High-precision multilayer circuit board surface cleaning device and method

Abstract

The invention discloses a high-precision multilayer circuit board surface cleaning device, and relates to the technical field of circuit board processing equipment.The high-precision multilayer circuit board surface cleaning device comprises a flushing mechanism, a spraying mechanism and a drying mechanism, and the flushing mechanism comprises an immersion tank used for soaking and flushing a multilayer circuit board; a bubbling piece for generating bubbles to wash the multilayer circuit board piece is arranged at the bottom of the immersion tank, and a sedimentation washing frame is arranged above the bubbling piece; and a plug-in board for clamping a plurality of layers of circuit board pieces is movably arranged in the sedimentation washing frame. The invention discloses a high-precision multilayer circuit board surface cleaning method. The method comprises the steps of board mounting, washing preparation, primary washing, secondary washing, spraying and drying. According to the device, convenient and efficient bubble flushing is carried out on the multilayer circuit board, holes in the surface of the multilayer circuit board are repeatedly and reliably cleaned while the surface of the multilayer circuit board is protected, and through the structural design of the sedimentation flushing frame and the plug-in board, the remarkable effects of repeatedly utilizing the structure and improving the cleaning efficiency are achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board processing equipment, in particular to a high-precision multi-layer circuit board surface cleaning device and method. BACKGROUND

[0002] In the electronics manufacturing industry, multi-layer PCBs (printed circuit boards) are one of the most critical components. Circuit boards are divided into three major categories by the number of layers: single-sided boards, double-sided boards, and multi-layer boards. Multi-layer circuit boards are printed boards with three or more layers of conductive patterns separated by insulating materials, with the conductive patterns interconnected as required. Electrical connections between layers are typically made through plated copper holes in the cross-section of the circuit board.

[0003] Multi-layer circuit boards are the result of the development of electronic information technology towards high speed, multi-function, large capacity, small size, thinness, and lightness. They carry complex circuit designs and ensure the normal operation of electronic devices. Environmental factors such as temperature, humidity, dust, and chemicals can negatively affect the performance of multi-layer PCBs.

[0004] In the existing multi-layer PCB cleaning process, there are many plated copper holes on the PCB surface. These holes can be divided into drill rod formed holes and laser formed laser holes based on the processing type, and into through holes and blind holes based on the hole type. Due to the structure of the holes, dust and various chemical stains can easily accumulate, and in severe cases, the holes can be blocked and the plated copper layer can be deformed. Therefore, the key to improving the cleaning quality of multi-layer PCBs is to efficiently remove the stains inside the holes on the PCB. However, existing cleaning methods such as brushing and wiping can easily cause damage to surface components and incomplete cleaning.

[0005] In addition, there is a final drying step in the cleaning process. For PCBs with densely packed and easily damaged surface components, existing technology can only space them out and lay them flat in the drying equipment to prevent collision and wear between PCBs. However, this also reduces the utilization of space in the drying equipment, greatly reducing the drying efficiency and the overall efficiency of the entire cleaning process. SUMMARY

[0006] To solve the above problems, the present application provides a high-precision multi-layer circuit board surface cleaning device and method, which realizes convenient and efficient bubble washing of multi-layer circuit boards, protects the surface of multi-layer circuit boards, and reliably cleans the holes on the surface of multi-layer circuit boards repeatedly. Through the structural design of the settling washing frame and the plug-in board, the structure is utilized multiple times and the cleaning efficiency is significantly improved.

[0007] To achieve the above purpose, the technical solution adopted by the present application is:

[0008] The utility model provides a high-precision multilayer circuit board surface cleaning device, including flushing mechanism, spraying mechanism and drying mechanism, the flushing mechanism includes the immersion liquid groove for soaking and washing multilayer circuit board spare, the immersion liquid groove bottom is provided with the bubble generator for generating bubble and washing multilayer circuit board spare, the bubble generator top is placed with the settlement and washes the frame, the settlement and washes the frame inside movablely provided with the insert board of clamping multilayer circuit board spare, and the insert board is vertically arranged in the track on the settlement and washes the frame and slides up and down, the settlement and washes the frame includes the frame body with the top opening for the insert board with multilayer circuit board spare is put into the track, and the frame body bottom one side is provided with the take -out board groove for taking out the insert board with multilayer circuit board spare.

[0009] As a further improvement of the above-mentioned scheme, the bubble generator includes a deposition bottom plate arranged at the bottom of the immersion liquid groove, and the deposition bottom plate is uniformly and spacedly provided with bubble generators; a screen is arranged above the bubble generators.

[0010] As a further improvement of the above-mentioned scheme, the bubble generator is provided with a bubble outlet upwardly, and the bubble outlet is a circular truncated cone.

[0011] As a further improvement of the above-mentioned scheme, the frame body is provided with a handle on both sides of the upper portion, and the frame body is provided with a screen fixing member for fixing the frame body on the screen; the screen fixing member is a tapered spike structure with a size matched with the size of the hole on the screen.

[0012] As a further improvement of the above-mentioned scheme, the immersion liquid groove is provided with a take-out port extending outwardly on one side of the top portion, and the other side of the immersion liquid groove is a take-out bucket-shaped groove for tilting and overturning the frame body by a worker; detachable slide rails are arranged between the two side edges of the take-out bucket-shaped groove and the temperature control device.

[0013] As a further improvement of the above-mentioned scheme, the immersion liquid groove is provided with a temperature control device; an observation window is arranged on the side edge of the immersion liquid groove; and a conveying member leading to the spraying mechanism is arranged on the side edge of the immersion liquid groove.

[0014] As a further improvement of the above-mentioned scheme, the insert board is clamped on both sides of the multilayer circuit board spare, and the insert board is provided with an insertion slot for accommodating the side edge of the multilayer circuit board spare; the bottom of the track is flush with the take-out board groove.

[0015] As a further improvement of the above-mentioned scheme, vertical separation columns are arranged on both ends of the upper surface of the insert board; and positioning holes matched with the separation columns are arranged on the lower surface of the insert board at positions corresponding to the separation columns.

[0016] A cleaning method using the above-mentioned multilayer circuit board surface cleaning device, which comprises the following steps:

[0017] The multi-layer circuit board is loaded into the plug-in board on both sides through the slot, and the plug-in board with the multi-layer circuit board is formed.

[0018] The flushing preparation is prepared, the cleaning solution is filled in the immersion tank, the cleaning solution is placed in the sedimentation flushing frame, the part with the handle of the sedimentation flushing frame is exposed above the liquid level of the cleaning solution, the temperature control device is started and the temperature in the immersion tank is controlled at 45-60℃, the bubble generator is started and a large amount of bubbles are sprayed into the cleaning solution.

[0019] The plug-in board with the multi-layer circuit board is placed into the track from the top opening of the sedimentation flushing frame, and then it is completely immersed in the cleaning solution and naturally falls to the bottom along the track.

[0020] The plug-in board with the multi-layer circuit board is taken out through the plate taking groove, and then the position of the sedimentation flushing frame is restored, the plug-in board with the multi-layer circuit board is turned over and placed into the track from the top opening of the sedimentation flushing frame again, and then it is completely immersed in the cleaning solution and naturally falls to the bottom along the track.

[0021] The plug-in board with the multi-layer circuit board is sent to the spraying mechanism through the conveying part for spraying operation to remove the residual cleaning solution on the surface of the multi-layer circuit board.

[0022] The plurality of sedimentation flushing frames with the multi-layer circuit boards are stacked in the sedimentation flushing frame, and the upper and lower separation is realized through the separation column on the plug-in board matched with the positioning hole.

[0023] As a further improvement of the above scheme,

[0024] In the flushing preparation step, the temperature control device controls the temperature in the immersion tank at 50℃.

[0025] In the drying step, the working temperature of the drying mechanism is 80℃; the height of the separation column is 5-8cm; and the depth of the positioning hole is 1cm.

[0026] Compared with the prior art, the cleaning equipment in the present application has the following advantages:

[0027] 1. By designing a settling and rinsing rack, along with a plug-in board and a bubble generator, a convenient and efficient bubble rinsing of multi-layer circuit boards can be achieved. During the rinsing process, the bubbles generated by the bubble generator pass through the screen to form finer bubbles that float in the cleaning solution. These bubbles collide with the multi-layer circuit boards falling in the bubble generator. A large number of bubbles vibrate and wash away the stains on the surface of the multi-layer circuit boards during the impact. Bubbles passing through the holes on the surface of the multi-layer circuit boards will continuously push or impact the stains that remain or block the holes, flushing them out or carrying them away.

[0028] 2. The cleaning solution decomposes or reacts these stains, forming precipitates that are deposited on the sedimentation plate. The frustum-shaped design of the foaming nozzle prevents precipitates from accumulating and clogging the nozzle. The sliding rail design allows for the removal of the bucket-shaped hopper, facilitating subsequent cleaning of the sediment on the sedimentation plate.

[0029] 3. The combination of the screen and the screen fixing parts can further fix the sedimentation washing rack in the immersion tank; the observation window makes it easy for staff to observe the inside of the immersion tank, and the hopper-shaped trough makes it easy for staff to tilt and lean the sedimentation washing rack.

[0030] The beneficial effects of the cleaning method in this invention are as follows:

[0031] 1. Multiple forward and reverse rinsing processes thoroughly clean the upper and lower surfaces of multi-layer circuit boards and further enhance the impact of rinsing on dirt in the holes of multi-layer circuit boards.

[0032] 2. The design of placing the components at the top and removing them at the bottom can improve the efficiency of the workers' collaborative processing; at the same time, the design of the multi-layer circuit board components through the partition columns and positioning holes on the plug-in board can achieve safe stacking of multiple layers in the settling and rinsing rack, which greatly improves the processing efficiency of the subsequent drying process. Attached Figure Description

[0033] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0034] Figure 2 This is a top view of the structure of the present invention.

[0035] Figure 3 for Figure 2 A schematic diagram of the cross-sectional structure of AA.

[0036] Figure 4 This is a three-dimensional structural diagram of the settling and rinsing frame in this invention.

[0037] Figure 5 This is a schematic diagram showing the positional relationship between the plug-in board and the multilayer circuit board in this invention.

[0038] Figure 6This is a schematic diagram showing the positional relationship of the positioning holes on the plug-in board in this invention.

[0039] In the diagram: 1. Immersion tank; 2. Foaming component; 3. Conveying component; 4. Settling and rinsing rack; 5. Multilayer circuit board component; 11. Temperature control device; 12. Picking port; 13. Picking rack hopper-shaped groove; 14. Slide rail fit; 15. Observation window; 21. Sedimentation bottom plate; 22. Bubble generator; 23. Bubble nozzle; 24. Screen; 41. Frame; 42. Track; 43. Picking plate groove; 44. Insertion plate; 45. Divider column; 46. Positioning hole; 47. Handle; 48. Slot; 49. Screen fixing component. Detailed Implementation

[0040] To enable those skilled in the art to better understand the technical solution, the present invention will be described in detail below with reference to embodiments. The description in this part is only exemplary and explanatory, and should not be used to limit the scope of protection of the present invention in any way.

[0041] like Figures 1-6 As shown, the specific solution of this embodiment is as follows: a high-precision multilayer circuit board surface cleaning device, including a rinsing mechanism, a spraying mechanism and a drying mechanism. The rinsing mechanism includes an immersion tank 1 for immersing and rinsing the multilayer circuit board 5; a foaming element 2 for generating bubbles to rinse the multilayer circuit board 5 is provided at the bottom of the immersion tank 1, and a settling rinsing rack 4 is placed above the foaming element 2; a plug-in plate 44 for clamping the multilayer circuit board 5 is movably arranged in the settling rinsing rack 4, and the plug-in plate 44 slides up and down in a vertically arranged track 42 on the settling rinsing rack 4; the settling rinsing rack 4 includes a frame body 41 with a top opening for placing the plug-in plate 44 with the multilayer circuit board 5 into the track 42, and a board removal slot 43 for removing the plug-in plate 44 with the multilayer circuit board 5 is provided on one side of the bottom of the frame body 41.

[0042] like Figures 1-6 As shown, in a preferred embodiment of the above, the foaming component 2 includes a deposition base plate 21 disposed at the bottom of the immersion tank 1, and bubble generators 22 are evenly spaced on the deposition base plate 21; a screen 24 is disposed directly above the bubble generators 22.

[0043] like Figures 1-6 As shown, in a preferred embodiment of the above embodiment, the bubble generator 22 is provided with a bubble outlet 23 facing upwards, and the bubble outlet 23 is frustoconical.

[0044] like Figures 1-6 As shown, in a preferred embodiment, the frame 41 is provided with handles 47 on both sides of the upper part, and the bottom of the frame 41 is provided with a mesh fixing member 49 for fixing the frame 41 to the screen 24; the mesh fixing member 49 is a conical structure whose size matches the size of the holes on the screen 24.

[0045] likeFigures 1-6 As shown in the preferred embodiment of the above example, a take-out port 12 extending outward is provided on one side of the top of the immersion tank 1, and a rack-drawing bucket-shaped groove 13 for tilting and overturning the rack body 41 by the staff is provided on the other side of the immersion tank 1; a detachable sliding rail cooperation 14 is provided between the two side edges of the rack-drawing bucket-shaped groove 13 and the temperature control device 11.

[0046] As shown in the preferred embodiment of the above example, a temperature control device 11 is provided in the immersion tank 1; an observation window 15 is provided on the side edge of the immersion tank 1; and a conveying member 3 leading to the spraying mechanism is provided on the side edge of the immersion tank 1. Figures 1-6 As shown in the preferred embodiment of the above example, plug-in boards 44 are clamped and arranged on both sides of the multilayer circuit board 5, and plug-in slots 48 for accommodating the side edges of the multilayer circuit board 5 are provided on the plug-in boards 44; the bottom of the track 42 is flush with the plug-in board slot 43.

[0047] Figures 1-6 As shown in the preferred embodiment of the above example, vertical upward partition columns 45 are provided at both ends of the upper surface of the plug-in board 44; and positioning holes 46 cooperating with the partition columns 45 are provided at both ends of the lower surface of the plug-in board 44 at positions corresponding to the partition columns 45.

[0048] As shown in the preferred embodiment of the above example, vertical upward partition columns 45 are provided at both ends of the upper surface of the plug-in board 44; and positioning holes 46 cooperating with the partition columns 45 are provided at both ends of the lower surface of the plug-in board 44 at positions corresponding to the partition columns 45. Figures 1-6 A cleaning method using the above-mentioned multilayer circuit board surface cleaning device, comprising the following steps:

[0049] Board loading, the multilayer circuit board 5 is loaded into the plug-in boards 44 on both sides through the plug-in slots 48, forming plug-in boards 44 with multilayer circuit boards 5;

[0050] Rinse preparation, the immersion tank 1 is filled with cleaning liquid, and a settling and rinsing rack 4 is placed in the cleaning liquid, the part of the settling and rinsing rack 4 with a handle 47 is exposed above the liquid surface of the cleaning liquid, the temperature control device 11 is started and controls the temperature in the immersion tank 1 to 45℃, and the bubble generator 22 is started and sprays a large amount of bubbles into the cleaning liquid;

[0051] Primary rinsing, the plug-in board 44 with multilayer circuit board 5 is placed into the track 42 from the top opening of the settling and rinsing rack 4, then waits for it to be completely immersed in the cleaning liquid and naturally falls to the bottom along the track 42;

[0052] Secondary rinsing, the settling and rinsing rack 4 is lifted from one side of the rack-drawing bucket-shaped groove 13 and tilted to lean against the inner wall of the rack-drawing bucket-shaped groove 13, the plug-in board 44 with multilayer circuit board 5 is taken out through the plug-in board slot 43, then the position of the settling and rinsing rack 4 is restored, the plug-in board 44 with multilayer circuit board 5 is overturned and placed into the track 42 again from the top opening of the settling and rinsing rack 4, and waits for it to be completely immersed in the cleaning liquid and naturally falls to the bottom along the track 42;

[0053] A cleaning method using the above-mentioned multilayer circuit board surface cleaning device, comprising the following steps:​

[0054] Spraying, the insert board 44 with the multilayer circuit board 5 is sent to the spraying mechanism by the conveying member 3 to perform the spraying operation, and the cleaning liquid remaining on the surface of the multilayer circuit board 5 is removed;

[0055] Drying, the plurality of the sink washing frame 4 with the multilayer circuit board 5 is stacked in the sink washing frame 4, and the upper and lower separation is realized by the cooperation of the separation column 45 on the insert board 44 and the positioning hole 46; then the residual moisture on the surface of the multilayer circuit board 5 is removed by the drying mechanism.

[0056] As a preferred mode of the above embodiment,

[0057] A cleaning method using the above multilayer circuit board surface cleaning device, comprising the following steps:

[0058] Board loading, the multilayer circuit board 5 is respectively loaded into the insert board 44 on both sides through the slot 48 to form the insert board 44 with the multilayer circuit board 5;

[0059] Preparation for washing, the cleaning liquid is filled in the immersion tank 1, and the sink washing frame 4 with the handle 47 is placed in the cleaning liquid, the temperature control device 11 is started to control the temperature in the immersion tank 1 to 50℃, and the bubble generator 22 is started to spray a large amount of bubbles into the cleaning liquid;

[0060] First washing, the insert board 44 with the multilayer circuit board 5 is put into the track 42 from the top opening of the sink washing frame 4, and then waits for it to be completely immersed in the cleaning liquid and naturally falls to the bottom along the track 42;

[0061] Second washing, the sink washing frame 4 is lifted from one side of the frame bucket-shaped groove 13 and leaned against the inner wall of the frame bucket-shaped groove 13, the insert board 44 with the multilayer circuit board 5 is taken out through the board taking groove 43, then the position of the sink washing frame 4 is restored, the insert board 44 with the multilayer circuit board 5 is turned over and put into the track 42 again from the top opening of the sink washing frame 4, and then waits for it to be completely immersed in the cleaning liquid and naturally falls to the bottom along the track 42;

[0062] Spraying, the insert board 44 with the multilayer circuit board 5 is sent to the spraying mechanism by the conveying member 3 to perform the spraying operation, and the cleaning liquid remaining on the surface of the multilayer circuit board 5 is removed;

[0063] Drying, the plurality of the sink washing frame 4 with the multilayer circuit board 5 is stacked in the sink washing frame 4, and the upper and lower separation is realized by the cooperation of the separation column 45 on the insert board 44 and the positioning hole 46; then the residual moisture on the surface of the multilayer circuit board 5 is removed by the drying mechanism. In the preparation for washing step, the temperature control device 11 controls the temperature in the immersion tank 1 to 50℃;

[0064] The working temperature of the drying mechanism is 80℃; the height of the partition column 45 is 5cm; and the depth of the positioning hole 46 is 1cm.

[0065] As a preferred mode of the above embodiment,

[0066] A cleaning method using the above multi-layer circuit board surface cleaning device, which comprises the following steps:

[0067] Board loading, the multi-layer circuit board pieces 5 are respectively loaded into the plug-in boards 44 on both sides through the insertion slots 48 to form the plug-in boards 44 with the multi-layer circuit board pieces 5;

[0068] Rinse preparation, the cleaning liquid is filled in the immersion tank 1, the sink-washing rack 4 is placed in the cleaning liquid, the part of the sink-washing rack 4 with the handle 47 is exposed above the liquid surface of the cleaning liquid, the temperature control device 11 is started to control the temperature in the immersion tank 1 at 60℃, and the bubble generator 22 is started to spray a large amount of bubbles into the cleaning liquid;

[0069] Primary rinse, the plug-in board 44 with the multi-layer circuit board piece 5 is placed into the track 42 from the top opening of the sink-washing rack 4, and then waits for it to be completely immersed in the cleaning liquid and naturally falls to the bottom along the track 42;

[0070] Secondary rinse, the sink-washing rack 4 is lifted from one side of the sink-washing bucket-shaped groove 13 and is leaned against the inner wall of the sink-washing bucket-shaped groove 13, the plug-in board 44 with the multi-layer circuit board piece 5 is taken out through the board taking groove 43, then the position of the sink-washing rack 4 is restored, the plug-in board 44 with the multi-layer circuit board piece 5 is turned over and is again placed into the track 42 from the top opening of the sink-washing rack 4, and then waits for it to be completely immersed in the cleaning liquid and naturally falls to the bottom along the track 42;

[0071] Spraying, the plug-in board 44 with the multi-layer circuit board piece 5 is sent to the spraying mechanism through the conveying piece 3 to perform the spraying operation to remove the residual cleaning liquid on the surface of the multi-layer circuit board piece 5;

[0072] Drying, the sink-washing racks 4 with the multi-layer circuit board pieces 5 are stacked in the sink-washing rack 4, and are separated by the partition column 45 and the positioning hole 46 on the plug-in board 44, and then the residual moisture on the surface of the multi-layer circuit board piece 5 is removed by the drying mechanism. In the rinse preparation step, the temperature control device 11 controls the temperature in the immersion tank 1 at 50℃;

[0073] The working temperature of the drying mechanism is 80℃; the height of the partition column 45 is 8cm; and the depth of the positioning hole 46 is 1cm.

[0074] It should be noted that, in this text, the terms include, contain or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. The principles and implementation of the technical solutions of the present application are described by applying specific examples. The above example is only used to help understand the method of the present application and its core idea. The above is only the preferred embodiment of the present application. It should be noted that, due to the limitation of language expression, there are infinite specific structures objectively. For ordinary skilled persons in the art, without departing from the principles of the present application, some improvements, refinements or changes can be made, or the above technical features can be combined in a proper way; these improvements, refinements, changes or combinations, or without improvement, the concept and technical solution of the present application are directly applied to other occasions, which should be regarded as the protection scope of the present application.

Claims

1. A high-precision multilayer circuit board surface cleaning device, comprising a rinsing mechanism, a spraying mechanism, and a drying mechanism, characterized in that, The rinsing mechanism includes an immersion tank (1) for soaking and rinsing the multi-layer circuit board (5); the bottom of the immersion tank (1) is provided with a foaming element (2) for generating bubbles to rinse the multi-layer circuit board (5), and a settling rinsing rack (4) is placed above the foaming element (2); a plug-in plate (44) for clamping the multi-layer circuit board (5) is movably arranged in the settling rinsing rack (4), and the plug-in plate (44) slides up and down in a vertically arranged track (42) on the settling rinsing rack (4); the settling rinsing rack (4) includes a frame (41) with a top opening for placing the plug-in plate (44) with the multi-layer circuit board (5) into the track (42), and a board removal slot (43) is provided on one side of the bottom of the frame (41) for removing the plug-in plate (44) with the multi-layer circuit board (5).

2. The high-precision multilayer circuit board surface cleaning device according to claim 1, characterized in that, The foaming component (2) includes a deposition base plate (21) disposed at the bottom of the immersion tank (1), on which bubble generators (22) are evenly spaced; and a screen (24) is disposed directly above the bubble generators (22).

3. The high-precision multilayer circuit board surface cleaning device according to claim 2, characterized in that, The bubble generator (22) is provided with a bubble outlet (23) facing upwards, and the bubble outlet (23) is frustum-shaped.

4. The high-precision multilayer circuit board surface cleaning device according to claim 2, characterized in that, The frame (41) is provided with handles (47) on both sides of the upper part, and the bottom of the frame (41) is provided with a mesh fixing member (49) for fixing the frame (41) on the screen (24); the mesh fixing member (49) is a conical structure whose size matches the size of the holes on the screen (24).

5. The high-precision multilayer circuit board surface cleaning device according to claim 1, characterized in that, The immersion tank (1) has an outwardly extending retrieval port (12) on one side of its top, and the other side of the immersion tank (1) is a retrieval bucket-shaped groove (13) for workers to tilt and flip the frame (41); the two sides of the retrieval bucket-shaped groove (13) are provided with detachable slide rails (14) that cooperate with the temperature control device (11).

6. The high-precision multilayer circuit board surface cleaning device according to claim 1, characterized in that, A temperature control device (11) is provided inside the immersion tank (1); an observation window (15) is provided on the side of the immersion tank (1); a conveyor (3) leading to the spraying mechanism is provided on the side of the immersion tank (1).

7. The high-precision multilayer circuit board surface cleaning device according to claim 1, characterized in that, The plug-in board (44) is clamped on both sides of the multi-layer circuit board (5), and the plug-in board (44) has a slot (48) for accommodating the side of the multi-layer circuit board (5); the bottom of the track (42) is flush with the board taking slot (43).

8. The high-precision multilayer circuit board surface cleaning device according to claim 1, characterized in that, The upper surface of the plug-in plate (44) is provided with vertically upward partition columns (45) at both ends; the lower surface of the plug-in plate (44) is provided with positioning holes (46) at the corresponding positions of the partition columns (45) to cooperate with the partition columns (45).

9. A cleaning method using the above-mentioned multilayer circuit board surface cleaning apparatus, characterized in that, Includes the following steps: The multi-layer circuit board (5) is inserted into the plug-in board (44) on both sides through the slot (48) to form a plug-in board (44) with multi-layer circuit board (5). Rinsing preparation: The immersion tank (1) is filled with cleaning liquid, and a settling rinsing rack (4) is placed in the cleaning liquid. The part of the settling rinsing rack (4) with a handle (47) is exposed above the liquid surface of the cleaning liquid. The temperature control device (11) is activated and the temperature in the immersion tank (1) is controlled at 45-60℃. The bubble generator (22) is activated and sprays a large number of bubbles into the cleaning liquid. In one rinse, insert the plug-in board (44) with multi-layer circuit board components (5) into the track (42) through the top opening of the settling rinse rack (4), and then wait for it to be fully immersed in the cleaning solution and fall naturally to the bottom along the track (42); Secondary rinsing: Lift the settling rinse rack (4) from one side of the rack hopper (13) and lean it against the inner wall of the rack hopper (13). Take out the plug-in board (44) with multi-layer circuit board components (5) through the plate taking slot (43). Then restore the position of the settling rinse rack (4). Turn the plug-in board (44) with multi-layer circuit board components (5) over and put it into the track (42) again from the top opening of the settling rinse rack (4). Wait for it to be completely immersed in the cleaning solution and fall naturally to the bottom with the track (42). Spraying: The plug-in board (44) with multi-layer circuit board (5) is sent to the spraying mechanism by the conveyor (3) to remove the cleaning liquid remaining on the surface of the multi-layer circuit board (5). Drying involves stacking multiple settling and rinsing racks (4) with multi-layer circuit board components (5) inside the settling and rinsing rack (4), and separating them into upper and lower sections by the cooperation of the partition column (45) on the plug-in plate (44) and the positioning hole (46); then the residual moisture on the surface of the multi-layer circuit board components (5) is dried and removed by the drying mechanism.

10. A high-precision multilayer circuit board surface cleaning method according to claim 9, characterized in that, During the rinsing preparation step, the temperature control device (11) controls the temperature in the immersion tank (1) at 50°C; In the drying step, the working temperature of the drying mechanism is 80℃; the height of the separator column (45) is 5-8cm; and the depth of the positioning hole (46) is 1cm.

Images