Heat exchange device and electronic device

Abstract

The application discloses a heat exchange device and electronic equipment, and relates to the technical field of electronic element heat dissipation. The heat exchange device comprises a device body. Liquid medium sequentially passes through a first sub heat exchange cavity, a second sub heat exchange cavity and a third sub heat exchange cavity, and is discharged from the device body after heat exchange. The first needle fin array arranged in the first sub heat exchange cavity can disturb the liquid medium. By enhancing the fluid disturbance, the inside of the heat exchange channel can be scoured to prevent accumulation and blockage. When the liquid medium flows through the first sub heat exchange cavity, the total cross-sectional area of the first medium flow channel formed by different columns of the first needle fin gradually decreases. In this way, the flow of the liquid medium can be accelerated, so that the liquid medium can enter the second sub heat exchange cavity more quickly. By optimizing the flow channel, the heat resistance gradient can be controlled. By reducing the flow resistance, the smoothness of the liquid medium flow can be improved, so that the heat exchange efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic component heat dissipation, and in particular to a heat exchange device and electronic equipment. BACKGROUND

[0002] With the continuous improvement of electronic component performance and the intensification of miniaturization trend, the heat dissipation problem of electronic equipment such as servers, switches, storage devices or personal computers is increasingly prominent. The traditional air cooling method has been difficult to meet the heat dissipation needs of high-performance processors and large-scale integrated circuits. Liquid cooling technology represented by cold plates is the trend of the times. Micro-channel cold plates have become the core technology to solve the problem of high heat flux density heat dissipation due to their micron-level flow channel structure. However, in a high-density deployed cluster, heat is accumulated in large quantities, and when the cooling liquid flows poorly, it will also cause poor local heat dissipation effect, which cannot meet the heat dissipation needs. SUMMARY

[0003] The present application provides a heat exchange device and electronic equipment to at least solve the problem of poor heat dissipation effect for high-power density electronic equipment in the related art.

[0004] The present application provides a heat exchange device, comprising:

[0005] A device body, the inside of the device body is sequentially formed with a first sub-heat exchange cavity, a second sub-heat exchange cavity and a third sub-heat exchange cavity which are interconnected in a first direction, and at least the second sub-heat exchange cavity exchanges heat with an electronic component;

[0006] A first pin fin array is arranged in the first sub-heat exchange cavity, the first pin fin array comprises a plurality of arrayed first pin fins, and a first medium flow channel is formed between any two adjacent first pin fins in the same column or between the first pin fin and the cavity wall of the first sub-heat exchange cavity;

[0007] Wherein, in the first direction, the total cross-sectional area of the first medium flow channels formed by the first pin fins of different columns gradually decreases.

[0008] The present application provides an electronic equipment, comprising an electronic component and the above-mentioned heat exchange device, the heat exchange device exchanges heat with the electronic component.

[0009] Through the application, the liquid medium can be filled into the device body, the liquid medium can be discharged from the device body after sequentially passing through the first, second and third sub heat exchange cavities and realizing heat exchange, the first needle fin array arranged in the first sub heat exchange cavity can disturb the liquid medium, the internal part of the heat exchange channel can be scoured by enhancing the fluid disturbance, so as to prevent the accumulation and blockage and reduce the flow resistance; meanwhile, the total cross-sectional area of the first medium flow channel formed by the first needle fins of different columns gradually decreases when the liquid medium flows through the first sub heat exchange cavity, so the flow of the liquid medium can be accelerated, so that the liquid medium can enter the second sub heat exchange cavity more quickly, and then the liquid medium in the second sub heat exchange cavity can exchange heat with the electronic components, the application can realize the gradient regulation of the thermal resistance by optimizing the flow channel, the flow smoothness of the liquid medium can be improved by reducing the flow resistance, so as to realize the uniform distribution and efficient heat exchange, ensure the heat dissipation effect of the device, and thus realize the effective heat exchange of the electronic equipment. BRIEF DESCRIPTION OF DRAWINGS

[0010] In order to more clearly illustrate the embodiments of the application, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0011] Figure 1 A structural schematic diagram of a heat exchange device provided by the embodiments of the application;

[0012] Figure 2 An exploded schematic diagram of the first cold plate and the second cold plate provided by the embodiments of the application;

[0013] Figure 3 An exploded schematic diagram of the first cold plate and the second cold plate provided by the embodiments of the application from another perspective.

[0014] Among them, the above drawings include the following reference signs:

[0015] 1, device body; 101, medium inlet; 102, medium outlet; 103, first sub heat exchange cavity; 104, second sub heat exchange cavity; 105, third sub heat exchange cavity; 11, first cold plate; 111, first groove; 12, second cold plate; 121, second groove; 13, sealing ring; 14, liquid delivery pipe; 15, fastener;

[0016] 2, first needle fin;

[0017] 3, second needle fin; 31, spoiler rod;

[0018] 4, spoiler plate. DETAILED DESCRIPTION

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0020] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0021] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0022] Reference Figures 1 to 3 As shown, an embodiment of this application provides a heat exchange device, including a device body 1 and a first needle fin array. The device body 1 has good thermal conductivity and mechanical strength, and its specific size can be adjusted according to the layout of electronic components and heat dissipation requirements.

[0023] The inside of the device body 1 is formed with a through heat exchange channel, i.e., the first sub heat exchange cavity 103, the second sub heat exchange cavity 104 and the third sub heat exchange cavity 105 which are in communication with each other, two ends of the heat exchange channel are formed into the medium inlet 101 and the medium outlet 102, the medium inlet 101 and the medium outlet 102 are usually located at opposite sides of the device body 1, for example, the medium inlet 101 is arranged at the left side and the medium outlet 102 is arranged at the right side, or the medium inlet 101 is arranged at the right side and the medium outlet 102 is arranged at the left side. Further, the medium inlet 101 is arranged corresponding to the first sub heat exchange cavity 103 and the medium outlet 102 is arranged corresponding to the third sub heat exchange cavity 105.

[0024] Specifically, the medium inlet 101 and the medium outlet 102 can be connected with the external heat exchange system through the infusion tube 14 to form a closed heat exchange cycle.

[0025] The heat exchange channel is filled with liquid medium, when the liquid medium flows in the heat exchange channel, the heat generated by the electronic components can be taken away by the device body 1, in the first direction (i.e., the direction of the first sub heat exchange cavity 103 towards the second sub heat exchange cavity 104, also the flow direction of the liquid medium), the heat exchange channel is formed into the first sub heat exchange cavity 103, the second sub heat exchange cavity 104 and the third sub heat exchange cavity 105 in sequence, and the first sub heat exchange cavity 103, the second sub heat exchange cavity 104 and the third sub heat exchange cavity 105 are in communication in sequence, at least the second sub heat exchange cavity 104 exchanges heat with the electronic components, i.e., the second sub heat exchange cavity 104 directly exchanges heat with the electronic components as the main heat exchange component, the first sub heat exchange cavity 103 is in communication with the medium inlet 101, the initial distribution and pre-heat exchange of the liquid medium can be realized through the first sub heat exchange cavity 103, the third sub heat exchange cavity 105 is in communication with the medium outlet 102, the collection and discharge of the heated liquid medium can be realized through the third sub heat exchange cavity 105. Specifically, the second sub heat exchange cavity 104 can account for 50%-70% of the length of the whole heat exchange channel to ensure the heat exchange effect of the heat exchange device.

[0026] The first needle fin array is arranged in the first sub heat exchange cavity 103, the first needle fin array includes a plurality of arrayed first needle fins 2, i.e., a plurality of first needle fins 2 are arranged in a matrix form to form a plurality of rows and a plurality of columns, the column direction is perpendicular to the first direction and the row direction is parallel to the first direction. First medium flow channels are formed between any two adjacent first needle fins 2 in the same column or between the first needle fin 2 and the cavity wall of the first sub heat exchange cavity 103, and the liquid medium flows through the first medium flow channels.

[0027] That is to say, in the same column of first needle fins 2, first medium flow channels are formed between the two adjacent first needle fins 2, and first medium flow channels are also formed between the first needle fin 2 at the end position and the cavity wall of the corresponding side first sub heat exchange cavity 103.

[0028] Wherein, in the first direction, the total cross-sectional area of the first medium flow channels formed by the first pin fins 2 of different columns gradually decreases. That is, the first sub heat exchange cavity 103 distributes and accelerates the liquid medium through the first pin fin array, and due to the decrease of the total cross-sectional area of the first medium flow channel, the liquid medium flow rate increases, the pressure energy is converted into kinetic energy, the turbulent flow effect is enhanced, the heat exchange efficiency is improved, the local overheating is prevented, and the heat dissipation demand of high-performance electronic equipment under high load is met. Specifically, the total cross-sectional area refers to the sum of the cross-sectional areas of all first medium flow channels in a column.

[0029] Through the present application, the liquid medium can enter the heat exchange channel through the medium inlet 101, and then pass through the first sub heat exchange cavity 103, the second sub heat exchange cavity 104 and the third sub heat exchange cavity 105. The liquid medium realizes heat exchange and can be discharged through the medium outlet 102 at the third sub heat exchange cavity 105. By arranging the first pin fin array in the first sub heat exchange cavity 103, the liquid medium can be disturbed, the flow disturbance of the fluid can be enhanced, the inside of the heat exchange channel can be flushed, and the accumulation and blockage can be prevented. At the same time, the total cross-sectional area of the first medium flow channel formed by the first pin fins 2 of different columns gradually decreases when the liquid medium flows through the first sub heat exchange cavity 103. In this way, the flow of the liquid medium can be accelerated, so that the liquid medium can enter the second sub heat exchange cavity 104 more quickly, and then the liquid medium in the second sub heat exchange cavity 104 can exchange heat with the electronic components. The present application can realize gradient regulation of thermal resistance by optimizing the flow channel, can improve the smoothness of the flow of the liquid medium by reducing the flow resistance, can realize uniform distribution and efficient heat exchange, can ensure the heat dissipation effect of the device, and can realize effective heat exchange of the electronic equipment.

[0030] It should be noted that the external heat exchange system can be a refrigerator or a heater, so that when the electronic components are overheated, the refrigerator can be connected to cool and dissipate heat from the electronic components, and when the external environment is too cold, the heater can be connected to ensure that the electronic components can operate normally.

[0031] In some embodiments, in the first direction, the number of first pin fins 2 contained in different columns of first pin fins 2 gradually increases. Specifically, in the first direction, the number of first pin fins 2 contained in different columns of first pin fins 2 gradually increases. For example, the first column has 8 first pin fins 2, the second column has 10 first pin fins 2, the third column has 12 first pin fins 2, and so on. The increase in the number of first pin fins 2 is realized by reducing the spacing between adjacent first pin fins 2, while keeping the size of the first pin fins 2 unchanged, so that the number of first medium flow channels increases, but the width of each first medium flow channel decreases, and the total cross-sectional area of the first medium flow channels of different columns gradually decreases.

[0032] In other embodiments, in the first direction, the size of the first needle fins 2 included in different columns of the first needle fins 2 gradually increases. Specifically, the size of the first needle fin 2 includes either a diameter or a width; for example, the diameter of the first needle fin 2 in the first column is 0.2 mm, increasing to 0.25 mm in the second column, and increasing to 0.3 mm in the third column. Meanwhile, the spacing between the centerlines of the first needle fins 2 can remain constant or decrease slightly, but due to the increased size, the gap between adjacent first needle fins 2 (i.e., the width of the first medium flow channel) decreases, resulting in a decrease in the total cross-sectional area.

[0033] In some other embodiments, in the first direction, the spacing between adjacent first needle fins 2 in different columns of first needle fins 2 gradually decreases. Here, the spacing refers to the distance between the outer surfaces of adjacent first needle fins 2. For example, the spacing in the first column is 0.2 mm, the spacing in the second column is reduced to 0.15 mm, and the spacing in the third column is reduced to 0.1 mm. This increases the adaptability of the size of the first needle fins 2. Thus, the reduction in spacing directly leads to a reduction in the width of the first medium flow channel, thereby reducing the total cross-sectional area.

[0034] Of course, the above methods can be used individually or in combination to achieve a more flexible flow channel design by changing the number and size of the first needle fins 2, and to adjust the flow channel characteristics. After the liquid medium enters from the medium inlet 101, it encounters the gradually denser array of first needle fins, which increases the flow velocity and makes the pressure distribution more uniform. By adjusting the flow characteristics of the liquid medium, dead zones in the flow can be avoided, heat exchange efficiency and pressure recovery can be improved, energy consumption can be reduced, and different heat load conditions can be adapted.

[0035] In some embodiments, refer to Figure 2 As shown, the heat exchange device also includes a second needle fin array, which is disposed within the second sub-heat exchange cavity 104. The second needle fin array comprises multiple second needle fins 3 arranged in an array, i.e., multiple second needle fins 3 arranged in a matrix to form multiple rows and columns. The column direction is perpendicular to the first direction, and the row direction is parallel to the first direction. A second medium flow channel is formed between any two adjacent second needle fins 3 in the same column or between a second needle fin 3 and the cavity wall of the second sub-heat exchange cavity 104, through which the liquid medium flows.

[0036] In other words, in the same row of second needle fins 3, a second medium flow channel is formed between two adjacent second needle fins 3, and a second medium flow channel is also formed between the second needle fin 3 located at the end position and the cavity wall of the corresponding side second sub-heat exchange cavity 104.

[0037] It should be noted that the second sub-heat exchange cavity 104 is the main heat exchange area, and the second needle fin array is directly thermally coupled to the electronic components. By increasing the heat exchange area and enhancing turbulence, the heat dissipation efficiency is improved. After the liquid medium flows from the first sub-heat exchange cavity 103 into the second sub-heat exchange cavity 104, it is divided into multiple fine streams by the second needle fins 3 to ensure uniform contact with the heat source.

[0038] In a specific implementation, the design of the second pin fin array can be matched with the layout of the electronic components, for example, the arrangement density of the second pin fin 3 can be adjusted according to the heat source distribution, for example, the pin fin density is increased in the hot spot area; or for a multi-core processor, the second pin fin 3 is densified at the corresponding core position.

[0039] Wherein, the first pin fin 2 and the second pin fin 3 are integrally formed with the device body 1, which ensures the disturbance effect and avoids flow dead zones.

[0040] In some embodiments, in the first direction, the total cross-sectional area of the first medium flow channel formed by any column of first pin fins 2 is less than or equal to the total cross-sectional area of the second medium flow channel formed by any column of second pin fins 3, that is, the liquid medium expands the flow channel and reduces the flow rate when entering the second sub heat exchange cavity 104 from the first sub heat exchange cavity 103, the liquid medium pressurized by the first pin fin array recovers the pressure in the second sub heat exchange cavity 104, which is conducive to achieving uniform heat exchange and ensuring the heat exchange effect of the electronic components.

[0041] In the first direction, the third medium flow channel is formed between the two side cavity walls of the third sub heat exchange cavity 105, and the total cross-sectional area of the third medium flow channel at any position is less than or equal to the total cross-sectional area of the second medium flow channel formed by any column of second pin fins 3. That is, the third medium flow channel is a continuous channel without pin fin structure, and the total cross-sectional area at any position is less than or equal to the total cross-sectional area of the second medium flow channel formed by any column of second pin fins 3. By such arrangement, the flow rate of the liquid medium can be increased before flowing out of the medium outlet 102, and deposition and flow separation of impurities can be avoided.

[0042] That is, in the first direction, the first medium flow channel, the second medium flow channel and the third medium flow channel in the heat exchange channel as a whole exhibit the characteristic of first expansion and then contraction, that is, the first sub heat exchange cavity 103 accelerates the flow of liquid medium by reducing the area of the first medium flow channel, the second sub heat exchange cavity 104 realizes stable heat exchange by the larger area of the second medium flow channel, and the third sub heat exchange cavity 105 promotes the discharge of liquid medium by the smaller area of the third medium flow channel, which improves the flow continuity of the liquid medium and reduces the pressure loss.

[0043] The device realizes smooth transition of the flow rate of the liquid medium by reasonable setting of the flow area, improves the uniformity and efficiency of heat exchange, reduces vortex and energy loss, and prolongs the service life of the equipment.

[0044] In a specific implementation, the change of the flow area is realized by the coordinated design of the cavity structure and the pin fin array, that is, the cavity structure can be gradually contracted or gradually expanded, or the pin fin array can be gradually dense, or both features can be combined to achieve the actual required change of the flow area.

[0045] Further, the liquid medium can be monitored by a pressure sensor when flowing, and the pump speed can be adjusted by feedback to the control system to maintain the optimal flow rate, ensure the heat exchange effect, and avoid energy waste.

[0046] In some embodiments, the width of the first media flow channel formed by the first needle fins 2 of any column is less than or equal to the width of the second media flow channel formed by the second needle fins 3 of any column, and / or the height of the first media flow channel formed by the first needle fins 2 of any column is less than or equal to the height of the second media flow channel formed by the second needle fins 3 of any column, and / or the number of the first media flow channels formed by the first needle fins 2 of any column is less than or equal to the number of the second media flow channels formed by the second needle fins 3 of any column.

[0047] It can be understood that, under the condition that the height and the number of the first media flow channel and the second media flow channel are the same, when the width of the first media flow channel formed by the first needle fins 2 of any column is less than or equal to the width of the second media flow channel formed by the second needle fins 3 of any column, the total cross-sectional area of the first media flow channel formed by the first needle fins 2 of any column can be less than or equal to the total cross-sectional area of the second media flow channel formed by the second needle fins 3 of any column.

[0048] Alternatively, under the condition that the width and the number of the first media flow channel and the second media flow channel are the same, when the height of the first media flow channel formed by the first needle fins 2 of any column is less than or equal to the height of the second media flow channel formed by the second needle fins 3 of any column, the total cross-sectional area of the first media flow channel formed by the first needle fins 2 of any column can also be less than or equal to the total cross-sectional area of the second media flow channel formed by the second needle fins 3 of any column.

[0049] Alternatively, under the condition that the width and the height of the first media flow channel and the second media flow channel are the same, when the number of the first media flow channel formed by the first needle fins 2 of any column is less than or equal to the number of the second media flow channel formed by the second needle fins 3 of any column, the total cross-sectional area of the first media flow channel formed by the first needle fins 2 of any column can also be less than or equal to the total cross-sectional area of the second media flow channel formed by the second needle fins 3 of any column.

[0050] Of course, the above-mentioned manners can be used alone or in combination to present the array density of the first needle fin array less than or equal to the array density of the second needle fin array by changing the width, the height and the number of the first media flow channel and the second media flow channel, so as to realize more flexible flow channel design and adjust the flow channel characteristics to optimize the distribution.

[0051] In some embodiments, the width of the third medium channel at any location is less than or equal to the width of the second medium channel formed by the second needle fins 3 in any column; and / or, the height of the third medium channel at any location is less than or equal to the height of the second medium channel formed by the second needle fins 3 in any column.

[0052] In other words, under the condition that the height of the third medium flow channel and the second medium flow channel are the same, when the width of the third medium flow channel at any position is less than or equal to the width of the second medium flow channel formed by the second needle fins 3 in any column, the total cross-sectional area of ​​the third medium flow channel at any position is less than or equal to the total cross-sectional area of ​​the second medium flow channel formed by the second needle fins 3 in any column.

[0053] Alternatively, under the condition that the widths of the third medium flow channel and the second medium flow channel are the same, when the height of the third medium flow channel at any position is less than or equal to the height of the second medium flow channel formed by the second needle fins 3 in any column, the total cross-sectional area of ​​the third medium flow channel at any position can also be less than or equal to the total cross-sectional area of ​​the second medium flow channel formed by the second needle fins 3 in any column.

[0054] Of course, the above methods can be used individually or in combination. By varying the width and height of the third and second medium channels, more flexible channel designs can be achieved to further improve flow distribution and heat transfer performance, reduce local hot spots and pressure drop, and enhance heat dissipation reliability and energy efficiency.

[0055] In other embodiments, the above-mentioned effect can also be achieved by increasing the overall width and height of the second sub-heat exchange cavity 104, for example, by widening and / or deepening the second sub-heat exchange cavity 104 relative to the first sub-heat exchange cavity 103 and the third sub-heat exchange cavity 105. This application does not limit this.

[0056] In some embodiments, refer to Figure 2 As shown, the second needle fin 3 includes a vertically arranged second rod, which is formed into a cylindrical or prismatic structure. For example, the second rod can be a triangular prism, a quadrangular prism, or a hexagonal prism. A turbulence-disrupting rod 31 is provided on the second rod, which intersects with the second rod, that is, the turbulence-disrupting rod 31 extends from the side of the second rod. The turbulence-disrupting rod 31 and the second rod can form a cross-shaped or T-shaped structure. As an additional disturbance element, the turbulence-disrupting rod 31 can generate eddies when the liquid medium flows through the second rod and the turbulence-disrupting rod 31. By destroying the boundary layer, the fluid thermal resistance can be further reduced and the heat transfer efficiency can be improved.

[0057] Specifically, the height of the second rod can be the same as the height of the second sub-heat exchange cavity 104. The turbulence rod 31 can be perpendicular to the second rod or at a certain angle, such as 45 degrees, etc., and this application does not limit this.

[0058] Further, the spoiler rod 31 is rotationally connected with the second rod body, and the spoiler rod 31 can automatically rotate relative to the second rod body under the flow action of the liquid medium to change the flow angle, that is, the spoiler rod 31 becomes a movable part and can adjust the position according to the fluid dynamics to continuously generate disturbance. The rotation of the spoiler rod 31 is driven by the flow of the liquid medium without external power. In this way, the spoiler rod 31 can adapt to the flow conditions, optimize the disturbance effect, improve the heat exchange efficiency and adaptability, and reduce the risk of fouling.

[0059] Specifically, the spoiler rod 31 is connected with the second rod body through a hinge or a bearing or a sleeve structure, allowing the spoiler rod 31 to rotate around the second rod body, and the rotation axis of the spoiler rod 31 is parallel to the central axis of the second rod body.

[0060] Of course, a damping structure can be provided between the spoiler rod 31 and the second rod body to ensure the relative rotation or relative fixation between the spoiler rod 31 and the second rod body as needed, suitable for heat exchange requirements in multiple scenarios.

[0061] In some embodiments, continuing to refer to Figure 2 As shown, the spoiler rod 31 is provided as at least two, and the at least two spoiler rods 31 are arranged at intervals along the length direction of the second rod body. It can be understood that the second medium flow channel is formed between the adjacent two second rod bodies, and the second medium flow channel is also formed between the adjacent two spoiler rods 31. In this application, the total cross-sectional area of the second medium flow channel formed by any column of second needle fins 3 includes the cross-sectional area of the second medium flow channel between the adjacent two second rod bodies, the cross-sectional area of the second medium flow channel between the adjacent two spoiler rods 31, and the cross-sectional area of the second medium flow channel between the second needle fin 3 and the cavity wall of the second sub-heat exchange cavity 104.

[0062] That is, the multiple spoiler rods 31 form a multi-layer disturbance structure on the second rod body, and the liquid medium experiences multiple vortex generation when flowing through. Through the cooperation of the second rod body and the multi-layer spoiler rod 31, the mixing effect and the turbulence intensity are enhanced, the temperature distribution is more uniform, and it is suitable for high-power electronic components.

[0063] Exemplarily, two spoiler rods 31 are arranged on the second rod body, one is located at the upper part of the second rod body, and the other is located at the lower part of the second rod body, and is arranged at a certain distance. Further, the spoiler rods 31 can be the same or different sizes, for example, the spoiler rod 31 located at the upper part is shorter, and the spoiler rod 31 located at the lower part is longer, so that multi-layer gradient disturbance can be generated.

[0064] In some embodiments, referring to Figure 2As shown, at least one spoiler 4 is arranged in the second sub heat exchange cavity 104, and the spoiler 4 is located between adjacent second pin fins 3, that is, the spoiler 4 fills the gap of the second pin fin array. It can be understood that the spoiler 4 is complementary to the second pin fin array, and the spoiler 4 provides point disturbance through the second pin fin 3 and provides planar guidance to jointly optimize the flow path. Specifically, the spoiler 4 is fixed to the bottom of the second sub heat exchange cavity 104 through a slot or adhesion. When the liquid medium flows, the spoiler 4 generates a guided flow and a separated flow, thereby enhancing the heat exchange effect.

[0065] In a specific implementation, the spoiler 4 includes a flat plate segment and an arc-shaped plate segment. The flat plate segment extends in the first direction, that is, the spoiler 4 is parallel to the flow direction of the liquid medium. In the first direction, the arc-shaped plate segment is located at the front end of the flat plate segment. When the liquid medium flows, the liquid medium first passes through the flat plate segment and then flows through the arc-shaped plate segment under the guidance of the flat plate segment. The spoiler 4 is arranged in a spaced manner with the second pin fin 3, and the flow path formed by the spoiler 4 and the second pin fin 3 can increase the flowability of the liquid medium in the second sub heat exchange cavity 104, thereby avoiding local overheating.

[0066] Of course, the spoiler 4 can also be arranged in an inclined manner to the flow direction of the liquid medium, and the present application does not limit this as long as the spoiler 4 can be used to guide and disturb the liquid medium to enhance the disturbance.

[0067] In some embodiments, the second sub heat exchange cavity 104 has a plurality of interval ranges in the first direction.

[0068] At least two spoilers 4 are arranged in the same interval range, and the arc-shaped plate segments of the adjacent two spoilers 4 are arranged in a back-to-back or opposite manner, so that the width of the flow path formed between the arc-shaped plate segments of the two spoilers 4 gradually increases or gradually decreases. Specifically, when the arc-shaped plate segments of the two spoilers 4 are arranged in a back-to-back manner, the two arc-shaped plate segments are respectively directed to two sides, and the width of the flow path formed between the two arc-shaped plate segments gradually increases. When the arc-shaped plate segments of the two spoilers 4 are arranged in an opposite manner, the two arc-shaped plate segments are directed to each other, so that the width of the flow path gradually decreases. That is, by arranging the variable cross-section flow path, the liquid medium can experience the acceleration and deceleration processes, thereby enhancing the turbulent flow and heat exchange effect.

[0069] In another embodiment, the spoilers 4 are arranged in the plurality of interval ranges in the first direction, and the widths of the flow paths formed by the arc-shaped plate segments of the spoilers 4 in the adjacent two interval ranges gradually increase or gradually decrease. Specifically, the width of the flow path gradually increases in the interval range on the front side of the first direction, and the width of the flow path gradually decreases in the interval range on the rear side of the first direction. Alternatively, the width of the flow path gradually decreases in the interval range on the front side of the first direction, and the width of the flow path gradually increases in the interval range on the rear side of the first direction. In this way, the flow path in the first direction can form a fluctuation.

[0070] It can be understood that by setting the specific positions of the plurality of spoilers 4, periodic or non-periodic pressure fluctuations can be formed in the second sub-heat exchange cavity 104, which can promote the mixing of the liquid medium, avoid local overheating, and improve the uniformity of heat exchange.

[0071] For example, referring to Figure 2 As shown in the figure, the second sub-heat exchange cavity 104 is formed with two interval ranges on the left and right. In the row direction (i.e., the direction parallel to the flow direction of the liquid medium), the orientations of the arc-shaped plate segments of the two spoilers 4 corresponding in position are opposite. In the column direction (i.e., the direction perpendicular to the flow direction of the liquid medium), the orientations of the arc-shaped plate segments of the two spoilers 4 corresponding in position are also opposite. In this way, a higher disturbance effect is achieved.

[0072] In some embodiments, the first needle fin 2 includes a first rod body arranged vertically, which is formed as a cylindrical structure or a prism structure. For example, the first rod body can be a triangular prism, a quadrangular prism, or a hexagonal prism structure. The cylindrical structure can provide uniform flow resistance, and the prism structure can enhance vortex generation. The specific implementation can be selected according to actual needs. In specific implementation, the height of the second rod body can be consistent with the height of the second sub-heat exchange cavity 104.

[0073] In some embodiments, the wall surface at the front end of the third sub-heat exchange cavity 105 in the first direction is formed as an arc-shaped wall surface. That is, when the liquid medium impacts the cavity wall of the third sub-heat exchange cavity 105, the arc-shaped wall surface can be used for buffering to avoid generating too large a disturbance, thereby improving the discharge efficiency of the liquid medium.

[0074] Further, the arc-shaped wall surface is formed as a minor arc wall surface, that is, the arc length of the arc-shaped wall surface is smaller than the arc length of a semicircular arc with the same radius. In this way, the third medium passage in the third sub-heat exchange cavity 105 can be formed as a tapered structure to accelerate the discharge efficiency of the liquid medium.

[0075] In some embodiments, the device body 1 includes a first cold plate 11 and a second cold plate 12 stacked above the first cold plate 11. After the first cold plate 11 and the second cold plate 12 are connected, the first sub-heat exchange cavity 103, the second sub-heat exchange cavity 104, and the third sub-heat exchange cavity 105 are formed between the first cold plate 11 and the second cold plate 12, that is, a heat exchange passage is formed between the first cold plate 11 and the second cold plate 12. It can be understood that by using a split cold plate structure design, the processing and assembly process is simplified, the maintainability and applicability are improved, and the device is suitable for various electronic equipment layouts.

[0076] Specifically, the first cold plate 11 and the second cold plate 12 are both made of high thermal conductivity materials, such as copper or aluminum. The first cold plate 11 and the second cold plate 12 can be fixedly connected by a fastener 15, such as a bolt, welding, or adhesion.

[0077] In specific implementation, referring to Figure 2and Figure 3 As shown, the top surface of the first cold plate 11 is provided with a first groove 111, and the bottom surface of the second cold plate 12 is provided with a second groove 121. The openings of the first groove 111 and the second groove 121 are opposite to each other to jointly form a heat exchange channel. Specifically, the openings of the first groove 111 and the second groove 121 are aligned to form a complete heat exchange channel. The depths of the first groove 111 and the second groove 121 are each half of the height of the heat exchange channel, or the depth of the second groove 121 accounts for a larger proportion and the depth of the first groove 111 accounts for a smaller proportion, which is not limited in the present application and can be specifically set according to actual needs.

[0078] A sealing ring 13 is arranged between the first cold plate 11 and the second cold plate 12. The sealing ring 13 is arranged outside the first groove 111 and the second groove 121, which can avoid leakage of the liquid medium in the first groove 111 and the second groove 121, ensure the sealing property, and improve the service life and safety. Specifically, the sealing ring 13 can be a rubber ring.

[0079] In some embodiments, the top of the first cold plate 11 is provided with a sink, and the bottom of the second cold plate 12 is provided with a boss which is inserted into the sink, so as to realize the pre-positioning between the first cold plate 11 and the second cold plate 12 and facilitate subsequent installation. The first groove 111 is arranged at the bottom of the sink, and the second groove 121 is arranged at the top surface of the boss.

[0080] It should be noted that the first medium channel, the second medium channel and the third medium channel can be formed into a micron-level slit heat dissipation channel, so that the contact area of the liquid medium and the heat source, i.e., the electronic element, is exponentially expanded, and the local hot spots are effectively eliminated.

[0081] In the present application, the liquid medium flow heat exchange mode is used for cooling or heating, the micro-slit channel can reduce the flow resistance and improve the heat dissipation efficiency, and different pin fin arrays and different shapes of heat exchange cavities are used according to different heating areas on the electronic element, so as to ensure the heat exchange efficiency in the high-temperature area, realize the targeted heat dissipation of the local hot spots, and solve the problem that the existing heat dissipation modes, such as fan heat dissipation and heat pipe heat dissipation, can meet the heat dissipation demand to a certain extent, but when facing high-power density and compact electronic equipment, due to the large size and simple structure, the heat dissipation efficiency and space utilization often cannot reach the ideal state, the application range is small, and the heat dissipation effect is poor.

[0082] By using two types of needle-fin arrays with non-uniform gradient distribution to turbulence, and adjusting the density and height of the needle fins according to the heat source distribution, targeted heat dissipation of local hot spots can be achieved. At the same time, the introduction of multi-level gradient distribution allows the liquid medium to gradually adapt to the pressure drop and heat transfer requirements during the flow process, and increases the heat exchange efficiency of the liquid medium flowing in the heat exchange channel. By designing variable cross-section microchannels, such as increasing the channel width or height (depth) in high-temperature regions, flow resistance can be reduced and heat dissipation efficiency can be improved, ensuring the heat exchange effect of the device.

[0083] Embodiments of this application also provide an electronic device, including electronic components and a heat exchange device according to any of the above embodiments, wherein the heat exchange device exchanges heat with the electronic components.

[0084] The electronic device provided in this application includes the heat exchange device of any of the above embodiments, and therefore has the beneficial effects of the heat exchange device of any of the above embodiments, which will not be repeated here.

[0085] The above provides a detailed description of a heat exchange device and electronic device provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A heat exchange device, characterized in that, include: The device body (1) has a first sub-heat exchange cavity (103), a second sub-heat exchange cavity (104) and a third sub-heat exchange cavity (105) that are interconnected in sequence along a first direction. At least the second sub-heat exchange cavity (104) exchanges heat with the electronic components. The first needle fin array is disposed in the first sub-heat exchange cavity (103). The first needle fin array includes multiple first needle fins (2) arranged in an array. A first medium flow channel is formed between any two adjacent first needle fins (2) in the same column or between the first needle fin (2) and the cavity wall of the first sub-heat exchange cavity (103). In the first direction, the total cross-sectional area of ​​the first medium flow channel formed by the first needle fins (2) of different columns gradually decreases; The heat exchange device further includes a second needle fin array, which is disposed in the second sub-heat exchange cavity (104). The second needle fin array includes multiple second needle fins (3) arranged in an array. A second medium flow channel is formed between any two adjacent second needle fins (3) in the same column or between the second needle fin (3) and the cavity wall of the second sub-heat exchange cavity (104). In the first direction, the total cross-sectional area of ​​the first medium flow channel formed by the first needle fins (2) in any column is less than or equal to the total cross-sectional area of ​​the second medium flow channel formed by the second needle fins (3) in any column; A third medium flow channel is formed between the two side walls of the third sub-heat exchange cavity (105). In the first direction, the total cross-sectional area of ​​the third medium flow channel at any position is less than or equal to the total cross-sectional area of ​​the second medium flow channel formed by any column of the second needle fins (3).

2. The heat exchange device according to claim 1, characterized in that, The second needle fin (3) includes a vertically arranged second rod body, which is formed as a cylindrical structure or a prism structure. A baffle rod (31) is provided on the second rod body, and the baffle rod (31) intersects with the second rod body.

3. The heat exchange device according to claim 2, characterized in that, The spoiler rod (31) is rotatably connected to the second rod body.

4. The heat exchange device according to claim 2, characterized in that, The deflector bar (31) is provided in at least two, and the at least two deflector bars (31) are spaced apart along the length direction of the second bar body.

5. The heat exchange device according to claim 2, characterized in that, At least one baffle plate (4) is also provided in the second sub-heat exchange cavity (104), and the baffle plate (4) is located between adjacent second needle fins (3).

6. The heat exchange device according to claim 5, characterized in that, The spoiler (4) includes a flat plate segment and an arc-shaped plate segment. The flat plate segment extends along the first direction, and the arc-shaped plate segment is located at the front end of the flat plate segment in the first direction.

7. The heat exchange device according to claim 6, characterized in that, In the first direction, the second sub-heat exchange cavity (104) has multiple interval ranges; At least two of the aforementioned baffles (4) are provided within the same interval, and the arc-shaped plate segments in two adjacent baffles (4) are arranged opposite to each other, so that the width of the flow channel formed between the arc-shaped plate segments of the two baffles (4) gradually increases or gradually decreases; And / or, the baffles (4) are provided in the first direction in multiple intervals, and the width of the flow channel formed by the arc-shaped plate segments of the baffles (4) in two adjacent intervals gradually increases and decreases.

8. The heat exchange device according to claim 1, characterized in that, The width of the first medium flow channel formed by the first needle fin (2) in any column is less than or equal to the width of the second medium flow channel formed by the second needle fin (3) in any column; And / or, the height of the first medium flow channel formed by the first needle fin (2) in any column is less than or equal to the height of the second medium flow channel formed by the second needle fin (3) in any column; And / or, the number of first medium channels formed by the first needle fins (2) in any column is less than or equal to the number of second medium channels formed by the second needle fins (3) in any column; And / or, the width of the third medium channel at any position is less than or equal to the width of the second medium channel formed by the second needle fins (3) in any column; And / or, the height of the third medium channel at any position is less than or equal to the height of the second medium channel formed by the second needle fins (3) in any column.

9. The heat exchange device according to any one of claims 1 to 8, characterized in that, In the first direction, the number of first needle wings (2) contained in different columns of first needle wings (2) gradually increases; And / or, in the first direction, the size of the first needle wing (2) contained in different columns of the first needle wing (2) gradually increases; And / or, in the first direction, the spacing between adjacent first needle wings (2) in different columns of the first needle wings (2) gradually decreases.

10. The heat exchange device according to any one of claims 1 to 8, characterized in that, The first needle wing (2) includes a first rod arranged vertically, which is formed as a cylindrical structure or a prism structure.

11. The heat exchange device according to any one of claims 1 to 8, characterized in that, The wall surface of the third sub-heat exchange cavity (105) along the first direction is formed as an arc-shaped wall surface.

12. The heat exchange device according to any one of claims 1 to 8, characterized in that, The device body (1) includes a first cold plate (11) and a second cold plate (12) stacked on top of the first cold plate (11). After the first cold plate (11) and the second cold plate (12) are connected, the first sub-heat exchange cavity (103), the second sub-heat exchange cavity (104) and the third sub-heat exchange cavity (105) are formed between the first cold plate (11) and the second cold plate (12).

13. An electronic device, characterized in that, It includes electronic components and a heat exchange device as described in any one of claims 1 to 12, wherein the heat exchange device exchanges heat with the electronic components.

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