Appearance defect detection equipment for chip packaging substrate

Abstract

The invention relates to appearance defect detection equipment for a chip packaging substrate, and relates to the technical field of semiconductor detection. The conveying belt is slidably connected to the equipment body in the first direction and used for conveying products, one end of the conveying belt is a feeding port, and the other end of the conveying belt is a discharging port; the defect detection mechanisms are symmetrically arranged on the two sides of the conveying belt in the second direction, each defect detection mechanism comprises a first camera and first light source equipment, the first cameras and the first light source equipment are installed on the equipment body through first installation frames, and the first installation frames are erected on the equipment body; the lens irradiation direction of the first cameras is close to one side of the conveying belt, the first cameras are used for detecting product defects, and a first through hole allowing one of the first cameras and the first light source equipment to penetrate through is formed in the top wall of the equipment body. The method has the effect of detecting the defects of the front surface and the back surface of the product.

Description

Technical Field

[0001] This application relates to the field of semiconductor inspection technology, and in particular to a device for detecting appearance defects in chip packaging substrates. Background Technology

[0002] In the chip manufacturing industry, quality control of chip packaging substrates is crucial. Visual defect inspection of chip packaging substrates is a key step in ensuring their quality. Accurate and efficient inspection can promptly detect scratches, cracks, impurities, and other problems on the substrate surface, preventing defective substrates from entering subsequent production processes. This improves chip yield, reduces production costs, and promotes the stable development of the entire chip industry.

[0003] Under relevant technologies, the industry standard for detecting appearance defects on chip packaging substrates that have not yet been fitted with chips is single-sided inspection. Specifically, the inspection equipment typically only has the capability to inspect one side of the substrate. During the inspection process, one side of the substrate is placed in the inspection area, and images of that side are acquired and analyzed using a camera and light source to identify potential appearance defects. After inspecting one side, the substrate needs to be flipped over manually or with the aid of other equipment, and the same inspection operation is performed on the other side.

[0004] Regarding the aforementioned technologies, the existing single-sided inspection method has significant drawbacks. Firstly, it suffers from low inspection efficiency, as the need to flip the substrate increases inspection time and reduces the number of samples that can be inspected per unit time. Secondly, its inspection accuracy is also low, as it cannot simultaneously acquire information from both sides of the substrate, potentially leading to the omission of some hidden defects and thus affecting the quality inspection results of the chip packaging substrate. Summary of the Invention

[0005] In order to detect defects on the front and back of a product, this application provides a device for detecting appearance defects on a chip packaging substrate.

[0006] This application provides a device for detecting appearance defects in a chip packaging substrate, which adopts the following technical solution: A device for detecting surface defects in chip packaging substrates, comprising: Equipment body; A conveyor belt is slidably connected to the main body of the equipment along a first direction for conveying products. One end of the conveyor belt is a feed inlet, and the other end is a discharge outlet. A defect detection mechanism is symmetrically arranged on both sides of the conveyor belt along a second direction. The defect detection mechanism includes a first camera and a first light source device. The first camera and the first light source device are mounted on the main body of the equipment via a first mounting bracket. The first mounting bracket is mounted on the main body of the equipment. The lens of the first camera is positioned closer to the side of the conveyor belt. The first camera is used to detect product defects. A first through hole is provided on the top wall of the main body of the equipment for one of the first cameras and the first light source device to pass through.

[0007] By adopting the above technical solution, and by setting two defect detection mechanisms along the second direction, when the product is transported to the defect detection mechanism by the conveyor belt, under the illumination of the first light source device, the two first cameras simultaneously detect defects such as scratches on the upper and lower surfaces of the product on the conveyor belt, thus improving the efficiency of product defect detection.

[0008] Optionally, the first camera is rotatably connected to the first mounting bracket, and the first camera is parallel to a third direction along the rotation axis of the first mounting bracket.

[0009] By adopting the above technical solution, and by setting the first camera to rotate and connect to the first mounting bracket in a third direction, the angle of the first camera can be adjusted according to the size and position of the product to adapt to the defect detection of different types of products.

[0010] Optionally, it also includes a first drive assembly for driving the first camera to rotate. The first drive assembly includes a first motor and a first rotating shaft. The first rotating shaft is rotatably connected to the first mounting bracket. The axis of the first rotating shaft and the axis of rotation are both parallel to a third direction. A first mounting base is installed on one side of the first camera. The first mounting base is fixedly connected to the first rotating shaft. The output shaft of the first motor is coaxially fixedly connected to the first rotating shaft.

[0011] By adopting the above technical solution, the first motor drives the first rotating shaft to rotate, which in turn drives the first camera to rotate in a third direction.

[0012] Optionally, the first rotating shaft is connected to the first mounting bracket via a second mounting seat, the first rotating shaft is rotatably connected to the second mounting seat, and the other side of the second mounting seat is slidably connected to the first mounting bracket along a third direction.

[0013] By adopting the above technical solution and setting the second mounting base to slide along the third direction, the position of the first camera along the third direction can be further adjusted, thereby improving the detection range of the first camera and enabling defect detection of products of different types and sizes, making it more applicable.

[0014] Optionally, it also includes a second drive assembly, which includes a second motor and a lead screw. The lead screw is rotatably connected to the first mounting bracket. The lead screw's own axis and rotation axis are both parallel to a third direction. The second mounting seat is directly or indirectly threaded to the lead screw. The second mounting seat slides along the axial direction of the lead screw. The output shaft of the second motor is coaxially fixedly connected to the lead screw.

[0015] By adopting the above technical solution and setting a second driving component, when the position of the first camera needs to be adjusted, the second motor drives the lead screw to rotate, and the lead screw further drives the second mounting base to slide in a third direction, thereby driving the first camera to slide in a third direction.

[0016] Optionally, the first mounting bracket has a first sliding groove along a third direction, the lead screw is located in the first sliding groove, and a slider is fixedly connected to one end of the second mounting base, the outer peripheral wall of the slider is in contact with the peripheral wall of the first sliding groove.

[0017] By adopting the above technical solution, the sliding of the second mounting seat along the screw axis is guided by setting the slider to slide in the first groove.

[0018] Optionally, the first mounting frame is also provided with two second cameras. The second cameras are symmetrically arranged on both sides of the conveyor belt along a third direction. The second cameras are directly or indirectly rotatably connected to the first mounting frame. The second cameras are parallel to the second direction along the rotation axis of the first mounting frame. The lens of the second camera is set closer to the side of the conveyor belt.

[0019] By adopting the above technical solution, the first camera set on both sides of the conveyor belt can detect defects on the upper and lower surfaces of the product. However, the two sides of the product are areas of uniform stress concentration, which are also prone to defects such as cracks. By setting a second camera, which is rotatably connected to the first mounting frame, the second camera can detect defects on both sides of the product.

[0020] Optionally, it also includes a third drive assembly, which includes a first bevel gear, a second bevel gear, a second rotating shaft, a third bevel gear, and a third rotating shaft, with a first bevel gear fixedly sleeved at both ends of the lead screw; The second rotating shaft is rotatably connected to the first mounting bracket. The axis of the second rotating shaft and its rotation axis are both parallel to the first direction. A second bevel gear is fixedly sleeved at both ends of the second rotating shaft. One end of the third rotating shaft is rotatably connected to the first mounting bracket, and the other end extends to the outside of the first mounting bracket. The axis of the third rotating shaft and its rotation axis are both parallel to the second direction. The third bevel gear is coaxially fixedly connected to the third rotating shaft. The third bevel gear meshes with the second bevel gear on the second rotating shaft away from the first bevel gear. The third rotating shaft is fixedly sleeved with the third bevel gear, and the third bevel gear meshes with the second bevel gear. The second camera is fixedly sleeved on the end of the third rotating shaft away from the first mounting bracket via a third mounting base.

[0021] By adopting the above technical solution and setting a third drive component, when it is necessary to adjust the angle of the second camera, the second motor is started. The second motor drives the lead screw to rotate, and the lead screw drives the first bevel gear, the second bevel gear, the third bevel gear and the third rotating shaft to rotate, thereby driving the second camera to rotate.

[0022] Optionally, it also includes a positional detection mechanism, at least one of which is installed on the main body of the equipment and located on the side of the defect detection mechanism near the discharge port.

[0023] By adopting the above technical solution and setting up a positional accuracy detection mechanism, the positional accuracy of features such as chips, passive components, pads for wire bonding, alignment marks, and vias in subsequent product mounting is detected.

[0024] Optionally, a cleaning device is also included, which is located on the side of the defect detection mechanism near the feed inlet and on the top wall of the conveyor belt, for cleaning the product.

[0025] By adopting the above technical solution and setting up cleaning equipment, the dirt or foreign matter on the surface of the product can be cleaned.

[0026] In summary, this application includes at least one of the following beneficial technical effects: This application provides two defect detection mechanisms along the second direction. When the product is transported to the defect detection mechanism by the conveyor belt, under the illumination of the first light source device, the two first cameras simultaneously detect defects such as scratches on the upper and lower surfaces of the product on the conveyor belt, thus improving the efficiency of product defect detection. This application sets a first camera to be rotatably connected to a first mounting bracket along a third direction, and the angle of the first camera can be adjusted according to the size and position of the product to adapt to defect detection of different types of products; This application incorporates a second camera, which is rotatably connected to the first mounting bracket. The second camera can detect defects on both sides of the product. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of the chip packaging substrate appearance defect detection equipment of this application; Figure 2 This is a schematic diagram of the connection between the defect detection organization and the main body of the equipment in this application; Figure 3 This is a schematic diagram of the structure of the first driving component and the second driving component of this application; Figure 4 This is a schematic diagram of the structure of the third driving component of this application; Figure 5 This application Figure 4 Enlarged view of part A in the middle.

[0028] Explanation of reference numerals in the attached drawings: 1. Equipment body; 11. First through hole; 12. Second through hole; 13. Third through hole; 14. NG marking mechanism; 15. Fourth through hole; 2. Conveyor belt; 21. Feed inlet; 22. Discharge outlet; 3. Defect detection mechanism; 31. First camera; 32. First light source device; 33. First mounting bracket; 331. First chute; 332. Mounting groove; 333. Second light source device; 34. Second camera; 4. Cleaning equipment; 5. Code reading device; 6. Position detection mechanism; 7. First drive assembly; 71. First motor; 72. First rotating shaft; 73. First mounting base; 74. Second mounting base; 741. Slider; 8. Second drive assembly; 81. Second motor; 82. Lead screw; 9. Third drive assembly; 91. First bevel gear; 92. Second bevel gear; 93. Second rotating shaft; 94. Third bevel gear; 95. Third rotating shaft; 96. Third mounting base. Detailed Implementation

[0029] The following is in conjunction with the appendix Figure 1-5 This application will be described in further detail.

[0030] This application discloses an appearance defect detection device for a chip packaging substrate. For ease of description, this application introduces directional terms such as first direction, second direction, and third direction to form a three-dimensional reference direction. The directional terms used, such as "first direction, second direction, and third direction," can be specifically referred to in the figure, where the first direction is represented by X, the second direction by Y, and the third direction by Z. The first direction, second direction, and third direction are perpendicular to each other.

[0031] Reference Figure 1 and Figure 2The chip packaging substrate appearance defect detection equipment includes a main body 1, a conveyor belt 2, and a defect detection mechanism 3. The conveyor belt 2 is slidably connected to the main body 1 along a first direction for conveying products. One end of the conveyor belt 2 is an inlet 21, and the other end is an outlet 22. The defect detection mechanism 3 is symmetrically arranged on both sides of the conveyor belt 2 along a second direction. The defect detection mechanism 3 includes a first camera 31 and a first light source device 32. The first camera 31 and the first light source device 32 are mounted on the main body 1 through a first mounting bracket 33. The first mounting bracket 33 is mounted on the main body 1. The lens of the first camera 31 is vertically downward and is set close to the side of the conveyor belt 2. The first camera 31 is used to detect product defects. The top wall of the main body 1 has a first through hole 11 for the first camera 31 and the first light source device 32 to pass through. When the product is transported by the conveyor belt 2 and reaches the vicinity of the first camera 31, the first cameras 31 distributed above and below the conveyor belt 2 detect product defects, thereby simultaneously detecting defects on the front and back of the product.

[0032] In this embodiment, the first camera 31 is an industrial camera, which is the prior art in this field. The conveyor belt 2 is the prior art in this field. The conveyor belt 2 is made of a semi-transparent material, and the driving structure that drives the conveyor belt 2 to slide along the second direction is also the prior art. The specific structure and driving structure will not be described in detail.

[0033] Reference Figure 1 In order to improve the defect recognition effect of the first camera 31, the first light source device 32 is tilted. The first light source device 32 is tilted towards the side closer to the discharge port 22 along the direction close to the main body of the device 1, so as to provide better light to the product.

[0034] Reference Figure 1 Before detecting defects in the product, the product transported by the conveyor belt 2 may be contaminated with foreign objects or dust. In order to reduce the impact on the accuracy of subsequent image acquisition, the appearance defect detection equipment for chip packaging substrate also includes a cleaning device 4. The cleaning device 4 is located on the side of the defect detection mechanism 3 near the feed inlet 21 and above the conveyor belt 2. The cleaning device 4 cleans the product. In this embodiment, the cleaning device 4 is a cleaning machine, which is the prior art in this field. The cleaning device 4 cleans the dirt or foreign objects on the surface of the product.

[0035] Reference Figure 1A barcode reader 5 is also provided between the cleaning equipment 4 and the defect detection equipment. The barcode reader 5 is installed on the main body 1 of the equipment and is symmetrically arranged on both sides of the conveyor belt 2 along the second direction. A second through hole 12 through which one of the barcode readers 5 passes is opened on the top wall of the main body 1 along the second direction. In this embodiment, the barcode reader 5 is the prior art in this field. It reads the barcode information of the product by scanning the barcode scanner to obtain data such as the production batch, model and production time of the product, so as to facilitate the association of subsequent detection data with product information and realize product traceability.

[0036] Reference Figure 1 and Figure 2 It should be noted that the semiconductor material can be a chip packaging substrate, a mobile phone SP base plate, etc. Since the semiconductor material (such as the chip packaging substrate) has features such as pads, alignment marks and vias for subsequent chip mounting, passive components and wire bonding, in order to detect the accuracy of the position of these features, the defect detection mechanism 3 is provided with a position detection mechanism 6 on the side near the discharge port 22. There is at least one position detection mechanism 6. In this embodiment, the position detection mechanism 6 is symmetrically arranged on both sides of the conveyor belt 2 along the second direction, and two position detection mechanisms 6 are spaced apart along the first direction. The equipment body 1 has a third through hole 13 along the top wall along the second direction for one of the position detection mechanisms 6 to pass through. In this embodiment, the position detection mechanism 6 is the prior art in this field, which is used to detect the center position of features such as bonding pads, alignment marks and vias.

[0037] Reference Figure 2 If a defective product is detected, in order to facilitate the rapid identification of defective products in the subsequent sorting process, the appearance defect detection equipment for the chip packaging substrate also includes an NG marking mechanism 14. The NG marking mechanism 14 is located on the side of the position detection mechanism 6 near the discharge port 22. The NG marking mechanism 14 is installed on the main body 1 of the installation equipment and is symmetrically arranged on both sides of the conveyor belt 2 along the second direction. The top wall of the main body 1 of the equipment has a fourth through hole 15 for one of the NG marking mechanisms 14 to pass through. In this embodiment, the NG marking mechanism 14 is a laser marking device, which is the prior art in this field. The specific structure will not be described in detail. The NG marking mechanism 14 can mark "NG" at a designated position on the product (such as the corner of the bottom plate), which facilitates the rapid identification and rejection of defective products in the subsequent sorting process and prevents defective products from flowing into the next process.

[0038] Reference Figure 3 In order to perform defect detection on different types of products, the first camera 31 is rotatably connected to the first mounting bracket 33. The first camera 31 is parallel to the third direction along the rotation axis of the first mounting bracket 33, that is, the angle of the first camera 31 is adjustable. The angle of the first camera 31 can be adjusted according to the size and position of the product to adapt to the defect detection of different types of products.

[0039] Reference Figure 3 In order to drive the first camera 31 to rotate in a third direction, the chip packaging substrate appearance defect detection device also includes a first drive component 7 for driving the first camera 31 to rotate. The first drive component 7 includes a first motor 71 and a first rotating shaft 72. The first rotating shaft 72 is rotatably connected to the first mounting bracket 33. The axis of the first rotating shaft 72 and the axis of rotation are both parallel to the third direction. A first mounting seat 73 is installed on one side of the first camera 31. The first mounting seat 73 is fixedly connected to the first rotating shaft 72. The output shaft of the first motor 71 is coaxially fixedly connected to the first rotating shaft 72. The first motor 71 drives the first rotating shaft 72 to rotate, thereby driving the first camera 31 to rotate.

[0040] Reference Figure 3 In order to connect the first rotating shaft 72 to the first mounting bracket 33, the first rotating shaft 72 is connected to the first mounting bracket 33 through the second mounting seat 74. The first rotating shaft 72 is rotatably connected to the second mounting seat 74, and the other side of the second mounting seat 74 is connected to the first mounting bracket 33.

[0041] Reference Figure 3 In order to further improve the detection range of the first camera 31 for different types of product defects, the second mounting base 74 is slidably connected to the first mounting bracket 33 along the third direction, thereby further realizing the position adjustment of the first camera 31 along the third direction, thus realizing the detection of defects of different types and sizes of products, making it more applicable.

[0042] Reference Figure 3 In order to drive the second mounting base 74 to slide along a third direction, the chip packaging substrate appearance defect detection device also includes a second drive assembly 8. The second drive assembly 8 includes a second motor 81 and a lead screw 82. The lead screw 82 is rotatably connected to the first mounting bracket 33. The axis of the lead screw 82 and its rotation axis are both parallel to the third direction. The second mounting base 74 is directly or indirectly threaded to the lead screw 82. The second mounting base 74 slides along the axis of the lead screw 82. The output shaft of the second motor 81 is coaxially fixedly connected to the lead screw 82. The second motor 81 drives the lead screw 82 to rotate. The lead screw 82 further drives the second mounting base 74 to slide along the third direction, thereby driving the first camera 31 to slide along the third direction.

[0043] Reference Figure 3 In order to guide the sliding of the second mounting base 74 along the lead screw 82, the first mounting bracket 33 is provided with a first sliding groove 331 along the third direction. The lead screw 82 is located in the first sliding groove 331. A slider 741 is fixedly connected to one end of the second mounting base 74. The slider 741 is threaded to the lead screw 82. The outer peripheral wall of the slider 741 is in contact with the peripheral wall of the first sliding groove 331. The rotation of the lead screw 82 drives the sliding lead screw 82 to slide in the direction of the axis of the sliding lead screw 82, that is, in the third direction.

[0044] Reference Figure 4 The first camera 31, located on both sides of the conveyor belt 2, can detect defects on the upper and lower surfaces of the product. However, the sides of the product are areas of uniform stress concentration, which are also prone to defects such as cracks. In order to detect defects on both sides of the product, a second camera 34 is also provided on the first mounting frame 33. Two second cameras 34 are spaced apart along a third direction. The second cameras 34 are rotatably connected to the first mounting frame 33. The second cameras 34 are parallel to the second direction along the rotation axis of the first mounting frame 33. The lens of the second camera 34 is positioned closer to the side of the conveyor belt 2, so that the second camera 34 can detect defects on both sides of the product. In this embodiment, the second camera 34 is an industrial camera, which is the prior art in this field.

[0045] Reference Figure 4 and Figure 5 To drive the second camera 34 to rotate in the second direction, the chip packaging substrate appearance defect detection device also includes a third drive assembly 9. The third drive assembly 9 includes a first bevel gear 91, a second bevel gear 92, a second rotating shaft 93, a third bevel gear 94, and a third rotating shaft 95. A first bevel gear 91 is fixedly sleeved at both ends of the lead screw 82. The second rotating shaft 93 is rotatably connected to the first mounting bracket 33. The axis of the second rotating shaft 93 and its rotation axis are both parallel to the first direction. A second bevel gear 92 is fixedly sleeved at both ends of the second rotating shaft 93. One end of the third rotating shaft 95 is rotatably connected to the first mounting bracket 33, and the other end extends to the outside of the first mounting bracket 33. The axis of the third rotating shaft 95 and its rotation axis are both parallel to the second direction. The third bevel gear 94 is coaxially fixed. The third bevel gear 94 is fixedly connected to the third rotating shaft 95. The third bevel gear 94 meshes with the second bevel gear 92 of the second rotating shaft 93 away from the first bevel gear 91. The third bevel gear 94 is fixedly sleeved on the third rotating shaft 95 and meshes with the second bevel gear 92. The second camera 34 is fixedly connected to the end of the third rotating shaft 95 away from the first mounting bracket 33 through the third mounting base 96. The top wall of the first mounting bracket 33 has a mounting groove 332 for accommodating the second bevel gear 92 and the third bevel gear 94. When it is necessary to adjust the angle of the second camera 34, the second motor 81 is started. The second motor 81 drives the lead screw 82 to rotate. The lead screw 82 drives the first bevel gear 91, the second bevel gear 92, the third bevel gear 94 and the third rotating shaft 95 to rotate, thereby driving the second camera 34 to rotate.

[0046] Reference Figure 4 In order to provide more sufficient illumination on both sides of the product, a second light source device 333 is also installed on the first mounting frame 33. The second light source device 333 is spaced apart along the third direction and is inclined upward along the direction close to the conveyor belt 2. The second light source device 333 is located below the second camera 34 and illuminates both sides of the product.

[0047] The implementation principle of the chip packaging substrate appearance defect detection device in this application embodiment is as follows: Several products are transported by conveyor belt 2. The products are first cleaned by cleaning equipment 4. Then, the code reading equipment 5 obtains information such as the production batch and model of the products. The products are transported to the vicinity of the first camera 31. The first motor 71 drives the first camera 31 to rotate in the second direction. The first camera 31 detects defects on the upper and lower surfaces of the products. When it is necessary to detect defects on both sides of the products, the second motor 81 drives the lead screw 82 to rotate, which drives the second rotating shaft 93 to rotate, further driving the second camera 34 to rotate, so that the second camera 34 can detect defects on the sidewalls of the products. At the same time, it drives the second mounting base 74 to slide in the third direction, so as to adjust the position of the first camera 31 in the third direction and improve the detection range of the first camera 31. After the detection is completed, the products are transported between two position detection mechanisms 6. The position detection mechanisms 6 detect the position of the left and right sides of the products. Finally, the NG marking mechanism 14 marks the unqualified products.

[0048] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A device for detecting appearance defects in a chip packaging substrate, characterized in that: include Equipment body (1); A conveyor belt (2) is slidably connected to the main body (1) of the equipment along a first direction for conveying products. One end of the conveyor belt (2) is a feed inlet (21), and the other end is a discharge outlet (22). A defect detection mechanism (3) is symmetrically arranged on both sides of the conveyor belt (2) along a second direction. The defect detection mechanism (3) includes a first camera (31) and a first light source device (32). The first camera (31) and the first light source device (32) are mounted on the main body of the equipment (1) through a first mounting bracket (33). The first mounting bracket (33) is mounted on the main body of the equipment (1). The lens of the first camera (31) is positioned closer to the side of the conveyor belt (2). The first camera (31) is used to detect product defects. The top wall of the main body of the equipment (1) has a first through hole (11) through which one of the first cameras (31) and the first light source device (32) passes.

2. The appearance defect detection device for a chip packaging substrate according to claim 1, characterized in that: The first camera (31) is rotatably connected to the first mounting bracket (33), and the first camera (31) is parallel to a third direction along the rotation axis of the first mounting bracket (33).

3. The appearance defect detection device for a chip packaging substrate according to claim 2, characterized in that: It also includes a first drive assembly (7) for driving the first camera (31) to rotate. The first drive assembly (7) includes a first motor (71) and a first rotating shaft (72). The first rotating shaft (72) is rotatably connected to the first mounting bracket (33). The axis of the first rotating shaft (72) and the axis of rotation are both parallel to a third direction. A first mounting seat (73) is installed on one side of the first camera (31). The first mounting seat (73) is fixedly connected to the first rotating shaft (72). The output shaft of the first motor (71) is coaxially fixedly connected to the first rotating shaft (72).

4. The appearance defect detection device for a chip packaging substrate according to claim 3, characterized in that: The first rotating shaft (72) is connected to the first mounting bracket (33) via the second mounting base (74). The first rotating shaft (72) is rotatably connected to the second mounting base (74), and the other side of the second mounting base (74) is slidably connected to the first mounting bracket (33) along a third direction.

5. The appearance defect detection device for a chip packaging substrate according to claim 4, characterized in that: It also includes a second drive assembly (8), which includes a second motor (81) and a lead screw (82). The lead screw (82) is rotatably connected to the first mounting bracket (33). The lead screw (82) has its own axis and rotation axis parallel to a third direction. The second mounting seat (74) is directly or indirectly threaded to the lead screw (82). The second mounting seat (74) slides along the axial direction of the lead screw (82). The output shaft of the second motor (81) is coaxially fixedly connected to the lead screw (82).

6. The appearance defect detection device for a chip packaging substrate according to claim 5, characterized in that: The first mounting bracket (33) has a first groove (331) in a third direction. The lead screw (82) is located in the first groove (331). The second mounting base (74) has a slider (741) fixedly connected to one end. The slider (741) is threaded to the lead screw (82). The outer peripheral wall of the slider (741) is in contact with the peripheral wall of the first groove (331).

7. The appearance defect detection device for a chip packaging substrate according to claim 5, characterized in that: The first mounting frame (33) is also provided with two second cameras (34). The second cameras (34) are symmetrically arranged on both sides of the conveyor belt (2) along a third direction. The second cameras (34) are directly or indirectly rotatably connected to the first mounting frame (33). The second cameras (34) are parallel to the second direction along the rotation axis of the first mounting frame (33). The lens of the second camera (34) is set closer to the side of the conveyor belt (2).

8. The appearance defect detection device for a chip packaging substrate according to claim 7, characterized in that: It also includes a third drive assembly (9), which includes a first bevel gear (91), a second bevel gear (92), a second shaft (93), a third bevel gear (94), and a third shaft (95); The lead screw (82) has a first bevel gear (91) fixedly sleeved at both ends. The second rotating shaft (93) is rotatably connected to the first mounting bracket (33). The axis of the second rotating shaft (93) and its rotation axis are both parallel to the first direction. The second rotating shaft (93) has a second bevel gear (92) fixedly sleeved at both ends. The third rotating shaft (95) has one end rotatably connected to the first mounting bracket (33) and the other end extends to the outside of the first mounting bracket (33). The axis of the third rotating shaft (95) and its rotation axis are both parallel to the second direction. The third bevel gear (94) is coaxially fixedly connected to the third rotating shaft (95). The third bevel gear (94) meshes with the second bevel gear (92) of the second rotating shaft (93) away from the first bevel gear (91). The third rotating shaft (95) is fixedly sleeved with the third bevel gear (94). The third bevel gear (94) meshes with the second bevel gear (92). The third mounting base (96) of the second camera (34) is fixedly sleeved on the end of the third rotating shaft (95) away from the first mounting bracket (33).

9. The appearance defect detection device for a chip packaging substrate according to claim 1, characterized in that: It also includes a position detection mechanism (6), at least one of which is installed on the main body of the equipment (1) and located on the side of the defect detection mechanism (3) near the discharge port (22).

10. The appearance defect detection device for a chip packaging substrate according to claim 1, characterized in that: It also includes a cleaning device (4), which is located on the side of the defect detection mechanism (3) near the feed inlet (21) and on the top wall of the conveyor belt (2) for cleaning the product.

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