Multi-layer silver paste printed circuit process
By using multi-layer silver paste printing circuit technology, the problems of large space occupation, unsightly appearance, and high cost of existing flexible circuit boards have been solved, resulting in smaller, more aesthetically pleasing, and more stable multi-layer circuit boards, filling a market gap.
Patent Information
- Application Number
- CN202511175415.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-21
- Publication Date
- 2025-11-25
AI Technical Summary
Existing flexible circuit boards are single-sided printed, resulting in large product sizes, occupying a lot of space, having an unattractive appearance, and high costs, which cannot meet the diverse market demands.
The process of printing circuits using multi-layer silver paste includes steps S1 to S16, which involves cutting, drilling, cleaning, printing silver paste and insulating ink, baking, and testing to form a multi-layer circuit structure. Specific materials and equipment are used for printing and processing.
It has achieved smaller, more aesthetically pleasing, more stable, and lower-cost multilayer circuit boards with a higher degree of flexibility than conventional FPC products.
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of circuit board, in particular to a kind of multilayer silver paste printing circuit process. BACKGROUND
[0002] The flexible circuit board in prior art is single-sided printed circuit board, its product design size is large, it is relatively space-occupying, appearance is not enough beautiful, and overall manufacturing cost is high.
[0003] With the diversification of circuit board application, product about conventional design single-sided conductive paste printed circuit board cannot satisfy the demand of existing market.Therefore, a kind of multilayer silver paste printing circuit process is proposed. SUMMARY
[0004] To solve the above technical problems, the present application provides a kind of multilayer silver paste printing circuit process, comprising the following steps: S1. blanking: according to design requirement, the base material of PET or PI material is cut into corresponding size; S2. drilling: the alignment hole used for printing and the via hole required by product design are drilled on the base material; S3. clean the base material: after blanking, the base material is cleaned using dust wheel, remove dust and foreign matter on the surface of base material, so that the surface of base material product is guaranteed clean; S4. front printing silver paste: according to alignment hole, a layer of conductive silver paste is printed on the front of incoming material base according to design requirement to form circuit; S5. baking: after printing, use box oven to bake 120℃ / 30min; S6. clean the base material: clean using dust wheel, remove dust and foreign matter on the surface of base material, so that the surface of base material product is guaranteed clean; S7. front printing insulating ink: a layer of insulating ink is printed on the front of base material except gold finger; S8. baking: after printing, use box oven to bake 120℃ / 30min; S9. back printing silver paste: according to alignment hole, a layer of conductive silver paste is printed on the back of incoming material base according to design requirement to form circuit; S10. baking: after printing, use box oven to bake 120℃ / 30min; S11. clean the base material: clean using dust wheel, remove dust and foreign matter on the surface of base material, so that the surface of base material product is guaranteed clean; S12. back printing insulating ink: insulating ink is printed on the back of base material; S13. baking: after printing, use box oven to bake 120℃ / 30min; S14. Test: the line is powered by a jig probe, the line performance of the product is measured, the defective products such as short circuit / break are separated, and the defective products are rejected; S15. Forming: according to the design drawing requirements, punching or laser forming into the required outer shape size of the finished product; S16. Inspection and delivery: the appearance of the formed product is inspected, the product that does not meet the customer's requirements is rejected, the good quality product is reserved, and the product is packaged according to the customer's requirements using a tray and other packaging methods and then delivered to the customer.
[0005] In step S4, the silver paste is stirred for 15 minutes before printing, and is left for 30 minutes, the silver paste printing thickness is 6-12um, a 325 mesh steel wire mesh is selected for making, the printing speed is 200mm / min, and the scraper hardness is 85.
[0006] In step S7, the insulating ink is stirred for 15 minutes before printing, and is left for 30 minutes, a 200 mesh nylon wire mesh is selected for making, the printing speed is 200mm / min, and the scraper hardness is 70.
[0007] In step S9, the silver paste is stirred for 15 minutes before printing, and is left for 30 minutes, the silver paste printing thickness is 6-12um, a 325 mesh steel wire mesh is selected for making, the printing speed is 200mm / min, and the scraper hardness is 85.
[0008] In step S12, the insulating ink is stirred for 15 minutes before printing, and is left for 30 minutes, a 200 mesh nylon wire mesh is selected for making, the printing speed is 200mm / min, and the scraper hardness is 70.
[0009] Through the above technical scheme, the multilayer silver paste printing line process of the application fills the gap in the existing market, the printing object of the line is PET or PI, the flexibility is better than that of the conventional FPC product, the product occupies less space and is more beautiful, meanwhile, the characteristics of the silver paste make the product more stable in use, and the cost is low. DETAILED DESCRIPTION
[0010] The technical solutions in the embodiments of the application will be clearly and completely described below.
[0011] The multilayer silver paste printing line process provided by the embodiments of the application comprises the following steps: S1. Cutting: according to the design requirements, the base material of PET or PI material is cut into corresponding size; S2. Drilling: drilling the alignment hole used for printing and the through hole required by the design of the product itself (used to make the silver paste printed on both sides pass through the through hole to conduct) on the base material; S3. Cleaning the substrate: After the substrate is unloaded, use a dust roller to clean it, remove dust and foreign matter on the surface of the substrate, and ensure that the surface of the substrate product is clean; S4. Front printing of silver paste: Stir the silver paste for 15 minutes before printing, stand for 30 minutes, align according to the alignment hole, print a layer of conductive silver paste on the front of the incoming substrate according to the design requirements to form a circuit, the silver paste printing thickness is 6-12um, select a 325 mesh steel wire mesh to make, the printing speed is 200mm / min, the squeegee hardness is 85; S5. Baking: After printing is completed, use a box oven to bake at 120℃ / 30min; S6. Cleaning the substrate: Use a dust roller to clean it, remove dust and foreign matter on the surface of the substrate, and ensure that the surface of the substrate product is clean; S7. Front printing of insulating ink: Stir the insulating ink for 15 minutes before printing, stand for 30 minutes, print a layer of insulating ink on the front of the substrate except for the gold fingers, select a 200 mesh nylon screen to make, the printing speed is 200mm / min, the squeegee hardness is 70; S8. Baking: After printing is completed, use a box oven to bake at 120℃ / 30min; S9. Back printing of silver paste: Stir the silver paste for 15 minutes before printing, stand for 30 minutes, align according to the alignment hole, print a layer of conductive silver paste on the back of the incoming substrate according to the design requirements to form a circuit, the silver paste printing thickness is 6-12um, select a 325 mesh steel wire mesh to make, the printing speed is 200mm / min, the squeegee hardness is 85; S10. Baking: After printing is completed, use a box oven to bake at 120℃ / 30min; S11. Cleaning the substrate: Use a dust roller to clean it, remove dust and foreign matter on the surface of the substrate, and ensure that the surface of the substrate product is clean; S12. Back printing of insulating ink: Stir the insulating ink for 15 minutes before printing, stand for 30 minutes, select a 200 mesh nylon screen to make, the printing speed is 200mm / min, the squeegee hardness is 70, print the insulating ink on the back of the substrate; S13. Baking: After printing is completed, use a box oven to bake at 120℃ / 30min; S14. Testing: Apply electricity to both ends of the circuit through a jig probe, measure the performance of the product circuit, separate short circuit / broken circuit and other defective products, and remove the defective products; S15. Forming: According to the design drawing requirements, punch or laser to form the required outer shape size of the finished product; S16. Inspection and delivery: After forming, the product is subjected to appearance inspection, and products that do not meet customer requirements are removed, and good quality products are retained, packaged according to customer requirements using trays and other packaging methods, and delivered to customers.
[0012] The multi-layer silver paste printed circuit process of the present application fills the gap in the existing market, the printing object of the circuit is PET or PI, the flexibility is better than the conventional FPC product, the product occupies less space, is more beautiful, meanwhile the characteristics of the silver paste make the product more stable in use, and the cost is low.
[0013] The above description of disclosed embodiments enables one of ordinary skill in the art to make or use the application. Various modifications to the above described embodiments will be apparent to those of ordinary skill in the art in view of the foregoing description, and the general principles described above can be implemented in other embodiments without departing from the spirit or scope of the present application. Accordingly, the present application is not intended to be limited to the implementations shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A multilayer silver paste printed wiring process, characterized by, Comprising the following steps: S1. Cutting: according to the design requirements, the base material of PET or PI material is cut into corresponding size; S2. Drilling: drilling the alignment hole used for printing and the through hole required by the design of the product itself on the base material; S3. Cleaning the base material: after cutting, the base material is cleaned by using a dust removal wheel to remove dust and foreign matter on the surface of the base material, so that the surface of the base material product is ensured to be clean; S4. Front printing of silver paste: according to the alignment hole, a layer of conductive silver paste is printed on the front of the incoming base material according to the design requirements to form a circuit; S5. Baking: after printing, the box oven is used for baking at 120℃ / 30min; S6. Cleaning the base material: cleaning is performed by using a dust removal wheel to remove dust and foreign matter on the surface of the base material, so that the surface of the base material product is ensured to be clean; S7. Front printing of insulating ink: a layer of insulating ink is printed on the front of the base material except for the gold fingers; S8. Baking: after printing, the box oven is used for baking at 120℃ / 30min; S9. Back printing of silver paste: according to the alignment hole, a layer of conductive silver paste is printed on the back of the incoming base material according to the design requirements to form a circuit; S10. Baking: after printing, the box oven is used for baking at 120℃ / 30min; S11. Cleaning the base material: cleaning is performed by using a dust removal wheel to remove dust and foreign matter on the surface of the base material, so that the surface of the base material product is ensured to be clean; S12. Back printing of insulating ink: insulating ink is printed on the back of the base material; S13. Baking: after printing, the box oven is used for baking at 120℃ / 30min; S14. Testing: the performance of the circuit is measured by applying electricity to both ends of the circuit through a jig probe, and defective products such as short circuit and open circuit are separated and removed; S15. Forming: according to the design drawing requirements, the required outer shape size of the finished product is punched or laser formed; S16. Inspection and delivery: after forming, the product is inspected for appearance, and products that do not meet customer requirements are removed, and good quality products are retained, packaged according to customer requirements using trays and other packaging methods, and delivered to customers.
2. The process for multilayer silver paste printed circuit according to claim 1, wherein, In step S4, the silver paste is stirred for 15min before printing, and is left for 30min, the silver paste printing thickness is 6-12um, a 325 mesh steel wire mesh is selected for making, the printing speed is 200mm / min, and the squeegee hardness is 85.
3. The process for multilayer silver paste printed circuit according to claim 1, wherein, In step S7, the insulating ink is stirred for 15min before printing, and is left for 30min, a 200 mesh nylon screen is selected for making, the printing speed is 200mm / min, and the squeegee hardness is 70.
4. The process for multilayer silver paste printed circuit according to claim 1, wherein, In step S9, the silver paste is stirred for 15min before printing, and is left for 30min, the silver paste printing thickness is 6-12um, a 325 mesh steel wire mesh is selected for making, the printing speed is 200mm / min, and the squeegee hardness is 85.
5. The process for multilayer silver paste printed circuit according to claim 1, wherein, In step S12, the insulating ink is stirred for 15min before printing, and is left for 30min, a 200 mesh nylon screen is selected for making, the printing speed is 200mm / min, and the squeegee hardness is 70.