Pin processing and forming device for electronic element

By designing a multi-module pin processing and forming device, the problems of deformation, uneven cutting and surface damage of electronic component pins during the processing process are solved, the precise forming and stability of the pins are achieved, and the performance and reliability of electronic products are improved.

CN120790798AActive Publication Date: 2025-10-17SHENZHEN CHUANGJINGRUI ELECTRONICS
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Patent Information

Application Number
CN202511281976.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-09-09
Publication Date
2025-10-17
Estimated Expiration
2045-09-09

AI Technical Summary

Technical Problem

During the processing, the pins of electronic components are prone to deformation, uneven cutting, and surface damage, which affects the welding effect and electrical connection stability, resulting in reduced performance and reliability of electronic products.

Method used

A pin processing and forming device is designed, which includes multiple modules such as a driving belt, a detection mechanism, a forming mechanism, and a cutting mechanism. The electronic components are transmitted by the driving belt, the detection mechanism is used to ensure accurate positioning, the forming mechanism performs precise forming, and the cutting mechanism ensures consistent length. The device is combined with a magnet to prevent offset and an anti-bending mechanism to prevent bending, thereby achieving stable pin processing.

Benefits of technology

It improves the precision and efficiency of pin processing, avoids the errors and damage risks of traditional manual operations, ensures the stable and reliable quality of pin molding, improves the welding effect and electrical connection stability of electronic components, and reduces the defective rate.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The invention relates to a pin processing and forming device for an electronic component, and the device comprises an operation table which is rotatably provided with a driving belt, and the driving belt is provided with a plurality of bearing plates which are used for bearing the electronic component; one side, close to the driving belt, of the detection mechanism is arranged on the operation table, and the detection mechanism is used for detecting the electronic elements on the bearing plate; and the forming mechanism is used for forming the pins of the electronic elements. Automatic machining forming of the electronic element pins is achieved, manual intervention can be effectively reduced, the machining precision and speed are improved, and the machining quality of the electronic element pins is guaranteed.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic component processing, and in particular to a pin processing and forming device for electronic components. BACKGROUND

[0002] At present, the processing of electronic components is a key link. The processing and forming quality of the pins of electronic components directly affects the welding effect and electrical connection stability on the circuit board, and plays a decisive role in the performance and reliability of the entire electronic product.

[0003] Conventionally, the processing and forming of the pins of electronic components is mainly operated by comprehensive automatic equipment. In the actual processing process, some problems may occur in the pins. In the forming process, the pins may be deformed due to uneven stress, resulting in that the shape of the pins does not meet the design requirements; in the cutting process, the cutting may not be neat, affecting the length consistency of the pins; moreover, in the process of transporting and moving the electronic components, the pins may be collided or rubbed, resulting in that the pins are damaged or the positions are deviated, causing the phenomenon of bending, and thus affecting the electrical performance. The deformed pins may not be accurately inserted into the jack of the circuit board, the cutting not neat may result in that the lengths of the pins are inconsistent, affecting the welding effect and electrical connection stability, and the surface damage may reduce the conductivity of the pins, thereby affecting the performance and reliability of the entire electronic product.

[0004] In view of the above related technologies, it is necessary to propose a pin processing and forming device for electronic components to solve one of the above technical problems. SUMMARY

[0005] In order to solve one of the above technical problems, the present application provides a pin processing and forming device for electronic components.

[0006] The pin processing and forming device for electronic components provided by the present application adopts the following technical solution: A pin processing and forming device for electronic components, comprising: an operation table, a driving belt is rotatably arranged on the operation table, a plurality of bearing plates are arranged on the driving belt, and the bearing plates are used for bearing electronic components; a detection mechanism, which is arranged on the operation table close to one side of the driving belt and is used for detecting the electronic components on the bearing plates; and The utility model relates to a forming mechanism for the pin forming of electronic components, which comprises a fixed frame arranged near one side of the driving belt, a forming table arranged on the fixed frame, a sliding block slidingly arranged at the forming table, and a pressing block arranged above the forming table, wherein the top of the forming table is provided with a forming groove near one side of the driving belt, the bottom of the forming table is provided with a sliding groove, the sliding block is slidingly arranged in the sliding groove, the top of the sliding block is provided with a forming piece on one side corresponding to the forming groove, the top of the forming table is provided with a positioning frame, the positioning frame is provided with a lifting cylinder group, the output end of the lifting cylinder group is provided with a combination plate, and the output end of the lifting cylinder group is connected with the pressing block through the combination plate.

[0007] By adopting the above technical scheme, the electronic component is placed on the bearing plate and sequentially passes through the detection mechanism and the forming mechanism with the rotation of the driving belt; the detection mechanism can accurately detect the electronic component on the bearing plate, ensuring the accurate position of the component to be processed; then, the electronic component is sent to the forming mechanism, the sliding block slides in the sliding groove to move the forming piece into the forming groove, the lifting cylinder group drives the pressing block to descend, and the pressing block cooperates with the forming piece to accurately perform the pin forming operation on the electronic component; this scheme not only improves the precision and efficiency of the pin processing, but also effectively avoids the errors and damage risks that may be caused by traditional manual operation, ensuring the stable and reliable pin forming quality of the electronic component.

[0008] Optionally, the forming table is provided with a protection block slidingly arranged at the rear end corresponding to the forming groove, the front end face of the protection block is provided with a V-shaped groove, the top of the fixed frame is provided with a first driving cylinder and a second driving cylinder away from one side of the forming table, the output end of the first driving cylinder and the second driving cylinder is provided with a connecting piece, the output end of the first driving cylinder is connected with the tail end of the protection block through the connecting piece, so that the inner side of the V-shaped groove at the protection block abuts against and protects the head of the electronic component, the output end of the second driving cylinder is connected with the tail end of the sliding block through the connecting piece, and when the protection block cooperates with the forming piece on the sliding block to perform the pin forming on the electronic component in the forming groove, the head and the pin of the electronic component are limited.

[0009] By adopting the technical scheme, the protection block arranged at the rear end of the forming table can effectively protect the head of the electronic component during the pin forming process, avoiding damage to the head of the electronic component caused by external force; the V-shaped groove design on the front end face of the protection block further improves the protection effect of the head of the electronic component, ensuring the stability of the electronic component during the processing process; in addition, the arrangement of the first driving cylinder and the second driving cylinder realizes precise control of the protection block and the sliding block, so that the protection block can be flexibly moved as needed, and the V-shaped groove at the protection block can effectively limit the forming piece at the sliding block during the pin compression forming of the electronic component in the forming groove, and better adapt to electronic components of different sizes and shapes, improving the applicability and reliability of the device.

[0010] Optionally, an adjusting frame is arranged below the fixing frame, and an adjusting cylinder group is arranged on the adjusting frame.

[0011] By adopting the above technical scheme, the connection relationship between the adjusting frame and the fixing frame can be dynamically adjusted through the adjusting cylinder group, thereby adapting to the processing requirements of different heights.

[0012] Optionally, the detection mechanism comprises a detection frame arranged on the operation table and a light column sensor for detection, and a through slot is arranged above the detection frame corresponding to the bearing plate, and the light column sensor is adjustably arranged in the through slot by a nut and is locked after position adjustment in the through slot.

[0013] By adopting the above technical scheme, the light column sensor can be flexibly adjusted in position in the through slot of the detection frame by the nut and is locked after adjustment to a suitable position; this design not only enables the detection mechanism to be accurately adapted to the size and position differences of electronic components, but also effectively improves the accuracy and reliability of detection; at the same time, the adjustability of the position of the light column sensor enhances the versatility of the device, which is suitable for detection of electronic components of various specifications, thereby reducing production cost and improving work efficiency.

[0014] Optionally, it further comprises a deviation adjusting mechanism for adjusting the position of the electronic component on the bearing plate to realize pin processing of the electronic component, and the deviation adjusting mechanism comprises a deviation adjusting frame arranged on one side of the operation table and a push block arranged on the deviation adjusting frame, and a deviation adjusting cylinder group is arranged on the top of the deviation adjusting frame, and a connecting plate is arranged at the output end of the deviation adjusting cylinder group, and the connecting plate is connected with the push block to realize horizontal position adjustment of the electronic component on the bearing plate by the push block.

[0015] By adopting the technical scheme, the position adjustment mechanism can accurately adjust the position of the electronic component on the bearing plate, ensuring the position accuracy of the electronic component during the pin processing process. The specific effects are as follows: the setting of the deviation rectifying frame and the push block provides stable structural support for the position adjustment of the electronic component. The deviation rectifying cylinder set drives the connecting plate and the push block to act, realizing accurate adjustment of the electronic component in the horizontal direction, thereby avoiding pin processing defects caused by position deviation and improving the processing yield.

[0016] Optionally, it also includes a cutting mechanism for cutting the pins of the formed electronic component. The cutting mechanism includes a cutting frame away from the forming mechanism, a cutter arranged above the cutting frame, and a receiving block arranged below the cutter on the cutting frame. A cutting cylinder is arranged on one side of the top of the cutting frame. The output end of the cutting cylinder is connected to the top of the cutter, driving the cutter to cooperate with the receiving block to cut the excess pins of the electronic component.

[0017] By adopting the technical scheme, the cutting mechanism can accurately cut the pins of the formed electronic component. Specifically, the cutting frame is arranged away from the forming mechanism, ensuring that the cutting operation and the forming operation do not interfere with each other, improving the work efficiency. The cutter is arranged above the cutting frame and cooperates with the receiving block below to form a stable cutting structure. When cutting is needed, the output end of the cutting cylinder drives the cutter to move downward. The relative movement between the cutter and the receiving block can accurately cut off the excess pin part, thereby ensuring the consistency of the length of the electronic component pins.

[0018] Optionally, a cutting clamping mechanism is arranged at the rear end of the cutting frame and relative to the cutter and the receiving block, for clamping and limiting the component head of the electronic component. The cutting clamping mechanism includes a cutting clamping cylinder arranged at the rear end of the cutting frame, a driving hinge arranged on the output end of the cutting clamping cylinder, and a clamping jaw for clamping the component head of the electronic component. The clamping jaws are respectively arranged symmetrically at the ends of the driving hinge. A limiting frame is arranged outside the cutting clamping cylinder for limiting the adjustment of the driving hinge. The opening and closing angle adjustment of the driving hinge driven by the output end of the cutting clamping cylinder realizes the clamping and separation of the clamping jaws.

[0019] By adopting the technical scheme, the cutting clamping mechanism can clamp and limit the component head of the electronic component during the cutting process, effectively avoiding the shaking or displacement of the electronic component during cutting, thereby improving the cutting precision and stability. The specific effects include that the cutting clamping cylinder drives the clamping jaws to open and close through the driving hinge, which can flexibly adapt to electronic component heads of different sizes. The setting of the limiting frame ensures that the driving hinge remains stable during adjustment, preventing over-opening and clamping failure.

[0020] Optionally, the bearing plate is provided with symmetrical bearing grooves, and a plurality of magnet pieces are arranged in the bearing grooves.

[0021] By adopting the above technical scheme, the magnet pieces can effectively adsorb the pins of the electronic components and prevent the pins from deviating during transportation, thereby improving the stability during processing and reducing processing errors or damages caused by position deviation.

[0022] Optionally, the anti-bending mechanism is further provided for preventing the pins of the electronic components from being bent on the protruding part of the bearing plate. The anti-bending mechanism comprises extension cylinders arranged on both sides of the bearing plate, a combination block mounted on the output end of the extension cylinder, and a semi-arc block for semi-wrapping the pins to prevent bending. The arc surface of the semi-arc block is in the same horizontal plane as the bearing groove, and the semi-arc block is arranged above the combination block. The combination block is driven to extend by the output end of the extension cylinder, so as to adapt the protruding length of the pins.

[0023] By adopting the above technical scheme, the problem that the protruding part of the pins of the electronic components is easily bent due to external factors during processing is effectively solved. Specifically, the anti-bending mechanism can accurately adjust the position of the semi-arc block according to the protruding length of the pins by the extension cylinders arranged on both sides of the bearing plate, so as to ensure that the semi-arc block always adapts to the protruding part of the pins. At the same time, the arc surface of the semi-arc block is in the same horizontal plane as the bearing groove. This design not only avoids interference between the pins and the edge of the bearing groove, but also realizes semi-wrapping support for the protruding part of the pins, thereby effectively preventing the bending phenomenon.

[0024] Optionally, a rotary motor is arranged on the top of the combination block, and the output end of the rotary motor is provided with a rotary disc. The bottom of the semi-arc block is connected to the end surface of the rotary disc, so as to realize support of the pins of the electronic components with different horizontal angles by the semi-arc block.

[0025] By adopting the above technical scheme, the semi-arc block can support the pins of the electronic components with different horizontal angles, effectively avoiding damage or bending of the pins caused by angle deviation during processing. The rotary motor drives the rotary disc to rotate, so that the semi-arc block is adjusted to an appropriate angle, thereby ensuring stable support of the pins and improving processing precision and yield.

[0026] In summary, the present application has at least one of the following beneficial technical effects: 1. The drive belt is provided with a plurality of bearing plates, the bearing plates are provided with symmetrical bearing grooves, and a plurality of magnet pieces are distributed in the bearing grooves. The magnet pieces can magnetically attract the pins of electronic components, effectively preventing the pins of electronic components from deviating during transportation, ensuring that electronic components are in the correct position, providing accurate positioning basis for subsequent processing procedures, and thus ensuring the accuracy of subsequent processing. 2. The forming mechanism includes a fixed frame arranged near one side of the drive belt, a forming table arranged on the fixed frame, a sliding block sliding on the forming table, and a pressing block located above the forming table. The top of the forming table is provided with a forming groove near one side of the drive belt. The top of the sliding block is provided with a forming piece corresponding to the forming groove. When the pressing block is lowered and cooperates with the forming piece moved into the forming groove, it can accurately perform the forming operation on the pins of electronic components. This cooperation mode can make the pins bear force more uniformly, reduce the deformation of the pins due to uneven force, and significantly improve the forming quality of the pins. 3. The cutting mechanism is composed of a cutting frame away from the forming mechanism, a cutter arranged above the cutting frame, and a receiving block arranged below the cutter on the cutting frame. The cutting cylinder on one side of the top of the cutting frame drives the cutter to move, so that the cutter cooperates with the receiving block to cut the excess pins of the formed electronic components. This cutting method can ensure the neatness of cutting and ensure that the lengths of the pins remain consistent. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 It is a three-dimensional view of a pin processing and forming device for electronic components in the present application.

[0028] Figure 2 It is a top view of a pin processing and forming device for electronic components in the present application.

[0029] Figure 3 It is Figure 1 the structure of A in the enlarged schematic view.

[0030] Figure 4 It is a top view of a bearing plate of a pin processing and forming device for electronic components in the present application.

[0031] Figure 5 It is a first perspective view of a forming mechanism of a pin processing and forming device for electronic components in the present application.

[0032] Figure 6 It is a second perspective view of a forming mechanism of a pin processing and forming device for electronic components in the present application.

[0033] Figure 7 It is Figure 5 the structure of B in the enlarged schematic view.

[0034] Figure 8Figure 1 is a schematic view of the mounting rack cooperating structure of the deviation adjusting mechanism of the pin processing and forming device for electronic components in the present application.

[0035] Figure 9 Figure 2 is a schematic view of the deviation rectifying rack cooperating structure of the deviation adjusting mechanism of the pin processing and forming device for electronic components in the present application.

[0036] Figure 10 Figure 3 is a structural schematic view of the cutting mechanism of the pin processing and forming device for electronic components in the present application.

[0037] Figure 11 Figure 4 is a structural schematic view of the cutting clamping mechanism of the pin processing and forming device for electronic components in the present application.

[0038] Figure 12 Figure 5 is a structural schematic view of the anti-bending mechanism of the pin processing and forming device for electronic components in the present application.

[0039] In the figure: 1, operation table; 11, driving belt; 12, bearing plate; 121, bearing groove; 122, magnet piece; 13, driving wheel; 14, driving motor; 15, driving piece; 2, detection mechanism; 21, detection rack; 211, through groove; 22, light column sensor; 3, forming mechanism; 31, fixed rack; 311, first driving cylinder; 312, second driving cylinder; 313, connecting piece; 32, forming table; 321, forming groove; 322, sliding groove; 323, positioning rack; 324, lifting cylinder group; 325, combined plate; 33, sliding block; 331, forming piece; 34, pressing block; 35, protection block; 351, V-shaped groove; 36, adjusting rack; 361, adjusting cylinder group; 362, adjusting plate; 4, deviation adjusting mechanism; 41, deviation rectifying rack; 42, push block; 43, deviation rectifying cylinder group; 44, connecting plate; 45, mounting rack; 46, vertical cylinder; 461, positioning plate; 47, horizontal cylinder; 48, horizontal rod; 49, split rod; 5, cutting mechanism; 51, cutting rack; 52, cutter; 53, receiving block; 54, cutting cylinder; 55, cutting clamping mechanism; 551, cutting clamping cylinder; 552, driving hinge; 553, clamping jaw; 554, limiting frame; 6, anti-bending mechanism; 61, extension cylinder; 62, combined block; 63, semi-arc block; 64, rotary motor; 65, rotary disc; 7, waste collecting bin; 71, telescopic cylinder; 72, cooperating plate; 73, waste clamping mechanism. DETAILED DESCRIPTION

[0040] The following description is made in conjunction with the drawings Figures 1-12 The present application is further described in detail.

[0041] Example one, refer to Figures 1-7The embodiment of the application discloses a pin processing and forming device for electronic components, which comprises an operation table 1, a detection mechanism 2 and a forming mechanism 3.

[0042] A driving belt 11 is rotationally arranged on the operation table 1, a plurality of bearing plates 12 are arranged on the driving belt 11 and used for bearing electronic components, driving wheels 13 are separately arranged at two ends of the operation table 1, a driving motor 14 is arranged on the outer side of the operation table 1, a driving part 15 is arranged at the output end of the driving motor 14, the output end of the driving motor 14 is connected with one of the driving wheels 13 through the driving part 15, and the driving belt 11 is rotated, the detection mechanism 2 is arranged on the operation table 1 and close to one side of the driving belt 11 and is used for detecting the electronic components on the bearing plates 12, the forming mechanism 3 is used for pin forming of the electronic components, the forming mechanism 3 comprises a fixing frame 31 arranged close to one side of the driving belt 11, a forming table 32 arranged on the fixing frame 31, a sliding block 33 slidingly arranged at the forming table 32 and a pressing block 34 arranged above the forming table 32, a forming groove 321 is arranged at the top of the forming table 32 and close to one side of the driving belt 11, a sliding groove 322 is arranged through the bottom of the forming table 32, the sliding block 33 is slidingly arranged in the sliding groove 322, a forming part 331 is arranged at the top of the sliding block 33 and corresponds to the forming groove 321, a positioning frame 323 is arranged at the top of the forming table 32, a lifting cylinder group 324 is arranged on the positioning frame 323, a combination plate 325 is arranged at the output end of the lifting cylinder group 324, the output end of the lifting cylinder group 324 is connected with the pressing block 34 through the combination plate 325, the pressing block 34 is lowered and cooperates with the forming part 331 moved into the forming groove 321, and pin pressing operation is realized.

[0043] The electronic components are placed on the bearing plates 12, sequentially pass through the detection mechanism 2 and the forming mechanism 3 along with the rotation of the driving belt 11, the detection mechanism 2 can accurately detect the electronic components on the bearing plates 12 and ensure that the position of the component to be processed is accurate, then the electronic components are sent to the forming mechanism 3, the sliding block 33 is slid in the sliding groove 322 to move the forming part 331 into the forming groove 321, the lifting cylinder group 324 drives the pressing block 34 to be lowered, the pressing block 34 cooperates with the forming part 331 to accurately perform pin pressing operation on the electronic components, the scheme not only improves the precision and efficiency of pin processing, but also effectively avoids errors and damage risks possibly caused by traditional manual operation and ensures that the pin forming quality of the electronic components is stable and reliable.

[0044] Reference Figures 5-7In the embodiment, more specifically, the rear end of the forming table 32 corresponds to the forming groove 321 and is provided with a protection block 35 through sliding, the front end face of the protection block 35 is provided with a V-shaped groove 351 for protecting the head of the electronic component, the top of the fixing frame 31 away from the side of the forming table 32 is provided with a first driving cylinder 311 and a second driving cylinder 312, the output end of the first driving cylinder 311 and the second driving cylinder 312 is provided with a connecting piece 313, the output end of the first driving cylinder 311 is connected with the tail end of the protection block 35 through the connecting piece 313, so that the inside of the V-shaped groove 351 of the protection block 35 abuts against and protects the head of the electronic component, the output end of the second driving cylinder 312 is connected with the tail end of the sliding block 33 through the connecting piece 313, the protection block 35 cooperates with the forming piece 331 on the sliding block 33 to limit the pin and head of the electronic component when the pin of the electronic component is formed in the forming groove 321, the protection block 35 arranged at the rear end of the forming table 32 can effectively protect the head of the electronic component during the pin forming process, avoiding damage to the head of the electronic component caused by external force; the design of the V-shaped groove 351 on the front end face of the protection block 35 further improves the protection effect of the head of the electronic component, ensuring its stability during processing; in addition, the arrangement of the first driving cylinder 311 and the second driving cylinder 312 realizes precise control of the protection block 35 and the sliding block 33, so that the protection block 35 can move flexibly as needed, and the V-shaped groove 351 at the protection block 35 can effectively limit the pin of the electronic component when the pin of the electronic component is formed in the forming groove 321 cooperated with the forming piece 331 at the sliding block 33, and better adapt to electronic components of different sizes and shapes, improving the applicability and reliability of the device; specifically, the first driving cylinder 311 drives the protection block 35 to move through the connecting piece 313, ensuring that the protection block 35 is always in the right position; the second driving cylinder 312 controls the action of the sliding block 33 through the connecting piece 313, realizing precise cooperation of pin forming.

[0045] Reference Figures 5-7 In the embodiment, more specifically, the lower part of the fixing frame 31 is provided with an adjusting frame 36, the adjusting frame 36 is provided with an adjusting cylinder group 361, the output end of the adjusting cylinder group 361 is provided with an adjusting plate 362, the adjusting plate 362 is connected with the bottom of the fixing frame 31, and the connecting relationship between the adjusting frame 36 and the fixing frame 31 can be dynamically adjusted through the adjusting cylinder group 361, so as to adapt to the processing requirements of different heights; this design not only improves the flexibility of the device, but also ensures the stable operation of the forming mechanism 3 under different working conditions, effectively reducing the processing error caused by the mismatch of the height of the equipment.

[0046] Reference Figures 1-3In the embodiment, more specifically, the detection mechanism 2 comprises a detection frame 21 arranged on the operation table 1 and a light column sensor 22 for detection, the detection frame 21 is provided with a through slot 211 corresponding to the upper side of the bearing plate 12, the light column sensor 22 is arranged in the through slot 211 by screw nut locking adjustment, so as to realize the position adjustment and locking of the light column sensor 22 in the through slot 211; the light column sensor 22 can be flexibly adjusted in position in the through slot 211 of the detection frame 21 and locked after being adjusted to a suitable position; such design not only enables the detection mechanism 2 to be accurately adapted to the size and position difference of the electronic component, but also effectively improves the accuracy and reliability of detection; at the same time, the adjustability of the position of the light column sensor 22 enhances the versatility of the device, which is suitable for detection of electronic components of various specifications, thereby reducing production cost and improving work efficiency; in addition, through accurate detection of the presence state and position of the electronic component on the bearing plate 12, abnormal conditions can be found in advance, thereby avoiding the generation of defective products in the subsequent processing process, and further improving the yield of products and the overall processing quality.

[0047] Reference Figure 1 And Figure 9 In the embodiment, more specifically, the detection mechanism 2 comprises a detection frame 21 arranged on the operation table 1 and a light column sensor 22 for detection, the detection frame 21 is provided with a through slot 211 corresponding to the upper side of the bearing plate 12, the light column sensor 22 is arranged in the through slot 211 by screw nut locking adjustment, so as to realize the position adjustment and locking of the light column sensor 22 in the through slot 211; the light column sensor 22 can be flexibly adjusted in position in the through slot 211 of the detection frame 21 and locked after being adjusted to a suitable position; such design not only enables the detection mechanism 2 to be accurately adapted to the size and position difference of the electronic component, but also effectively improves the accuracy and reliability of detection; at the same time, the adjustability of the position of the light column sensor 22 enhances the versatility of the device, which is suitable for detection of electronic components of various specifications, thereby reducing production cost and improving work efficiency; in addition, through accurate detection of the presence state and position of the electronic component on the bearing plate 12, abnormal conditions can be found in advance, thereby avoiding the generation of defective products in the subsequent processing process, and further improving the yield of products and the overall processing quality.

[0048] Reference Figure 1 And Figure 8 In the embodiment, more specifically, the detection mechanism 2 comprises a detection frame 21 arranged on the operation table 1 and a light column sensor 22 for detection, the detection frame 21 is provided with a through slot 211 corresponding to the upper side of the bearing plate 12, the light column sensor 22 is arranged in the through slot 211 by screw nut locking adjustment, so as to realize the position adjustment and locking of the light column sensor 22 in the through slot 211; the light column sensor 22 can be flexibly adjusted in position in the through slot 211 of the detection frame 21 and locked after being adjusted to a suitable position; such design not only enables the detection mechanism 2 to be accurately adapted to the size and position difference of the electronic component, but also effectively improves the accuracy and reliability of detection; at the same time, the adjustability of the position of the light column sensor 22 enhances the versatility of the device, which is suitable for detection of electronic components of various specifications, thereby reducing production cost and improving work efficiency; in addition, through accurate detection of the presence state and position of the electronic component on the bearing plate 12, abnormal conditions can be found in advance, thereby avoiding the generation of defective products in the subsequent processing process, and further improving the yield of products and the overall processing quality.

[0049] Reference Figure 1 And Figure 10In the embodiment, more specifically, the cutting mechanism 5 is further included for cutting the pins of the formed electronic components, the cutting mechanism 5 includes a cutting frame 51 away from the forming mechanism 3, a cutter 52 arranged above the cutting frame 51, and a receiving block 53 arranged below the cutter 52 on the cutting frame 51, a cutting cylinder 54 is arranged on one side of the top of the cutting frame 51, the output end of the cutting cylinder 54 is connected with the top of the cutter 52, the cutter 52 is driven to cut the excess pins of the electronic components in cooperation with the receiving block 53, and the cutting mechanism 5 can realize accurate cutting of the pins of the formed electronic components; specifically, the cutting frame 51 is arranged away from the forming mechanism 3, so that the cutting operation and the forming operation do not interfere with each other, and the working efficiency is improved; the cutter 52 is arranged above the cutting frame 51, cooperates with the receiving block 53 below, and forms a stable cutting structure; when cutting is needed, the output end of the cutting cylinder 54 drives the cutter 52 to move downward, and the relative movement between the cutter 52 and the receiving block 53 can accurately cut off the excess pin part, so as to ensure the consistency of the length of the pins of the electronic components; the design not only improves the cutting precision, but also effectively avoids the errors and damages that may be caused by traditional manual cutting, and significantly improves the overall processing quality of the electronic components.

[0050] Reference Figure 1 and Figure 11 In the embodiment, more specifically, the cutting mechanism 5 is further included for cutting the pins of the formed electronic components, the cutting mechanism 5 includes a cutting frame 51 away from the forming mechanism 3, a cutter 52 arranged above the cutting frame 51, and a receiving block 53 arranged below the cutter 52 on the cutting frame 51, a cutting cylinder 54 is arranged on one side of the top of the cutting frame 51, the output end of the cutting cylinder 54 is connected with the top of the cutter 52, the cutter 52 is driven to cut the excess pins of the electronic components in cooperation with the receiving block 53, and the cutting mechanism 5 can realize accurate cutting of the pins of the formed electronic components; specifically, the cutting frame 51 is arranged away from the forming mechanism 3, so that the cutting operation and the forming operation do not interfere with each other, and the working efficiency is improved; the cutter 52 is arranged above the cutting frame 51, cooperates with the receiving block 53 below, and forms a stable cutting structure; when cutting is needed, the output end of the cutting cylinder 54 drives the cutter 52 to move downward, and the relative movement between the cutter 52 and the receiving block 53 can accurately cut off the excess pin part, so as to ensure the consistency of the length of the pins of the electronic components; the design not only improves the cutting precision, but also effectively avoids the errors and damages that may be caused by traditional manual cutting, and significantly improves the overall processing quality of the electronic components.

[0051] Reference Figure 4In the embodiment, more specifically, the bearing plate 12 is provided with symmetrical bearing grooves 121, and a plurality of magnet pieces 122 are arranged in the bearing grooves 121. The pins of the electronic components are magnetically attracted by the magnet pieces 122, so that the pins are prevented from being deviated during transportation. The magnet pieces 122 can effectively attract the pins of the electronic components and prevent the pins from being deviated during transportation, thereby improving the stability during processing and reducing processing errors or damages caused by position deviation.

[0052] Reference Figure 1 And Figure 2 In the embodiment, more specifically, the operation table 1 is provided with a waste collecting bin 7 on one side. A telescopic cylinder 71 is arranged above the waste collecting bin 7 and corresponds to the side surface of the bearing plate 12. The output end of the telescopic cylinder 71 is provided with a matching plate 72. The matching plate 72 is provided with a waste clamping mechanism 73. The waste clamping mechanism 73 has the same structure and clamping principle as the cutting clamping mechanism 55. The waste clamping mechanism 73 is adjusted by the output end of the telescopic cylinder 71 to achieve telescopic clamping of the waste and put the waste into the waste collecting bin 7.

[0053] The embodiment of the electronic component pin processing and forming device has the following implementation principle: through the cooperative work of various mechanisms, the problems of deformation, irregular cutting, surface damage and the like in the processing of electronic component pins in the prior art are effectively solved. The electronic components on the bearing plate 12 are driven by the driving belt 11 to sequentially pass through the detection mechanism 2, the deviation adjusting mechanism 4, the forming mechanism 3 and the cutting mechanism 5, so as to realize the processing steps of pin detection, position adjustment, forming and cutting. At the same time, the magnet pieces 122 on the bearing plate 12 and the anti-bending mechanism 6 further ensure the stability of the electronic components during transportation and processing, improve the processing precision and quality of the pins, reduce the product rejection rate, meet the market demand for high-quality electronic components, and have a significant improvement and promotion compared with the prior art.

[0054] Embodiment two, reference Figure 12The difference between the embodiment and the embodiment one is that the anti-bending mechanism 6 is further included for preventing the pin of the electronic component from being bent on the protruding part of the bearing plate 12. The anti-bending mechanism 6 includes the extension cylinder 61 arranged on both sides of the bearing plate 12, the combination block 62 mounted on the output end of the extension cylinder 61, and the semi-arc block 63 for preventing the pin from being bent in a semi-wrapping manner. The arc surface of the semi-arc block 63 is in the same horizontal plane as the bearing groove 121. The semi-arc block 63 is arranged above the combination block 62. The combination block 62 is driven to extend by the output end of the extension cylinder 61, so that the semi-arc block 63 is adapted to the length of the pin protrusion. The problem that the pin protrusion is easily bent due to external factors during the processing of the electronic component is effectively solved. Specifically, the anti-bending mechanism 6 can accurately adjust the position of the semi-arc block 63 according to the length of the pin protrusion by the extension cylinder 61 arranged on both sides of the bearing plate 12, so as to ensure that the semi-arc block 63 is always adapted to the pin protrusion. Meanwhile, the arc surface of the semi-arc block 63 is in the same horizontal plane as the bearing groove 121. This design not only avoids the interference between the pin and the edge of the bearing groove 121, but also realizes the semi-wrapping support for the pin protrusion, so as to effectively prevent the bending phenomenon. In addition, the mechanism has simple structure and convenient operation, and can significantly improve the yield of the pin processing of the electronic component, and provide reliable protection for the subsequent forming and cutting processes.

[0055] Reference Figure 12 In the embodiment, more specifically, the top of the combination block 62 is provided with the rotary motor 64. The output end of the rotary motor 64 is provided with the rotary disc 65. The bottom of the semi-arc block 63 is connected with the end surface of the rotary disc 65, so as to realize the support of the pin of the electronic component with different horizontal angles by the semi-arc block 63. The semi-arc block 63 can support the pin of the electronic component with different horizontal angles, so as to effectively avoid the damage or bending of the pin caused by the angle deviation during the processing. The rotary motor 64 drives the rotary disc 65 to rotate, so that the semi-arc block 63 is adjusted to the appropriate angle, and the stable support of the pin is ensured, and the processing precision and the yield are improved.

[0056] The above are the preferred embodiments of the present application, which do not limit the protection scope of the present application. Therefore, any equivalent changes made on the basis of the structure, shape and principle of the present application should be covered by the protection scope of the present application.

Claims

1. A pin forming device for electronic components, characterized in that: include: An operating table (1), wherein a driving belt (11) is rotatably provided on the operating table (1), and a plurality of carrying plates (12) are provided on the driving belt (11) for carrying electronic components; A detection mechanism (2) is provided on the operating table (1) on a side close to the driving belt (11) and is used for detecting electronic components on the carrier plate (12); and A molding mechanism (3) is used for molding the pins of electronic components. The molding mechanism (3) includes a fixing frame (31) arranged near one side of the driving belt (11), a molding table (32) arranged on the fixing frame (31), a sliding block (33) slidingly arranged on the molding table (32), and a pressing block (34) arranged above the molding table (32). A molding groove (321) is provided on the top of the molding table (32) near the side of the driving belt (11), and a sliding groove (322) is provided through the bottom of the molding table (32). The sliding block (33) is slidably arranged in the sliding groove (322). A molding piece (331) is provided on one side of the top of the sliding block (33) and corresponds to the molding groove (321). A positioning frame (323) is provided on the top of the molding table (32). A lifting cylinder group (324) is provided on the positioning frame (323). A combination plate (325) is provided at the output end of the lifting cylinder group (324). The output end of the lifting cylinder group (324) is connected to the pressing block (34) through the combination plate (325). The pressing block (34) descends and moves to the molding piece (331) in the molding groove (321) to realize the pin pressing operation.

2. The pin forming device for electronic components according to claim 1, characterized in that: A protective block (35) is provided at the rear end of the forming table (32) so as to slide through the forming groove (321), and a V-shaped groove (351) is provided on the front end surface of the protective block (35). A first driving cylinder (311) and a second driving cylinder (312) are provided on the top of the fixing frame (31) away from the forming table (32). The output ends of the first driving cylinder (311) and the second driving cylinder (312) are provided with a connecting piece (313). The output end of the first driving cylinder (311) is connected to the connecting piece (313). The part (313) is connected to the tail end of the protection block (35), so that the inner side of the V-shaped groove (351) at the protection block (35) abuts against the head of the electronic component and protects it. The output end of the second driving cylinder (312) is connected to the tail end of the sliding block (33) through the connecting part (313). When the pins of the electronic component are pressed and formed in the forming groove (321) by the protection block (35), the pins and the head of the electronic component are limited.

3. The pin forming device for electronic components according to claim 1, characterized in that: An adjustment frame (36) is provided below the fixing frame (31), an adjustment cylinder group (361) is provided on the adjustment frame (36), an adjustment plate (362) is provided at the output end of the adjustment cylinder group (361), and the adjustment plate (362) is connected to the bottom of the fixing frame (31).

4. The pin forming device for electronic components according to claim 1, characterized in that: The detection mechanism (2) comprises a detection frame (21) arranged on the operating table (1) and a light column sensor (22) for detection, wherein a through slot (211) is provided on the detection frame (21) corresponding to the upper portion of the carrier plate (12), and the light column sensor (22) is arranged in the through slot (211) by means of a nut locking adjustment, so that the light column sensor (22) is locked after the position of the light column sensor (22) in the through slot (211) is adjusted.

5. The device for processing and forming pins of electronic components according to claim 4, characterized in that: The invention also includes a deflection adjustment mechanism (4) for adjusting the position of the electronic component on the carrier plate (12) to achieve pin processing of the electronic component. The deflection adjustment mechanism (4) includes a deflection correction frame (41) arranged on one side of the operating table (1) and a push block (42) arranged on the deflection correction frame (41). A deflection correction cylinder group (43) is arranged on the top of the deflection correction frame (41). A connecting plate (44) is arranged at the output end of the deflection correction cylinder group (43). The connecting plate (44) is connected to the push block (42) to enable the push block (42) to adjust the position of the electronic component on the carrier plate (12) horizontally.

6. The device for processing and forming pins of electronic components according to claim 1, characterized in that: The invention also includes a cutting mechanism (5) for cutting the pins of the formed electronic components. The cutting mechanism (5) includes a cutting frame (51) away from the forming mechanism (3), a cutter (52) arranged above the cutting frame (51), and a receiving block (53) arranged on the cutting frame (51) below the cutter (52). A cutting cylinder (54) is provided on one side of the top of the cutting frame (51). The output end of the cutting cylinder (54) is connected to the top of the cutter (52), driving the cutter (52) to cooperate with the receiving block (53) to cut the redundant pins of the electronic components.

7. The pin forming device for electronic components according to claim 6, characterized in that: A cutting clamping mechanism (55) is provided at the rear end of the cutting frame (51) and between the cutting knife (52) and the receiving block (53), for clamping and limiting the component head of the electronic component. The cutting clamping mechanism (55) comprises a cutting clamping cylinder (551) provided at the rear end of the cutting frame (51), a driving hinge (552) provided on the output end of the cutting clamping cylinder (551), and a clamping claw (553) for clamping the component head of the electronic component. The clamping claws (553) are symmetrically provided at the ends of the driving hinge (552). A limiting frame (554) is provided on the outside of the cutting clamping cylinder (551), for adjusting and limiting the driving hinge (552). The output end of the cutting clamping cylinder (551) drives the driving hinge (552) to adjust its opening and closing angle, thereby achieving the clamping and separation of the clamping claws (553).

8. The pin forming device for electronic components according to claim 1, characterized in that: Symmetrical bearing slots (121) are provided on the bearing plate (12), and a plurality of magnet pieces (122) are provided in the bearing slots (121). The pins of the electronic components are magnetically attracted by the magnet pieces (122) to avoid deviation during transportation.

9. The device for processing and forming pins of electronic components according to claim 8, characterized in that: The invention also includes an anti-bending mechanism (6) for preventing the protruding portion of the pin of the electronic component on the carrier plate (12) from bending. The anti-bending mechanism (6) includes an extension cylinder (61) arranged on both sides of the carrier plate (12), a combination block (62) installed at the output end of the extension cylinder (61), and a semi-arc block (63) for semi-wrapped pin anti-bending, wherein the arc surface of the semi-arc block (63) is on the same horizontal plane as the bearing groove (121). The semi-arc block (63) is arranged above the combination block (62), and the combination block (62) is extended by the output end of the extension cylinder (61), so that the semi-arc block (63) adapts to the protruding length of the pin.

10. The device for processing and forming pins of electronic components according to claim 9, characterized in that: A rotating motor (64) is provided on the top of the combination block (62), a rotating disk (65) is provided at the output end of the rotating motor (64), and the bottom of the semi-arc block (63) is connected to the end face of the rotating disk (65), so as to achieve pin support for electronic components with different horizontal angles adapted to the semi-arc block (63).

Citation Information

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