Ion source position calibration method, system and equipment based on removal function and medium
By removing function spots through machining on the workpiece, calculating the interference error surface shape, and adjusting the ion source position, the problem of inaccurate ion source calibration was solved, thus improving the accuracy and processing quality of ion beam polishing.
Patent Information
- Application Number
- CN202511566415.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-30
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2045-10-30
AI Technical Summary
In existing technologies, the ion source position calibration is not precise enough during ion beam polishing, resulting in insufficient processing accuracy, which has a significant impact, especially in high-precision polishing.
By processing multiple removal function spots at preset symmetrical positions on the workpiece, surface shape data before and after processing are obtained, interference error surface shape is calculated, pixel center position information is extracted, and ion source position is adjusted to achieve precise calibration.
This improved the precision of ion beam polishing, ensured the quality of high-precision processing, and reduced processing errors.
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Figure CN121018296A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of optical processing, and more particularly to an ion source position calibration method, system, device and medium based on a removal function in ion beam polishing processes. Background Technology
[0002] Ultra-precision optical components have broad application prospects in high-end fields such as deep space exploration, laser systems, and advanced instruments. With the development of these fields, the requirements for the surface accuracy of optical components have reached the nanometer level or even higher. Ion beam polishing (IBF) uses an ion beam to process optical components, avoiding the problems of subsurface damage, polishing tool wear, and unstable removal function faced by traditional contact polishing methods. At the same time, based on the principle of ion sputtering to remove component material, ion beam polishing can achieve atomic-level polishing accuracy. Therefore, it is usually used as the final processing step for ultra-precision optical components.
[0003] The removal function of an ion beam is a rotationally symmetric continuous function with a maximum removal rate at its center. The removal rate has a single peak, and the removal rate decreases to zero as the radius increases; this is a two-dimensional Gaussian removal function. The actual removal function is obtained through point-to-point bombardment experiments.
[0004] Accurate calculation of the removal function is a prerequisite for achieving ultra-precision ion beam polishing, and its accuracy directly affects the final processing quality. Therefore, the removal function needs to be determined before ion beam polishing. Simultaneously, the alignment of the ion source position and the processing error are important factors affecting polishing accuracy. When the actual processing position of the ion source is not aligned with the ideal position, it will directly affect the quality of ion beam polishing and shaping. Especially after high-precision ion beam polishing and shaping, ion source position calibration is particularly important and directly affects the final processing accuracy.
[0005] Currently, existing technologies typically measure the ion source position indirectly using a Faraday cup. This is mainly achieved by scanning the Faraday cup with an ion beam to determine the position of maximum beam current as the center of the ion source. The position of the ion source is then indirectly determined by measuring the position of the Faraday cup. However, the indirectly determined ion source position is subject to measurement errors in the position of the Faraday cup, making it impossible to achieve highly accurate ion source position determination.
[0006] Therefore, providing an ion source position calibration method and system based on a removal function that can improve the accuracy of ion beam polishing is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention
[0007] To address the aforementioned technical problems, the present invention aims to provide a method, system, device, and medium for calibrating the ion source position of an ion beam polishing machine tool based on a removal function. The actual deviation between the removal function spot actually processed by the ion beam polishing machine tool and the workpiece center position is calculated, and the actual deviation is compensated for to achieve accurate calibration of the ion source position, thereby improving the precision of ion beam polishing.
[0008] The first objective of this invention is to provide an ion source position calibration method based on a removal function; The technical solution provided by this invention is as follows: An ion source position calibration method based on a removal function includes the following steps: Multiple removal function spots are processed at preset symmetrical positions on the workpiece; Obtain the surface profile data of the workpiece after machining, and calculate the difference between the surface profile data of the workpiece before machining to obtain the interference error surface profile after removing function spots; The pixel center position information of the removal function is extracted based on the interference error surface pattern; The pixel center position information of the workpiece is extracted based on the interference error surface pattern; The actual deviation of the spot in the removal function relative to the center position of the workpiece is determined based on the pixel center position information of the removal function and the pixel center position information of the extracted workpiece. Adjust the ion source position according to the actual deviation to complete the calibration.
[0009] Preferably, the preset symmetrical position specifically refers to four points distributed symmetrically along the coordinate axis direction with the center position of the workpiece as the origin of the coordinate axis, wherein two points are symmetrically distributed along the x-axis direction of the coordinate axis according to the symmetrical distance, and two points are symmetrically distributed along the y-axis direction of the coordinate axis according to the symmetrical distance.
[0010] Preferably, when performing the extraction of pixel center position information based on the interference error surface pattern to remove the function, the following steps are included: Based on the interference error surface pattern, a first image is generated by removing the function speckle, and the edge error and center error of the first image are removed to obtain a first image, wherein the first image contains only the function speckle. Extract the contour information of the removed function blob and the center coordinates of the smallest circumcircle of the removed function blob from the first image to obtain the first position information of the removed function blob; Based on the first position information and the center coordinates, it is determined whether there is a coordinate axis rotation error, and the first image is calibrated at an angle to obtain the standard position information of the removed function blob. The pixel distance of the removed function blob is calculated based on the standard position information. The pixel position of the removed function blob is calibrated according to the pixel distance of the removed function blob and the actual distance of the removed function blob, so as to obtain the pixel size of the removed function and calculate the pixel center position information of the removed function.
[0011] Preferably, the angle calibration includes: The phase angle of the removed function blob is calculated based on the first image, the rotation angle is determined by the arctangent function, and the removed function blob in the first image is rotated to obtain the second image; The second image is rotated and corrected so that the removed function blob is aligned with the standard coordinate axis, resulting in a third image and the standard position information of the removed function blob.
[0012] Preferably, the process of extracting the pixel center position information of the workpiece based on the interference error surface pattern includes the following steps: Generate an interference error measurement data image based on the interference error surface pattern; The interference error measurement data image is rotated according to the rotation angle, and the contour information of the interference error measurement data image is extracted; The pixel radius of the workpiece is calibrated based on the pixel size of the removal function and the actual size of the workpiece, and the pixel center position information of the workpiece is calculated by least squares method based on the pixel radius of the workpiece.
[0013] Preferably, when performing the step of determining the actual deviation of the removal function spot relative to the workpiece center position based on the pixel center position information of the removal function and the pixel center position information of the extracted workpiece, the specific steps include: The pixel deviation is obtained by calculating the pixel center position information of the workpiece and the pixel center position information of the removal function, wherein the pixel deviation includes lateral deviation and longitudinal deviation; The pixel deviation is converted into the actual physical distance to obtain the actual deviation.
[0014] The second objective of this invention is to provide an ion source position calibration system based on a removal function; The technical solution provided by this invention is as follows: An ion source position calibration system based on a removal function includes: The processing module is used to generate removal function spots at preset positions on the workpiece; The measurement module is used to acquire the surface profile data of the workpiece before and after processing and generate the interference error surface profile of the removed function spots; The processing module is used to extract the pixel center position information of the removal function blob and the pixel center position information of the workpiece based on the interference error surface pattern, and to calculate the actual deviation. The calibration module is used to adjust the processing position of the ion source according to the actual deviation.
[0015] Preferably, the processing module includes an image processing unit for removing edge noise and center noise from the image generated based on the interference error surface pattern, extracting the contour of the image, and performing angle calibration on the image.
[0016] The third objective of this invention is to provide a computer device; The technical solution provided by this invention is as follows: A computer device includes a memory and a processor, the memory storing a computer program, the processor executing the method steps of any one of the ion source position calibration methods based on the removal function.
[0017] A fourth objective of this invention is to provide a computer-readable storage medium; The technical solution provided by this invention is as follows: A computer-readable storage medium having a computer program stored thereon, the computer program being executed by a processor using the method steps of any one of the ion source position calibration methods based on the removal function.
[0018] This invention provides an ion source position calibration method based on a removal function, comprising the following steps: processing multiple removal function spots at a preset symmetrical position on the workpiece; acquiring the surface profile data of the workpiece after processing, and calculating the interference error surface profile of the removal function spots by subtracting it from the surface profile data of the workpiece before processing; extracting the pixel center position of the removal function and the pixel center position of the workpiece based on the interference error surface profile; determining the actual deviation of the removal function spots relative to the center position of the workpiece based on the pixel center position of the removal function and the extracted pixel center position of the workpiece; and adjusting the ion source position according to the actual deviation to complete the calibration. Compared with the prior art, the ion source position calibration method based on a removal function of this invention achieves the effect of improving the accuracy of ion beam polishing by calculating the actual deviation through the actual processing of the removal function spot positions and performing deviation compensation calibration on the ion source position. This system has the same beneficial effect.
[0019] The present invention also provides an ion source position calibration system based on a removal function. Since this system and the ion source position calibration method based on a removal function solve the same technical problem and belong to the same technical concept, they should have the same beneficial effects, and will not be described in detail here. Attached Figure Description
[0020] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 This is a flowchart of an ion source position calibration method based on a removal function in an embodiment of the present invention; Figure 2 This is the original image with the blob removal function in this embodiment of the invention; Figure 3 These are images (a) and (b) after edge error removal from the original image based on the removal function blob removal method in this embodiment of the invention. Figure 4 This is the second image in an embodiment of the present invention; Figure 5 This is a second image that requires coordinate axis alignment in an embodiment of the present invention; Figure 6 This is an image of the interference error measurement data in an embodiment of the present invention; Figure 7 This is an image obtained by rotating the interference error measurement data image according to an embodiment of the present invention. Figure 8 The image obtained by contour extraction based on the rotated interferometric error measurement data image in this embodiment of the invention; Figure 9 The image obtained by calibrating the pixel center position information of the workpiece based on the interference error measurement data image after contour extraction in this embodiment of the invention; Figure 10 The image shows the original interference error surface pattern of the workpiece processed based on the loss function speckle in the experimental data. Figure 11 The image shows the interference error surface profile of the workpiece after ion source position correction based on the method of this application, as presented in the experimental data. Figure 12 This is a schematic diagram of an ion source position calibration system based on a removal function in an embodiment of the present invention; Figure 13 This is an internal structural diagram of a computer device according to an embodiment of the present invention. Detailed Implementation
[0022] To enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0023] like Figure 1 As shown, this embodiment of the invention provides an ion source position calibration method based on a removal function, comprising the following steps: S1. Process multiple removal function spots at preset symmetrical positions on the workpiece; Before step S1, the surface profile data before processing is measured by an interferometer; in step S1, multiple removal function spots are processed at symmetrical positions with the workpiece center as the origin of the coordinate axis using an ion beam machine tool.
[0024] Preferably, the preset symmetrical position in step S1 is specifically: four points distributed symmetrically along the coordinate axis direction with the center position of the workpiece as the origin of the coordinate axis, wherein two points are symmetrically distributed along the x-axis direction with symmetrical distance, and two points are symmetrically distributed along the y-axis direction with symmetrical distance. As one implementation method, four removal function spots are processed at four symmetrical points with the workpiece center as the origin of the coordinate axis using an ion beam machine tool. That is, removal function spots are processed at equal distances from the workpiece center in all directions. The distance is generally determined according to the actual size of the workpiece, and is generally 30-50mm. For example, the coordinates of the four points can be: (0,50), (0,-50), (50,0), (-50,0). The spot processing time is determined according to the actual working conditions. For example, the spot processing time can be 120s. S2. Obtain the surface profile data of the workpiece after processing, and calculate the difference between the surface profile data of the workpiece before processing to obtain the interference error surface profile after removing the function spots. In step S2, the surface profile data after processing is measured by an interferometer, and the difference between the surface profile data after workpiece processing and the surface profile data before workpiece processing is calculated to obtain the interference error surface profile after removing function speckles.
[0025] S3. Extract pixel center position information based on interference error surface pattern and removal function; Preferably, step S3 includes the following steps: S3.1. Generate the original image of the removed function blob based on the interference error surface pattern, and remove the edge error and center error of the original image of the removed function blob to obtain the first image, wherein the first image contains only the removed function blob; In practical applications, MATLAB is used to read the interference error surface pattern data of the removal function. Based on the depth information of the interference error surface pattern, the origin coordinates of the original image of the removed function blob are set. Then, based on the origin coordinates, the depth information of the interference error surface pattern is read to generate the original image of the removed function blob, such as... Figure 2 As shown in the figure, P1, P2, P3, and P4 are four blobs generated by the removal function. Edge error removal is then performed on the original image of the generated blobs, depending on the specific circumstances. Figure 3 As shown in (a); then, center error removal is performed to obtain the first image with only four removed function blobs, as shown in (a). Figure 3 As shown in (b). Edge error removal: First, read the matrix size of the original image of the blob removal function, and then set all the matrices outside the edge to zero by setting the size of the edge, which will appear black on the image, thus removing the edge error; similarly, the removal of the center error is also done in this way, by setting the size of the center region.
[0026] S3.2 Extract the contour information of the removed function blob and the center coordinates of the smallest circumcircle of the removed function blob from the first image to obtain the first position information of the removed function blob; As one implementation, the center coordinates of the smallest circumcircle after removing function blobs are the center coordinates of the four smallest circumcircles after removing function blobs.
[0027] S3.3. Determine whether there is a coordinate axis rotation error based on the first position information and center coordinates, and perform angle calibration on the first image to obtain the standard position information for removing function blobs; Preferably, the angle calibration in step S3.3 includes: S3.3.1 Calculate the phase angle of the removed function blob based on the first image, determine the rotation angle through the arctangent function, and rotate the removed function blob in the first image to obtain the second image; In practical applications, determining whether rotation exists during image measurement based on the four-point coordinates of the first position information of the removed function speckles includes: calculating the phase angle between the removed function speckles; determining whether P1 and P2 are on a straight line and whether P1 and P2 are on the x-axis or y-axis of the first image's coordinate system based on the phase angle; if rotation is determined to exist, calculating the arctangent angle based on the center coordinates of points P1 and P2 as the rotation angle, and rotating the removed function speckles in the first image to obtain the second image, as shown below. Figure 4As shown, the rotation angle is generally a smaller angle, including the rotation angle with respect to the x-axis and the y-axis of the first image coordinate system. The phase angle is calculated as follows: extract the positions of the four removed function spots, then determine the positions of the upper and lower spots using their coordinates. Calculate the angle between the upper and lower spots and the standard y-axis vertical line based on their coordinates; this is the rotation angle. Then, perform the rotation transformation.
[0028] S3.3.2. Perform rotation correction on the second image to align the removed function blobs with the standard coordinate axes, thereby obtaining the third image and the standard position information of the removed function blobs.
[0029] In practical applications, determining whether image measurement involves rotation based on the four-point coordinates of the first position information of the removed function blobs also includes: determining whether the removed function blobs have an angle with the standard coordinate axes of the second image. The standard coordinate axes are generally defined as the positive x-axis pointing to the right and the positive y-axis pointing upwards. For example, if the second image is as follows... Figure 5 As shown, the image needs to be rotated again to align the removed function blobs with the standard coordinate axes, thus obtaining the standard position information of the removed function blobs.
[0030] S3.4 Calculate the pixel distance of the removed function blob based on the standard position information. According to the pixel distance of the removed function blob and the actual distance of the removed function blob, the pixel position of the removed function blob is calibrated to obtain the pixel size of the removed function and the pixel center position information of the removed function is calculated.
[0031] In practical applications, based on the position coordinates of the standard position information of P1~P4, the pixel distance between P1 and P2 is calculated. Then, based on the actual distance of the removed function spots, the pixel distance of each single point of the removed function spot is calculated, and pixel calibration is performed to obtain the pixel size of the removed function. Next, the pixel center position of the removed function spots is calculated, with the center of P1 and P2 as the y-axis center and the center of P3 and P4 as the x-axis center. Pixel calibration specifically involves: for example, calculating the pixel distance between two removed function spots based on their vertical positions. Then, since the actual distance between these two spots on the machine tool is known, the ratio between the pixel distance and the actual distance can be obtained.
[0032] S4. Extract the pixel center position information of the workpiece based on the interference error surface pattern; Preferably, step S4 includes the following steps: S4.1 Generate an image of the interferometric error measurement data based on the interferometric error surface pattern; In practical applications, MATLAB is used to read the interference error surface pattern data after removing the interference error function. Based on the depth information of the interference error surface pattern, the entire surface pattern data region is extracted to generate an interference error measurement data image, such as... Figure 6 As shown.
[0033] S4.2 Rotate the interference error measurement data image according to the rotation angle, and extract the contour information of the interference error measurement data image; In practical applications, the interference error measurement data image is rotated according to the rotation angle specified in step S3.3.1, resulting in the rotated interference error measurement data image as shown below. Figure 7 As shown; the contour information of the interferometric error measurement data image is extracted from the rotated interferometric error measurement data image, such as... Figure 8 As shown.
[0034] S4.3. Based on the pixel size of the removal function and the actual size of the workpiece, the pixel radius of the workpiece is calibrated, and the pixel center position information of the workpiece is calculated by least squares method based on the pixel radius of the workpiece.
[0035] In practical applications, the pixel radius of the workpiece is determined based on the pixel size of the removal function in step S3.4 and the actual size of the workpiece. The pixel center position information of the workpiece is then calculated using the least squares method based on the pixel radius. Figure 9 As shown.
[0036] S5. Determine the actual deviation of the spot in the removal function relative to the center position of the workpiece based on the pixel center position information of the removal function and the pixel center position information of the extracted workpiece. Preferably, step S5 specifically includes: S5.1 Calculate the pixel center position information of the workpiece and the pixel center position information of the removal function to obtain the pixel deviation, wherein the pixel deviation includes the horizontal deviation and the vertical deviation; S5.2 Convert the pixel deviation into the actual physical distance to obtain the actual deviation.
[0037] S6. Adjust the ion source position according to the actual deviation to complete the calibration.
[0038] This paper also demonstrates the effectiveness of the proposed method through experimental data. The specific workpiece type processed was a 100mm diameter fused silica workpiece. The experimental parameters were set as follows: power 100W, grid voltage 800V, accelerating grid voltage 123V, gas flow rate 11sccm, vacuum degree 5×10⁻²Pa, RF power 130W, and argon flow rate 5sccm. Figure 10It is known that a groove exists in the original interference error surface data of the workpiece processed based on the loss function speckle pattern, which is difficult to handle in ion source processing. However, after using the ion source calibration method of this application, the processed image is as follows: Figure 11 As shown, Figure 10 The original grooves in the ion source have completely disappeared, which indicates that the alignment error of the ion source in the method of this application is very small, thus proving the effectiveness of the method of this application.
[0039] This invention provides an ion source position calibration method based on a removal function, comprising the following steps: processing multiple removal function spots at a preset symmetrical position on the workpiece; acquiring the surface profile data of the workpiece after processing, and calculating the interference error surface profile of the removal function spots by subtracting it from the surface profile data of the workpiece before processing; extracting the pixel center position of the removal function and the pixel center position of the workpiece based on the interference error surface profile; determining the actual deviation of the removal function spots relative to the center position of the workpiece based on the pixel center position of the removal function and the extracted pixel center position of the workpiece; and adjusting the ion source position according to the actual deviation to complete the calibration. Compared with the prior art, the ion source position calibration method based on a removal function of this invention calculates the actual deviation between the removal function spots actually processed by the ion beam machine tool and the center position of the workpiece, and compensates for the actual deviation of the ion source position, thereby achieving accurate calibration of the ion source position and improving the accuracy of ion beam polishing.
[0040] In one embodiment, such as Figure 12 As shown, an ion source position calibration system based on a removal function is provided, comprising: The processing module is used to generate removal function spots at preset positions on the workpiece; The measurement module is used to acquire surface profile data of the workpiece before and after processing and generate an interference error surface profile after removing function speckles; The processing module is used to extract the pixel center position information of the removal function blob and the pixel center position information of the workpiece based on the interference error surface pattern, and to calculate the actual deviation. The calibration module is used to adjust the processing position of the ion source according to the actual deviation.
[0041] Preferably, the processing module includes an image processing unit for removing edge noise and center noise from the image generated based on the interference error surface pattern, extracting the contour of the image, and performing angle calibration on the image.
[0042] For specific limitations regarding the ion source position calibration system based on the removal function, please refer to the limitations of the ion source position calibration method based on the removal function mentioned above, which will not be repeated here. Each module in the aforementioned ion source position calibration system based on the removal function can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in or independent of the processor in a computer device, or stored in the memory of a computer device as software, so that the processor can call and execute the corresponding operations of each module.
[0043] Those skilled in the art will understand that Figure 13 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.
[0044] In one embodiment, a computer device is provided, including a memory and a processor, the memory storing a computer program, the processor executing the computer program to perform the following steps: Multiple removal function spots are processed at preset symmetrical positions on the workpiece; Obtain the surface profile data of the workpiece after machining, and calculate the difference between the surface profile data of the workpiece before machining to obtain the interference error surface profile after removing function spots; Pixel center position information is extracted and removed based on the interference error surface pattern; Pixel center position information of the workpiece is extracted based on the interference error surface pattern; The actual deviation of the spot from the workpiece center position is determined based on the pixel center position information of the removal function and the pixel center position information of the extracted workpiece. Adjust the ion source position according to the actual deviation to complete the calibration.
[0045] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon, the computer program performing the following steps when executed by a processor: Multiple removal function spots are processed at preset symmetrical positions on the workpiece; Obtain the surface profile data of the workpiece after machining, and calculate the difference between the surface profile data of the workpiece before machining to obtain the interference error surface profile after removing function spots; Pixel center position information is extracted and removed based on the interference error surface pattern; Pixel center position information of the workpiece is extracted based on the interference error surface pattern; The actual deviation of the spot from the workpiece center position is determined based on the pixel center position information of the removal function and the pixel center position information of the extracted workpiece. Adjust the ion source position according to the actual deviation to complete the calibration.
[0046] In the embodiments provided in this application, it should be understood that the disclosed methods and systems can be implemented in other ways. The system embodiments described above are merely illustrative. For example, the division of modules is only a logical functional division, and in actual implementation, there may be other division methods, such as: multiple modules or components can be combined, or integrated into another system, or some features can be ignored or not executed. In addition, the coupling, direct coupling, or communication connection between the various components shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or modules, and can be electrical, mechanical, or other forms.
[0047] Furthermore, in the various embodiments of the present invention, each functional module can be fully integrated into a processor, or each module can be a separate device, or two or more modules can be integrated into a device; each functional module in the various embodiments of the present invention can be implemented in hardware or in the form of hardware plus software functional units.
[0048] Those skilled in the art will understand that all or part of the steps of the above method embodiments can be implemented by program instructions and related hardware. The aforementioned program instructions can be stored in a computer-readable storage medium. When the program instructions are executed, they perform the steps of the above method embodiments. The aforementioned storage medium includes various media that can store program code, such as mobile storage devices, read-only memory (ROM), magnetic disks, or optical disks.
[0049] It should be understood that the use of terms such as "system," "device," "unit," and / or "module" in this application is merely one method of distinguishing different components, elements, parts, sections, or assemblies at different levels. However, if other terms can achieve the same purpose, they may be replaced by other expressions.
[0050] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "a," and / or "the" are not specifically singular and may include the plural. Generally, the terms "comprising" and "including" only indicate the inclusion of expressly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements. An element defined by the phrase "comprising an..." does not exclude the presence of other identical elements in the process, method, product, or apparatus that includes the element.
[0051] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "a plurality of" or "several" means two or more, unless otherwise explicitly specified.
[0052] If a flowchart is used in this application, it is used to illustrate the operations performed by the system according to embodiments of this application. It should be understood that the preceding or following operations are not necessarily performed in exact order. Instead, the steps can be processed in reverse order or simultaneously. Furthermore, other operations can be added to these processes, or one or more steps can be removed from them.
[0053] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. An ion source position calibration method based on a removal function, characterized in that, Includes the following steps: Multiple removal function spots are processed at preset symmetrical positions on the workpiece; Obtain the surface profile data of the workpiece after machining, and calculate the difference between the surface profile data of the workpiece before machining to obtain the interference error surface profile after removing function spots; The pixel center position information of the removal function is extracted based on the interference error surface pattern; The pixel center position information of the workpiece is extracted based on the interference error surface pattern; The actual deviation of the spot in the removal function relative to the center position of the workpiece is determined based on the pixel center position information of the removal function and the pixel center position information of the extracted workpiece. Adjust the ion source position according to the actual deviation to complete the calibration.
2. The ion source position calibration method as described in claim 1, characterized in that, The preset symmetrical positions are specifically: four points distributed symmetrically along the coordinate axis with the center position of the workpiece as the origin of the coordinate axis, wherein two points are symmetrically distributed along the x-axis of the coordinate axis according to the symmetrical distance, and two points are symmetrically distributed along the y-axis of the coordinate axis according to the symmetrical distance.
3. The ion source position calibration method as described in claim 2, characterized in that, When performing the extraction of pixel center position information based on the interference error surface pattern to obtain the removal function, the following steps are included: Based on the interference error surface pattern, a first image is generated by removing the function speckle, and the edge error and center error of the first image are removed to obtain a first image, wherein the first image contains only the function speckle. Extract the contour information of the removed function blob and the center coordinates of the smallest circumcircle of the removed function blob from the first image to obtain the first position information of the removed function blob; Based on the first position information and the center coordinates, it is determined whether there is a coordinate axis rotation error, and the first image is calibrated at an angle to obtain the standard position information of the removed function blob. The pixel distance of the removed function blob is calculated based on the standard position information. The pixel position of the removed function blob is calibrated according to the pixel distance of the removed function blob and the actual distance of the removed function blob, so as to obtain the pixel size of the removed function and calculate the pixel center position information of the removed function.
4. The ion source position calibration method according to claim 3, characterized in that, The angle calibration includes: The phase angle of the removed function blob is calculated based on the first image, the rotation angle is determined by the arctangent function, and the removed function blob in the first image is rotated to obtain the second image; The second image is rotated and corrected so that the removed function blob is aligned with the standard coordinate axis, resulting in a third image and the standard position information of the removed function blob.
5. The ion source position calibration method as described in claim 4, characterized in that, When performing the extraction of pixel center position information of the workpiece based on the interference error surface pattern, the following steps are included: Generate an interference error measurement data image based on the interference error surface pattern; The interference error measurement data image is rotated according to the rotation angle, and the contour information of the interference error measurement data image is extracted; The pixel radius of the workpiece is calibrated based on the pixel size of the removal function and the actual size of the workpiece, and the pixel center position information of the workpiece is calculated by least squares method based on the pixel radius of the workpiece.
6. The ion source position calibration method according to claim 5, characterized in that, When performing the step of determining the actual deviation of the removal function spot relative to the workpiece center position based on the pixel center position information of the removal function and the pixel center position information of the extracted workpiece, the specific steps include: The pixel deviation is obtained by calculating the pixel center position information of the workpiece and the pixel center position information of the removal function, wherein the pixel deviation includes lateral deviation and longitudinal deviation; The pixel deviation is converted into the actual physical distance to obtain the actual deviation.
7. An ion source position calibration system based on a removal function, characterized in that, include: The processing module is used to generate removal function spots at preset positions on the workpiece; The measurement module is used to acquire the surface profile data of the workpiece before and after processing and generate the interference error surface profile of the removed function spots; The processing module is used to extract the pixel center position information of the removal function blob and the pixel center position information of the workpiece based on the interference error surface pattern, and to calculate the actual deviation. The calibration module is used to adjust the processing position of the ion source according to the actual deviation.
8. The ion source position calibration system as described in claim 7, characterized in that, The processing module includes an image processing unit, used to remove edge noise and center noise from the image generated based on the interference error surface pattern, extract the contour of the image, and perform angle calibration on the image.
9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 6.
10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 6.
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