A die bonder

Abstract

The application relates to the technical field of die bonding equipment, and discloses a die bonder, which comprises a transfer table and a cleaning assembly. The transfer table is provided with a bearing surface used for bearing a chip. The cleaning assembly is connected to the transfer table and is used for generating a cleaning airflow passing through the bearing surface. When the chip is placed on the bearing surface, the cleaning airflow can clean the chip. In actual application, the cleaning airflow can be generated by the cleaning assembly to clean the bearing surface before the chip is placed on the bearing surface, and / or the cleaning airflow can be generated by the cleaning assembly to clean the chip after the chip is placed on the bearing surface. Therefore, the chip is not prone to being polluted by impurities when temporarily staying on the transfer table. The die bonder has the characteristics of good die bonding quality.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of die bonding equipment, and more particularly relates to a die bonder. BACKGROUND

[0002] The die bonder is a core device for realizing precise bonding of a chip and a substrate. The die bonder is usually provided with a transfer table between a chip conveying process and a die bonding process. In the working process of the die bonder, the chip is first transferred from the chip conveying process to the transfer table, and then transferred from the transfer table to the die bonding process. The transfer table is provided to facilitate adjustment of the posture of the chip in the process of being transferred to the die bonding process, so as to ensure the bonding accuracy of the chip. However, the chip is temporarily stopped on the transfer table, which is prone to cause the surface of the chip to be contaminated by impurities, thereby affecting the die bonding quality. SUMMARY

[0003] The main purpose of the present application is to provide a die bonder with good die bonding quality.

[0004] According to a first aspect of the present application, a die bonder is provided, which comprises a transfer table and a cleaning assembly. The transfer table has a bearing surface for bearing a chip. The cleaning assembly is connected to the transfer table and is used to generate a cleaning air flow passing through the bearing surface. When the chip is placed on the bearing surface, the cleaning air flow cleans the chip.

[0005] In a specific embodiment of the present application, the transfer table has a first direction.

[0006] The cleaning assembly comprises a first air pipe connected to the transfer table and located on one side of the bearing surface in the first direction. The first air pipe is provided with air blowing holes facing the bearing surface, which are used for blowing air.

[0007] In a specific embodiment of the present application, one end of the first air pipe facing the bearing surface has an arc-shaped concave surface, and the number of air blowing holes is multiple. The multiple air blowing holes are arranged on the arc-shaped concave surface at intervals.

[0008] In a specific embodiment of the present application, the cleaning assembly further comprises a second air pipe connected to the transfer table. In the first direction, the second air pipe is arranged on the other side of the bearing surface relative to the first air pipe. The second air pipe is provided with air suction holes facing the bearing surface, which are used for sucking air.

[0009] In a specific embodiment of the present application, one end of the second air pipe facing the bearing surface has a flow converging groove, and the air suction holes are arranged on the groove bottom surface of the flow converging groove.

[0010] In a specific embodiment of the present application, the transfer table further has a second direction and a third direction, the first direction, the second direction and the third direction are perpendicular to each other, wherein the length direction of the first air pipe and the second air pipe is parallel to the second direction, and the perpendicular line of the bearing surface extends along the third direction;

[0011] In the first air pipe, the arc-shaped concave surface extends along the second direction by a first preset distance, and a plurality of the air blowing holes are arranged at intervals along the second direction;

[0012] In the second air pipe, the converging groove extends along the second direction by a second preset distance, and the air suction hole is in a strip shape, and the length direction of the air suction hole is the same as the length direction of the second air pipe.

[0013] In a specific embodiment of the present application, the transfer table comprises a mounting seat, an air passage communication seat and an adsorption seat connected along the third direction, the air passage communication seat has a first air passage, the adsorption seat has the bearing surface, and the bearing surface is provided with an adsorption hole, and the adsorption hole is in communication with the first air passage;

[0014] The first air pipe and the second air pipe are connected on the mounting seat.

[0015] In a specific embodiment of the present application, the mounting seat comprises a mounting plate, a first mounting ear and a second mounting ear, the first mounting ear and the second mounting ear are connected to one end of the mounting plate along the second direction, and the first mounting ear and the second mounting ear are arranged at intervals along the first direction, and an avoiding space is formed between the first mounting ear and the second mounting ear, and the avoiding space is used for avoiding a material taking mechanism;

[0016] The air passage communication seat is connected to the mounting plate, one end of the first air pipe along the length direction is connected to the first mounting ear, and one end of the second air pipe along the length direction is connected to the second mounting ear.

[0017] In a specific embodiment of the present application, the die bonder further comprises a light source assembly, the light source assembly is used for irradiating the bearing surface, and the light source assembly is connected to the mounting seat.

[0018] In a specific embodiment of the present application, the light source assembly comprises a first support, a first light source, a second support and a second light source, the first light source and the second light source are used for irradiating the bearing surface;

[0019] The first support is connected to the first mounting ear, the first light source is connected to the first support, and along the third direction, the first light source is located on the side of the first air pipe away from the mounting plate;

[0020] The second support is connected to the mounting plate, and the second light source is connected to the second support and faces the avoiding space along the second direction.

[0021] In a specific embodiment of the present application, the second support extends to the side of the air passage communication seat away from the mounting plate along the third direction.

[0022] In the third direction, the air passage communication seat is provided with a positioning protrusion on the side facing the adsorption seat, and the positioning protrusion is located at one end of the air passage communication seat in the first direction.

[0023] The end of the adsorption seat in the first direction is in contact with the positioning protrusion, and the end of the adsorption seat away from the avoiding space in the second direction is in contact with the second support.

[0024] In a specific embodiment of the present application, the light source assembly includes a first support, a first light source, a second support, and a second light source, and the first light source and the second light source are used to irradiate the bearing surface.

[0025] The first support is connected to the first mounting lug, and the first light source is connected to the first support and located on the side of the first air pipe away from the mounting plate along the third direction.

[0026] The second support is connected to the mounting plate, and the second light source is connected to the second support and located on the side of the second air pipe away from the mounting plate along the third direction.

[0027] In a specific embodiment of the present application, the air passage communication seat is provided with a sealing groove on the side facing the adsorption seat, and the sealing groove is annular.

[0028] The die bonder further includes a sealing ring, which is sealingly connected in the sealing groove and coaxially arranged with the sealing groove, and the side of the sealing ring away from the mounting seat is in abutting connection with the adsorption seat along the third direction, and the communication position of the first air passage and the adsorption hole is located on the inner side of the sealing groove.

[0029] The above technical solutions of the present application have at least one of the following advantages or beneficial effects:

[0030] The die bonder of the present application, wherein the cleaning assembly is connected to the turntable and is used to generate a cleaning airflow through the turntable bearing surface, in actual application, the cleaning airflow can be generated by the cleaning assembly to clean the bearing surface before the chip is placed on the bearing surface, and / or, the cleaning airflow generated by the cleaning assembly can be used to clean the chip after the chip is placed on the bearing surface, based on this, the chip is not easy to be contaminated by impurities when it is temporarily stopped on the turntable, and the die bonder of the present application has the characteristics of good die bonding quality. BRIEF DESCRIPTION OF DRAWINGS

[0031] The present application will be further described below in combination with the drawings and examples.

[0032] Figure 1 is a structural schematic view of the cooperation of the turntable, the cleaning assembly, the light source assembly, the slide rail and the position sensor of the die bonder of the embodiment of the present application;

[0033] Figure 2 is a structural schematic view of the turntable of the embodiment of the present application;

[0034] Figure 3 is a structural schematic view of the turntable of the embodiment of the present application from another angle;

[0035] Figure 4 is a sectional view of A-A of the embodiment of the present application; Figure 3

[0036] Figure 5 is a structural schematic view of the first air pipe of the embodiment of the present application;

[0037] Figure 6 is a structural schematic view of the second air pipe of the embodiment of the present application;

[0038] Figure 7 is a structural schematic view of the cooperation of the turntable, the cleaning assembly, the light source assembly and the slide rail of another embodiment of the present application;

[0039] Figure 8 is a structural schematic view of the cooperation of the turntable, the slide rail, the wafer supply mechanism, the material discharging mechanism and the material taking mechanism of the die bonder of the embodiment of the present application in one kind of working mode;

[0040] Figure 9 is another structural schematic view of the cooperation of the turntable, the slide rail, the wafer supply mechanism, the material discharging mechanism and the material taking mechanism of the die bonder of the embodiment of the present application in another working mode.

[0041] ​In the figure, 1, a transfer table; 11, a mounting seat; 111, a mounting plate; 112, a first mounting lug; 113, a second mounting lug; 12, an air passage communication seat; 1201, a first air passage; 1202, a sealing groove; 121, a first positioning protrusion; 13, a suction seat; 1301, a suction hole; 2, a cleaning assembly; 21, a first air pipe; 2101, a blowing hole; 2102, an arc-shaped concave surface; 22, a second air pipe; 2201, a suction hole; 2202, a flow converging groove; 3, a light source assembly; 31, a first support; 32, a first light source; 33, a second support; 34, a second light source; 4, a sliding rail; 5, a position sensor; 6, a wafer supply mechanism; 7, a material feeding mechanism; 8, a material taking mechanism; 9, a sealing ring; 100, a bearing surface; 200, a clearance; X, a first direction; Y, a second direction; Z, a third direction. DETAILED DESCRIPTION

[0042] Embodiments of the present application are described below in detail, examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application.

[0043] Reference Signs List Figures 1 to 6 As shown in the figure, the die bonder of the preferred embodiment of the present application comprises a transfer table 1 and a cleaning assembly 2, the transfer table 1 has a bearing surface 100 for bearing a chip, and the cleaning assembly 2 is connected to the transfer table 1 and is used to generate a cleaning airflow passing through the bearing surface 100, so that the chip can be cleaned by the cleaning airflow when placed on the bearing surface 100.

[0044] In actual application, the cleaning airflow can be generated by the cleaning assembly 2 to clean the bearing surface 100 before the chip is placed on the bearing surface 100, and / or the cleaning airflow can be generated by the cleaning assembly 2 to clean the chip after the chip is placed on the bearing surface 100, based on which, the chip is not easy to be contaminated by impurities when temporarily staying on the transfer table 1, and the die bonder of the present application has the characteristic of good die bonding quality.

[0045] In addition, the cleaning airflow can also be generated by the cleaning assembly 2 to clean the bearing surface 100 after the chip is taken away by the material taking mechanism 8; or the cleaning assembly 2 only works to generate the cleaning airflow to clean the chip after the chip is placed on the bearing surface 100.

[0046] In the embodiment, the transfer station 1 has a first direction X; the cleaning assembly 2 comprises a first air pipe 21 connected to the transfer station 1 and located on one side of the bearing surface 100 in the first direction X, and the first air pipe 21 is provided with air blowing holes 2101 facing the bearing surface 100, which are used for blowing air. Specifically, in actual application, the first air pipe 21 has a first air nozzle connected to a gas supply device through a gas supply pipe, and the gas supply device and the gas supply pipe supply gas to the first air pipe 21, and the gas is sprayed from the air blowing holes 2101 to form a cleaning air flow, which blows away impurities on the bearing surface 100 and / or the chip, has a simple structure, and has a good cleaning effect.

[0047] Further, one end of the first air pipe 21 facing the bearing surface 100 has an arc-shaped concave surface 2102, and a plurality of air blowing holes 2101 are arranged on the arc-shaped concave surface 2102. Specifically, the arrangement of the arc-shaped concave surface 2102 allows at least part of the gas to flow along the surface of the arc-shaped concave surface 2102 when the gas is output from the first air pipe 21 through the air blowing holes 2101, thereby forming an air flow field with a certain range, which has a wide coverage. Therefore, the cleaning air flow can better clean the bearing surface 100 and / or the chip, and has a good cleaning effect.

[0048] In the embodiment, the cleaning assembly 2 further comprises a second air pipe 22 connected to the transfer station 1, which is arranged on the other side of the bearing surface 100 relative to the first air pipe 21 in the first direction X. The second air pipe 22 is provided with air suction holes 2201 facing the bearing surface 100, which are used for sucking air. Specifically, in actual application, the second air pipe 22 has a second air nozzle connected to an air suction device through an air suction pipe, and the air suction device and the air suction pipe realize the function of sucking air of the second air pipe 22. At this time, the air flow output through the air blowing holes 2101 of the first air pipe 21 will flow back to the second air pipe 22 through the air suction holes 2201 and be discharged through the air suction pipe. Based on the first air pipe 21 and the second air pipe 22 forming a cleaning air flow, the advantage is that after the cleaning air flow cleans the impurities on the bearing surface 100 and / or the chip, part of the impurities will enter the second air pipe 22 through the air suction holes 2201 and be discharged, and the part of the impurities will not enter other stations of the die bonder and will not cause secondary pollution to the bearing surface 100, thereby ensuring the die bonding quality of the die bonder.

[0049] Further, the second air pipe 22 has a converging groove 2202 at one end of the bearing surface 100, and the air suction hole 2201 is arranged on the bottom surface of the converging groove 2202. The space of the converging groove 2202 gradually decreases from the opening to the bottom along the depth direction of the converging groove 2202. The advantage of this structure is that the converging groove 2202 has a larger inlet area to collect a wider range of gas, so that the second air pipe 22 has stronger air flow collection capacity, which is beneficial to better remove the clean gas flow carrying impurities.

[0050] In this embodiment, the transfer station 1 also has a second direction Y and a third direction Z, and the first direction X, the second direction Y and the third direction Z are perpendicular to each other. The length direction of the first air pipe 21 and the second air pipe 22 is parallel to the second direction Y, and the perpendicular line of the bearing surface 100 extends along the third direction Z. In the first air pipe 21, the arc-shaped concave surface 2102 extends along the second direction Y by a first preset distance, and the plurality of air blowing holes 2101 are arranged in the second direction Y at intervals. In the second air pipe 22, the converging groove 2202 extends along the second direction Y by a second preset distance, and the air suction hole 2201 is in a strip shape, and the length direction of the air suction hole 2201 is the same as the length direction of the second air pipe 22. The advantage of this structure is that the air flow output by the first air pipe 21 has a relatively large coverage range in the second direction Y, that is, the cleaning range is larger, which can improve the cleaning effect. Similarly, the converging groove 2202 extends along the second direction Y, which has a relatively large air suction range in the second direction Y, which is beneficial to better recovery of the clean gas flow. The first preset distance and the second preset distance are set according to the actual size of the bearing surface 100, which is not limited in the present application. For example, the first preset distance and the second preset distance are both greater than the length of the bearing surface 100 in the second direction Y, so that the cleaning effect of the clean gas flow on the bearing surface 100 and the chip can be ensured.

[0051] For example, the number of air blowing holes 2101 is nine, and the air flow is output through the nine air blowing holes 2101 to form a clean gas flow.

[0052] Further, the air blowing hole 2101 is a circular hole, and the distance between the centers of the first air blowing hole 2101 and the last air blowing hole 2101 in the plurality of air blowing holes 2101 along the second direction Y is a third preset distance. The first preset distance is greater than the third preset distance, and at this time, the plurality of air blowing holes 2101 are arranged on the arc-shaped concave surface 2102, and the second preset distance is greater than the third preset distance to ensure the smooth recovery of the clean gas flow. It should be noted that the third preset distance is also set according to the actual size of the bearing surface 100, which is not limited in the present application. The third preset distance is greater than the length of the bearing surface 100 in the second direction Y, so that the cleaning effect of the clean gas flow on the bearing surface 100 and the chip can be ensured.

[0053] In the embodiment, the transfer station 1 comprises a mounting base 11, an air passage communication base 12 and an adsorption base 13 connected along the third direction Z, the air passage communication base 12 has a first air passage 1201, and the adsorption base 13 has a bearing surface 100 provided with adsorption holes 1301 in communication with the first air passage 1201; the first air pipe 21 and the second air pipe 22 are connected to the mounting base 11; in actual application, the air passage communication base 12 has a third air nozzle in communication with the first air passage 1201, and the third air nozzle is connected to a negative pressure device through a negative pressure pipeline, and the negative pressure device is used to suck air to generate adsorption force in the adsorption holes 1301, when the chip is placed on the bearing surface 100, the chip covers the adsorption holes 1301, and the transfer station 1 adsorbs the chip through the adsorption force to realize stable placement of the chip and ensure normal operation of die bonding.

[0054] In addition, the mounting base 11, the air passage communication base 12 and the adsorption base 13 are connected to form the transfer station 1, which has simple structure and is convenient to process, for example, the mounting base 11, the air passage communication base 12 and the adsorption base 13 are connected through bolts, that is, the air passage communication base 12 is connected to the mounting base 11 through bolts, and the adsorption base 13 is connected to the air passage communication base 12 through bolts, which is convenient to install.

[0055] In the present application, the die bonder further comprises a wafer supply mechanism 6, a chip placing mechanism 7 and a chip taking mechanism 8, the chip placing mechanism 7 is used to place the chips on the wafer supply mechanism 6 on the bearing surface 100 of the transfer table 1, and the chip taking mechanism 8 is used to take the chips on the transfer table 1 and place them in the die bonding process. Specifically, the bearing surface 100 is horizontally arranged, and the chip taking mechanism 8 moves above the bearing surface 100 to take the chips. Further, the mounting seat 11 comprises a mounting plate 111, a first mounting lug 112 and a second mounting lug 113, the first mounting lug 112 and the second mounting lug 113 are connected to one end of the mounting plate 111 along the second direction Y, and the first mounting lug 112 and the second mounting lug 113 are arranged along the first direction X. For example, the first mounting lug 112 and the second mounting lug 113 are integrally formed with the mounting plate 111, and the first mounting lug 112 and the second mounting lug 113 form an avoiding space 200 therebetween, which is used to avoid the chip taking mechanism 8. The air passage communication seat 12 is connected to the mounting plate 111, the first air pipe 21 is connected to the first mounting lug 112 along one end of its length direction, and the second air pipe 22 is connected to the second mounting lug 113 along one end of its length direction. Specifically, the first air pipe 21 and the second air pipe 22 are respectively installed through the first mounting lug 112 and the second mounting lug 113, which has the advantages of simple and compact structure, convenient installation, full use of the space above the bearing surface 100, and high space utilization rate of the die bonder. At the same time, since the avoiding space 200 is formed between the first mounting lug 112 and the second mounting lug 113, the space above the bearing surface 100 is fully utilized while the interference with the work of the chip taking mechanism 8 is reduced, which facilitates the chip taking mechanism 8 to take the chips on the bearing surface 100 and ensures the normal operation of the die bonder.

[0056] For example, the first mounting lug 112 has a first mounting hole penetrating along the second direction Y, and the first air pipe 21 is inserted into the first mounting hole and fixed by a jack screw. The second mounting lug 113 has a second mounting hole penetrating along the second direction Y, and the second air pipe 22 is inserted into the second mounting hole and fixed by a jack screw.

[0057] In practical application, the die bonder further comprises a visual detection mechanism for detecting the posture of the chip on the bearing surface 100, so as to adjust the posture of the chip while the chip is taken away by the taking mechanism 8, so that the posture of the chip is adapted to the mounting position on the substrate, and thus, in the embodiment, the die bonder further comprises a light source assembly 3 for irradiating the bearing surface 100, the light source assembly 3 is connected to the mounting seat 11, and when the chip is placed on the bearing surface 100, the light source assembly 3 irradiates the chip, thereby facilitating the visual detection mechanism to detect the posture of the chip. Specifically, the light source assembly 3 is connected to the mounting seat 11, which has the advantage that the light source assembly 3 does not need to be installed at other positions of the die bonder, and the space around the transfer table 1 is fully utilized to arrange the light source assembly 3, so that the die bonder has the advantage of high space utilization, and at the same time, the light source assembly 3 is closer to the chip during work, which can provide better light conditions and provide strong support for the visual detection mechanism to detect the posture of the chip, thereby improving the accuracy and reliability of detection.

[0058] In the embodiment, the light source assembly 3 comprises a first bracket 31, a first light source 32, a second bracket 33 and a second light source 34, the first light source 32 and the second light source 34 are used for irradiating the bearing surface 100; the first bracket 31 is connected to the first mounting lug 112, the first light source 32 is connected to the first bracket 31, and the first light source 32 is located on the side of the first air duct 21 away from the mounting plate 111 along the third direction Z; the second bracket 33 is connected to the mounting plate 111, and the second light source 34 is connected to the second bracket 33, and the second bracket 33 and the second light source 34 are both opposite to the avoiding space 200 along the second direction Y. The light source assembly 3 with such a structure can effectively provide light conditions and has simple structure and convenient installation.

[0059] Further, the second bracket 33 extends to the side of the air passage communication seat 12 away from the mounting plate 111 along the third direction Z; on the third direction Z, the first positioning protrusion 121 is arranged on the side of the air passage communication seat 12 facing the adsorption seat 13, and the first positioning protrusion 121 is located at one end of the air passage communication seat 12 in the first direction X; wherein, the end of the adsorption seat 13 in the first direction X is in contact with the first positioning protrusion 121, and the end of the adsorption seat 13 in the second direction Y away from the avoiding space 200 is in contact with the second bracket 33, thereby enabling the adsorption seat 13 to be stably connected to the air passage communication seat 12, which has simple and reliable structure. Specifically, the second bracket 33 not only serves as a mounting position for the second light source 34, but also serves as a function of limiting the position of the adsorption seat 13, without the need for additional positioning structures to limit the position of the adsorption seat 13, so that the die bonder has the advantages of simple and compact structure.

[0060] It should be noted that the first support 31 is connected to the first mounting lug 112 by bolts, the first light source 32 is connected to the first support 31 by bolts, the second support 33 is connected to the mounting plate 111 by bolts, and the second light source 34 is connected to the second support 33 by bolts, which is simple in structure and convenient to install.

[0061] For the arrangement of the light source assembly 3, in other embodiments, referring to Figure 7 As shown, the first support 31 is connected to the first mounting lug 112, the first light source 32 is connected to the first support 31, and along the third direction Z, the first light source 32 is located on the side of the first air pipe 21 away from the mounting plate 111; the second support 33 is connected to the mounting plate 111, the second light source 34 is connected to the second support 33, and along the third direction Z, the second light source 34 is located on the side of the second air pipe 22 away from the mounting plate 111, the first light source 32 and the second light source 34 are oppositely arranged along the first direction X, and the second support 33 is located on the side of the second air pipe 22 away from the first air pipe 21 along the first direction X. The light source assembly 3 of this structure can also effectively provide light conditions. In addition, since the second support 33 is located on the side of the second air pipe 22 away from the first air pipe 21 along the first direction X, and the second light source 34 is located on the side of the second air pipe 22 away from the mounting plate 111 along the third direction Z, the mounting plate 111 does not have related structures above one end of the first mounting lug 112 in the second direction Y, that is, the mounting plate 111, the first air pipe 21, the first light source 32, the second air pipe 22, and the second light source 34 form an avoidance area away from one end of the first mounting lug 112 in the second direction Y. The advantage of this structure is that the existence of the avoidance area reserves a certain space for the movement of the above-mentioned material taking mechanism 8 and the material placing mechanism 7, and the transfer table 1 is not easy to interfere with the material taking mechanism 8 and the material placing mechanism 7.

[0062] In this embodiment, the air passage communication seat 12 is provided with a sealing groove 1202 on the side facing the adsorption seat 13, and the sealing groove 1202 is annular. The die bonder further comprises a sealing ring 9, which is sealingly connected in the sealing groove 1202. The sealing ring 9 is coaxially arranged with the sealing groove 1202, and along the third direction Z, the side of the sealing ring 9 away from the mounting seat 11 is in abutting connection with the adsorption seat 13. The communication part of the first air passage 1201 and the adsorption hole 1301 is located on the inside of the sealing groove 1202. Specifically, the sealing groove 1202 cooperates with the sealing ring 9 to ensure the sealing performance of the communication part of the first air passage 1201 and the adsorption hole 1301.

[0063] In the present application, the die bonder further has a transfer station, which is located between the material taking mechanism 8 and the material placing mechanism 7. In the present embodiment, the die bonder further comprises a fixed slide rail 4, a driving mechanism (not shown in the figure) and a position sensor 5. The transfer table 1 is slidably connected to the slide rail 4. The driving mechanism is connected to the transfer table 1 and can drive the transfer table 1 to move along the length direction of the slide rail 4. The driving mechanism can be a linear slide. The transfer table 1 is fixedly connected to the sliding block of the linear slide. The position sensor 5 is used to detect whether the position of the transfer table 1 is located on the transfer station. Based on this, in one of the die bonding modes of the die bonder, as shown in Figure 8 , based on the signal of the position sensor 5, the driving mechanism drives the transfer table 1 to move to the transfer station and remain stationary. The material placing mechanism 7 is used to place the chips on the wafer supply mechanism 6 on the bearing surface 100 of the transfer table 1. The material taking mechanism 8 is used to take away the chips on the transfer table 1 and place them in the die bonding process. In another die bonding mode of the die bonder, as shown in Figure 9 , the driving mechanism drives the transfer table 1 to move out of the transfer station. The wafer supply mechanism 6 moves to the transfer station. The material taking mechanism 8 takes away the chips on the wafer supply mechanism 6 and places them in the die bonding process. That is, based on the arrangement of the slide rail 4, the driving mechanism and the position sensor 5, the die bonder can realize the above-mentioned two die bonding modes. Therefore, the die bonder can be suitable for the die bonding requirements of chips with different size specifications, and has high applicability.

[0064] It should be noted that the wafer supply mechanism 6, the material taking mechanism 8 and the material placing mechanism 7 are prior art, and the present application will not be described in detail.

[0065] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirit of the present application. The scope of the present application is defined by the claims and their equivalents.

Claims

1. A die bonder, characterized by, The chip cleaning device comprises a transfer table (1) and a cleaning assembly (2), the transfer table (1) has a bearing surface (100) for bearing a chip, the cleaning assembly (2) is connected to the transfer table (1) and is used to generate a cleaning airflow passing through the bearing surface (100) to clean the chip when the chip is placed on the bearing surface (100); The transfer table (1) has a first direction (X), a second direction (Y) and a third direction (Z), and the first direction (X), the second direction (Y) and the third direction (Z) are perpendicular to each other; The cleaning assembly (2) comprises a first air pipe (21) located on one side of the bearing surface (100) in the first direction (X), the first air pipe (21) is provided with air blowing holes (2101) facing the bearing surface (100) and used for blowing air, one end of the first air pipe (21) facing the bearing surface (100) is provided with an arc-shaped concave surface (2102), the number of the air blowing holes (2101) is plural, and the plural air blowing holes (2101) are arranged on the arc-shaped concave surface (2102) at intervals, and the arc-shaped concave surface (2102) extends in the second direction (Y) by a first preset distance in the first air pipe (21), and the plural air blowing holes (2101) are arranged at intervals in the second direction (Y); The cleaning assembly (2) further comprises a second air pipe (22), the second air pipe (22) is arranged on the other side of the bearing surface (100) relative to the first air pipe (21) in the first direction (X), the second air pipe (22) is provided with air suction holes (2201) facing the bearing surface (100) and used for sucking air, the air suction holes (2201) extend in the second direction (Y) by a second preset distance in the second air pipe (22), the air suction holes (2201) are in a strip shape, and the length direction of the air suction holes (2201) is the same as the length direction of the second air pipe (22); The length directions of the first air pipe (21) and the second air pipe (22) are parallel to the second direction (Y), and the perpendicular line of the bearing surface (100) extends in the third direction (Z). The transfer station (1) comprises a mounting base (11), an air passage communication base (12) and an adsorption base (13) connected along the third direction (Z), the mounting base (11) comprises a mounting plate (111), a first mounting lug (112) and a second mounting lug (113), the first mounting lug (112) and the second mounting lug (113) are connected to one end of the mounting plate (111) along the second direction (Y), and the first mounting lug (112) and the second mounting lug (113) are arranged at intervals along the first direction (X), and an avoiding space (200) is formed between the first mounting lug (112) and the second mounting lug (113) for avoiding a material taking mechanism; the air passage communication base (12) is connected to the mounting plate (111), one end of the first air pipe (21) along the length direction is connected to the first mounting lug (112), and one end of the second air pipe (22) along the length direction is connected to the second mounting lug (113); the air passage communication base (12) has a first air passage (1201), and the adsorption base (13) has the bearing surface (100) provided with an adsorption hole (1301), and the adsorption hole (1301) is communicated with the first air passage (1201).

2. The die bonder of claim 1, wherein One end of the second air pipe (22) towards the bearing surface (100) has a flow converging groove (2202), and the air suction hole (2201) is arranged on the groove bottom surface of the flow converging groove (2202).

3. The die bonder of claim 1, wherein The die bonder further comprises a light source assembly (3) for irradiating the bearing surface (100), and the light source assembly (3) is connected to the mounting base (11).

4. The die bonder of claim 3, wherein, The light source assembly (3) comprises a first support (31), a first light source (32), a second support (33) and a second light source (34), and the first light source (32) and the second light source (34) are used for irradiating the bearing surface (100); The first support (31) is connected to the first mounting lug (112), the first light source (32) is connected to the first support (31), and along the third direction (Z), the first light source (32) is located on the side of the first air pipe (21) away from the mounting plate (111); The second support (33) is connected to the mounting plate (111), the second light source (34) is connected to the second support (33), and along the second direction (Y), the second support (33) and the second light source (34) are both opposite to the avoiding space (200).

5. The die bonder of claim 4, wherein the die bonder further comprises: The second support (33) extends to the side of the air passage communication base (12) away from the mounting plate (111) along the third direction (Z); On the third direction (Z), one side of the air passage communication base (12) towards the adsorption base (13) is provided with a first positioning protrusion (121), and the first positioning protrusion (121) is located at one end of the air passage communication base (12) along the first direction (X). The adsorption seat (13) is in contact with the first positioning protrusion (121) at one end in the first direction (X), and is in contact with the second support (33) at one end away from the avoiding space (200) in the second direction (Y).

6. The die bonder of claim 3, wherein the die bonder further comprises: The light source assembly (3) comprises a first support (31), a first light source (32), a second support (33) and a second light source (34), the first light source (32) and the second light source (34) are used for irradiating the bearing surface (100); The first support (31) is connected to the first mounting lug (112), the first light source (32) is connected to the first support (31), and along the third direction (Z), the first light source (32) is located on the side of the first air pipe (21) away from the mounting plate (111); The second support (33) is connected to the mounting plate (111), and the second support (33) is located on the side of the second air pipe (22) away from the first air pipe (21) along the first direction (X), the second light source (34) is connected to the second support (33), and along the third direction (Z), the second light source (34) is located on the side of the second air pipe (22) away from the mounting plate (111).

7. The die bonder according to any one of claims 1 to 6, wherein One side of the air passage communication seat (12) facing the adsorption seat (13) is provided with a sealing groove (1202), and the sealing groove (1202) is annular; The die bonder further comprises a sealing ring (9), the sealing ring (9) is sealingly connected in the sealing groove (1202), the sealing ring (9) and the sealing groove (1202) are coaxially arranged, along the third direction (Z), one side of the sealing ring (9) away from the mounting seat (11) is in abutting connection with the adsorption seat (13), and the communication part of the first air passage (1201) and the adsorption hole (1301) is located on the inner side of the sealing groove (1202).

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