Stacked packaging structure and process method thereof
By introducing heat sinks and heat conduction channels for packaged components into the stacked packaging structure, heat transfer is achieved using heat spreaders, heat-concentrating plates, graphene, and ventilation ducts, combined with active heat dissipation using air ducts and heat sink fins. This solves the problem of heat concentration in the stacked packaging structure and improves heat dissipation performance and compressive strength.
Patent Information
- Application Number
- CN202511086064.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-05
- Publication Date
- 2025-11-07
AI Technical Summary
Heat concentration in stacked packaging structures leads to heat dissipation problems, which has become a key factor in improving the performance of packaging structures.
The heat conduction channel, composed of a heat sink and packaging components, achieves efficient heat transfer through a heat spreader, heat concentrator, graphene, and ventilation duct structure, and actively dissipates heat using air ducts and heat sink fins, forming a multi-layer chip temperature balance.
It significantly improves the heat dissipation performance of the packaging structure, reduces the chip operating temperature, improves the chip's reliability and lifespan, and enhances the compressive strength of the packaging structure.
Smart Images
Figure CN120914178A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of stacked packaging, in particular to a stacked packaging structure and a process method thereof. BACKGROUND
[0002] With the development of electronic devices towards miniaturization and high performance, higher requirements are put forward for semiconductor packaging technology. As a technical solution that can effectively improve the integration and reduce the volume of the package, the stacked packaging structure has been widely used. However, due to the heat concentration after the chip stacking, the heat dissipation problem becomes a key factor restricting the performance improvement of the packaging structure. SUMMARY
[0003] The present application aims to provide a stacked packaging structure and a process method thereof to solve the problems in the background art.
[0004] To achieve the above-mentioned purpose, the present application provides the following technical scheme: a stacked packaging structure, comprising a first chip, the top of the first chip is provided with a die film, and the first chip is connected with a second chip through the die film, the top of the second chip is also connected with a third chip through the die film, the bottom of the second chip is connected with a heat dissipation box through the die film, and the top of the heat dissipation box is fixedly installed with a heat spreading plate, the bottom of the heat spreading plate is fixedly provided with a heat gathering plate, and the heat gathering plate is built-in in the inner cavity of the heat dissipation box, the side surface of the heat dissipation box is provided with a heat conduction port, the inner cavity of the heat dissipation box is filled with graphene, and the graphene covers the heat gathering plate, the side surface of the heat dissipation box is provided with a ventilation pipe, and the ventilation pipe is provided with a plurality of groups, the side surface of the ventilation pipe in the heat dissipation box is in contact with the graphene, and the pipe opening side surface of the ventilation pipe is provided with a packaging assembly.
[0005] Preferably, the top of the heat dissipation box is fixedly installed with a support rod, the top of the third chip is provided with a heat dissipation fin, and the heat dissipation fin is connected with the packaging assembly.
[0006] Preferably, the bottom of the first chip is fixedly connected with a substrate, the top of the substrate is fixedly provided with a connecting piece, and the bottom of the substrate is fixedly provided with a bump.
[0007] Preferably, the top of the second chip and the third chip is fixedly connected with a bonding lead, and the second chip and the third chip are fixedly connected with the connecting piece through the bonding lead.
[0008] Preferably, the packaging assembly comprises a packaging shell, the packaging shell is fixedly installed on the top of the substrate, the top of the packaging shell is fixedly installed with a top plate, the top of the top plate is provided with a clamping groove, and the clamping groove is connected with the heat dissipation fin.
[0009] Preferably, a hollow insert is fixedly installed on the inner side of the encapsulation shell, the hollow insert is plugged into the heat conduction port, and a heat conduction component is fixedly provided on the side of the encapsulation shell.
[0010] Preferably, the heat-conducting component includes a flow guide channel, and two sets of flow guide channels are provided, symmetrically installed on the front and back of the encapsulation shell. A heat collection channel is fixedly installed on the side of the flow guide channel. The flow guide channel has a cavity design and is connected to the hollow insert block.
[0011] Preferably, an air outlet is provided on the side of the heat collection groove on the back of the encapsulation shell, and an air inlet is provided on the side of the heat collection groove on the front of the encapsulation shell.
[0012] Preferably, a blower pipe is fixedly installed on the side of the air inlet, the blower pipe is fixedly connected to the heat dissipation fins, and the blower pipe adopts a "U"-shaped design.
[0013] The process method for the aforementioned stacked packaging structure includes the following steps: S1. Remove the substrate; S2. Stacking chips: A first chip is connected to the top of the substrate through a die-casting film. Then, a first heat sink is fixedly installed on the top of the substrate. The top of the first heat sink and the first chip are connected to the second chip through a die-casting film. A second heat sink is installed again. A third chip is installed on top of the second heat sink and the second chip. S3. Chip bonding: The bonding wires are connected to the pads on the chip surface. The other end of the bonding wires is pulled to the corresponding connecting piece on the substrate to form a bridging circuit. S4. The side plate of the package shell is installed using injection molding. The side plate of the package shell is formed by injection molding on the top of the substrate to enclose the stacked chip structure. A hollow insert is fixedly provided on the inner side of the package shell. The hollow insert is fixedly inserted into the heat conduction port provided on the side of the heat sink box. A heat conduction component is formed by injection molding on the side of the side plate of the package shell. S5. Packaging: Heat sink fins are placed on top of the third chip in the stacked chips. Then, injection molding is used again to form a top plate on the top of the package shell side plate. The top plate has a pre-reserved snap-fit groove, which is fixedly connected to the heat sink fins. The entire package shell is heated and softened a second time to solidify the connection between the top plate and the package shell, thereby improving the connection strength and stability. S6. Heat dissipation connection: Connect the air blower pipe on the side of the heat dissipation fins to the air inlet, and connect the other end of the air blower pipe to the external blower.
[0014] Compared with the prior art, the beneficial effects of the present application are that the heat conduction channel composed of the heat dissipation box and the packaging assembly transmits the heat of the stacked chips to each other, balances the temperature of each chip in the packaging shell, and the heat generated by the chips is efficiently transmitted in the heat equalizing plate, the heat collecting plate, the graphene and the ventilation pipe structure, air is circulated in the ventilation pipe, which can quickly dissipate the heat generated by the chips in the packaging shell, significantly improves the heat dissipation performance of the packaging structure, reduces the working temperature of the chips, is beneficial to improve the reliability and service life of the chips, and the heat dissipation box structure is added by the supporting rod, which not only can exchange heat with the chips, but also can support and clamp the chips, improve the compressive strength of the packaging structure, and avoid damage of the chips due to excessive stress. BRIEF DESCRIPTION OF DRAWINGS Figure 1 It is a schematic diagram of the structure of the present application as a whole. Figure 2 It is a schematic diagram of the structure of the present application as a whole. Figure 3 It is a schematic diagram of the structure of the present application as a whole. Figure 4 It is a schematic diagram of the cross section of the packaging structure of the present application. Figure 5 It is a schematic diagram of the structure of the heat dissipation box of the present application as a whole. Figure 6 It is a schematic diagram of the cross section of the heat dissipation box of the present application.
[0015] In the figure: 1, first chip; 2, chip mounting film; 3, second chip; 4, third chip; 5, heat dissipation box; 6, heat equalizing plate; 7, heat collecting plate; 8, heat conduction port; 9, graphene; 10, ventilation pipe; 11, supporting rod; 12, heat dissipation fin; 13, base plate; 14, connecting piece; 15, bump; 16, bonding lead; 17, packaging shell; 18, top plate; 19, clamping groove; 20, hollow plug; 21, flow guide groove; 22, heat collecting groove; 23, air outlet; 24, air inlet; 25, air blowing pipe. DETAILED DESCRIPTION
[0016] In order to make the purpose, technical scheme of the present application clear, complete and the advantages more clear and obvious, the embodiments of the present application are further described in detail below with reference to the drawings. It should be understood that the specific embodiments described herein are part of the embodiments of the present application, not all embodiments, and are used to explain the embodiments of the present application, and do not limit the embodiments of the present application. All other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.
[0017] Embodiment one: please refer to Figures 1-6The application provides a technical scheme: a stacked packaging structure and a process method thereof, which comprise a first chip 1, the top of the first chip 1 is provided with a die attach film 2, and the first chip 1 is connected with a second chip 3 through the die attach film 2, the top of the second chip 3 is also connected with a third chip 4 through the die attach film 2, the bottom of the second chip 3 is connected with a heat dissipation box 5 through the die attach film 2, and the top of the heat dissipation box 5 is fixedly provided with a heat spreader 6, the bottom of the heat spreader 6 is fixedly provided with a heat gathering plate 7, the heat gathering plate 7 is arranged in the inner cavity of the heat dissipation box 5, the side surface of the heat dissipation box 5 is provided with a heat conduction opening 8, the inner cavity of the heat dissipation box 5 is filled with graphene 9, and the graphene 9 covers the heat gathering plate 7; the heat spreader 6 can uniformly transfer heat to the surface of the chip, so that the local high temperature of the chip is avoided and the chip is not damaged, the bottom of the heat gathering plate 7 is provided with a wave structure design, the heat transfer efficiency between the heat gathering plate 7 and the graphene 9 is improved, and therefore the heat dissipation efficiency of the packaging structure is improved.
[0018] The ventilation pipe 10 is arranged at the heat conduction opening 8 of the side surface of the heat dissipation box 5, and a plurality of groups of ventilation pipes 10 are arranged, the side surface of the ventilation pipe 10 arranged in the heat dissipation box 5 is in contact with the graphene 9, the pipe opening side surface of the ventilation pipe 10 is provided with a packaging assembly, the ventilation pipe and the packaging assembly form a heat conduction channel, air can be actively ventilated in the ventilation pipe 10, the air circulation in the ventilation pipe 10 is accelerated, the heat exchange between the ventilation pipe 10 and the graphene 9 is accelerated, and therefore the heat dissipation efficiency of the packaging structure is further improved.
[0019] The top of the heat dissipation box 5 is fixedly provided with a supporting rod 11, the top of the third chip 4 is provided with a heat dissipation fin 12, and the heat dissipation fin 12 is connected with the packaging assembly in a clamping mode; the heat dissipation fin structure can contact the top layer chip of the stacked chip and has a heat dissipation effect; the packaging assembly comprises a packaging shell 17, the packaging shell 17 is fixedly arranged on the top of a substrate 13, a top plate 18 is fixedly arranged on the top of the packaging shell 17, a clamping groove 19 is arranged on the top of the top plate 18, and the clamping groove 19 is connected with the heat dissipation fin 12 in a clamping mode.
[0020] The bottom of the first chip 1 is fixedly connected with the substrate 13, the top of the substrate 13 is fixedly provided with a connecting piece 14, the bottom of the substrate 13 is fixedly provided with a bump 15, the top of the second chip 3 and the third chip 4 is fixedly connected with a bonding wire 16, and the second chip 3 and the third chip 4 are fixedly connected with the connecting piece 14 through the bonding wire 16.
[0021] The inner side surface of the packaging shell 17 is fixedly provided with a hollow plug 20, the hollow plug 20 is in plug-in connection with the heat conduction opening 8, and the side surface of the packaging shell 17 is fixedly provided with a heat conduction assembly.
[0022] The heat conduction assembly comprises the flow guide groove 21, the flow guide groove 21 is provided with two groups, is symmetrically installed on the front face and the back face of the packaging shell 17, the side surface of the flow guide groove 21 is fixedly installed with the heat collection groove 22, the flow guide groove 21 is designed as a cavity, the flow guide groove 21 is communicated with the hollow plug 20, the hollow plug 20 is communicated with the flow guide groove 21 and the heat conduction port 8 respectively, so that the heat conduction channel structure can be formed, the heat of the stacked chips is mutually transmitted, the temperature of each chip in the packaging shell 17 is balanced, the side surface of the heat collection groove 22 on the back face of the packaging shell 17 is provided with the air outlet 23, the side surface of the heat collection groove 22 on the front face of the packaging shell 17 is provided with the air inlet 24, the side surface of the air inlet 24 is fixedly installed with the blowing pipe 25, the blowing pipe 25 is fixedly connected with the heat dissipation fin 12, and the blowing pipe 25 adopts the "j" type design; the heat dissipation fin 12 is combined with the blowing pipe 25, when the air is actively introduced into the blowing pipe 25, the flowing air can exchange heat with the heat dissipation fin 12 and the ventilation pipe 10 at the same time, so that each group of chips can be cooled at the same time.
[0023] The process method of the device is characterized in that: First, the substrate 13 is taken out, the first chip 1 is connected on the top of the substrate 13 through the die attach film 2, then the first layer of the heat dissipation box 5 is fixedly installed on the top of the substrate 13, and the top of the first layer of the heat dissipation box 5 and the first chip 1 are connected with the second chip 3 through the die attach film 2, then the second layer of the heat dissipation box 5 is installed, the third chip 4 is installed on the top of the second layer of the heat dissipation box 5, the bonding wire 16 is connected to the pad on the surface of the chip, the other end of the bonding wire 16 is pulled to the corresponding connecting piece 14 of the substrate 13 to form a bridge circuit, the side plate of the packaging shell 17 is installed, the side plate of the packaging shell 17 is formed on the top of the substrate 13 by using the injection molding process, the stacked chip structure is contained, and the hollow plug 20 is fixedly arranged on the inner side of the packaging shell 17, the hollow plug 20 is fixedly plugged with the heat conduction port 8 arranged on the side of the heat dissipation box 5, the heat conduction assembly is formed on the side of the side plate of the packaging shell 17, the heat dissipation fin 12 is placed on the top of the third chip 4 in the stacked chip, then the top plate 18 is formed on the top of the side plate of the packaging shell 17 by using the injection molding process again, and the clamping groove 19 is reserved on the top plate 18 and is fixedly connected with the heat dissipation fin 12, the entire packaging shell 17 is heated and softened again, the top plate 18 is solidly connected with the packaging shell 17, the connection strength and stability are improved, the blowing pipe 25 arranged on the side of the heat dissipation fin 12 is connected with the air inlet 24, the other end of the blowing pipe 25 is connected with an external air blowing device, when air is actively introduced into the blowing pipe 25, the flowing air flows in the blowing pipe 25, the blowing pipe 25 designed in the shape of "j" can efficiently exchange heat with the heat dissipation fin 12, the heat dissipation efficiency of the heat dissipation fin 12 on the third chip 4 is improved, and the flowing air flows into the heat collecting groove 22 through the air inlet 24, then flows to the flow guide groove 21 and reaches the ventilation pipe 10, the ventilation pipe 10 exchanges heat with the graphene 9, the flowing air carries away the heat of the ventilation pipe 10, and hot air is discharged from the air outlet 23, thereby completing the active heat dissipation of the stacked chip.
[0024] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.
Claims
1. A stacked package structure, characterized by: It includes a first chip (1), a mounting film (2) is provided on the top of the first chip (1), and the first chip (1) is connected to a second chip (3) through the mounting film (2). The top of the second chip (3) is also connected to a third chip (4) by the mounting film (2). The bottom of the second chip (3) is connected to a heat dissipation box (5) through the mounting film (2), and a heat spreader (6) is fixedly installed on the top of the heat dissipation box (5). A heat collecting plate (7) is fixedly arranged at the bottom of the heat spreader (6), and the heat collecting plate (7) is built in the inner cavity of the heat dissipation box (5). A heat conduction port (8) is formed on the side of the heat dissipation box (5). Graphene (9) is filled in the inner cavity of the heat dissipation box (5), and the graphene (9) covers the heat collecting plate (7). A ventilation pipe (10) is penetrated through the heat conduction port (8) on the side of the heat dissipation box (5), and multiple groups of ventilation pipes (10) are provided. The side of the ventilation pipe (10) in the heat dissipation box (5) is in contact with the graphene (9). A packaging component is installed on the side of the pipe orifice of the ventilation pipe (10).
2. The stacked package structure of claim 1, wherein: A support rod (11) is fixedly installed on the top of the heat dissipation box (5). A heat dissipation fin (12) is installed on the top of the third chip (4), and the heat dissipation fin (12) is snap-fitted with the packaging component.
3. The stacked package structure of claim 2, wherein: The bottom of the first chip (1) is fixedly connected to a substrate (13). A connecting piece (14) is fixedly arranged on the top of the substrate (13), and bumps (15) are fixedly arranged on the bottom of the substrate (13).
4. The stacked package structure of claim 3, wherein: Bonding leads (16) are fixedly connected to the tops of the second chip (3) and the third chip (4), and the second chip (3) and the third chip (4) are fixedly connected to the connecting piece (14) through the bonding leads (16).
5. The stacked package structure of claim 4, wherein: The packaging component includes a packaging shell (17). The packaging shell (17) is fixedly installed on the top of the substrate (13). A top plate (18) is fixedly installed on the top of the packaging shell (17). A clamping groove (19) is formed on the top of the top plate (18), and the clamping groove (19) is snap-connected to the heat dissipation fin (12).
6. The stacked package structure of claim 5, wherein: A hollow insertion block (20) is fixedly installed on the inner side surface of the packaging shell (17). The hollow insertion block (20) is inserted and matched with the heat conduction port (8), and a heat conduction component is fixedly arranged on the side of the packaging shell (17).
7. The stacked package structure of claim 6, wherein: The heat conduction component includes diversion grooves (21). Two groups of diversion grooves (21) are provided and symmetrically installed on the front and back of the packaging shell (17). A heat collecting groove (22) is fixedly installed on the side of the diversion groove (21). The diversion groove (21) is designed as a cavity, and the diversion groove (21) is communicated with the hollow insertion block (20).
8. The stacked package structure of claim 7, wherein: An air outlet (23) is formed on the side of the heat collecting groove (22) on the back of the packaging shell (17), and an air inlet (24) is formed on the side of the heat collecting groove (22) on the front of the packaging shell (17).
9. The stacked package structure of claim 8, wherein: A blowing pipe (25) is fixedly installed on the side of the air inlet (24). The blowing pipe (25) is fixedly connected to the heat dissipation fin (12), and the blowing pipe (25) is designed in a "U" shape.
10. The process method of claim 9, wherein: It includes the following steps: S1. Take out the substrate (13); S2, stack chip, connect the first chip (1) through the die film (2) on the top of the substrate (13), then fix the first layer of heat dissipation box (5) on the top of the substrate (13), and the first layer of heat dissipation box (5) and the top of the first chip (1) are connected with the second chip (3) through the die film (2), and then install the second layer of heat dissipation box (5), the second layer of heat dissipation box (5) and the top of the second chip (3) are installed with the third chip (4); S3, chip bonding, connect the bonding lead (16) to the pad on the surface of the chip, and the other end of the bonding lead (16) is pulled to the corresponding connecting sheet (14) of the substrate (13) to form a bridge circuit; S4, package shell (17) side plate installation, using injection molding process, injection molding the side plate of the package shell (17) on the top of the substrate (13), containing the stacked chip structure, and the inside of the package shell (17) is fixedly provided with a hollow plug (20), the hollow plug (20) is fixedly inserted with the heat conduction port (8) provided on the side of the heat dissipation box (5), and the heat conduction assembly is formed on the side of the side plate of the package shell (17); S5, packaging, placing the heat dissipation fin (12) on the top of the third chip (4) in the stacked chip, and then using the injection molding process again to form the top plate (18) on the top of the side plate of the package shell (17), and the top plate (18) is provided with a clamping groove (19), the clamping groove (19) is fixedly connected with the heat dissipation fin (12), the whole package shell (17) is heated and softened again, the top plate (18) is connected with the package shell (17), the connection strength and stability are improved; S6, heat dissipation connection, the blowing pipe (25) provided on the side of the heat dissipation fin (12) is connected with the air inlet (24), and the other end of the blowing pipe (25) is connected with the external air blowing device.