Sensor and electronic equipment
By designing through holes and multi-stage gradually expanding airflow channels on the sensor substrate, the wind noise problem of MEMS sensors in strong wind environments is solved, and efficient wind noise filtering and signal optimization are achieved.
Patent Information
- Application Number
- CN202510863529.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-25
- Publication Date
- 2025-10-17
AI Technical Summary
The combined sensor of a MEMS microphone and a barometer in an integrated package is easily affected by wind noise outdoors or in strong wind environments, resulting in reduced accuracy of sound pickup and barometer output. Existing designs make it difficult to effectively reduce the impact of airflow on the vibrating diaphragm.
Through holes and air flow channels are opened on the substrate of the sensor. The air flow channel is designed as a multi-stage gradually expanding structure. The air flow enters the sensor through the through holes, gradually slowing down the air flow speed and reducing the impact on the sensing chip.
It significantly reduces the negative impact of wind noise on the perception chip, improves the wind noise filtering effect and signal reception accuracy of the sensor, and optimizes the sound quality and sensitivity.
Smart Images
Figure CN120800469A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of electronic products, and more particularly, to a sensor and an electronic device. BACKGROUND
[0002] A combined sensor (referred to as M / P sensor for short) composed of a MEMS microphone and a MEMS barometer is widely used in the consumer electronics field due to its small size, high sensitivity, and low cost. However, both the microphone and the barometer are susceptible to wind noise caused by airflow changes in the environment during use; this is particularly evident in outdoor, mobile device, or strong wind environments, thereby negatively affecting the pickup of the microphone and the output accuracy of the barometer.
[0003] The influence of the above-mentioned wind noise on the performance of the sensor comes from two aspects. First, the M / P sensor is small in size, and the sensing diaphragm is more sensitive to airflow and is easily affected by physical vibration caused by wind. Although a gas-permeable film or mesh is added during the assembly of the whole sensor to block impurities and part of the airflow, the wind noise suppression effect is still not good for high-speed airflow or complex flow environments. Second, since the M / P sensor must interact with the external environment, it needs an external access channel, and the traditional channel design cannot effectively reduce the influence of airflow on the vibrating diaphragm.
[0004] In view of this, a new technical solution is needed to solve the above technical problems. SUMMARY
[0005] An object of the present application is to provide a new technical solution for a sensor and an electronic device.
[0006] According to a first aspect of the present application, a sensor is provided, comprising:
[0007] a substrate having a first surface arranged in a thickness direction;
[0008] a housing connected to the first surface of the substrate and forming a receiving cavity together with the substrate;
[0009] a first sensing chip arranged on the first surface of the substrate and located in the receiving cavity;
[0010] The substrate is provided with a through hole through its length direction or width direction, and the substrate is provided with an airflow channel, which communicates the through hole and the first sensing chip.
[0011] Optionally, the length direction of the substrate is larger than the width direction, and the through hole is arranged through the width direction of the substrate.
[0012] Optionally, the through hole is cuboid, a length of the through hole is arranged along a width direction of the substrate, a width of the through hole is arranged along a length direction of the substrate, and a height of the through hole is arranged along a thickness direction of the substrate.
[0013] Optionally, the airflow channel is arranged along the thickness direction of the substrate, and the airflow channel is located at a middle position of the width of the through hole.
[0014] Optionally, the width of the through hole is about times of the height of the through hole.
[0015] Optionally, the airflow channel includes a first channel and a second channel, the first channel is arranged closer to the through hole than the second channel, and an average inner diameter of the second channel is greater than an average inner diameter of the first channel.
[0016] Optionally, along a direction gradually away from the first channel, the inner diameter of the second channel gradually increases.
[0017] Optionally, the inner diameter of the first channel is equal along an extension direction of the first channel.
[0018] Optionally, the sensor further includes a second sensing chip, and the second sensing chip is arranged in the accommodating cavity.
[0019] According to a second aspect of the present application, an electronic device is provided, and the electronic device includes the sensor according to the first aspect.
[0020] In the sensor provided by the embodiments of the present application, the air pressure change when the airflow directly enters from the direction opposite to the first sensing chip can be avoided, so that the wind noise in the direction opposite to the first sensing chip is directly reduced, and then the negative influence caused by the wind noise is significantly reduced, and the purpose of filtering the wind noise is achieved.
[0021] Other features and advantages of the present application will become apparent from the following detailed description of illustrative embodiments thereof, which proceeds with reference to the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS
[0022] The accompanying drawings incorporated in and forming a part of the specification illustrate embodiments of the present application and, together with the description, serve to explain the principles of the application.
[0023] Figure 1 is a schematic cross-sectional structure of a sensor according to an embodiment of the present application Figure 1 ;
[0024] Figure 2 is a schematic cross-sectional structure of a sensor according to an embodiment of the present application Figure 2 ;
[0025] Figure 3 is a schematic diagram of a partial cross-sectional structure of a sensor according to an embodiment of the present application;
[0026] Figure 4 is a schematic diagram of wind noise pressure fluctuation of a sensor according to an embodiment of the present application.
[0027] BRIEF DESCRIPTION OF DRAWINGS
[0028] 1. sensor; 10, housing; 100, accommodating cavity; 11, substrate; 110, through hole; 111, air flow channel; 1111, first channel; 1112, second channel; 12, first sensing chip; 13, second sensing chip; 14, first processing chip; 15, second processing chip. DETAILED DESCRIPTION
[0029] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of the components and steps set forth in the examples, numerical expressions, and numerical values are not limiting to the scope of the present application unless otherwise specifically stated.
[0030] The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the scope of the application, its application, or uses.
[0031] Techniques, methods, and devices known to those of ordinary skill in the relevant art can not be discussed in detail herein. However, the techniques, methods, and devices are further explained in connection with the description of the illustrative examples.
[0032] In all of the examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not limiting. Thus, other examples of the illustrative embodiments can have different values.
[0033] It should be noted that like reference numerals and letters refer to like items throughout the drawings, and once an item is defined in one drawing, it is not necessary to discuss it further in subsequent drawings.
[0034] SUMMARY Figures 1-3As shown, according to one embodiment of the present application, a sensor 1 is provided. The sensor 1 comprises a substrate 11, a housing 10 and a first sensing chip 12. The substrate 11 has a first surface arranged along a thickness direction. The housing 10 is connected to the first surface of the substrate 11 and forms a receiving cavity 100 together with the substrate 11. The first sensing chip 12 is arranged on the first surface of the substrate 11 and located in the receiving cavity 100. The substrate 11 is provided with a through hole 110 along a length direction or a width direction of the substrate 11. The substrate 11 is also provided with an airflow channel 111 which is connected to the through hole 110 and the first sensing chip 12. That is, a first end of the airflow channel 111 is connected to the through hole 110, and a second end of the airflow channel 111 is arranged corresponding to the first sensing chip 12.
[0035] In the sensor 1 provided by the embodiment of the present application, the receiving cavity 100 is formed by the housing 10 and the substrate 11 connected to each other. The first sensing chip 12 is arranged in the receiving cavity 100 and connected to the first surface of the substrate 11 facing the receiving cavity 100. The first sensing chip 12 is, for example, a microphone MEMS chip. The microphone MEMS chip generally comprises a support portion and a sensing diaphragm. One end of the support portion is connected to the first surface of the substrate 11, and the other end of the support portion is connected to the sensing diaphragm. The substrate 11 is provided with the airflow channel 111, and the through hole 110 is arranged along the length direction or the width direction of the substrate 11, that is, the through hole 110 is arranged through the side of the substrate 11. A first end of the airflow channel 111 is connected to the through hole 110, and a second end of the airflow channel 111 is connected to a front cavity of the microphone MEMS chip, that is, the second end of the airflow channel 111 is arranged towards the sensing diaphragm of the microphone MEMS chip.
[0036] During the process of airflow entering the front cavity of the microphone MEMS chip and the receiving cavity 100, the airflow flows to the through hole 110 through the side of the substrate 11. Most of the airflow flows out through the through hole 110, and a small part of the airflow flows to the airflow channel 111 from the through hole 110 and then enters the front cavity of the microphone MEMS chip and the receiving cavity 100. In this way, the air pressure change when the airflow directly enters from the direction opposite to the microphone MEMS chip can be avoided, thereby directly reducing the wind noise in the direction opposite to the microphone MEMS chip, and further significantly reducing the negative effects of the wind noise, achieving the purpose of filtering the wind noise, and without affecting the signal reception of the first sensing chip 12.
[0037] Referring to Figures 1-3 As shown, in one embodiment, the length direction of the substrate 11 is larger than the width direction of the substrate 11, and the through hole 110 is arranged along the width direction of the substrate 11.
[0038] In this specific example, because the length of the substrate 11 is large, it is difficult to open the through hole 110 along the length direction of the substrate 11. Therefore, the through hole 110 is opened along the width direction of the substrate 11, so as to reduce the difficulty of opening the through hole 110 and improve the processing efficiency of the substrate 11.
[0039] Referring to Figures 1-3 In one embodiment, as shown in the figure, the through hole 110 is in a cuboid shape, the length of the through hole 110 is arranged along the width direction of the substrate 11, the width of the through hole 110 is arranged along the length direction of the substrate 11, and the height of the through hole 110 is arranged along the thickness direction of the substrate 11.
[0040] In this specific example, the through hole 110 is arranged in a cuboid shape, and the length, width and height thereof are arranged along the width, length and thickness directions of the substrate respectively. The above arrangement of shape and size direction helps to further optimize the flow characteristics of the airflow in the through hole 110, so that the airflow can flow more smoothly in the through hole 110, and at the same time facilitates cooperation with the airflow channel 111, thereby improving the effect of wind noise filtering.
[0041] Referring to Figures 1-3 In one embodiment, as shown in the figure, the airflow channel 111 is arranged to extend along the thickness direction of the substrate 11, and the airflow channel 111 is located at the middle position of the width of the through hole 110.
[0042] In this specific example, the airflow channel 111 is located at the middle position of the width of the through hole 110, and the airflow channel 111 is arranged to extend along the thickness direction of the substrate 11. In this way, the airflow enters the airflow channel 111 from the middle of the through hole 110, so that the airflow is more evenly distributed when it enters the accommodation cavity 100 and interacts with the first sensing chip 12, thereby reducing the influence of uneven airflow distribution on the performance of the first sensing chip 12, and further optimizing the effect of wind noise filtering.
[0043] Referring to Figures 1-3 In one embodiment, as shown in the figure, the width of the through hole 110 is 10-20 times the height thereof.
[0044] In this specific example, the above ratio between the width and the height of the through hole 110 helps to control the height of the through hole 110 while ensuring that the through hole 110 can provide sufficient airflow passing space, so as to avoid that the height of the through hole 110 is too large, which may reduce the strength of the substrate or have an adverse effect on the internal structure of the sensor, thereby balancing between the airflow passing performance and the stability of the sensor structure.
[0045] Referring to Figures 1-3As shown, in one embodiment, the airflow passage 111 comprises a first passage 1111 and a second passage 1112, the first passage 1111 is arranged closer to the through hole 110 than the second passage 1112; the average inner diameter of the second passage 1112 is greater than that of the first passage 1111.
[0046] In this specific example, in the process of airflow entering the front cavity of the microphone MEMS chip and the accommodating cavity 100 from the through hole 110 via the airflow passage 111, it first passes through the first passage 1111 with a smaller inner diameter, which preliminarily buffers and adjusts the airflow, and then enters the second passage 1112 with a larger inner diameter, further reducing the impact of the airflow on the first sensing chip 12 and improving the filtering effect of wind noise.
[0047] Referring to Figures 1-3 As shown, in one embodiment, the inner diameter of the second passage 1112 gradually increases along the direction gradually away from the first passage 1111.
[0048] In this specific example, the inner diameter of the second passage 1112 gradually increases along the direction gradually away from the first passage 1111, so that the gradually expanding channel design can better adapt to the flow characteristics of the airflow, allowing the airflow to gradually diffuse in the second passage 1112, which can gradually slow down the airflow speed, thereby reducing the impact of the airflow on the first sensing chip 12, reducing the influence of wind noise on the first sensing chip 12, and improving the performance stability of the sensor.
[0049] Referring to Figures 1-3 As shown, in one embodiment, the inner diameter of the first passage 1111 along its extension direction is equal everywhere.
[0050] In this specific example, the equal inner diameter design of the first passage 1111 makes the flow state of the airflow relatively stable when flowing in the first passage 1111; at the same time, it also simplifies the manufacturing process of the first passage 1111 and reduces the production cost.
[0051] Specifically, referring to Figure 3 As shown, the airflow passage 111 opposite to the microphone MEMS chip (the first sensing chip 12) is arranged in a Y-shaped cross-section shape, thereby forming a multi-stage gradually expanding channel with the front cavity of the microphone MEMS chip, gradually expanding the cross-sectional area of the airflow passing from the first passage 1111 to the second passage 1112 to the front cavity of the MEMS chip. Referring to Figure 3As shown, the first-stage channel I corresponds to the first channel 1111, the second-stage channel II corresponds to the second channel 1112, and the third-stage channel III corresponds to the front cavity of the microphone MEMS chip, so that the energy dissipation is increased by gradually slowing down the airflow, the airflow speed is gradually slowed down, and the impact of the airflow on the sensing diaphragm of the microphone MEMS chip is reduced. Compared with the circular straight hole directly facing the microphone MEMS chip in the prior art, the airflow channel 111 increases the front cavity and improves the MIC frequency response curve, and the multi-stage sound transmission design allows the microphone MEMS chip to accurately capture and optimize different frequencies of sound, thereby improving the overall sound quality and sensitivity. By gradually adjusting the acoustic impedance, the efficient transmission of sound signals is ensured, energy loss and distortion are reduced, wind noise is reduced, and the sound transmission path is optimized.
[0052] Referring to Figures 1-3 As shown, in one embodiment, the sensor further comprises a second sensing chip 13 arranged in the accommodating cavity 100.
[0053] In this specific example, for example, the second sensing chip 13 is a pressure MEMS chip, and the sensor 1 is a combined sensor combining a microphone sensor and an air pressure sensor; accordingly, the sensor 1 further comprises a first processing chip 14 and a second processing chip 15 arranged in the accommodating cavity 100; wherein the first processing chip 14 is a microphone ASIC chip, and the second processing chip is a pressure ASIC chip. The pressure fluctuation caused by wind noise at the through hole 110 and the airflow channel 111 is as shown in the following figure: Figure 4 As shown, the structure does not affect the reception of air pressure / sound signals and can filter wind noise.
[0054] According to another embodiment of the present application, an electronic device is provided, which comprises the sensor 1 as described above; the electronic device is, for example, a smart watch.
[0055] The above embodiments mainly describe the differences between the embodiments, and the different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory. Considering the brevity of the writing, the above will not be repeated here.
[0056] Although some specific embodiments of the present application have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration and are not intended to limit the scope of the present application. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.
Claims
1. A sensor, characterized in that: The sensor comprises: A substrate (11), the substrate (11) having a first surface arranged along a thickness direction; A housing (10), the housing (10) being connected to the first surface of the substrate (11) and the two enclosed to form a receiving cavity (100); a first sensing chip (12), the first sensing chip (12) being arranged on a first surface of the substrate (11) and located in the accommodating cavity (100); The substrate (11) is provided with a through hole (110) in its length direction or width direction, and the substrate (11) is provided with an air flow channel (111), and the air flow channel (111) connects the through hole (110) and the first sensing chip (12).
2. The sensor according to claim 1, characterized in that The lengthwise dimension of the substrate (11) is greater than the widthwise dimension thereof, and the through hole (110) is opened through the substrate (11) along the widthwise direction.
3. The sensor according to claim 2, characterized in that The through hole (110) is in a rectangular parallelepiped shape, the length of the through hole (110) is arranged along the width direction of the substrate (11), the width of the through hole (110) is arranged along the length direction of the substrate (11), and the height of the through hole (110) is arranged along the thickness direction of the substrate (11).
4. The sensor according to claim 3, characterized in that The airflow channel (111) is extended along the thickness direction of the substrate (11), and the airflow channel (111) is located at a middle position of the width of the through hole (110).
5. The sensor according to claim 3, characterized in that The width of the through hole (110) is 10 to 20 times its height.
6. The sensor according to claim 1, characterized in that The air flow channel (111) comprises a first channel (1111) and a second channel (1112); the first channel (1111) is arranged closer to the through hole (110) than the second channel (1112); and the average inner diameter of the second channel (1112) is greater than the average inner diameter of the first channel (1111).
7. The sensor according to claim 6, characterized in that The inner diameter of the second channel (1112) gradually increases in a direction gradually moving away from the first channel (1111).
8. The sensor according to claim 7, characterized in that The inner diameter of the first channel (1111) is equal everywhere along its extending direction.
9. The sensor according to claim 1, wherein The sensor further comprises a second sensing chip (13), and the second sensing chip (13) is arranged in the accommodating cavity (100).
10. An electronic device, characterized in that: The electronic device comprises a sensor (1) according to any one of claims 1 to 9.