Data acquisition module preparation method, data acquisition module and dental orthodontic device

Abstract

The application provides a data acquisition module preparation method, a data acquisition module and a tooth corrector, relates to the technical field of medical instrument manufacturing, and the data acquisition module preparation method comprises the following steps: preparing a sensitive gate structure on a flexible substrate through physical deposition and a photolithography process to obtain a sensor; and integrating the sensor and a passive data processing chip in one piece to obtain a data acquisition module, wherein the passive data processing chip comprises an induction power supply unit, a signal amplifier, a signal filter and a wireless communication unit. The application can prepare the data acquisition module integrated with the flexible sensor and the passive data processing chip in one piece, and the data acquisition module can be applied to the tooth corrector to realize real-time monitoring of tooth stress and displacement.

Description

Technical Field

[0001] This invention relates to the field of medical device manufacturing technology, and in particular to a method for preparing a data acquisition module, a data acquisition module, and a dental orthodontic appliance. Background Technology

[0002] In the field of orthodontics, traditional metal braces have long held an important position in the correction of malocclusion as classic orthodontic appliances. These appliances mainly consist of metal brackets, archwires, and ligatures. Their orthodontic mechanism relies on mechanical force transmission. By having the dentist manually bend the archwire and adjust the ligature force, the position of the teeth and the occlusal relationship are gradually adjusted.

[0003] In clinical application, the setting and adjustment of the corrective force of metal braces highly depends on the professional experience and clinical skills of the orthodontist. The orthodontist must estimate and set the initial corrective force based on the individual patient's type and severity of malocclusion, combined with imaging data and accumulated practical experience. Subsequently, the management of the treatment process revolves around a regular follow-up appointment system, typically requiring patients to visit the medical institution for regular checkups. During these visits, the orthodontist uses traditional examination methods such as visual observation and intraoral probing, combined with the patient's subjective feedback, to empirically adjust the corrective force.

[0004] In existing technologies, metal braces cannot provide real-time, dynamic monitoring of tooth force and displacement changes. During actual treatment, the lack of precise mechanical data makes it difficult for dentists to accurately grasp the actual response of each tooth under orthodontic force. This easily leads to a mismatch between the applied orthodontic force and the physiological movement requirements of the teeth, resulting in over-force application. Over-force can not only cause increased pain and root resorption, but also interfere with the normal periodontal remodeling process, reducing tooth movement efficiency and significantly prolonging the overall treatment period. Furthermore, the lack of real-time, accurate monitoring data for adjustment introduces significant subjectivity and uncertainty into the orthodontic force adjustment process, easily leading to deviations in force direction and inaccurate force control. Ultimately, this results in a deviation from the initial treatment plan, making it difficult to achieve the desired dentofacial morphology and occlusal function reconstruction goals. Summary of the Invention

[0005] This invention provides a method for preparing a data acquisition module, a data acquisition module, and a dental orthodontic appliance, in order to solve the defect in the prior art that dental orthodontic appliances cannot monitor the force and displacement of teeth in real time, and to realize real-time monitoring of the force and position of teeth.

[0006] This invention provides a method for preparing a data acquisition module, comprising:

[0007] A sensor is obtained by fabricating a sensitive gate structure on a flexible substrate using physical deposition and photolithography.

[0008] The sensor and the passive data processing chip are integrated into one unit to obtain the data acquisition module. The passive data processing chip includes an inductive power supply unit, a signal amplifier, a signal filter, and a wireless communication unit.

[0009] According to a method for preparing a data acquisition module provided by the present invention, the flexible substrate is made of polymer.

[0010] According to a method for preparing a data acquisition module provided by the present invention, the flexible substrate is made of polyimide.

[0011] According to a method for fabricating a data acquisition module provided by the present invention, the method comprises integrating the sensor and a passive data processing chip into a single unit to obtain the data acquisition module, including:

[0012] The sensor and the passive data processing chip are integrated into a single fabrication, such that the wiring patterns of the sensor and the passive data processing chip are interconnected.

[0013] According to the present invention, a method for preparing a data acquisition module is provided.

[0014] The process of integrating the sensor with the passive data processing chip includes:

[0015] The interconnect pattern between the sensor and the passive data processing chip is fabricated on the flexible substrate of the sensor using a photolithography process;

[0016] A planar array of metal bumps is fabricated on the passive data processing chip;

[0017] A rigid temporary pad is fixed on the flexible substrate, and the flexible substrate with the temporary pad is aligned with the passive data processing chip according to the interconnection requirements of the wiring pattern and then soldered together.

[0018] The temporary pad is removed by heating.

[0019] According to a method for fabricating a data acquisition module provided by the present invention, after integrating the sensor and the passive data processing chip into a single unit to obtain the data acquisition module, the method includes:

[0020] The data acquisition module is flexibly encapsulated using a flexible insulating and sealing material.

[0021] According to a data acquisition module fabrication method provided by the present invention, the flexible substrate of the sensor is made of amorphous metal.

[0022] According to a method for manufacturing a data acquisition module provided by the present invention, the step of integrating the sensor and the passive data processing chip into one unit includes:

[0023] The sensor is connected to the passive data processing chip via metal interdigitated electrodes.

[0024] The present invention also provides a data acquisition module, which is prepared by the data acquisition module preparation method described in any of the above claims.

[0025] The present invention also provides a dental orthodontic appliance, including the data acquisition module described above.

[0026] The present invention provides a data acquisition module fabrication method, a data acquisition module, and an orthodontic appliance. A sensitive gate structure is fabricated on a flexible substrate using physical deposition and photolithography to obtain a sensor. This sensor is then integrated with a passive data processing chip to form the data acquisition module. This allows for the fabrication of a flexible sensor integrated with a passive data processing chip. When applied to an orthodontic appliance, the sensor, being flexible, deforms in response to changes in tooth force and displacement. This enables precise sensing of minute force changes and displacement deformations caused by orthodontic forces during orthodontic treatment. When a tooth is subjected to force or displacement, the sensitive gate structure of the flexible sensor undergoes mechanical strain, altering the material's electrical properties and generating corresponding sensing signals. Since the sensor and passive data processing chip are integrated, these signals can be transmitted to the passive data processing chip for signal amplification, filtering, and other processing. The signals are then transmitted externally via a wireless communication unit, enabling real-time monitoring of tooth force and displacement. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0028] Figure 1 This is a flowchart of the data acquisition module preparation method provided by the present invention.

[0029] Figure 2 This is a schematic diagram of the data acquisition module provided by the present invention.

[0030] Figure 3 This is a schematic diagram of the sensor structure in the data acquisition module provided by the present invention.

[0031] Figure 4This is a schematic diagram of the passive data processing chip in the data acquisition module provided by the present invention.

[0032] Figure 5 This is a circuit block diagram of the passive data processing chip in the data acquisition module provided by the present invention.

[0033] Figure 6 This is a schematic diagram illustrating the use of the orthodontic appliance provided by the present invention. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0035] It should be understood that, when used in this specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0036] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0037] It should also be further understood that the term "and / or" as used in this specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0038] As used in this specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrases "if determined" or "if detected [the described condition or event]" may be interpreted, depending on the context, as meaning "once determined," "in response to determination," "once detected [the described condition or event]," or "in response to detection [the described condition or event]."

[0039] The following is combined Figure 1 The method for preparing the data acquisition module provided by this invention is described below. Figure 1 As shown, the data acquisition module preparation method provided by the present invention includes the following steps:

[0040] S110. A sensitive gate structure is fabricated on a flexible substrate by physical deposition and photolithography to obtain a sensor.

[0041] S120. The sensor and the passive data processing chip are integrated into one unit to obtain a data acquisition module. The passive data processing chip includes an inductive power supply unit, a signal amplifier, a signal filter, and a wireless communication unit.

[0042] Traditional metal braces rely on the elastic deformation of the archwire to provide corrective force. However, due to the inability to collect real-time data on tooth force and displacement, it is difficult to establish a precise biomechanical feedback system. Adjustments to the braces require archwire replacement or bracket adjustment, but the lack of data for these adjustments forces reliance on the dentist's experience. This lack of precise biomechanical data makes it difficult for dentists to accurately grasp the actual response of each tooth under corrective force. This easily leads to a mismatch between the applied corrective force and the physiological movement requirements of the teeth, resulting in over-force. Over-force can not only cause increased pain and root resorption but also interfere with the normal periodontal remodeling process, reducing tooth movement efficiency and significantly prolonging the overall treatment period. Furthermore, the lack of real-time, accurate monitoring data for adjustment introduces significant subjectivity and uncertainty into the force adjustment process, leading to deviations in force direction and inaccurate force control. Ultimately, this results in a deviation from the initial treatment plan, making it difficult to achieve the desired dentofacial morphology and occlusal function reconstruction goals.

[0043] The data acquisition module fabrication method provided by this invention involves fabricating a sensitive gate structure on a flexible substrate using physical deposition and photolithography to obtain a sensor. This sensor is then integrated with a passive data processing chip to obtain the data acquisition module. This method allows for the fabrication of a flexible sensor integrated with a passive data processing chip. When applied to orthodontic appliances, the flexible sensor deforms with changes in tooth force and displacement, enabling precise sensing of minute force changes and displacement deformations caused by orthodontic forces during orthodontic treatment. When a tooth is subjected to force or displacement, the sensitive gate structure of the flexible sensor undergoes mechanical strain, causing changes in the electrical properties of the material and generating corresponding sensing signals. Since the sensor and passive data processing chip are integrated, these sensing signals can be transmitted to the passive data processing chip for signal amplification, filtering, and other processing, and then transmitted externally via a wireless communication unit, achieving real-time monitoring of tooth force and displacement.

[0044] The data acquisition module prepared by the data acquisition module preparation method provided by this invention can be applied to orthodontic appliances, such as... Figure 2 As shown, the data acquisition module includes a sensor 210 and a passive data processing chip 220, which are integrated into one unit. A steel wire rope 310 can be added to this data acquisition module, which is then fixed to the tooth to monitor the force and displacement of the tooth. Figure 6 As shown.

[0045] The data acquisition module fabrication method provided by this invention first fabricates a sensitive gate structure on a flexible substrate using physical deposition and photolithography to obtain a sensor. Specifically, after depositing an insulating layer and a sensitive layer material on the flexible substrate, the sensitive layer material can be a nickel-chromium alloy or a gold thin film. Then, a nano-deformable sensitive gate structure is fabricated on the sensitive layer using photolithography, which specifically includes steps such as resist coating, exposure, and development. The resulting sensor structure is shown below. Figure 3 As shown.

[0046] Because the sensor is fabricated as a deformation-sensitive gate structure on a flexible substrate, it is also flexible. When the flexible substrate deforms, it causes a change in the gate structure, resulting in a change in the material resistance of the gate structure, thus enabling the measurement of force and deformation. When the flexible substrate is attached to a tooth, changes in the force on the tooth or displacement will cause the flexible substrate to deform, which in turn causes the gate structure to deform. This will change the electrical signal of the sensitive gate structure, allowing for real-time monitoring of the force and displacement of the tooth.

[0047] Furthermore, photolithography can ensure the miniaturization of the gate structure, thereby enabling the miniaturization of the sensor. This allows it to be compatible with the bracket sizes in existing orthodontic appliances, ensuring that the data acquisition module prepared by the method provided in this invention is compatible with existing orthodontic appliances without the need to design a separate, suitable orthodontic appliance. This expands the application range of the data acquisition module prepared by the method provided in this invention and reduces its application cost.

[0048] Because the sensitive gate structure is nanoscale, the nano-deformation sensitive gate structure can achieve a gate linewidth of less than 1 micrometer and a total sensor thickness of less than 50 micrometers. This allows for the detection of minute forces and deformations on teeth, and further enables the adjustment of the orthodontic force based on more precise data, which helps to improve the orthodontic effect.

[0049] The data acquisition module fabrication method provided by this invention integrates a sensor and a passive data processing chip into a single unit to obtain the data acquisition module. The structure of the data acquisition module is as follows: Figure 2 As shown.

[0050] The passive data processing chip includes an inductive power supply unit, a signal amplifier, a signal filter, and a wireless communication unit. The structure of the passive data processing chip is as follows: Figure 4 As shown, the circuit block diagram is as follows: Figure 5 As shown, the sensor and passive data processing chip are integrated into one unit during the fabrication of the data acquisition module. The passive data processing chip amplifies and filters the signals reflecting tooth force and displacement collected by the sensor, and then transmits the data via a wireless communication unit, thus enabling data acquisition. Specifically, the passive data processing chip can transmit data via NFC (Near Field Communication) or BLE (Bluetooth Low Energy) communication.

[0051] The data acquisition module prepared by the method provided by this invention can achieve wireless sensing because the passive data processing chip and sensor are integrated into one unit, which can further improve the wearing comfort when it is applied to orthodontic appliances.

[0052] Furthermore, the passive design of the passive data processing chip can avoid battery replacement and extend the lifespan of the orthodontic appliance.

[0053] The passive data processing chip uses a flexible substrate as a carrier, which allows the passive data processing chip to deform. When applied in a data acquisition module, the passive data processing chip can adapt to the deformation of the sensor, ensuring the effectiveness of the connection between the passive data processing chip and the sensor.

[0054] For the sensor and passive data processing chip, they are integrated into a single unit. In one possible implementation, the flexible substrate of the sensor can be an amorphous metal. Amorphous metals are amorphous metal alloys that combine the advantages of metals and glass while overcoming their respective drawbacks, such as the fragility and lack of ductility of glass. When the flexible substrate of the sensor is an amorphous metal, the sensor can wirelessly couple with the passive data processing chip through metal interdigitated electrodes to achieve a communication connection between the two. Finally, a flexible sealing material is used to encapsulate both components, achieving physical integration.

[0055] In another possible implementation of the data acquisition module fabrication method provided by this invention, the flexible substrate of the sensor is a polymer. When the flexible substrate of the sensor is a polymer, it can be directly used as a carrier for a passive data processing chip. That is, the passive data processing chip is directly fabricated integrally on the flexible substrate of the sensor, and the wiring patterns of the sensor and the passive data processing chip are interconnected.

[0056] Specifically, the sensor and passive data processing chip are integrated into a single fabrication process, including:

[0057] Interconnect patterns between the sensor and the passive data processing chip are fabricated on a flexible substrate of the sensor using photolithography.

[0058] Fabrication of surface array metal bumps on a passive data processing chip;

[0059] A rigid temporary pad is fixed on a flexible substrate. The passive data processing chip is then aligned with the flexible substrate with the temporary pad according to the interconnection requirements of the wiring pattern and soldered together.

[0060] Heat to remove the temporary pad.

[0061] For passive data processing chips, area array metal bumps, such as copper-silver composite metal bumps or copper-silver composite metal bumps with solder caps, can be fabricated on the passive data acquisition chip using electrodeposition and photolithography processes. A flexible substrate is then fixed to a rigid temporary pad using adhesive bonding. Subsequently, a flip-chip bonding machine is used to align the passive data processing chip with the metal bumps and the flexible substrate with the temporary pad according to the interconnect pattern requirements, and interconnects them using thermoforming, thermoacoustic, or reflow processes. During this process, the metal bumps on the passive data processing chip are collapsed, becoming solder joints, thus achieving the interconnection between the passive data processing chip and the flexible substrate. Using area array bump bonding can improve the processing speed. Furthermore, by inverting the passive data processing chip for alignment with the flexible substrate, the overall size of the passive data processing chip can be reduced.

[0062] In the interconnection process between the flexible substrate and the passive data processing chip, rigid spacers prevent deformation of areas on the flexible substrate other than those connected to the metal bumps during processing, thus avoiding interference with the interconnection effect. After interconnection, the temporary spacers are removed by heating, achieving integrated fabrication of the data acquisition module.

[0063] Through the above-mentioned integrated fabrication method, the passive data processing chip and the sensor actually share the same substrate, which can effectively ensure the reliability of the connection between the passive data processing chip and the sensor, thereby improving the reliability of data acquisition, processing and transmission of the data acquisition module. When the data acquisition module is applied to orthodontic appliances, it is beneficial to improve the orthodontic effect.

[0064] In one possible implementation, the flexible substrate can be made of polyimide, a polymer. Polyimide (PI) refers to a class of polymers containing imide rings (-CO-NR-CO-) in its main chain, and is one of the best-performing organic polymer materials. It can withstand temperatures above 400°C, has a long-term operating temperature range of -200 to 300°C, some varieties have no obvious melting point, and exhibit high insulation properties. At 103 Hz, its dielectric constant is 4.0, and its dielectric loss is only 0.004 to 0.007, classifying it as an F to H grade insulation.

[0065] Furthermore, in one possible implementation, the data acquisition module preparation method provided by the present invention, after integrating the sensor and the passive data processing chip into a single unit to obtain the data acquisition module, further includes the following steps:

[0066] The data acquisition module is flexibly encapsulated using flexible insulating and sealing materials.

[0067] Flexible insulating sealing materials can be silicone or polyimide, etc. Vacuum sealing can be used during encapsulation, which can further ensure the reliability of the interconnection between the sensor and the passive data processing chip, ensure the accuracy of data acquisition, and also allow the data acquisition module to fit better with the components of the orthodontic appliance.

[0068] Based on the above-described data acquisition module preparation method, this invention also provides a data acquisition module, which is prepared using the above-described data acquisition module preparation method. For example... Figure 2 As shown, the data acquisition module includes a sensor 210 and a passive data processing chip 220, which are integrated into one unit. A steel wire rope 310 can be added to this data acquisition module, which is then fixed to the tooth to monitor the force and displacement of the tooth. Figure 6 As shown.

[0069] The data acquisition module provided by this invention integrates a flexible sensor with a passive data processing chip. When applied to orthodontic appliances, the flexible sensor deforms with changes in tooth force and displacement, accurately sensing minute changes in force and displacement caused by orthodontic forces during treatment. When a tooth is subjected to force or displacement, the sensitive gate structure of the flexible sensor undergoes mechanical strain, altering the electrical properties of the material and generating corresponding sensing signals. Since the sensor and passive data processing chip are integrated, these signals can be transmitted to the chip for signal amplification, filtering, and other processing, and then transmitted to the outside via a wireless communication unit, enabling real-time monitoring of tooth force and displacement.

[0070] In the data acquisition module provided by this invention, the sensor is a deformation-sensitive gate structure fabricated on a flexible substrate. Therefore, the sensor itself is flexible. When the flexible substrate deforms, it causes a change in the gate structure, resulting in a change in the material resistance of the gate structure, thereby enabling the measurement of force and deformation. When the flexible substrate is attached to a tooth, changes in the force on the tooth or displacement occur, causing the flexible substrate to deform, which in turn causes the gate structure to deform. This results in a change in the electrical signal of the sensitive gate structure, thus enabling real-time monitoring of the force and displacement of the tooth.

[0071] In one possible implementation of the data acquisition module provided by the present invention, the passive data processing chip and the sensor share a common substrate, which can effectively ensure the reliability of the connection between the passive data processing chip and the sensor, thereby improving the reliability of data acquisition, processing and transmission of the data acquisition module. When the data acquisition module is applied to orthodontic appliances, it is beneficial to improve the orthodontic effect.

[0072] In one possible implementation, the flexible substrate in the data acquisition module provided by the present invention can be made of polyimide, a polymer.

[0073] In one possible implementation, the data acquisition module provided by the present invention further includes an encapsulation film that seals the sensor and the passive data processing chip. The encapsulation film is made of a flexible insulating sealing material, such as silicone or polyimide. The encapsulation film further ensures the reliability of the interconnection between the sensor and the passive data processing chip, guarantees the accuracy of data acquisition, and allows the data acquisition module to better fit with components of orthodontic appliances.

[0074] Furthermore, the present invention also provides a dental orthodontic appliance, which includes the data acquisition module described above. For example... Figure 6 As shown, in this orthodontic appliance, the data acquisition module can be fixed to the teeth via steel wires to monitor the force and displacement of the teeth. Because this data acquisition module can detect the force and displacement of the teeth in real time, the orthodontic appliance can provide real-time feedback on the actual orthodontic situation, thereby allowing for adjustments to the orthodontic force based on the actual orthodontic progress and improving the effectiveness of orthodontic treatment.

[0075] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0076] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0077] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for preparing a data acquisition module, characterized in that, The method includes: A sensor is obtained by fabricating a sensitive gate structure on a flexible substrate using physical deposition and photolithography. The sensor and the passive data processing chip are integrated into one unit to obtain the data acquisition module. The passive data processing chip includes an inductive power supply unit, a signal amplifier, a signal filter, and a wireless communication unit. The flexible substrate is made of polymer; The sensor and the passive data processing chip are integrated into one fabrication so that the wiring patterns of the sensor and the passive data processing chip are interconnected. The process of integrating the sensor with the passive data processing chip includes: The interconnect pattern between the sensor and the passive data processing chip is fabricated on the flexible substrate of the sensor using a photolithography process; A planar array of metal bumps is fabricated on the passive data processing chip; A rigid temporary pad is fixed on the flexible substrate. The area array metal bumps on the passive data processing chip are aligned with the flexible substrate with the temporary pad according to the interconnection requirements of the wiring pattern and then soldered together. The flexible substrate of the sensor is the carrier of the passive data processing chip. The temporary pad is removed by heating.

2. The method for preparing a data acquisition module according to claim 1, characterized in that, The flexible substrate is made of polyimide.

3. The method for preparing a data acquisition module according to claim 1, characterized in that, After integrating the sensor and the passive data processing chip into a single unit to obtain the data acquisition module, it includes: The data acquisition module is flexibly encapsulated using a flexible insulating and sealing material.

4. A data acquisition module, characterized in that, The data acquisition module is prepared using the data acquisition module preparation method as described in any one of claims 1-3.

5. A dental orthodontic appliance, characterized in that, The orthodontic appliance includes the data acquisition module as described in claim 4.

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