Turnover device of high-precision semiconductor packaging die bonding equipment

Abstract

The invention belongs to the technical field of turnover equipment, and particularly relates to a turnover device of high-precision semiconductor packaging die bonding equipment, which comprises a bracket, a transverse moving mechanism is arranged at the top of the bracket, the transverse moving mechanism is used for the transverse movement of a material taking assembly, a turnover mechanism is arranged on the bracket, and the turnover mechanism comprises a mounting plate. The mounting plate is fixedly mounted on the outer wall of the support, a first motor is fixedly connected to the outer wall of the mounting plate, and a rotating shaft is fixedly connected to an output shaft of the first motor; and the placing frame is fixed with the rotating shaft. According to the turnover device of the high-precision semiconductor packaging die bonding equipment, through cooperative use of the transverse moving mechanism, the material taking assembly and the turnover mechanism, semiconductor packaging die bonding can be sucked, placed and turned over, when a placing frame is turned over, a rotating sleeve guides a connecting rod through an inclined ring groove to drive a baffle to conduct alternate blocking, the die bonding is prevented from falling off in the turnover process, and the turnover efficiency of the semiconductor packaging die bonding equipment is improved. And the overturning effect of the semiconductor packaging bonding chip is improved.

Description

Technical Field

[0001] This invention relates to the field of flipping device technology, specifically a flipping device for a high-precision semiconductor packaging die bonding equipment. Background Technology

[0002] In semiconductor packaging processes, the die bonding process is a crucial step in accurately attaching the die to the lead frame or substrate. The flipping device, as the core component of the die bonding equipment, is responsible for flipping the die from the pick-up position to the bonding position.

[0003] Currently, traditional semiconductor packaging die-flipping devices typically rely on robotic arms to grip and flip the die. However, the gripping force of the robotic arm is difficult to control precisely. Excessive force can cause the die edge to break or damage the internal circuitry, while insufficient force can cause the die to slip off. Furthermore, the contact area between the robotic arm and the die is fixed, which can easily lead to gripping misalignment for micro-die-flipping devices. Therefore, a high-precision semiconductor packaging die-flipping device flipping mechanism is proposed. Summary of the Invention

[0004] The main objective of this invention is to provide a flipping device for a high-precision semiconductor packaging die bonding equipment, which can solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention proposes a flipping device for a high-precision semiconductor packaging die bonding equipment, comprising a support, a lateral movement mechanism at the top of the support for lateral movement of the material handling assembly, and a flipping mechanism on the support, the flipping mechanism comprising: Mounting plate, the mounting plate is fixedly mounted on the outer wall of the bracket, a motor is fixedly connected to the outer wall of the mounting plate, and a rotating shaft is fixedly connected to the output shaft of the motor. A placement frame is fixed to a rotating shaft, and a rotating sleeve is rotatably connected to the outer wall of the mounting plate. An oblique annular groove is provided on the outer wall of the rotating sleeve. The connecting rod is slidably connected in the inclined ring groove. A baffle is rotatably connected to the end of the connecting rod away from the rotating sleeve. The connecting rod passes through the limiting plate and is slidably connected to the limiting plate. An auxiliary centering component is provided on the placement frame. The output shaft of motor one drives the rotating shaft to rotate, which can drive the placement frame to flip, so that the connecting rod slides stably in the inclined ring groove, thereby driving the baffle to reciprocate. During the flipping process of the placement frame, the two sets of baffles can alternately block.

[0006] Preferably, the rotating shaft passes through the rotating sleeve and is rotatably connected to the rotating sleeve, and the rotating shaft passes through the limiting plate and is fixedly connected to the limiting plate.

[0007] Preferably, there are two sets of connecting rods and baffles, and the two sets of baffles are located on the upper and lower sides of the placement frame, respectively. A ball bearing is embedded in the end of the connecting rod away from the baffle, and the ball bearing abuts against the inclined ring groove.

[0008] Preferably, the auxiliary centering component includes a fixing block, which is fixedly connected to the placement frame. The fixing block is penetrated by a T-rod and slidably connected to the T-rod. The T-rod and the fixing block are elastically connected by a return spring. A push plate is fixedly connected to one end of the T-rod near the fixing block, and a trapezoidal block is fixedly connected to the other end of the T-rod away from the push plate.

[0009] Preferably, the placement frame is hollow, an elastic airbag is fixedly connected to the inner surface of the placement frame, a positioning component is slidably connected to the inner surface of the placement frame, an air cylinder is fixedly installed on the outer surface of the placement frame, the air cylinder is connected to a conduit, and the end of the conduit away from the air cylinder is connected to the elastic airbag.

[0010] Preferably, an electric piston rod is provided in the air cylinder. When the electric piston rod moves, the gas in the air cylinder can be added to the elastic air bladder through a conduit, causing the elastic air bladder to expand and push the positioning member to move and position the semiconductor package die.

[0011] Preferably, the transverse movement mechanism includes a U-shaped plate, which is welded and fixed to the bracket. A lead screw is rotatably connected to the inner surface of the U-shaped plate, and a second motor is fixedly connected to the outer wall of the U-shaped plate. The output shaft of the second motor is fixed to the lead screw. A guide rod is fixedly connected to the inner surface of the U-shaped plate, and a sliding seat is threaded to the lead screw. The guide rod passes through the sliding seat and is slidably connected to it. The output shaft of the second motor drives the lead screw to rotate, and under the limiting action of the guide rod, the sliding seat can be moved, thereby adjusting the position of the material picking component.

[0012] Preferably, the material handling assembly includes a connecting plate, a cylinder is fixedly installed on the upper side of the connecting plate, a horizontal plate is fixedly connected to the output end of the cylinder, a second horizontal plate is provided on the lower side of the first horizontal plate, and a vacuum suction head is fixedly installed on the lower side of the second horizontal plate. The output end of the cylinder drives the first horizontal plate to descend, thereby driving the vacuum suction head to descend, so that the vacuum suction head can pick up the semiconductor package die and place it in the placement frame. At the same time, after the semiconductor package die is flipped, during the process of the vacuum suction head abutting against the semiconductor package die and transferring it tightly, the baffle can limit the semiconductor package die.

[0013] Preferably, the connecting plate and the sliding seat are fixedly connected by bolts, and a limiting rod is fixedly connected to the upper side of the first horizontal plate. The limiting rod passes through the connecting plate and is slidably connected to the connecting plate. The first horizontal plate and the second horizontal plate are elastically connected by an elastic telescopic rod. By using the elastic telescopic rod, damage to the semiconductor package die is prevented during the process of the vacuum suction head abutting against the semiconductor package die.

[0014] Preferably, the pushing assembly includes a horizontal plate three, on which an electric telescopic rod is fixedly installed. The telescopic end of the electric telescopic rod is fixedly connected to a U-shaped frame, and a rotating wheel is rotatably connected to the inner surface of the U-shaped frame.

[0015] This invention provides a flipping device for a high-precision semiconductor packaging die bonding equipment. It has the following advantages: (1) The flipping device of the high-precision semiconductor packaging die bonding equipment can pick up, place and flip semiconductor packaging dies through the cooperation of the transverse mechanism, the material picking component and the flipping mechanism. In addition, when the placement frame is flipped, the rotating sleeve drives the baffle to block alternately through the inclined ring groove guide rod to prevent the die from falling off during the flipping process and improve the effect of flipping semiconductor packaging dies.

[0016] (2) The flipping device of the high-precision semiconductor packaging die bonding equipment expands by inflating the elastic air bladder in the placement frame through the air cylinder, and pushes the positioning component to adaptively clamp the die bonding of different sizes, replacing the rigid clamping of the traditional robot arm, avoiding excessive force that causes the die bonding to break, and adapting to different specifications of die bonding without changing the fixture, reducing changeover time and improving work efficiency.

[0017] (3) The flipping device of the high-precision semiconductor packaging die bonding equipment uses the material picking component. During the process of vacuum suction head picking up and placing die bonding, after the vacuum suction head comes into contact with the die bonding, when the output end of the cylinder continues to descend, the horizontal plate continues to descend, thereby squeezing the elastic telescopic rod to shrink, buffering the contact pressure, and further protecting the die bonding.

[0018] (4) The flipping device of the high-precision semiconductor packaging die bonding equipment uses the push component and the auxiliary centering component to enable the semiconductor packaging die bonding device to be tilted on the placement frame after being picked up by the vacuum suction head. Even if it is tilted due to the suction eccentricity, it can be driven by activating the electric telescopic rod to drive the rotating wheel to descend and squeeze the trapezoidal block to move. This causes the T rod to compress the reset spring and drive the push plate to move towards the center of the placement frame. When multiple sets of push plates approach simultaneously, they push the tilted die bonding device to gradually correct its position and finally accurately position the die bonding device at the center reference of the placement frame, avoiding slippage, collision or subsequent bonding offset during the flipping process due to the initial suction eccentricity. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention. Figure 1 ; Figure 2 This is a schematic diagram of the overall structure of the present invention. Figure 2 ; Figure 3 This is a schematic diagram of the flipping mechanism of the present invention; Figure 4 For the present invention Figure 3 Schematic diagram of structure A in the middle; Figure 5 For the present invention Figure 3 Schematic diagram of structure B Figure 6 This is a schematic diagram of the material handling component structure of the present invention; Figure 7 For the present invention Figure 6 Schematic diagram of the C-structure; Figure 8 This is a schematic cross-sectional view of the placement frame structure of the present invention.

[0021] Explanation of icon numbers: 1. Support frame; 2. Lateral movement mechanism; 3. Material handling assembly; 4. Tilting mechanism; 21. U-shaped plate; 22. Lead screw; 23. Motor II; 24. Guide rod; 25. Sliding seat; 31. Connecting plate; 32. Cylinder; 33. Horizontal plate I; 36. Horizontal plate II; 37. Vacuum suction head; 34. Limiting rod; 35. Elastic telescopic rod; 38. Pushing assembly; 381. Horizontal plate III; 382. Electric telescopic rod; 383. U-shaped frame; 3 84. Rotating wheel; 41. Mounting plate; 42. Motor 1; 43. Rotating shaft; 44. Placement frame; 45. Rotating sleeve; 451. Inclined ring groove; 46. Connecting rod; 47. Baffle; 48. Limiting plate; 49. Auxiliary centering component; 461. Ball bearing; 441. Elastic airbag; 442. Positioning component; 443. Air cylinder; 444. Conduit; 491. Fixing block; 492. T-rod; 493. Push plate; 494. Trapezoidal block.

[0022] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] Example 1 Please see Figures 1-7 The present invention proposes a flipping device for a high-precision semiconductor packaging die bonding equipment, including a support 1, a transverse mechanism 2 is provided on the top of the support 1, the transverse mechanism 2 is used for the transverse movement of the material picking component 3, and a flipping mechanism 4 is provided on the support 1.

[0025] In an embodiment of the present invention, in order to pick up the semiconductor packaged die and facilitate subsequent flipping of the semiconductor packaged die, the material handling assembly 3 specifically includes a connecting plate 31. A cylinder 32 is fixedly mounted on the upper side of the connecting plate 31. A horizontal plate 33 is fixedly connected to the output end of the cylinder 32. A horizontal plate 36 is provided on the lower side of the horizontal plate 33. A vacuum suction head 37 is fixedly mounted on the lower side of the horizontal plate 36. A limiting rod 34 is fixedly connected to the upper side of the horizontal plate 33. The limiting rod 34 passes through the connecting plate 31 and is slidably connected to the connecting plate 31. The first horizontal plate 33 and the second horizontal plate 36 are elastically connected by the elastic telescopic rod 35. When the cylinder 32 is activated, the output end of the cylinder 32 drives the first horizontal plate 33 to descend, which in turn drives the elastic telescopic rod 35 and the second horizontal plate 36 to descend, so that the vacuum suction head 37 comes into contact with the semiconductor package die, thereby achieving the suction of the semiconductor package die. After the vacuum suction head 37 comes into contact with the die, when the output end of the cylinder 32 continues to descend, the first horizontal plate 33 continues to descend, and the telescopic end of the elastic telescopic rod 35 can retract to buffer the contact pressure and achieve the effect of protecting the die.

[0026] Furthermore, in order to transfer the clamped adhesive sheet to the flipping mechanism 4 for flipping, the transverse mechanism 2 specifically includes a U-shaped plate 21, which is welded and fixed to the bracket 1. A lead screw 22 is rotatably connected to the inner surface of the U-shaped plate 21. A second motor 23 is fixedly connected to the outer wall of the U-shaped plate 21, and the output shaft of the second motor 23 is fixed to the lead screw 22. A guide rod 24 is fixedly connected to the inner surface of the U-shaped plate 21. A sliding seat 25 is threadedly connected to the lead screw 22, and the guide rod 24 passes through the sliding seat 25 and is connected to... The sliding seat 25 is slidably connected, and the connecting plate 31 is fixedly connected to the sliding seat 25 by bolts. The output shaft of the motor 23 rotates, which drives the lead screw 22 to rotate. Under the action of the guide rod 24, the sliding seat 25 can slide stably on the lead screw 22, adjusting the position of the connecting plate 31, thereby achieving the effect of adjusting the position of the picking component 3. This makes it easier for the picking component 3 to move the semiconductor package die to the top of the placement frame 44, and then place the semiconductor package die in the placement frame 44 through the use of the picking component 3.

[0027] Furthermore, the flipping mechanism 4 includes a mounting plate 41, a placement frame 44, and a connecting rod 46. The mounting plate 41 is fixedly mounted on the outer wall of the bracket 1. A motor 42 is fixedly connected to the outer wall of the mounting plate 41. A rotating shaft 43 is fixedly connected to the output shaft of the motor 42. The placement frame 44 is fixed to the rotating shaft 43 and is hollow. A rotating sleeve 45 is fixedly connected to the outer wall of the mounting plate 41. An oblique annular groove 451 is provided on the outer wall of the rotating sleeve 45. The connecting rod 46 is slidably connected in the oblique annular groove 451. A baffle 47 is rotatably connected to the end of the connecting rod 46 away from the rotating sleeve 45. The connecting rod 46 passes through a limiting plate 48 and is slidably connected to the limiting plate 48. The rotating shaft 43 passes through the rotating sleeve 45 and is rotatably connected to the rotating sleeve 45. The rotating shaft 43 passes through the limiting plate 48 and is fixedly connected to the limiting plate 48. Two sets of connecting rods 46 and baffles 47 are provided, and the two sets of baffles 47 are respectively Located on the upper and lower sides of the placement frame 44, after the semiconductor package adhesive is placed in the placement frame 44, the output shaft of the start motor 42 rotates half a turn. During this process, the rotating shaft 43 and the rotating sleeve 45 rotate, and the rotating shaft 43 drives the placement frame 44 to flip over. At the same time, the rotating sleeve 45 rotates, causing the connecting rod 46 to slide stably in the inclined ring groove 451, thereby driving the baffle 47 to reciprocate. During the flipping process of the placement frame 44, the two sets of baffles 47 can alternately block. This method can stably place the semiconductor package adhesive in the placement frame 44, prevent the adhesive from falling off during the flipping process, improve the flipping effect of the semiconductor package adhesive, and after the semiconductor package adhesive is flipped, during the process of the vacuum suction head 37 abutting against the semiconductor package adhesive and transferring it, the baffle 47 can limit the semiconductor package adhesive.

[0028] Furthermore, a ball bearing 461 is embedded in the end of the connecting rod 46 away from the baffle 47. The ball bearing 461 abuts against the inclined ring groove 451. Through the use of the ball bearing 461, the connecting rod 46 can have a small friction force when it moves in the inclined ring groove 451.

[0029] Furthermore, a pushing assembly 38 is provided on the rod of the vacuum suction head 37. The pushing assembly 38 includes a horizontal plate 381, on which an electric telescopic rod 382 is fixedly installed. A U-shaped frame 383 is fixedly connected to the telescopic end of the electric telescopic rod 382. A rotating wheel 384 is rotatably connected to the inner surface of the U-shaped frame 383. An auxiliary centering assembly 49 is provided on the placement frame 44. The auxiliary centering assembly 49 includes a fixing block 491, which is fixedly connected to the placement frame 44. The fixing block 491 is penetrated by a T-rod 492 and is slidably connected to the T-rod 492. The T-rod 492 and the fixing block 491 are elastically connected by a return spring. The connection is as follows: a push plate 493 is fixedly connected to one end of the T-rod 492 near the fixed block 491, and a trapezoidal block 494 is fixedly connected to the other end of the T-rod 492 away from the push plate 493. By activating the electric telescopic rod 382, ​​the rotating wheel 384 is driven to descend and squeeze the trapezoidal block 494 to move, causing the T-rod 492 to compress the reset spring and drive the push plate 493 to move towards the center of the placement frame 44. When multiple sets of push plates 493 approach simultaneously, they push the skewed adhesive piece and gradually correct its position, finally accurately positioning the adhesive piece at the center reference of the placement frame 44, avoiding slippage, collision, or subsequent bonding offset during the flipping process due to initial eccentricity of the suction.

[0030] In addition, in order to prevent the auxiliary centering component 49 from affecting the use of the baffle 47, the auxiliary centering component 49 is not provided on the side of the placement frame 44 near the baffle 47. When the adhesive piece is tilted at the baffle 47, the baffle 47 can push the adhesive piece into the placement frame 44 by rotating and tilting the placement frame 44.

[0031] Example 2 Please see Figure 8To accommodate semiconductor package bonding of different sizes, specifically, an elastic airbag 441 is fixedly connected to the inner surface of the placement frame 44, a positioning element 442 is slidably connected to the inner surface of the placement frame 44, and an air cylinder 443 is fixedly installed on the outer surface of the placement frame 44. The air cylinder 443 is connected to a conduit 444, and the end of the conduit 444 away from the air cylinder 443 is connected to the elastic airbag 441. An electric piston rod is provided in the air cylinder 443. When the electric piston rod moves, the gas in the air cylinder 443 can be added to the elastic airbag 441 through the conduit 444, causing the elastic airbag 441 to expand and push the positioning element 442 to move and position the semiconductor package bonding die. In this way, bonding dies of different sizes can be adaptively clamped, replacing the rigid clamping of traditional robotic arms, avoiding excessive force that could cause the bonding die to break, adapting to different specifications of bonding dies without changing the fixture, reducing changeover time, and improving work efficiency.

[0032] It should be noted that the above electrical components are all existing technology products. Those skilled in the art should select, install and complete the circuit debugging work according to the needs of use to ensure that all electrical appliances can work normally. The components are all general standard parts or components known to those skilled in the art. Their structure and principle can be known by those skilled in the art through technical manuals or conventional experimental methods. No specific restrictions are made here.

[0033] In use, the output shaft of motor 23 is rotated first, which drives the lead screw 22 to rotate. Then, under the action of guide rod 24, the sliding seat 25 can slide stably on the lead screw 22. Adjust the position of connecting plate 31, and then adjust the position of material picking component 3, so that it moves above the semiconductor package bonding die. Then, start the output end of cylinder 32 to drive the horizontal plate 33 to descend, which in turn drives the elastic telescopic rod 35 and the horizontal plate 36 to descend, so that the vacuum suction head 37 abuts against the semiconductor package bonding die, and achieves the suction of the semiconductor package bonding die. After the vacuum suction head 37 abuts against the bonding die, when the output end of cylinder 32 continues to descend, the horizontal plate 33 continues to descend, and the telescopic end of elastic telescopic rod 35 can retract to buffer the contact pressure. Then, by using the transverse mechanism 2, the vacuum suction head 37 is positioned directly above the placement frame 44. Then, by using the material handling component 3, the vacuum suction head 37 places the semiconductor package die into the placement frame 44. Then, the output shaft of motor 42 rotates half a turn. During this process, the rotating shaft 43 and the limiting plate 48 rotate. The rotating shaft 43 drives the placement frame 44 to flip over. At the same time, the connecting rod 46 slides stably in the inclined ring groove 451, thereby driving the baffle 47 to reciprocate. During the flipping process, the two sets of baffles 47 can alternately block, so that the semiconductor package die is stably placed in the placement frame 44, preventing the die from falling off during the flipping process. After the flipping is completed, the vacuum suction head 37 picks up the semiconductor package die, and the transverse mechanism 2 moves it to transfer the semiconductor package die away. At the same time, the electric telescopic rod 382 is activated, which drives the rotating wheel 384 to descend and squeeze the trapezoidal block 494 to move. This causes the T rod 492 to compress the reset spring and drive the push plate 493 to move towards the center of the placement frame 44. When multiple sets of push plates 493 move together synchronously, they push the skewed adhesive piece to correct its position and place it in the placement frame 44.

[0034] Meanwhile, by operating the electric piston rod, the gas in the air cylinder 443 can be added to the elastic air bag 441 through the conduit 444, causing the elastic air bag 441 to expand and push the positioning member 442 to move and position the semiconductor package die, adaptively clamping dies of different sizes.

[0035] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A flipping device for a high-precision semiconductor packaging die bonding equipment, comprising a support (1), characterized in that: The top of the support (1) is provided with a transverse movement mechanism (2), which is used for the transverse movement of the material handling component (3). The support (1) is provided with a flipping mechanism (4), which includes: Mounting plate (41), the mounting plate (41) is fixedly mounted on the outer wall of bracket (1), a motor (42) is fixedly connected to the outer wall of the mounting plate (41), and a rotating shaft (43) is fixedly connected to the output shaft of the motor (42). Placement frame (44), the placement frame (44) is fixed to the rotating shaft (43), and a rotating sleeve (45) is fixedly connected to the outer wall of the mounting plate (41), and an oblique ring groove (451) is opened on the outer wall of the rotating sleeve (45). The connecting rod (46) is slidably connected in the inclined ring groove (451). A baffle (47) is rotatably connected to the end of the connecting rod (46) away from the rotating sleeve (45). The connecting rod (46) passes through the limiting plate (48) and is slidably connected to the limiting plate (48). An auxiliary centering component (49) is provided on the placement frame (44).

2. The flipping device of a high-precision semiconductor packaging die bonding equipment according to claim 1, characterized in that: The rotating shaft (43) passes through the rotating sleeve (45) and is rotatably connected to the rotating sleeve (45). The rotating shaft (43) passes through the limiting plate (48) and is fixedly connected to the limiting plate (48).

3. The flipping device of a high-precision semiconductor packaging die bonding equipment according to claim 1, characterized in that: The connecting rod (46) and the baffle (47) are provided in two sets, and the two sets of baffles (47) are located on the upper and lower sides of the placement frame (44) respectively. A ball (461) is embedded in the end of the connecting rod (46) away from the baffle (47), and the ball (461) abuts against the inclined ring groove (451).

4. The flipping device of a high-precision semiconductor packaging die bonding equipment according to claim 1, characterized in that: The auxiliary centering component (49) includes a fixing block (491), which is fixedly connected to the placement frame (44). The fixing block (491) is penetrated by a T-rod (492) and slidably connected to the T-rod (492). The T-rod (492) and the fixing block (491) are elastically connected by a return spring. A push plate (493) is fixedly connected to one end of the T-rod (492) near the fixing block (491), and a trapezoidal block (494) is fixedly connected to one end of the T-rod (492) away from the push plate (493).

5. The flipping device of a high-precision semiconductor packaging die bonding equipment according to claim 1, characterized in that: The placement frame (44) is hollow. An elastic airbag (441) is fixedly connected to the inner surface of the placement frame (44). A positioning member (442) is slidably connected to the inner surface of the placement frame (44). An air cylinder (443) is fixedly installed on the outer surface of the placement frame (44). The air cylinder (443) is connected to the conduit (444). The end of the conduit (444) away from the air cylinder (443) is connected to the elastic airbag (441).

6. The flipping device of a high-precision semiconductor packaging die bonding equipment according to claim 5, characterized in that: An electric piston rod is provided in the air cylinder (443). When the electric piston rod moves, the gas in the air cylinder (443) can be added to the elastic air bag (441) through the conduit (444) to make the elastic air bag (441) expand and push the positioning member (442) to move and position the semiconductor package die.

7. The flipping device of a high-precision semiconductor packaging die bonding equipment according to claim 1, characterized in that: The transverse mechanism (2) includes a U-shaped plate (21), which is welded and fixed to the bracket (1). A lead screw (22) is rotatably connected to the inner surface of the U-shaped plate (21). A motor (23) is fixedly connected to the outer wall of the U-shaped plate (21). The output shaft of the motor (23) is fixed to the lead screw (22). A guide rod (24) is fixedly connected to the inner surface of the U-shaped plate (21). A sliding seat (25) is threadedly connected to the lead screw (22). The guide rod (24) passes through the sliding seat (25) and is slidably connected to the sliding seat (25).

8. The flipping device of a high-precision semiconductor packaging die bonding equipment according to claim 7, characterized in that: The material handling component (3) includes a connecting plate (31), a cylinder (32) is fixedly installed on the upper side of the connecting plate (31), a horizontal plate (33) is fixedly connected to the output end of the cylinder (32), a horizontal plate (36) is provided on the lower side of the horizontal plate (33), a vacuum suction head (37) is fixedly installed on the lower side of the horizontal plate (36), and a pushing component (38) is provided on the rod of the vacuum suction head (37).

9. The flipping device of a high-precision semiconductor packaging die bonding equipment according to claim 8, characterized in that: The connecting plate (31) and the sliding seat (25) are fixedly connected by bolts. A limiting rod (34) is fixedly connected to the upper side of the first horizontal plate (33). The limiting rod (34) passes through the connecting plate (31) and is slidably connected to the connecting plate (31). The first horizontal plate (33) and the second horizontal plate (36) are elastically connected by an elastic telescopic rod (35).

10. The flipping device of a high-precision semiconductor packaging die bonding equipment according to claim 8, characterized in that: The pushing component (38) includes a horizontal plate three (381), on which an electric telescopic rod (382) is fixedly installed. The telescopic end of the electric telescopic rod (382) is fixedly connected to a U-shaped frame (383), and a rotating wheel (384) is rotatably connected to the inner surface of the U-shaped frame (383).

Images