Heat dissipating device and method of mounting the same

Abstract

The application relates to the heat dissipation technical field, and provides a heat dissipation device and a mounting method thereof. The heat dissipation device comprises a clamping part, the clamping part is provided with a clamping opening penetrating along a first direction, at least one end of the clamping part along the first direction is provided with a heat dissipation module, the heat dissipation module comprises at least one heat dissipation part, one end of the heat dissipation part is connected with the clamping part, the other end of the heat dissipation part is inclinedly extended away from the clamping opening and towards the central extension line of the first direction where the clamping opening is located, and a plurality of grooves are arranged on the heat dissipation part and are spaced along the extending direction of the heat dissipation part. The heat dissipation device can improve the heat dissipation efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation, in particular to a heat dissipation device and a mounting method thereof. BACKGROUND

[0002] With the popularity of cloud computing, big data and artificial intelligence applications, the data processing load of servers and other electronic devices continues to rise, and the high-temperature components of various functional components or other electronic devices in the server need to be cooled, for example, the capacity and frequency of memory modules as core computing components are constantly increasing, and the power consumption of a single memory has broken through 20W. High power consumption leads to a sharp rise in the operating temperature of the memory module, especially when running at full capacity, the memory particles generate heat in clusters, and excessive temperature will trigger frequency reduction protection, resulting in performance degradation, and even causing the server system to crash.

[0003] The existing heat dissipation device relies on fins on its surface for heat dissipation, and the high-temperature components are installed in a narrow space. On the one hand, the fins are located between adjacent high-temperature components, and the space range where the heat dissipation device can be arranged is limited, affecting the heat dissipation effect; on the other hand, the airflow is limited in the narrow space, and the heat dissipation effect of the heat dissipation device is insufficient. SUMMARY

[0004] The purpose of the present application is to solve the above technical problems, and provide a heat dissipation device and a mounting method thereof, so as to effectively improve the heat dissipation efficiency of the heat dissipation device. In order to achieve the above purpose, the technical scheme of the present application is as follows:

[0005] In a first aspect, the present application provides a heat dissipation device, comprising a clamping part, the clamping part has a clamping opening through in a first direction, at least one end of the clamping part in the first direction is provided with a heat dissipation module, the heat dissipation module comprises at least one heat dissipation part, one end of the heat dissipation part is connected with the clamping part, the other end of the heat dissipation part deviates from the clamping opening and extends obliquely towards the center extension line of the first direction where the clamping opening is located, and a plurality of grooves are arranged on the heat dissipation part and spaced apart along the extension direction of the heat dissipation part.

[0006] In a second aspect, the present application provides a mounting method of a heat dissipation device, comprising: obtaining the environmental characteristics in the server where the memory module is located, the environmental characteristics including the spacing information of the components in the circumferential preset area of the memory module and the airflow information; determining the structural parameter characteristics of the heat dissipation device according to the environmental characteristics, so as to adapt the heat dissipation device to the memory module; positioning the clamping opening of the clamping part on both sides of the memory module, and ensuring that the heat dissipation part extends obliquely towards the center extension line of the first direction where the clamping opening is located; obtaining the temperature information of the memory module when working, and adjusting the angle of the heat dissipation part relative to the clamping part according to the temperature information and the airflow information.

[0007] Compared with the prior art, the heat dissipation device and the mounting method thereof have the following beneficial effects:

[0008] The heat dissipation device is not limited to memory modules. It can be effectively and stably positioned on both sides of the memory module through the clamping part. The heat dissipation device can be reasonably set to the heat dissipation position on the memory module according to the actual position of the internal space of the server where the memory module is located. Since the clamping part and the memory module can be quickly connected, the ease of installing the heat dissipation device is improved.

[0009] For different memory module installation spaces, the way the heat dissipation module can be arranged on the clamping part can be varied, and the connection method between the heat dissipation part of the heat dissipation module and the clamping part can also be varied, so as to make the heat dissipation device adapt to the installation space of the memory module and solve the problem of limited installation space for the memory module. The heat dissipation part has an inclined extension trend, and the heat dissipation part is located at at least one end of the clamping part along the first direction. The heat dissipation part should not occupy the space of the heat dissipation device along the second direction as much as possible. This can be understood as the memory modules arranged adjacently being separated from each other without any obstructing parts. The heat dissipation part and the clamping part are both located on both sides of the memory module and are as close to the memory module as possible, without occupying the space between adjacent memory modules.

[0010] Because the other end of the heat sink extends away from the clamp and tilts towards the center extension line of the clamp in the first direction, the heat sink is provided with multiple grooves arranged at intervals along its extension direction. The airflow forms a turbulent state as it passes through the heat sink, and most of the airflow is effectively guided on the surface of the heat sink. The airflow flows along the surface of the heat sink, increasing the effective heat dissipation area of ​​the heat sink and improving its heat dissipation efficiency. The heat from the memory module is transferred to the clamping part and then to the heat sink. The heat sink effectively absorbs heat to cool the memory module. At the same time, the airflow from the clamping part through the heat sink can be directly guided to the memory module, increasing the wind speed flowing over the surface of the memory module and effectively improving the cooling efficiency of the memory module. Attached Figure Description

[0011] Figure 1 A schematic diagram of a heat dissipation device provided for an embodiment of this application;

[0012] Figure 2 for Figure 1 The diagram shows a structural schematic of the heat dissipation device in another embodiment;

[0013] Figure 3 for Figure 1 The diagram shows the installation of the heat dissipation device in one embodiment.

[0014] Figure 4 for Figure 1 The diagram shows the heat dissipation device at the open end in one embodiment;

[0015] Figure 5 for Figure 1 A schematic diagram of the outer surface structure of the heat dissipation unit in one embodiment is shown.

[0016] Figure 6 As shown in the schematic diagram of the heat dissipation part in a side view cross-section of an embodiment; Figure 5

[0017] Figure 7 As shown in the schematic diagram of the heat dissipation part in an inner surface structure of an embodiment; Figure 5

[0018] Figure 8 As shown in the schematic diagram of the heat dissipation part in an outer surface structure of another embodiment; Figure 5

[0019] Figure 9 As shown in the schematic diagram of the clamping part in an embodiment. Figure 1

[0020] Reference signs:

[0021] Memory module 1;

[0022] Clamping part 2, clamping opening 21;

[0023] Heat dissipation module 3, heat dissipation part 31, heat dissipation air duct 32, segmented part 33, first connecting shaft 34, second connecting shaft 35;

[0024] Groove 41, outer notch 42, inner notch 43, communication groove 44;

[0025] Thermal conduction part 5, thermal conduction air duct 51;

[0026] Rebound part 6, rebound channel 61;

[0027] Fixed shaft 7, mounting groove 71, torsional spring 72;

[0028] Composite gasket 8;

[0029] Thermal conduction pipe 9, fixing groove 91. DETAILED DESCRIPTION

[0030] In order to make the technical solutions and advantages in the embodiments of the present application more clear and apparent, the following further describes the exemplary embodiments of the present application in conjunction with the drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0031] Embodiment one

[0032] ​​​​The embodiment provides a heat dissipation device, which has good heat dissipation effect on a high-temperature plate part, and the application range of the heat dissipation device is not limited to a memory module 1 in a server, and the heat dissipation device can be applied to other modules in the server, switches, storage devices, personal computers and other electronic devices. The embodiment takes the application of the heat dissipation device to the memory module 1 as an example. The memory module 1 is a key hardware specially designed to meet the requirements of uninterrupted stable operation and high-load tasks of the server, and the core value lies in reliability, fault tolerance and performance. In order to support a multi-processor architecture and cope with huge memory capacity requirements, the server memory also widely adopts register type or full buffer module technology. By adding a register buffer chip to the memory bar, the load of the memory controller is reduced, so as to stably drive larger capacity memory particles and improve system scalability, so that the capacity of a single memory can reach 128 GB or even higher. Correspondingly, as the memory capacity and frequency continue to increase, the temperature of the memory module 1 is relatively high during operation, and therefore, a heat dissipation device needs to be designed to effectively cool the memory module 1 to avoid performance degradation of the memory module 1.

[0033] In the related art, the surface of the heat dissipation device is provided with heat dissipation fins, the memory module 1 has a substantially long strip type plate structure, and the wind flow condition and the densely arranged state of the installation space of the memory module 1 affect the heat dissipation effect of the heat dissipation device. Understandably, in order to fully utilize the internal space of the server, the interval distance between adjacent memory modules 1 is small, the space available for the heat dissipation device is small, and the heat absorption effect of the wind flow through the heat dissipation device is limited, thereby resulting in insufficient heat dissipation effect of the heat dissipation device. The embodiment improves the heat dissipation device to solve the above technical problems. The improved heat dissipation device reduces the layout limitation of the internal space of the server as much as possible, and improves the heat absorption efficiency of the wind flow on the heat dissipation device. Details are described below.

[0034] As shown in Figure 1 , Figure 3 , in a conventional state, the memory module 1 is installed in a vertical direction, and the heat dissipation device is installed on both sides of the memory module 1. The first direction refers to the length direction of the heat dissipation device, that is, the length direction of the memory module 1. The second direction refers to the width direction of the heat dissipation device, that is, the width direction of the memory module 1. The first direction is perpendicular to the second direction. The third direction refers to the height direction of the heat dissipation device, that is, the height direction of the memory module 1. The third direction is perpendicular to the first direction. The wind flow in the internal space of the server can be in any direction, or can be transported along the first direction. The components for forming the wind flow are not limited in the embodiment.

[0035] As shown in Figures 1-4As shown, a heat dissipation device comprises a clamping portion 2, the clamping portion 2 has a clamping opening 21 penetrating along a first direction, and the clamping portion 2 is provided with a heat dissipation module 3 at least at one end along the first direction, the heat dissipation module 3 comprises at least one heat dissipation portion 31, one end of the heat dissipation portion 31 is connected with the clamping portion 2, the other end of the heat dissipation portion 31 is inclined to extend away from the clamping opening 21 and towards the center extension line of the first direction where the clamping opening 21 is located, and the heat dissipation portion 31 is provided with a plurality of grooves 41 arranged at intervals along the extension direction thereof.

[0036] The width of the clamping opening 21 of the clamping portion 2 is adapted to the width of the memory module 1, and the opposite inner walls of the clamping opening 21 can abut against the two sides of the memory module 1; a plurality of heat dissipation devices can be arranged along the first direction on the memory module, and the heat dissipation devices are arranged reasonably according to the heat dissipation requirements of the memory module, for example, the clamping portion 2 is positioned at the memory particle position of the memory module 1. The clamping opening 21 of the clamping portion 2 has an opening and closing function, when the clamping opening 21 of the clamping portion 2 is in an open state, the clamping portion 2 can be easily positioned above the memory module 1; when the opening of the clamping portion 2 is in a closed state, the clamping portion 2 can be tightly abutted against the two sides of the memory module 1, thereby realizing the positioning function. The clamping opening 21 of the clamping portion 2 can have a U-shaped structure, one end of the clamping portion 2 along a third direction is an opening end of the clamping opening 21, the other end of the clamping portion 2 along the third direction is a tail end, and the operation of the tail end can facilitate the transfer of the heat dissipation device. When the clamping portion 2 is positioned at the memory module 1, the opening end of the clamping portion 2 is arranged downward, and the tail end is arranged upward, and the above-mentioned upward and downward refer to the upward and downward along the third direction. The clamping portion 2 has the characteristics of quickly operating the heat dissipation device, has the performance of portability and easy disassembly, and can be applied to the heat dissipation operation of the memory module in the server, and the assembly to the memory module is simple, avoiding the occupation of space caused by too complex structure.

[0037] One end of the clamping portion 2 along the first direction can be provided with the heat dissipation module 3, the other end of the clamping portion 2 along the first direction can also be provided with the heat dissipation module 3, and both ends of the clamping portion 2 along the first direction can be provided with the heat dissipation module 3; when one end of the clamping portion 2 along the first direction is provided with the heat dissipation module 3, the internal space of the server is reduced while the effective delivery of air flow in a larger space is taken into account, the delivery efficiency of the air flow is improved, thereby realizing sufficient heat dissipation of the heat dissipation device; this embodiment is described by taking one end of the clamping portion 2 along the first direction as an example.

[0038] The heat dissipation module 3 comprises one heat dissipation portion 31 or two heat dissipation portions 31, the number of heat dissipation portions 31 can be multiple, and the heat dissipation portions 31 are arranged opposite to the clamping opening 21, the heat dissipation portions 31 are connected with the clamping portion 2, thereby the clamping portion 2 can be heat dissipated; the arrangement position of the heat dissipation portion 31 on the clamping portion 2 should not deviate too far from the clamping opening 21, otherwise the heat dissipation effect of the heat dissipation portion 31 will be affected.

[0039] When the heat dissipation module 3 is a heat dissipation part 31, one end of the heat dissipation part 31 is connected with the clamping part 2, and the other end of the heat dissipation part 31 extends obliquely away from the clamping opening 21 and towards the center extension line of the first direction where the clamping opening 21 is located. The heat dissipation part 31 is not suitable for extending obliquely away from the center extension line. Since the air flow passes through the outer surface of the heat dissipation part 31, if the heat dissipation part 31 extends obliquely beyond the outer surface of the clamping part 2, the air flow will be blocked at the heat dissipation part 31, and then escape along the two ends of the heat dissipation part 31 in the third direction, disrupting the normal direction of the air flow. On the one hand, it causes greater wind noise and air flow vibration, affecting the stability of the heat dissipation device positioned on the memory module 1. On the other hand, it reduces the heat absorption efficiency of the heat dissipation part 31 and may also reduce the heat absorption efficiency of the adjacent heat dissipation device on the memory module 1. The extension trend of the heat dissipation part 31 is towards the center extension line of the clamping opening 21. The air flow passes through the outer surface of the heat dissipation part 31 and is guided to the surface of the memory module 1, forming an effective air flow conveying path. Among them, the outer surface of the heat dissipation part 31 is the side of the heat dissipation part 31 away from the clamping opening 21, and the inner surface of the heat dissipation part 31 is the side of the heat dissipation part 31 towards the clamping opening 21.

[0040] When the heat dissipation module 3 is a plurality of heat dissipation parts 31, a single plurality of heat dissipation parts 31 can be arranged in sequence along the third direction, or a plurality of heat dissipation parts 31 in a group can be arranged in sequence along the third direction. The actual length of the clamping opening 21 of the clamping part 2 along the third direction is used to reasonably arrange the number of heat dissipation parts 31, so that the heat dissipation part 31 has a larger effective heat dissipation area. Among them, the group of heat dissipation parts 31 is understood as two heat dissipation parts 31 arranged at intervals along the second direction as a group, and a group of heat dissipation parts 31 has a heat dissipation air duct 32, which is arranged opposite to the clamping opening 21. The air flow can pass through the clamping opening 21 and the heat dissipation air duct 32, further improving the heat dissipation efficiency of the heat dissipation part 31. Similarly, the extension area of the group of heat dissipation parts 31 is also towards the center extension line of the clamping opening 21. The air flow passes through the outer surface of the group of heat dissipation parts 31, which can form an effective air flow conveying path.

[0041] The heat dissipation part 31 is provided with a plurality of grooves 41 arranged at intervals along the extension direction thereof, and the outer surface and / or the inner surface of the heat dissipation part 31 is provided with a plurality of grooves 41. The grooves 41 can be through grooves, blind grooves or closed grooves. The embodiment takes the through grooves as an example for description. The air flow passes through the outer surface of the heat dissipation part 31. The grooves 41 can not only increase the effective heat dissipation area, but also can destroy the air boundary layer, disperse the air flow and re-form the guide, thereby forming a controllable turbulent flow state and enhancing the heat exchange efficiency. At the same time, the air flow is guided to flow along the preset track, reduces the scattering distribution of the air flow and improves the heat dissipation efficiency of the heat dissipation part 31. When the air flow passes through the outer surface of the heat dissipation part 31, most of the air flow is directly guided from the outer surface of the heat dissipation part 31. The air flow has a high wind speed when passing through the outer surface of the heat dissipation part 31 along the extension direction thereof, thereby achieving the effect of accelerating heat dissipation.

[0042] Similarly, when the air flow passes through the inner surface of the heat dissipation part 31, most of the air flow is directly guided from the inner surface of the heat dissipation part 31. It is understood that most of the air flow is not directly guided from the through grooves 41, but contacts the inner wall of the grooves 41 and is guided from the inner surface of the heat dissipation part 31 again, thereby achieving the effect of accelerating heat dissipation.

[0043] The heat dissipation device of the embodiment can be effectively and stably positioned on both sides of the memory module 1 through the clamping opening 21 of the clamping part 2, and the heat dissipation device can be reasonably arranged according to the actual position of the internal space of the server where the memory module 1 is located, and the heat dissipation position required on the memory module 1. Since the clamping part 2 cooperates with the memory module 1 in a quick manner, the installation of the heat dissipation device is convenient. The arrangement of the heat dissipation module 3 on the clamping part 2 can be various for different installation spaces of the memory module 1, and the connection mode of the heat dissipation part 31 of the heat dissipation module 3 and the clamping part 2 can also be various, so that the heat dissipation device can be adapted to the installation space of the memory module 1, and the problem of cramped installation space of the memory module 1 can be solved. The heat dissipation part 31 has a tendency to extend obliquely, and the heat dissipation part 31 is arranged at at least one end of the clamping part 2 along the first direction. The heat dissipation part 31 does not occupy the space of the heat dissipation device along the second direction, and it is understood that the adjacent memory modules 1 are spaced apart without blocking components. The heat dissipation part 31 and the clamping part 2 are located on both sides of the memory module 1, and are as close to the memory module 1 as possible, without occupying the space between the adjacent memory modules 1. Since the other end of the heat dissipation part 31 extends obliquely away from the clamping opening 21 and towards the center extension line of the clamping opening 21 in the first direction, a plurality of grooves 41 are arranged on the heat dissipation part 31 along the extension direction thereof. The air flow passing through the heat dissipation part 31 forms a turbulent flow state, and most of the air flow is effectively guided on the surface of the heat dissipation part 31. The air flow flows along the surface of the heat dissipation part 31, thereby increasing the effective heat dissipation area of the heat dissipation part 31 and improving the heat dissipation efficiency of the heat dissipation part 31. The heat of the memory module 1 is transferred to the clamping part 2 and then to the heat dissipation part 31. The heat dissipation part 31 effectively absorbs heat to cool the memory module 1. At the same time, the air flow passing through the heat dissipation part 31 from the clamping part 2 can be directly guided to the memory module 1, thereby increasing the air speed flowing through the surface of the memory module 1 and effectively improving the cooling efficiency of the memory module 1.

[0044] In some embodiments, the heat dissipation module 3 includes heat dissipation parts 31 arranged opposite to each other on both sides of the clamping opening 21, and a heat dissipation air duct 32 is formed between the adjacent heat dissipation parts 31.

[0045] As shown in Figure 1 , Figure 3 , Figure 4 The number of heat dissipation parts 31 is two, and they are arranged opposite to each other along the second direction. The opposite heat dissipation parts 31 can be symmetrically arranged along the center extension line of the clamping opening 21. The two heat dissipation parts 31 have equivalent heat dissipation effects and can guide the air flow to flow effectively on the heat dissipation part 31.

[0046] The heat dissipation air duct 32 is formed between the ends of the two heat dissipation parts 31 away from the clamping part 2, and is arranged opposite to the clamping opening 21 and communicates with the clamping opening 21. The two heat dissipation parts 31 form an overhead cavity in the shape of an isosceles trapezoid. When the outer surface of the heat dissipation part 31 flows through the air flow, the heat in the overhead cavity is easily conducted from the heat dissipation air duct 32, the flow speed of the air flow is improved, and the heat dissipation efficiency of the heat dissipation part 31 is further improved.

[0047] In some embodiments, the heat dissipation part 31 is rotationally connected with the clamping part 2, and the spacing between adjacent heat dissipation parts 31 is adjustable.

[0048] As shown in Figure 1 , the heat dissipation part 31 is hinged with the clamping part 2 through a first connecting shaft 34, and the heat dissipation part 31 has a certain damping force with the first connecting shaft 34, for example, a rotary damper can achieve the above function; when the heat dissipation part 31 needs to be adjusted in angle, the heat dissipation part 31 can be suspended at a specified angle relative to the clamping part 2, improving the convenience of adjusting the angle of the heat dissipation part 31.

[0049] Exemplarily, the heat dissipation part 31 and the clamping part 2 are connected to form an included angle β. By changing the included angle of the heat dissipation part 31 and the clamping part 2, on the one hand, the heat dissipation device can be adapted to the actual installation space of the memory module 1. The heat dissipation device can effectively avoid other components in the installation space by adjusting the angle of the heat dissipation part 31, and has flexible applicability. On the other hand, changing the inclination of the heat dissipation part 31 can improve the heat dissipation efficiency of the heat dissipation part 31. According to the actual heating condition of the memory module 1, the included angle of the heat dissipation part 31 and the clamping part 2 is adjusted, which has good adaptability.

[0050] Exemplarily, the included angle β is in the range of 30°-45°. The appropriate angle range can ensure the smooth flow of the air flow in the heat dissipation air duct 32, reduce the wind resistance and vortex noise; the air flow is directed to flow along the surface of the heat dissipation part 31, and the air flow is reduced by flow guiding to reduce air flow separation and vortex formation, thereby significantly reducing high-frequency noise.

[0051] In some embodiments, the heat dissipation part 31 includes a plurality of segment parts 33 connected in sequence along the extension direction thereof, and adjacent segment parts 33 are rotationally connected.

[0052] As shown in Figure 2 , adjacent segment parts 33 are hinged through a second connecting shaft 35, and adjacent segment parts 33 have a certain damping force. The second connecting shaft 35 is similar in structure to the first connecting shaft 34, and the segment part 33 can be suspended at a specified angle. The multi-segment heat dissipation part 31 can adapt to the air duct environment of the internal space of different servers and the slot density of the memory module 1, and effectively design for the limited space inside the server, so that the applicability of the heat dissipation device is stronger.

[0053] In some embodiments, the recess 41 is provided through the heat dissipation portion 31, the recess 41 forms an outer notch 42 on the outer surface of the heat dissipation portion 31, and the recess 41 forms an inner notch 43 on the inner surface of the heat dissipation portion 31, the width W1 of the outer notch 42 along the extension direction of the heat dissipation portion 31 is less than the width W2 of the inner notch 43 along the extension direction of the heat dissipation portion 31.

[0054] As shown in Figure 5 , Figure 6 , the air flow passes through the outer surface and the inner surface of the heat dissipation portion 31, the clamping portion 2 conducts the heat of the internal memory module 1 to the heat dissipation portion 31, the air flow passes through the inner notch 43 from the inner surface of the heat dissipation portion 31, is guided out of the heat dissipation air duct 32 and carries away the heat; at the same time, the outer surface of the heat dissipation portion 31 passes through the outer notch 42 and is guided to the internal memory module 1 from the extension direction of the heat dissipation portion 31, thereby carrying away the heat. Since the width size of the inner notch 43 is greater than the width size of the outer notch 42, under the condition of a certain air pressure, most of the air flow passes through the inner notch 43 and continues to flow along the inner surface of the heat dissipation portion 31, the air flow is in full contact with the large area of the notch wall of the inner notch 43, and the inner surface of the heat dissipation portion 31 is positioned closer to the position of the clamping portion 2 positioning the internal memory module 1 relative to the outer surface of the heat dissipation portion 31, the design of the hollow cavity can carry out a large amount of heat accumulated therein from the heat dissipation air duct 32, and the heat dissipation efficiency of the heat dissipation portion 31 is improved.

[0055] In some embodiments, the inner surface and / or the outer surface of the heat dissipation portion 31 is a plane, and the inner wall of the recess 41 is arranged inclined relative to the plane.

[0056] As shown in Figure 6 , the cross section of the recess 41 is a substantially isosceles trapezoidal structure, the upper base of the isosceles trapezoidal structure is the corresponding position of the outer notch 42, the lower base of the isosceles trapezoidal structure is the corresponding position of the inner notch 43, and the two waists of the isosceles trapezoidal structure are the inner wall of the recess 41.

[0057] The cross-sectional structure of the recess 41 makes the inner surface of the heat dissipation portion 31 have a higher effective heat dissipation area, and can have better heat dissipation effect on the side of the heat dissipation portion 31 close to the internal memory module 1. The specific structure of the recess 41 is not limited to the isosceles trapezoidal structure described above, and the width size of the inner notch 43 of the recess 41 is greater than the width size of the outer notch 42, which can enable the recess 41 to have corresponding design functions.

[0058] In some embodiments, a plurality of recesses 41 are arranged in the vertical direction of the extension direction of the heat dissipation portion 31.

[0059] As shown in Figure 8As shown, the heat dissipation part 31 is provided with a plurality of grooves 41 arranged at intervals along the extending direction of the heat dissipation part 31, and the number of the grooves 41 can be three, five or more; the two ends of the grooves 41 along the vertical direction of the extending direction of the heat dissipation part 31 are spaced apart from the edges of the heat dissipation part 31, that is, the grooves 41 are generally concentrated in the middle part of the heat dissipation part 31, which can effectively correspond to the clamping opening 21 position of the clamping part 2 and ensure the guiding direction of the air flow. The grooves 41 are arranged at intervals along the vertical direction of the extending direction of the heat dissipation part 31, and the number of the grooves 41 is four, five or more. The grooves 41 are arranged in an array on the heat dissipation part 31, which improves the number of the grooves 41 on the heat dissipation part 31, increases the effective heat dissipation area of the grooves 41, and improves the heat dissipation performance of the heat dissipation part 31.

[0060] In some embodiments, the inner surface and / or the outer surface of the heat dissipation part 31 is provided with a plurality of communication grooves 44 arranged at intervals along the vertical direction of the extending direction of the heat dissipation part 31, and the communication grooves 44 are connected to the plurality of grooves 41, and the two ends of the communication grooves 44 are respectively communicated with the two ends of the heat dissipation part 31 along the extending direction of the heat dissipation part 31.

[0061] As shown, Figure 7 the communication grooves 44 can be open grooves, that is, the ends of the communication grooves 44 are communicated with the edges of the heat dissipation part 31, and the air flow can be smoothly guided from the edges of the heat dissipation part 31 into the communication grooves 44 and then guided out of the heat dissipation air duct 32. Arranging a plurality of communication grooves 44 on the inner surface and / or the outer surface of the heat dissipation part 31 makes the air flow guided in the communication grooves 44 enter the grooves 41, which improves the guiding accuracy of the air flow. At the same time, the communication grooves 44 can also improve the effective heat dissipation area and accelerate the heat dissipation effect of the air flow, thereby improving the heat dissipation performance of the heat dissipation part 31.

[0062] In some embodiments, the number of the communication grooves 44 is reasonably designed according to the area of the heat dissipation part 31, and each communication groove 44 can be connected to part of the grooves 41 or all the grooves 41.

[0063] In some embodiments, the groove depth H of the communication grooves 44 is less than the groove depth L of the grooves 41, and the communication grooves 44 are arranged vertically relative to the grooves 41.

[0064] As shown, Figure 6 , Figure 7 the width W1 of the outer groove 42 of the groove 41 along the extending direction of the heat dissipation part 31 is 1mm-2mm, and the groove depth L of the groove 41 is 0.4mm-0.6mm; the communication grooves 44 cooperate with the grooves 41 to realize rapid flow guiding of the air flow and accurately guide the air flow to the preset direction. In this embodiment, the groove 41 is taken as an example for description, and the groove depth of the communication groove 44 should not be greater than or equal to the groove depth of the groove 41, so as to maintain the integrity of the heat dissipation part 31 and facilitate the normal assembly function of the heat dissipation part 31 and the clamping part 2.

[0065] In some embodiments, the inner wall of the clamping opening 21 is provided with a heat conduction part 5, which has a heat conduction air duct 51 opposite to the inner surface of the heat dissipation part 31, and the heat conduction air duct 51 communicates with the heat dissipation air duct 32.

[0066] As shown in Figure 1 , Figure 4 , Figure 9 As shown in the figure, since the inner wall of the clamping opening 21 is in contact with the memory module 1, the heat of the memory module 1 can be transferred to the heat conduction part 5, which has a heat conduction air duct 51. The airflow passes through the heat conduction part 5, is collected through the heat conduction air duct 51, and is guided to the inner surface of the heat dissipation part 31 in the first direction. The airflow dissipates heat from the heat dissipation part 31 and is guided out of the heat dissipation air duct 32, thereby accelerating the heat dissipation efficiency of the memory module 1.

[0067] Since the clamping part 2 is provided with a clamping opening 21 penetrating in the first direction, and the heat conduction air duct 51 also penetrates in the first direction on the clamping part 2, when the airflow is transported in the first direction, it can pass through the clamping opening 21 of the clamping part 2 and enter the heat conduction air duct 51. The cross section of the heat conduction air duct 51 can be a generally semicircular structure or an arc structure. The spacing between the heat conduction part 5 and the center extension line of the clamping opening 21 can form an effective heat conduction air duct 51, and the cross-sectional area of the heat conduction air duct 51 is not limited to the above structure.

[0068] In some embodiments, a plurality of heat conduction parts 5 are respectively arranged on the opposite inner walls of the clamping opening 21, and the heat conduction air duct 51 is formed between the opposite heat conduction parts 5, and the adjacent heat conduction air ducts 51 are arranged in communication through the clamping opening 21.

[0069] As shown in Figure 3 , Figure 9 The number of heat conduction parts 5 can be two or more, and a plurality of heat conduction parts 5 are arranged in groups on the opposite inner walls of the clamping opening 21. One group of heat conduction parts 5 is two, and the two heat conduction parts 5 are symmetrically arranged relative to the clamping opening 21 in the first direction. Since the heat conduction part 5 has a generally semicircular structure, one group of heat conduction parts 5 is arranged in a generally circular structure, which improves the flow capacity of the airflow passing through the heat conduction part 5 and effectively improves the heat conduction effect.

[0070] This embodiment takes two groups of heat conduction parts 5 as an example for description. The two heat conduction air ducts 51 formed by the two groups of heat conduction parts 5 are in communication through the clamping opening 21. The diameters of the two heat conduction air ducts 51 can be different. Since one end of the clamping opening 21 in the third direction is a closed end and the other end is an open end, the heat conduction air duct 51 with a larger diameter is closer to the open end, and the heat conduction air duct 51 with a smaller diameter is closer to the closed end, and thus the heat conduction air duct 51 with a larger diameter is closer to the memory module 1, and the heat conduction effect on the memory module 1 is better. The clamping opening 21 has an opening and closing function, and the heat conduction air duct 51 with a smaller diameter is closer to the closed end, so that the clamping opening 21 has better clamping force at the closed end, thereby ensuring the clamping stability of the whole clamping part 2.

[0071] In some embodiments, the inner wall of the clamping opening 21 is provided with a resilient portion 6, the resilient portion 6 is provided with a resilient channel 61, the resilient channel 61 is in communication with the heat-conducting air duct 51; the clamping portion 2 is provided with a fixed shaft 7 at the end of the resilient portion 6 away from the resilient channel 61, and the clamping portion 2 is elastically connected with the fixed shaft 7.

[0072] As shown in Figure 1 , Figure 9 The resilient portion 6 can be made of a memory alloy material, the resilient portion 6 is located at the closed end of the clamping opening 21, the resilient portion 6 has a generally U-shaped structure or a V-shaped structure, and the resilient portion 6 automatically enhances the clamping force as the temperature rises. For example, the resilient portion 6 is made of a nickel-titanium alloy material, which has a memory characteristic of deforming with temperature.

[0073] In addition to the conventional V-shaped or U-shaped structure, the structure of the resilient portion 6 can be further optimized to a more efficient and more sensitive configuration to improve the opening and closing performance of the clamping portion and the clamping opening. For example, the resilient portion 6 can be designed as a wave-shaped spring structure, which provides a larger elastic stroke and a buffering effect by using a continuous curve form, and is particularly suitable for occasions that require frequent opening and closing or a larger deformation amount. At the same time, in order to realize the composite resilient function, the resilient portion 6 can also adopt a double-layer composite structure composed of an outer high-elasticity metal layer and an inner memory alloy layer, which provides primary elastic support at low temperature and thermal resilient effect of the memory alloy at high temperature, thereby realizing more accurate temperature response control.

[0074] The resilient portion can also be designed as an oval closed ring to automatically adjust the opening and closing amplitude under temperature change, which can not only enhance the clamping stability, but also maintain the consistency of the opening and closing path. Further, combined with modern manufacturing processes, the resilient portion can also be manufactured as a spatial curved surface structure by three-dimensional molding, so as to have multi-axial flexible response capability and wider adaptability in multi-angle clamping or complex geometry clamping opening 21.

[0075] The structure of the resilient portion 6 can not only be diversified, but also be combined with the thermal response characteristics of the memory alloy, so as to provide stronger driving capability, faster response speed and longer fatigue life in the opening and closing process of the clamping opening 21 by reasonably designing the shape and material distribution, and finally effectively improve the mechanical properties and application reliability of the clamping portion 2.

[0076] The clamping portion 2 is provided with a mounting groove 71, a fixing shaft 7 is mounted in the mounting groove 71, a torsion spring 72 abutting against the groove wall of the mounting groove 71 is sleeved on the fixing shaft 7, the clamping portion 2 realizes the opening and closing function of the clamping opening 21 through the fixing shaft 7 and the torsion spring 72, the tail end and the head end of the clamping portion 2 are located on the two sides of the fixing shaft 7 respectively, the tail end of the clamping portion 2 is pressed, the resilient portion 6 is deformed, the area of the resilient channel 61 gradually increases, and the clamping opening 21 of the clamping portion 2 is opened; when the external force on the tail end of the clamping portion 2 is removed, the resilient portion 6 is automatically reset, the area of the resilient channel 61 gradually decreases, and the clamping opening 21 of the clamping portion 2 is reset.

[0077] The heat conduction portion 5, the resilient portion 6 and the clamping portion 2 can be integrally formed or separately formed; for example, when the clamping portion 2 is made of insulating plastic material, the heat conduction portion 5 and the resilient portion 6 can be integrally injection molded with the clamping portion 2, at this time, the resilient portion 6 is the inner wall of the clamping opening 21, and the heat conduction portion 5 is also the inner wall of the clamping opening 21.

[0078] In some embodiments, a composite gasket 8 is arranged on the opposite inner wall of the clamping opening 21, the composite gasket 8 is connected with the heat conduction portion 5, the composite gasket 8 includes a heat conduction base material layer, a phase change material layer and a heat conduction silica gel layer which are sequentially stacked, the heat conduction base material layer is connected with the clamping portion 2, and the heat conduction silica gel layer abuts against the memory module 1.

[0079] The heat conduction silica gel layer is directly attached to the surface of the memory module 1, has excellent softness and adhesion, ensures sufficient contact with the memory module 1, and reduces the interface thermal resistance; the phase change material layer adopts a paraffin-based phase change material, can convert between solid and liquid states in a specific temperature range, absorbs and stores a large amount of heat, self-adapts to thermal expansion differences through volume changes, buffers stress caused by temperature fluctuations, and maintains stable contact pressure; the heat conduction base material layer adopts graphene composite material or metal foil layer, improves the mechanical strength and heat conduction capacity of the overall composite gasket 8, the above-mentioned gasket layers are formed through a hot pressing process, the number of gasket layers can be multiple, ensures that the connected interfaces are closely attached, and the composite gasket 8 has compressibility and resilience, and can be applied to the vibration and thermal change environment of the memory module 1 in the server during long-term use.

[0080] In some embodiments, the heat dissipation device further includes a heat conduction pipe 9, the heat conduction pipe 9 is arranged on the clamping portion 2, one end of the heat conduction pipe 9 is connected with the composite gasket 8, and the other end of the heat conduction pipe 9 is connected with the heat dissipation portion 31.

[0081] As shown in FIG. 1, the heat dissipation device includes a memory module 1, a heat dissipation device 2 and a heat dissipation portion 31. Figure 2 , Figure 9As shown, a fixing groove 91 is provided on the outer surface of the clamping part 2, and the heat conduction pipe 9 is installed in the fixing groove 91. The outer surface of the clamping part 2 refers to the surface of the clamping part 2 facing away from the clamping opening 21. One end of the heat conduction pipe 9 passes through the clamping part 2 and extends to the composite gasket 8, and the other end of the heat conduction pipe 9 extends to the connection between the heat dissipation part 31 and the clamping part 2. The heat conduction pipe 9 is provided with a phase change material, which utilizes the phase change heat transfer principle to quickly transfer heat from the composite gasket 8 to the heat dissipation part 31, thereby improving the heat conduction efficiency.

[0082] To further optimize the heat conduction path and thermal response efficiency of the heat dissipation structure, the heat pipe 9 is preferably a sealed hollow tube made of a high thermal conductivity metal material (such as copper, aluminum, or nickel alloy), filled with a high-efficiency phase change material, such as paraffin-based or metal nanoparticle-reinforced phase change material. This type of phase change material has the dual function of endothermic melting and exothermic solidification within a specific temperature range. It can rapidly absorb a large amount of heat when the local temperature rises and release thermal energy when the temperature drops, thereby stabilizing the device temperature and suppressing thermal abrupt changes.

[0083] Furthermore, the heat pipe 9 employs a capillary structure to enhance heat transfer. Porous materials such as sintered copper powder, woven copper mesh, or microgrooves are added to the inner wall of the pipe to improve the reflux rate and evaporation efficiency of the condensate, achieving a more efficient heat circulation and conduction capability. This structural design not only enhances the capillary force within the pipe but also reduces performance degradation under different installation orientations, strengthening its stability and adaptability under multi-angle installation.

[0084] In terms of installation structure, the fixing groove 91 not only provides physical support for the heat pipe 9, but also forms a good thermal contact interface by tightly fitting with the heat pipe. To this end, the inner surface of the fixing groove 91 can be coated with high thermal conductivity silicone grease or a thermal interface material (TIM) to reduce interface thermal resistance and further improve the thermal coupling efficiency between the clamping part 2 and the heat pipe 9. Simultaneously, the groove depth of the fixing groove 91 matches the outer diameter of the heat pipe 9, and a snap-fit ​​or press-fit installation structure is adopted to ensure that the heat pipe 9 is not easily displaced or loosened during operation, thus improving the overall reliability of the device.

[0085] In terms of heat dissipation path, the heat transfer process of heat pipe 9 can be divided into three stages: First, heat enters from the composite gasket 8 through the heat pipe inlet; second, heat is rapidly transferred in heat pipe 9 using the latent heat of the phase change material; finally, heat is transferred to heat dissipation unit 31 via heat pipe outlet. To enhance the heat release efficiency of the third stage, a heat diffusion layer or heat fin structure (not shown in the figure) is provided between heat pipe outlet and heat dissipation unit 31 to expand the heat dissipation area and enhance natural convection and radiation heat dissipation.

[0086] The running direction and length of the heat conduction pipe 9 can be optimally arranged according to the structural space of the clamping part 2, and multiple heat conduction pipes can be arranged in parallel to improve the total heat transfer capacity. In high heat flux application scenarios, multiple parallel fixed grooves 91 can be arranged on the clamping part 2, so as to realize the dispersion of heat conduction and rapid discharge, and avoid the accumulation of temperature at a single point.

[0087] From the perspective of manufacturing process, the heat conduction pipe 9 should adopt high airtightness packaging technology to ensure that the internal phase change material does not leak or oxidize during long-term operation. At the same time, the outer surface of the heat conduction pipe 9 can be subjected to corrosion prevention treatment, such as anodic oxidation, electroplating or ceramic coating treatment, to enhance its durability in complex environments (such as high humidity, acid and alkali or dust environment).

[0088] In summary, the heat conduction pipe 9 not only serves as a heat transfer component, but also performs multiple functions such as temperature balancing, heat mutation buffering and structural coupling, and is a key technical means to improve the overall performance of the heat dissipation device. It has broad application prospects in high-power device clamping heat dissipation schemes, especially in application scenarios that require high heat dissipation response speed and temperature control accuracy, such as heat dissipation of memory modules 1 in servers.

[0089] Embodiment Two

[0090] The embodiment provides a mounting method of a heat dissipation device, comprising:

[0091] S1, obtaining environmental characteristics in a server where the memory module 1 is located, the environmental characteristics including spacing information of components in a circumferential predetermined area of the memory module 1 and airflow information.

[0092] Wherein, the memory module 1 is installed in the internal space of the server, and it can be understood that the number of memory modules 1 is multiple, and the multiple memory modules 1 are arranged side by side and spaced apart, and the components in the circumferential predetermined area of the memory module 1 can be other memory modules 1, and the spacing information in the environmental characteristics specifically refers to the spacing of adjacent memory modules 1, and on the basis of determining the spacing of adjacent memory modules 1, the size parameters of the heat dissipation device can be further determined, so that the length, width and height of the heat dissipation device can be suitable for this type of memory module 1.

[0093] The airflow information refers to the need for airflow in the internal space of the server under the running state of the memory module 1. Determining the airflow information can maximize the heat dissipation effect of the heat dissipation device and effectively dissipate heat from the memory module 1. The internal space of the server is provided with a first sensor for detecting airflow information, and the direction and speed of the airflow can be accurately determined through the first sensor.

[0094] S2, determining the structural parameter characteristics of the heat dissipation device according to the environmental characteristics, so that the heat dissipation device is adapted to the memory module 1.

[0095] The heat dissipation device comprises the clamping part 2 and a heat dissipation part 31, the heat dissipation part 31 is arranged to rotate relative to the clamping part 2, the angle of rotation of the heat dissipation part 31 is limited by environmental characteristics, the angle change of the heat dissipation part 31 relative to the clamping part 2 influences the direction of the guided wind flow and the heat dissipation effect. The structural parameter characteristics of the heat dissipation device are determined, and the heat dissipation treatment of the memory module 1 can be better realized.

[0096] S3, the clamping opening 21 of the clamping part 2 is positioned at both sides of the memory module 1, and it is ensured that the heat dissipation part 31 extends obliquely towards the center extension line of the first direction where the clamping opening 21 is located.

[0097] A plurality of heat dissipation devices can be arranged on the memory module 1, and the heat dissipation devices can be positioned on the regions of the memory module 1 which are prone to overheating, and the extension direction of the heat dissipation part 31 is preliminarily determined.

[0098] S4, temperature information of the memory module 1 during work is obtained, and the angle of the heat dissipation part 31 relative to the clamping part 2 is adjusted according to the temperature information and the wind flow information.

[0099] The internal space of the server is provided with a second sensor for detecting the temperature information of the memory module 1, and the real-time temperature of the memory module 1 can be accurately judged through the second sensor.

[0100] The memory module 1 starts to work normally, and the wind flow information of the internal space of the server is confirmed; if the temperature of the memory module 1 is greater than a threshold value, the angle of the heat dissipation part 31 relative to the clamping part 2 is adjusted.

[0101] If the temperature of the memory module 1 is less than or equal to the threshold value within a preset time, the heat dissipation part 31 is no longer adjusted; if the temperature of the memory module 1 is greater than the threshold value within the preset time, the heat dissipation part 31 is continuously adjusted until the temperature of the memory module 1 is less than or equal to the threshold value within the preset time. If the temperature of the memory module 1 is still greater than the threshold value within the preset time, the number of heat dissipation devices on the memory module 1 is increased, the heat dissipation devices on the memory module 1 can be arranged in a uniform direction, specifically, a plurality of memory modules 1 are arranged at intervals along a first direction. The angle of the heat dissipation part 31 of the newly added heat dissipation device relative to the clamping part 2 is adaptively adjusted.

[0102] In the description of the present application, the terms "first", "second" are only used for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0103] In this application, unless otherwise explicitly specified and limited, the terms "installation", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, can be fixed connection, can also be detachable connection, or integrated; can be mechanical connection, can also be electrical connection or can communicate with each other; can be directly connected, can also be indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0104] Although the preferred embodiments of the present application have been described, those skilled in the art can make further changes and modifications to these embodiments once they know the basic inventive concept. Therefore, the appended embodiments are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.

[0105] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the inventive concept and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the present application and its equivalents, the present application also intends to include these changes and variations.

Claims

1. A heat dissipation device, characterized in that: The heat dissipation device includes a clamping part (2), which has a clamping opening (21) extending along a first direction. At least one end of the clamping part (2) along the first direction is provided with a heat dissipation module (3). The heat dissipation module (3) includes at least one heat dissipation section (31). One end of the heat dissipation section (31) is connected to the clamping part (2), and the other end of the heat dissipation section (31) extends away from the clamping opening (21) and obliquely towards the center extension line of the clamping opening (21) in the first direction. The heat dissipation section (31) is provided with a [feature / feature] extending along its [feature / feature]. The heat dissipation module (3) includes a plurality of grooves (41) arranged at intervals in the extension direction. The heat dissipation module (3) includes heat dissipation parts (31) arranged opposite to each other on both sides of the clamp (21). Adjacent heat dissipation parts (31) are spaced apart to form heat dissipation air ducts (32) in the second direction. A heat-conducting part (5) is provided on the inner wall of the clamp (21). The heat-conducting part (5) has a heat-conducting air duct (51). The heat-conducting air duct (51) is arranged opposite to the inner surface of the heat dissipation part (31). The heat-conducting air duct (51) is connected to the heat dissipation air duct (32).

2. The heat dissipation device according to claim 1, characterized in that: The heat dissipation part (31) is rotatably connected to the clamping part (2), and the spacing between adjacent heat dissipation parts (31) is adjustable.

3. The heat dissipation device according to claim 2, characterized in that: The heat dissipation part (31) is connected to the clamping part (2) to form an angle, and the angle range is 30°-45°.

4. The heat dissipation device according to claim 1, characterized in that: The heat dissipation part (31) includes a plurality of segmented parts (33) connected sequentially along its extension direction, and adjacent segmented parts (33) are rotatably connected.

5. The heat dissipation device according to claim 1, characterized in that: The groove (41) is provided through the heat dissipation part (31). The groove (41) forms an outer groove (42) on the outer surface of the heat dissipation part (31). The groove (41) forms an inner groove (43) on the inner surface of the heat dissipation part (31). The width of the outer groove (42) along the extension direction of the heat dissipation part (31) is smaller than the width of the inner groove (43) along the extension direction of the heat dissipation part (31).

6. The heat dissipation device according to claim 5, characterized in that: The inner and / or outer surfaces of the heat dissipation part (31) are planes, and the inner wall of the groove (41) is inclined relative to the plane.

7. The heat dissipation device according to claim 1, characterized in that: The grooves (41) are arranged in a plurality of spaces at intervals in the direction perpendicular to the extension direction of the heat dissipation part (31).

8. The heat dissipation device according to claim 1, characterized in that: The inner and / or outer surfaces of the heat dissipation part (31) are provided with a plurality of connecting grooves (44) arranged at intervals in the vertical direction along its extension direction. The connecting grooves (44) are connected to the plurality of grooves (41), and the two ends of the connecting grooves (44) are respectively connected to the two ends of the heat dissipation part (31) along its extension direction.

9. The heat dissipation device according to claim 8, characterized in that: The depth of the connecting groove (44) is less than the depth of the groove (41), and the connecting groove (44) and the groove (41) are arranged perpendicularly to each other.

10. The heat dissipation device according to claim 1, characterized in that: Multiple sets of heat-conducting parts (5) are respectively provided on the inner walls of the clamp (21). Each set of heat-conducting parts (5) includes two heat-conducting parts (5) arranged opposite to each other. The heat-conducting air duct (51) is formed between the opposite heat-conducting parts (5). The adjacent heat-conducting air ducts (51) are connected through the clamp (21).

11. The heat dissipation device according to claim 10, characterized in that: The inner wall of the clamp (21) is provided with a spring-loaded part (6), the spring-loaded part (6) has a spring-loaded channel (61), the spring-loaded channel (61) is connected to the heat-conducting air duct (51); a fixed shaft (7) is provided on the clamping part (2) at the end of the spring-loaded part (6) away from the spring-loaded channel (61), the clamping part (2) is elastically connected to the fixed shaft (7) so that the clamp (21) can be elastically opened and closed.

12. The heat dissipation device according to claim 10, characterized in that: Composite gaskets (8) are respectively provided on the inner walls of the clamp (21). The composite gaskets (8) are connected to the heat-conducting part (5). The composite gaskets (8) include a heat-conducting substrate layer, a phase change material layer and a heat-conducting silicone layer stacked in sequence. The heat-conducting substrate layer is connected to the clamping part (2).

13. The heat dissipation device according to claim 12, characterized in that: The heat dissipation device also includes a heat pipe (9), which is disposed on the clamping part (2). One end of the heat pipe (9) is connected to the composite gasket (8), and the other end of the heat pipe (9) is connected to the heat dissipation part (31).

14. A method for installing a heat dissipation device, applied to the heat dissipation device as described in any one of claims 1-13, characterized in that, The installation method includes: Obtain the environmental characteristics of the server where the memory module (1) is located, including the spacing information of the components in the circumferential preset area of ​​the memory module (1) and the airflow information; Based on the environmental characteristics, the structural parameter characteristics of the heat dissipation device are determined so that the heat dissipation device is compatible with the memory module (1); Position the clamp (21) of the clamping part (2) on both sides of the memory module (1) to ensure that the heat dissipation part (31) extends obliquely toward the center extension line of the clamp (21) in the first direction; The temperature information of the memory module (1) during operation is obtained, and the angle of the heat dissipation part (31) relative to the clamping part (2) is adjusted according to the temperature information and the airflow information.

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