Substrate processing apparatus

Abstract

A substrate processing apparatus (A1) includes: a substrate processing unit (U1) including a first chamber (1A) in which a first process including a process of wetting a substrate (W) is performed, and a second chamber (1B) in which a second process is performed on the substrate after the first process; a first transport device (3) that transports the substrate (W) into the substrate processing unit (U1) and transports the substrate (W) from the substrate processing unit (U1); and a second transport device (4A) that transports the substrate (W) from the first chamber (1A) and transports the substrate (W) into the second chamber (1B). With such a configuration, it is possible to improve the processing capability of the substrate processing apparatus and to transfer the substrate more appropriately.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus. Background Art

[0002] Various substrate processing apparatuses have been proposed for performing prescribed processes on various substrates such as semiconductor wafers. Patent Document 1 discloses an example of a conventional substrate processing apparatus. This apparatus includes multiple chambers for performing prescribed processes on the substrates, a buffer unit, a first transport robot, and a second transport robot. The first transport robot carries substrates supplied from the outside into the buffer unit. The second transport robot performs the feeding of substrates carried in the buffer unit into each chamber, the feeding and unloading of substrates between chambers, and the unloading of substrates from each chamber into the buffer unit.

[0003] Existing technical documents

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-197799 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] If the second transport robot performs the aforementioned feeding and unloading operations frequently, there are concerns that the processing capacity of the substrate processing apparatus may be limited. Furthermore, during the feeding and unloading of substrates between chambers, there are instances where the second transport robot transports substrates in a wet state. On the other hand, it is sometimes preferable to transport substrates that have undergone a series of processes in multiple chambers to the buffer unit in a dry state. When the second transport robot transports substrates in both wet and dry states, it is possible that substrates that should be in a dry state may become wetted.

[0008] The present invention was conceived in view of the above circumstances, and its objective is to provide a substrate processing apparatus that can improve the processing capability of the substrate processing apparatus and transport the substrate more appropriately.

[0009] Technical solutions for solving the problem

[0010] The substrate processing apparatus provided by the present invention includes: a substrate processing unit having a first chamber and a second chamber, wherein the first chamber is used for performing a first step including wetting the substrate, and the second chamber is used for performing a second step on the substrate after the first step; a first transport device for feeding the substrate into the substrate processing unit and feeding the substrate out of the substrate processing unit; and a second transport device for feeding the substrate out of the first chamber and feeding the substrate into the second chamber.

[0011] In a preferred embodiment of the present invention, the first step uses a pharmaceutical solution containing a reagent as a treatment liquid, and the second step includes washing the substrate with water.

[0012] In a preferred embodiment of the present invention, the first chamber and the second chamber are arranged in a first direction, and the first transport device and the second transport device are arranged on opposite sides of each other in a second direction orthogonal to the first direction, separated by the substrate processing unit.

[0013] In a preferred embodiment of the present invention, the invention includes: one of the first transport devices; two substrate processing units disposed on opposite sides of each other in the second direction, separated by the first transport device; and two second transport devices disposed on opposite sides of each other in the second direction, separated by the two substrate processing units.

[0014] In a preferred embodiment of the present invention, the second transport device has a holding portion for holding the substrate, the holding portion being able to pass through an intermediate standby position located outside the first chamber and the second chamber, overlapping the first chamber and the second chamber when viewed along the first direction, and overlapping the first chamber and the second chamber when viewed along the second direction.

[0015] In a preferred embodiment of the present invention, the first chamber has a first cover and the second chamber has a second cover. When viewed along a third direction orthogonal to the first and second directions, the portions of the first and second covers opposite to the second transport device are arc-shaped.

[0016] In a preferred embodiment of the present invention, the substrate processing unit further includes a liquid tank for storing a liquid for processing the substrate. The liquid tank has a first outlet and a second outlet for discharging the liquid, and a bottom portion located below in the vertical direction. The first outlet is located above the second outlet in the vertical direction. The bottom portion is inclined relative to the direction of the gap between the first outlet and the second outlet in the vertical direction, such that the side where the second outlet is located is located is below in the vertical direction in the direction that separates the first outlet from the second outlet.

[0017] In a preferred embodiment of the present invention, the substrate processing unit further includes a piping unit for the flow of a pharmaceutical solution for processing the substrate, the piping unit being able to be pulled out of the substrate processing unit while the first chamber and the second chamber are fixed.

[0018] The effects of the invention

[0019] According to the present invention, it is possible to improve the processing capacity of the substrate processing apparatus and achieve more appropriate transport of the substrate.

[0020] Other features and advantages of the invention will become more apparent from the following detailed description with reference to the accompanying drawings. Attached Figure Description

[0021] Figure 1 This is a perspective view of a substrate processing apparatus according to a first embodiment of the present invention.

[0022] Figure 2 This is a top view showing the substrate processing apparatus according to the first embodiment of the present invention.

[0023] Figure 3 It is along Figure 2 A cross-sectional view of line III-III.

[0024] Figure 4 It is along Figure 2 A cross-sectional view of line IV-IV.

[0025] Figure 5 It is along Figure 2 A cross-sectional view of the VV line.

[0026] Figure 6 This is a top view showing the substrate transport path in the substrate processing apparatus according to the first embodiment of the present invention.

[0027] Figure 7A This is a top view showing an example of a second transport device in a substrate processing apparatus according to a first embodiment of the present invention.

[0028] Figure 7B This is a top view showing another example of the second transport device in the substrate processing apparatus according to the first embodiment of the present invention.

[0029] Figure 8A This is a partial top view showing a modified example of the substrate processing apparatus according to the first embodiment of the present invention.

[0030] Figure 8B This is a partial top view showing a modified example of the substrate processing apparatus according to the first embodiment of the present invention.

[0031] Figure 8C This is a partial top view showing a modified example of the substrate processing apparatus according to the first embodiment of the present invention.

[0032] Figure 9 This is a front view showing the substrate processing apparatus according to the second embodiment of the present invention.

[0033] Figure 10AThis is a top view showing the substrate processing apparatus according to the third embodiment of the present invention.

[0034] Figure 10B It is along Figure 10A A cross-sectional view of the XX line.

[0035] Figure 11A This is a front view showing an example of the solution tank of the substrate processing apparatus of the present invention.

[0036] Figure 11B This is a left-side view showing an example of the solution tank of the substrate processing apparatus of the present invention.

[0037] Figure 11C This is a right-side view showing an example of the solution tank of the substrate processing apparatus of the present invention.

[0038] Figure 12 This is a diagram illustrating an example of the flow of medicine in the medicine tank shown in Figure 11.

[0039] Figure 13 This is another example of the flow of medicine in the medicine tank shown in Figure 11.

[0040] Figure 14A This is a cross-sectional view showing the substrate processing apparatus according to the fourth embodiment of the present invention.

[0041] Figure 14B This is a cross-sectional view showing the substrate processing apparatus according to the fourth embodiment of the present invention. Detailed Implementation

[0042] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0043] The terms "first," "second," and "third" used in this manual are for identification purposes only and are not intended to arrange these objects in any particular order.

[0044] <First Implementation Method>

[0045] Figures 1 to 7B This diagram illustrates a substrate processing apparatus according to a first embodiment of the present invention. The substrate processing apparatus A1 of this embodiment includes two substrate processing units U1 and U2, a first transport device 3, two second transport devices 4A and 4B, and a feed-in / feed-out stage 6. The substrate processing apparatus A1 is a device for performing prescribed processing on a substrate W supplied to the feed-in / feed-out stage 6. In these figures, the x-direction corresponds to the first direction of the present invention, the y-direction corresponds to the second direction, and the z-direction corresponds to the third direction. Furthermore, in this embodiment, the z-direction coincides with the vertical direction.

[0046] There are no specific limitations on the structure of the substrate W; for example, a semiconductor wafer can be considered. When the substrate W is a semiconductor wafer, it may be circular, for example.

[0047] The two substrate processing units U1 and U2 are respectively units for performing specified processing on the substrate W. The two substrate processing units U1 and U2 can be a shared structure or different structures. In this embodiment, the case where the two substrate processing units U1 and U2 have the same structure will be described as an example. In addition, there is no limitation on the number of substrate processing units in the substrate processing apparatus of the present invention; it can be one or more. In this embodiment, the two substrate processing units U1 and U2 are arranged at intervals between each other in the y-direction and are arranged on opposite sides of each other in the y-direction across the first transport device 3.

[0048] In this embodiment, the terms "outer side in the y-direction" and "inner side in the y-direction" are sometimes used in the description of the two substrate processing units U1 and U2. In substrate processing unit U1, the outer side in the y-direction is the y1 side, and the inner side in the y-direction is the y2 side. In substrate processing unit U2, the outer side in the y-direction is the y2 side, and the inner side in the y-direction is the y1 side.

[0049] The substrate processing units U1 and U2 include a first chamber 1A and a second chamber 1B. In this embodiment, the substrate processing units U1 and U2 also include a preparation table 2 and two piping units 5. The first chamber 1A and the second chamber 1B can have the same or different structures. When the first chamber 1A and the second chamber 1B share a common structure, the combination of the substrate processing units U1 and U2 offers greater flexibility, allowing for more diverse usage configurations. Furthermore, when using the first chamber 1A and the second chamber 1B in different processing methods, the required modifications can be reduced. Additionally, the first chamber 1A and the second chamber 1B themselves can be rationally modularized. In this case, if a problem such as leakage occurs in one of the first chambers 1A or the second chamber, it is easy to replace that chamber with another.

[0050] Preparation stage 2 is a stage for receiving substrates W that are fed into substrate processing units U1 and U2. The function of preparation stage 2 is not limited; it can also be a stage for placing substrates W before processing in the first chamber 1A or the second chamber 1B for time adjustments, etc. Alternatively, preparation stage 2 may also have functions for adjusting the orientation and posture of substrates W. Furthermore, substrate processing units U1 and U2 may also be structures that do not have preparation stage 2 and directly feed substrates W into the first chamber 1A.

[0051] The first chamber 1A is used to perform a first process on the substrate W fed in via the preparation table 2. The first chamber 1A can have various specific structures depending on the content of the first process. The first process includes a process of wetting the substrate W. The process of wetting the substrate W is not particularly limited; for example, immersing the substrate W in a processing solution or spraying the processing solution onto the substrate W can be exemplified. In this embodiment, an example will be given where the first process includes, for example, a peeling process of the substrate W. The first chamber 1A of this embodiment includes a first container 11A, a first worktable 12A, a first drive mechanism 13A, a first cover 14A, and an ultrasonic horn 19.

[0052] The first container 11A is used to process the substrate W and can store the processing solution used to process the substrate W. There are no specific limitations on the structure of the processing solution. For example, pure water, a solution containing a specified agent, etc. can be used. In the case of stripping, for example, a solution containing an organic solvent can be used as the organic solvent, such as IPA (isopropanol) or NMP (N-methyl-2-pyrrolidone).

[0053] The first worktable 12A supports the substrate W during processes such as peeling in the first container 11A. Alternatively, the first worktable 12A may also be a portion that receives the substrate W fed into the first chamber 1A. Furthermore, the first mounting stage 12A may be configured to support the substrate W in a state that allows it to be discharged from the first chamber 1A after processing in the first container 11A.

[0054] The first drive mechanism 13A is a mechanism for driving the first worktable 12A. For example, the first drive mechanism 13A is used to rotate the substrate W in the processing liquid stored in the first container 11A by rotating the first stage 12A about an axis extending in the z-direction. Alternatively, the first drive mechanism 13A may also have the function of raising and lowering the first worktable 12A in the z-direction.

[0055] The ultrasonic amplitude transformer 19 applies ultrasonic waves to the substrate W immersed in the treatment liquid in the first container 11A to remove, for example, resist layers and metal layers. There are no specific limitations on the structure of the ultrasonic amplitude transformer 19. Alternatively, the first chamber 1A may not have the ultrasonic amplitude transformer 19, or it may have other mechanisms for performing stripping or other treatments.

[0056] The first cover 14A is used to externally shield the first container 11A when processing the substrate W. In this embodiment, the first cover 14A houses the first container 11A and the first worktable 12A, and also houses the ultrasonic amplitude transformer 19. The specific structure of the first cover 14A is not limited, but in this embodiment, it has a fixing part 141A and a first opening and closing device 142A.

[0057] The fixing part 141A is the main body of the first cover 14A and is fixed to a support frame or the like. The fixing part 141A has an opening for feeding in and out of the substrate W. In the illustrated example, the fixing part 141A opens outward in the y-direction. That is, the fixing part 141A of the first chamber 1A of the substrate processing unit U1 opens on the y1 side in the y-direction, and the fixing part 141A of the first chamber 1A of the substrate processing unit U2 opens on the y2 side in the y-direction.

[0058] The first opener / closer 142A can move relative to the fixed part 141A, allowing it to be in both a covered and open state. There are no limitations on the operation of the first opener / closer 142A. In the illustrated example, the first opener / closer 142A moves up and down along the z-direction. The mechanism used to move the first opener / closer 142A (not shown) is not limited; cylinders, motors, etc., can be used appropriately.

[0059] The shape of the first cover 14A is not limited. In the illustrated example, the first cover 14A, when viewed along the z-direction, has a shape that bulges outward in the y-direction, for example, having a semi-circular portion. Correspondingly, the first opener / closer 142A, when viewed along the z-direction, has an arc shape.

[0060] The second chamber 1B is used to perform a second process on the substrate W, which has undergone the first process in the first chamber 1A. The second chamber 1B can have various specific structures depending on the content of the second process. In this embodiment, the second process is illustrated by an example where the second process includes cleaning the substrate W that has undergone a peeling treatment. The second chamber 1B of this embodiment includes a second container 11B, a second worktable 12B, a second drive mechanism 13B, and a second cover 14B. Furthermore, the second chamber 1B can also be configured to remove the processing liquid adhering to the substrate W by centrifugal force through high-speed rotation of the second worktable 12B. Moreover, the second chamber 1B can also have the function of drying the substrate W with a drying gas such as air or nitrogen. With such a structure, it is possible to more reliably prevent the first transport device 3 from becoming wetted during the transport of the substrate W.

[0061] The second container 11B is used to process the substrate W and can store the processing solution used to process the substrate W. The specific structure of the processing solution is not limited; for example, pure water or a solution containing a specified reagent can be used. In the case of cleaning, for example, pure water can be used.

[0062] The second worktable 12B supports the substrate W during cleaning or other processing in the second container 11B. Alternatively, the second worktable 12B may also be a portion that receives the substrate W fed into the second chamber 1B. Furthermore, the second mounting stage 12B may be configured to support the substrate W in a state where it can be discharged out of the second chamber 1B after processing in the second container 11B.

[0063] The second drive mechanism 13B is a mechanism for driving the second worktable 12B. For example, the second drive mechanism 13B is used to rotate the substrate W in the processing liquid stored in the second container 11B by rotating the second worktable 12B about an axis extending in the z-direction. Alternatively, the second drive mechanism 13B may also have the function of raising and lowering the second worktable 12B in the z-direction.

[0064] The second cover 14B is used to shield the second container 11B from the outside when processing the substrate W. In this embodiment, the second cover 14B houses the second container 11B and the second worktable 12B. The specific structure of the second cover 14B is not limited, but in this embodiment, it has a fixing part 141B, a second opening / closing device 142B, and a delivery opening / closing device 143B.

[0065] The fixing part 141B is the main body of the second cover 14B and is fixed to the support frame, etc. The fixing part 141B has an opening for feeding in and out of the substrate W. In the illustrated example, the fixing part 141B opens inward and outward in the y direction. That is, the fixing part 141B opens on the y1 side and the y2 side in the y direction.

[0066] The second opener / closer 142B can be in a state of covering and opening the opening on the outer side of the fixed part 141B in the y-direction, and can move relative to the fixed part 141B. There are no limitations on the operation of the second opener / closer 142B. In the illustrated example, the second opener / closer 142B moves up and down in the z-direction. There are no limitations on the mechanism (not shown) used to move the second opener / closer 142B; cylinders, motors, etc., can be used appropriately.

[0067] The output switch 143B can move relative to the fixed part 141B, allowing it to be in a state of being covered or open in the y-direction inner opening of the fixed part 141B. The operation of the output switch 143B is not limited. In the illustrated example, the output switch 143B moves up and down in the z-direction. The mechanism for moving the output switch 143B (not shown) is not limited; cylinders, motors, etc., can be used appropriately. Furthermore, the first cover 14A may also have a structure that includes the same switch as the output switch 143B. In a structure where the first cover 14A has the same switch as the output switch 143B, for example, unlike this embodiment, this switch can be used as an inlet when the first transport device 3 feeds the substrate W into the first chamber 1A without passing through the preparation table 2. Furthermore, by making the first cover 14A and the second cover 14B a shared structure, the substrate processing units U1 and U2 can be used in more diverse ways. Furthermore, when using substrate processing units U1 and U2 in a certain processing method with different processing methods, the required modification parts can be reduced.

[0068] The shape of the second cover 14B is not limited. In the illustrated example, the second cover 14B, when viewed along the z-direction, has a shape that bulges outward in the y-direction, for example, having a semi-circular portion. Correspondingly, the second opener / closer 142B, when viewed along the z-direction, has an arc shape. The output opener / closer 143B is flat.

[0069] Furthermore, the substrate processing units U1 and U2 may also include, for example, separate from the first chamber 1A and the second chamber 1B, other chambers or other processing tanks for swelling treatment. This swelling treatment involves maintaining the substrate W in a submerged state in a processing solution stored in a container for an extended period, causing the resist layer, etc., to swell and dissolve. For example, a chamber or processing tank for swelling treatment may be provided as a pre-processing step of the first chamber 1A. Alternatively, the first chamber 1A may also undergo swelling treatment. The processing solution used in the swelling treatment is often a chemical solution containing agents, etc. By separately providing a chamber using such a chemical solution (e.g., the chamber or processing tank for swelling treatment and the first chamber 1A) and a second chamber 1B using pure water, etc., for water washing treatment, the chemical solution and pure water can be more completely separated. This structure prevents the chemical solution from being accidentally diluted by pure water, which is preferable for the reuse of the chemical solution. Alternatively, substrate processing units U1 and U2 may also be configured to include other chambers after the second chamber 1B, from which substrate W is delivered to substrate processing units U1 and U2.

[0070] The two piping units 5 are units that allow the processing fluid to flow for the first process in the first chamber 1A and the second process in the second chamber 1B. The number of piping units 5 in each of the substrate processing units U1 and U2 is not limited; for example, it can be one or more. In this embodiment, the substrate processing unit U1 and the substrate processing unit U2 each have one piping unit 5 corresponding to the first chamber 1A and one piping unit 5 corresponding to the second chamber 1B, respectively.

[0071] There are no specific limitations on the structure of piping unit 5. Piping unit 5 may include, for example, a treatment fluid tank for storing treatment fluid, valves, filters, pumps, and other piping components.

[0072] The first transport device 3 is a device for feeding substrate W into and out of the two substrate processing units U1 and U2. In this embodiment, the first transport device 3 is located between the substrate processing unit U1 and the substrate processing unit U2 in the y-direction. That is, the first transport device 3 is disposed inside the substrate processing unit U1 and the substrate processing unit U2 in the y-direction.

[0073] There are no specific limitations on the structure of the first transport device 3. For example, a vertical joint robot, a horizontal joint robot, or an orthogonal robot can be used as the first transport device 3. In the illustrated example, the first transport device 3 is a horizontal joint robot, having a holding part 31, an arm 32, and a drive part 33.

[0074] The holding part 31 is the part that holds the substrate W. The arm 32 is configured as a horizontal multi-joint, which is the part that realizes the degree of freedom to move the holding part 31 to a desired position. The drive part 33 drives the arm 32, for example, including a servo motor. In addition, the drive part 33 has the function of moving the entire first conveying device 3 in the x-direction. Furthermore, the drive part 33 may also have the function of raising and lowering the holding part 31 and the arm 32 in the z-direction.

[0075] The two second transport devices 4A and 4B are for transporting the substrate W from the first chamber 1A and the second chamber 1B. Specifically, the second transport device 4A delivers the substrate W from the first chamber 1A of the substrate processing unit U1 and delivers the substrate W into the second chamber 1B. Similarly, the second transport device 4B delivers the substrate W from the first chamber 1A of the substrate processing unit U2 and delivers the substrate W into the second chamber 1B.

[0076] In this embodiment, two second transport devices 4A and 4B are arranged opposite each other in the y-direction, separated by two substrate processing units U1 and U2. The second transport device 4A is arranged on the outer side (y1 side) of the y-direction relative to the substrate processing unit U1. The second transport device 4B is arranged on the outer side (y2 side) of the y-direction relative to the substrate processing unit U2.

[0077] The specific structures of the two second transport devices 4A and 4B are not limited. For example, vertical multi-joint robots, horizontal multi-joint robots, or orthogonal robots can be used as the two second transport devices 4A and 4B. Furthermore, the two second transport devices 4A and 4B can have a common structure or different structures. In this embodiment, the case where the two second transport devices 4A and 4B have the same structure will be described as an example. In the illustrated example, the two second transport devices 4A and 4B are orthogonal robots, having a holding part 41, an arm 42, a rod 43, a drive part 44, a drive part 45, and a track 49.

[0078] The holding part 41 holds the substrate W. The arm 42 supports the holding part 41 and is shaped with the y-direction as its length. The drive part 44 functions to reciprocate the arm 42 in the y-direction. The drive part 44 may include, for example, a motor. The rod 43 supports the drive part 44 and is shaped with the z-direction as its length. The drive part 45 functions to move the rod 43. The drive part 45 moves the rod 43 reciprocating in the x-direction by traveling relative to the track 49 in the x-direction. Alternatively, the drive part 45 may also have the function of raising and lowering the rod 43 in the z-direction.

[0079] Figure 6This illustrates an example of the transport path of substrate W in substrate processing apparatus A1. Substrate W, placed on the feed-in feed table 6, is transported by the first transport device 3 to the preparation table 2 of substrate processing unit U1 (path R311) or to the preparation table 2 of substrate processing unit U2 (path R321). Substrate W placed on the preparation table 2 of substrate processing unit U1 is fed into the first chamber 1A by the second transport device 4A (path R411). Substrate W, having completed the first process in the first chamber 1A, is discharged from the first chamber 1A by the second transport device 4A and fed into the second chamber 1B (path R412). Then, substrate W, having completed the second process in the second chamber 1B, is discharged from the second chamber 1B by the first transport device 3 and placed on the feed-in feed table 6 (path R312). Conversely, substrate W placed on the preparation table 2 of substrate processing unit U2 is fed into the first chamber 1A by the second transport device 4B (path R421). The substrate W, having completed the first process in the first chamber 1A, is conveyed out of the first chamber 1A by the second transport device 4B and into the second chamber 1B (path R422). Then, the substrate W, having completed the second process in the second chamber 1B, is conveyed out of the second chamber 1B by the first transport device 3 and placed on the delivery and feeding platform 6 (path R322). That is, in this embodiment, the first transport device 3 performs the transport along paths R311, R312, R321, and R322, the second transport device 4A performs the transport along paths R411 and R412, and the second transport device 4B performs the transport along paths R421 and R422.

[0080] Figure 7A This illustrates a specific example of transport performed by the second transport device 4A. The second transport device 4A can move the holding part 31 via positions P0, P1, P2, P3, and P4. Position P0 is located on the front side of the preparation worktable 2 in the y-direction on the y-side. Position P1 is located on the front side of the first chamber 1A in the y-direction on the y-side, a position that does not interfere with the first cover 14A in its closed state. Position P2 is located on the front side of the second chamber 1B in the y-direction on the y-side, a position that does not interfere with the second cover 14B in its closed state. The positions P0, P1, and P2 in the y-direction can, for example, be the same.

[0081] Position P3 is located outside the first chamber 1A and the second chamber 1B, where the holding part 41 overlaps with both the first chamber 1A and the second chamber 1B when viewed along the x-direction and when viewed along the y-direction. Furthermore, position P3 is a position where the holding part 41 and the substrate W held in the holding part 41 do not interfere with the first cover 14A in its closed state and the second cover 14B in its closed state. Position P3 is the intermediate standby position of the present invention.

[0082] Along Figure 6Transport along path R411 can also be carried out via positions P0 and P1. Alternatively, more specifically, transport along path R411 can also be carried out without passing through positions P0 and P1. Figure 7A Position P4. Along Figure 6 Transport along path R412 can also be carried out via positions P1 and P2. Alternatively, more specifically, transport along path R412 can also be carried out without passing through positions P1 and P2. Figure 7A Position P3.

[0083] exist Figure 7A In the example shown, the second transport device 4A is an orthogonal robot. Therefore, the holding part 41 moves through at least two degrees of freedom: reciprocating motion in the x-direction and reciprocating motion in the y-direction.

[0084] exist Figure 7B In the example shown, the second transport device 4A has different degrees of freedom. The second transport device 4A moves by at least two degrees of freedom: rotational motion about an axis extending in the z-direction and reciprocating motion in the x-direction. In this example, the second transport device 4A can also move the holding part 31 via positions P0, P1, P2, P3, and P4.

[0085] Figures 8A to 8C Examples of other shapes for the first cover 14A and the second cover 14B are shown. Figure 8A In the example shown, the first cover 14A and the second cover 14B have semi-elliptical portions. Figure 8B In the example shown, the first cover 14A and the second cover 14B have trapezoidal portions. Figure 8C In the examples shown, the first cover 14A and the second cover 14B have triangular portions. In these examples, the second transport device 4A can also transport the holding portion 41 via position P3, which is the intermediate standby position of the present invention.

[0086] Next, the function of the substrate processing device A1 will be explained.

[0087] According to this embodiment, such as Figure 6As shown, the first transport device 3 transports the substrate W along paths R311 and R312, and the second transport device 4A transports the substrate W along paths R411 and R412. Therefore, the transport of substrate W along either path R311 or R312 and along either path R411 or R412 can be performed simultaneously and in parallel. This prevents the transport of substrate W along paths R311 and R312 from waiting for each other, thus improving the processing capacity of the substrate processing apparatus A1. Furthermore, since the first process in the first chamber 1A includes wetting the substrate W, the substrate W is wetted during transport along path R412. On the other hand, during transport along path R311, the substrate W is still being processed, while during transport along path R312, the processing of the substrate W in the substrate processing unit U1 is completed. Therefore, the second transport device 4A transports the substrate W, which is more likely to be wetted, while the first transport device 3 can only transport the substrate W in a dry state. Thus, the first transport device 3, which is supposed to transport the dried substrate W, can be prevented from being accidentally wetted, and the substrate can be transported more appropriately.

[0088] The first chamber 1A and the second chamber 1B are arranged in the x-direction, and the second transport device 4A and the first transport device 3 are arranged on opposite sides of each other in the y-direction, separated by the substrate processing unit U1. This prevents interference between the first transport device 3 and the second transport device 4A. Furthermore, it more reliably prevents the first transport device 3 from being wetted.

[0089] In the substrate processing apparatus A1, substrate processing units U1 and U2 are arranged on opposite sides of each other in the y-direction, separated by a first transport device 3. By using a single first transport device 3 to transport the substrate W of both substrate processing units U1 and U2, the complexity of the apparatus structure can be reduced, and the processing capacity of the substrate processing apparatus A2 can be further improved. Furthermore, the second transport device 4A and the second transport device 4B are arranged separately from the substrate processing units U1 and U2 on their outer sides in the y-direction. This avoids interference between the second transport device 4A and the second transport device 4B, which is preferable for improving the processing capacity of the substrate processing apparatus A1.

[0090] like Figure 7A , Figure 7BAs shown, the second conveying device 4A can move the holding part 31 via position P3. Thus, for example, the holding part 31 holding the substrate W delivered from the first chamber 1A can be positioned at position P3, waiting until the processing of another substrate W in the second chamber 1B is completed. When the processing in the second chamber 1B is completed and the second opener 142B is in the open state, the holding part 31 at position P3 can be quickly moved into the second cover 14B, and the substrate W can be fed into the second chamber 1B more quickly. This feeding is, for example, faster than when the holding part 31 is waiting at position P2. Therefore, the processing capacity of the substrate processing apparatus A1 is more preferably improved. Furthermore, after the first process in the first chamber 1A is completed, the second process in the second chamber 1B can be performed more quickly. Thus, the retention of chemicals and residues on the substrate W, which could reduce the quality of the substrate W, can be suppressed, and the processing quality of the substrate W can be improved.

[0091] Figures 9 to 14B Other embodiments of the present invention are shown. Furthermore, in these figures, elements that are the same as or similar to those in the above embodiments are labeled with the same reference numerals as those in the above embodiments. Additionally, the structures of the various modifications and components in each embodiment can be appropriately combined with each other without creating technical inconsistencies.

[0092] <Second Implementation Method>

[0093] Figure 9 This describes a substrate processing apparatus according to a second embodiment of the present invention. The substrate processing apparatus A2 of this embodiment has two substrate processing units U1 and two substrate processing units U2. Furthermore, the substrate processing apparatus A2 has two second transport devices 4A and two second transport devices 4B. Additionally, the substrate processing apparatus A2 has at least one first transport device 3. In other words, the substrate processing apparatus A2 is a structure in which two substrate processing apparatuses with the same structure as the substrate processing apparatus A1 described above are stacked in the z-direction. The first transport device 3 can be responsible for feeding and feeding the substrates W of the two substrate processing units U1 and the two substrate processing units U2. Alternatively, the substrate processing apparatus A2 may also have a structure having two first transport devices 3 arranged vertically in the z-direction.

[0094] According to this embodiment, the processing capability of the substrate processing apparatus A2 can also be improved and the substrate can be transported more appropriately. In addition, as understood according to this embodiment, by rationally modularizing the substrate processing units U1 and U2, substrate processing apparatuses with more diverse structures can be constructed by combining the substrate processing units U1 and U2 with the first transport device 3 and the second transport devices 4A and 4B.

[0095] <Third Implementation Method>

[0096] Figure 10A , Figure 10B This describes a substrate processing apparatus according to a third embodiment of the present invention. The substrate processing apparatus A3 of this embodiment includes one substrate processing unit U1 and one first transport device 3 and one second transport device 4A. The first transport device 3 and the second transport device 4A are arranged on the same side in the y-direction, i.e., the y1 side, relative to the substrate processing unit U1.

[0097] The first transport device 3 in this embodiment is, for example, an orthogonal robot, with the same structure as the second transport device 4A in the above embodiment. Furthermore, the second transport device 4A in this embodiment is, for example, a horizontal multi-joint robot, with the same structure as the first transport device 3 in the above embodiment. The first transport device 3 and the second transport device 4A are spaced apart from each other in the z-direction, enabling them to transport the substrate W without interfering with each other.

[0098] According to this embodiment, the processing capability of the substrate processing apparatus A2 can be improved, and the substrate can be transported more appropriately. Furthermore, as understood according to this embodiment, the substrate processing apparatus of the present invention can also be configured to have only one substrate processing unit. Alternatively, the first transport device 3 and the second transport device 4A can be configured to be positioned on the same side relative to the substrate processing unit U1.

[0099] <Specific example of treatment tank 51>

[0100] Figure 11A , Figure 11B , Figure 11C This figure shows a specific example of a processing fluid tank 51 in the piping unit 5. The processing fluid tank 51 shown in the figure has a side portion 511, a bottom portion 512, a first outlet 513, and a second outlet 514.

[0101] Side portion 511 is a rectangular ring-shaped portion when viewed along the z-direction. The bottom portion 512 connects to the z2 side of side portion 511 in the z-direction, closing off the z2 side of side portion 511. A first outlet 513 is located on one side of the processing liquid tank 51 in the y-direction. The first outlet 513 connects the interior of the processing liquid tank 51 to the outside. A second outlet 514 is located on the other side in the y-direction. The second outlet 514 also connects the interior of the processing liquid tank 51 to the outside. In the illustrated example, the direction in which the first outlet 513 and the second outlet 514 are spaced apart is the y-direction.

[0102] The first outlet 513 is located on the z1 side in the z direction, which is closer to the second outlet 514. In the illustrated example, the processing liquid tank 51 has two second outlets 514. The two second outlets 514 are arranged at intervals on both sides in the x direction. However, there are no limitations on the number or arrangement of the second outlets 514; for example, a second outlet 514 can be arranged in the center in the x direction. The arrangement of the first outlet 513 and the second outlet 514 is only required to facilitate the accumulation of impurities on the side of the second outlet 514. In addition, the bottom surface 512 is inclined relative to the y direction such that the side where the second outlet 514 is located is on the z2 side in the z direction compared to the side where the first outlet 513 is located in the y direction. Furthermore, the bottom surface 512 is not limited to a planar shape; it can also be curved, bent, stepped, or other shapes.

[0103] Figure 12 and Figure 13 This illustrates the flow pattern of the processing liquid in the substrate processing apparatus having the processing liquid tank 51 shown in FIG. 11. The processing liquid stored in the first container 11A is injected into the processing liquid tank 51. The processing liquid stored in the processing liquid tank 51 can be discharged from the first outlet 513. Additionally, the processing liquid stored in the processing liquid tank 51 can also be discharged from the second outlet 514. The multiple piping components 52 included in the piping unit 5, such as the valves, filters, and pumps shown in the figure, facilitate the flow of the processing liquid.

[0104] Figure 12 In the flow pattern shown, the valve of the piping component 52 connected to the first outlet 513 is in the open state, and the valve of the piping component 52 connected to the second outlet 514 is in the closed state. Driven by the pump of the piping component 52, the processed liquid stored in the processed liquid tank 51 is discharged from the first outlet 513 and injected into the first container 11A. On the other hand, the processed liquid is not discharged from the second outlet 514. In addition, the processed liquid stored in the first container 11A is injected into the processed liquid tank 51. Thus, the processed liquid circulates between the processed liquid tank 51 and the first container 11A.

[0105] Figure 13 In the flow pattern shown, the valve of the piping component 52 connected to the first outlet 513 is in the closed state, and the valve of the piping component 52 connected to the second outlet 514 is in the open state. As a result, the processing liquid is discharged from the second outlet 514 and discharged outside the piping unit 5. On the other hand, the processing liquid is not discharged from the first outlet 513.

[0106] According to this embodiment, because the bottom surface 512 is inclined relative to the y-direction, impurities such as the resist film that have been peeled off during the first and second processes tend to accumulate on the side of the second discharge outlet 514 in the y-direction. Therefore, when making... Figure 12 In the illustrated circulating flow of the processing liquid, the accidental contamination of impurities into the first container 11A can be suppressed. Furthermore, by reducing the circulation of impurities within the piping unit 5, clogging of filters, such as those included in the piping component 52, can be suppressed. This reduces maintenance time for the piping unit 5. On the other hand, when the processing liquid is discharged from the piping unit 5, it is discharged from the second outlet 514. This allows impurities accumulated near the second outlet 514 to be discharged along with the processing liquid from the second outlet 514. Therefore, contamination of the processing liquid used for processing can be suppressed, and impurities can be discharged more smoothly outside the substrate processing apparatus. Additionally, the first outlet 513 is located at one end of the processing liquid tank 51 in the y-direction, and the second outlet 514 is located near the other end of the processing liquid tank 51 in the y-direction. This allows for a longer distance between the first outlet 513 and the second outlet 514, thereby more reliably suppressing the discharge of impurities lingering near the second outlet 514 from the first outlet 513.

[0107] <Fourth Implementation Method>

[0108] Figure 14A , Figure 14B This describes a substrate processing apparatus according to a fourth embodiment of the present invention. The structure of the piping unit 5 in this embodiment of the substrate processing apparatus A4 differs from that in the embodiments described above. In this embodiment, the piping unit 5 can be pulled out from the substrate processing unit U1 while the first chamber 1A and the second chamber 1B are fixed. More specifically, the piping unit 5 can be moved in the y-direction y1 side while the first chamber 1A and the second chamber 1B are fixed to a support frame or the like, thereby allowing it to be pulled out from the substrate processing unit U1.

[0109] The specific structure of such a piping unit 5 is not limited. In the illustrated example, piping unit 5 includes a first part 5A and a second part 5B. The first part 5A and the second part 5B, for example, respectively include... Figure 12 and Figure 13 The diagram shows multiple piping components 52. For example, the first part 5A includes piping components 52 such as filters and / or valves. The second part 5B includes piping components 52 such as pumps, and may also include a treatment fluid tank 51. The treatment fluid tank 51 is located, for example, directly below the z2 side of the first chamber 1A in the z direction. The first part 5A is located on the z1 side of the z direction relative to the second part 5B, and is positioned biased towards the y1 side of the y direction relative to the first chamber 1A. In addition, in the illustrated example, the piping unit 5 may also have multiple casters 59. The multiple casters 59 are mounted on the second part 5B to allow movement when the piping unit 5 is pulled out.

[0110] Alternatively, the piping unit 5 can be connected to the first container 11A of the first chamber 1A via a quick connector, for example. When the piping unit 5 operates together with the first chamber 1A, it is in a state where the quick connector is connected. On the other hand, when pulling the piping unit 5 out of the substrate processing unit U1, it is preferable to remove the quick connector beforehand.

[0111] According to this embodiment, when performing maintenance on the piping unit 5, such as... Figure 14B As shown, the piping unit 5 can be pulled out without changing the state of the first chamber 1A and the second chamber 1B. For example, if the first drive mechanism 13A, the second drive mechanism 13B, etc., need to be disassembled for maintenance of the piping unit 5, the maintenance work of the piping unit 5 must take a corresponding amount of time. According to this embodiment, the time required for maintenance work of the piping unit 5 can be shortened.

[0112] The substrate processing apparatus of the present invention is not limited to the embodiments described above. The specific structure of each part of the substrate processing apparatus of the present invention can be freely modified in various ways.

Claims

1. A substrate processing apparatus, characterized in that, include: A substrate processing unit having a first chamber and a second chamber, wherein the first chamber is used for a first step including a process of wetting the substrate, and the second chamber is used for a second step of processing the substrate after the first step; A first conveying device is used to feed the substrate into the substrate processing unit and to deliver the substrate out of the substrate processing unit; and A second conveying device is used to deliver the substrate from the first chamber and to the second chamber.

2. The substrate processing apparatus as described in claim 1, characterized in that: The first step uses a pharmaceutical solution containing the agent as the treatment solution. The second step includes washing the substrate with water.

3. The substrate processing apparatus as described in claim 1, characterized in that: The first chamber and the second chamber are arranged in a first direction. The first transport device and the second transport device are arranged on opposite sides of each other in a second direction orthogonal to the first direction, separated by the substrate processing unit.

4. The substrate processing apparatus as described in claim 3, characterized in that, include: One of the first transport devices; Two substrate processing units are arranged on opposite sides of each other in the second direction, separated by the first transport device; and Two second transport devices are arranged on opposite sides of each other in the second direction, separated by the two substrate processing units.

5. The substrate processing apparatus as described in claim 3 or 4, characterized in that: The second transport device has a holding portion for holding the substrate. The retaining portion can pass through an intermediate standby position located outside the first chamber and the second chamber, overlapping with the first chamber and the second chamber when viewed along the first direction, and overlapping with the first chamber and the second chamber when viewed along the second direction.

6. The substrate processing apparatus as described in claim 5, characterized in that: The first chamber has a first cover. The second chamber has a second cover. When viewed along a third direction orthogonal to the first and second directions, the portions of the first and second covers opposite to the second conveying device are arc-shaped.

7. The substrate processing apparatus as described in claim 1, characterized in that: The substrate processing unit also includes a solution tank for storing the solution used for processing the substrate. The medicine tank has a first outlet and a second outlet for discharging medicine, as well as a bottom portion located vertically downwards. The first outlet is located vertically above the second outlet. The bottom surface is inclined relative to the direction of the gap, such that the side where the second outlet is located is vertically lower in the direction that separates the first outlet from the second outlet.

8. The substrate processing apparatus as described in claim 1, characterized in that: The substrate processing unit also includes a piping unit for the flow of the chemical solution used to process the substrate. The piping unit can be pulled out of the substrate processing unit while the first chamber and the second chamber are fixed.

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