A welding device and a welding method for semiconductor heating disc processing

Abstract

The application discloses a welding device and a welding method for semiconductor heating disc processing and relates to the technical field of heating disc welding. The application comprises a welding box, a welding assembly and a cleaning assembly, the bottom surface of the tin paste limiting cylinder is in contact with the top surface of the heating plate, the lifting injection pipe injects the tin paste into the tin paste limiting cylinder, the lifting mounting plate moves downward to drive the electrode rod fixed plate to move downward, the electrode rod part enters the fixed notch, the sliding fixed block moves to contact and extrude the electrode rod, and the electrode rod is fixed; after the tin paste injection is completed, the lifting mounting plate moves upward to drive the electrode rod fixed plate to move upward, the lifting mounting plate rotates to drive the electrode rod fixed plate to move to above the tin paste limiting rod, the lifting mounting plate moves downward, and the electrode rod enters the tin paste limiting cylinder; the tin paste on the heating disc is limited, the tin paste is prevented from flowing, the size, shape and thickness of the welding points after the subsequent tin paste hardens are different, and the heat conduction of the subsequent electrode rod to the heating disc is affected.

Description

Technical Field

[0001] This invention belongs to the field of heating plate welding technology, and more specifically, relates to a welding device and a welding method for processing semiconductor heating plates. Background Technology

[0002] A heating plate is a widely used device in the preparation and processing of semiconductor materials. In the process of producing a heating plate, it is necessary to solder electrode rods to the heating plate. Usually, the electrode rods are soldered to the heating plate, then solder paste is placed on the heating plate, one end of the electrode rod is pressed against the solder paste, and then the solder paste is heated to solder the electrode rod and the heating plate together.

[0003] Solder paste is a paste-like substance at room temperature. When the electrode rod presses against the solder paste, it will deform and flow, resulting in different sizes and shapes of solder joints, which will affect subsequent heat conduction. The expansion range of the solder paste needs to be limited. The amount of solder paste used in each soldering session is different. Even if the expansion range of the solder paste is the same, the thickness of the solder paste will be different. Therefore, it is necessary to remove and clean the excess solder paste in order to control the thickness of the solder paste and collect the excess solder paste to prevent waste. Summary of the Invention

[0004] To address the problems in related technologies, this invention proposes a welding apparatus and a welding method for processing semiconductor heating plates. The apparatus features the ability to limit solder paste on the heating plate to prevent it from flowing and causing variations in the size, shape, and thickness of the solder joints after hardening, thus affecting heat conduction from the electrode rods to the heating plate. It also allows for the overflow of solder paste from the limiting cylinder, pushing away and collecting the excess solder paste for reuse, improving the applicability of the apparatus, and ensuring uniform shape and thickness at each solder joint, which is beneficial for subsequent heat conduction. This invention solves the problem that solder paste is a paste-like substance at room temperature, and when the electrode rods press against it, the solder paste deforms and flows, resulting in varying solder joint sizes and shapes, thus affecting subsequent heat conduction. Furthermore, it limits the outward expansion range of the solder paste. Since the amount of solder paste varies with each welding operation, even with the same outward expansion range, the thickness of the solder paste varies, necessitating the removal and cleaning of excess solder paste. This allows for control of the solder paste thickness and collection of excess solder paste, preventing waste.

[0005] To solve the above technical problems, the present invention provides the following technical solution: The present invention is a welding device, including a welding box, a welding assembly and a cleaning assembly. A welding mounting table is fixedly installed inside the welding box, a conveyor belt is provided on the mounting table, and the welding assembly and the cleaning assembly are arranged above the welding mounting table.

[0006] The welding assembly includes several welding units. Each welding unit includes a rotating heating plate, a lifting mounting plate, a lifting injection tube, several electrode rod fixing structures, and several welding structures. Each welding structure includes a solder paste limiting cylinder. The electrode rod fixing structure includes an electrode rod fixing plate and a sliding fixing block. The rotating heating plate is positioned above the conveyor belt. The solder paste limiting cylinder is fixedly installed on the side of the rotating heating plate. The lifting mounting plate is positioned above the rotating heating plate. The lifting injection tube is fixedly connected to the lifting mounting plate. The electrode rod fixing plate is positioned below the lifting mounting plate. A fixing slot is formed on the top surface of the electrode rod fixing plate, and the sliding fixing block is slidably installed in the fixing slot.

[0007] The rotating heating plate can rotate, the lifting mounting plate can drive the lifting injection tube and the electrode rod fixing plate to move vertically, when the electrode rod enters the fixing slot, the sliding fixing block can move to squeeze and fix the electrode rod, and the lifting injection tube can inject solder paste into the solder paste limiting cylinder.

[0008] The cleaning assembly includes several cleaning units, each of which includes a cleaning tray, a cleaning pusher, and a collection hopper. The cleaning tray is fixedly installed on the top surface of the solder paste limiting cylinder, and a communicating slot is provided on the top surface of the cleaning tray. The cleaning pusher is disposed on the top surface of the cleaning tray, and the collection hopper is fixedly installed on one side of the cleaning tray.

[0009] When the electrode rod enters the solder paste limiting cylinder, some solder paste overflows onto the cleaning tray, and the cleaning pusher can move to push the solder paste into the collection hopper.

[0010] Preferably, the welding unit further includes a rotating fixed rod, a lifting cylinder, a fixed cylinder, and a fixed lifting ring plate. One end of the rotating fixed rod is rotatably mounted on the top surface of the welding mounting platform, and the other end is fixedly connected to the rotating heating plate. The lifting cylinder is fixedly connected to the lifting mounting plate. A connecting round rod is fixedly mounted on the output end of the lifting cylinder. The fixed lifting ring plate is slidably sleeved on the connecting round rod. The fixed cylinder is fixedly mounted on the bottom surface of the lifting mounting plate. A lifting fixed plate is fixedly mounted on the output end of the fixed cylinder. The lifting fixed plate is fixedly connected to the fixed lifting ring plate.

[0011] Preferably, the welding unit further includes a support mounting plate, a horizontal sliding frame, a horizontal cylinder, a lifting motor, a lifting screw, a lifting moving block, and a rotating motor. Several support columns are fixedly mounted on the top surface of the welding mounting platform. The support mounting plate is fixedly mounted on the top surface of the support columns. The horizontal sliding frame is slidably mounted on the side of the support mounting plate. The horizontal cylinder is fixedly mounted on the other side of the support mounting plate. A communicating slot is provided on the side of the support mounting plate. A connecting block is fixedly mounted on the output end of the horizontal cylinder. The connecting block is fixedly connected to the horizontal sliding frame. The lifting motor is fixedly mounted on the top surface of the horizontal sliding frame. The lifting screw is vertically rotatably mounted inside the horizontal sliding frame. The driving shaft of the lifting motor passes through the horizontal sliding frame and is fixedly connected to the lifting screw. The lifting moving block is threaded onto the lifting screw and slidably connected to the horizontal sliding frame. The rotating motor is fixedly mounted on the lifting moving block. The driving shaft of the rotating motor is fixedly connected to the lifting mounting plate.

[0012] Preferably, the electrode rod fixing structure further includes a lifting connecting rod, and the fixed lifting ring plate has several connection ports around its perimeter. One end of the lifting connecting rod is rotatably connected to the sliding fixing block, and the other end is rotatably installed in the connection port.

[0013] Preferably, the cleaning assembly further includes a cleaning mounting plate, a cleaning motor, a rotating gear, and several movable racks. Several cleaning mounting columns are fixedly mounted on the top surface of the rotating heating plate. The cleaning mounting plate is fixedly mounted on the top surface of the cleaning mounting columns. The cleaning motor is fixedly mounted on the top surface of the cleaning mounting plate. The rotating gear is rotatably mounted on the bottom surface of the cleaning mounting plate. The drive shaft of the cleaning motor passes through the cleaning mounting plate and is fixedly connected to the rotating gear. Two movable racks are slidably mounted on the top surface of the rotating heating plate, and the movable racks are located on both sides of the rotating gear. Two movable racks are slidably mounted on the bottom surface of the cleaning mounting plate, and the movable racks are located at both ends of the rotating gear. Both movable racks mesh with the rotating gear.

[0014] Preferably, the cleaning unit further includes a cleaning baffle, a movable mounting plate, and a reset spring. Two cleaning baffles are fixedly installed on the top surface of the cleaning tray, and two movable mounting plates are provided on the top surface of the cleaning baffles. A connecting movable block is fixedly installed on the top surface of the cleaning tray, and the connecting movable block is slidably connected to the movable mounting plate. A spring mounting block is fixedly installed on the side of the movable mounting plate, and one end of the reset spring is fixedly connected to the spring mounting block, and the other end is fixedly connected to the connecting movable block.

[0015] Preferably, a cleaning connecting rod is provided between the two movable mounting plates of the cleaning unit, and the two ends of the cleaning connecting rod are respectively fixedly connected to the two movable mounting plates, and the cleaning connecting rod is fixedly connected to a movable rack.

[0016] Preferably, the middle part of the cleaning baffle is arc-shaped.

[0017] Preferably, a plurality of conveyor blocks are fixedly installed on the conveyor belt, and a heating plate fixing plate is fixedly installed on the top surface of the conveyor blocks. The conveyor belt is slidably installed inside the welding box and can move vertically. A plurality of rotary motors and a heating device are provided inside the welding box. The drive shaft of the rotary motor is fixedly connected to the rotating fixing rod, and the heating device is rotatably connected to the rotating fixing rod.

[0018] A welding method for processing semiconductor heating plates, using the aforementioned welding apparatus, includes the following steps:

[0019] During soldering, the heating plate is placed on the conveyor belt, which moves the heating plate into the soldering box. The conveyor belt stops moving, and the rotating heating plate moves above the heating plate. The bottom surface of the solder paste limiting cylinder contacts the top surface of the heating plate. The lifting mounting plate moves vertically downward, and the lifting injection tube injects solder paste into the solder paste limiting cylinder. The downward movement of the lifting mounting plate drives the electrode rod fixing plate to move downward, so that the electrode rod part enters the fixing slot. The sliding fixing block moves to contact and squeeze the electrode rod for fixing.

[0020] After the solder paste injection is completed, the lifting mounting plate moves upward, causing the electrode rod fixing plate to move upward. The lifting mounting plate rotates, causing the electrode rod fixing plate to move above the solder paste limiting rod. The lifting mounting plate moves downward, allowing the electrode rod to enter the solder paste limiting cylinder.

[0021] When the electrode rod enters the solder paste limiting cylinder, some solder paste overflows onto the cleaning tray. The cleaning pusher moves toward the collection hopper and pushes the overflowing solder paste into the collection hopper.

[0022] The rotating heating plate heats and conducts the temperature to the solder paste limiting cylinder, which heats the solder paste, causing it to harden and weld the electrode rod to the heating plate.

[0023] After welding is completed, the sliding fixing block moves to release the electrode rod from the fixing, the conveyor belt moves downward, driving the electrode rod through the solder paste limiting cylinder, and the conveyor belt drives the welding completed heating plate out of the welding box.

[0024] Compared with the prior art, the present invention provides a welding apparatus and a welding method for processing semiconductor heating plates, which has the following beneficial effects:

[0025] 1. The bottom surface of the solder paste limiting cylinder contacts the top surface of the heating plate. The lifting injection tube injects solder paste into the solder paste limiting cylinder. The lifting mounting plate moves downward, causing the electrode rod fixing plate to move downward, so that the electrode rod part enters the fixing slot. The sliding fixing block moves to contact and squeeze the electrode rod for fixation. After the solder paste injection is completed, the lifting mounting plate moves upward, causing the electrode rod fixing plate to move upward. The lifting mounting plate rotates, causing the electrode rod fixing plate to move above the solder paste limiting rod. The lifting mounting plate moves downward, so that the electrode rod enters the solder paste limiting cylinder. This limits the solder paste on the heating plate to prevent the solder paste from flowing, which would cause the size, shape and thickness of the solder joints to be different after the solder paste hardens, affecting the heat conduction of the electrode rod to the heating plate.

[0026] 2. When the electrode rod enters the solder paste limiting cylinder, some solder paste overflows onto the cleaning tray. The cleaning pusher moves towards the collection hopper and pushes the overflowing solder paste into the collection hopper. Solder paste overflows from the solder paste limiting cylinder. The excess solder paste is pushed away and collected for reuse, improving the applicability of the device and ensuring that the shape and thickness of each solder joint are the same, which is conducive to subsequent heat conduction.

[0027] 3. The moving rack moves, driving two moving mounting plates to move. The moving mounting plates drive the cleaning push plate to move. When the cleaning push plate contacts and presses against the electrode rod, the cleaning push plate moves towards the cleaning baffle. When the cleaning push plate moves towards the cleaning baffle, it enters the arc-shaped area of ​​the cleaning baffle. The cleaning push plate moves while moving without obstruction. The structure is simple and easy to maintain.

[0028] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0029] To more clearly illustrate the technical solutions of the embodiments of the invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is one of the overall three-dimensional structural schematic diagrams of the present invention;

[0031] Figure 2 This is one of the partial three-dimensional structural schematic diagrams of the present invention;

[0032] Figure 3 This is a second partial three-dimensional structural schematic diagram of the present invention;

[0033] Figure 4 For the present invention Figure 3 Schematic diagram of the structure at point A

[0034] Figure 5 This is the third partial three-dimensional structural schematic diagram of the present invention;

[0035] Figure 6 For the present invention Figure 5 A schematic diagram of the structure at point B;

[0036] Figure 7 This is the fourth partial three-dimensional structural schematic diagram of the present invention;

[0037] Figure 8 For the present invention Figure 7 A schematic diagram of the structure at point C;

[0038] Figure 9 For the present invention Figure 7 A schematic diagram of the structure at point D;

[0039] Figure 10 This is the fifth partial three-dimensional structural schematic diagram of the present invention;

[0040] Figure 11 For the present invention Figure 10 A schematic diagram of the structure at point E.

[0041] The attached diagram lists the components represented by each number as follows:

[0042] 1. Welding box; 101. Welding mounting table; 102. Conveyor belt; 103. Support column; 104. Heating plate fixing plate; 2. Welding assembly; 3. Cleaning assembly; 301. Cleaning mounting plate; 302. Cleaning motor; 303. Rotating gear; 304. Moving rack; 305. Cleaning mounting column; 4. Welding unit; 401. Rotating heating plate; 402. Lifting mounting plate; 403. Lifting injection tube; 404. Rotating fixing rod; 405. Lifting cylinder; 406. Fixing cylinder; 407. Fixing lifting ring plate; 408. Lifting fixing plate; 409. Support plate 410. Mounting plate; 411. Horizontal sliding frame; 412. Horizontal cylinder; 413. Lifting motor; 414. Lifting lead screw; 415. Lifting moving block; 416. Rotating motor; 5. Electrode rod fixing structure; 501. Electrode rod fixing plate; 502. Sliding fixing block; 503. Fixing slot; 504. Lifting connecting rod; 6. Welding structure; 601. Solder paste limiting cylinder; 7. Cleaning unit; 701. Cleaning tray; 702. Cleaning push plate; 703. Collection hopper; 704. Cleaning baffle; 705. Movable mounting plate; 706. Return spring; 707. Cleaning connecting rod. Detailed Implementation

[0043] The technical solutions of the embodiments of the invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the invention, and not all embodiments. Based on the embodiments of the invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the invention.

[0044] In the description of this invention, it should be understood that the terms "opening", "upper", "lower", "top", "middle", "inner", etc., which indicate orientation or positional relationship, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the invention.

[0045] For examples, please refer to Figure 1 - Figure 11 As shown, the present invention is a welding device, including a welding box 1, a welding assembly 2 and a cleaning assembly 3. A welding mounting table 101 is fixedly installed inside the welding box 1, a conveyor belt 102 is provided on the mounting table, and the welding assembly 2 and the cleaning assembly 3 are provided above the welding mounting table 101.

[0046] The welding assembly 2 includes several welding units 4. Each welding unit 4 includes a rotating heating plate 401, a lifting mounting plate 402, a lifting injection tube 403, several electrode rod fixing structures 5, and several welding structures 6. Each welding structure 6 includes a solder paste limiting cylinder 601. Each electrode rod fixing structure 5 includes an electrode rod fixing plate 501 and a sliding fixing block 502. The rotating heating plate 401 is positioned above the conveyor belt 102. The solder paste limiting cylinder 601 is fixedly installed on the side of the rotating heating plate 401. The lifting mounting plate 402 is positioned above the rotating heating plate 401. The lifting injection tube 403 is fixedly connected to the lifting mounting plate 402. The electrode rod fixing plate 501 is positioned below the lifting mounting plate 402. A fixing slot 503 is opened on the top surface of the electrode rod fixing plate 501. The sliding fixing block 502 is slidably installed in the fixing slot 503.

[0047] The rotating heating plate 401 can rotate, and the lifting mounting plate 402 can drive the lifting injection tube 403 and the electrode rod fixing plate 501 to move vertically. When the electrode rod enters the fixing slot 503, the sliding fixing block 502 can move to squeeze and fix the electrode rod. The lifting injection tube 403 can inject solder paste into the solder paste limiting cylinder 601.

[0048] The cleaning component 3 includes several cleaning units 7. Each cleaning unit 7 includes a cleaning tray 701, a cleaning pusher 702, and a collection hopper 703. The cleaning tray 701 is fixedly installed on the top surface of the solder paste limiting cylinder 601. A connecting slot is opened on the top surface of the cleaning tray 701. The cleaning pusher 702 is set on the top surface of the cleaning tray 701. The collection hopper 703 is fixedly installed on one side of the cleaning tray 701.

[0049] When the electrode rod enters the solder paste limiting cylinder 601, some solder paste overflows onto the cleaning tray 701, and the cleaning push plate 702 can move to push the solder paste into the collection hopper 703.

[0050] During use, when soldering, the heating plate is placed on the conveyor belt 102. The conveyor belt 102 moves the heating plate into the soldering box 1. The conveyor belt 102 stops moving, and the rotating heating plate 401 moves above the heating plate. The bottom surface of the solder paste limiting cylinder 601 contacts the top surface of the heating plate. The lifting mounting plate 402 moves vertically downward, and the lifting injection tube 403 injects solder paste into the solder paste limiting cylinder 601. The downward movement of the lifting mounting plate 402 causes the electrode rod fixing plate 501 to move downward, so that the electrode rod part enters the fixing slot 503 and slides. The fixing block 502 moves to contact and press the electrode rod for fixation; after the solder paste is injected, the lifting mounting plate 402 moves upward, causing the electrode rod fixing plate 501 to move upward. The lifting mounting plate 402 rotates, causing the electrode rod fixing plate 501 to move above the solder paste limiting rod. The lifting mounting plate 402 moves downward, allowing the electrode rod to enter the solder paste limiting cylinder 601; the solder paste on the heating plate is limited to prevent the solder paste from flowing, which would result in different sizes, shapes and thicknesses of the solder joints after the solder paste hardens, affecting the heat conduction of the subsequent electrode rod to the heating plate;

[0051] When the electrode rod enters the solder paste limiting cylinder 601, some solder paste overflows onto the cleaning tray 701. The cleaning pusher 702 moves towards the collection hopper 703, pushing the overflowing solder paste into the collection hopper 703. Solder paste overflows from the solder paste limiting cylinder 601, pushing away and collecting the excess solder paste for reuse, improving the applicability of the device, ensuring that the shape and thickness of each solder joint are the same, which is beneficial for subsequent heat conduction.

[0052] The rotating heating plate 401 heats and conducts the temperature to the solder paste limiting cylinder 601. The solder paste limiting cylinder 601 heats the solder paste, and the solder paste hardens by heat, thus welding the electrode rod to the heating plate.

[0053] After welding is completed, the sliding fixing block 502 moves to release the fixing of the electrode rod, the conveyor belt 102 moves downward, and drives the electrode rod through the solder paste limiting cylinder 601. The conveyor belt 102 then drives the welding completed heating plate out of the welding box 1.

[0054] Please see Figure 1 - Figure 11As shown, the welding unit 4 also includes a rotating fixed rod 404, a lifting cylinder 405, a fixed cylinder 406, and a fixed lifting ring plate 407. One end of the rotating fixed rod 404 is rotatably mounted on the top surface of the welding mounting table 101, and the other end is fixedly connected to the rotating heating plate 401. The lifting cylinder 405 is fixedly connected to the lifting mounting plate 402. A connecting round rod is fixedly mounted on the output end of the lifting cylinder 405. The fixed lifting ring plate 407 is slidably sleeved on the connecting round rod. The fixed cylinder 406 is fixedly mounted on the bottom surface of the lifting mounting plate 402. A lifting fixed plate 408 is fixedly mounted on the output end of the fixed cylinder 406. The lifting fixed plate 408 is fixedly connected to the fixed lifting ring plate 407.

[0055] In use, rotating the fixed rod 404 causes the rotating heating plate 401 to move; the lifting cylinder 405 drives the electrode rod fixing plate 501 to move vertically, and the fixed cylinder 406 drives the fixed lifting ring plate 407 to move vertically. The vertical movement of the fixed lifting ring plate 407 can drive the sliding fixing block 502 to move.

[0056] Please see Figure 1 - Figure 11 As shown, the welding unit 4 also includes a support mounting plate 409, a horizontal sliding frame 410, a horizontal cylinder 411, a lifting motor 412, a lifting screw 413, a lifting moving block 414, and a rotating motor 415. Several support columns 103 are fixedly mounted on the top surface of the welding mounting table 101. The support mounting plate 409 is fixedly mounted on the top surface of the support columns 103. The horizontal sliding frame 410 is slidably mounted on the side of the support mounting plate 409. The horizontal cylinder 411 is fixedly mounted on the other side of the support mounting plate 409. A connecting slot is provided on the side of the support mounting plate 409. The output end of the horizontal cylinder 411 is fixed... A connecting block is fixedly installed, and the connecting block is fixedly connected to the horizontal sliding frame 410. The lifting motor 412 is fixedly installed on the top surface of the horizontal sliding frame 410. The lifting screw 413 is vertically rotatably installed inside the horizontal sliding frame 410. The drive shaft of the lifting motor 412 passes through the horizontal sliding frame 410 and is fixedly connected to the lifting screw 413. The lifting moving block 414 is threaded onto the lifting screw 413 and is slidably connected to the horizontal sliding frame 410. The rotating motor 415 is fixedly installed on the lifting moving block 414. The drive shaft of the rotating motor 415 is fixedly connected to the lifting mounting plate 402.

[0057] In use, the horizontal cylinder 411 drives the horizontal sliding frame 410 to move, the lifting motor 412 drives the lifting screw 413 to rotate, the rotation of the lifting screw 413 drives the lifting moving block 414 to move, the lifting moving block 414 drives the rotating motor 415 to move vertically, and the rotation drives the lifting mounting plate 402 to rotate.

[0058] Please see Figure 1 - Figure 11As shown, the electrode rod fixing structure 5 also includes a lifting connecting rod 504. The fixed lifting ring plate 407 has several connection ports around its perimeter. One end of the lifting connecting rod 504 is rotatably connected to the sliding fixing block 502, and the other end is rotatably installed in the connection port.

[0059] In use, the vertical movement of the fixed lifting ring plate 407 can drive the sliding fixed block 502 to move through the lifting connecting rod 504.

[0060] Please see Figure 1 - Figure 11 As shown, the cleaning assembly 3 also includes a cleaning mounting plate 301, a cleaning motor 302, a rotating gear 303, and several movable racks 304. Several cleaning mounting columns 305 are fixedly installed on the top surface of the rotating heating plate 401. The cleaning mounting plate 301 is fixedly installed on the top surface of the cleaning mounting columns 305. The cleaning motor 302 is fixedly installed on the top surface of the cleaning mounting plate 301. The rotating gear 303 is rotatably installed on the bottom surface of the cleaning mounting plate 301. The drive shaft of the cleaning motor 302 passes through the cleaning mounting plate 301 and is fixedly connected to the rotating gear 303. Two movable racks 304 are slidably installed on the top surface of the rotating heating plate 401. The movable racks 304 are located on both sides of the rotating gear 303. Two movable racks 304 are slidably installed on the bottom surface of the cleaning mounting plate 301. The movable racks 304 are located at both ends of the rotating gear 303. The movable racks 304 mesh with the rotating gear 303.

[0061] In use, the cleaning motor 302 drives the rotating gear 303 to rotate, and the rotating gear 303 drives the moving rack 304 to move. The two moving racks 304 on both sides move in opposite directions, and the two moving racks 304 at both ends move in opposite directions.

[0062] Please see Figure 1 - Figure 11 As shown, the cleaning unit 7 also includes a cleaning baffle 704, a movable mounting plate 705, and a return spring 706. Two cleaning baffles 704 are fixedly installed on the top surface of the cleaning tray 701. Two movable mounting plates 705 are provided on the top surface of the cleaning baffles 704. A connecting movable block is fixedly installed on the top surface of the cleaning tray 701. The connecting movable block is slidably connected to the movable mounting plate 705. A spring mounting block is fixedly installed on the side of the movable mounting plate 705. One end of the return spring 706 is fixedly connected to the spring mounting block, and the other end is fixedly connected to the connecting movable block.

[0063] In use, the moving rack 304 moves, driving the two moving mounting plates 705 to move. The moving mounting plates 705 drive the cleaning push plate 702 to move. When the cleaning push plate 702 contacts and presses against the electrode rod, the cleaning push plate 702 moves towards the cleaning baffle 704, and the return spring 706 is compressed.

[0064] Please see Figure 1- Figure 11 As shown, a cleaning connecting rod 707 is provided between the two movable mounting plates 705 of the cleaning unit 7. The two ends of the cleaning connecting rod 707 are fixedly connected to the two movable mounting plates 705 respectively, and the cleaning connecting rod 707 is fixedly connected to a movable rack 304.

[0065] In use, the moving rack 304 drives the cleaning connecting rod 707 to move, and the cleaning connecting rod 707 drives the moving mounting plate 705 to move.

[0066] Please see Figure 1 - Figure 11 As shown, the middle part of the cleaning baffle 704 is arc-shaped;

[0067] When in use, as the cleaning push plate 702 moves toward the cleaning baffle 704, the cleaning push plate 702 enters the arc-shaped area of ​​the cleaning baffle 704.

[0068] Please see Figure 1 - Figure 11 As shown, several conveyor blocks are fixedly installed on the conveyor belt 102, and a heating plate fixing plate 104 is fixedly installed on the top surface of the conveyor blocks. The conveyor belt 102 is slidably installed in the welding box 1. The conveyor belt 102 can move vertically. Several rotary motors and heating devices are provided in the welding box 1. The drive shaft of the rotary motor is fixedly connected to the rotating fixing rod 404, and the heating device is rotatably connected to the rotating fixing rod 404.

[0069] In use, the conveyor belt 102 can move vertically, and the heating device can heat the rotating fixed rod 404.

[0070] A welding method for processing semiconductor heating plates, using the aforementioned welding apparatus, includes the following steps:

[0071] During soldering, the heating plate is placed on the conveyor belt 102, which moves the heating plate into the soldering box 1. The conveyor belt 102 stops moving, and the rotating heating plate 401 moves above the heating plate. The bottom surface of the solder paste limiting cylinder 601 contacts the top surface of the heating plate. The lifting mounting plate 402 moves vertically downward, and the lifting injection tube 403 injects solder paste into the solder paste limiting cylinder 601. The lifting mounting plate 402 moves downward, causing the electrode rod fixing plate 501 to move downward, so that the electrode rod part enters the fixing slot 503. The sliding fixing block 502 moves to contact and squeeze the electrode rod for fixing.

[0072] After the solder paste injection is completed, the lifting mounting plate 402 moves upward, causing the electrode rod fixing plate 501 to move upward. The lifting mounting plate 402 rotates, causing the electrode rod fixing plate 501 to move above the solder paste limiting rod. The lifting mounting plate 402 moves downward, allowing the electrode rod to enter the solder paste limiting cylinder 601.

[0073] When the electrode rod enters the solder paste limiting cylinder 601, some solder paste overflows onto the cleaning tray 701. The cleaning push plate 702 moves toward the collection hopper 703 and pushes the overflowing solder paste into the collection hopper 703.

[0074] The rotating heating plate 401 heats and conducts the temperature to the solder paste limiting cylinder 601. The solder paste limiting cylinder 601 heats the solder paste, and the solder paste hardens by heat, thus welding the electrode rod to the heating plate.

[0075] After welding is completed, the sliding fixing block 502 moves to release the fixing of the electrode rod, the conveyor belt 102 moves downward, and drives the electrode rod through the solder paste limiting cylinder 601. The conveyor belt 102 then drives the welding completed heating plate out of the welding box 1.

[0076] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0077] The preferred embodiments of the invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A welding apparatus, comprising a welding box, a welding assembly, and a cleaning assembly, characterized in that: A welding mounting table is fixedly installed inside the welding box. A conveyor belt is provided on the mounting table. The welding assembly and the cleaning assembly are arranged above the welding mounting table. The welding assembly includes several welding units. Each welding unit includes a rotating heating plate, a lifting mounting plate, a lifting injection tube, several electrode rod fixing structures, and several welding structures. Each welding structure includes a solder paste limiting cylinder. The electrode rod fixing structure includes an electrode rod fixing plate and a sliding fixing block. The rotating heating plate is positioned above the conveyor belt. The solder paste limiting cylinder is fixedly installed on the side of the rotating heating plate. The lifting mounting plate is positioned above the rotating heating plate. The lifting injection tube is fixedly connected to the lifting mounting plate. The electrode rod fixing plate is positioned below the lifting mounting plate. A fixing slot is formed on the top surface of the electrode rod fixing plate, and the sliding fixing block is slidably installed in the fixing slot. The rotating heating plate can rotate, the lifting mounting plate can drive the lifting injection tube and the electrode rod fixing plate to move vertically, when the electrode rod enters the fixing slot, the sliding fixing block can move to squeeze and fix the electrode rod, and the lifting injection tube can inject solder paste into the solder paste limiting cylinder. The cleaning assembly includes several cleaning units, each of which includes a cleaning tray, a cleaning pusher, and a collection hopper. The cleaning tray is fixedly installed on the top surface of the solder paste limiting cylinder, and a communicating slot is provided on the top surface of the cleaning tray. The cleaning pusher is disposed on the top surface of the cleaning tray, and the collection hopper is fixedly installed on one side of the cleaning tray. When the electrode rod enters the solder paste limiting cylinder, some solder paste overflows onto the cleaning tray, and the cleaning pusher can move to push the solder paste into the collection hopper.

2. The welding apparatus according to claim 1, characterized in that, The welding unit further includes a rotating fixed rod, a lifting cylinder, a fixed cylinder, and a fixed lifting ring plate. One end of the rotating fixed rod is rotatably mounted on the top surface of the welding mounting platform, and the other end is fixedly connected to the rotating heating plate. The lifting cylinder is fixedly connected to the lifting mounting plate. A connecting round rod is fixedly mounted on the output end of the lifting cylinder. The fixed lifting ring plate is slidably sleeved on the connecting round rod. The fixed cylinder is fixedly mounted on the bottom surface of the lifting mounting plate. A lifting fixed plate is fixedly mounted on the output end of the fixed cylinder. The lifting fixed plate is fixedly connected to the fixed lifting ring plate.

3. The welding apparatus according to claim 2, characterized in that, The welding unit further includes a support mounting plate, a horizontal sliding frame, a horizontal cylinder, a lifting motor, a lifting screw, a lifting moving block, and a rotary motor. Several support columns are fixedly mounted on the top surface of the welding mounting platform. The support mounting plate is fixedly mounted on the top surface of the support columns. The horizontal sliding frame is slidably mounted on the side of the support mounting plate. The horizontal cylinder is fixedly mounted on the other side of the support mounting plate. A connecting slot is provided on the side of the support mounting plate. A connecting block is fixedly mounted on the output end of the horizontal cylinder and is fixedly connected to the horizontal sliding frame. The lifting motor is fixedly mounted on the top surface of the horizontal sliding frame. The lifting screw is vertically rotatably mounted inside the horizontal sliding frame. The drive shaft of the lifting motor passes through the horizontal sliding frame and is fixedly connected to the lifting screw. The lifting moving block is threaded onto the lifting screw and is slidably connected to the horizontal sliding frame. The rotary motor is fixedly mounted on the lifting moving block, and its drive shaft is fixedly connected to the lifting mounting plate.

4. The welding apparatus according to claim 3, characterized in that, The electrode rod fixing structure also includes a lifting connecting rod. The fixed lifting ring plate has several connection ports around its perimeter. One end of the lifting connecting rod is rotatably connected to the sliding fixing block, and the other end is rotatably installed in the connection port.

5. The welding apparatus according to claim 4, characterized in that, The cleaning assembly further includes a cleaning mounting plate, a cleaning motor, a rotating gear, and several movable racks. Several cleaning mounting columns are fixedly mounted on the top surface of the rotating heating plate. The cleaning mounting plate is fixedly mounted on the top surface of the cleaning mounting columns. The cleaning motor is fixedly mounted on the top surface of the cleaning mounting plate. The rotating gear is rotatably mounted on the bottom surface of the cleaning mounting plate. The drive shaft of the cleaning motor passes through the cleaning mounting plate and is fixedly connected to the rotating gear. Two movable racks are slidably mounted on the top surface of the rotating heating plate, and the movable racks are located on both sides of the rotating gear. Two movable racks are slidably mounted on the bottom surface of the cleaning mounting plate, and the movable racks are located at both ends of the rotating gear. Both movable racks mesh with the rotating gear.

6. The welding apparatus according to claim 5, characterized in that, The cleaning unit also includes a cleaning baffle, a movable mounting plate, and a reset spring. Two cleaning baffles are fixedly installed on the top surface of the cleaning tray, and two movable mounting plates are provided on the top surface of the cleaning baffles. A connecting movable block is fixedly installed on the top surface of the cleaning tray, and the connecting movable block is slidably connected to the movable mounting plate. A spring mounting block is fixedly installed on the side of the movable mounting plate, and one end of the reset spring is fixedly connected to the spring mounting block, and the other end is fixedly connected to the connecting movable block.

7. The welding apparatus according to claim 6, characterized in that, A cleaning connecting rod is provided between the two movable mounting plates of the cleaning unit. The two ends of the cleaning connecting rod are fixedly connected to the two movable mounting plates respectively, and the cleaning connecting rod is fixedly connected to a movable rack.

8. A welding apparatus according to claim 7, characterized in that, The middle part of the cleaning baffle is arc-shaped.

9. A welding apparatus according to claim 8, characterized in that, Several conveyor blocks are fixedly installed on the conveyor belt, and a heating plate fixing plate is fixedly installed on the top surface of the conveyor blocks. The conveyor belt is slidably installed inside the welding box and can move vertically. Several rotary motors and heating devices are provided inside the welding box. The drive shaft of the rotary motor is fixedly connected to the rotating fixing rod, and the heating device is rotatably connected to the rotating fixing rod.

10. A welding method for processing semiconductor heating plates, characterized in that, The welding apparatus as described in any one of claims 1-9 is used, comprising the following steps: During soldering, the heating plate is placed on the conveyor belt, which moves the heating plate into the soldering box. The conveyor belt stops moving, and the rotating heating plate moves above the heating plate. The bottom surface of the solder paste limiting cylinder contacts the top surface of the heating plate. The lifting mounting plate moves vertically downward, and the lifting injection tube injects solder paste into the solder paste limiting cylinder. The downward movement of the lifting mounting plate drives the electrode rod fixing plate to move downward, so that the electrode rod part enters the fixing slot. The sliding fixing block moves to contact and squeeze the electrode rod for fixing. After the solder paste injection is completed, the lifting mounting plate moves upward, causing the electrode rod fixing plate to move upward. The lifting mounting plate rotates, causing the electrode rod fixing plate to move above the solder paste limiting rod. The lifting mounting plate moves downward, allowing the electrode rod to enter the solder paste limiting cylinder. When the electrode rod enters the solder paste limiting cylinder, some solder paste overflows onto the cleaning tray. The cleaning pusher moves toward the collection hopper and pushes the overflowing solder paste into the collection hopper. The rotating heating plate heats and conducts the temperature to the solder paste limiting cylinder, which heats the solder paste, causing it to harden and weld the electrode rod to the heating plate. After welding is completed, the sliding fixing block moves to release the electrode rod from the fixing, the conveyor belt moves downward, driving the electrode rod through the solder paste limiting cylinder, and the conveyor belt drives the welding completed heating plate out of the welding box.

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