Wafer carrier apparatus for wafer transfer equipment and method of use

Abstract

The application discloses a wafer support device for wafer transmission equipment and a use method thereof, and belongs to the technical field of semiconductor manufacturing. The wafer support device for wafer transmission equipment comprises a base, a circular groove is formed in the upper surface of the base, a first support and a second support which are symmetric about the center point of the groove are arranged on the inner wall of the groove, a plurality of mounting holes are formed in the upper surfaces of the first support and the second support, a gem ball is arranged in each mounting hole, the diameter of the gem ball is greater than the depth of the mounting hole, and an exhaust passage is formed in the bottom of each mounting hole. The exhaust passage can discharge the pollutants such as particles, dust and turbid gas in the mounting hole after operation, effectively solves the technical problems that the single-point continuous wear of the fixed support point leads to particle pollution, wafer scratch and short service life.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor manufacturing technology, specifically relating to a wafer carrier device for wafer transport equipment and its usage method. Background Technology

[0002] In semiconductor manufacturing, wafers need to be frequently and automatically transferred between various devices. The wafer carrier assembly on wafer transfer equipment (such as robotic arms and loading locks) is a key component for supporting and positioning wafers; its performance directly affects the stability of the transfer process, wafer cleanliness, and production yield. Currently, common wafer carrier assemblies (such as robotic arm end effectors or fixed carriers) use multiple rigid, fixed support points to support the wafer. Specifically, these support points are typically spheres or nails made of high-hardness materials, and their bottoms are rigidly fixed in cylindrical blind holes or venting channels of the carrier through interference fits or bonding, forming a fixed, immovable contact point. The main drawbacks are as follows:

[0003] 1. Severe single-point wear: Because the support ball is rigidly fixed and cannot move, the contact position between the support point and the back of the wafer remains almost constant during each placement, transport, and removal cycle. This causes all friction and wear to concentrate on this fixed point, resulting in excessive localized wear.

[0004] 2. Particulate contamination: Wear and tear can roughen the surface of the originally smooth gemstone spheres, generating micron-sized particulate contaminants. These particles can contaminate the back side of the wafer and the environment of the transmission equipment chamber, leading to product defects and reduced yield.

[0005] 3. Easily scratches wafers: Severely worn support points may form tiny notches or burrs, which can easily scratch the sensitive structures on the back of the wafer when moving relative to the back of the wafer, causing irreversible damage and wafer scrapping.

[0006] 4. Difficult maintenance and replacement: Once a support point wears out beyond the limit, it is difficult to disassemble and replace it individually because it is firmly pressed into the hole. Usually, the entire bracket or even the entire bracket assembly needs to be replaced, resulting in high maintenance costs and long downtime. Summary of the Invention

[0007] Based on the technical problems existing in the prior art, the present invention provides a wafer support device for wafer transfer equipment and a method for using the same.

[0008] To achieve the above objectives, according to a first aspect of the technical solution of the present invention, the present invention provides a wafer support device for a wafer transfer device, comprising a base, wherein a circular groove is formed on the upper surface of the base, and a first support and a second support, whose center points are symmetrical about the center of the groove, are provided on the inner wall of the groove. The upper surfaces of the first support and the second support are each provided with a plurality of mounting holes, and a sapphire ball is provided in each mounting hole. The diameter of the sapphire ball is greater than the depth of the mounting hole, and an exhaust channel is formed at the bottom of each mounting hole.

[0009] A further improvement of the present invention is that both the first support and the second support are arc-shaped plates, and the length of the first support is greater than the length of the second support.

[0010] A further improvement of the present invention is that: both the first support and the second support are stacked structures, and the first support and the second support have the same number of stacked layers.

[0011] A further improvement of the present invention is that: the mounting hole includes an outward flare, an inward flare, and a ball seat; the inward flare is a channel with the same inner diameter; a ball seat is provided below the inward flare; an outward flare is provided above the inward flare; the ball seat is a bottom surface with the same diameter as the inner diameter of the inward flare; the outward flare is a cone with an inner diameter that gradually decreases from top to bottom; and the minimum inner diameter of the outward flare is equal to the inner diameter of the inward flare.

[0012] A further improvement of the present invention is that the gemstone ball is made of sapphire.

[0013] A further improvement of the present invention is that: a plurality of support columns are vertically provided below the first bracket and the second bracket, the bottom of the plurality of support columns is fixedly connected to the bottom of the groove, and the first bracket and the second bracket are connected to the support columns by screws.

[0014] A further improvement of the present invention is that: a plurality of positioning posts are vertically provided below the first bracket and the second bracket, the first bracket and the second bracket are fixedly connected to the plurality of positioning posts, a plurality of positioning shafts are vertically provided above the bottom surface of the groove, and positioning holes are provided at the bottom of the plurality of positioning posts, and the plurality of positioning posts cooperate with the plurality of positioning shafts.

[0015] A further improvement of the present invention is that: a spacer is provided between the stacked plurality of first supports and a spacer is provided between the stacked plurality of second supports.

[0016] A further improvement of the present invention is that the height of the inner opening is greater than the radius of the gemstone ball, and the diameter of the ball seat is smaller than the diameter of the gemstone ball.

[0017] According to a second aspect of the present invention, the present invention provides a method of using a wafer carrier device for a wafer transport equipment, applicable to the aforementioned wafer carrier device for a wafer transport equipment, comprising the following steps:

[0018] Step S1: Place the wafer to be transferred above the first support and the second support, so that the top of several gem balls is in contact with the bottom of the wafer;

[0019] Step S2: During the transmission process, the gemstone ball is vibrated and rotates within the mounting hole until the transmission is completed;

[0020] Step S3: After the transmission is completed, the particles and gas generated during the transmission process are discharged through the exhaust channel;

[0021] Step S4: When a gemstone ball reaches the end of its service life, the gemstone ball that has reached the end of its service life is discharged through the venting channel.

[0022] Compared with the prior art, the above-mentioned technical solution of the present invention has the following beneficial technical effects:

[0023] This invention limits the depth of the mounting hole to less than the diameter of the sapphire ball, allowing the sapphire ball to protrude from the mounting hole and thus support the wafer. One end of the exhaust channel communicates with the mounting hole, and the other end is connected to a vacuum system. The vacuum system and exhaust channel remove contaminants such as particles, dust, or turbid gas from the mounting hole after operation. The vacuum system can also remove scrapped sapphire balls from the exhaust channel, effectively solving the technical problems of particle contamination, wafer scratches, and short lifespan caused by continuous wear at a single point on the fixed support point. Attached Figure Description

[0024] The accompanying drawings are provided to better understand the invention and are not intended to unduly limit the scope of the invention. Wherein:

[0025] Figure 1 This is a top view of a wafer support device for a wafer transport equipment according to the present invention;

[0026] Figure 2 This is a schematic diagram of the structure of a support assembly in a wafer support device for a wafer transport equipment according to the present invention;

[0027] Figure 3 This is a cross-sectional view of a wafer support device for a wafer transport equipment according to the present invention;

[0028] Figure 4 This is a cross-sectional view of the mounting hole in a wafer support device for a wafer transport equipment according to the present invention;

[0029] Figure 5This is a schematic diagram of a wafer support device for wafer transport equipment installed in a vacuum system according to the present invention;

[0030] Figure 6 This is a cross-sectional view of a wafer support device for wafer transport equipment of the present invention installed in a vacuum system.

[0031] Reference numerals in the attached figures: 1. Support assembly; 101. First support; 102. Third support; 103. Screw; 104. Positioning post; 105. Gemstone ball; 106. Support post; 107. Second support; 108. Fourth support; 109. Spacer; 111. Outer flare; 112. Inner flare; 113. Ball seat; 114. Exhaust channel; 115. Positioning shaft; 116. Connecting thread; 2. Base; 21. Groove; 201. Valve; 202. End cap; 203. Vacuum interface; 3. Wafer. Detailed Implementation

[0032] The following description, in conjunction with the accompanying drawings, illustrates exemplary embodiments of the present invention, including various details to aid understanding. These details should be considered merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the invention. Similarly, for clarity and brevity, descriptions of well-known functions and structures are omitted in the following description.

[0033] This invention provides a wafer support device for a wafer transfer equipment, comprising a base, a circular groove on the upper surface of the base, and a first support and a second support symmetrical about the center of the groove on the inner wall of the groove. The upper surfaces of the first support and the second support are provided with a plurality of mounting holes, and a sapphire ball is provided in each mounting hole. The diameter of the sapphire ball is greater than the depth of the mounting hole, and an exhaust channel is provided at the bottom of each mounting hole.

[0034] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0035] Example 1

[0036] A wafer carrier device for wafer transport equipment, such as Figure 1 As shown, the device includes a support assembly 1 and a base 2. A circular groove 21 is formed on the upper surface of the base 2, and the support assembly 1 is disposed within the groove 21. The support assembly 1 is used to support the wafer 3 to be transported. Figure 2As shown, the support assembly 1 includes a first support 101 and a second support 107. The centers of the first support 101 and the second support 107 are symmetrical about the center of the groove 21. Both the first support 101 and the second support 107 are adjacent to the inner wall of the groove 21. Both ends of the first support 101 and the second support 107 are provided with bosses facing the center of the groove 21. Each boss has a mounting hole, and a gemstone ball 105 is placed in the mounting hole. The diameter of the gemstone ball 105 is larger than the depth of the mounting hole. An exhaust channel 114 is provided at the bottom of the mounting hole. The exhaust channel 114 is a through hole that passes through the first support 101 or the second support 107. The circular groove 21 and the support assembly located near the inner wall of the groove 21 can better support the circular wafer. By setting two supports whose centers are symmetrical about the center of the groove 21, the force can be balanced when the wafer 3 is placed on the first support 101 and the second support 107, providing stability to the wafer. By limiting the depth of the mounting hole to less than the diameter of the sapphire ball 105, the sapphire ball 105 can be exposed within the mounting hole, thus supporting the wafer 3. One end of the exhaust channel 114 communicates with the mounting hole, and the other end is connected to a vacuum system. The vacuum system and exhaust channel 114 remove contaminants such as particles, dust, or turbid gas from the mounting hole after operation. The vacuum system can also remove discarded sapphire balls 105 from the exhaust channel 114, effectively solving the technical problems of particle contamination, wafer scratches, and short lifespan caused by continuous wear at a single point on the fixed support point. During use, the wafer 3 to be transferred is placed above the first support 101 and the second support 107, with the tops of several sapphire balls 105 in contact with the bottom of the wafer 3. During transfer, the sapphire balls 105 are vibrated and rotate within the mounting hole until transfer is complete. After transfer, particles and gas generated during transfer are discharged through the exhaust channel 114. When a sapphire ball 105 reaches the end of its service life, it is discharged through the exhaust channel.

[0037] Specifically, both the first support 101 and the second support 107 are curved plates, with the length of the first support 101 being greater than the length of the second support 107. The curvature of the first support 101 and the second support 107 is similar to the curvature of the inner wall of the groove 21, thereby allowing the first support 101 and the second support 107 to better fit the inner wall of the groove 21. The two supports have different lengths, and the combination of long and short supports allows the workpiece to rotate around the axis while maintaining some degrees of freedom. This allows the lower layer to still be operated or adjusted without removing the upper layer structure, improving the maintainability and ease of operation of the system, facilitating subsequent multi-layer stacking, and the long and short supports save space, making it easier for the robotic arm to move the wafer 3.

[0038] Specifically, both the first support 101 and the second support 107 are stacked structures, and the first support 101 and the second support 107 have the same number of stacked layers. Each of the first support 101 and the second support 107 forms a group that can support one wafer 3. Each stacked layer includes such a group of support structures, thereby allowing for different groups of support structures to be set according to actual conditions, supporting multiple wafers 3 simultaneously and improving work efficiency.

[0039] Specifically, such as Figure 4 As shown, the plane height of the mounting hole is lower than the highest height of the first bracket 101 and the second bracket 107. By creating a difference between the top height of the mounting hole and the highest height of the first bracket 101, a stepped structure is formed. The wafer 3 is placed on the lower plane of the stepped structure, so that the end face formed by the height difference of the stepped structure can prevent the wafer 3 from horizontal displacement. The mounting hole includes an outer flare 111, an inner flare 112, and a ball seat 113. The inner flare 112 is a channel with the same inner diameter. A ball seat 113 is provided below the constriction 112, and an outward flare 111 is provided above the constriction 112. The ball seat 113 has a bottom surface with the same diameter as the inner diameter of the constriction 112. The outward flare 111 is a cone with an inner diameter that gradually decreases from top to bottom. The minimum inner diameter of the outward flare 111 is equal to the inner diameter of the constriction 112. By setting the outward flare 111, it is easy to guide the gem ball 105 into the constriction 112. During the installation of the gem ball 105, air is guided through the exhaust channel 114, thereby reducing the installation difficulty.

[0040] Specifically, the height of the inner opening 112 is B, the radius of the gemstone ball 105 is R, the diameter of the ball seat 113 and the inner diameter of the inner opening 112 are both A. There is a relationship B > R, which allows for a gap between the gemstone ball 105 and its surroundings to facilitate its rotation. There is also a relationship A < 2R, which provides an interference fit between the inner opening 112 and the gemstone ball 105, preventing the gemstone ball pressed into the inner opening 112 from falling out of the outer opening 111 above. When installing the sapphire ball 105, the sapphire ball 105 is first guided to the top of the inner opening 112 through the outer flare 111. Then, air is guided through the exhaust channel 114, with A slightly less than 2R, and the sapphire ball 105 is pressed into the inner opening 112, so that the sapphire ball 105 and the ball seat 113 are aligned. This setting allows the sapphire ball to rotate when subjected to external force, but it will not fall out of the outer flare 111. The rotating sapphire ball 105 can be supported on all sides, avoiding the technical problems of particle contamination, wafer scratches and short life caused by continuous wear on a single contact surface. The uniform wear significantly extends the life of the component, reduces particle generation from the source to improve product yield, and reduces maintenance costs.

[0041] Specifically, the connection between the ball seat 113 and the inner opening 112 is chamfered to prevent particles generated during the friction of the gemstone ball from accumulating at the connection between the ball seat 113 and the inner opening 112. After chamfering, it is easier to suck up particles through the exhaust channel 114, reducing the difficulty of cleaning.

[0042] Specifically, the gemstone ball 105 is made of sapphire or other materials with a hardness close to that of the wafer 3, thereby avoiding the gemstone ball 105 being too hard and damaging the wafer, or too soft and causing the gemstone ball to wear out quickly and reduce its expected lifespan.

[0043] Specifically, such as Figure 3 As shown, the first bracket 101 and the second bracket 107 are uniformly provided with a plurality of support holes and a plurality of positioning pin holes along the vertical direction. All the support holes and positioning pin holes are through holes. Each support hole contains a support pin 106, the lower part of which is fixedly connected to the bottom surface of the groove 21. Each positioning pin contains a positioning pin 104. The first bracket 101 and the second bracket 107 are fixedly connected to the positioning pins 104. A plurality of positioning shafts 115 are vertically arranged above the bottom surface of the groove 21. Positioning holes are formed at the bottom of each positioning pin 104, and the positioning pins 104 cooperate with the positioning shafts 115. The first bracket 101 and the second bracket 107 are connected to the support pins 106 by screws 103. A connecting thread 116 is provided on the outer side of the bottom of each support pin 106, and the support pin 106 is threadedly connected to the bottom surface of the groove 21 by the connecting thread 116.

[0044] Specifically, spacers 109 are provided between the stacked first supports 101 and the stacked second supports 107. The height of the spacers 109 is greater than the height of the wafer 3, thereby preventing contact between wafers at different levels.

[0045] Example 2

[0046] A method of using a wafer carrier device for a wafer transport device, which uses a wafer carrier device for a wafer transport device as described in Embodiment 1 above, includes the following steps:

[0047] Step S1, wafer bonding: The transfer robot places the wafer 3 on the support plane formed by the top of multiple gem balls 105.

[0048] Step S2, uniform wear: When the wafer 3 is placed, transported or subjected to slight vibration, or when the wafer 3 is loaded from a high temperature to a low temperature suitable for wafer transfer, and when the wafer 3 expands, shrinks or deforms, the friction between the wafer 3 and the sapphire ball 105 will drive the sapphire ball 105 to rotate within the ball seat 113, thereby causing the contact point to change continuously and achieving uniform wear.

[0049] Step S3, Exhausting: During the process, an external vacuum system can be used to extract the gas and any trace particles that may be generated in the contact area of ​​the sapphire ball 105 through the exhaust channel 114 to maintain local cleanliness.

[0050] Step S4: When a gem ball 105 reaches the end of its service life, it can be replaced by pressing out the old gem ball 105 from the venting channel 114.

[0051] Example 3

[0052] A wafer support device for a wafer transport equipment, wherein the support assembly has a stacked structure, taking a double-layer support assembly 1 as an example, such as... Figure 2-3 As shown, the system includes a first support 101 and a third support 102 of the same size and shape, and a second support 107 and a fourth support 108 of the same size and shape. The third support 102 is located above the first support 101, and the fourth support 108 is located above the second support 107. Two support columns 106 penetrate the first support 101 and the third support 102 vertically, and two more support columns 106 penetrate the second support 107 and the fourth support 108 vertically. The bottom of each support column 106 is fixedly connected to the bottom surface of the groove 21, and the support column 106 is also fixedly connected to the support through which it passes. Two positioning columns 104 penetrate the first support 101 and the third support 102 vertically, and two more positioning columns 104 penetrate the second support 107 and the fourth support 108 vertically. The bottom of each positioning column 104 is fixedly connected to the bottom surface of the groove 21, and the positioning column 104 is also fixedly connected to the support through which it passes. Since the first support 101 and the third support 102 have the same structure, and the second support 107 and the fourth support 108 have the same structure, and the first support 101 and the second support 107 have the same height, and the third support 102 and the fourth support 108 have the same height, each wafer at each height is supported by two supports (e.g., the first support 101 and the second support 107). By providing a spacer 109 on the outside of the support post 106, the spacer 109 is located between the first support 101 and the third support 102, and also between the second support 107 and the fourth support 108, thus preventing contact between wafers 3 at different heights.

[0053] Example 4

[0054] like Figure 5-6 As shown, the base is a vacuum system, including a valve 201, an end cap 202, and a vacuum port 203. The opening and closing of the valve 201 enables the robotic arm to place the wafer 3 on top of the support assembly 1 in Embodiment 1 or to remove the wafer 3 from the support assembly 1. The end cap 202 is located on top of the support assembly 1. The end cap 202 is removed to maintain the support assembly 1. The vacuum port 203 is used to provide a vacuum environment.

[0055] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0056] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can occur depending on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A wafer support device for a wafer transport equipment, characterized in that, Includes a base (2), the upper surface of which is provided with a circular groove (21). The inner wall of the groove (21) is provided with a first support (101) and a second support (107) whose center point is symmetrical about the center of the groove (21). The upper surfaces of the first support (101) and the second support (107) are provided with a plurality of mounting holes. Each mounting hole is provided with a gemstone ball (105). The diameter of the gemstone ball (105) is greater than the depth of the mounting hole. Each mounting hole is provided with an exhaust channel (114) at the bottom. The exhaust channel (114) is a through hole. When the wafer carrier device for wafer transport equipment is used, the following steps are included: Step S1: Place the wafer (3) to be transferred above the first support (101) and the second support (107) so that the top of a plurality of gem balls (105) is in contact with the bottom of the wafer (3); In step S2, the gemstone ball (105) is vibrated and rotates within the mounting hole during the transmission process until the transmission is completed; Step S3: After the transmission is completed, the particles and gas generated during the transmission process are discharged through the exhaust channel (114); Step S4: When a gemstone ball (105) reaches the end of its service life, the gemstone ball (105) that has reached the end of its service life is discharged through the exhaust channel (114).

2. A wafer support device for a wafer transport equipment according to claim 1, characterized in that, Both the first bracket (101) and the second bracket (107) are arc-shaped plates, and the length of the first bracket (101) is greater than the length of the second bracket (107).

3. A wafer support device for a wafer transport equipment according to claim 1, characterized in that, Both the first support (101) and the second support (107) are stacked structures, and the first support (101) and the second support (107) have the same number of stacking layers.

4. A wafer support device for a wafer transport equipment according to claim 1, characterized in that, The mounting hole includes an outward flare (111), an inward flare (112), and a ball seat (113). The inward flare (112) is a channel with the same inner diameter. A ball seat (113) is provided below the inward flare (112). An outward flare (111) is provided above the inward flare (112). The ball seat (113) is a bottom surface with the same diameter as the inner diameter of the inward flare (112). The outward flare (111) is a cone with an inner diameter that gradually decreases from top to bottom. The minimum inner diameter of the outward flare (111) is equal to the inner diameter of the inward flare (112).

5. A wafer carrier device for a wafer transport equipment according to claim 1, characterized in that, The gemstone sphere (105) is made of sapphire.

6. A wafer support device for a wafer transport equipment according to claim 1, characterized in that, A plurality of support columns (106) are vertically provided below the first bracket (101) and the second bracket (107). The bottom of the plurality of support columns (106) is fixedly connected to the bottom of the groove (21). The first bracket (101) and the second bracket (107) are connected to the support columns (106) by screws (103).

7. A wafer support device for a wafer transport equipment according to claim 1, characterized in that, A plurality of positioning posts (104) are vertically arranged below the first bracket (101) and the second bracket (107). The first bracket (101) and the second bracket (107) are fixedly connected to the plurality of positioning posts (104). A plurality of positioning shafts (115) are vertically arranged above the bottom surface of the groove (21). The bottom of each of the plurality of positioning posts (104) is provided with a positioning hole. The plurality of positioning posts (104) cooperate with the plurality of positioning shafts (115).

8. A wafer support device for a wafer transport equipment according to claim 3, characterized in that, Spacers (109) are provided between the stacked first supports (101) and between the stacked second supports (107).

9. A wafer support device for a wafer transport equipment according to claim 4, characterized in that, The height of the inner opening (112) is greater than the radius of the gemstone ball (105), and the diameter of the ball seat (113) is smaller than the diameter of the gemstone ball (105).

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