Reaction kettle device for non-sintered quartz glass micro-fluidic chip and experimental method

Abstract

The invention discloses a reaction kettle device for a non-sintered quartz glass micro-fluidic chip. The reaction kettle device comprises a reaction kettle bottom plate, a cover plate, an upper groove water injection channel, a lower groove water injection channel and a bolt structure. The invention further discloses a corresponding experimental method. The chip is subjected to isobaric lamination through the water pressure of the upper and lower water injection cavities, a traditional sintering process is replaced, and the problem that the sintered chip cannot be detached and reused is solved. Liquid pressure fitting avoids stress concentration of a rigid clamp, is suitable for fragile materials such as quartz glass, and reduces the risk of fracture. After the experiment, the chip can be disassembled and thoroughly cleaned, so that the reusability is improved, and the material consumption and the experiment cost are reduced. The device is made of high-pressure-resistant and corrosion-resistant materials, injection ports are accurately aligned, bolts are uniformly distributed to ensure reliable sealing, and the device is suitable for high-temperature and high-pressure reaction experiments in the field of petroleum engineering.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of microfluidic chip, and particularly relates to a reaction kettle device for a non-sintered quartz glass microfluidic chip in the field of petroleum engineering. BACKGROUND

[0002] I. Technical scenario As a core platform for formation fluid reaction simulation in the field of petroleum engineering, the quartz glass material of the microfluidic chip is widely used in high-temperature and high-pressure reaction experiments such as CO2 displacement and shale gas exploitation due to its high-temperature resistance (>1000 DEG C), chemical inertness (resistant to strong acid and strong alkali corrosion) and optical transparency (convenient for real-time observation of micro flow field). The packaging technology of the traditional quartz glass (brittle material) microfluidic chip is the key to realizing high-pressure sealing (the simulated formation pressure can reach 30 MPa), which directly determines the accuracy of experimental data and the service life of the chip.

[0003] In the visualization displacement experiment of tight oil reservoir, shale oil reservoir and complex fracture system, the microfluidic chip is used to 1:1 replicate the rock pore network so as to observe the percolation mechanism of crude oil, water and gas in the porous medium under the microscope. In order to simulate the formation conditions, the chip must be able to withstand an injection pressure of at least 10 MPa (megapascal) or more, and the internal channel width is often only a few tens of microns. Therefore, the experimental platform has high requirements for the high-pressure sealing performance, structural integrity and visualization clarity of the chip.

[0004] The current industry practice is as follows: Quartz glass is selected as the chip substrate, and its high light transmittance, high Young's modulus and chemical corrosion resistance are utilized; A sintering process is adopted to permanently bond the cover plate and the bottom plate to form an integral whole. After sintering, the overall strength of the chip is significantly improved, and the chip can be operated under high pressure for a long time without breaking; An external hydraulic or pneumatic confining pressure system is used to provide additional lateral constraint for the chip, further reducing the risk of explosion.

[0005] The above structure has supported a large number of high-pressure visualization experiments in the past ten years, providing valuable micro percolation data for unconventional oil and gas development and laying a technical foundation.

[0006] II. Deficiencies of the prior art and direct technical reasons and historical development reasons 1. The chip cannot be disassembled after sintering, and once the channel is contaminated by crude oil, emulsion or solid particles, the whole chip is scrapped.

[0007] Direct technical reason: sintering relies on the diffusion bonding of quartz glass molecules at high temperature, which is irreversible, resulting in the integration of the chip into a single rigid body, which cannot be reopened and cleaned.

[0008] Historical development reasons: Early microfluidic chips originated from MEMS silicon wafer bonding process, and quartz glass chips directly follow the "high temperature permanent bonding" route; Later, high pressure demand emerged, and the industry continued to increase sintering temperature and time on this path, rather than questioning the "permanent bonding" itself.

[0009] 2. When the mechanical clamp replaces sintering, the brittle quartz glass is fragile and the seal is unstable.

[0010] The technical reason is: the traditional clamp transmits concentrated load through a metal pressing plate and an elastic gasket. Although the Young's modulus of quartz glass is high, its fracture toughness is extremely low, and local stress concentration can produce microcracks. When the high pressure fluctuates, the difference in clamp resilience further amplifies the stress unevenness.

[0011] Mechanical clamping originated from the early low-pressure PDMS chip packaging experience, which was directly transferred to the high-strength quartz glass scene, ignoring the essential differences in material properties.

[0012] 3. The confining pressure loading system is complex and the operation is lengthy.

[0013] The direct technical reason is that the external hydraulic / pneumatic system requires a high-pressure pump, a pressure stabilizing tank, a multi-channel valve group, and a safety interlock. Any leakage at any link will result in experimental failure. When the chip is replaced, it needs to be repeatedly pressurized and depressurized, and the single preparation time is > 2h (hours).

[0014] Historical development reasons: High-pressure experimental technology initially served core displacement, and large core clamps naturally required confining pressure. After the size of microfluidic chips was reduced, the experimental platform directly followed the design thinking of "large equipment" and did not redesign for micro-scale requirements.

[0015] III. Improvement necessity Because the existing technology has been long-term bound by the two path dependencies of "sintering irreversibility" and "mechanical clamping fragility", the industry urgently needs a new type of microfluidic chip packaging solution that does not require sintering to achieve high-pressure sealing, can be quickly disassembled and cleaned after the experiment, and can be operated at room temperature and atmospheric pressure. SUMMARY

[0016] The purpose of the application is to provide a reaction kettle device for non-sintered quartz glass microfluidic chips, solving the problems of non-dismountability of traditional microfluidic chip reaction kettles due to the dependence on sintering process, damage to brittle materials by rigid clamps, and the inability to reuse chips.

[0017] To achieve the above purpose, the reaction kettle device for non-sintered quartz glass microfluidic chips of the present application comprises: A reaction kettle bottom plate with a microfluidic chip groove in the center for accommodating the microfluidic chip and forming a lower water injection cavity; The lower groove water injection channel is provided at the bottom of the groove of the bottom plate of the reactor, and is used to inject water into the lower water injection cavity through the groove of the bottom plate of the reactor; the groove of the bottom plate of the reactor is communicated with the lower water injection cavity; The reactor cover has an upper groove on its inner side corresponding to the chip position and forms an upper water injection cavity; The upper groove water injection channel is provided at the top of the top plate groove and is used to inject water into the upper water injection cavity; the top plate groove is communicated with the upper water injection cavity; The bolt structure is used to fasten the reactor cover and reactor bottom plate.

[0018] The size of the microfluidic chip groove matches the microfluidic chip. A chip injection port is provided on the bottom plate of the reaction kettle, and the chip injection port corresponds to the fluid inlet channel of the microfluidic chip.

[0019] The upper groove water injection channel and the lower groove water injection channel are symmetrically arranged, and the water injection pressure can be adjusted independently.

[0020] The bolt structures are evenly distributed along the edge of the reactor, with a number of no less than 4.

[0021] The bottom plate and cover plate of the reactor are made of high-pressure and corrosion-resistant materials.

[0022] The present invention also provides a corresponding experimental method, which is carried out by using the above-mentioned reactor device for non-sintered quartz glass microfluidic chip according to the following steps: S1. Chip installation stage; Place the non-sintered quartz glass microfluidic chip in the microfluidic chip groove in the center of the reactor bottom plate, ensuring that the fluid injection port of the chip is aligned with the chip injection port on the bottom plate to complete the initial positioning of the chip; S2. Cover closing and pre-fixing; The reactor cover is placed on the bottom plate and the cover and bottom plate are preliminarily fastened by bolts to form a closed reactor cavity. The chip is now in a state of waiting to be bonded between the cover and bottom plate. S3. Water pressure bonding process; Establishing lower water pressure: Water is injected into the lower water injection cavity of the reactor bottom plate through the lower groove water injection channel. After the water fills the cavity, uniform water pressure is formed on the lower surface of the chip; Establishing upper water pressure: Water is injected into the upper water injection cavity of the reactor cover through the upper groove water injection channel, so that the upper surface of the chip is subjected to a symmetrical water pressure with the lower surface; Isobaric bonding effect: Symmetrical water pressure presses the chip cover and base tightly together, achieving a sealed fit without sintering, ensuring the stability of the chip structure during high-pressure experiments. S4. Experimental operation phase; The external fluid is injected into the internal channel of the microfluidic chip through the chip injection inlet of the bottom plate, and experiments such as oil displacement and fluid observation are performed; during the experiment, water pressure continuously acts on the surface of the chip to maintain the sealing property, so that the chip is prevented from separating or leaking under high pressure.

[0023] The present application has the following advantages: Dismountable and reusable: The water pressure isopressing technology is used to replace the traditional sintering process, the device can be disassembled after the experiment, and the microfluidic chip can be reused, which significantly reduces the material consumption and experimental cost.

[0024] Protect fragile materials: uniform isopressing is realized through liquid pressure, stress concentration caused by rigid clamps is eliminated, and the rupture of fragile chips such as quartz glass is effectively avoided, and the experimental stability is improved.

[0025] Convenient and efficient operation: without complex sintering process, the assembly and disassembly process is simplified, and the experimental preparation time is shortened; the same chip can be reused for multiple experiments, improving the operation flexibility.

[0026] Cleaning and compatibility optimization: the detachable structure facilitates thorough cleaning of residual impurities, reducing the risk of cross contamination; compatible with a variety of chemical reagents, suitable for complex reaction systems.

[0027] Precise structure and durability: the injection inlet and the chip channel are accurately aligned to ensure stable fluid introduction; the bottom plate and the cover plate are made of 316L stainless steel and other materials, which have high pressure resistance and corrosion resistance, and are suitable for harsh experimental environment.

[0028] In summary, the present application responds to the need for improvement in the prior art, and the upper and lower symmetrical water injection groove water pressure isopressing technology (reaction kettle bottom plate 1, groove 3, 7, upper and lower water injection channels 5, 9) solves the problems of material waste caused by sintering (the chip can be disassembled and cleaned after the experiment without sintering operation), brittle rupture caused by mechanical clamping, and complex operation caused by confining pressure system (no need to load confining pressure), so that the chip can be reused and the experimental process can be greatly simplified under the premise of ensuring high pressure stability. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 is a structure schematic diagram of the present application after cutting off half of the structure.

[0030] Figure 2 is a top view structure schematic diagram of the reaction kettle bottom plate.

[0031] Component name and figure mark details 1. Reaction kettle bottom plate 1 Installation position: the bottom of the device, the central part is provided with a microfluidic chip groove 3.

[0032] Working process: Place the microfluidic chip in the groove, and tighten it with the cover plate 2 through the bolt structure 10 to form a closed cavity.

[0033] Working principle: As the basic support structure of the device, the lower water pressure is established through the bottom water injection channel 5.

[0034] Technical effect: Provide a chip mounting platform, and cooperate with the cover plate to realize water pressure sealing.

[0035] 2. Reactor cover plate 2 Installation position: The top of the device, with an upper groove 7 on the inside corresponding to the chip position.

[0036] Working process: Cover the bottom plate 1, and after pre-fixing by bolts, establish water pressure through the upper water injection channel 9.

[0037] Working principle: Form a symmetrical cavity structure with the bottom plate, and realize stress-free lamination of the chip through liquid pressure transmission.

[0038] Technical effect: Provide an upper water pressure cavity 8 to realize isobaric sealing with the bottom plate.

[0039] 3. Microfluidic chip groove 3 Installation position: The center of the reactor bottom plate 1, with a size matching the microfluidic chip.

[0040] Working process: Contain the chip and preliminarily position it.

[0041] Working principle: Limit the displacement of the chip through the size of the groove to realize accurate installation.

[0042] Technical effect: Ensure the position of the chip is fixed to avoid fluid leakage or misplacement during the experiment.

[0043] 4. Lower water injection cavity (4) Installation position: Between the microfluidic chip groove 3 and the lower surface of the chip.

[0044] Working process: Inject water through the lower groove water injection channel 5 to form uniform lower surface water pressure.

[0045] Working principle: The liquid pressure uniformly acts on the bottom of the chip, replacing the rigid clamp to realize lamination.

[0046] Technical effect: Provide lower lamination pressure to avoid chip rupture due to stress concentration.

[0047] 5. Lower groove water injection channel 5 Installation position: The bottom of the reactor bottom plate groove 6, connected to the lower water injection cavity 4.

[0048] Working process: Connect the water injection device (such as a micro water pump) to inject water into the cavity 4 and adjust the pressure.

[0049] Working principle: Establish controllable water pressure through fluid transmission, and independently adjust the pressure to meet experimental requirements.

[0050] Technical effect: Achieve precise control of the lower water pressure and match the upper water pressure 8 to form symmetrical fitting.

[0051] 6. Reaction kettle bottom plate groove 6 Installation position: inside the reaction kettle bottom plate 1, surrounding the microfluidic chip groove 3.

[0052] Working process: As the connection transition structure of the lower groove water injection channel 5 and the lower water injection cavity 4.

[0053] Working principle: Guide the uniform distribution of water flow to the cavity 4 to avoid local pressure mutation.

[0054] Technical effect: Ensure stable water pressure transmission and water injection channel.

[0055] 7. Top plate groove 7 Installation position: inside the reaction kettle cover plate 2, corresponding to the chip position, symmetrical with the bottom plate groove 6.

[0056] Working process: Water injection structure of the upper water injection cavity 8, inject water through the upper groove water injection channel 9.

[0057] Working principle: Cooperate with the bottom plate groove 6 to form a symmetrical water injection structure, realize the chip upper and lower surface isobaric or pressure controllable water injection.

[0058] Technical effect: Ensure stable water pressure transmission and water injection channel.

[0059] 8. Upper water injection cavity 8 Installation position: between the top plate groove 7 and the upper surface of the chip.

[0060] Working process: Inject water through the upper groove water injection channel 9 to form symmetrical water pressure with the lower cavity 4.

[0061] Working principle: Liquid pressure acts vertically on the top of the chip, and together with the lower water pressure to realize stress-free fitting.

[0062] Technical effect: Balance the stress of the chip to avoid deformation or separation of the chip under high pressure.

[0063] 9. Upper groove water injection channel 9 Installation position: top of the top plate groove 7, connecting the upper water injection cavity 8.

[0064] Working process: External water injection device, inject water into the upper cavity 8 and independently adjust the pressure.

[0065] Working principle: Symmetrical to the lower water injection channel 5, the adhesion strength is controlled by pressure difference.

[0066] Technical effect: Water injection channel, auxiliary realization of upper water pressure precise regulation, adapt to different experimental pressure demand.

[0067] 10. Bolt structure 10 Installation position: evenly distributed along the edge of the reaction kettle, the number is not less than 4.

[0068] Working process: pre-tighten the cover plate 2 and the bottom plate 1 to form an initial seal, and assist in fixing when the water pressure is adhered.

[0069] Working principle: avoid local gap and prevent water pressure leakage by evenly distributed bolt force.

[0070] Technical effect: ensure the stability of the overall structure of the device, suitable for long-term or dynamic pressure experiment.

[0071] 11. Chip injection port 11 Installation position: on the bottom plate 1 of the reaction kettle, corresponding to the fluid inlet channel of the microfluidic chip.

[0072] Working process: external fluid is injected into the internal channel of the chip through this port during the experiment.

[0073] Working principle: precisely align the chip fluid inlet to ensure that the fluid is introduced without leakage.

[0074] Technical effect: improve the reliability of experimental data, avoid fluid leakage pollution or pressure loss. DETAILED DESCRIPTION

[0075] As shown in Figure 1 and Figure 2 , a reaction kettle device for non-sintered quartz glass microfluidic chip of the application comprises: The reaction kettle bottom plate 1 is provided with a microfluidic chip groove 3 in the center, which is used to accommodate the microfluidic chip and form a lower water injection cavity 4; The lower groove water injection channel 5 is arranged at the bottom of the reaction kettle bottom plate groove 6, which is used to inject water into the lower water injection cavity 4 through the reaction kettle bottom plate groove 6; the reaction kettle bottom plate groove 6 is communicated with the lower water injection cavity 4; The reaction kettle cover plate 2 is provided with an upper groove on the inner side corresponding to the chip position and forms an upper water injection cavity 8; The upper groove water injection channel 9 is arranged at the top of the top plate groove 7, which is used to inject water into the upper water injection cavity 8; the top plate groove 7 is communicated with the upper water injection cavity 8; The bolt structure 10 is used to fasten the reaction kettle cover plate 2 and the reaction kettle bottom plate 1.

[0076] The application can realize sealing and fitting without sintering: the water pressure of the upper water injection cavity and the lower water injection cavity is used to isostatic fit the chip, replacing the traditional sintering process, and solving the problem that the chip cannot be disassembled and reused after sintering.

[0077] The application can avoid damage to the chip by rigid clamps: the liquid pressure fitting method avoids stress concentration of external rigid clamps, is suitable for brittle materials such as quartz glass, and reduces the risk of chip breakage.

[0078] The application can improve reusability: the chip can be easily disassembled and thoroughly cleaned after the experiment, and residual impurities can be removed, thereby significantly reducing material consumption and experimental cost.

[0079] The size of the microfluidic chip groove 3 matches the microfluidic chip, the reaction kettle bottom plate 1 is provided with a chip injection port 11, and the chip injection port 11 corresponds to the fluid inlet channel of the microfluidic chip.

[0080] The application realizes accurate positioning and fluid tightness: the groove size matches the chip to ensure accurate positioning during installation, the injection port is designed correspondingly to avoid experimental fluid leakage, and the reliability of experimental data is improved.

[0081] The upper groove water injection channel 9 and the lower groove water injection channel 5 are symmetrically arranged, and the water injection pressure can be independently adjusted.

[0082] The symmetrical water pressure of the upper groove water injection channel 9 and the lower groove water injection channel 5 makes the upper and lower surfaces of the chip bear force uniformly, prevents the chip from separating or deforming when high-pressure injection is performed, and reduces the risk of breakage; independent pressure adjustment can adapt to different experimental pressure requirements. Independent pressure adjustment can be realized by connecting different water injection devices (such as micro water pumps) through the upper groove water injection channel 9 and the lower groove water injection channel 5, or by connecting the same water injection device but setting pressure regulating valves on the upstream of the upper groove water injection channel 9 and the lower groove water injection channel 5, which are all prior art and will not be described in detail.

[0083] The bolt structure 10 is uniformly distributed along the edge of the reaction kettle, and the number is not less than 4.

[0084] The bolt structure 10 is uniformly provided with a plurality of bolt structures, realizing uniform fastening and sealing reliability; the uniformly distributed bolts on the edge ensure that the cover plate and the bottom plate are tightly fitted, avoid water pressure leakage caused by local gaps, and are suitable for long-term or dynamic pressure experiments.

[0085] The material of the reaction kettle bottom plate 1 and the cover plate 2 is a high-pressure-resistant and corrosion-resistant material.

[0086] The reaction kettle bottom plate 1 and the cover plate 2 can be made of metal materials such as stainless steel (such as 316L), titanium alloy, nickel-based alloy (such as hastelloy), or engineering plastics such as polytetrafluoroethylene and polyether ether ketone (PEEK), and preferably made of stainless steel (such as 316L).

[0087] The high-pressure resistance of the reactor bottom plate 1 and the cover plate 2 meets the high-pressure fluid injection requirements in the field of petroleum engineering, and the corrosion resistance avoids the erosion of experimental fluids (such as crude oil and chemical reagents) to the device, prolonging the service life.

[0088] The detailed working process of the present application is as follows: 1. Chip mounting stage Place the non-sintered quartz glass microfluidic chip in the microfluidic chip groove in the center of the reactor bottom plate, ensure that the fluid injection port of the chip is aligned with the chip injection port on the bottom plate, and complete the preliminary positioning of the chip.

[0089] 2. Cover plate closing and pre-fixing Cover the reactor cover plate on the bottom plate, and preliminarily fasten the cover plate and the bottom plate through the bolt structure to form a closed reactor cavity, and at this time the chip is in a state of waiting to be fitted between the cover plate and the bottom plate.

[0090] 3. Water pressure fitting process Lower water pressure establishment: inject water into the lower water cavity of the reactor bottom plate through the lower groove water channel, and form uniform water pressure on the lower surface of the chip after the cavity is filled with water.

[0091] Upper water pressure establishment: simultaneously inject water into the upper water cavity of the reactor cover plate through the upper groove water channel, so that the upper surface of the chip is subjected to water pressure symmetrically with the lower surface.

[0092] Isobaric fitting effect: the upper and lower symmetric water pressure tightly presses the chip cover plate and the bottom plate, realizes the sealing fitting without sintering, and ensures the stability of the chip structure during high-pressure experiment.

[0093] 4. Experimental operation stage External fluid is injected into the microfluidic chip internal channel through the chip injection port of the bottom plate for oil displacement, fluid observation and other experimental operations. During the experiment, the water pressure continuously acts on the surface of the chip to maintain the sealing property, avoiding chip separation or leakage under high pressure.

[0094] 5. Disassembly and cleaning after experiment Pressure relief operation: after the experiment is completed, the water pressure in the upper and lower water cavities is released, and the fitting force on the chip is removed.

[0095] Disassembly and cleaning: unscrew the bolt structure, separate the cover plate and the bottom plate, take out the chip for thorough cleaning, remove the internal residual impurities such as crude oil and emulsion, and the cleaned chip can be reused for subsequent experiments.

[0096] The key features of the present application are as follows: No sintering and reuse: Water pressure bonding replaces the traditional sintering process to achieve non-destructive chip disassembly and reuse, reducing experimental costs.

[0097] Pressure-adaptive sealing: Liquid pressure bonding avoids stress concentration problems associated with rigid fixtures, protects fragile glass chips, and adapts to dynamic pressure testing requirements.

[0098] Simplified operation process: No complex confining pressure system is required at normal temperature and pressure, shortening experimental preparation time and improving platform flexibility.

[0099] The above embodiments are only used to illustrate rather than limit the technical solutions of the present invention. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that the present invention can still be modified or replaced by equivalents. Any modification or partial replacement that does not depart from the spirit and scope of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A reactor device for non-sintered quartz glass microfluidic chips, characterized in that: include: A reactor bottom plate (1) is provided with a microfluidic chip groove (3) in the center for accommodating the microfluidic chip and forming a lower water injection cavity (4); The lower groove water injection channel (5) is provided at the bottom of the reactor bottom plate groove (6) and is used for injecting water into the lower water injection cavity (4) through the reactor bottom plate groove (6); the reactor bottom plate groove (6) is in communication with the lower water injection cavity (4); The reactor cover (2) has an upper groove on its inner side corresponding to the chip position and forms an upper water injection cavity (8); An upper groove water injection channel (9) is provided at the top of the top plate groove (7) and is used to inject water into the upper water injection cavity (8); the top plate groove (7) is in communication with the upper water injection cavity (8); The bolt structure (10) is used to fasten the reactor cover plate (2) and the reactor bottom plate (1).

2. The reactor device for non-sintered quartz glass microfluidic chip according to claim 1, characterized in that: The size of the microfluidic chip groove (3) matches the microfluidic chip, and a chip injection port (11) is provided on the bottom plate (1) of the reactor, and the chip injection port (11) corresponds to the fluid inlet channel of the microfluidic chip.

3. The reactor device for non-sintered quartz glass microfluidic chip according to claim 1, characterized in that: The upper groove water injection channel (9) and the lower groove water injection channel (5) are symmetrically arranged, and the water injection pressure can be adjusted independently.

4. The reactor device for non-sintered quartz glass microfluidic chip according to claim 1, characterized in that: The bolt structures (10) are evenly distributed along the edge of the reactor, and the number is not less than 4.

5. The reactor device for non-sintered quartz glass microfluidic chip according to claim 1, characterized in that: The reactor bottom plate (1) and the cover plate (2) are made of high-pressure-resistant and corrosion-resistant materials.

6. Experimental method: using the reactor device for non-sintered quartz glass microfluidic chip according to claim 2, the following steps are carried out: S1. Chip installation stage; Place the non-sintered quartz glass microfluidic chip in the microfluidic chip groove in the center of the reactor bottom plate, ensuring that the fluid injection port of the chip is aligned with the chip injection port on the bottom plate to complete the initial positioning of the chip; S2. Cover closing and pre-fixing; The reactor cover is placed on the bottom plate and the cover and bottom plate are preliminarily fastened by bolts to form a closed reactor cavity. At this time, the chip is in a state of waiting to be bonded between the cover and bottom plate. S3. Water pressure bonding process; Establishing lower water pressure: Water is injected into the lower water injection cavity of the reactor bottom plate through the lower groove water injection channel. After the water fills the cavity, uniform water pressure is formed on the lower surface of the chip; Establishing upper water pressure: Water is injected into the upper water injection cavity of the reactor cover through the upper groove water injection channel, so that the upper surface of the chip is subjected to a symmetrical water pressure with the lower surface; Isobaric bonding effect: Symmetrical water pressure presses the chip cover and base tightly together, achieving a sealed fit without sintering, ensuring the stability of the chip structure during high-pressure experiments. S4. Experimental operation phase; External fluid is injected into the internal channel of the microfluidic chip through the chip injection port on the bottom plate to perform experimental operations such as oil displacement and fluid observation. During the experiment, water pressure continuously acts on the chip surface to maintain the fit and seal, preventing chip separation or leakage under high pressure.

Images