Nanofluid jet intelligent chip heat dissipation device based on piezoelectric driving

Abstract

The invention relates to the technical field of chip heat dissipation, in particular to a nanofluid jet intelligent chip heat dissipation device based on piezoelectric driving. The chip comprises a piezoelectric driving structure and a chip fixing piece, the piezoelectric driving structure comprises a driving jetting piece, a nozzle is formed in the end, close to a chip body, of the driving jetting piece, and the outer side of the nozzle is covered with a spray head structure. According to the invention, through the plurality of branch channels in the nozzle structure, each branch channel adopts a gradual change structure with a small upper end and a large lower end, and the winding radius of the outer side branch channel is greater than that of the inner side branch channel, the nanofluid forms a rotary diffusion effect during circulation, and a multi-nozzle array does not need to be installed in a narrow top space of the chip body; the single nozzle can utilize rotating centrifugal force to enable fluid to be thrown out in the tangential direction to form annular spray, a larger area of a chip is covered, and the problems that when a traditional single nozzle conducts direct injection, the liquid amount in the center is concentrated, and a heat dissipation blind area is formed on the edge are effectively solved.

Description

Technical Field

[0001] This invention relates to the field of chip heat dissipation technology, and more specifically, to a smart chip heat dissipation device based on piezoelectric-driven nanofluid jetting. Background Technology

[0002] With the rapid development of technologies such as artificial intelligence and 5G communication, the integration and computing power of intelligent chips (such as CPUs, GPUs, and AI chips) continue to rise, and their power consumption and heat generation also surge accordingly. The heat flux density of high-end AI chips has exceeded 300W / cm². 2 Traditional heat dissipation methods (such as passive heat sinks and air cooling) have limited heat exchange efficiency and are difficult to cope with the dynamic heat demand of chips. Overheating can directly lead to performance degradation, shortened lifespan, or even failure. Therefore, efficient and compact active heat dissipation technology has become crucial. Piezoelectric driven nanofluid jet technology has become a highly promising solution due to the precise controllability of piezoelectric elements and the high heat transfer capability of nanofluids. Its driving element is small in size and its heat dissipation efficiency is 3-5 times higher than that of passive heat dissipation, making it suitable for high-density chip packaging scenarios.

[0003] However, the installation space for smart chips is often occupied by the packaging shell, peripheral components or interfaces, leaving very little space for installing heat dissipation devices. In piezoelectric-driven nanofluid jetting technology, a single nozzle is often used to save space, which makes the jetted fluid easily concentrated in the central area of ​​the chip, while the edge heat-generating areas (such as near the chip's I / O interface) become heat dissipation blind areas due to insufficient liquid volume, resulting in differences in the temperature distribution on the chip surface and affecting its operational stability.

[0004] On the other hand, although nanoparticles in nanofluids can improve thermal conductivity, they are prone to agglomeration during storage and spraying due to insufficient Brownian motion and excessive surface energy, forming micron-sized clusters. When the sprayed droplet size is large, these clusters will be encapsulated by the droplet and directly impact the chip surface. Due to the poor spreadability and slow evaporation of large droplets, the clusters will deposit as dot-like residues of droplet size after evaporation. Long-term accumulation will form a thermal resistance layer, weakening subsequent heat dissipation efficiency and threatening the long-term reliability of the chip.

[0005] Therefore, there is an urgent need for a piezoelectric-driven nanofluid jet smart chip heat dissipation device to solve the above problems. Summary of the Invention

[0006] This invention provides a piezoelectric-driven nanofluid jetting smart chip heat dissipation device. It achieves precise jetting of nanofluid through piezoelectric actuation, and combines this with a spiral channel design in the nozzle structure to form a rotating diffusion spray. The slicing strips and diffuser channels of the solid tube structure further refine the droplets. Simultaneously, relying on the damping characteristics of the inner cladding layer and the stability of the heat-resistant material, the nanofluid forms a uniform and large-area coverage on the chip surface, efficiently transferring the heat generated by the chip within a confined space, ensuring continuous and stable operation of the chip. This solves the problems mentioned in the background art, namely:

[0007] In today's smart chips, the fluid sprayed from a single nozzle tends to concentrate in the center of the chip due to insufficient liquid volume in the confined installation space, resulting in a heat dissipation blind zone in the edge heating area and uneven temperature distribution on the chip surface. Furthermore, the nanoparticles in the nanofluid tend to agglomerate to form micron-sized clusters. After being impacted by large droplets on the chip surface, they will be deposited as dot-like residues after evaporation, which will accumulate over time to form a thermal resistance layer and weaken the heat dissipation efficiency.

[0008] To achieve the above objectives, the intelligent chip heat dissipation device includes a piezoelectric drive structure with a drive jet component at its bottom forming a nozzle; a chip fixing component for fixing the chip body and connecting to the piezoelectric drive structure; and a fluid transport component for transporting nanofluid to the drive jet component.

[0009] The nozzle is covered with a nozzle structure on the outside, and a spray pipeline is provided inside. The spray pipeline includes a main channel located on the central axis and multiple gradually changing branch channels around the main channel.

[0010] The nozzle structure has a fixed tube structure at the outlet end, and multiple spray holes are opened on its surface. Each spray hole has a vertically arranged slicing strip. The slicing strip and the inner wall of the spray hole form a diffusion channel. After the nanofluid is rotated and diffused through the spray pipe, it is cut into microdroplets and sprayed onto the surface of the chip body through the diffusion channel.

[0011] In the above technical solution, the precision of the spray position is ensured by the dual fixation of the chip body and the driving spray component through the chip fixing component; the nozzle structure enables the nanofluid to rotate and diffuse, expanding the spray coverage area, which can cover the heat-generating areas at the center and edge of the chip and reduce heat dissipation blind spots; the secondary diffusion of the solid tube structure refines the droplets and reduces the generation of large droplets. At the same time, in conjunction with the rotational shear force and the effect of the inner coating layer in the nozzle structure, the nanoparticle agglomerates are dispersed and the deposition is reduced, and the heat-resistant material ensures that the device operates stably in high-temperature environments.

[0012] Based on this, multiple injection channels consist of a main channel and multiple branch channels. The main channel is located in the middle of the nozzle body, and the multiple branch channels surround the main channel on the outside. Each of the multiple branch channels has a gradual transition structure, with a smaller upper end and a larger lower end. The outer branch channel has a larger radius of rotation than the inner branch channel. The main channel can guide some of the nanofluid directly to the central area of ​​the chip, ensuring the liquid supply to the core heating zone. The branch channels surrounding it, due to their gradual transition structure and larger outer radius, force the fluid to form a spiral motion that gradually diffuses from the inside to the outside during flow. This gives the fluid in the outer branch channels a greater centrifugal force, extending the injection range further to the edge of the chip. This complements the direct fluid from the main channel, reducing the possibility of insufficient liquid in the edge heating zone. At the same time, the gradual transition structure of the branch channels can also accelerate the fluid velocity and enhance the shear force generated by rotation. Combined with the secondary diffusion of the subsequent solid tube structure, this further improves the dispersion effect of nanoparticles and reduces the formation and deposition of agglomerates.

[0013] In addition, the interior of each of the aforementioned injection pipes is lined with an inner lining;

[0014] Both the nozzle structure and the pipe structure are made of heat-resistant materials.

[0015] Specifically, the inner lining layer laid inside the multiple spray pipes absorbs the vibration energy generated by piezoelectric drive through damping characteristics, reducing the resonance amplitude of the pipes, minimizing fluid velocity fluctuations, and ensuring spray stability. Simultaneously, its surface properties and minute deformation during vibration reduce the adhesion and deposition of nanoparticles within the pipes, maintaining unobstructed channels. The heat-resistant materials used in the nozzle and tube structures maintain their original physical and chemical properties under the continuous high temperatures generated during chip operation, preventing positional deviations between the spray pipes and nozzles due to thermal deformation, and also preventing material reactions with the nanofluid that could cause contamination. This further ensures stability throughout the entire process from fluid transport and rotational diffusion to secondary dispersion, synergizing with the aforementioned structural design to jointly enhance the long-term reliable operation of the heat dissipation device.

[0016] Compared to existing technologies, this solution eliminates the need for installing multiple nozzle arrays in a confined space; a single nozzle can achieve uniform coverage over a large area. It also effectively solves the problem of nanoparticle aggregation and deposition, improving heat dissipation efficiency and the long-term reliability of the chip.

[0017] By using multiple branch channels in the nozzle structure, with the branch channels adopting a gradient structure that is smaller at the top and larger at the bottom, and the outer branch channel having a larger circumference than the inner branch channel, the nanofluid forms a rotational diffusion effect during flow. This eliminates the need to install multiple nozzle arrays in the narrow space on top of the chip body. A single nozzle can use the rotational centrifugal force to throw the fluid out tangentially, forming a ring spray that covers a larger area of ​​the chip. This effectively solves the problem of concentrated liquid volume in the center and the formation of heat dissipation blind spots at the edges when a traditional single nozzle sprays directly, reduces the temperature difference on the chip surface, and ensures the stability of chip operation.

[0018] In addition, the branch channels of the jet pipeline have a spiral gradient structure. When the nanofluid flows through these channels, it will generate continuous shear force due to the rotational flow. This shear force can effectively break the agglomeration of nanoparticles and reduce the deposition of particles on the inner wall of the channel. At the same time, in conjunction with the inner lining layer laid in the channel, the probability of particle adhesion is further reduced, reducing the decrease in jetting efficiency caused by channel blockage and extending the maintenance cycle and service life of the device.

[0019] Furthermore, the combination of the fixed sleeve, connecting rod, and receiving platform not only securely connects the nozzle body to the driving jet component, but also provides physical protection for the nozzle body, reducing damage caused by external vibration or collision. More importantly, the nozzle holes and slicing strips on the surface of the receiving platform work together to further slice the nanofluid flowing out of the jet pipe, forming smaller droplets through the flat diffuser channel. This not only enhances the atomization effect of the fluid, making the droplets cover the chip surface more evenly, but also reduces the risk of nanoparticle point contamination, improves heat dissipation efficiency, and enhances the long-term reliability of the chip. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the nozzle structure connection of the present invention;

[0022] Figure 3 This is a schematic diagram of the solid tube structure of the present invention;

[0023] Figure 4 This is a schematic diagram of the nozzle body disassembly structure of the present invention;

[0024] Figure 5 This is a cross-sectional schematic diagram of the connection between the drive injection component and the nozzle body of the present invention;

[0025] Figure 6 This is a schematic diagram of the internal structure of the nozzle body of the present invention;

[0026] Figure 7 This is a schematic diagram of the main channel and branch channel structure of the present invention;

[0027] Figure 8 This is a schematic diagram of the disassembled structure of the solid pipe structure of the present invention;

[0028] Figure 9 This is a schematic diagram of the slicing strip installation structure of the present invention;

[0029] Figure 10 This is a schematic diagram of the drive injection component structure of the present invention.

[0030] The meanings of the labels in the diagram are as follows:

[0031] 1. Piezoelectric drive structure; 11. Drive jet component; 12. Fluid transport component; 13. Nozzle structure; 14. Fixed pipe structure; 15. Nozzle; 16. Flow buffer chamber;

[0032] 10. Chip holder; 100. Chip body; 101. Connecting sleeve; 102. Mounting inner plate; 103. Fluid connection pipe;

[0033] 21. Nozzle body; 22. Flow channel; 23. Injection pipeline; 231. Main channel; 232. Branch channel; 24. Inner liner;

[0034] 31. Fixed sleeve; 32. Connecting rod; 33. Receiving platform; 34. Spray hole;

[0035] 4. Sliced ​​strips; 41. Diffuser channel. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0037] This invention provides a piezoelectric-driven nanofluid jet smart chip heat dissipation device, see [link to relevant documentation]. Figures 1-3 As shown, it includes a piezoelectric drive structure 1 and a chip fixing component 10. The chip fixing component 10 is used to fix the chip body 100. The piezoelectric drive structure 1 includes a drive jet component 11. One end of the chip fixing component 10 is connected to the piezoelectric drive structure 1 to fix the drive jet component 11.

[0038] A fluid delivery component 12 is connected to the side end of the driving jet component 11. A nozzle 15 is formed at the end of the driving jet component 11 near the chip body 100. A nozzle structure 13 is installed on the outside of the nozzle 15. A fixed tube structure 14 for fixing the nozzle structure 13 is provided at the bottom end of the nozzle structure 13.

[0039] When the nanofluid is sprayed onto the chip body 100 for cooling through the driving jet 11, the nanofluid undergoes rotational diffusion through the nozzle structure 13, and can also achieve secondary diffusion when passing through the solid tube structure 14.

[0040] When the chip body 100 is in use, it needs to be stably installed by the chip fixing component 10. First, the specific structure of the chip fixing component 10 is disclosed. The chip fixing component 10 includes a connecting sleeve 101 and a mounting inner plate 102. The connecting sleeve 101 and the mounting inner plate 102 form a double-layer structure to fix the chip body 100. The inside of the connecting sleeve 101 is a hollow structure. One end of the connecting sleeve 101 is connected to a fluid connecting pipe 103, and the other end of the fluid connecting pipe 103 is connected to a fluid conveying component 12.

[0041] See Figure 1 As shown, the connecting sleeve 101 of the chip fixing component 10 and the mounting inner plate 102 form a double-layer structure, which stably fixes the chip body 100, reduces its displacement due to vibration or external force during use, and ensures working stability. The connecting sleeve 101 has a hollow structure inside. One end of the connecting sleeve 101 is connected to a bent fluid connecting pipe 103 and connected to the fluid conveying component 12. The hollow structure provides storage space for the nanofluid, while the bent fluid connecting pipe 103 provides support for the driving jet component 11, ensuring its relative positional accuracy with the chip body 100 and improving the overall structural coordination and operational reliability of the device.

[0042] Among them, the nanofluid can be made of metal oxides such as aluminum oxide, copper oxide, carbon nanotubes, graphene and other nanoparticles, dispersed in basic fluids such as water, ethanol, and engine oil to form a liquid state. It has both the high thermal conductivity of nanoparticles and the fluidity of basic fluids, and can be transported through the fluid connection pipe 103. It can efficiently dissipate heat for the chip body 100 and also meet the fluid transport requirements of the chip fixing component 10.

[0043] The aforementioned drive injection component 11 operates on the principle well known to those skilled in the art, combined with... Figure 10 Based on the inverse piezoelectric effect of piezoelectric materials, when piezoelectric ceramics and other piezoelectric materials are excited by an external electrical signal, they undergo mechanical deformation (such as stretching or bending). This deformation is transmitted to the fluid chamber connected to it, causing the nanofluid in the chamber to be squeezed instantaneously, and the pressure rises sharply. Under the action of the pressure difference, the nanofluid is pushed out at high speed through the tiny channel of the nozzle 15. When the electrical signal is removed, the piezoelectric material returns to its original state, the chamber volume increases and a negative pressure is generated, which draws the nanofluid in the fluid connecting pipe 103 into the chamber to replenish it, completing one jet cycle. By controlling the frequency, amplitude and pulse width of the electrical signal, the dynamic control of the nanofluid jet process can be achieved.

[0044] To reduce the heat dissipation blind zone, the driving jet component 11 extends the jetting range of the nanofluid through the nozzle structure 13. The specific structure of the nozzle structure 13 is disclosed below. The nozzle structure 13 includes a nozzle body 21. The top of the nozzle body 21 is threadedly connected to the bottom of the driving jet component 11. A slow flow cavity 16 is formed between the nozzle body 21 and the nozzle 15. Multiple flow channels 22 are opened inside the nozzle body 21, and jetting pipes 23 are installed inside each of the multiple flow channels 22.

[0045] The multiple injection pipes 23 consist of a main channel 231 and multiple branch channels 232. The main channel 231 is located in the middle of the nozzle body 21, and the multiple branch channels 232 surround the outside of the main channel 231.

[0046] Multiple branch channels 232 have a gradually changing structure with a smaller upper end and a larger lower end, and the outer branch channel 232 has a larger circumference than the inner branch channel 232.

[0047] Combination Figure 2 and Figure 3 It can be seen that the nozzle structure 13 adopts a modular design, forming a detachable assembly with the drive spray component 11 via a threaded connection (not shown in the figure), which facilitates the maintenance and replacement of the device. Figure 4 and Figure 5 As shown, the slow-flow cavity 16 between the nozzle 15 and the nozzle body 21 is set in an inclined state, which can guide the nanofluid to flow smoothly into the injection pipe 23 and reduce the turbulence generated by fluid impact. During this process, the piezoelectric drive structure 1 can continuously deliver the nanofluid, provide power for the nanofluid, and ensure that the nanofluid maintains a stable flow rate and pressure in the system.

[0048] Further integration Figure 6 and Figure 7 The internal flow channels 22 are radially distributed. Each channel's spray pipe 23 consists of a central main channel 231 and peripheral spiral branch channels 232. The branch channels 232 adopt a gradually changing structure that is narrower at the top and wider at the bottom. The outer branch channel 232 has a larger circumference than the inner branch channel 232, forcing the fluid to form a spiral motion within the channel. When the nanofluid enters the branch channel 232, due to the change in the channel radius and cross-sectional area, centrifugal acceleration is generated, causing the fluid to rotate close to the spiral wall and finally be thrown out from the nozzle 15 along the tangential direction, forming an annular spray. This spraying method significantly expands the coverage area without increasing the physical size, effectively solving the problem of heat dissipation uniformity in a small space. Traditional direct spray nozzles often can only cover a local area of ​​the chip, which can easily lead to the generation of hot spots. However, this design can uniformly cover the entire chip surface through an annular spray, making the heat distribution more uniform and thus improving the heat dissipation efficiency.

[0049] Furthermore, during the rotational motion of the nanofluid within the spiral branch channel 232, the fluid near the inner wall of the channel experiences slower flow due to frictional resistance, while the fluid in the central region experiences faster flow due to centrifugal force, forming a radially distributed velocity gradient. This generates shear force, which can disrupt the binding force within the aggregates, breaking down larger micron-sized aggregates into smaller nano-sized particles, thereby reducing the possibility of particle deposition. Simultaneously, the rotating flow of the nanofluid exerts a continuous scouring effect on the inner wall of the branch channel 232. Even if a small number of particles accidentally adhere, they will be carried away by the high-speed flow of the fluid, reducing the flow rate attenuation in the jet pipe 23 due to particle blockage, thus improving the overall reliability of the device.

[0050] Finally, the specific structure of the fixed pipe structure 14 is disclosed. The fixed pipe structure 14 includes a fixed sleeve 31 sleeved on the outer wall of the drive jet component 11. A connecting rod 32 is installed at the bottom of the fixed sleeve 31. A receiving platform 33 is fixedly installed at the other end of the connecting rod 32. A plurality of spray holes 34 are opened on the surface of the receiving platform 33. The plurality of spray holes 34 are respectively aligned with the bottom openings of the plurality of jet pipes 23.

[0051] Each of the multiple nozzles 34 has a slicing strip 4 inside, and the upper and lower ends of the multiple slicing strips 4 are narrower than the middle part of the slicing strip 4.

[0052] Multiple flow channels 41 are formed between the slice strip 4 and the nozzle 34, and all multiple flow channels 41 have a flat structure.

[0053] The improvements are: See Figure 8 As shown, the solid tube structure 14 is connected to the outer wall of the drive jet component 11 by the fixed sleeve 31 to form a stable connection. Then, the receiving platform 33 is fixed directly below the nozzle structure 13 by the connecting rod 32, which ensures that the nozzle 34 on the surface of the receiving platform 33 corresponds to the bottom opening of the jet pipe 23, providing an unobstructed channel for the transition of nanofluid from the jet pipe 23 to the nozzle 34, and avoiding fluid loss or turbulence caused by misalignment.

[0054] Further integration Figure 9The sliced ​​strips 4 inside the nozzle 34 are narrow at the top and bottom and wide in the middle, forming multiple flat diffuser channels 41 with the nozzle 34 wall. When the nanofluid flows out of the injection pipe 23 and into the nozzle 34, the sliced ​​strips 4 physically separate the fluid, further splitting the originally relatively concentrated flow into multiple independent thin-layer fluids. The flat diffuser channels 41 further constrain the fluid shape, forcing the fluid to pass through in a more dispersed state. (Compared to a circular cross-section structure, the flat structure can increase the contact area and contact time between the fluid and the inner wall of the diffuser channel 41 in the same space, which helps the nanofluid to further disperse during the flow and reduces the possibility of nanoparticle aggregation.) By physically dividing and constraining the fluid, the nozzle structure 13 is refined into a finer stream before ejection, increasing the contact area with air and thus promoting better atomization of the droplets during the ejection process. This results in a more uniform distribution of the droplets when they fall onto the chip surface, preventing localized liquid accumulation or insufficient liquid volume. At the same time, the rigid combination of the fixed sleeve 31 and the connecting rod 32 not only provides additional support for the nozzle structure 13, reducing nozzle position displacement caused by piezoelectric vibration during ejection, but also reduces the impact of external environmental factors on the nozzle orifice 34 and fluid ejection through structural enclosure and isolation. This improves the operational reliability of the device from both mechanical stability and fluid dispersion perspectives.

[0055] Because the piezoelectric drive structure 1 will transmit the vibration to the jet pipe 23 when it vibrates at high frequency, causing resonance between the pipe and the internal flowing nanofluid, this resonance will exacerbate the instability of the fluid jet and may cause pipe structure fatigue due to long-term vibration. Therefore, an inner cladding layer 24 is laid inside the multiple jet pipes 23.

[0056] Combination Figure 6Each of the multiple injection pipes 23 has an inner cladding layer 24, which is a damping coating. This inner cladding layer absorbs vibration energy through its viscoelastic properties. When the pipe vibrates due to piezoelectric drive, the molecules within the damping coating undergo relative displacement, converting the mechanical energy of the vibration into heat energy and dissipating it. This reduces the resonance amplitude of the pipe and minimizes the interference of vibration on the fluid flow. The inner cladding layer 24 effectively suppresses the resonance phenomenon of the injection pipes 23, reducing the vibration amplitude and minimizing fluid velocity fluctuations and injection direction deviations caused by vibration. This ensures that the nanofluid passes through the pipes and exits from the nozzle in a stable state, improving the uniformity and stability of the injection. Meanwhile, the damping coating absorbs vibration energy, reduces structural fatigue of the pipeline, extends the service life of the injection pipeline 23, and reduces the risk of device failure due to pipeline damage. In addition, the inner cladding layer 24 can be made of butyl rubber, which has a soft and smooth surface. The particles in the nanofluid have weak adhesion to the surface of the inner cladding layer 24. When the particles flow through the pipeline with the fluid, they are difficult to be stably adsorbed on the butyl rubber surface by van der Waals forces or electrostatic forces. At the same time, the damping characteristics of butyl rubber can also produce a "peeling effect" on the small number of adhering particles during the process of absorbing vibration. Combined with the scouring force of the fluid flow, it further reduces particle deposition.

[0057] Since the chip body 100 continuously generates heat during operation, and the high-frequency vibration of the piezoelectric drive structure 1 also generates a certain amount of heat, the heat in the installation space of the entire heat dissipation device increases. This heat will be transferred to the nozzle structure 13 and the solid tube structure 14. If the materials of the two are not heat-resistant enough, they will deform, age or degrade due to long-term exposure to high temperature environment, affecting the spraying accuracy and structural stability. Therefore, both the nozzle structure 13 and the solid tube structure 14 are made of heat-resistant materials.

[0058] The nozzle structure 13 and the solid tube structure 14, which are made of heat-resistant materials, will not undergo significant deformation or performance degradation under continuous high temperature conditions. This ensures that key components such as the spray pipe 23 and spray hole 34 of the nozzle structure 13 maintain their original size and positional accuracy, guaranteeing the stability of the spray path and dispersion effect of the nanofluid. At the same time, the heat-resistant material has good chemical stability and will not react chemically with the nanofluid due to high temperature, avoiding material corrosion or fluid contamination and maintaining the long-term reliable operation of the device. In particular, considering the application scenario of the chip body 100, polytetrafluoroethylene can be selected as the heat-resistant material, which has excellent high temperature resistance and a smooth surface that does not easily react with particles in the nanofluid.

[0059] Working principle:

[0060] First, the chip fixing component 10 fixes the chip body 100 through a double-layer structure formed by the connecting sleeve 101 and the mounting inner plate 102. The hollow structure of the connecting sleeve 101 stores nanofluid, and one end of it is connected to the fluid transport component 12 through a bent fluid connecting pipe 103. This not only realizes the transmission of nanofluid but also provides support for the driving jet component 11, ensuring its relative positional accuracy with the chip body 100. The driving jet component 11 is based on the inverse piezoelectric effect of piezoelectric materials. Under the excitation of an external electrical signal, the piezoelectric material undergoes mechanical deformation and transmits it to the fluid chamber, causing the pressure of the nanofluid in the chamber to rise sharply after being squeezed. It is then ejected at high speed through the nozzle 15. After the electrical signal is removed, the piezoelectric material returns to its original state, and the chamber generates a negative pressure to draw in the nanofluid, completing the jetting cycle. The jetting process can be controlled by electrical signal parameters.

[0061] The ejected nanofluid first enters the slow-flow chamber 16 of the nozzle structure 13, and then flows steadily into the jet pipe 23 through the inclined structure. The main channel 231 and the outer spiral branch channel 232 of the jet pipe 23 force the fluid to form a spiral motion, generate centrifugal acceleration, and finally rotate and diffuse along the tangential direction to form an annular spray to expand the coverage area. At the same time, the shear force generated by the rotation disperses the nanoparticle agglomerates and reduces channel deposition.

[0062] Subsequently, the nanofluid enters the nozzle 34 of the solid tube structure 14. The internal slicing strips 4 and flat diffuser channels 41 further divide the fluid into fine streams, enhancing the atomization effect of the fluid, making the droplets more evenly cover the surface of the chip body 100, reducing the risk of nanoparticle point contamination, and improving heat dissipation efficiency and the long-term reliability of the chip body 100.

[0063] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A piezoelectric-driven nanofluid jet smart chip heat dissipation device, comprising a piezoelectric drive structure (1), wherein a drive jetting component (11) is provided at the bottom end and forms a nozzle (15); A chip holder (10) is used to fix the chip body (100) and connect the piezoelectric drive structure (1); A fluid transport component (12) delivers nanofluid to a drive jet component (11); characterized in that: The nozzle (15) is covered with a nozzle structure (13) on the outside, and a spray pipe (23) is provided inside. The spray pipe (23) includes: a main channel (231) located on the central axis and multiple gradually changing branch channels (232) surrounding the main channel (231). The nozzle structure (13) has a fixed pipe structure (14) at the outlet end, and multiple nozzle holes (34) are opened on its surface. Each nozzle hole (34) has a vertically arranged slicing strip (4). The slice (4) and the inner wall of the nozzle (34) form a diffuser channel (41); After the nanofluid is swirled and diffused through the jetting pipe (23), it is cut into microdroplets and sprayed onto the surface of the chip body (100) through the diffuser channel (41).

2. The piezoelectric-driven nanofluid jet smart chip heat dissipation device according to claim 1, characterized in that: The chip fixing component (10) includes a connecting sleeve (101) and a mounting inner plate (102). The connecting sleeve (101) and the mounting inner plate (102) form a double-layer structure to fix the chip body (100). The interior of the connecting sleeve (101) is a hollow structure. One end of the connecting sleeve (101) is connected to a fluid connecting pipe (103), and the other end of the fluid connecting pipe (103) is connected to a fluid conveying component (12).

3. The piezoelectric-driven nanofluid jet smart chip heat dissipation device according to claim 1, characterized in that: The nozzle structure (13) includes a nozzle body (21), the top of the nozzle body (21) is threadedly connected to the bottom of the driving injection component (11), a slow flow cavity (16) is formed between the nozzle body (21) and the nozzle (15), a flow channel (22) is provided inside the nozzle body (21), and the injection pipeline (23) is located inside the flow channel (22).

4. The piezoelectric-driven nanofluid jet smart chip heat dissipation device according to claim 1, characterized in that: The branch channel (232) has a spiral structure that is narrow at the top and wide at the bottom, and the spiral radius of the outer branch channel (232) is larger than that of the inner branch channel (232).

5. The piezoelectric-driven nanofluid jet smart chip heat dissipation device according to claim 3, characterized in that: The fixed tube structure (14) includes a fixed sleeve (31) sleeved on the outer wall of the drive jet component (11). A connecting rod (32) is installed at the bottom of the fixed sleeve (31). A receiving platform (33) is fixedly installed at the other end of the connecting rod (32). A plurality of spray holes (34) are opened on the surface of the receiving platform (33).

6. The piezoelectric-driven nanofluid jet smart chip heat dissipation device according to claim 5, characterized in that: The nozzle (34) is aligned with the bottom opening of the injection pipe (23).

7. The piezoelectric-driven nanofluid jet smart chip heat dissipation device according to claim 6, characterized in that: The upper and lower ends of the slice (4) are narrower than the middle part of the slice (4).

8. The piezoelectric-driven nanofluid jet smart chip heat dissipation device according to claim 1, characterized in that: The diffuser channels (41) are all flat.

9. The piezoelectric-driven nanofluid jet smart chip heat dissipation device according to claim 3, characterized in that: The interior of each of the multiple injection pipes (23) is covered with an inner lining (24).

10. The piezoelectric-driven nanofluid jet smart chip heat dissipation device according to claim 1, characterized in that: Both the nozzle structure (13) and the tube structure (14) are made of heat-resistant materials.

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