ALD equipment capable of mounting multiple cavities to execute multi-task processing and efficient ALD process

Abstract

The invention provides ALD equipment capable of mounting multiple cavities to execute multitask processing and an efficient ALD process, and relates to the technical field of semiconductor equipment. Comprising an EFEM loading system, a vacuum transmission system, a stack cooling module, a stack preheating module, an RF cleaning module and an ALD module, wherein the stack cooling module, the stack preheating module, the RF cleaning module and the ALD module are connected to the peripheral side of the vacuum transmission system through isolation seam valves and can operate independently; wherein the vacuum transmission system is suitable for controlling substrates to be transmitted among the modules through a vacuum manipulator; the EFEM loading system is connected to the stack cooling module and is used for realizing the loading and unloading processes of substrates; the RF cleaning module is suitable for carrying out pre-cleaning treatment on a substrate; the stack preheating module is suitable for preheating the substrate before the process; and the stack cooling module is suitable for cooling the substrates processed by the ALD equipment and receiving the substrates conveyed by the EFEM loading system during feeding. According to the scheme, the efficiency and the process quality of the ALD process are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor equipment, in particular to an ALD device capable of mounting multiple chambers to perform multitask processing and an efficient ALD process. BACKGROUND

[0002] The existing semi-automatic single-chamber ALD device has many technical defects, which seriously restricts the development of semiconductor manufacturing processes. This type of device usually adopts a manual handling of the rack method, which requires the rack to be carried to the device base, and then the substrate is sent to the designated position through the transmission mechanism of the device. This operation method has obvious pollution risk, because the vacuum environment must be broken during the loading of the substrate, which exposes the substrate to the atmospheric environment, which will cause a large amount of particulate (Partic) pollution on the surface of the substrate. These pollutants not only increase the subsequent processing cost, but in some processes that require high cleanliness, they can even directly cause the product to be unqualified.

[0003] In addition, the traditional device also has the problem of low process efficiency. Due to the single-chamber design, all processing steps including preheating, film forming, cooling, etc. need to be performed in the same chamber in sequence, and parallel processing cannot be achieved. This serial processing method seriously restricts the device capacity. More seriously, the rack needs to be repeatedly switched between heating, cooling, vacuum, and atmospheric environments, and this environmental change is easy to cause the deposited coating layer to fall off, resulting in more particulate pollution, forming a vicious cycle.

[0004] These problems make the existing device only applicable to the process field that is not sensitive to particulate pollution, and it faces serious application bottlenecks in high-end semiconductor manufacturing. Especially in advanced processes that require high cleanliness and high efficiency, traditional devices cannot guarantee product quality and are difficult to meet the capacity demand. In view of the above problems, the existing technology needs to be improved. SUMMARY

[0005] The present application discloses an ALD device capable of mounting multiple chambers to perform multitask processing and an efficient ALD process, which has the advantages of reducing substrate pollution risk, improving process efficiency, and reducing device cost.

[0006] The application provides an ALD device capable of mounting multiple chambers to perform multitask processing, comprising an EFEM loading system, a vacuum transmission system, and a stack cooling module, a stack preheating module, an RF cleaning module and an ALD module connected on the side of the vacuum transmission system and capable of independent operation through an isolation slit valve; wherein the vacuum transmission system is suitable for controlling the transmission of substrates between the modules through a vacuum manipulator; the EFEM loading system is connected to the stack cooling module to realize the loading and unloading process of the substrates; the RF cleaning module is suitable for pre-cleaning the substrates; the stack preheating module is suitable for preheating the substrates before processing; the stack cooling module is suitable for cooling the substrates processed by the ALD device, and receives the substrates transmitted by the EFEM loading system during loading.

[0007] Further, the application also provides that the EFEM loading system comprises a rack and a plurality of loading and unloading modules, an atmospheric manipulator, a calibration module and a high-efficiency filtration system arranged on the rack; wherein the atmospheric manipulator is suitable for transmitting the substrates between the loading and unloading modules, the calibration module and the cooling stack module; the calibration module is suitable for correcting the center of the substrate and detecting the substrate; and the high-efficiency filtration system is used to keep the cleanliness in the EFEM loading system within a set range.

[0008] Further, the application also provides that the vacuum transmission system comprises a vacuum cavity, a vacuum manipulator arranged in the vacuum cavity, and a plurality of isolation slit valves arranged on the side of the vacuum cavity to connect the vacuum cavity with the stack cooling module, the stack preheating module, the RF cleaning module and the ALD module; the vacuum manipulator is suitable for passing through the channel of the isolation slit valve to transmit the substrates between the stack cooling module, the stack preheating module, the RF cleaning module and the ALD module.

[0009] Further, the application also provides that the stack cooling module comprises a first vacuum outer cavity, and a first shelf base suitable for placing a first multi-layer shelf arranged in the first vacuum outer cavity; the first shelf base is connected with a first rotating system for driving the first multi-layer shelf to rotate; and a first lifting transmission system is arranged on the first rotating system for driving the first multi-layer shelf to lift; the first vacuum outer cavity comprises a first upper vacuum cavity and a first lower vacuum cavity; wherein the first lower vacuum cavity is connected with the vacuum cavity through a first isolation slit valve; the first lifting transmission system is suitable for driving the first multi-layer shelf to lift between the first upper vacuum cavity and the first lower vacuum cavity; the upper end side of the first upper vacuum cavity is connected with an inert gas purging system, the inert gas purging system is connected to the first upper vacuum cavity through a cooling purging gas pipe, and the cooling purging gas pipe is provided with a plurality of gas outlet channels in the height direction of the first multi-layer shelf to improve the purging and cooling efficiency; a first dry pump for air exhaust is arranged at the bottom of the first lower vacuum cavity.

[0010] Further, the application also proposes that the RF cleaning module comprises a second vacuum outer cavity, and a second rack base suitable for placing the second multi-layer rack is arranged in the second vacuum outer cavity, the second rack base is connected with a second rotating system for driving the second multi-layer rack to rotate; and a second lifting transmission system is arranged on the second rotating system for driving the second multi-layer rack to lift; the second vacuum outer cavity comprises a second upper vacuum cavity and a second lower vacuum cavity; the second lower vacuum cavity is connected with the vacuum cavity through a second isolation slit valve; the second lifting transmission system is suitable for driving the second multi-layer rack to lift between the second upper vacuum cavity and the second lower vacuum cavity; one side of the second upper vacuum cavity is connected with an RF module, the RF module comprises an RF processing unit, and an air inlet path and an RF circuit module connected on the RF processing unit, so as to deliver plasma to the second upper vacuum cavity to clean and pretreat the substrate in the second multi-layer rack; and a heater is arranged in the second upper vacuum cavity; and a second dry pump for pumping is arranged at the bottom of the second lower vacuum cavity.

[0011] Further, the application also proposes that the stack preheating module comprises a third vacuum outer cavity, and a third rack base suitable for placing the third multi-layer rack is arranged in the third vacuum outer cavity, the third rack base is connected with a third rotating system for driving the third multi-layer rack to rotate; and a third lifting transmission system is arranged on the third rotating system for driving the third multi-layer rack to lift; the third vacuum outer cavity comprises a third upper vacuum cavity and a third lower vacuum cavity; the third lower vacuum cavity is connected with the vacuum cavity through a third isolation slit valve; the third lifting transmission system is suitable for driving the third multi-layer rack to lift between the third upper vacuum cavity and the third lower vacuum cavity; a first heating system is arranged in the third upper vacuum cavity, and the heating system is suitable for preheating the substrate in the third multi-layer rack; and a third dry pump for pumping is arranged at the bottom of the third lower vacuum cavity.

[0012] Further, the ALD module comprises a fourth vacuum outer cavity, and a fourth rack base for placing the fourth multi-layer rack is arranged in the fourth vacuum outer cavity, and the fourth rack base is connected with a fourth rotating system for driving the fourth multi-layer rack to rotate; and a fourth lifting transmission system is arranged on the fourth rotating system for driving the fourth multi-layer rack to lift; the fourth vacuum outer cavity comprises a fourth upper vacuum cavity and a fourth lower vacuum cavity; the fourth lower vacuum cavity is connected with the vacuum cavity through a fourth isolation slit valve; the fourth lifting transmission system is adapted to drive the fourth multi-layer rack to lift between the fourth upper vacuum cavity and the fourth lower vacuum cavity; an air inlet system is connected to the fourth upper vacuum cavity through an air inlet pipe to make the process gas blow the substrate in the fourth multi-layer rack to react; and a second heating system is arranged in the fourth upper vacuum cavity; an air outlet is arranged on the side of the fourth upper vacuum cavity away from the air inlet pipe, the air outlet is connected with a filter, and the filter is connected with a fourth dry pump for air exhaust.

[0013] Further, the vacuum outer cavities of the stack cooling module, the stack preheating module, the RF cleaning module and the ALD module are provided with maintenance doors for maintenance.

[0014] Further, the multi-layer racks in the stack cooling module, the stack preheating module, the RF cleaning module and the ALD module are arranged to be not less than 50 layers.

[0015] Further, the application further provides an efficient ALD process using the ALD device capable of mounting multiple chambers to perform multi-task processing, comprising the following steps: S1, layer by layer transmitting the substrate from the EFEM loading system to the stack cooling module for stacking; S2, transmitting the substrate in the stack cooling module to the RF cleaning module through the vacuum manipulator to stack and clean; after cleaning, the substrate is transmitted to the stack preheating module to stack and preheat to a preset temperature; then the vacuum manipulator is used to transmit the preheated substrate to the ALD module to stack and perform real-time ALD process; after the process is completed, the stack cooling module is unloaded to transmit the processed substrate to the stack cooling module to stack and cool; after cooling, the processed substrate is unloaded through the EFEM loading system; S3, repeating the steps of S1-S2.

[0016] As can be seen from the above, the ALD device capable of mounting multiple chambers to perform multi-task processing and the efficient ALD process provided by the application have the advantages of reducing the risk of substrate contamination, improving process efficiency and reducing equipment cost by integrating the EFEM loading system, the vacuum transmission system and the multiple independently running process modules, adopting the vacuum environment transmission and parallel processing mechanism, and realizing multi-task synchronous processing while maintaining the cleanliness of the substrate. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a structural schematic diagram of an ALD device capable of mounting multiple chambers to perform multi-task processing according to an embodiment of the present application;

[0018] Figure 2 is a structural schematic diagram of an EFEM loading system of an ALD device capable of mounting multiple chambers to perform multi-task processing according to an embodiment of the present application;

[0019] Figure 3 is a structural schematic diagram of a vacuum transmission system of an ALD device capable of mounting multiple chambers to perform multi-task processing according to an embodiment of the present application;

[0020] Figure 4 is a structural schematic diagram of a stack cooling module of an ALD device capable of mounting multiple chambers to perform multi-task processing according to an embodiment of the present application;

[0021] Figure 5 is a structural schematic diagram of an RF cleaning module of an ALD device capable of mounting multiple chambers to perform multi-task processing according to an embodiment of the present application;

[0022] Figure 6 is a structural schematic diagram of a stack preheating module of an ALD device capable of mounting multiple chambers to perform multi-task processing according to an embodiment of the present application;

[0023] Figure 7 is a structural schematic diagram of an ALD module of an ALD device capable of mounting multiple chambers to perform multi-task processing according to an embodiment of the present application;

[0024] EFEM loading system 1, rack 11, loading and unloading module 12, atmospheric robot 13, calibration module 14;

[0025] vacuum transmission system 2, vacuum cavity 21, vacuum robot 22;

[0026] stack cooling module 3, first vacuum outer cavity 31, first upper vacuum cavity 311, first lower vacuum cavity 312, first multi-layer rack 32, first rack base 33, first rotating system 34, first lifting transmission system 35, first isolation slit valve 36, inert gas purging system 37, cooling purging gas pipe 38, first dry pump 39;

[0027] RF cleaning module 4, second vacuum outer cavity 41, second upper vacuum cavity 411, second lower vacuum cavity 412, second multi-layer rack 42, second rack base 43, second rotating system 44, second lifting transmission system 45, second isolation slit valve 46, RF processing unit 47, gas inlet circuit 48, RF circuit module 49, heater 410, second dry pump 413;

[0028] Stack preheating module 5, third vacuum outer cavity 51, third upper vacuum cavity 511, third lower vacuum cavity 512, third multi-layered rack 52, third rack base 53, third rotating system 54, third lifting transmission system 55, third isolation slit valve 56, first heating system 57, third dry pump 58;

[0029] ALD module 6, fourth vacuum outer cavity 61, fourth upper vacuum cavity 611, fourth lower vacuum cavity 612, fourth multi-layered rack 62, fourth rack base 63, fourth rotating system 64, fourth lifting transmission system 65, fourth isolation slit valve 66, gas inlet system 67, second heating system 68, gas inlet pipe 69, filter 610, fourth dry pump 613, maintenance door 614;

[0030] Source cabinet 7. DETAILED DESCRIPTION

[0031] Embodiment 1

[0032] Combination Figure 1 The embodiment provides an ALD device capable of mounting multiple chambers to perform multiple task processing, comprising a front-end module loading system, a vacuum transmission system 2, and a cooling module, a preheating module, a radio frequency cleaning module and a deposition module arranged around the vacuum transmission system 2. Each module is connected by a vacuum isolation device to form a closed transmission channel. The front-end module loading system is connected to the cooling module to realize substrate handover, and the vacuum manipulator 22 completes substrate transfer between modules in a vacuum environment. The cooling module is configured with an inert gas purging system 37, the preheating module is integrated with a heating device, the radio frequency cleaning module is provided with a plasma generating unit, and the deposition module is provided with a gas delivery system.

[0033] Among them, the EFEM loading system 1 refers to the front-end module loading system, which is provided with a clean transmission unit with a high-efficiency air filter device, and comprises a substrate calibration mechanism and a mechanical arm. The system maintains a positive pressure clean environment to control particle pollution during substrate loading and unloading. The vacuum transmission system 2 refers to a transmission hub composed of a vacuum cavity 21 and a mechanical arm, and the vacuum degree thereof is maintained within the process requirement range. The mechanical arm joint adopts magnetic fluid sealing technology to ensure reliable operation in a vacuum environment. The isolation slit valve refers to a vacuum isolation device connecting the vacuum transmission system 2 and the process module, which adopts a double-gate plate structure design. The device allows the mechanical arm to perform substrate handover operation while maintaining the vacuum isolation state of adjacent cavities. The multi-piece rack refers to a substrate container with a multi-layer bearing structure, and the layer spacing can be adjusted to adapt to different sizes of substrates. The rack is provided with a rotating lifting mechanism to realize batch processing of substrates.

[0034] After the substrate is positioned and calibrated by the front end module loading system, it is transferred to the stack cooling module 3 by the atmospheric mechanical arm. The mechanical arm of the vacuum transfer system 2 takes the substrate out of the stack cooling module 3, and sends it into the RF cleaning module 4 for surface treatment according to the process sequence. After the substrate is cleaned, it is heated by the stack preheating module 5 and then enters the deposition module, where the process gas chemically reacts on the heated substrate surface to form a thin film. After the processing is completed, the substrate is cooled by the stack cooling module 3 and finally removed from the equipment by the front end module. Each process module independently controls the temperature, gas environment and processing time to achieve parallel processing of multiple batches of substrates.

[0035] Compared with the prior art, the traditional equipment is limited by a single cavity structure and must sequentially complete each process step. The present scheme allows the cleaning, preheating and deposition processes to be performed simultaneously through a modular layout, reducing the processing cycle of a single substrate to the key process time. The vacuum transfer system 2 avoids exposing the substrate to the atmosphere, and the clean environment control of the front end module effectively reduces the risk of particle contamination. The multi-chamber design allows the equipment to process different sizes of substrates simultaneously, improving equipment utilization. The entire process of the substrate is processed in a vacuum environment, eliminating the pollution problem caused by exposure to the atmosphere. The parallel operation of multiple process modules significantly improves the processing efficiency of the equipment, and the modular structure design enhances the expandability and maintenance convenience of the equipment. The independently controlled process cavities can be flexibly configured according to production needs to adapt to diversified product manufacturing requirements.

[0036] In combination Figure 2 , the EFEM loading system 1 in the present embodiment specifically includes a rack 11 and a plurality of loading and unloading modules 12, an atmospheric mechanical hand 13, a calibration module 14 and a high-efficiency filtration system arranged on the rack 11. The atmospheric mechanical hand 13 is configured to transfer the substrate between the loading and unloading modules 12, the calibration module 14 and the cooling stack module, the calibration module 14 is used to correct the center position of the substrate and perform detection operations, and the high-efficiency filtration system is used to maintain the cleanliness of the internal environment of the loading system.

[0037] The rack 11 refers to a frame structure that carries each functional module, and its internal space forms a closed transmission environment to isolate external pollution. The loading and unloading module 12 refers to the physical interface for loading and unloading the substrate, which can use a mechanical arm or a conveyor belt mechanism to realize automatic picking and placing of the substrate, avoiding pollution risks caused by manual contact. The atmospheric mechanical hand 13 refers to an automated transfer device operating in an atmospheric environment, such as a multi-axis mechanical arm combined with a vacuum suction cup structure, which realizes precise transfer of the substrate between the loading and unloading module 12 and the cooling stack module. The calibration module 14 refers to a device with optical detection and positioning functions, such as a CCD vision system and a rotary positioning platform, which detects the offset of the substrate through image recognition technology and drives the positioning platform to compensate for the position. The high-efficiency filtration system refers to an air purification device composed of a HEPA filter 610 and a circulating fan, such as a laminar flow air supply mode, which maintains the appropriate cleanliness of the internal space of the system.

[0038] After the substrate enters the closed rack 11 through the loading and unloading module 12, the atmospheric mechanical hand 13 transfers it to the calibration module 14 for position correction and surface detection. The calibration module 14 identifies the edge position of the substrate through an optical sensor, drives the rotating platform to adjust the angle of the substrate, and ensures that the center thereof is accurately aligned with the transmission path. The substrate that has completed calibration is transferred by the atmospheric mechanical hand 13 to the designated layer position of the cooling stack module, and the entire process is completed in a clean environment maintained by the high-efficiency filtration system. The high-efficiency filtration system transports purified air downward through the top air supply port, expels particulate matter generated by the movement of the mechanical hand in the vertical direction, and avoids the deposition of particles on the surface of the substrate. By completely eliminating the manual intervention link through the closed rack 11 and the automated transmission device, the positioning compensation function of the calibration module 14 solves the problem of repeated positioning errors of the mechanical hand. The fully closed and automated operation of the substrate transmission process effectively isolates atmospheric environmental pollutants.

[0039] In combination Figure 3 , in this embodiment, the vacuum transmission system 2 includes a vacuum cavity 21, a vacuum mechanical hand 22 arranged in the vacuum cavity 21, and a plurality of isolation slit valves arranged on the side of the vacuum cavity 21 to connect the vacuum cavity 21 with the stack cooling module 3, the stack preheating module 5, the RF cleaning module 4, and the ALD module 6. The vacuum mechanical hand 22 passes through the channel of the isolation slit valve to transmit the substrate between the modules.

[0040] Among them, the vacuum cavity 21 refers to a closed vacuum environment container, which is internally configured with a vacuum pump group to maintain the required vacuum degree. This structure serves as the core channel for substrate transmission, ensuring that the substrate is always in a vacuum environment and avoiding contact with atmospheric pollutants. The vacuum mechanical hand 22 refers to a vacuum-compatible mechanical device with multiple degrees of freedom of movement, which can use a magnetic coupling driving mechanism to achieve precise positioning in a vacuum environment. This device achieves automated transmission of the substrate between modules through motion path planning, reducing the pollution risk caused by human intervention. The isolation slit valve refers to a vacuum valve with an openable sealing structure, for example, a gate plate structure can be used in combination with a fluororubber sealing ring to achieve vacuum isolation. This valve maintains the vacuum independence of each module in the closed state, and forms a transmission channel for the mechanical hand to pass through when opened, balancing the demand for module independence and system linkage.

[0041] The operation of the vacuum transmission system 2 is based on the closed environment constructed by the vacuum cavity 21, and the substrate grabbing action is performed by the vacuum manipulator 22 in the cavity. When transmission across the module is required, the corresponding isolation slit valve of the target module is opened to form a channel, and the vacuum manipulator 22 passes through the channel along the predetermined path to complete the substrate handover. After the transmission is completed, the isolation slit valve is immediately closed to restore the vacuum isolation state of each module. This dynamic opening and closing mechanism not only ensures the vacuum continuity of the transmission process, but also maintains the independent operation environment of each process module. The motion trajectory of the vacuum manipulator 22 is optimized and designed, which can simultaneously process the transmission requirements of multiple modules, and cooperates with the stacking structure of the multi-piece carrier to realize parallel processing of batch substrates.

[0042] The present scheme realizes the whole process of the substrate from loading to process completion in a clean vacuum environment through a full-vacuum transmission path and dynamic sealing of the isolation slit valve. In the prior art, the vacuum is frequently broken for transmission between modules, while the present scheme realizes substrate transfer without damaging the vacuum state of the module through the cooperation of the vacuum manipulator 22 and the isolation slit valve, which significantly reduces the pollution risk. At the same time, the layout of the multi-channel isolation slit valve allows different modules to simultaneously perform substrate handover.

[0043] Through the above technical scheme, the present application makes the whole process of substrate transmission in a vacuum environment, eliminates particle pollution introduced by atmospheric exposure; each module maintains an independent vacuum state through the isolation slit valve, avoiding cross contamination; the cooperation of the vacuum manipulator 22 and the multi-channel isolation slit valve realizes multi-module parallel operation, improving the overall processing efficiency; the dynamic valve control mechanism completes the substrate handover on the premise of ensuring vacuum isolation, taking into account the system cleanliness and transmission flexibility.

[0044] In combination Figure 4 The stacking cooling module 3 in the embodiment includes a first vacuum outer cavity 31 and a first carrier base 33 arranged in the first vacuum outer cavity 31. The first carrier base 33 is connected with a first rotating system 34, and the first rotating system 34 is provided with a first lifting transmission system 35. The first vacuum outer cavity 31 includes a first upper vacuum cavity 311 and a first lower vacuum cavity 312. The first lower vacuum cavity 312 is connected with the vacuum cavity 21 through a first isolation slit valve 36. The upper end side of the first upper vacuum cavity 311 is connected with an inert gas purging system 37. A cooling purging gas pipe 38 is arranged in multiple gas outlet channels along the height direction of the first multi-layer carrier 32. The first lower vacuum cavity 312 is provided with a first dry pump 39 at the bottom.

[0045] The first vacuum outer cavity 31 refers to a split type vacuum cavity 21 structure, which can be implemented by a stainless steel welded cavity cooperating with a vacuum sealing flange. The first rotating system 34 refers to a mechanical device for driving the rotation of the rack, which can be implemented by a servo motor cooperating with a precision reduction mechanism. The first lifting transmission system 35 refers to a vertical motion mechanism, which can be implemented by a ball screw cooperating with a linear guide rail. The inert gas purging system 37 refers to a gas circulation device, which can be implemented by a nitrogen gas supply unit cooperating with a multi-hole air distribution pipe. The first dry pump 39 refers to a vacuum maintaining device, which can be implemented by a scroll dry pump.

[0046] When the substrate enters the first multi-layer rack 32 of the first lower vacuum cavity 312 through the first isolation slit valve 36 under the control of the vacuum transmission system 2, the first lifting transmission system 35 lifts the first multi-layer rack 32 carrying the substrate step by step, so that the substrate is stacked layer by layer along the first multi-layer rack 32, and then lifted to the first upper vacuum cavity 311. The inert gas purging system 37 blows cooling gas to the surface of the substrate through a plurality of gas outlets arranged along the height direction of the rack, and at the same time, the first rotating system 34 drives the rack to rotate at a constant speed to make the gas uniformly cover the surface of the substrate. The gas generated during the cooling process is continuously discharged from the first lower vacuum cavity 312 by the first dry pump 39, so as to maintain the stability of the vacuum environment. After the cooling is completed, the rack returns to the first lower vacuum cavity 312 through the lifting transmission system, and the substrate is transferred to the EFEM loading system 1 through the isolation slit valve.

[0047] The present scheme realizes the whole cooling process in a closed vacuum environment by cooperating the split type vacuum cavity 21 with the isolation slit valve, and eliminates the risk of atmospheric contact. The multi-layer rack structure and the rotating and lifting cooperative control realize batch processing of more than 50 substrates, which significantly improves the throughput compared with the traditional single piece processing mode. The three-dimensional distribution of the inert gas purging system 37 greatly improves the cooling efficiency compared with the single-point air supply mode. Through the present scheme, the atmospheric exposure pollution during the substrate cooling process is effectively avoided, and the forced convection of inert gas in the vacuum environment realizes rapid and uniform cooling. The multi-layer rack structure and the rotating and lifting mechanism work cooperatively, and more than 50 substrates can be processed at a time, which meets the demand of large batch production. The split cavity design realizes the physical isolation of the cooling process and other process modules, and ensures the parallel processing capacity of the system.

[0048] In combination with Figure 5The RF cleaning module 4 described in the embodiment includes a second vacuum outer cavity 41, a second multi-layer rack 42 arranged in the second vacuum outer cavity 41 and a corresponding second rack base 43, the second rack base 43 being connected to a second rotating system 44 to drive the rack to rotate, and a second lifting transmission system 45 arranged on the second rotating system 44 to drive the rack to lift; the second vacuum outer cavity 41 is divided into a second upper vacuum cavity 411 and a second lower vacuum cavity 412, and the second lower vacuum cavity 412 is connected to the main vacuum cavity 21 through a second isolation slit valve 46; the second upper vacuum cavity 411 is connected to an RF module, which includes an RF processing unit 47, an air inlet path 48 and an RF circuit module 49, for delivering plasma to the cavity for cleaning treatment, and a heater 410 is arranged in the second upper vacuum cavity 411; a second dry pump 413 is arranged at the bottom of the second lower vacuum cavity 412 for air extraction.

[0049] The second vacuum outer cavity 41 is a vacuum sealing structure made of metal material, and the internal space is divided into two independent vacuum areas. The second multi-layer rack 42 is a substrate placing device with multiple bearing surfaces, which can be realized by a ceramic tray structure arranged in a ring shape, and the distance between each layer of tray is controlled by precise mechanical processing. The second rotating system 44 is a mechanical device for driving the rack to rotate around the central axis, which can be realized by a servo motor combined with a reduction gear box, and the rotating speed can be adjusted to adapt to different process requirements. The second lifting transmission system 45 is a transmission mechanism for driving the rack to move vertically, which can be realized by a combination structure of lead screw guide rail and stepping motor, and the lifting stroke is controlled by encoder feedback. The second isolation slit valve 46 is a sealing valve connecting two vacuum cavities 21, which forms a material transmission channel when the valve body is opened. The RF module is a device for generating high-frequency electromagnetic field, which can be realized by combining a 13.56MHz RF power supply and a matching network, and is connected to the electrode in the cavity through a coaxial cable. The heater 410 is a heat source device for maintaining the temperature of the cavity, and the temperature is controlled by a thermocouple closed loop. The second dry pump 413 is an air extraction equipment for maintaining the vacuum environment.

[0050] Specifically, the substrate enters the second lower vacuum cavity 412 through the second isolation slit valve 46, and is stacked on the second multi-layer rack 42 layer by layer. After the stacking is completed, the second lifting transmission system 45 lifts the second multi-layer rack 42 to the second upper vacuum cavity 411. At this time, the second rotating system 44 drives the rack to rotate at a constant speed, the RF module is started and generates uniform plasma in the cavity, and the contaminants adsorbed on the surface of the substrate are decomposed and peeled off under the bombardment of the plasma. The heater 410 works synchronously to maintain the temperature of the cavity in a set range, so as to avoid unstable cleaning effect caused by temperature fluctuation. After cleaning is completed, the second dry pump 413 removes the reaction by-products from the cavity, the second lifting transmission system 45 lowers the rack back to the second lower vacuum cavity 412, and the substrate is transported to the next module through the isolation slit valve. The whole process is continuously completed in a vacuum environment, and the lifting and rotating actions of the rack realize batch processing of multiple substrates.

[0051] By designing the independent vacuum cavity 21 and the isolation valve, the cleaning process is completely carried out in a closed vacuum environment, and the atmospheric exposure link is eliminated. The cleaning area and the transmission area are separated into upper and lower vacuum cavities, the separation operation of process treatment and material turnover is realized, the substrate completes efficient cleaning pretreatment in a vacuum environment, and the introduction of particle contaminants caused by atmospheric exposure is avoided. The multi-layer rack cooperates with the rotating and lifting mechanism to improve the processing amount per unit time, the independent vacuum cavity 21 design guarantees the stability of the cleaning process, the upper and lower cavity separation structure enables the cleaning and transmission processes to be carried out synchronously, and the process cycle is significantly shortened. The synergy of plasma cleaning and temperature control improves the uniformity of surface treatment, and provides a clean substrate surface state for the subsequent ALD process.

[0052] In combination Figure 6 , the stacking preheating module 5 described in the embodiment includes a third vacuum outer cavity 51, a third rack base 53 adapted to place a third multi-layer rack 52 arranged in the third vacuum outer cavity 51, a third rotating system 54 connected to the third rack base 53 to drive the third multi-layer rack 52 to rotate, and a third lifting transmission system 55 arranged on the third rotating system 54 to drive the third multi-layer rack 52 to lift; the third vacuum outer cavity 51 includes a third upper vacuum cavity 511 and a third lower vacuum cavity 512, the third lower vacuum cavity 512 is connected with the vacuum cavity 21 through a third isolation slit valve 56, and the third lifting transmission system 55 drives the third multi-layer rack 52 to lift between the third upper vacuum cavity 511 and the third lower vacuum cavity 512; a first heating system 57 is arranged in the third upper vacuum cavity 511 to preheat the substrate in the third multi-layer rack 52, and a third dry pump 58 is arranged at the bottom of the third lower vacuum cavity 512.

[0053] The third vacuum outer cavity 51 refers to a vacuum container composed of a third upper vacuum cavity 511 and a third lower vacuum cavity 512. The third isolation slit valve 56 refers to a vacuum sealing device connecting the vacuum transmission system 2 and the third lower vacuum cavity 512. The third lifting transmission system 55 refers to a mechanism for driving the third multi-layer rack 52 to move vertically, which can specifically adopt a servo motor cooperating with a ball screw to realize precise lifting positioning, so that the substrates are stacked in layers in the preheating cavity. The third dry pump 58 refers to a gas extraction device for maintaining the vacuum degree of the third lower vacuum cavity 512, realizing rapid vacuumization. The substrate enters the third lower vacuum cavity 512 through the vacuum manipulator 22 via the third isolation slit valve 56 and is stacked on the third multi-layer rack 52 layer by layer, and then the third lifting transmission system 55 lifts the third multi-layer rack 52 to the third upper vacuum cavity 511. The first heating system 57 uniformly heats the stacked substrates, and the third rotating system 54 drives the rack to rotate to make the substrates uniformly heated. After preheating is completed, the rack is lowered back to the third lower vacuum cavity 512, and the substrate is transferred to the subsequent process module through the vacuum transmission system 2. The whole process is completed in a vacuum environment, and the third dry pump 58 continuously extracts the gas byproducts in the cavity, and the third isolation slit valve 56 maintains vacuum sealing in the transmission gap.

[0054] The present scheme realizes the whole process of substrate transmission and preheating in a vacuum environment through the cooperation of the independent vacuum cavity 21 and the isolation slit valve, avoiding contact with the atmosphere. The split cavity design cooperates with the lifting system to realize multi-layer stacking processing, and the processing efficiency is significantly improved. The independently arranged third dry pump 58 can discharge the gas generated during preheating, preventing cross contamination between different process modules. The particle pollution problem caused by exposure of the substrate to the atmosphere during preheating is effectively eliminated, and batch preheating is realized through multi-layer stacking processing in a vacuum environment, greatly improving the processing efficiency. The cooperation of the independent vacuum cavity 21 and the isolation slit valve enables the preheating module and other process modules to run in parallel, breaking through the efficiency bottleneck that the process steps of traditional equipment must be processed in series. The independent arrangement of the third dry pump 58 avoids pollution of volatile substances generated during the preheating process to other modules, ensuring process cleanliness.

[0055] In combination with Figure 7The ALD module 6 described in the embodiment includes a fourth vacuum outer cavity 61, a fourth multi-layered rack 62 and a fourth rack base 63 arranged in the fourth vacuum outer cavity 61, a fourth rotating system 64 connected to the fourth rack base 63 for driving the rack to rotate, and a fourth lifting transmission system 65 for driving the rack to lift. The fourth vacuum outer cavity 61 is divided into a fourth upper vacuum cavity 611 and a fourth lower vacuum cavity 612, and the fourth lower vacuum cavity 612 is connected to the vacuum transmission system 2 through an isolation slit valve. The fourth upper vacuum cavity 611 is connected to an air inlet system 67 and transports process gas into the cavity through an air inlet pipe 69, and a second heating system 68 is arranged therein. An air outlet with a filter 610 is arranged on the side of the fourth upper vacuum cavity 611 away from the air inlet pipe 69, and a fourth dry pump 613 is connected for air exhaust.

[0056] The fourth multi-layered rack 62 refers to a bearing device with a vertical stacking structure, which can be implemented by a combination of ceramic trays with positioning slots, and can simultaneously carry multiple substrates for batch processing. The fourth rotating system 64 refers to a mechanism for driving the rack to rotate around the shaft, which can be implemented by a stepper motor cooperating with a harmonic reducer, so that the substrate surface uniformly contacts the reaction gas. The fourth lifting transmission system 65 refers to a device for realizing the vertical movement of the rack, which can be implemented by a ball screw cooperating with a linear guide rail, and is used to control the transfer path of the substrate between the upper and lower vacuum cavities. The filter 610 is a purification device for trapping unreacted particles, which can be implemented by a porous ceramic filter element or a metal sintered filter screen, to prevent microparticles in the process exhaust gas from polluting the vacuum system.

[0057] The substrate enters the fourth lower vacuum cavity 612 in a vacuum state through the isolation slit valve and is stacked, and then the fourth lifting transmission system 65 lifts the fourth multi-layered rack 62 loaded with the substrate to the fourth upper vacuum cavity 611. After the substrate is heated to the set temperature by the second heating system 68, the fourth rotating system 64 drives the rack to rotate at a constant speed. The air inlet system 67 injects process gas into the fourth upper vacuum cavity 611 through the air inlet pipe 69, and the surface of the rotating substrate realizes laminar flow under the joint action of the air distribution pipe and the fluid cavity. When the unreacted gas and by-products are discharged through the air outlet, the filter 610 traps solid particles, and the fourth dry pump 613 maintains the vacuum degree of the cavity and discharges the purified exhaust gas. After deposition is completed, the fourth lifting transmission system 65 lowers the rack back to the fourth lower vacuum cavity 612, and the substrate is transferred to the next module through the isolation slit valve. The ALD device described herein also has a source cabinet 7 arranged thereon for supplying process reaction source gas to the air inlet system 67.

[0058] The independent vacuum outer cavity and the isolation slit valve cooperate to keep the substrate in a vacuum protection state throughout. The multi-layer rack and the lifting transmission system realize continuous processing of batch substrates, the rotating system and the directional airflow design ensure deposition uniformity, and the filter 610 and the dry pump combination effectively control process waste gas pollution. The problem of particle pollution caused by exposure of the substrate to the atmosphere is solved, and damage to the vacuum system caused by residual process gas is avoided. The multi-layer rack structure realizes continuous processing of batch substrates in a vacuum environment, the rotating mechanism and the directional airflow improve deposition uniformity, and the independently controlled upper and lower vacuum cavities 21 realize spatial separation of process steps, reducing environmental interference during different processing stages.

[0059] In this embodiment, maintenance doors 614 are provided on the vacuum outer cavities of the stack cooling module 3, the stack preheating module 5, the RF cleaning module 4, and the ALD module 6 to facilitate maintenance. The maintenance door 614 refers to a sealable structure provided on the vacuum outer cavity, which can be implemented by a hinged door or a sliding door with a vacuum sealing ring. The edge of the door is provided with multiple layers of metal sealing rings and is equipped with a pneumatic locking mechanism. In the closed state, the maintenance door 614 forms a complete sealed interface with the vacuum outer cavity, and in the open state, it forms an independent maintenance channel. When maintenance needs to be performed, the vacuum outer cavity of the target module is isolated, and the maintenance door 614 is opened separately to form a local maintenance space. Maintenance personnel directly access the internal components of the module through the maintenance door 614 for cleaning or replacement, while the vacuum environment of adjacent modules remains intact.

[0060] The modular maintenance door 614 design allows maintenance operations on individual modules to be completed in an isolated area, while other modules can remain in a vacuum operating state. Only the target module needs to be partially depressurized during maintenance, avoiding repeated vacuuming of the entire vacuum system. This allows independent maintenance of each functional module without disrupting the vacuum environment of the vacuum transmission system 2 and other modules during maintenance. The sealing structure of the maintenance door 614 and the vacuum outer cavity effectively prevents external contaminants from entering the vacuum system, and the vacuum recovery time of the module after maintenance is shortened. Maintenance operations on each module can be carried out in parallel without interfering with each other, improving the overall operating efficiency of the equipment. During maintenance, there is no need to disassemble the vacuum cavity 21 connection components, reducing the risk of damage to the sealing surface.

[0061] In the above embodiment, the multi-layer rack in the stack cooling module 3, the stack preheating module 5, the RF cleaning module 4, and the ALD module 6 is provided with no less than 50 layers. The multi-layer rack refers to a vertical stacking structure of the bearing device, which can be implemented by a metal frame structure with interlayer spacing. Each layer is provided with a positioning groove or a buckle to fix substrates of different sizes. This structure increases the number of layers in the vertical direction, allowing a single module to accommodate more substrates simultaneously. By increasing the density of the stack, the single processing capacity is improved, and the number of substrate transfers is reduced.

[0062] The substrates are batch processed in a stacked manner within each module, for example, in the preheating module, the multi-layer rack sends the substrates into the heating area layer by layer through the lifting system to achieve continuous preheating; in the ALD module 6, the process gas is uniformly distributed through the gaps of the multi-layer rack, and the multiple substrates are coated at the same time. Due to the increase in the number of layers of the rack in each module, the substrates do not need to be frequently transferred between modules, thereby avoiding repeated switching between vacuum and atmospheric environments.

[0063] In some embodiments, the interlayer spacing of the multi-layer rack is adjustable, for example, different customized racks are used to accommodate the placement requirements of substrates of different sizes from 4 inches to 12 inches. The rack frame is made of high-strength and high-temperature-resistant titanium alloy material to withstand the high-temperature environment in the preheating and ALD processes.

[0064] Embodiment 2

[0065] The application further proposes an efficient ALD process using an ALD device capable of mounting multiple chambers to perform multitask processing, including the following steps: layer by layer, the substrates are transferred from the EFEM loading system 1 to the stack cooling module 3 for stacking; the substrates in the stack cooling module 3 are transferred to the RF cleaning module 4 for stacking and cleaning treatment by the vacuum manipulator 22; after cleaning, the substrates are transferred to the stack preheating module 5 for stacking and preheating to a preset temperature; then the preheated substrates are transferred to the ALD module 6 for stacking and real-time ALD process by the vacuum manipulator 22; after the process is completed, the stack cooling module 3 is unloaded to stack and cool the processed substrates; after cooling is completed, the processed substrates are unloaded by the EFEM loading system 1; repeat the above steps.

[0066] The substrates are first loaded in the clean environment of the EFEM loading system 1, and are transferred to the stack cooling module 3 for temporary storage by the atmospheric manipulator 13. The manipulator of the vacuum transfer system 2 sequentially transfers the substrates to the RF cleaning module 4 for surface treatment, then to the preheating module for temperature adjustment, and then to the ALD module 6 for coating process. The coated substrates return to the cooling module for cooling, and then are unloaded by the EFEM system. Each module is environmentally isolated by independent vacuum chambers 21 and isolation valves, so that the cleaning, preheating, coating and cooling steps can be performed simultaneously. The substrates are in a vacuum or inert gas protection environment throughout the process, avoiding contact with the atmosphere to produce particle contamination. The unloaded state of the stack cooling module 3 allows it to immediately receive the processed substrates, ensuring that the processing pace of each module matches, forming an uninterrupted assembly line operation.

[0067] It should be noted that when the substrate is loaded, the EFEM loading system 1 can continue to load when the substrate is transmitted from the stack cooling module 3 to the RF cleaning module 4 for cleaning, and can be paused when the substrate is reacted in the ALD module 6, to provide space for unloading and cooling; during the cooling process, the ALD module 6 is stacked again for reaction. By controlling the time interval, the idle time of other modules in the device can be reduced, thereby improving the process efficiency. When the stack cooling module 3 is about to carry the substrate transmitted from the ALD module 6, the inert gas purging system 37 in the stack cooling module 3 is opened in advance to purge and clean the first vacuum cavity 21, to prevent the residue of particles during the loading process from affecting the cleanliness of the reacted substrate.

[0068] Compared with the prior art, the conventional process needs to sequentially perform cleaning, preheating, coating and cooling steps in the same cavity, and the vacuum environment needs to be destroyed every time the substrate is loaded, which causes the substrate to be repeatedly exposed to the atmosphere. The process disclosed in the present application eliminates the waiting time between process steps through multi-module parallel processing, while maintaining a vacuum environment throughout the process to avoid the risk of particle contamination. In the prior art, the rack needs to be switched between different temperature and pressure environments, which can cause the coating layer to fall off, while in the present application, the process parameters of each module are independently controlled to eliminate the impact of environmental changes on the substrate.

[0069] Through the above technical solutions, particle contamination during substrate processing is effectively controlled, and process efficiency is improved through multi-module parallel operation. The continuity of the vacuum environment ensures the stability of the coating layer quality, and the multi-layer rack structure realizes batch processing and meets the production needs of substrates of different sizes. The modular design reduces the repeated configuration of the equipment and reduces the hardware cost.

[0070] It should be understood that: the above is only a preferred embodiment of the present application, the protection scope of the present application is not limited to the above-mentioned embodiments, any technical solution falling within the scope of the present application is within the protection scope of the present application.

[0071] The above description of the drawings used in the embodiments only shows some embodiments of the present application, and should not be considered as limiting the scope. For those skilled in the art, other related drawings can be obtained from the above drawings without creative labor.

Claims

1. An ALD apparatus capable of mounting multiple chambers to perform multitasking processing, characterized by, The application relates to a vacuum processing system, which comprises an EFEM loading system, a vacuum transmission system, and a stack cooling module, a stack preheating module, an RF cleaning module and an ALD module which are connected to the vacuum transmission system through isolation slit valves and can independently operate; wherein the vacuum transmission system is suitable for controlling the transmission of substrates between the modules through a vacuum manipulator; the EFEM loading system is connected to the stack cooling module to realize the loading and unloading process of the substrates; the RF cleaning module is suitable for pre-cleaning the substrates; the stack preheating module is suitable for preheating the substrates before processing; the stack cooling module is suitable for cooling the substrates after ALD equipment processing and receiving the substrates transmitted by the EFEM loading system during loading. The EFEM loading system comprises a rack and a plurality of loading and unloading modules, an atmospheric manipulator, a calibration module and a high-efficiency filtering system arranged on the rack; wherein the atmospheric manipulator is suitable for transmitting the substrates between the loading and unloading modules, the calibration module and the cooling stack module; the calibration module is suitable for correcting the center of the substrates and detecting the substrates; and the high-efficiency filtering system is used for keeping the cleanliness in the EFEM loading system within a set range. The vacuum transmission system comprises a vacuum cavity, a vacuum manipulator arranged in the vacuum cavity, and a plurality of isolation slit valves arranged on the periphery of the vacuum cavity to connect the vacuum cavity with the stack cooling module, the stack preheating module, the RF cleaning module and the ALD module; the vacuum manipulator is suitable for passing through the channels of the isolation slit valves to transmit the substrates between the stack cooling module, the stack preheating module, the RF cleaning module and the ALD module. The stack cooling module comprises a first vacuum outer cavity and a first rack base suitable for placing a first multi-layer rack arranged in the first vacuum outer cavity; the first rack base is connected with a first rotating system for driving the first multi-layer rack to rotate; and a first lifting transmission system is arranged on the first rotating system for driving the first multi-layer rack to lift. The first vacuum outer cavity comprises a first upper vacuum cavity and a first lower vacuum cavity; wherein the first lower vacuum cavity is connected with the vacuum cavity through a first isolation slit valve; the first lifting transmission system is suitable for driving the first multi-layer rack to lift between the first upper vacuum cavity and the first lower vacuum cavity; the upper end side of the first upper vacuum cavity is connected with an inert gas purging system which is connected into the first upper vacuum cavity through a cooling purging cloth gas pipe; a plurality of gas outlet channels are arranged along the height direction of the first multi-layer rack on the cooling purging cloth gas pipe to improve the purging and cooling efficiency; and a first dry pump for air exhaust is arranged at the bottom of the first lower vacuum cavity. ​ ​ 2. The ALD apparatus of claim 1, wherein, ​ 3. The ALD apparatus of claim 1, wherein, ​ 4. The ALD apparatus of claim 1, wherein, ​ ​ 5. The ALD apparatus of claim 1, wherein, The RF cleaning module comprises a second vacuum outer cavity, and a second rack base adapted to place a second multi-layer rack is arranged in the second vacuum outer cavity, the second rack base is connected with a second rotating system for driving the second multi-layer rack to rotate; and a second lifting transmission system is arranged on the second rotating system for driving the second multi-layer rack to lift; the second vacuum outer cavity comprises a second upper vacuum cavity and a second lower vacuum cavity; wherein the second lower vacuum cavity is connected with the vacuum cavity through a second isolation slit valve; the second lifting transmission system is adapted to drive the second multi-layer rack to lift between the second upper vacuum cavity and the second lower vacuum cavity; one side of the second upper vacuum cavity is connected with an RF module, the RF module comprises an RF processing unit, and an air inlet gas circuit and an RF circuit module connected on the RF processing unit, so as to deliver plasma to the second upper vacuum cavity to clean and pretreat the substrate in the second multi-layer rack; and a heater is arranged in the second upper vacuum cavity; A second dry pump for pumping is arranged at the bottom of the second lower vacuum cavity.

6. The ALD apparatus of claim 1, wherein, The stack preheating module comprises a third vacuum outer cavity, and a third rack base adapted to place a third multi-layer rack is arranged in the third vacuum outer cavity, the third rack base is connected with a third rotating system for driving the third multi-layer rack to rotate; and a third lifting transmission system is arranged on the third rotating system for driving the third multi-layer rack to lift; The third vacuum outer cavity comprises a third upper vacuum cavity and a third lower vacuum cavity; wherein the third lower vacuum cavity is connected with the vacuum cavity through a third isolation slit valve; the third lifting transmission system is adapted to drive the third multi-layer rack to lift between the third upper vacuum cavity and the third lower vacuum cavity; a first heating system is arranged in the third upper vacuum cavity, and the heating system is adapted to preheat the substrate in the third multi-layer rack; a third dry pump for pumping is arranged at the bottom of the third lower vacuum cavity.

7. The ALD apparatus of claim 1, wherein, The ALD module comprises a fourth vacuum outer cavity, and a fourth rack base adapted to place a fourth multi-layer rack is arranged in the fourth vacuum outer cavity, the fourth rack base is connected with a fourth rotating system for driving the fourth multi-layer rack to rotate; and a fourth lifting transmission system is arranged on the fourth rotating system for driving the fourth multi-layer rack to lift; the fourth vacuum outer cavity comprises a fourth upper vacuum cavity and a fourth lower vacuum cavity; wherein the fourth lower vacuum cavity is connected with the vacuum cavity through a fourth isolation slit valve; the fourth lifting transmission system is adapted to drive the fourth multi-layer rack to lift between the fourth upper vacuum cavity and the fourth lower vacuum cavity; an air inlet system is connected on the upper end of the fourth upper vacuum cavity, the air inlet system is connected to the fourth upper vacuum cavity through an air inlet pipe to make the process gas purge the substrate in the fourth multi-layer rack to react; and a second heating system is arranged in the fourth upper vacuum cavity; A gas outlet is arranged on the side of the fourth upper vacuum cavity away from the gas inlet pipe, the gas outlet is connected with a filter, and the filter is connected with a fourth dry pump for air extraction.

8. The ALD apparatus of claim 1, wherein, The vacuum outer cavities of the stack cooling module, the stack preheating module, the RF cleaning module, and the ALD module are provided with maintenance doors for facilitating maintenance.

9. The ALD apparatus of claim 1, wherein, The multi-layer racks in the stack cooling module, the stack preheating module, the RF cleaning module, and the ALD module are arranged with no less than 50 layers.

10. A high efficiency ALD process, characterized by, The ALD device capable of mounting and processing multiple tasks in multiple cavities according to any one of claims 1-9 comprises the following steps: S1, transferring the substrates from the EFEM loading system to the stack cooling module layer by layer for stacking; S2, transferring the substrates in the stack cooling module to the RF cleaning module for stacking and cleaning treatment by a vacuum manipulator; After cleaning, the substrates are transferred to the stack preheating module for stacking and preheating to a preset temperature, and then the preheated substrates are transferred to the ALD module for stacking and ALD process by the vacuum manipulator; After the process is completed, the stack cooling module is unloaded for transferring the processed substrates to the stack cooling module for stacking and cooling; After cooling is completed, the processed substrates are unloaded by the EFEM loading system; S3, repeating the steps of S1-S2.

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