Cooling device for semiconductor processing

Abstract

The invention relates to the technical field of semiconductor processing, and discloses a semiconductor processing cooling device which comprises a machine body and a control screen, two first linear motors are installed on the inner wall of the machine body, a second linear motor is arranged at the output end of the machine body, a laser cutter is arranged at the output end of the second linear motor, and an auxiliary device is arranged on the inner wall of the machine body. Through cooperation of the heat-conducting supporting plate and the heat-conducting cover plate, large-area heat conduction of the heat-conducting supporting plate and small-area heat conduction of the heat-conducting cover plate and the grooves, the heat conduction efficiency is greatly improved, meanwhile, the circulation assembly can rapidly take away heat on the surface of the heat-conducting supporting plate for cooling, and the problems of silicon wafer deformation, damage and the like caused by local overheating are effectively reduced. The silicon wafer machining precision and quality are guaranteed, the heat conduction cover plate can effectively shield smoke dust and splashes in the cutting process, the situation that the smoke dust and the splashes fall on the silicon wafer is reduced, pollution and damage to the surface of the silicon wafer are reduced, the cleanliness of the silicon wafer can be maintained, the product quality is guaranteed, and the defective rate caused by pollution is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor processing, in particular to a cooling device for semiconductor processing. BACKGROUND

[0002] Semiconductor is a material with electrical conductivity between conductor (such as copper, silver) and insulator (such as rubber, ceramic), its electrical conductivity can be significantly changed by factors such as temperature, light, impurities, etc. Under normal circumstances, the number of electrons and holes of semiconductor is small, and the conductivity is limited; but when the external conditions change, the concentration of electrons and holes will change, and the conductivity will also change. Using this characteristic, semiconductor is widely used in electronic field, such as manufacturing diodes, triodes, integrated circuits and other electronic devices. These semiconductor devices are the core components of modern electronic products, such as computers, mobile phones, smart home devices, etc., and play a key role in promoting information technology development.

[0003] Silicon wafer is a key basic material for semiconductor manufacturing, which is made of high-purity silicon and has good electrical properties, thermal stability and mechanical properties. The manufacturing process of silicon wafer is complex, which needs to go through multiple processes, such as extracting high-purity silicon from silicon ore, then making silicon single crystal rod through crystal pulling technology, and finally cutting, grinding and polishing into the required silicon wafer. In semiconductor manufacturing, silicon wafer as a substrate is the carrier for building various semiconductor devices. During the processing of semiconductor silicon wafer, it is often necessary to cut multiple silicon wafers of the same size on a larger silicon wafer by laser cutting, as shown in Figure 10

[0004] In the prior art, during the laser cutting process of the silicon wafer, a large amount of heat will be generated in the cutting area of the cut and formed silicon wafer. If the heat cannot be effectively dissipated in time, it will have a bad effect on the internal microstructure of the silicon wafer, thereby damaging the quality and performance of the silicon wafer and reducing the yield of semiconductor devices. At the same time, during the laser cutting process, melting and gasification phenomena will occur, and smoke and splashes will easily splash onto the surface of the formed silicon wafer, causing subsequent cleaning inconvenience and quality problems.

[0005] Therefore, we propose a cooling device for semiconductor processing. SUMMARY

[0006] In view of the shortcomings of the prior art, the present application provides a cooling device for semiconductor processing, which solves the problems of the prior art that a large amount of heat is generated in the cutting area of the cut and formed silicon wafer during the laser cutting process of the silicon wafer, which is not convenient for cooling, and smoke and splashes are easily splashed onto the surface of the formed silicon wafer.

[0007] ​In order to achieve the above object, the application is implemented by the following technical scheme: a cooling device for semiconductor processing, comprising a body and a control screen, the inner wall of the body is provided with two linear motors I, the output end of the linear motor I is provided with a linear motor II, the output end of the linear motor II is provided with a laser cutter, the inner wall of the body is provided with an auxiliary device, the auxiliary device comprises a mounting seat mounted in the inner wall of the body by screws, a plurality of supports are mounted on the upper surface of the mounting seat, a heat-conducting supporting plate is mounted on the upper end of the support, and a cavity is formed in the inner wall, a liquid inlet pipe and a liquid outlet pipe which are connected with the cavity are fixedly connected below the heat-conducting supporting plate, a fixing seat is mounted on the support, a clamping part for clamping the silicon wafer is arranged on the inner wall of the fixing seat, lifting frames are fixedly connected on both sides of the fixing seat, a frame body is rotatably connected to the inner wall of the lifting frame, a turnover motor is fixedly connected to the surface of the lifting frame, and the output end is fixedly connected with the frame body, a heat-conducting cover plate is arranged on one side of the frame body, the surface of the heat-conducting cover plate is fixedly connected with a protrusion which is inserted into the inner wall of the frame body, a disengagement assembly is arranged on the surface of the frame body to limit the protrusion, a recess is formed in the inner wall of the heat-conducting cover plate, and a magnetic column and a magnetic ring are fixedly connected to the inner walls of the recess and the heat-conducting supporting plate respectively. The inner wall of the body is provided with a circulating assembly connected with the plurality of liquid inlet pipes and liquid outlet pipes.

[0008] Preferably, the lifting frame comprises a hollow sleeve, a sliding frame is slidably connected to the inner wall of the hollow sleeve, a lifting cylinder is fixedly connected to the inner wall of the hollow sleeve, the output end of the lifting cylinder is fixedly connected to the surface of the sliding frame, and support plates are fixedly connected to both sides of the sliding frame. Through the above components, the lifting cylinder is opened, the lifting cylinder can drive the sliding frame to move back and forth in the hollow sleeve, thereby driving the frame body and the heat-conducting cover plate to move, which facilitates the placement of the heat-conducting cover plate on the silicon wafer or the removal of the heat-conducting cover plate from the silicon wafer.

[0009] Preferably, the heat-conducting supporting plate and the heat-conducting cover plate are both made of copper material, and the size ratio of the heat-conducting supporting plate and the heat-conducting cover plate is less than the size of the formed silicon wafer.

[0010] Preferably, the circulating assembly comprises a box body mounted in the inner wall of the body, a pump body is arranged on the upper surface of the box body, a suction pipe is fixedly connected to the input end of the pump body, the other end of the suction pipe is inserted into the box body, a water inlet connecting piece is arranged between the output end of the pump body and the liquid inlet pipe, a backwater connecting piece is arranged between the box body and the liquid outlet pipe, and a stirring part and a temperature control part are further arranged on the box body. Through the above components, the pump body can suck the liquid in the box body through the suction pipe, and then the liquid enters the cavity of the heat-conducting supporting plate through the water inlet connecting piece and the liquid inlet pipe, and then enters the box body through the liquid outlet pipe and the backwater connecting piece, realizing circulation.

[0011] Preferably, the separation assembly comprises two separation cylinders fixed in the inner wall of the frame, the output end of the separation cylinder is fixedly connected with a clamping block, the clamping block is inserted with the inner wall of the protrusion, through the above-mentioned components, when the clamping block is removed from the inner wall of the protrusion by the separation cylinder, the heat-conducting cover plate can be placed on the silicon wafer at this time, when the clamping block is inserted into the inner wall of the protrusion by the separation cylinder, the protrusion and the heat-conducting cover plate can be connected on the frame, which is convenient for resetting operation.

[0012] Preferably, the inner wall of the machine body is provided with a plurality of protection assemblies, the protection assembly comprises a rotary motor fixed in the inner wall of the machine body, the output end of the rotary motor is fixedly connected with a shielding plate, through the above-mentioned components, when the heat-conducting cover plate is reset, the rotary motor can drive the shielding plate to rotate to shield and protect the heat-conducting cover plate. Figure 2

[0013] Preferably, the stirring part comprises a stirring motor fixed on the surface of the box, the output end of the stirring motor is fixedly connected with a stirring rod, through the above-mentioned components, the stirring motor can drive the stirring rod to rotate to mix the liquid on the inner wall of the box, so as to ensure the uniform temperature of the liquid.

[0014] Preferably, the temperature control part comprises a refrigerator installed in the inner wall of the box, the inner wall of the box is provided with a temperature sensor, the surface of the box is provided with a battery module, the battery module is provided with a microcontroller, the battery module is used for power supply of the refrigerator, the temperature sensor and the battery module, through the above-mentioned components, the temperature sensor can monitor the temperature of the circulating water in the box in real time, and transmit the monitored information to the microcontroller, when the temperature of the circulating water is too high, the microcontroller can control the refrigerator to work to cool the circulating water, so as to ensure the overall cooling effect.

[0015] Preferably, the water inlet connector comprises an annular pipe one fixed on the surface of the mounting seat, the other end of the plurality of liquid inlet pipes is communicated with the annular pipe one, the output end of the pump body is fixedly connected with a soft pipe one, one end of the soft pipe one is rotatably connected with a threaded sleeve one, the threaded sleeve one is threadedly connected with the interface of the annular pipe one, the water outlet connector comprises an annular pipe two fixed on the surface of the mounting seat, the surface of the box is fixedly connected with a soft pipe two, one end of the soft pipe two is rotatably connected with a threaded sleeve two, the threaded sleeve two is threadedly connected with the interface of the annular pipe two, through the above-mentioned components, the soft pipe one and the annular pipe one can deliver the liquid pumped by the pump body to the plurality of liquid inlet pipes, the liquid discharged from the plurality of liquid outlet pipes can enter the annular pipe two and be discharged into the box through the soft pipe two.

[0016] ​Preferably, the clamping part comprises a clamping block connected with the inner wall of the fixing seat, the inner side of the clamping block is arc-shaped, the inner wall of the fixing seat is fixedly connected with a clamping cylinder, and the output end of the clamping cylinder is fixedly connected with the surface of the clamping block.

[0017] In summary, the technical effects and advantages of the present application are: 1、In the application, the auxiliary device is provided, the heat-conducting base plate can support the formed silicon wafer, the lifting frame cooperates with the overturning motor, the frame body and the disengagement assembly, the heat-conducting cover plate can be placed above the formed silicon wafer, the heat-conducting cover plate and the heat-conducting base plate are attracted by the magnetic ring and the magnetic column, the formed silicon wafer is further limited, heat conduction is conducted on the silicon wafer from the top and the bottom, the heat-conducting base plate conducts heat in a large area, the heat-conducting cover plate cooperates with the groove to conduct heat in a small area, the heat conduction efficiency is greatly improved, the circulating assembly can quickly take away the heat on the surface of the heat-conducting base plate to cool, the problems of deformation and damage of the silicon wafer caused by local overheating are effectively reduced, the precision and the quality of the silicon wafer processing are ensured, the heat-conducting cover plate can effectively shield smoke and splashes during the cutting process, the smoke and splashes are reduced to fall on the silicon wafer, the pollution and damage to the surface of the silicon wafer are reduced, the cleanliness of the silicon wafer is maintained, the product quality is ensured, and the rate of defective products caused by pollution is reduced.

[0018] 2、In the application, the clamping part is provided, the inner side of the clamping block is arc-shaped, the silicon wafer can be better attached to the surface of the silicon wafer, the clamping cylinder is cooperated, a plurality of clamping blocks work cooperatively, the silicon wafer can be stably clamped, the displacement of the silicon wafer body during processing is effectively reduced, the accuracy and consistency of laser cutting are ensured, and the product pass rate is improved.

[0019] 3、In the application, the protection assembly is provided, the rotating motor drives the shielding plate to rotate, the heat-conducting cover plate can be shielded and protected after being reset, the heat-conducting cover plate is prevented from being polluted by dust and sundries in the external environment when being idle, the service life of the heat-conducting cover plate is prolonged, and the cleanliness and performance of the heat-conducting cover plate are ensured for next use.

[0020] 4、In the application, the temperature sensor, the microcontroller, the refrigerator and the battery module constitute a stable control part, the circulating water temperature can be monitored in real time, the refrigerator can be automatically controlled to work according to the monitoring result, the stability of the circulating water is ensured, the cooling effect is improved, and the stirring part can mix the circulating water in the tank body, and the uniformity is improved. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is a whole structure schematic view of the cooling device for semiconductor processing; Figure 2 It is an internal structure schematic view of the cooling device for semiconductor processing; Figure 3 Structure diagram of an auxiliary device of a cooling device for semiconductor processing according to the present application; Figure 4 Structure diagram of an auxiliary device of a cooling device for semiconductor processing according to the present application; Figure 5 Structure diagram of a heat-conducting support plate of a cooling device for semiconductor processing according to the present application; Figure 6 Structure diagram of an auxiliary device of a cooling device for semiconductor processing according to the present application Figure 7 Structure diagram of an auxiliary device of a cooling device for semiconductor processing according to the present application Figure 6 Structure diagram of an auxiliary device of a cooling device for semiconductor processing according to the present application Figure 8 Structure diagram of a water supply assembly of a cooling device for semiconductor processing according to the present application Figure 9 Structure diagram of a water supply assembly of a cooling device for semiconductor processing according to the present application Figure 10 Structure diagram of a water supply assembly of a cooling device for semiconductor processing according to the present application

[0022] In the figure: 1, machine body; 2, control screen; 3, linear motor one; 4, linear motor two; 5, laser cutter; 6, auxiliary device; 61, mounting seat; 62, protection assembly; 621, rotary motor; 622, shielding plate; 63, support; 64, heat-conducting support plate; 65, heat-conducting cover plate; 66, magnetic ring; 67, magnetic column; 68, groove; 69, cavity; 610, liquid inlet pipe; 611, liquid outlet pipe; 612, lifting frame; 6121, hollow sleeve; 6122, sliding frame; 6123, lifting cylinder; 613, frame body; 614, overturning motor; 615, disengagement assembly; 6151, disengagement cylinder; 6152, clamping block; 616, support plate; 617, protruding block; 618, clamping cylinder; 619, clamping block; 6111, fixed seat; 7, water inlet connecting piece; 71, annular pipe one; 72, hose one; 73, threaded sleeve one; 8, water return connecting piece; 81, annular pipe two; 82, hose two; 83, threaded sleeve two; 9, circulating assembly; 91, box body; 92, pump body; 93, suction pipe; 94, battery module; 95, microcontroller; 96, stirring motor; 97, temperature sensor; 98, refrigerator; 99, stirring rod; B, silicon wafer body; C, shaped silicon wafer. DETAILED DESCRIPTION

[0023] Clearly, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present application.

[0024] Reference Figures 1-10 The cooling device for semiconductor processing shown in the figure comprises a machine body 1 and a control screen 2, two linear motors I 3 are installed on the inner wall of the machine body 1, the output end of the linear motor I 3 is provided with a linear motor II 4, the output end of the linear motor II 4 is provided with a laser cutter 5, and the inner wall of the machine body 1 is provided with an auxiliary device 6.

[0025] The auxiliary device 6 comprises a mounting seat 61 mounted in the inner wall of the machine body 1 through a screw, a plurality of supports 63 are mounted on the upper surface of the mounting seat 61, a heat-conducting supporting plate 64 is mounted on the upper end of the support 63, a cavity 69 is formed in the inner wall, a liquid inlet pipe 610 and a liquid outlet pipe 611 which are in communication with the cavity 69 are fixedly connected below the heat-conducting supporting plate 64, a fixing seat 6111 is mounted on the support 63, a clamping part for clamping a silicon wafer is arranged on the inner wall of the fixing seat 6111, lifting frames 612 are fixedly connected to the two sides of the fixing seat 6111, a frame body 613 is rotatably connected to the inner wall of the lifting frame 612, a turnover motor 614 is fixedly connected to the surface of the lifting frame 612 and has an output end fixedly connected with the frame body 613, a heat-conducting cover plate 65 is arranged on one side of the frame body 613, a protrusion 617 is fixedly connected to the inner wall of the frame body 613, a disengagement assembly 615 is arranged on the surface of the frame body 613 to limit the protrusion 617, a recess 68 is formed in the inner wall of the heat-conducting cover plate 65, a magnetic column 67 and a magnetic ring 66 are fixedly connected to the inner walls of the heat-conducting supporting plate 64 and the heat-conducting cover plate 65 respectively, the heat-conducting supporting plate 64 and the heat-conducting cover plate 65 are made of copper material, the size ratio of the heat-conducting supporting plate 64 and the heat-conducting cover plate 65 is less than that of the formed silicon wafer C, the lifting frame 612 comprises a hollow sleeve 6121, a sliding frame 6122 is slidably connected to the inner wall of the hollow sleeve 6121, a lifting cylinder 6123 is fixedly connected to the inner wall of the hollow sleeve 6121, the output end of the lifting cylinder 6123 is fixedly connected to the surface of the sliding frame 6122, support plates 616 are fixedly connected to the two sides of the sliding frame 6122, the disengagement assembly 615 comprises two disengagement cylinders 6151 fixedly arranged in the inner wall of the frame body 613, a clamping block 6152 is fixedly connected to the output end of the disengagement cylinder 6151, the clamping block 6152 is inserted into the inner wall of the protrusion 617, the clamping part comprises a clamping block 619 slidably connected to the inner wall of the fixing seat 6111, the inner side of the clamping block 619 is arc-shaped, a clamping cylinder 618 is fixedly connected to the inner wall of the fixing seat 6111, and the output end of the clamping cylinder 618 is fixedly connected to the surface of the clamping block 619.

[0026] In the embodiment, the clamping cylinder 618 is opened, the clamping blocks 619 are driven to move, a plurality of clamping blocks 619 can clamp the silicon wafer body B, the stability is improved, the lifting cylinder 6123 is opened, the lifting cylinder 6123 can drive the sliding frame 6122 to move back and forth in the hollow sleeve 6121, so as to drive the frame body 613 and the heat-conducting cover plate 65 to move, so as to facilitate the heat-conducting cover plate 65 to be placed on the silicon wafer or taken away from the silicon wafer, when being placed above the silicon wafer, the clamping block 6152 is driven by the separation cylinder 6151 to move out of the inner wall of the protrusion 617, at this time, the heat-conducting cover plate 65 can be placed on the silicon wafer, at this time, the magnetic column 67 is attracted to the magnetic ring 66 due to the thinness of the silicon wafer, and is further fixed. The heat-conducting cover plate 65 can not only shield smoke and splashes, but also cooperate with the heat-conducting supporting plate 64 to conduct heat. When the clamping block 6152 is inserted into the inner wall of the protrusion 617 driven by the separation cylinder 6151, the protrusion 617 and the heat-conducting cover plate 65 can be connected to the frame body 613, so as to facilitate the reset movement operation.

[0027] The inner wall of the machine body 1 is provided with a circulating assembly 9 connected with a plurality of liquid inlet pipes 610 and liquid outlet pipes 611. The circulating assembly 9 comprises a box body 91 installed in the inner wall of the machine body 1. The upper surface of the box body 91 is provided with a pump body 92. The input end of the pump body 92 is fixedly connected with a suction pipe 93. The other end of the suction pipe 93 is inserted into the box body 91. The output end of the pump body 92 is provided with a water inlet connecting piece 7 between the liquid inlet pipe 610. The box body 91 is provided with a water return connecting piece 8 between the liquid outlet pipe 611. The box body 91 is further provided with a stirring part and a temperature control part. The stirring part comprises a stirring motor 96 fixed on the surface of the box body 91. The output end of the stirring motor 96 is fixedly connected with a stirring rod 99. The temperature control part comprises a refrigerator 98 installed in the inner wall of the box body 91. The inner wall of the box body 91 is installed with a temperature sensor 97. The surface of the box body 91 is installed with a battery module 94. The battery module 94 is installed with a microcontroller 95. The battery module 94 is used for power supply of the refrigerator 98, the temperature sensor 97 and the battery module 94. The water inlet connecting piece 7 comprises an annular pipe one 71 fixed on the surface of the mounting seat 61. The other end of the plurality of liquid inlet pipes 610 is communicated with the annular pipe one 71. The output end of the pump body 92 is fixedly connected with a soft pipe one 72. One end of the soft pipe one 72 is rotatably connected with a threaded sleeve one 73. The threaded sleeve one 73 is threadedly connected with the interface of the annular pipe one 71. The water return connecting piece 8 comprises an annular pipe two 81 fixed on the surface of the mounting seat 61. The surface of the box body 91 is fixedly connected with a soft pipe two 82. One end of the soft pipe two 82 is rotatably connected with a threaded sleeve two 83. The threaded sleeve two 83 is threadedly connected with the interface of the annular pipe two 81.

[0028] In the embodiment, the pump body 92 can suck the liquid in the box 91 through the suction pipe 93, the hose 1 and the annular pipe 1 can deliver the liquid sucked by the pump body 92 to the plurality of liquid inlet pipes 610, into the cavity 69 of the heat-conducting base plate 64, and then the liquid discharged by the plurality of liquid outlet pipes 611 can enter the annular pipe 2 81 and be discharged into the box 91 through the hose 2 82 to realize circulation; the temperature sensor 97 can monitor the temperature of the circulating water in the box 91 in real time and transmit the monitored information to the microcontroller 95; when the temperature of the circulating water is too high, the microcontroller 95 can control the refrigerator 98 to work to cool the circulating water and ensure the overall cooling effect; the stirring motor 96 can drive the stirring rod 99 to rotate to mix the liquid on the inner wall of the box 91 to ensure uniform temperature of the liquid.

[0029] In the embodiment, the inner wall of the machine body 1 is provided with a plurality of protection assemblies 62, and each protection assembly 62 comprises a rotating motor 621 fixed in the inner wall of the machine body 1, and a shielding plate 622 fixedly connected to the output end of the rotating motor 621.

[0030] In the embodiment, when the heat-conducting cover plate 65 is reset, as shown in the figure, the rotating motor 621 can drive the shielding plate 622 to rotate to shield and protect the heat-conducting cover plate 65. Figure 2

[0031] The working principle of the present application is as follows: during the processing, first, the silicon wafer body B is placed on the heat-conducting base plate 64, then the clamping cylinder 618 drives the clamping block 619 to move, the arc surfaces on the inner sides of the plurality of clamping blocks 619 can clamp and position the silicon wafer body B, and meanwhile, the plurality of heat-conducting base plates 64 are located below the formed silicon wafer C; at this time, the lifting frame 612 is opened, the lifting cylinder 6123 can drive the sliding frame 6122 to move back and forth in the hollow sleeve 6121, thereby driving the frame body 613 and the heat-conducting cover plate 65 to move, after moving to a certain height, the overturning motor 614 drives the frame body 613 and the heat-conducting cover plate 65 to rotate, so that the heat-conducting cover plate 65 is located directly above the silicon wafer body B; then the lifting frame 612 drives the heat-conducting cover plate 65 to place the silicon wafer body B, because the silicon wafer is thin, the magnetic column 67 is attracted to the magnetic ring 66, at this time, the disengaging assembly 615 works, the disengaging cylinder 6151 drives the clamping block 6152 to move out of the inner wall of the protruding block 617, then the lifting frame 612 cooperates with the overturning motor 614 to drive the frame body 613 to reset, at this time, the heat-conducting base plate 64 and the heat-conducting cover plate 65 are in contact with the cut formed silicon wafer C, and meanwhile, the pump body 92 is opened; the pump body 92 can suck the liquid in the box 91 through the suction pipe 93, the hose 1 and the annular pipe 1 can deliver the liquid sucked by the pump body 92 to the plurality of liquid inlet pipes 610, into the cavity 69 of the heat-conducting base plate 64, and then the liquid discharged by the plurality of liquid outlet pipes 611 can enter the annular pipe 2 81 and be discharged into the box 91 through the hose 2 82 to realize circulation. ​When laser cutting is performed, the linear motor 3 and the linear motor 4 drive the laser cutter 5 to move, so as to cut the silicon wafer body B. The prior art will not be explained here, such as Figure 10 During the cutting process, the cutting area of the shaped silicon wafer C generates heat. At this time, the heat-conducting base plate 64 and the heat-conducting cover plate 65 can conduct heat out. The heat-conducting cover plate 65 can reduce smoke and splashes from splashing onto the shaped silicon wafer C during the cutting process. At the same time, the circulating water moves in the heat-conducting base plate 64, which can cool the heat-conducting base plate 64, thereby improving the cooling effect of the cutting area of the shaped silicon wafer C. The temperature sensor 97 can monitor the temperature of the circulating water in the box 91 in real time and transmit the monitored information to the microcontroller 95. When the circulating water temperature is too high, the microcontroller 95 can control the refrigerator 98 to work to cool the circulating water, so as to ensure the overall cooling effect. The stirring motor 96 can drive the stirring rod 99 to rotate to mix the liquid on the inner wall of the box 91, so as to ensure the uniformity of the liquid temperature, When the cutting is completed and cooled, the lifting frame 612 cooperates with the overturning motor 614 to drive the frame body 613 to move to the upper side of the heat-conducting cover plate 65. The lifting frame 612 drives the frame body 613 to move to the side close to the heat-conducting cover plate 65. The protrusion 617 is inserted in the inner wall of the frame body 613. The clamping block 6152 driven by the air cylinder 6151 is inserted in the inner wall of the protrusion 617. At this time, the lifting frame 612 drives the frame body 613 and the heat-conducting cover plate 65 to move upward and reset, as shown in the state of Figures 2-3 Subsequently, the rotating motor 621 is opened. The rotating motor 621 can drive the shielding plate 622 to rotate, so as to shield and protect the heat-conducting cover plate 65.

[0032] The electrical components appearing in this document are all connected with the main controller and 220V mains from the outside, and the main controller can be a conventional known device such as a computer for control.

[0033] Finally, it should be noted that: the above only describes the preferred embodiments of the present application and is not intended to limit the present application. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent replacements to some technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A cooling device for semiconductor processing, comprising a body (1) and a control panel (2), wherein two linear motors (3) are mounted on the inner wall of the body (1), and a second linear motor (4) is provided at its output end; and a laser cutter (5) is provided at the output end of the second linear motor (4), characterized in that: The inner wall of the machine body (1) is provided with an auxiliary device (6); The auxiliary device (6) comprises a mounting seat (61) mounted in the inner wall of the machine body (1) by screws, a plurality of supports (63) are mounted on the upper surface of the mounting seat (61), a heat-conducting supporting plate (64) is mounted on the upper end of the support (63), and a cavity (69) is formed in the inner wall, a liquid inlet pipe (610) and a liquid outlet pipe (611) are fixedly connected to the lower side of the heat-conducting supporting plate (64) and communicate with the cavity (69), a fixing seat (6111) is mounted on the support (63), the inner wall of the fixing seat (6111) is provided with a clamping portion, and lifting frames (612) are fixedly connected to the two sides of the fixing seat (6111), a frame body (613) is rotatably connected to the inner wall of the lifting frame (612), a turnover motor (614) is fixedly connected to the surface of the lifting frame (612) and has an output end fixedly connected to the frame body (613), a heat-conducting cover plate (65) is arranged on one side of the frame body (613), the surface of the heat-conducting cover plate (65) is fixedly connected with a protrusion (617) inserted into the inner wall of the frame body (613), the surface of the frame body (613) is provided with a disengagement assembly (615), the inner wall of the heat-conducting cover plate (65) is provided with a groove (68), and the inner walls of the groove (68) and the heat-conducting supporting plate (64) are fixedly connected with a magnetic column (67) and a magnetic ring (66), respectively. The inner wall of the machine body (1) is provided with a circulating assembly (9) connected with a plurality of liquid inlet pipes (610) and liquid outlet pipes (611).

2. The cooling device for semiconductor processing according to claim 1, characterized by: The lifting frame (612) comprises a hollow sleeve (6121), a sliding frame (6122) is slidably connected to the inner wall of the hollow sleeve (6121), and a lifting cylinder (6123) is fixedly connected to the inner wall of the hollow sleeve (6121), the output end of the lifting cylinder (6123) is fixedly connected to the surface of the sliding frame (6122), and support plates (616) are fixedly connected to the two sides of the sliding frame (6122).

3. The cooling device for semiconductor processing according to claim 1, wherein: The heat-conducting supporting plate (64) and the heat-conducting cover plate (65) are both made of copper material, and the size ratio of the heat-conducting supporting plate (64) and the heat-conducting cover plate (65) is less than the size of the formed silicon wafer (C).

4. The cooling device for semiconductor processing according to claim 1, characterized by: The circulating assembly (9) comprises a box body (91) mounted in the inner wall of the machine body (1), a pump body (92) is arranged on the upper surface of the box body (91), a suction pipe (93) is fixedly connected to the input end of the pump body (92), the other end of the suction pipe (93) is inserted into the box body (91), a water inlet connecting piece (7) is arranged between the output end of the pump body (92) and the liquid inlet pipe (610), a water return connecting piece (8) is arranged between the box body (91) and the liquid outlet pipe (611), and a stirring portion and a temperature control portion are further arranged on the box body (91).

5. The cooling device for semiconductor processing according to claim 1, characterized by: The disengagement assembly (615) comprises two disengagement cylinders (6151) fixed in the inner wall of the frame body (613), a clamping block (6152) is fixedly connected to the output end of the disengagement cylinder (6151), and the clamping block (6152) is inserted into the inner wall of the protrusion (617).

6. The cooling device for semiconductor processing according to claim 1, wherein: The inner wall of the machine body (1) is provided with a plurality of groups of protection components (62), the protection components (62) comprising a rotating motor (621) fixed in the inner wall of the machine body (1), and the output end of the rotating motor (621) is fixedly connected with a shielding plate (622).

7. The cooling device for semiconductor processing according to claim 4, wherein: The stirring part comprises a stirring motor (96) fixed on the surface of the box body (91), and the output end of the stirring motor (96) is fixedly connected with a stirring rod (99).

8. The cooling device for semiconductor processing according to claim 4, characterized by: The temperature control part comprises a refrigerator (98) installed in the inner wall of the box body (91), a temperature sensor (97) is installed on the inner wall of the box body (91), a battery module (94) is installed on the surface of the box body (91), a microcontroller (95) is installed on the battery module (94), and the battery module (94) is used to supply power to the refrigerator (98), the temperature sensor (97) and the battery module (94).

9. The cooling device for semiconductor processing according to claim 4, wherein: The water inlet connector (7) comprises an annular pipe one (71) fixed on the surface of the mounting seat (61), the other ends of a plurality of liquid inlet pipes (610) are connected with the annular pipe one (71), the output end of the pump body (92) is fixedly connected with a soft pipe one (72), one end of the soft pipe one (72) is rotatably connected with a threaded sleeve one (73), the threaded sleeve one (73) is threadedly connected with the interface of the annular pipe one (71), and the water return connector (8) comprises an annular pipe two (81) fixed on the surface of the mounting seat (61), the surface of the box body (91) is fixedly connected with a soft pipe two (82), one end of the soft pipe two (82) is rotatably connected with a threaded sleeve two (83), and the threaded sleeve two (83) is threadedly connected with the interface of the annular pipe two (81).

10. The cooling device for semiconductor processing according to claim 1, characterized by: The clamping part comprises a clamping block (619) slidably connected with the inner wall of the fixing seat (6111), the inner side of the clamping block (619) is arc-shaped, the inner wall of the fixing seat (6111) is fixedly connected with a clamping cylinder (618), and the output end of the clamping cylinder (618) is fixedly connected with the surface of the clamping block (619).

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