Daughter card optical backplane connector system

Abstract

A daughter card connector assembly includes: (a) a housing defining a first plane configured for mounting parallel to a backplane, a second plane for mounting parallel to a daughter card, and a plurality of parallel slots perpendicular to the first plane; and (b) one or more optoelectronic cards, each of the one or more optoelectronic cards disposed in one of the plurality of slots, and comprising at least: (i) a printed circuit board (PCB) defining at least a first edge and a second edge, where the first edge is parallel to a first plane when the optoelectronic cards are installed in the slots, and the second edge is parallel to a second plane when the optoelectronic cards are installed in the slots; the second edge is parallel to the second plane; (ii) a blind mating optical connector along the first edge; (iii) an electrical interface along the second edge; (iv) at least one optical component mounted on the PCB for converting between an electrical signal and an optical signal, the PCB being electrically connected to at least a portion of the electrical interface; and (v) one or more waveguides connecting the optical component and the optical connector.

Description

TECHNICAL FIELD

[0001] The present invention relates generally to printed circuit board (PCB) based backplane connector assemblies, and more particularly to PCB based backplane connector systems having blind mate optical interfaces. BACKGROUND

[0002] Printed circuit board (PCB) based backplane connectors are well known. For example, the MULTIGIG RT interconnect family from TE Connectivity (TE) is used in a variety of computer, communications, medical, industrial control, and military applications. These connector systems use printed circuit board (PCB) cards or “wafers” in place of traditional pin and socket contact systems, thereby eliminating the open pin field on the plug-in module portion of the backplane connector and reducing the end user’s exposure to field failures in the card cage system. A typical PCB backplane subcard connector assembly includes a housing defining a plurality of slots, with each slot configured to receive a separate PCB wafer.

[0003] Applicants recognized that PCB wafers could be improved by adding functionality to the wafers that converts between electrical signals and optical signals. To this end, applicants disclosed a high density optical subcard connector assembly described, for example, in U.S. Patent No. 10,852,489. This optical subcard connector assembly met many needs, particularly with respect to its free end optical fibers that could be configured. However, applicants recognized that there was a further need for a blind mate optical subcard connector assembly. The present invention meets these needs, among others. SUMMARY

[0004] The solution is provided by a subcard connector assembly including: (a) a housing defining a first plane configured to be parallel to a backplane installation, a second plane for a subcard installation, and a plurality of parallel slots perpendicular to the first plane; and (b) one or more optoelectronic cards, each of the one or more optoelectronic cards disposed in one of the plurality of slots, and including at least: (i) a printed circuit board (PCB) defining at least a first edge and a second edge, wherein the first edge is parallel to the first plane and the second edge is parallel to the second plane when the optoelectronic card is installed in the slot; (ii) a blind mate optical connector along the first edge; (iii) an electrical interface along the second edge; (iv) at least one optical component mounted on the PCB for converting between electrical signals and optical signals, the PCB electrically connected to at least a portion of the electrical interface; and (v) one or more waveguides connecting the optical component with the optical connector. BRIEF DESCRIPTION OF DRAWINGS

[0005] The application will now be described by way of example with reference to the accompanying drawings in which:

[0006] Figure 1 A perspective view of one embodiment of the subcard connector assembly of the present application is shown.

[0007] Figure 2a shows Figure 1 a perspective view of the subcard connector assembly of the present application, wherein the optical fiber connects the optical connector with the optical component, and Figure 2b shows a close-up view of a portion of Figure 2a.

[0008] Figure 3 An exploded view of one embodiment of the backplane connector of the present application is shown.

[0009] Figures 4a and 4b show a front perspective view and a rear perspective view, respectively, of the backplane connector of the present application. Figure 3

[0010] Figure 5 A front view of the backplane connector of the present application is shown. Figure 3

[0011] Figure 6 A front view of the connector assembly of the present application is shown. Figure 1

[0012] A rear perspective view of the backplane connector of the present application coupled with the subcard connector assembly of the present application is shown. Figure 7 Figure 1 Figure 3 A front perspective view of the backplane connector of the present application coupled with the subcard connector assembly of the present application is shown, wherein the cable extends at an angle from the rear of the backplane connector.

[0013] Figure 8 A front perspective view of the backplane connector of the present application coupled with the subcard connector assembly of the present application is shown, wherein the cable extends at an angle from the rear of the backplane connector. Figure 1 Figure 3 A cross-sectional view of the coupled connectors of the present application is shown.

[0014] Figure 9 Figures 10a-10d show perspective views of alternative embodiments of the subcard connector assembly having a heat sink to draw heat away from the wafer. Figure 7 DETAILED DESCRIPTION

[0015]

[0016] ​​​​​​​Accordingly, in one embodiment, the present invention is directed to a daughter card connector assembly comprising: (a) a housing defining a first plane configured to be mounted parallel to a backplane, a second plane configured to be mounted parallel to a daughter card, and a plurality of parallel slots perpendicular to the first plane; and (b) one or more optoelectronic cards, each of the one or more optoelectronic cards disposed in one of the plurality of slots and comprising at least: (i) a printed circuit board (PCB) defining at least a first edge and a second edge, wherein the first edge is parallel to the first plane and the second edge is parallel to the second plane when the optoelectronic card is mounted in the slot; (ii) a blind mate optical connector along the first edge; (iii) an electrical interface along the second edge; (iv) at least one optical component mounted on the PCB for converting between electrical signals and optical signals, the PCB electrically connected to at least a portion of the electrical interface; and (v) one or more waveguides connecting the optical component and the optical connector.

[0017] In another embodiment, the present invention is directed to an optoelectronic card for mounting in a slot of a housing of a daughter card connector assembly, the housing defining a first plane configured to be mounted parallel to a backplane, a second plane configured to be mounted parallel to a daughter card, and a plurality of parallel slots perpendicular to the first plane, the card comprising: (a) a printed circuit board (PCB) configured to be received within the slot and defining at least a first edge and a second edge, wherein the first edge is parallel to the first plane and the second edge is parallel to the second plane when the optoelectronic card is mounted in the slot; (b) a blind mate optical connector along the first edge; (c) an electrical interface along the second edge; (d) at least one optical component mounted on the PCB for converting between electrical signals and optical signals, the PCB electrically connected to at least a portion of the electrical interface; and (e) one or more waveguides connecting the optical component and the optical connector.

[0018] Reference is made to Figure 1-2, showing one embodiment of a daughter card connector assembly 100. The daughter card connector assembly 100 includes a housing 101 defining a first plane 101a configured to be mounted parallel to a backplane, a second plane 101b for mounting parallel to a daughter card (not shown), and a plurality of parallel slots 102 perpendicular to the first plane. The daughter card connector assembly 100 also includes one or more optoelectronic cards 103. Each of the one or more optoelectronic cards is disposed in one of the plurality of slots and includes at least a printed circuit board (PCB) 104 having at least a first edge 105 and a second edge 106. When the optoelectronic card is mounted in the slot, the first edge is parallel to the first plane and the second edge is parallel to the second plane. A blind mate optical connector (or ferrule) 107 is disposed along the first edge and an electrical interface is disposed along the second edge. (In the figure, the electrical interface is obscured by the housing 101.) At least one optical component 110 is mounted on the PCB for converting between electrical and optical signals, the PCB being electrically connected to at least a portion of the electrical interface. In this particular embodiment, the optical component 110 includes an optoelectronic device 110a and a driver circuit 110b. One or more waveguides 111 connect the optical component with the optical connector. In this embodiment, the waveguides are optical fibers 112.

[0019] Each of these elements / features is described in detail below in connection with selected alternative embodiments.

[0020] In one embodiment, the daughter card connector assembly includes discrete / modular optoelectronic cards 104. In one embodiment, each discrete optoelectronic card is releasably engaged with the housing 101. In one embodiment, the housing 101 includes a plurality of slots 102 and each optoelectronic card 104 is slidably engaged with one of the slots. Generally, each optoelectronic card includes one or more optical components for transmitting / receiving electrical / optical signals, although it should be appreciated that the optoelectronic card can be a dedicated optical receiver or a dedicated optical transmitter. In this regard, the modular construction of the optoelectronic cards allows a given daughter card connector assembly to be configured in different ways. For example, depending on the application, the daughter card connector assembly can include a portion of optoelectronic cards configured for transceiving and another portion of optoelectronic cards dedicated to receiving and / or transmitting.

[0021] Not only does the modularity of the optoelectronic cards provide flexibility in constructing a daughtercard connector assembly with transceiver / transmitter / receiver optoelectronic cards, but it also provides scalability. That is, in one embodiment, the daughtercard connector assembly of the present invention can be scaled up to meet the needs of an application, rather than purchasing and installing a daughtercard connector assembly with its full complement of channels. For example, initially, a backplane connector housing with relatively few optoelectronic cards can be installed, and subsequently, as the need for additional channels grows, additional optoelectronic cards can be added to the housing. Thus, in one embodiment, the daughtercard connector assembly of the present invention provides a pay-as-you-grow solution.

[0022] Another benefit of the modular construction of the optoelectronic card is the ability to replace defective optoelectronic cards or periodically upgrade them without having to replace the entire daughtercard connector assembly. In other words, unlike conventional transceivers, where the entire transceiver must be replaced if one or more channels become inoperable, in one embodiment of the backplane connector assembly, only the inoperable or obsolete optoelectronic card needs to be replaced. Thus, the modular construction of the optoelectronic card eliminates the single point of failure of the entire daughtercard connector assembly. Furthermore, the discrete optoelectronic card solution of the present invention enables configurable ratios of channel protection. More specifically, the scalable construction of the present invention enables users to precisely configure the desired channel protection level, for example, from 1:1 redundancy to 1:N redundancy, rather than having to provision an entire single redundant multi-channel transceiver (e.g., a 12-channel device) at higher initial and replacement costs.

[0023] An important feature of the daughter card connector assembly is the blind-mate optical connector 107 on the first edge 105 of the optoelectronic card 103. Such a connector facilitates blind mating of the connector with a backplane. As shown, the optical connector is an MT-type optical connector having alignment pins / alignment pin holes 150 at its ends, and the fiber end face 151 presented in the center. In this particular embodiment, the distance between the alignment pin holes is relatively large compared to the relatively few fibers present in the center of the ferrule. This configuration is generally preferred (although not required) because the longer distance between the fiber end face and the alignment pin holes tends to improve alignment of the fiber end face with the fiber end face of the mating connector 106 on the backplane. Although in Figure 1 While MT-type connectors are shown in the embodiments of FIG and 2 , other embodiments are possible within the scope of the present invention. For example, essentially any blind-mate optical connector can be used as long as it has a thin profile to accommodate the relatively small pitch between the slots of the daughter card connector assembly 100. For example, in one embodiment, the pitch is less than 2 mm, and in another embodiment, the pitch is less than 1.8 mm, and in another embodiment, the pitch is less than 1.5 mm.

[0024] As Figure 1 and shown in FIG. 2, one or more waveguides 111 connect the interposer 110a to the blind mate optical connector 107. In one embodiment, the waveguides are optical fibers 112 as Figure 1 and shown in FIG. 2. In yet another embodiment, the waveguides can be defined in the PCB such that the optical connector 107 is optically coupled to the PCB.

[0025] In one embodiment, the first edge of the card 104 further includes an electrical interface 130 for connecting to a mating connector on a backplane. In one embodiment, the electrical interface on the first edge is a blind mate electrical connector.

[0026] In one embodiment, the electrical interface on the second edge of the card is similar to the electrical interface disclosed in U.S. Patent No. 9,196,985, which is incorporated by reference herein. Also, in one embodiment, the second plane of the housing has a daughter card interface similar to the daughter card interface defined in the '985 patent. Specifically, in one embodiment, the daughter card interface includes a pinhole connector 120 along the second plane. (Such connectors are well known and will not be described in detail here)

[0027] In one embodiment, the optical component 110 includes an interposer 110a and a chip 110b. The interposer 110a includes an innovative interposer that minimizes skew and simplifies optical alignment. For example, one embodiment of the inventive interposer is disclosed in U.S. Patent Application No. 16 / 450,189, which is incorporated by reference herein in its entirety. In one embodiment, the interposer 110a is perpendicular to the optoelectronic card as Figure 1 and shown in FIG. 2. Such an embodiment has a number of advantages as described in the aforementioned application. In one embodiment, the interposer is disposed in the middle of the board, thereby reducing the length of the wire bonds between the traces in the PCB or the electrical interface on the second edge and the interposer, thereby reducing impedance / skew. In one embodiment, the interposer is part of a board mounted optical module that is mounted to the optoelectronic card.

[0028] In one embodiment, the interposer integrates both the optics and the chip.As used herein, an optical device may be any known or later developed component that can be optically coupled to an optical conduit, as described below. The optical device can be, for example: (a) an optoelectronic device (OED), which is an electrical device that emits, detects and / or controls light (e.g., a laser, such as a vertical cavity surface emitting laser (VCSEL), a double channel, a planar buried heterostructure (DC-PBH), a buried crescent (BC), a distributed feedback (DFB), a distributed Bragg reflector (DBR); a light emitting diode (LED), such as a surface emitting LED (SLED), an edge emitting LED (ELED), a superluminescent diode (SLD); a photodiode, such as a P intrinsic N (PIN) and an avalanche photodiode (APD); a photonic processor, such as a CMOS photonic processor for receiving an optical signal, processing the signal and sending a response signal, an electro-optical memory, an electro-optical random access memory (EO-RAM) or an electro-optical dynamic random access memory (EO-DRAM), and an electro-optical logic chip (EO logic chip) for managing the optical memory); or (b) a hybrid device that does not convert optical energy into another form but changes state in response to a control signal (e.g., a switch, a modulator, an attenuator and a tunable filter). It should also be understood that the optical device can be a single discrete device, or it can be assembled or integrated into an array of devices. It should also be understood that the optical device can be a single-mode or multi-mode device. In one embodiment, the optical device is a surface emitting light source. In one embodiment, the surface emitting light source is a VCSEL. In one embodiment, the optical component is photosensitive. In one embodiment, the photosensitive optical component is a photodiode.

[0029] In one embodiment, the optical component operates in conjunction with one or more electronic chips 110b. As used herein, "chip" refers to any electronic / semiconductor chip required to facilitate the functionality of the optical component. For example, if the optical component is a transmitter, the chip may be a driver, or if the optical component is a receiver, the chip may be a transimpedance amplifier (TIA). The chips required for a given optical component are well known in the art and will not be described in detail here.

[0030] Despite Figure 1 As shown in FIG. 2 , the chip is provided on an optoelectronic card, but in other embodiments, as disclosed in the '189 application, it is preferred to integrate the chip with the optical device on an interposer.

[0031] Now refer to Figure 3 , shows an embodiment of a backplane connector 300 of the present invention. The backplane connector is configured to be connected to a daughter card connector assembly (e.g., Figure 1) is mated with the daughter card connector assembly 100 shown in . The backplane connector has a front orientation and a rear orientation and includes a retainer block 301 configured for attachment to a backplane 303. The retainer block 301 defines a plurality of ferrule slots 302, each of which is configured to receive a ferrule 304. As shown, the plurality of ferrules 304 are configured to be disposed in the ferrule slots 302. A plurality of ferrule springs 306 are shown for urging the plurality of ferrules forward. The springs are retained in a plurality of ferrule spring retainers 307. The ferrule spring retainers are mounted rearwardly on the retainer block, with each ferrule spring retainer retaining springs for two or more ferrules. Each of these features and selected alternative embodiments are described in more detail below.

[0032] The function of the retainer block 301 is to secure the connector 300 to the backplane 303 and to maintain proper registration of the ferrule relative to the optoelectronic card of the daughter card connector assembly. This can be accomplished in different ways. For example, Figure 3 In an embodiment, a portion of the retainer block "floats" relative to the backplate. For example, in this embodiment, retainer block 301 includes a float 301b defining a ferrule slot for receiving a ferrule and maintaining proper registration, and a bracket 301a for securing the float to the backplate. Specifically, the bracket is configured to be secured to the backplate with fasteners 309 such that the float is sandwiched between the bracket and the backplate but is not secured to the backplate, thereby allowing the float to move relative to the backplate. In this particular embodiment, the bracket is secured to the front portion 303a of the backplate, although the bracket could also be secured to the rear portion 303b of the backplate. Additionally, while a floating retainer block is shown in this embodiment, the retainer block could be rigidly secured to the backplate, although this may not be preferred.

[0033] although Figure 3 The holder block shown has a single row of ferrule slot arrays, but other configurations are possible within the scope of the present invention. For example, in one embodiment, the holder block may define multiple rows of ferrule slots.

[0034] In one embodiment, the retainer block (or at least a portion thereof) comprises metal or other thermally conductive material to draw heat away from the optoelectronic card of the daughtercard connector assembly. For example, in one embodiment, the optoelectronic card includes one or more thermally conductive pads 130, as shown in FIG2b , to thermally couple with the thermally conductive portion of the retainer, thereby drawing heat away from the optoelectronic card. For example, referring to FIG4a , in one embodiment, the retainer block includes a protruding thermally conductive tab 402 that defines a slot 401 that coincides with the ferrule slot, such that the slot 401 is aligned with the leading edge of the optoelectronic card of the daughtercard connector assembly and thermally couples with the thermally conductive pad 130 when the daughtercard connector assembly 100 is coupled to the backplane connector 300. Based on this disclosure, one skilled in the art can determine other thermal paths between the optoelectronic board and the backplane connector without undue experimentation.

[0035] The ferrule spring retainer is used to hold the spring that pushes the ferrule forward. The applicant has found that the relatively small spacing between the optoelectronic cards makes the traditional method of using a spring retainer for each ferrule difficult. Therefore, in one embodiment of the present invention, a single ferrule retainer holds the springs for multiple ferrules. For example, referring to Figure 3 , each ferrule spring retainer holds the springs of two adjacent ferrules. In this particular embodiment, two springs correspond to each ferrule, and each ferrule spring retainer holds four springs. It should be understood that other embodiments are also possible.

[0036] exist Figure 3 In the embodiment shown, each ferrule spring retainer is fastened to the rear side of the retainer block with at least one fastener. In this particular embodiment, only two fasteners are used in an over / under relationship. This configuration allows for close spacing between the ferrule slots.

[0037] 4b, in one embodiment, each ferrule spring retainer defines at least one channel 405 through which the optical cable 305 passes (see Figure 3 ). In a more specific embodiment, each ferrule spring retainer defines two channels to accommodate a cable having two ferrules terminated with optical fibers. In one embodiment, the channels define a beveled portion 406 at the point where the optical cable exits the ferrule spring retainer. The beveled portion allows the cable to bend as it exits the ferrule spring retainer, as shown in FIG. Figure 8 As shown. Figure 8 As shown, the cable is a ribbon cable, although variations are possible. For example, in one embodiment, the cable includes a ribbon cable portion 880a (see FIG. 1 ) that terminates to a ferrule. Figure 9 ), and a round cable portion 880b for easier cable management (bending), as described, for example, in U.S. Patent Application Publication US20220283392A1. In another embodiment, the optical fiber is in a cable that is terminated to a ferrule using conventional equipment.

[0038] As Figure 3 shown, backplane connector 300 includes a plurality of ferrules for optically connecting with the optocarrier assembly. The function of ferrules is well known and will not be described in detail here. In this particular embodiment, the plurality of ferrules includes expanded beam lens ferrules. Expanded beam ferrules are generally preferred, although not required, because they do not require physical contact with mating ferrules. Rather, so long as the distance along the optical axis remains substantially constant between two mating ferrules. Sufficient optical coupling is achieved. In one embodiment, the plurality of ferrules includes guide pins for alignment. In a more particular embodiment, the plurality of ferrules includes MT-type ferrules.

[0039] Referring Figure 10A-1 0d, an alternate embodiment of an optocarrier assembly 1000 is shown having a heat sink 1001 to draw heat away from the die 1002 of the optocarrier 1003. In particular, referring to Figure 10a, the connector assembly 1000 is shown fully populated with optocarriers 1003. Each of the carriers includes a heat sink 1001 to dissipate heat from the optoelectronic drivers 1030. In particular, referring to Figure 10b, the optoelectronic drivers 1030 have been removed from one of the optocarriers to expose the front side ground pads 1019 having through-car vias 1020 to provide a thermal path from the front side ground pads to the back side of the die and heat sink 1001. Referring to Figures 10c and 10d, the back side of the optocarriers is shown. Figure 10d shows a portion of the heat sink that has been removed to expose back side thermal pads 1021 that are in thermal communication with the vias 1020. The back side thermal pads 1021 are in thermal communication with the heat sink 1001. In one embodiment, the back side thermal pads 1021 are significantly larger than the front side ground pads 1019 to maximize the thermal coupling between the thermal pads and the heat sink 1001.

[0040] In one embodiment, the die is thermally coupled to the backplane connector and / or the subcarriers to transfer heat away from the die. For example, in one embodiment, the card edge connector of the PCB die includes one or more thermal pads to conduct heat from the optocarriers through the connector into the backplane connector. In another embodiment, the thermal connectors between the connectors 120 are configured to conduct heat from the optocarriers to the subcarriers. Alternatively, the heat sink 1001 can also be thermally coupled to the thermal pads or thermal conductors described above. In one embodiment, the robustness of the heat sink 1001 can be used to dissipate heat from the subcarriers. In such an embodiment, the thermal conductors would be configured to conduct heat away from the subcarriers and into the heat sink 1001 to dissipate to the environment. Other embodiments for dissipating heat will be apparent to those of skill in the art in light of the present disclosure.

Claims

1. A daughter card connector assembly, comprising: a housing defining a first plane configured for mounting parallel to the backplane, a second plane for mounting parallel to the daughter card, and a plurality of parallel slots perpendicular to the first plane; and one or more optoelectronic cards, each of the one or more optoelectronic cards being disposed in one of the plurality of slots and comprising at least, a printed circuit board (PCB) defining at least a first edge and a second edge, wherein the first edge is parallel to a first plane and the second edge is parallel to a second plane when the optoelectronic card is installed in the slot; a blind-mate optical connector along the first edge; an electrical interface along the second edge; at least one optical component mounted on the PCB for converting between electrical signals and optical signals, the PCB being electrically connected to at least a portion of the electrical interface; and One or more waveguides connecting the optical component with the optical connector. 2 . The connector assembly of claim 1 , wherein the optoelectronic card further comprises a blind-mate electrical connector along the first edge. The connector assembly of claim 1 , wherein the waveguide is an optical fiber.

4. The connector assembly of claim 3, wherein the one or more waveguides comprise a plurality of optical fibers. The connector assembly of claim 1 , wherein the first plane and the second plane are perpendicular. 6 . The connector assembly of claim 5 , wherein the housing further comprises a plurality of pins along the second plane for electrically connecting to the daughter card.

7. The connector assembly of claim 6, wherein the second edge is electrically connected to the plurality of pins when the optoelectronic card is installed in the slot.

8. The connector assembly of claim 1 , wherein the optical component includes an interposer, the interposer including a substrate mounted vertically on the PCB, the substrate having a first side and a second side, and at least one hole defined therein to receive an optical fiber in the first side, and an optical device mounted on the second side, the optical device optically coupled to the optical fiber, the optical component further comprising a driver circuit mounted on the PCB and electrically connected to the optical device.

9. The connector assembly of claim 8, wherein the optical device is a VCSEL.

10. The connector assembly of claim 1, wherein the optical component comprises a transceiver. The connector assembly of claim 10 , wherein the transceiver is a dual-channel transceiver.

12. The connector assembly of claim 10, wherein the optical component is a four-channel transmitter or a four-channel receiver.

13. The connector assembly of claim 1, wherein the blind-mate optical connector comprises an air gap connector.

14. The connector assembly of claim 13, wherein the blind-mate optical connector comprises an expanded beam connector.

15. The connector assembly of claim 1, wherein the blind-mate optical connector is not a physical contact connector.

16. The connector assembly of claim 1, wherein the blind-mate optical connector is rigidly secured to the PCB such that any alignment movement is provided by a mating connector on the backplane.

17. The connector assembly of claim 1, wherein the blind-mate optical connector is an MT connector.

18. The connector assembly of claim 1, wherein the one or more optoelectronic cards comprises a plurality of optoelectronic cards.

19. The connector assembly of claim 1, wherein each of the one or more optoelectronic cards is releasably engaged with the housing.

20. The connector assembly of claim 1, wherein each of the one or more optoelectronic cards includes a heat sink in thermal communication with the PCB.

21. The connector assembly of claim 20 , wherein each of the one or more optoelectronic cards comprises a chip on the front side of the PCB for powering the optical component, a through-hole for conducting heat from the front side to the back side of the PCB, the through-hole being thermally connected to a heat sink on the back side.

22. An optoelectronic card for mounting in a slot of a housing of a daughter card connector assembly, the housing defining a first plane configured for mounting parallel to a backplane, a second plane for mounting parallel to the daughter card, and a plurality of parallel slots perpendicular to the first plane, the card comprising: a printed circuit board (PCB) configured to be received within the slot and defining at least a first edge and a second edge, wherein the first edge is parallel to a first plane and the second edge is parallel to a second plane when the optoelectronic card is installed within the slot; a blind-mate optical connector along the first edge; an electrical interface along the second edge; at least one optical component mounted on the PCB for converting between electrical signals and optical signals, the PCB being electrically connected to at least a portion of the electrical interface; and One or more waveguides connecting the optical component with the optical connector.

23. The optoelectronic card of claim 22, wherein the optoelectronic card further comprises a blind-mate electrical connector along the first edge.

24. The optoelectronic card of claim 22, wherein the waveguide is an optical fiber.

25. The optoelectronic card of claim 24, wherein the one or more waveguides comprise a plurality of optical fibers.

26. An optoelectronic card according to claim 22, wherein the optical component includes an interposer, the interposer including a substrate vertically mounted on the PCB, the substrate having a first side and a second side, and at least one hole defined therein to receive an optical fiber in the first side, and an optical device mounted on the second side, the optical device being optically connected to the optical fiber, the optical component also including a chip mounted on the PCB and electrically connected to the interposer.

27. The optoelectronic card of claim 26, wherein the optical device is a VCSEL.

28. The optoelectronic card of claim 22, wherein the optical component comprises a transceiver.

29. The optoelectronic card of claim 28, wherein the transceiver is a four-channel transceiver.

30. The optoelectronic card of claim 22, wherein the blind-mate optical connector comprises an air gap connector.

31. The optoelectronic card of claim 30, wherein the blind-mate optical connector comprises an expanded beam connector.

32. The optoelectronic card of claim 22, wherein the blind-mate optical connector is not a physical contact connector.

33. The optoelectronic card of claim 22, wherein the blind-mate optical connector is rigidly secured to the PCB such that any alignment movement is provided by a mating connector on the backplane.

34. The optoelectronic card of claim 22, wherein the blind-mate optical connector is an MT connector.

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