrude the electrically insulating material 20. The print heads are configured to melt the respective materials 20, 22, in particular completely melt them, during extrusion of A, C.

[0041] The shaping device 8 arranged between the print heads 4, 6 has a shaping template 24. The shaping template 24 is configured to shape the layer extruded by the first print head 4. For example, the shaping template 24 of the shaping device 8 is configured to insert recesses, in particular concave recesses, into the layer extruded by the first print head 4.

[0042] Furthermore, the printing device 2 includes a gas jet 26, which is respectively assigned to one of the print heads 4, 6 and is configured to supply an inert gas into the extrusion region, whereby, for example, the extruded electrically insulating material 20 can be cooled by the supplied inert gas to a defined temperature range for molding using the molding device 8. The inert gas contains, for example, argon or nitrogen to prevent oxidation of the extruded material 20, 22.

[0043] The print heads 4 , 6 can each be arranged so as to be rotatable by angles α1 , α2 relative to the shaping device 8 and to be displaceable by distances d1 , d2 , so that even complex geometries can be produced. Control is performed by means of a control unit 28 .

[0044] Figure 2 Schematic diagram of a method for manufacturing a conductor arrangement 30 is shown. By way of example, the conductor arrangement 30 is manufactured using a method according to Figure 1 The method is implemented by a printing device 2. The method includes a first extrusion A of electrically insulating material 20 using a first print head 4 to form an insulating layer 32 of a conductor arrangement 30, shaping B of the insulating layer 32 to form a concave recess 34 in the insulating layer 32, and a second extrusion C of metallic material 22 using a second print head 6 to form a conductor layer 36 of the conductor arrangement 30 in the concave recess 34 of the insulating layer 32. During extrusions A and C, the electrically insulating material 20 and the metallic material 22 are completely melted. The first extrusion A, shaping B, and the second extrusion C are performed simultaneously in the printing direction 18. The concave recess 34 of the insulating layer 32 has a semicircular, semi-elliptical, or segmented cross-section.

[0045] Exemplarily, the extrusion A, C of the electrically insulating material 20 and the metallic material 22 and the shaping B is performed spirally for forming a spiral winding of the coil 38. The electrically insulating material 20 can comprise a glass, for example a quartz glass or a borosilicate glass. The metallic material 22 can comprise copper, aluminum, silver or one of their alloys. In particular, the viscosity of the extruded glass is less than the viscosity of the extruded metal, the viscosity of the extruded glass is in particular reduced by supplying an inert gas, in order to enable a stable shaping B. The extrusion of the metallic material 22 with the smaller viscosity is made simple by the concave recess 34 of the insulating layer 32. The metallic material 22 in the concave recess of the insulating layer 32 is solidified by supplying an inert gas.

[0046] Figure 3 A schematic enlarged view of the method during the second extrusion C of the conductor layer 36 is shown, the metallic material 22 is extruded into the concave recess 34 of the insulating layer 32 to form the conductor layer 36. An inert gas is supplied for cooling and to prevent oxidation of the metallic material 22 in the extrusion area 40 of the conductor layer 36, for example via the gas jet head 26.

[0047] Figure 4 A schematic enlarged view of the method during the first extrusion A of the insulating layer 32 is shown, the electrically insulating material 20 is extruded by means of the first print head 4 for forming the insulating layer 32 on the conductor layer 36. An inert gas is supplied for cooling in the extrusion area 40 of the insulating layer 32, for example via the gas jet head 26. The shell surface 42 of the conductor layer 36 is completely in contact with or completely surrounded by the electrically insulating material 20 by the upper and lower insulating layer 32.

[0048] Figure 5 A schematic enlarged view of the method during the shaping B of the insulating layer is shown, the shaping mold 24 shapes the concave recess 34 of the insulating layer 32 to have a cross section with for example a semi-elliptical shape. The excess material of the extruded electrically insulating material 20 is removed via recesses 44 of the side of the shaping mold 24. Furthermore, the shaping mold 24 can comprise tungsten or molybdenum.

[0049] In general, the invention relates to a method for manufacturing a conductor device 30 by means of a printing device 2, which is configured for use in a fused deposition system. In order to achieve an improved heat resistance and dielectric strength of the conductor device 30, it is proposed that the printing device 2 has a first print head 4 and a second print head 6, the method comprising the following steps: first extrusion A of an electrically insulating material 20 by means of the first print head 4 for forming an insulating layer 32 of the conductor device 30; second extrusion C of a metallic material 22 by means of the second print head 6 for forming a conductor layer 36 of the conductor device 30 on the insulating layer 32, the electrically insulating material 20 and / or the metallic material 22 being melted, in particular completely melted, during the extrusion A, C.

Claims

1. A method for producing a conductor arrangement (30) by means of a printing device (2), the printing device being configured for use in a fused deposition system, in, The printing device (2) has a first print head (4) and a second print head (6), wherein the printing device (2) has a forming device (8) arranged between the first print head (4) and the second print head (6), The method comprises the following steps: - a first extrusion (A) of an electrically insulating material (20) by means of said first print head (4) to form an insulating layer (32) of said conductor arrangement (30), - shaping (B) the insulating layer (32) after the first extrusion (A) to form a concave recess (34) in the insulating layer (32), - extruding (C) a metallic material (22) a second time by means of the second print head (6) to form a conductor layer (36) of the conductor arrangement (30) on the insulating layer (32), wherein the electrically insulating material (20) and / or the metallic material (22) are extruded (A, C) melting, in particular completely melting, during Wherein, the second extrusion (C) of the metal material (22) is performed in the concave recess (34) of the insulating layer (32).

2. The method according to claim 1, wherein The first extrusion (A) and the second extrusion (C) are performed in a synchronous manner.

3. The method according to any one of claims 1 to 2, comprising the steps of: - extruding (A) the electrically insulating material (20) for the first time by means of the first print head (4) to form the insulating layer (32) of the conductor arrangement (30) on the conductor layer (36), wherein the shell surface (42) of the conductor layer (36) is completely in contact with the electrically insulating material (20).

4. A method according to any one of the preceding claims, wherein The extrusion (A, C) of the electrically insulating material (20) and the metallic material (22) is performed helically to form a helical winding of a coil (38).

5. A method according to any one of the preceding claims, wherein An inert gas is supplied in the extrusion region (40) of the respective layer (32, 36) during the first extrusion (A) and / or the second extrusion (C).

6. A method according to any one of the preceding claims, wherein The electrically insulating material (20) comprises glass.

7. A method according to any one of the preceding claims, wherein The metal material (22) comprises copper, aluminum, silver or an alloy of copper, aluminum and silver.

8. The method according to any one of the preceding claims, in, The first print head (4) and / or the second print head (6) has a nozzle (12), which contains platinum and / or molybdenum, Therein, the filament (16) in the nozzle (12) is heated by means of induction during extrusion (A, C).

9. A method according to any one of the preceding claims, wherein After the first extrusion (A), the insulation layer (32) is cooled so that the shaping (B) is performed with a viscosity that is reduced by at least 10 times, in particular by at least 100 times, and more particularly by at least 1000 times.

10. A conductor arrangement (30) manufactured using the method according to any one of the preceding claims.

11. A control unit (28) having means for carrying out the method according to any one of claims 1 to 9.

12. A computer program product for carrying out the method according to any one of claims 1 to 9 during operation in a control unit (28) according to claim 11.

13. A printing device (2) for producing a conductor device (30), the printing device being configured for use in a fused deposition system, the printing device comprising a first printing head (4) and a second printing head (6), in, The printing device (2) has a forming device (8), which is arranged between the first print head (4) and the second print head (6), wherein the first print head (4) is configured to extrude an electrically insulating material (20) to form an insulating layer (32) of the conductor arrangement (30), wherein the second print head (6) is configured to extrude a metal material (22) to form a conductor layer (36) of the conductor device (30), wherein, during extrusion (A, C), the first print head (4) is configured to melt the electrically insulating material (20), and / or the second print head (6) is configured to melt the metallic material (22), in particular completely, The forming device (8) is configured to form a concave recess (34) in the insulating layer (32) after extruding the electrically insulating material (20).

14. The printing device (2) according to claim 13, wherein: The print heads (4, 6) are configured for synchronized extrusion (A, C).

15. The printing device (2) according to claim 13 or 14, comprising at least one air jet head (26) configured to supply an inert gas in the extrusion region (40).

16. The printing device (2) according to any one of claims 13 to 15, wherein: The first print head (4) and / or the second print head (6) has a nozzle (12) containing platinum and / or molybdenum and an induction coil (14), wherein the induction coil is configured to heat a filament (16) in the nozzle (12).

17. The printing device (2) according to any one of claims 13 to 16, wherein: The first print head (4) is configured to extrude glass, and / or the second print head (6) is configured to extrude one of copper, aluminum, silver or an alloy of copper, aluminum and silver.

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