Liquid treatment device
By compactly arranging the functional arms and the carrying parts, the problems of large space occupation and long moving path of the existing liquid coating device are solved, and the wafer processing efficiency is improved.
Patent Information
- Application Number
- CN202410492956.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-23
- Publication Date
- 2025-10-24
AI Technical Summary
The existing liquid coating device requires five functional arms, which takes up a large space and has a long moving path for the functional arms, resulting in an increase in the time of the photolithography step and a reduction in wafer processing efficiency.
A liquid processing device is designed. A first supporting part and a second supporting part are adjacently provided on one side of the upper surface of a base, and the functional arms are compactly arranged to reduce the moving path. A multi-arm sharing and multi-directional movement method is adopted to save space and shorten the working path of the functional arms.
It effectively saves space, shortens the photolithography step time, and improves wafer processing efficiency.
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Figure CN120834033A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor manufacturing, in particular to a liquid processing device. BACKGROUND
[0002] Wafer refers to the silicon wafer used for making silicon semiconductor integrated circuits, the raw material of which is silicon, high-purity polycrystalline silicon is dissolved, then doped into a silicon crystal seed, and then slowly pulled out to form a cylindrical single crystal silicon. After the silicon crystal rod is ground, polished and sliced, a silicon wafer, that is, a wafer, is formed.
[0003] In the photolithography step of the semiconductor manufacturing process, a liquid coating device is used to supply a processing liquid for forming a coating film such as a resist to the wafer surface of a wafer to form a coating film. The existing liquid coating device requires five function arms to complete the work of two working units, each function arm occupies a large space, and the function arm has a long moving path during work, which increases the time of the photolithography step and reduces the wafer processing efficiency. SUMMARY
[0004] The purpose of the present application is to provide a liquid processing device which can save space, shorten the moving path of the function arm during work, reduce the time of the photolithography step, and improve the wafer processing efficiency.
[0005] To achieve the above-mentioned purpose, in a first aspect, the present application provides a liquid processing device, comprising a base, a first bearing part, a second bearing part, a first function arm, a second function arm, a third function arm and a fourth function arm; the first bearing part and the second bearing part are used to bear wafers, the first function arm, the second function arm, the third function arm and the fourth function arm are provided with nozzles and drive the nozzles to move; the first bearing part and the second bearing part are arranged side by side on one side of the upper surface of the base, the first function arm is arranged close to the first bearing part and the second bearing part and located between the first bearing part and the second bearing part; the second function arm is arranged away from the first bearing part and the second bearing part and opposite to the first function arm; the third function arm and the fourth function arm are arranged on both sides of the second function arm respectively.
[0006] Optionally, the third function arm and the fourth function arm are on the same straight line in the horizontal movement direction, the movement direction of the second function arm in the horizontal plane is two parallel straight lines with the movement direction of the third function arm and the fourth function arm, and the height of the plane where the second function arm is located is higher than the height of the plane where the third function arm and the fourth function arm are located.
[0007] Optionally, the first functional arm comprises a lifting mechanism, a rotating mechanism and a first fixed rod, the rotating mechanism is arranged on the lifting mechanism, the first fixed rod is arranged on the rotating mechanism, and the nozzle is arranged on the first fixed rod; wherein the lifting mechanism lifts the rotating mechanism along a direction perpendicular to a plane of the base, the rotating mechanism rotates the first fixed rod and drives the nozzle to rotate; the first functional arm further comprises a first direct-acting mechanism, the first fixed rod is connected with the rotating mechanism through the first direct-acting mechanism, and the first direct-acting mechanism is used to extend or retract the first fixed rod to adjust an extension distance of the nozzle.
[0008] Optionally, the second functional arm comprises a second direct-acting mechanism and a second fixed rod arranged on the second direct-acting mechanism, and the nozzle is arranged on the second fixed rod; the second direct-acting mechanism comprises a first horizontal slide, a first lifting slide in sliding connection with the first horizontal slide, and a first telescopic slide in sliding connection with the first lifting slide, and the second fixed rod is in sliding connection with the first telescopic slide to drive the nozzle to move; wherein the first horizontal slide is arranged along a first direction, the first lifting slide is arranged along a second direction, and the first telescopic slide is arranged along a third direction, the first direction is a length direction of the base, the second direction is a direction perpendicular to a plane of the base, and the third direction is perpendicular to the first direction and the second direction.
[0009] Optionally, the third functional arm comprises a third direct-acting mechanism and a third fixed rod arranged on the third direct-acting mechanism, and the nozzle is arranged on the third fixed rod; the third direct-acting mechanism comprises a second horizontal slide, a second lifting slide in sliding connection with the second horizontal slide, and a second telescopic slide in sliding connection with the second lifting slide, and the third fixed rod is in sliding connection with the second telescopic slide to drive the nozzle to move; wherein the second horizontal slide is arranged along the first direction, the second lifting slide is arranged along the second direction, and the second telescopic slide is arranged along the third direction.
[0010] Optionally, the fourth functional arm comprises a fourth direct-acting mechanism and a fourth fixed rod arranged on the fourth direct-acting mechanism, and the nozzle is arranged on the fourth fixed rod; the fourth direct-acting mechanism comprises a third horizontal slide, a third lifting slide in sliding connection with the third horizontal slide, and a third telescopic slide in sliding connection with the third lifting slide, and the fourth fixed rod is in sliding connection with the third telescopic slide to drive the nozzle to move; wherein the third horizontal slide is arranged along the first direction, the third lifting slide is arranged along the second direction, and the third telescopic slide is arranged along the third direction.
[0011] Optionally, the liquid processing device further comprises a first standby part, a second standby part, a third standby part and a fourth standby part arranged outside the first supporting part and the second supporting part; when the liquid processing device is in standby state, the first functional arm, the second functional arm, the third functional arm and the fourth functional arm respectively move their nozzles to the first standby part, the second standby part, the third standby part and the fourth standby part.
[0012] Optionally, the first supporting part comprises a first rotating fixing disc for fixing the wafer and driving the wafer to rotate, and the second supporting part comprises a second rotating fixing disc for fixing the wafer and driving the wafer to rotate.
[0013] Optionally, the first supporting part further comprises a plurality of first lifting pins uniformly arranged at the periphery of the first rotating fixing disc, and the first lifting pins are used for supporting the wafer on the first rotating fixing disc; the second supporting part further comprises a plurality of second lifting pins uniformly arranged at the periphery of the second rotating fixing disc, and the second lifting pins are used for supporting the wafer on the second rotating fixing disc.
[0014] Optionally, the first supporting part further comprises a first cylinder, and the first rotating fixing disc and the three first lifting pins are located in the first cylinder, and the upper surface of the first cylinder is higher than the upper surface of the first rotating fixing disc; the second supporting part further comprises a second cylinder, and the second rotating fixing disc and the three second lifting pins are located in the second cylinder, and the upper surface of the second cylinder is higher than the upper surface of the second rotating fixing disc.
[0015] The application has the following beneficial effects:
[0016] The application provides a liquid processing device, which comprises a base, a first supporting part and a second supporting part arranged on one side of the upper surface of the base for supporting and fixing a wafer, a first functional arm arranged close to the first supporting part and the second supporting part and between the first supporting part and the second supporting part, a second functional arm arranged away from the first supporting part and the second supporting part and opposite to the first functional arm, and between the first supporting part and the second supporting part, a third functional arm and a fourth functional arm arranged on the two sides of the second functional arm respectively. BRIEF DESCRIPTION OF DRAWINGS
[0017] In order to more clearly illustrate the technical solution of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.
[0018] Figure 1 This is a schematic plan view of the liquid treatment device of this application;
[0019] Figure 2 This is a schematic structural diagram of the liquid processing device of this application.
[0020] Icons: 10-base; 11-first standby section; 12-second standby section; 13-third standby section; 14-fourth standby section; 20-first bearing section; 21-first rotating fixed disk; 22-first lifting pin; 23-first cylinder; 30-second bearing section; 31-second rotating fixed disk; 32-second lifting pin; 33-second cylinder; 40-first functional arm; 41-rotating mechanism; 42-first fixing rod; 50-second functional arm; 51-second direct-acting mechanism; 511-first horizontal slide; 512-first lifting slide; 513-first telescopic slide; 52-second fixed rod; 60-third functional arm; 61-third direct-acting mechanism; 611-second horizontal slide; 612-second lifting slide; 613-second telescopic slide; 62-third fixed rod; 70-fourth functional arm; 71-fourth direct-acting mechanism; 711-third horizontal slide; 712-third lifting slide; 713-third telescopic slide; 72-fourth fixed rod.
[0021] The realization of the objectives, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0022] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.
[0023] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0024] In this application, unless otherwise clearly specified and limited, the terms "connection", "fixing", and the like should be understood in a broad sense, for example, "fixing" can be fixed connection, or detachable connection, or integral; can be mechanical connection, or electrical connection; can be direct connection, or indirect connection through intermediate medium; can be internal connection of two elements, or interaction relationship between two elements, unless otherwise clearly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0025] In addition, if the description of "first", "second" and the like is involved in the embodiments of the present application, the description of "first", "second" and the like is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing throughout the text includes three parallel schemes. For example, "A and / or B" includes A scheme, or B scheme, or A and B scheme. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, nor within the scope of protection claimed by the present application.
[0026] The existing liquid coating device needs five function arms to complete the work of two working units, each function arm occupies a large space, and the moving path of the function arm is long during the working process, which increases the time of the photoetching step and reduces the wafer processing efficiency. In view of the above problems, the technical solutions provided in the embodiments of the present application are used to overcome the above problems.
[0027] Embodiment 1
[0028] Please refer to Figure 1 and Figure 2The embodiment of the application provides a liquid processing device, which comprises a base 10, a first bearing part 20, a second bearing part 30, a first functional arm 40, a second functional arm 50, a third functional arm 60 and a fourth functional arm 70; the first bearing part 20 and the second bearing part 30 are used for bearing wafers, the first functional arm 40, the second functional arm 50, the third functional arm 60 and the fourth functional arm 70 are all provided with nozzles and drive the nozzles to move; the first bearing part 20 and the second bearing part 30 are arranged side by side on one side of the upper surface of the base 10, the first functional arm 40 is arranged close to the first bearing part 20 and the second bearing part 30 and is located between the first bearing part 20 and the second bearing part 30; the second functional arm 50 is arranged away from the first bearing part 20 and the second bearing part 30 and opposite to the first functional arm 40; the third functional arm 60 and the fourth functional arm 70 are arranged on the two sides of the second functional arm 50 respectively.
[0029] Specifically, the first bearing part 20 and the second bearing part 30 are arranged side by side and adjacent to each other on the base 10 and close to one side edge of the base 10 and are used for bearing and fixing wafers; the first functional arm 40 and the second functional arm 50 are arranged on the two sides of the center connecting line of the first bearing part 20 and the second bearing part 30 respectively, the first functional arm 40 is arranged close to the first bearing part 20 and the second bearing part 30 and is located between the first bearing part 20 and the second bearing part 30, the second functional arm 50 is arranged away from the first bearing part 20 and the second bearing part 30 and opposite to the first functional arm 40, and the third functional arm 60 and the fourth functional arm 70 are located on the two sides of the second functional arm 50 respectively.
[0030] The first functional arm 40 and the second functional arm 50 are shared by the first bearing part 20 and the second bearing part 30, and the first functional arm 40 and the second functional arm 50 can drive the nozzles on them to move to the first bearing part 20 or the second bearing part 30 respectively and spray liquid on the wafers on the first bearing part 20 or the second bearing part 30. It can be understood that the working forms of the first functional arm 40 and the second functional arm 50 are:
[0031] The first functional arm 40 moves and holds the nozzle on itself to perform liquid coating at the center of the first carrier 20, the second functional arm 50 moves and holds the nozzle on itself to perform synchronous liquid coating at the eccentric circle of the first carrier 20, or the second functional arm 50 moves and holds the nozzle on itself to perform liquid coating at the center of the first carrier 20, and the first functional arm 40 moves and holds the nozzle on itself to perform synchronous liquid coating at the eccentric circle of the first carrier 20; similarly, the same working mode is performed on the second carrier 30. The first functional arm 40 can also move and hold the nozzle on itself to perform liquid coating at the center of the first carrier 20, and the second functional arm 50 can also move and hold the nozzle on itself to perform liquid coating at the center of the second carrier 30, after the coating is completed, the first functional arm 40 moves and holds the nozzle on itself to perform liquid coating at the eccentric circle of the second carrier 30, and the second functional arm 50 moves and holds the nozzle on itself to perform liquid coating at the eccentric circle of the first carrier 20. Here, the working mode of the first functional arm 40 and the second functional arm 50 is not listed one by one, and can be flexibly set according to actual production needs.
[0032] It should be noted that the third functional arm 60 is located on one side of the first carrier 20, and the third functional arm 60 moves and holds the nozzle on itself to perform liquid coating at the edge of the first carrier 20 to complete the liquid coating of the edge of the wafer on the first carrier 20. The fourth functional arm 70 is located on one side of the second carrier 30, and the fourth functional arm 70 moves and holds the nozzle on itself to perform liquid coating at the edge of the second carrier 30 to complete the liquid coating of the edge of the wafer on the second carrier 30.
[0033] The liquid processing device provided in the application sets the adjacent first carrier 20 and second carrier 30 on one side of the upper surface of the base 10 for carrying and fixing the wafer, further sets the first functional arm 40 close to the first carrier 20 and the second carrier 30, and between the first carrier 20 and the second carrier 30, reduces the moving path of the first functional arm 40; sets the second functional arm 50 away from the first carrier 20 and the second carrier 30, and opposite to the first functional arm 40, and the second functional arm 50 is also located between the first carrier 20 and the second carrier 30, reduces the moving path of the second functional arm 50, and makes the first carrier 20 and the second carrier 30 share the first functional arm 40 and the second functional arm 50; further sets the third functional arm 60 and the fourth functional arm 70 on both sides of the second functional arm 50 respectively; so that the first functional arm 40, the second functional arm 50, the third functional arm 60 and the fourth functional arm 70 are more compact in space, can save space, shorten the moving path of the functional arm in work, reduce the time of the photoetching step, and improve the wafer processing efficiency.
[0034] In the embodiment of the present application, the third functional arm 60 and the fourth functional arm 70 are in the same straight line in the horizontal plane movement direction, the second functional arm 50 is in two parallel straight lines with the third functional arm 60 and the fourth functional arm 70 in the horizontal plane movement direction, and the height of the plane where the second functional arm 50 is located is higher than the height of the plane where the third functional arm 60 and the fourth functional arm 70 are located
[0035] Specifically, in the working process of the first functional arm 40, the second functional arm 50, the third functional arm 60 and the fourth functional arm 70, because the first functional arm 40 and the second functional arm 50 are oppositely arranged on the two sides of the first bearing part 20 and the second bearing part 30, the movement of the first functional arm 40 and the second functional arm 50 will not interfere with each other. Further, the movement direction of the fourth functional arm 70 and the third functional arm 60 and the fourth functional arm 70 are in two parallel straight lines, and when moving in the horizontal direction, the second functional arm 50, the third functional arm 60 and the fourth functional arm 70 will not interfere with each other, and the height of the plane where the second functional arm 50 is located is higher than the height of the plane where the third functional arm 60 and the fourth functional arm 70 are located, avoiding interference due to height overlap.
[0036] Embodiment 2
[0037] Please refer to Figure 1 and Figure 2 , the first functional arm 40 of the present embodiment includes a lifting mechanism, a rotating mechanism 41 and a first fixed rod 42, the rotating mechanism 41 is arranged on the lifting mechanism, the first fixed rod 42 is arranged on the rotating mechanism 41, and the nozzle is arranged on the first fixed rod 42, wherein the lifting mechanism lifts the rotating mechanism along the direction perpendicular to the plane of the base 10, the rotating mechanism 41 rotates the first fixed rod 42 and drives the nozzle to rotate; the first functional arm 40 further includes a first straight motion mechanism, the first fixed rod 42 is connected with the rotating mechanism 41 through the first straight motion mechanism, and the first straight motion mechanism is used to extend and retract the first fixed rod 42 to adjust the extension distance of the nozzle.
[0038] Specifically, the lifting mechanism moves the rotating mechanism 41 along the direction perpendicular to the plane of the base 10, avoiding interference between the first functional arm 40 and the second functional arm 50. The rotating mechanism 41 rotates the first fixed rod 42 and drives the nozzle to move quickly between the first bearing part 20 and the second bearing part 30, and the first straight motion mechanism can adjust the length of the first fixed rod 42, further extending the distance of the nozzle, so that the nozzle can have a larger moving range and better complete the work of coating liquid on the wafer.
[0039] In the embodiment of the present application, the second functional arm 50 comprises a second direct-acting mechanism 51 and a second fixed rod 52 arranged on the second direct-acting mechanism 51, and the nozzle is arranged on the second fixed rod 52; the second direct-acting mechanism 51 comprises a first horizontal slide 511, a first lifting slide 512 in sliding connection with the first horizontal slide 511, and a first telescopic slide 513 in sliding connection with the first lifting slide 512, and the second fixed rod 52 is in sliding connection with the first telescopic slide 513 to drive the nozzle to move; wherein the first horizontal slide 511 is arranged along a first direction, the first lifting slide 512 is arranged along a second direction, and the first telescopic slide 513 is arranged along a third direction, the first direction is the length direction of the base 10, the second direction is the direction perpendicular to the plane of the base 10, and the third direction is perpendicular to the first direction and perpendicular to the second direction.
[0040] Specifically, the second direct-acting mechanism 51 of the second functional arm 50 can displace in three directions, the first lifting slide 512 slides on the first horizontal slide 511 along the first direction, the first telescopic slide 513 slides on the first lifting slide 512 along the second direction, and the second fixed rod 52 slides on the first telescopic slide 513 along the third direction; in the working process of the second functional arm 50, the second fixed rod 52 keeps and fixes the nozzle thereof, since the second functional arm 50 is arranged between the first bearing part 20 and the second bearing part 30, the moving path of the second direct-acting mechanism 51 in three directions is short, so that the nozzle can be kept on the first bearing part 20 or the second bearing part 30 to complete the work of coating liquid, and the movement of the second direct-acting mechanism 51 in three directions is more flexible, thereby saving the space of the liquid processing device, and further saving the time of coating liquid due to the shorter path, thereby further improving the efficiency of the photoetching process.
[0041] In the embodiment of the present application, the third functional arm 60 comprises a third direct-acting mechanism 61 and a third fixed rod 62 arranged on the third direct-acting mechanism 61, and the nozzle is arranged on the third fixed rod 62; the third direct-acting mechanism 61 comprises a second horizontal slide 611, a second lifting slide 612 in sliding connection with the second horizontal slide 611, and a second telescopic slide 613 in sliding connection with the second lifting slide 612, and the third fixed rod 62 is in sliding connection with the second telescopic slide 613 to drive the nozzle to move; wherein the second horizontal slide 611 is arranged along the first direction, the second lifting slide 612 is arranged along the second direction, and the second telescopic slide 613 is arranged along the third direction.
[0042] Specifically, the third straight motion mechanism 61 of the third functional arm 60 can move in three directions, the second lifting slide 612 slides on the second horizontal slide 611 in the first direction, the second telescopic slide 613 slides on the second lifting slide 612 in the second direction, and the third fixed rod 62 slides on the second telescopic slide 613 in the third direction. During the operation of the third functional arm 60, the movement of the third straight motion mechanism 61 in the three directions makes the third fixed rod 62 keep and fix the nozzle on the edge of the first carrier 20, and completes the coating of the liquid on the edge of the wafer on the first carrier 20. By using the above arrangement, the movement of the third straight motion mechanism 61 in the three directions is more flexible, the time for coating the liquid is saved, and the efficiency of the photolithography process is improved.
[0043] In the embodiment of the present application, the fourth functional arm 70 comprises a fourth straight motion mechanism 71 and a fourth fixed rod 72 arranged on the fourth straight motion mechanism 71, and the nozzle is arranged on the fourth fixed rod 72; the fourth straight motion mechanism 71 comprises a third horizontal slide 711, a third lifting slide 712 slidably connected with the third horizontal slide 711, and a third telescopic slide 713 slidably connected with the third lifting slide 712, and the fourth fixed rod 72 is slidably connected with the third telescopic slide 713 to drive the nozzle to move; wherein the third horizontal slide 711 is arranged along the first direction, the third lifting slide 712 is arranged along the second direction, and the third telescopic slide 713 is arranged along the third direction.
[0044] Specifically, the fourth straight motion mechanism 71 of the fourth functional arm 70 can move in three directions, the third lifting slide 712 slides on the third horizontal slide 711 in the first direction, the third telescopic slide 713 slides on the third lifting slide 712 in the second direction, and the fourth fixed rod 72 slides on the third telescopic slide 713 in the third direction. During the operation of the fourth functional arm 70, the movement of the fourth straight motion mechanism 71 in the three directions makes the fourth fixed rod 72 keep and fix the nozzle on the edge of the second carrier 30, and completes the coating of the liquid on the edge of the wafer on the second carrier 30. By using the above arrangement, the movement of the fourth straight motion mechanism 71 in the three directions is more flexible, which further saves the time for coating the liquid and improves the efficiency of the photolithography process.
[0045] Embodiment 3
[0046] Please refer to Figure 1 and Figure 2In the embodiment, the liquid processing device further comprises a first standby part 11, a second standby part 12, a third standby part 13 and a fourth standby part 14 arranged outside the first supporting part 20 and the second supporting part 30, and when the liquid processing device is in standby state, the first functional arm 40, the second functional arm 50, the third functional arm 60 and the fourth functional arm 70 respectively move their nozzles to the first standby part 11, the second standby part 12, the third standby part 13 and the fourth standby part 14.
[0047] Specifically, when the first functional arm 40, the second functional arm 50, the third functional arm 60 and the fourth functional arm 70 are in standby state in non-working condition, the first functional arm 40 moves the nozzle to be placed in the first standby part 11, the second functional arm 50 moves the nozzle to be placed in the second standby part 12, the third functional arm 60 moves the nozzle to be placed in the third standby part 13, and the fourth functional arm 70 moves the nozzle to be placed in the fourth standby part 14. It should be noted that the first standby part 11, the second standby part 12, the third standby part 13 and the fourth standby part 14 can flush the nozzles and can observe the fluid state of the liquid sprayed by the nozzles. By using the above arrangement, not only the nozzles are protected and flushed, but also the nozzles with abnormal liquid spraying can be found in time, preventing the liquid coating effect from being affected by damaged nozzles.
[0048] Embodiment 4
[0049] Please refer to Figure 1 and Figure 2 In the embodiment, the first supporting part 20 comprises a first rotating fixed disc 21 for fixing the wafer and driving the wafer to rotate, the second supporting part 30 comprises a second rotating fixed disc 31 for fixing the wafer and driving the wafer to rotate, the first supporting part 20 further comprises a plurality of first lifting pins 22 uniformly arranged at the periphery of the first rotating fixed disc 21, and the first lifting pins 22 are used for supporting the wafer on the first rotating fixed disc 21; the second supporting part 30 further comprises a plurality of second lifting pins 32 uniformly arranged at the periphery of the second rotating fixed disc 31, and the second lifting pins 32 are used for supporting the wafer on the second rotating fixed disc 31.
[0050] Specifically, the first lifting pin 22 is used to receive the wafer transported by other devices to the liquid processing device, the first lifting pin 22 is raised to receive the wafer, and when the first lifting pin 22 is lowered, the wafer is placed on the first rotating fixed disc 21, the first rotating fixed disc 21 carries and fixes the wafer and drives the wafer to rotate, at this time, the liquid processing device performs the work of coating the wafer with liquid. It can be understood that there are many methods for the first rotating fixed disc 21 to fix the wafer, and in the embodiment, the specific limitation is not made, and the actual production demand can be flexibly set. It should be noted that the second rotating fixed disc 31 and the second lifting pin 32 have the same setting form and beneficial effect as the first rotating fixed disc 21 and the second rotating fixed disc 31, and will not be repeated here.
[0051] In the embodiment, the first bearing part 20 further comprises a first cylinder 23, the first rotating fixed disc 21 and the three first lifting pins 22 are located in the first cylinder 23, and the upper surface of the first cylinder 23 is higher than the upper surface of the first rotating fixed disc 21; the second bearing part 30 further comprises a second cylinder 33, the second rotating fixed disc 31 and the three second lifting pins 32 are located in the second cylinder 33, and the upper surface of the second cylinder 33 is higher than the upper surface of the second rotating fixed disc 31.
[0052] Specifically, the first cylinder 23 is arranged outside the first rotating fixed disc 21 and the three first lifting pins 22, surrounds the first rotating fixed disc 21 and the three first lifting pins 22, and the upper surface of the first cylinder 23 is higher than the upper surface of the first rotating fixed disc 21. When the liquid processing device coats the wafer with liquid, the first rotating fixed disc 21 drives the wafer to rotate, the liquid spreads from the center of the wafer to the edge due to the centrifugal force, and the excess liquid is thrown out of the wafer, the cylinder wall of the first cylinder 23 can block the thrown excess liquid, prevent the liquid from splashing on other wafers, and improve the yield of the photolithography process. It should be noted that the setting form and beneficial effect of the second cylinder 33 are the same as those of the first cylinder 23, and will not be repeated here.
[0053] The above is only a specific implementation manner of the embodiment of the application, but the protection scope of the embodiment of the application is not limited to this. Any change or replacement within the technical scope disclosed in the embodiment of the application should be covered in the protection scope of the embodiment of the application. Therefore, the protection scope of the embodiment of the application should be subject to the protection scope of the claims.
Claims
1. A liquid treatment device, characterized by, The base, the first bearing part, the second bearing part, the first functional arm, the second functional arm, the third functional arm and the fourth functional arm are provided. The first bearing part and the second bearing part are used for bearing wafers, and the first functional arm, the second functional arm, the third functional arm and the fourth functional arm are provided with nozzles and drive the nozzles to move. The first bearing part and the second bearing part are arranged side by side on one side of the upper surface of the base, the first functional arm is arranged close to the first bearing part and the second bearing part and between the first bearing part and the second bearing part, the second functional arm is arranged away from the first bearing part and the second bearing part and opposite to the first functional arm, and the third functional arm and the fourth functional arm are arranged on the two sides of the second functional arm respectively.
2. The fluid treatment device defined in claim 1, wherein The third functional arm and the fourth functional arm are on the same straight line in the horizontal movement direction, the second functional arm is on two parallel straight lines in the horizontal movement direction, and the plane where the second functional arm is located is higher than the plane where the third functional arm and the fourth functional arm are located.
3. The fluid treatment device defined in claim 1, wherein The first functional arm comprises a lifting mechanism, a rotating mechanism and a first fixed rod, the rotating mechanism is arranged on the lifting mechanism, the first fixed rod is arranged on the rotating mechanism, and the nozzle is arranged on the first fixed rod. The lifting mechanism lifts the rotating mechanism along the direction perpendicular to the plane of the base, the rotating mechanism rotates the first fixed rod and drives the nozzle to rotate. The first functional arm further comprises a first direct-acting mechanism, the first fixed rod is connected with the rotating mechanism through the first direct-acting mechanism, and the first direct-acting mechanism is used for telescoping the first fixed rod to adjust the extension distance of the nozzle.
4. The fluid treatment device defined in claim 3, wherein The second functional arm comprises a second direct-acting mechanism and a second fixed rod arranged on the second direct-acting mechanism, and the nozzle is arranged on the second fixed rod. The second direct-acting mechanism comprises a first horizontal slide, a first lifting slide connected with the first horizontal slide in sliding mode, and a first telescopic slide connected with the first lifting slide in sliding mode, and the second fixed rod is connected with the first telescopic slide in sliding mode to drive the nozzle to move. The first horizontal slide is arranged along a first direction, the first lifting slide is arranged along a second direction, and the first telescopic slide is arranged along a third direction, the first direction is the length direction of the base, the second direction is the direction perpendicular to the plane of the base, and the third direction is perpendicular to the first direction and the second direction.
5. The fluid treatment device defined in claim 4, wherein The third functional arm comprises a third direct-acting mechanism and a third fixed rod arranged on the third direct-acting mechanism, and the nozzle is arranged on the third fixed rod. The third direct-acting mechanism comprises a second horizontal slide, a second lifting slide connected with the second horizontal slide in sliding mode, and a second telescopic slide connected with the second lifting slide in sliding mode, and the third fixed rod is connected with the second telescopic slide in sliding mode to drive the nozzle to move. The second horizontal slide is arranged along the first direction, the second lifting slide is arranged along the second direction, and the second telescopic slide is arranged along the third direction.
6. The fluid treatment device defined in claim 5, wherein The fourth function arm comprises a fourth direct-acting mechanism and a fourth fixed rod arranged on the fourth direct-acting mechanism, and the nozzle is arranged on the fourth fixed rod. The fourth direct-acting mechanism comprises a third horizontal slide, a third lifting slide in sliding connection with the third horizontal slide, and a third telescopic slide in sliding connection with the third lifting slide, and the fourth fixed rod is in sliding connection with the third telescopic slide to drive the nozzle to move. The third horizontal slide is arranged along the first direction, the third lifting slide is arranged along the second direction, and the third telescopic slide is arranged along the third direction.
7. The fluid treatment device defined in claim 6, wherein The liquid processing device further comprises a first standby part, a second standby part, a third standby part and a fourth standby part arranged outside the first bearing part and the second bearing part. When the liquid processing device is in standby state, the first function arm, the second function arm, the third function arm and the fourth function arm respectively move their nozzles to the first standby part, the second standby part, the third standby part and the fourth standby part.
8. The fluid treatment device defined in any one of claims 1-7, wherein The first bearing part comprises a first rotary fixed disc for fixing the wafer and driving the wafer to rotate, and the second bearing part comprises a second rotary fixed disc for fixing the wafer and driving the wafer to rotate.
9. The fluid treatment device defined in claim 8, wherein The first bearing part further comprises a plurality of first lifting pins uniformly arranged on the periphery of the first rotary fixed disc, and the first lifting pins are used for supporting the wafer on the first rotary fixed disc. The second bearing part further comprises a plurality of second lifting pins uniformly arranged on the periphery of the second rotary fixed disc, and the second lifting pins are used for supporting the wafer on the second rotary fixed disc.
10. The fluid treatment device defined in claim 9, wherein The first bearing part further comprises a first cylinder, and the first rotary fixed disc and the three first lifting pins are located in the first cylinder, and the upper surface of the first cylinder is higher than the upper surface of the first rotary fixed disc. The second bearing part further comprises a second cylinder, and the second rotary fixed disc and the three second lifting pins are located in the second cylinder, and the upper surface of the second cylinder is higher than the upper surface of the second rotary fixed disc.