Data processing method and device, electronic equipment, storage medium and program product

Abstract

The invention relates to a data processing method and apparatus, an electronic device, a storage medium and a program product. The method comprises the steps of obtaining multiple groups of preset structure parameters and a preset pressure value between a to-be-assembled chip and a heat dissipation member; wherein the preset pressure value represents the maximum pressure borne by the chip and the heat dissipation piece, and the group of structural parameters represents the structural parameters of the elastic piece to be prepared; the elastic piece is used for being connected with the heat dissipation piece on the side, opposite to the heat dissipation piece, of the chip and providing elastic force for the heat dissipation piece. For each group of structural parameters, determining an elastic force value supported by the to-be-prepared elastic piece based on the structural parameters; the structure parameters with the supported elastic force values larger than or equal to the preset pressure value in the multiple sets of structure parameters serve as target structure parameters; wherein the target structure parameter is used for preparing a target elastic piece, so that the target elastic piece is installed on the side, back on to the heat dissipation piece, of the chip and is connected with the heat dissipation piece. Through the method, the time for determining the target elastic piece can be shortened, and the efficiency is high.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of data processing, and in particular, to a data processing method and device, electronic equipment, storage medium and program product. BACKGROUND

[0002] With the continuous improvement of the performance of electronic equipment, the chip heat dissipation problem is increasingly prominent. The pressure between the chip and the heat sink is a key factor affecting the heat dissipation effect. Too small pressure will lead to poor contact, thereby affecting the heat dissipation effect, and too large pressure will cause mechanical stress problems, thereby damaging the chip. Common pressure providing methods are spring screws or spring sheet backboards. Although the spring screw scheme is simple in design process, it needs to be avoided on the heat sink, which not only reduces the heat dissipation area, but also causes the heat sink to be unable to be reused due to different chip mounting requirements, thereby increasing the cost. Although the spring sheet backboard scheme does not need to be set on the heat sink, the current way of determining the structure parameters of the spring sheet backboard required by different chips and corresponding heat sinks is low in efficiency and high in cost. SUMMARY

[0003] To overcome the problems in the related art, the present disclosure provides a data processing method and device, electronic equipment, storage medium and program product.

[0004] According to a first aspect of an embodiment of the present disclosure, a method is provided, the method comprising:

[0005] obtaining a plurality of groups of preset structure parameters and a preset pressure value between a chip to be assembled and a heat dissipation piece; wherein the preset pressure value represents the maximum pressure mutually borne by the chip and the heat dissipation piece, and one group of structure parameters represents the structure parameters of one elastic piece to be prepared; the elastic piece is used to connect the heat dissipation piece on the side of the chip away from the heat dissipation piece and provide elastic force to the heat dissipation piece;

[0006] For each group of structure parameters, determining an elastic force value supported by the elastic piece to be prepared based on the structure parameters;

[0007] taking, as target structure parameters, the structure parameters in the plurality of groups of structure parameters whose supported elastic force value is greater than or equal to the preset pressure value; wherein the target structure parameters are used to prepare target elastic pieces, so as to install the target elastic pieces on the side of the chip away from the heat dissipation piece and connect the target elastic pieces with the heat dissipation piece.

[0008] In some embodiments, one elastic piece to be prepared includes a plurality of elastic sheets, and one group of structure parameters includes a first structure parameter of each elastic sheet and a second structure parameter of assembling the elastic sheets;

[0009] The determining of the elastic force value supported by the elastic piece to be prepared based on the structure parameters comprises:

[0010] For each elastic sheet, the elastic force value supported by the elastic sheet is determined based on the second structural parameter and the first structural parameter of the elastic sheet;

[0011] The elastic force value supported by the elastic element to be prepared is determined based at least on the elastic force value supported by each elastic sheet.

[0012] In some embodiments, the plurality of elastic sheets are symmetrically arranged, and each elastic sheet has the same structure;

[0013] The determination of the elastic force value supported by each elastic sheet, based on the second structural parameter and the first structural parameter of the elastic sheet, includes:

[0014] For any one of the plurality of elastic sheets, the elastic force value supported by any one elastic sheet is determined based on the second structural parameter and the first structural parameter of any one elastic sheet; wherein, each elastic sheet supports the same elastic force value;

[0015] Determining the elastic force value supported by the elastic element to be prepared, based at least on the elastic force value supported by each elastic sheet, includes:

[0016] The sum of the elastic force values ​​supported by each elastic sheet is determined as the elastic force value supported by the elastic element to be prepared.

[0017] In some embodiments, the plurality of elastic sheets are four elastic sheets, and there is a connecting portion between any two adjacent elastic sheets. Each connecting portion has the same structure, and the second structural parameter in a set of structural parameters includes the structural parameters of the connecting portion.

[0018] The step of determining the elastic force value supported by any elastic sheet among the plurality of elastic sheets, based on the second structural parameter and the first structural parameter of the elastic sheet, includes:

[0019] For any elastic sheet, a first bending stiffness of the elastic sheet is determined based on a first structural parameter of the elastic sheet, and a second bending stiffness of the connection between the elastic sheet and the adjacent elastic sheet is determined based on the structural parameters of the connection between the elastic sheet and the adjacent elastic sheet; wherein, the adjacent elastic sheet is an elastic sheet that is adjacent to the position of the elastic sheet.

[0020] Based on the first structural parameters of any elastic sheet, the structural parameters of the connection between any elastic sheet and the adjacent elastic sheet, the first bending stiffness, and the second bending stiffness, the elastic force value supported by any elastic sheet is determined.

[0021] In some embodiments, any elastic sheet is a wedge-shaped structure, and any elastic sheet includes a through hole, which is away from the connecting portion and is used to connect the elastic element to be prepared and the heat dissipation element; the first structural parameters of any elastic sheet include the thickness of any elastic sheet, a first material elastic modulus, a first length, and a second length; wherein, the first length is the length of the first portion of any elastic sheet connected to the connecting portion, and the second length is the length passing through the through hole of any elastic sheet and parallel to the first portion;

[0022] Determining the first bending stiffness of any elastic sheet based on its first structural parameters includes:

[0023] The first length of any elastic sheet is weighted based on a preset first weight, the second length of any elastic sheet is weighted based on a preset second weight, and the first cross-sectional moment of inertia of any elastic sheet is determined based on the weighted first length, the weighted second length, and the thickness of any elastic sheet.

[0024] The first bending stiffness is determined based on the moment of inertia of the first cross section and the elastic modulus of the first material.

[0025] In some embodiments, the structural parameters of the connecting portion include the width, thickness, and elastic modulus of the second material of the connecting portion;

[0026] The determination of the second bending stiffness of the connection between any elastic sheet and the adjacent elastic sheet based on the structural parameters of the connection between the elastic sheet and the adjacent elastic sheet includes:

[0027] Based on the width and thickness of the connection between any elastic sheet and the adjacent elastic sheet, determine the second cross-sectional moment of inertia of the connection between any elastic sheet and the adjacent elastic sheet;

[0028] The second bending stiffness is determined based on the moment of inertia of the second cross section and the elastic modulus of the second material.

[0029] In some embodiments, determining the elastic force value supported by any elastic sheet based on the first structural parameter of any elastic sheet, the structural parameter of the connection between the any elastic sheet and the adjacent elastic sheet, the first bending stiffness, and the second bending stiffness includes:

[0030] Based on the first structural parameters of any elastic sheet, the structural parameters of the connection between any elastic sheet and the adjacent elastic sheet, the first bending stiffness, and the second bending stiffness, the third bending stiffness of the target region of the elastic element to be prepared is determined; wherein, the target region includes any elastic sheet, the adjacent elastic sheet, and the connection between any elastic sheet and the adjacent elastic sheet;

[0031] Based on the first structural parameters of any elastic sheet, the structural parameters of the connection between any elastic sheet and the adjacent elastic sheet, and the third bending stiffness, the elastic force value supported by any elastic sheet is determined.

[0032] In some embodiments, any elastic sheet includes a through hole, the through hole being located away from the connecting portion, for connecting the elastic element to be manufactured and the heat dissipation element; the first structural parameter of any elastic sheet includes a third length, and the structural parameter of the connecting portion includes the length of the connecting portion; wherein, the third length is the distance between the center of the through hole on any elastic sheet and the center of the first portion where the any elastic sheet is connected to the connecting portion, and the length of the connecting portion is the distance between the center of the second portion where the adjacent elastic sheet is connected to the connecting portion and the center of the first portion;

[0033] The determination of the third bending stiffness of the target region of the elastic element to be prepared based on the first structural parameters of any elastic sheet, the structural parameters of the connection between any elastic sheet and the adjacent elastic sheet, the first bending stiffness, and the second bending stiffness includes:

[0034] The first bending stiffness is weighted based on the third length of any elastic sheet, the bending stiffness of the adjacent elastic sheets is weighted based on the third length of the adjacent elastic sheets, and the second bending stiffness is weighted based on the length of the connecting portion to obtain the third bending stiffness; wherein the third length of the adjacent elastic sheets is the same as the third length of any elastic sheet, and the bending stiffness of the adjacent elastic sheets is the same as the first bending stiffness.

[0035] In some embodiments, the first structural parameter of any elastic sheet includes the bending height of any elastic sheet; wherein, the bending height is the vertical distance between the through hole on any elastic sheet and the connecting portion;

[0036] The determination of the elastic force value supported by any elastic sheet based on the first structural parameter of any elastic sheet, the structural parameter of the connection between any elastic sheet and the adjacent elastic sheet, and the third bending stiffness includes:

[0037] The elastic force value supported by any elastic sheet is determined based on the bending height of any elastic sheet, the third length of any elastic sheet, the length of the connection between any elastic sheet and the adjacent elastic sheet, and the third bending stiffness.

[0038] In some embodiments, obtaining the preset pressure value between the chip to be assembled and the heat sink includes:

[0039] Obtain the contact area between the chip and the heat sink;

[0040] The preset pressure value is determined based on the contact area and the preset pressure.

[0041] According to a second aspect of the present disclosure, a data processing apparatus is provided, the apparatus comprising:

[0042] The acquisition module is configured to acquire multiple preset sets of structural parameters and a preset pressure value between the chip to be assembled and the heat sink; wherein, the preset pressure value represents the maximum pressure that the chip and the heat sink can withstand against each other, and a set of structural parameters represents the structural parameters of an elastic element to be prepared; the elastic element is used to connect to the heat sink on the side of the chip facing away from the heat sink and to provide elastic force to the heat sink;

[0043] The module is configured to determine the elastic force value supported by the elastic component to be prepared based on the structural parameters for each set of structural parameters.

[0044] The target structural parameter determination module is configured to select structural parameters among the multiple sets of structural parameters whose supported elastic force value is greater than or equal to the preset pressure value as target structural parameters; wherein, the target structural parameters are used to prepare target elastic elements, so that the target elastic elements are installed on the side of the chip facing away from the heat sink and connected to the heat sink.

[0045] In some embodiments, an elastic element to be prepared includes a plurality of elastic sheets, and a set of structural parameters includes a first structural parameter for each elastic sheet and a second structural parameter for assembling the elastic sheets; the determining module is further configured to, for each elastic sheet, determine the elastic force value supported by the elastic sheet based on the second structural parameter and the first structural parameter of the elastic sheet; and determine the elastic force value supported by the elastic element to be prepared based at least on the elastic force value supported by each elastic sheet.

[0046] In some embodiments, the plurality of elastic sheets are symmetrically arranged, and each elastic sheet has the same structure; the determining module is further configured to determine the elastic force value supported by any elastic sheet among the plurality of elastic sheets based on the second structural parameter and the first structural parameter of the elastic sheet; wherein, the elastic force value supported by each elastic sheet is the same; the sum of the elastic force values ​​supported by each elastic sheet is determined as the elastic force value supported by the elastic element to be prepared.

[0047] In some embodiments, the plurality of elastic sheets are four elastic sheets, and any two adjacent elastic sheets have a connecting portion. Each connecting portion has the same structure, and the second structural parameter in a set of structural parameters includes the structural parameters of the connecting portion. The determining module is further configured to, for any elastic sheet, determine a first bending stiffness of the any elastic sheet based on the first structural parameter of the any elastic sheet, and determine a second bending stiffness of the connecting portion between the any elastic sheet and the adjacent elastic sheet based on the structural parameters of the connecting portion between the any elastic sheet and the adjacent elastic sheet; wherein, the adjacent elastic sheet is an elastic sheet that is positionally adjacent to the any elastic sheet; and determine the elastic force value supported by the any elastic sheet based on the first structural parameter of the any elastic sheet, the structural parameters of the connecting portion between the any elastic sheet and the adjacent elastic sheet, the first bending stiffness, and the second bending stiffness.

[0048] In some embodiments, any elastic sheet is a wedge-shaped structure, and any elastic sheet includes a through hole, which is away from the connecting portion and is used to connect the elastic element to be prepared and the heat dissipation element; the first structural parameters of any elastic sheet include the thickness of any elastic sheet, a first material elastic modulus, a first length, and a second length; wherein, the first length is the length of the first portion of any elastic sheet connected to the connecting portion, and the second length is the length passing through the through hole of any elastic sheet and parallel to the first portion; the determining module is further configured to weight the first length of any elastic sheet based on a preset first weight, weight the second length of any elastic sheet based on a preset second weight, and determine the first cross-sectional moment of inertia of any elastic sheet based on the weighted first length, the weighted second length, and the thickness of any elastic sheet; and determine the first bending stiffness based on the first cross-sectional moment of inertia and the first material elastic modulus.

[0049] In some embodiments, the structural parameters of the connection portion include the width, thickness, and second material elastic modulus of the connection portion; the determining module is further configured to determine the second cross-sectional moment of inertia of the connection portion between any elastic sheet and the adjacent elastic sheet based on the width and thickness of the connection portion between any elastic sheet and the adjacent elastic sheet; and to determine the second bending stiffness based on the second cross-sectional moment of inertia and the second material elastic modulus.

[0050] In some embodiments, the determining module is further configured to determine a third bending stiffness of a target region of the elastic element to be manufactured based on a first structural parameter of any elastic sheet, a structural parameter of the connection between any elastic sheet and the adjacent elastic sheet, a first bending stiffness, and a second bending stiffness; wherein the target region includes any elastic sheet, the adjacent elastic sheet, and the connection between any elastic sheet and the adjacent elastic sheet; and to determine the elastic force value supported by any elastic sheet based on the first structural parameter of any elastic sheet, the structural parameter of the connection between any elastic sheet and the adjacent elastic sheet, and the third bending stiffness.

[0051] In some embodiments, any elastic sheet includes a through hole, the through hole being away from the connecting portion, for connecting the elastic element to be manufactured and the heat dissipation element; the first structural parameter of any elastic sheet includes a third length, and the structural parameter of the connecting portion includes the length of the connecting portion; wherein, the third length is the distance between the center of the through hole on any elastic sheet and the center of the first portion where the any elastic sheet is connected to the connecting portion, and the length of the connecting portion is the distance between the center of the second portion where the adjacent elastic sheet is connected to the connecting portion and the center of the first portion; the determining module is further configured to weight the first bending stiffness based on the third length of any elastic sheet, weight the bending stiffness of the adjacent elastic sheets based on the third length of the adjacent elastic sheets, and weight the second bending stiffness based on the length of the connecting portion to obtain the third bending stiffness; wherein, the third length of the adjacent elastic sheets is the same as the third length of any elastic sheet, and the bending stiffness of the adjacent elastic sheets is the same as the first bending stiffness.

[0052] In some embodiments, the first structural parameter of any elastic sheet includes the bending height of the any elastic sheet; wherein the bending height is the vertical distance between the through hole on the any elastic sheet and the connecting portion; the determining module is further configured to determine the elastic force value supported by the any elastic sheet based on the bending height of the any elastic sheet, the third length of the any elastic sheet, the length of the connecting portion between the any elastic sheet and the adjacent elastic sheet, and the third bending stiffness.

[0053] In some embodiments, the acquisition module is further configured to acquire the contact area between the chip and the heat sink; and determine the preset pressure value based on the contact area and the preset pressure.

[0054] According to a third aspect of the present disclosure, an electronic device is provided, comprising:

[0055] processor;

[0056] Memory used to store computer programs or instructions;

[0057] The processor executes the computer program or instructions to implement the steps of the data processing method described in the first aspect above.

[0058] According to a fourth aspect of the present disclosure, a non-transitory computer-readable storage medium is provided, the storage medium storing a computer program or instructions which, when executed by a processor, implement the steps of the data processing method described in the first aspect above.

[0059] According to a fifth aspect of the present disclosure, a computer program product is provided, including a computer program or instructions, which, when executed by a processor, implement the steps of the data processing method described in the first aspect above.

[0060] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0061] In this embodiment, the electronic device acquires multiple preset sets of structural parameters and a preset pressure value between the chip to be assembled and the heat sink, and determines the elastic force value supported by the elastic component to be prepared corresponding to each set of structural data. The structural parameters whose supported elastic force value is greater than or equal to the preset pressure value are selected as target structural parameters for preparing the target elastic component and installing it. Compared to related technologies, which require designing multiple elastic components corresponding to multiple structural parameters and performing simulations to determine the elastic force value supported by each elastic component, and then determining the target elastic component from the designed elastic components based on the simulation results, this embodiment eliminates the need to design an elastic component corresponding to each structural parameter and perform simulations to determine the supported elastic force value. Instead, it directly determines the supported elastic force value of the elastic component to be prepared based on the structural parameters, saving design and simulation time and improving the efficiency of determining the target elastic component. Furthermore, it reduces the software costs required for simulation.

[0062] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0063] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0064] Figure 1 This is a schematic diagram of a spring providing elastic force in a related technology.

[0065] Figure 2 A schematic diagram illustrating the elasticity provided by a pre-deformed spring-loaded backplate in related technologies.

[0066] Figure 3 This is a flowchart illustrating a data processing method according to an exemplary embodiment.

[0067] Figure 4 This is a schematic diagram illustrating the structure between an elastic element, a chip, and a heat sink according to an exemplary embodiment.

[0068] Figure 5 This is a schematic diagram of the structure of an elastic element to be manufactured according to an exemplary embodiment.

[0069] Figure 6 This is a schematic diagram of the structure of an elastic sheet according to an exemplary embodiment.

[0070] Figure 7 This is a schematic diagram of a connection part according to an exemplary embodiment.

[0071] Figure 8 This is a schematic diagram of the structure of a target region of an elastic member according to an exemplary embodiment.

[0072] Figure 9 This is a schematic diagram illustrating the bending height of an elastic sheet according to an exemplary embodiment.

[0073] Figure 10 This is a block diagram of a data processing apparatus according to an exemplary embodiment.

[0074] Figure 11 This is a structural block diagram of an electronic device according to an exemplary embodiment. Detailed Implementation

[0075] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0076] As the performance of electronic devices continues to improve, effective contact between the chip and the heat sink has become a key factor in ensuring stable operation. To guarantee good heat dissipation, the pressure at the chip-heat sink contact surface needs to be precisely controlled within a reasonable range, which is typically achieved using the elastic force provided by a spring or sheet. Figure 1This is a schematic diagram illustrating the use of a spring to provide elastic force in related technologies. L11 is a heat sink, L12 is a spring, L13 is a chip, and L14 is a printed circuit board (PCB). Figure 1 As can be seen, the spring needs to pass through the heat sink and be fixed on the PCB board. This method requires a clearance space on the heat sink for the spring to pass through. This design not only occupies part of the heat sink area, thus reducing the effective area that can be used for heat dissipation, but also makes it impossible to reuse the heat sink between different devices due to the different installation requirements and size differences of different chips, which greatly increases production and manufacturing costs.

[0077] Figure 2 This is a schematic diagram illustrating the use of a pre-deformed spring-loaded backplate to provide elasticity in related technologies. L21 is the spring-loaded backplate, L22 is the PCB board, and L23 is one of the pre-deformed springs on the spring-loaded backplate L21. Figure 2 It is known that spring-loaded backplates do not require clearance on the heatsink, which can increase the effective contact area between the heatsink and the chip. Currently, the main way to determine the structural parameters of the spring-loaded backplate required for the chip and heatsink is to design multiple spring-loaded backplates with different structural parameters manually or using parametric modeling functions, and then use preset simulation software to simulate each spring-loaded backplate to determine the elastic force that each spring-loaded backplate can provide. However, this method has two drawbacks. First, it requires designing a large number of spring-loaded backplates with different structural parameters and simulating each one. This results in a large number of simulations, which takes a lot of time and is inefficient. Second, it relies on simulation software, which is costly.

[0078] In response, this disclosure provides a data processing method. Figure 3 This is a flowchart illustrating a data processing method according to an exemplary embodiment. For example... Figure 3 As shown, the method mainly includes the following steps:

[0079] S31. Obtain multiple preset sets of structural parameters and a preset pressure value between the chip to be assembled and the heat sink; wherein, the preset pressure value represents the maximum pressure that the chip and the heat sink can withstand against each other, and a set of structural parameters represents the structural parameters of an elastic element to be prepared; the elastic element is used to connect to the heat sink on the side of the chip facing away from the heat sink and to provide elastic force to the heat sink.

[0080] S32. For each set of structural parameters, determine the elastic force value supported by the elastic component to be prepared based on the structural parameters;

[0081] S33. Among the multiple sets of structural parameters, the structural parameter whose supported elastic force value is greater than or equal to the preset pressure value is taken as the target structural parameter; wherein, the target structural parameter is used to prepare the target elastic element, so as to install the target elastic element on the side of the chip facing away from the heat sink and connect it to the heat sink.

[0082] The data processing method provided in this disclosure can be executed by terminal devices such as user equipment (UE), mobile devices, user terminals, mobile phones, tablets, personal digital assistants (PDAs), handheld devices, computing devices, vehicle-mounted devices, and wearable devices; it can also be executed by cloud devices such as cloud servers. This disclosure does not limit the execution subject; for ease of description, this disclosure uses electronic devices as the execution subject for illustration.

[0083] In step S31, the electronic device acquires multiple preset sets of structural parameters. Each set of structural parameters represents the structural parameters of an elastic component to be prepared. The structural parameters of an elastic component to be prepared may include the material property parameters and geometric dimension parameters of the elastic component to be prepared, such as the length, width, thickness, cross-sectional shape, and longitudinal cross-sectional shape of the elastic component to be prepared. If the elastic component to be prepared has a through hole, the structural parameters also include the position and size of the through hole. It should be noted that each set of structural parameters corresponds to an elastic component to be prepared.

[0084] In this embodiment, the electronic device further acquires a preset pressure value between the chip to be assembled and the heat sink. The preset pressure value represents the maximum pressure that the chip and the heat sink can withstand. The heat sink is a component used for heat dissipation, such as an air-cooled heat sink, a water-cooled heat sink, or a heat pipe heat sink. In some embodiments, the electronic device can acquire the preset pressure value between the chip and the heat sink based on a preset database. The preset database stores pressure values ​​corresponding to different models of chips and heat sinks, and the electronic device can acquire the corresponding preset pressure value from the preset database based on the current model of the chip and heat sink. In other embodiments, the electronic device can receive a preset pressure value input by a user, which can be input via voice, gesture, or interface input. In still other embodiments, the electronic device can also acquire the preset pressure value between the chip and the heat sink based on a preset model.

[0085] In other embodiments, the electronic device may also acquire structural parameters of the chip and the heat sink, as well as structural parameters between the chip and the heat sink, and determine a preset pressure value between the chip and the heat sink using a preset algorithm; for example, in some embodiments, acquiring the preset pressure value between the chip to be assembled and the heat sink includes:

[0086] Obtain the contact area between the chip and the heat sink;

[0087] The preset pressure value is determined based on the contact area and the preset pressure.

[0088] In this embodiment of the disclosure, the electronic device obtains the contact area between the chip and the heat sink, and determines the preset pressure value between the chip and the heat sink based on the contact area and the preset pressure. For example, the electronic device can use the product of the contact area and the preset pressure as the preset pressure value between the chip and the heat sink. For instance, when the contact area between the chip and the heat sink is 2500 square millimeters and the preset pressure is 10 pounds per square inch (psi), the preset pressure value F between the chip and the heat sink is F = 10 * 6894.76 Pa * 2500 * 10 -6 m 2 =172N.

[0089] The method for calculating the preset pressure value between the chip and the heat sink in this embodiment is relatively simple, fast, and efficient.

[0090] In this embodiment, the elastic element is used to connect to the heat sink on the side of the chip facing away from the heat sink and to provide elastic force to the heat sink. For example, the chip can be mounted on a PCB board, the heat sink is mounted on the side of the chip facing away from the PCB board and is in contact with the chip, the elastic element is mounted on the side of the chip facing away from the heat sink and is connected to the heat sink, and provides elastic force to the heat sink. The elastic element can be connected to the heat sink through a fixing element. For example, the elastic element can be provided with a through hole, and the heat sink can be provided with fixing elements such as screws and bolts. The fixing element on the heat sink can pass through the PCB board and the through hole on the elastic element and be connected to the elastic element. Figure 4 This is a schematic diagram illustrating the structure between an elastic element, a chip, and a heat sink according to an exemplary embodiment, wherein L41 is a heat sink, L42 is a chip, L43 is an elastic element, and L44 is a PCB board. Figure 4 It is known that chip L42 is in contact with PCB board L44. If chip L42 can be soldered or bonded to PCB board L44, heat sink L41 is located on the side of chip L42 facing away from PCB board L44. Elastic component L43 is in contact with PCB board L44 on the side of PCB board L44 facing away from chip L42. If elastic component L43 can be soldered or bonded to PCB board L44, and elastic component L43 is connected to heat sink L41, it can be understood that because elastic component L43 and heat sink L41 are connected, elastic component L43 and heat sink L41 are relatively fixed, and because elastic component L43 can produce elastic deformation, the elastic force of elastic component L43 can force elastic component L43 and heat sink L41 to apply pressure to PCB board L44 and chip L42 sandwiched between them.

[0091] In step S32, the electronic device determines the elastic force value supported by the elastic element to be prepared based on the structural parameters for each set of structural parameters. In some embodiments, the electronic device can use a preset algorithm to determine the elastic force value supported by the elastic element to be prepared based on the structural parameters for each set of structural parameters. In other embodiments, the electronic device can use a preset model to determine the elastic force value supported by the elastic element to be prepared based on the structural parameters for each set of structural parameters. In still other embodiments, the electronic device can first determine the structural characteristics of the elastic element to be prepared for each set of structural parameters, and then determine the elastic force value supported by the elastic element to be prepared based on the structural parameters and structural characteristics. For example, when the elastic element to be prepared includes multiple elastic sheets, the electronic device can first use a preset algorithm or preset formula to determine the elastic force value supported by each elastic sheet, and then determine the elastic force value supported by the elastic element to be prepared based on the elastic force value supported by each elastic sheet.

[0092] In step S33, the electronic device selects the structural parameters from the multiple sets of structural parameters whose supported elastic force value is greater than or equal to a preset pressure value as target structural parameters. It should be noted that the electronic device determines the elastic force value supported by the elastic element to be prepared corresponding to each set of structural parameters, and selects the structural parameters from the multiple sets of structural parameters whose supported elastic force value is greater than or equal to the preset pressure value, and whose difference between the supported elastic force value and the preset pressure value is within a preset range as target structural parameters. The preset range can be a set value, such as setting the preset range to 50% of the preset pressure value. For example, when the preset pressure value is 150N, the electronic device can select the structural parameters from the multiple sets of structural parameters whose supported elastic force value is between 150N and 225N as target structural parameters.

[0093] In this embodiment of the disclosure, it is understood that the target structural parameters are used to prepare the target elastic element so that the target elastic element is installed on the side of the chip facing away from the heat sink and connected to the heat sink. For example, after the electronic device determines the target structural parameters, it can output the target structural parameters through voice, display screen, etc., so that the user can prepare the target elastic element according to the target structural parameters and install it.

[0094] In this embodiment, the electronic device acquires multiple preset sets of structural parameters and a preset pressure value between the chip to be assembled and the heat sink, and determines the elastic force value supported by the elastic component to be prepared corresponding to each set of structural data. The structural parameters whose supported elastic force value is greater than or equal to the preset pressure value are selected as target structural parameters for preparing the target elastic component and installing it. Compared to related technologies, which require designing multiple elastic components corresponding to multiple structural parameters and performing simulations to determine the elastic force value supported by each elastic component, and then determining the target elastic component from the designed elastic components based on the simulation results, this embodiment eliminates the need to design an elastic component corresponding to each structural parameter and perform simulations to determine the supported elastic force value. Instead, it directly determines the supported elastic force value of the elastic component to be prepared based on the structural parameters, saving design and simulation time and improving the efficiency of determining the target elastic component. Furthermore, it reduces the software costs required for simulation.

[0095] In some embodiments, an elastic element to be prepared includes a plurality of elastic sheets, and a set of structural parameters includes a first structural parameter for each elastic sheet and a second structural parameter for assembling the elastic sheets.

[0096] The determination of the elastic force value supported by the elastic element to be prepared based on structural parameters includes:

[0097] For each elastic sheet, the elastic force value supported by the elastic sheet is determined based on the second structural parameter and the first structural parameter of the elastic sheet;

[0098] The elastic force value supported by the elastic element to be prepared is determined based at least on the elastic force value supported by each elastic sheet.

[0099] In this embodiment of the disclosure, an elastic element to be prepared includes multiple elastic sheets, and a set of structural parameters includes a first structural parameter for each elastic sheet and a second structural parameter for assembling each elastic sheet. It should be noted that the structure of each elastic sheet may be the same or different, and this embodiment of the disclosure does not limit this.

[0100] In this embodiment of the present disclosure, the electronic device determines the elastic force value supported by each elastic sheet based on the second structural parameter and the first structural parameter of the elastic sheet. In some embodiments, the electronic device can use a preset algorithm to determine the elastic force value supported by each elastic sheet based on the second structural parameter and the first structural parameter of the elastic sheet. In other embodiments, the electronic device can use a preset model to determine the elastic force value supported by each elastic sheet based on the second structural parameter and the first structural parameter of the elastic sheet.

[0101] In this embodiment of the present disclosure, the electronic device determines the elastic force value supported by the elastic element to be prepared based at least on the elastic force value supported by each elastic sheet. In some embodiments, when the structures of each elastic sheet are identical and the elastic sheets are symmetrically arranged, the sum of the elastic force values ​​supported by each elastic sheet can be used as the elastic force value supported by the elastic element to be prepared. In other embodiments, when the structures of each elastic sheet are different and / or the elastic sheets are not symmetrically arranged, the elastic force values ​​supported by each elastic sheet can be weighted based on the structural parameters and / or second structural parameters of each elastic sheet, and the sum of the weighted elastic force values ​​supported by each elastic sheet can be used as the elastic force value supported by the elastic element to be prepared.

[0102] In this embodiment of the disclosure, when an elastic element to be prepared includes multiple elastic sheets, the method of calculating the elastic force value supported by each elastic sheet and determining the elastic force value supported by the elastic element to be prepared based at least on the elastic force value supported by each elastic sheet can fully take into account the structural parameters of each elastic sheet and its specific position in the elastic element, thereby improving the accuracy of determining the elastic force value supported by the elastic element to be prepared.

[0103] In some embodiments, the plurality of elastic sheets are symmetrically arranged, and each elastic sheet has the same structure;

[0104] The determination of the elastic force value supported by each elastic sheet, based on the second structural parameter and the first structural parameter of the elastic sheet, includes:

[0105] For any one of the plurality of elastic sheets, the elastic force value supported by any one elastic sheet is determined based on the second structural parameter and the first structural parameter of any one elastic sheet; wherein, each elastic sheet supports the same elastic force value;

[0106] Determining the elastic force value supported by the elastic element to be prepared, based at least on the elastic force value supported by each elastic sheet, includes:

[0107] The sum of the elastic force values ​​supported by each elastic sheet is determined as the elastic force value supported by the elastic element to be prepared.

[0108] In this embodiment, multiple elastic sheets are symmetrically arranged, each with the same structure, indicating that each elastic sheet supports the same elastic force value, and each elastic sheet contributes equally to the elastic force value supported by the elastic element to be prepared. It should be noted that since each elastic sheet has the same structure, only the second structural parameter and the first structural parameter of any elastic sheet need to be obtained.

[0109] In this embodiment of the present disclosure, the electronic device determines the elastic force value supported by any elastic sheet among a plurality of elastic sheets based on a second structural parameter and a first structural parameter of any elastic sheet. In some embodiments, the electronic device can use a preset algorithm to determine the elastic force value supported by any elastic sheet based on the second structural parameter and the first structural parameter of any elastic sheet. In other embodiments, the electronic device can use a preset model to determine the elastic force value supported by any elastic sheet based on the second structural parameter and the first structural parameter of any elastic sheet.

[0110] In this embodiment of the present disclosure, the electronic device determines the sum of the elastic force values ​​supported by each elastic sheet as the elastic force value supported by the elastic element to be prepared. As mentioned above, each elastic sheet supports the same elastic force value, and each elastic sheet contributes the same amount to the elastic force value supported by the elastic element to be prepared. Therefore, the sum of the elastic force values ​​supported by each elastic sheet can be determined as the elastic force value supported by the elastic element to be prepared.

[0111] In this embodiment of the invention, due to the structure of the elastic element, it is not necessary to calculate the elastic force value supported by each elastic sheet. Instead, it is only necessary to calculate the elastic force value supported by any one of the elastic sheets to determine the elastic force value supported by the elastic element to be prepared. The solution is simple, effective, and highly efficient.

[0112] In some embodiments, the plurality of elastic sheets are four elastic sheets, and there is a connecting portion between any two adjacent elastic sheets. Each connecting portion has the same structure, and the second structural parameter in a set of structural parameters includes the structural parameters of the connecting portion.

[0113] The step of determining the elastic force value supported by any elastic sheet among the plurality of elastic sheets, based on the second structural parameter and the first structural parameter of the elastic sheet, includes:

[0114] For any elastic sheet, a first bending stiffness of the elastic sheet is determined based on a first structural parameter of the elastic sheet, and a second bending stiffness of the connection between the elastic sheet and the adjacent elastic sheet is determined based on the structural parameters of the connection between the elastic sheet and the adjacent elastic sheet; wherein, the adjacent elastic sheet is an elastic sheet that is adjacent to the position of the elastic sheet.

[0115] Based on the first structural parameters of any elastic sheet, the structural parameters of the connection between any elastic sheet and the adjacent elastic sheet, the first bending stiffness, and the second bending stiffness, the elastic force value supported by any elastic sheet is determined.

[0116] In this embodiment, the multiple elastic sheets are four elastic sheets, and any two adjacent elastic sheets are connected by a connecting portion, with each connecting portion having the same structure. Figure 5This is a schematic diagram of the structure of an elastic element to be manufactured according to an exemplary embodiment, wherein L51 is an elastic element to be manufactured, L511, L512, L513, and L514 are elastic sheets of the elastic element L51, and L515 is the connecting portion between elastic sheet L512 and elastic sheet L513. Figure 5 It can be seen that elastic sheet L511, elastic sheet L512, elastic sheet L513, and elastic sheet L514 have the same structure, and the connection between any two elastic sheets has the same structure.

[0117] In this embodiment of the disclosure, the electronic device determines the first bending stiffness of any elastic sheet based on the first structural parameters of the elastic sheet. In some embodiments, the electronic device can determine the first bending stiffness of any elastic sheet using a preset first bending stiffness calculation model based on the first structural parameters of any elastic sheet; in other embodiments, the electronic device can determine the first bending stiffness of any elastic sheet using a preset first bending stiffness calculation formula based on the first structural parameters of any elastic sheet, such as by first calculating the first section moment of inertia of any elastic sheet, and then determining the first bending stiffness of any elastic sheet based on the first section moment of inertia and the first structural parameters. In this case, the electronic device can first determine the shape of any elastic sheet based on its structural parameters, and then determine the first section moment of inertia corresponding to any elastic sheet according to the corresponding section moment of inertia calculation formula.

[0118] In this embodiment of the disclosure, the electronic device further determines a second bending stiffness of the connection between any elastic sheet and an adjacent elastic sheet based on the structural parameters of the connection between any elastic sheet and an adjacent elastic sheet; wherein, the adjacent elastic sheet is an elastic sheet that is positionally adjacent to any elastic sheet, for example, such as Figure 5 As shown, when elastic sheet L512 is any elastic sheet, elastic sheet L513 can be an adjacent elastic sheet, and L515 is the connection between any elastic sheet L512 and the adjacent elastic sheet L513. In some embodiments, the electronic device can determine the second bending stiffness of the connection between any elastic sheet and the adjacent elastic sheet using a preset second bending stiffness calculation model based on the structural parameters of the connection between any elastic sheet and the adjacent elastic sheet; in other embodiments, the electronic device can determine the second bending stiffness using a preset second bending stiffness calculation formula based on the structural parameters of the connection between any elastic sheet and the adjacent elastic sheet, such as first calculating the second section moment of inertia of the connection between any elastic sheet and the adjacent elastic sheet, and determining the second bending stiffness based on the second section moment of inertia and the second structural parameters. The electronic device can first determine the shape of the connection between any elastic sheet and the adjacent elastic sheet based on the structural parameters of the connection between any elastic sheet and the adjacent elastic sheet, and determine the second section moment of inertia corresponding to the connection between any elastic sheet and the adjacent elastic sheet according to the corresponding section moment of inertia calculation formula.

[0119] In this embodiment, the electronic device determines the elastic force value supported by any elastic sheet based on a first structural parameter of any elastic sheet, the structural parameter of the connection between any elastic sheet and adjacent elastic sheets, a first bending stiffness, and a second bending stiffness. In some embodiments, the electronic device can determine the elastic force value supported by any elastic sheet using a preset calculation formula based on the first structural parameter of any elastic sheet, the structural parameter of the connection between any elastic sheet and adjacent elastic sheets, the first bending stiffness, and the second bending stiffness. In other embodiments, the electronic device can also determine the elastic force value supported by any elastic sheet using a preset model based on the first structural parameter of any elastic sheet, the structural parameter of the connection between any elastic sheet and adjacent elastic sheets, the first bending stiffness, and the second bending stiffness. The calculation method of this embodiment is simpler, more effective, and more intelligent.

[0120] In some embodiments, any elastic sheet is a wedge-shaped structure, and any elastic sheet includes a through hole, which is away from the connecting portion and is used to connect the elastic element to be prepared and the heat dissipation element; the first structural parameters of any elastic sheet include the thickness of any elastic sheet, a first material elastic modulus, a first length, and a second length; wherein, the first length is the length of the first portion of any elastic sheet connected to the connecting portion, and the second length is the length passing through the through hole of any elastic sheet and parallel to the first portion;

[0121] Determining the first bending stiffness of any elastic sheet based on its first structural parameters includes:

[0122] The first length of any elastic sheet is weighted based on a preset first weight, the second length of any elastic sheet is weighted based on a preset second weight, and the first cross-sectional moment of inertia of any elastic sheet is determined based on the weighted first length, the weighted second length, and the thickness of any elastic sheet.

[0123] The first bending stiffness is determined based on the moment of inertia of the first cross section and the elastic modulus of the first material.

[0124] In this embodiment, any elastic sheet is a wedge-shaped structure. It should be noted that the wedge shape only has a trapezoidal longitudinal section and a rectangular cross section. Figure 6 This is a schematic diagram of the structure of an elastic sheet according to an exemplary embodiment. L61 is an elastic sheet, L611 is a through hole on the elastic sheet L61, CD is the first part of the elastic sheet L61 connected to the connecting part, the first length of the elastic sheet L61 is the length of CD, and the second length is the length of AB, wherein AB is parallel to CD.

[0125] In this embodiment of the present disclosure, the heat sink may be provided with four symmetrical connectors, each connector corresponding to a through hole on an elastic sheet. The connectors are used to pass through the through holes to connect the heat sink and the elastic sheet. After all four elastic sheets are connected to their corresponding connectors, the connection between the heat sink and the elastic sheet is completed.

[0126] In this embodiment, the electronic device weights the first length of any elastic sheet based on a preset first weight, and weights the second length of any elastic sheet based on a preset second weight. Based on the weighted first length, the weighted second length, and the thickness of any elastic sheet, the first cross-sectional moment of inertia of any elastic sheet is determined. The first and second weights are preset values, which can be measured experimentally or specified by the user. The thickness of any elastic sheet is the same at every location. It is understood that... Figure 6 For example, since the elastic sheet is a wedge-shaped structure, when calculating the moment of inertia of the first section of the elastic sheet, the contribution of ends AB and CD to the interface moment of inertia needs to be considered. The calculation formula is shown in formula (1):

[0127]

[0128] Where I1 is the moment of inertia of the first section, k1 is the first weight, and b1 is the first length, as shown below. Figure 6 The length of edge CD in the middle, k2 is the second weight, b2 is the second length, as shown below. Figure 6 The length of side AB is given, and h is the thickness of the elastic sheet.

[0129] In this embodiment of the disclosure, the electronic device determines the first bending stiffness based on the first cross-sectional moment of inertia and the first material elastic modulus. For example, the product of the first cross-sectional moment of inertia and the first material elastic modulus can be used as the first bending stiffness.

[0130] In this embodiment, considering that the elastic sheet is a wedge-shaped structure, the determination of the moment of inertia of the first cross section can be improved by weighting, thereby improving the accuracy of the first bending stiffness.

[0131] In some embodiments, the structural parameters of the connecting portion include the width, thickness, and elastic modulus of the second material of the connecting portion;

[0132] The determination of the second bending stiffness of the connection between any elastic sheet and the adjacent elastic sheet based on the structural parameters of the connection between the elastic sheet and the adjacent elastic sheet includes:

[0133] Based on the width and thickness of the connection between any elastic sheet and the adjacent elastic sheet, determine the second cross-sectional moment of inertia of the connection between any elastic sheet and the adjacent elastic sheet;

[0134] The second bending stiffness is determined based on the moment of inertia of the second cross section and the elastic modulus of the second material.

[0135] In this embodiment of the disclosure, the electronic device determines the second cross-sectional moment of inertia of the connection between any elastic sheet and adjacent elastic sheets based on the width and thickness of the connection between any elastic sheet and adjacent elastic sheets. Figure 7 This is a schematic diagram of a connecting portion according to an exemplary embodiment. L71 is an elastic element, L711 is any elastic sheet, L712 is an elastic sheet adjacent to elastic sheet L711, the portion between elastic sheet L711 and elastic sheet L712 is the connecting portion, and EF is the width of the connecting portion. It should be noted that the thickness of the connecting portion is the same at every position. Figure 7 It can be seen that the cross-section of the connecting part is rectangular, and the method for determining the moment of inertia of the second cross-section of the electronic device is as shown in formula (2):

[0136]

[0137] Where I2 is the moment of inertia of the second section, and b3 is the width of the connection, as shown below. Figure 7 The length of side EF is given, and h is the thickness of the connecting part.

[0138] In this embodiment of the disclosure, the electronic device determines the second bending stiffness based on the second cross-sectional moment of inertia and the second material elastic modulus. The electronic device determines the second bending stiffness in the manner shown in formula (3):

[0139] A = 2 * E² * I² (3)

[0140] Where A is the second bending stiffness, E2 is the second material elastic modulus, and I2 is the second moment of inertia of the cross section.

[0141] In this embodiment of the disclosure, when calculating the second bending stiffness, the electronic device takes into account that the structures of each connection part are the same, so that the influence of adjacent connection parts can be directly superimposed on the current connection part, so that only the moment of inertia of the section of one connection part needs to be calculated, and the solution is simple and effective.

[0142] In some embodiments, determining the elastic force value supported by any elastic sheet based on the first structural parameter of any elastic sheet, the structural parameter of the connection between the any elastic sheet and the adjacent elastic sheet, the first bending stiffness, and the second bending stiffness includes:

[0143] Based on the first structural parameters of any elastic sheet, the structural parameters of the connection between any elastic sheet and the adjacent elastic sheet, the first bending stiffness, and the second bending stiffness, the third bending stiffness of the target region of the elastic element to be prepared is determined; wherein, the target region includes any elastic sheet, the adjacent elastic sheet, and the connection between any elastic sheet and the adjacent elastic sheet;

[0144] Based on the first structural parameters of any elastic sheet, the structural parameters of the connection between any elastic sheet and the adjacent elastic sheet, and the third bending stiffness, the elastic force value supported by any elastic sheet is determined.

[0145] In this embodiment of the present disclosure, the electronic device determines the third bending stiffness of a target region of the elastic element to be manufactured based on the first structural parameters of any elastic sheet, the structural parameters of the connection between any elastic sheet and adjacent elastic sheets, the first bending stiffness, and the second bending stiffness; wherein, the target region includes any elastic sheet, adjacent elastic sheets, and the connection between any elastic sheet and adjacent elastic sheets. In some embodiments, the electronic device may determine the third bending stiffness based on the first bending stiffness, the second bending stiffness, and the sum of the bending stiffness values ​​of adjacent elastic sheets.

[0146] In other embodiments, any elastic sheet includes a through hole located away from the connecting portion for connecting the elastic element to be manufactured and the heat dissipation element; the first structural parameter of any elastic sheet includes a third length, and the structural parameter of the connecting portion includes the length of the connecting portion; wherein, the third length is the distance between the center of the through hole on any elastic sheet and the center of the first portion where the elastic sheet is connected to the connecting portion, and the length of the connecting portion is the distance between the center of the second portion where the adjacent elastic sheet is connected to the connecting portion and the center of the first portion;

[0147] The determination of the third bending stiffness of the target region of the elastic element to be prepared based on the first structural parameters of any elastic sheet, the structural parameters of the connection between any elastic sheet and the adjacent elastic sheet, the first bending stiffness, and the second bending stiffness includes:

[0148] The first bending stiffness is weighted based on the third length of any elastic sheet, the bending stiffness of the adjacent elastic sheets is weighted based on the third length of the adjacent elastic sheets, and the second bending stiffness is weighted based on the length of the connecting portion to obtain the third bending stiffness; wherein the third length of the adjacent elastic sheets is the same as the third length of any elastic sheet, and the bending stiffness of the adjacent elastic sheets is the same as the first bending stiffness.

[0149] Figure 8This is a schematic diagram of the structure of a target region of an elastic element according to an exemplary embodiment. L81 is the target region of the elastic element, L811 is any elastic sheet, and L812 is an adjacent elastic sheet. The structure of the elastic sheet L811 is similar to... Figure 6 The structure of the intermediate elastic sheet L611 is the same, H1H2 is the length of the connecting part, and G1H1 is the third length.

[0150] In this embodiment of the disclosure, it should be noted that the structural parameters obtained by the electronic device may directly include the length of the connecting part. The electronic device can also calculate the length of the connecting part using parameters from the structural parameters. For example, the structural parameters may include the distance between the center of the through-hole of any elastic sheet and the center of the through-hole of an adjacent elastic sheet. Figure 8 The distance between G1 and G2 is used to calculate the length of the connecting portion based on the distance between the center of the through hole of any elastic sheet and the center of the through hole of the adjacent elastic sheet and the third length. This disclosure does not limit the scope of the embodiments.

[0151] In this embodiment of the present disclosure, the electronic device weights the first bending stiffness based on the third length of any elastic sheet, weights the bending stiffness of adjacent elastic sheets based on the third length of adjacent elastic sheets, and weights the second bending stiffness based on the length of the connecting portion to obtain the third bending stiffness; wherein, the third length of adjacent elastic sheets is the same as the third length of any elastic sheet, and the bending stiffness of adjacent elastic sheets is the same as the first bending stiffness. The electronic device determines the second bending stiffness in the manner shown in formula (4):

[0152]

[0153] Where B is the third bending stiffness, L1 is the third length, E1I1 is the first bending stiffness, since the third length of the adjacent elastic sheet is the same as the third length of any elastic sheet, the bending stiffness of the adjacent elastic sheet is the same as the first bending stiffness, therefore multiplied by 2, L3 is the length of the connecting part, and E2I2 is the second bending stiffness.

[0154] In this embodiment, the target region is the structure after symmetrically dividing the elastic element. By focusing on the bending stiffness of the target region without needing to focus on the bending stiffness of the entire elastic element, and by using a weighted method, the accuracy of the determined third bending stiffness can be improved, resulting in a high degree of intelligence.

[0155] In this embodiment of the disclosure, the electronic device determines the elastic force value supported by any elastic sheet based on the first structural parameters of any elastic sheet, the structural parameters of the connection between any elastic sheet and adjacent elastic sheets, and the third bending stiffness. In some embodiments, the electronic device can determine the elastic force value supported by any elastic sheet using a preset model based on the first structural parameters of any elastic sheet, the structural parameters of the connection between any elastic sheet and adjacent elastic sheets, and the third bending stiffness.

[0156] In other embodiments, the electronic device determines the elastic force value supported by any elastic sheet using a preset calculation formula based on a first structural parameter of any elastic sheet, the structural parameter of the connection between any elastic sheet and adjacent elastic sheets, and a third bending stiffness. For example, the first structural parameter of any elastic sheet includes the bending height of the elastic sheet; wherein the bending height is the perpendicular distance between the through hole on the elastic sheet and the connection.

[0157] The determination of the elastic force value supported by any elastic sheet based on the first structural parameter of any elastic sheet, the structural parameter of the connection between any elastic sheet and the adjacent elastic sheet, and the third bending stiffness includes:

[0158] The elastic force value supported by any elastic sheet is determined based on the bending height of any elastic sheet, the third length of any elastic sheet, the length of the connection between any elastic sheet and the adjacent elastic sheet, and the third bending stiffness.

[0159] Figure 9 This is a schematic diagram illustrating the bending height of an elastic sheet according to an exemplary embodiment, wherein L91 is any elastic sheet, G is the center of the through hole of the elastic sheet L91, and GI is the bending height of the elastic sheet L91. It should be noted that the structural parameters acquired by the electronic device may directly include the bending height of the elastic sheet, or the electronic device may calculate the bending height of the elastic sheet using parameters from the structural parameters. As mentioned above, the structural parameters include the third length of the elastic sheet, and may also include the bending angle of the elastic sheet relative to the connecting portion, such as... Figure 9 The angle between the elastic sheet L91 and the dotted line is such that the electronic device can calculate the bending height of the elastic sheet based on the bending angle of the elastic sheet relative to the connecting part and the third length. This disclosure does not limit this aspect.

[0160] In this embodiment of the present disclosure, the electronic device determines the elastic force value supported by any elastic sheet based on the bending height of any elastic sheet, the third length of any elastic sheet, the length of the connection between any elastic sheet and the adjacent elastic sheet, and the third bending stiffness. In some embodiments, the electronic device may determine the elastic force value supported by any elastic sheet using a preset model based on the bending height of any elastic sheet, the third length of any elastic sheet, the length of the connection between any elastic sheet and the adjacent elastic sheet, and the third bending stiffness; in other embodiments, the electronic device may determine the elastic force value supported by any elastic sheet using a preset calculation formula based on the bending height of any elastic sheet, the third length of any elastic sheet, the length of the connection between any elastic sheet and the adjacent elastic sheet, and the third bending stiffness, such as the electronic device determining the elastic force value supported by the elastic sheet based on formula (5).

[0161]

[0162] Where H is the bending height of the elastic sheet, P is the elastic force supported by the elastic sheet, B is the third bending stiffness calculated above, L1 is the third length, and L3 is the length of the connection part.

[0163] The embodiments disclosed herein provide a simple, effective, and highly intelligent method for determining the elastic force value supported by the elastic sheet.

[0164] Figure 10 This is a block diagram of a data processing apparatus 1000 according to an exemplary embodiment. (See diagram below.) Figure 10 As shown, the device mainly includes:

[0165] The acquisition module 1001 is configured to acquire multiple preset sets of structural parameters and a preset pressure value between the chip to be assembled and the heat sink; wherein, the preset pressure value represents the maximum pressure that the chip and the heat sink can withstand against each other, and a set of structural parameters represents the structural parameters of an elastic element to be prepared; the elastic element is used to connect to the heat sink on the side of the chip facing away from the heat sink and to provide elastic force to the heat sink.

[0166] The module 1002 is configured to determine the elastic force value supported by the elastic element to be prepared based on the structural parameters for each set of structural parameters.

[0167] The target structural parameter determination module 1003 is configured to select the structural parameter among the multiple sets of structural parameters whose supported elastic force value is greater than or equal to the preset pressure value as the target structural parameter; wherein, the target structural parameter is used to prepare a target elastic element, so that the target elastic element is installed on the side of the chip facing away from the heat sink and connected to the heat sink.

[0168] In some embodiments, an elastic element to be prepared includes a plurality of elastic sheets, and a set of structural parameters includes a first structural parameter for each elastic sheet and a second structural parameter for assembling the elastic sheets; the determining module 1002 is further configured to, for each elastic sheet, determine the elastic force value supported by the elastic sheet based on the second structural parameter and the first structural parameter of the elastic sheet; and determine the elastic force value supported by the elastic element to be prepared based at least on the elastic force value supported by each elastic sheet.

[0169] In some embodiments, the plurality of elastic sheets are symmetrically arranged, and each elastic sheet has the same structure; the determining module 1002 is further configured to determine the elastic force value supported by any elastic sheet among the plurality of elastic sheets based on the second structural parameter and the first structural parameter of the elastic sheet; wherein, the elastic force value supported by each elastic sheet is the same; the sum of the elastic force values ​​supported by each elastic sheet is determined as the elastic force value supported by the elastic element to be prepared.

[0170] In some embodiments, the plurality of elastic sheets are four elastic sheets, and any two adjacent elastic sheets have a connecting portion. Each connecting portion has the same structure, and the second structural parameter in a set of structural parameters includes the structural parameters of the connecting portion. The determining module 1002 is further configured to, for any elastic sheet, determine a first bending stiffness of the any elastic sheet based on the first structural parameter of the any elastic sheet, and determine a second bending stiffness of the connecting portion between the any elastic sheet and the adjacent elastic sheet based on the structural parameters of the connecting portion between the any elastic sheet and the adjacent elastic sheet. The adjacent elastic sheet is an elastic sheet that is positionally adjacent to the any elastic sheet. Based on the first structural parameter of the any elastic sheet, the structural parameters of the connecting portion between the any elastic sheet and the adjacent elastic sheet, the first bending stiffness, and the second bending stiffness, the elastic force value supported by the any elastic sheet is determined.

[0171] In some embodiments, any elastic sheet is a wedge-shaped structure, and any elastic sheet includes a through hole, which is away from the connecting portion and is used to connect the elastic element to be prepared and the heat dissipation element; the first structural parameters of any elastic sheet include the thickness of any elastic sheet, a first material elastic modulus, a first length, and a second length; wherein, the first length is the length of the first portion of any elastic sheet connected to the connecting portion, and the second length is the length passing through the through hole of any elastic sheet and parallel to the first portion; the determining module 1002 is further configured to weight the first length of any elastic sheet based on a preset first weight, weight the second length of any elastic sheet based on a preset second weight, and determine the first cross-sectional moment of inertia of any elastic sheet based on the weighted first length, the weighted second length, and the thickness of any elastic sheet; and determine the first bending stiffness based on the first cross-sectional moment of inertia and the first material elastic modulus.

[0172] In some embodiments, the structural parameters of the connection portion include the width, thickness, and second material elastic modulus of the connection portion; the determining module 1002 is further configured to determine the second cross-sectional moment of inertia of the connection portion between any elastic sheet and the adjacent elastic sheet based on the width and thickness of the connection portion between any elastic sheet and the adjacent elastic sheet; and to determine the second bending stiffness based on the second cross-sectional moment of inertia and the second material elastic modulus.

[0173] In some embodiments, the determining module 1002 is further configured to determine a third bending stiffness of a target region of the elastic element to be prepared based on a first structural parameter of any elastic sheet, a structural parameter of the connection between any elastic sheet and the adjacent elastic sheet, a first bending stiffness, and a second bending stiffness; wherein the target region includes any elastic sheet, the adjacent elastic sheet, and the connection between any elastic sheet and the adjacent elastic sheet; and to determine the elastic force value supported by any elastic sheet based on the first structural parameter of any elastic sheet, the structural parameter of the connection between any elastic sheet and the adjacent elastic sheet, and the third bending stiffness.

[0174] In some embodiments, any elastic sheet includes a through hole, the through hole being away from the connecting portion, for connecting the elastic element to be manufactured and the heat dissipation element; the first structural parameter of any elastic sheet includes a third length, and the structural parameter of the connecting portion includes the length of the connecting portion; wherein, the third length is the distance between the center of the through hole on any elastic sheet and the center of the first portion where the any elastic sheet is connected to the connecting portion, and the length of the connecting portion is the distance between the center of the second portion where the adjacent elastic sheet is connected to the connecting portion and the center of the first portion; the determining module 1002 is further configured to weight the first bending stiffness based on the third length of any elastic sheet, weight the bending stiffness of the adjacent elastic sheets based on the third length of the adjacent elastic sheets, and weight the second bending stiffness based on the length of the connecting portion to obtain the third bending stiffness; wherein, the third length of the adjacent elastic sheets is the same as the third length of any elastic sheet, and the bending stiffness of the adjacent elastic sheets is the same as the first bending stiffness.

[0175] In some embodiments, the first structural parameter of any elastic sheet includes the bending height of the any elastic sheet; wherein the bending height is the vertical distance between the through hole on the any elastic sheet and the connecting portion; the determining module 1002 is further configured to determine the elastic force value supported by the any elastic sheet based on the bending height of the any elastic sheet, the third length of the any elastic sheet, the length of the connecting portion between the any elastic sheet and the adjacent elastic sheet, and the third bending stiffness.

[0176] In some embodiments, the acquisition module 1001 is further configured to acquire the contact area between the chip and the heat sink; and determine the preset pressure value based on the contact area and the preset pressure.

[0177] Regarding the apparatus in the above embodiments, the specific manner in which each module performs its operation has been described in detail in the embodiments related to the method, and will not be elaborated upon here.

[0178] Figure 11 This is a structural block diagram of an electronic device 1100 according to an exemplary embodiment. For example, the electronic device 1100 may be a mobile phone, computer, digital broadcasting terminal, messaging device, tablet device, personal digital assistant, or other terminal device; it may also be a cloud device such as a server.

[0179] Reference Figure 11 The electronic device 1100 may include one or more of the following components: processing component 1102, memory 1104, power supply component 1106, multimedia component 1108, audio component 1110, input / output (I / O) interface 1112, sensor component 1114, and communication component 1116.

[0180] Processing component 1102 typically controls the overall operation of electronic device 1100, such as operations associated with at least one of display, telephone call, data communication, camera operation, and recording operation. Processing component 1102 may include one or more processors 1120 to execute instructions to perform all or part of the steps of the methods described above. Furthermore, processing component 1102 may include one or more modules to facilitate interaction between processing component 1102 and other components. For example, processing component 1102 may include a multimedia module to facilitate interaction between multimedia component 1108 and processing component 1102.

[0181] Memory 1104 is configured to store various types of data to support operation on electronic device 1100. Examples of such data include at least one of the following: instructions for any application or method operating on electronic device 1100, contact data, phonebook data, messages, pictures, and videos. Memory 1104 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as Static Random Access Memory (SRAM), Electrically Erasable Programmable Read-Only Memory (EEPROM), Erasable Programmable Read-Only Memory (EPROM), Programmable Read Only Memory (PROM), Read-Only Memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0182] Power supply component 1106 provides power to various components of electronic device 1100. Power supply component 1106 may include at least one of the following: a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to electronic device 1100.

[0183] Multimedia component 1108 includes a screen that provides an output interface between electronic device 1100 and the user. In some embodiments, the screen may include a Liquid Crystal Display (LCD) and a Touch Panel (TP). If the screen includes a Touch Panel, the screen may be implemented as a touchscreen to receive input signals from the user. The Touch Panel includes one or more touch sensors to sense touches, swipes, and gestures on the Touch Panel. The touch sensors may sense not only the boundaries of touch or swipe actions but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 1108 includes a front-facing camera and / or a rear-facing camera. When electronic device 1100 is in an operating mode, such as a shooting mode or a video mode, the front-facing camera and / or rear-facing camera may receive external multimedia data. Each front-facing camera and rear-facing camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0184] Audio component 1110 is configured to output and / or input audio signals. For example, audio component 1110 includes a microphone (MIC) configured to receive external audio signals when electronic device 1100 is in an operating mode, such as call mode, recording mode, and voice recognition mode. The received audio signals may be further stored in memory 1104 or transmitted via communication component 1116. In some embodiments, audio component 1110 also includes a speaker for outputting audio signals.

[0185] I / O interface 1112 provides an interface between processing component 1102 and peripheral interface modules, such as keyboards, click wheels, and buttons. These buttons may include, but are not limited to, home buttons, volume buttons, power buttons, and lock buttons.

[0186] Sensor assembly 1114 includes one or more sensors for providing state assessments of various aspects of electronic device 1100. For example, sensor assembly 1114 may detect the on / off state of electronic device 1100, the relative positioning of components such as the display and keypad of electronic device 1100, changes in position of electronic device 1100 or one of its components, the presence or absence of user contact with electronic device 1100, orientation or acceleration / deceleration of electronic device 1100, and temperature changes of electronic device 1100. Sensor assembly 1114 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 1114 may also include an optical sensor, such as a complementary metal-oxide-semiconductor (CMOS) or charge-coupled device (CCD) image sensor, for use in imaging applications. In some embodiments, sensor assembly 1114 may also include, but is not limited to, at least one of the following: an accelerometer, a gyroscope, a magnetometer, a pressure sensor, and a temperature sensor.

[0187] Communication component 1116 is configured to facilitate wired or wireless communication between electronic device 1100 and other devices. Electronic device 1100 can access wireless networks based on communication standards, such as Wi-Fi, 4G, 5G, or combinations thereof. In one exemplary embodiment, communication component 1116 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, communication component 1116 also includes a Near Field Communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID), Infrared Data Association (IrDA), Ultra Wide Band (UWB), Bluetooth (BT), and other technologies.

[0188] In an exemplary embodiment, the electronic device 1100 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components.

[0189] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 1104 including executable instructions or a computer program, which can be executed by the processor 1120 of the electronic device 1100 to perform the above-described method. For example, the non-transitory computer-readable storage medium may be a ROM, random access memory (RAM), a compact disc read-only memory (CD-ROM), magnetic tape, floppy disk, and optical data storage device, etc.

[0190] A non-transitory computer-readable storage medium, wherein instructions in the storage medium, when executed by a processor of an electronic device, enable the electronic device to perform any of the data processing methods described in the embodiments of this disclosure.

[0191] This disclosure provides a computer program product comprising a computer program or executable instructions stored in a computer-readable storage medium. A processor of a computer device reads the computer program or executable instructions from the computer-readable storage medium and executes the computer program or executable instructions, causing the computer device to perform any of the data processing methods described in this disclosure.

[0192] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the claims.

[0193] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A data processing method, characterized in that, The method includes: Multiple sets of preset structural parameters and preset pressure values ​​between the chip to be assembled and the heat sink are obtained; wherein, the preset pressure value represents the maximum pressure that the chip and the heat sink can withstand against each other, and a set of structural parameters represents the structural parameters of an elastic element to be prepared; the elastic element is used to connect to the heat sink on the side of the chip facing away from the heat sink and to provide elastic force to the heat sink; For each set of structural parameters, the elastic force value supported by the elastic component to be prepared is determined based on the structural parameters; Among the multiple sets of structural parameters, the structural parameter whose elastic force value is greater than or equal to the preset pressure value is taken as the target structural parameter; wherein, the target structural parameter is used to prepare the target elastic element, so that the target elastic element is installed on the side of the chip facing away from the heat sink and connected to the heat sink.

2. The method according to claim 1, characterized in that, An elastic element to be prepared includes multiple elastic sheets, and a set of structural parameters includes a first structural parameter for each elastic sheet and a second structural parameter for assembling the elastic sheets. The determination of the elastic force value supported by the elastic element to be prepared based on structural parameters includes: For each elastic sheet, the elastic force value supported by the elastic sheet is determined based on the second structural parameter and the first structural parameter of the elastic sheet; The elastic force value supported by the elastic element to be prepared is determined based at least on the elastic force value supported by each elastic sheet.

3. The method according to claim 2, characterized in that, The plurality of elastic sheets are symmetrically arranged, and each elastic sheet has the same structure; The determination of the elastic force supported by each elastic sheet, based on the second structural parameter and the first structural parameter of the elastic sheet, includes: For any one of the plurality of elastic sheets, the elastic force value supported by any one elastic sheet is determined based on the second structural parameter and the first structural parameter of any one elastic sheet; wherein, each elastic sheet supports the same elastic force value; The determination of the elastic force value supported by the elastic element to be prepared, based at least on the elastic force value supported by each elastic sheet, includes: The sum of the elastic force values ​​supported by each elastic sheet is determined as the elastic force value supported by the elastic element to be prepared.

4. The method according to claim 3, characterized in that, The plurality of elastic sheets consists of four elastic sheets, and there is a connecting part between any two adjacent elastic sheets. Each connecting part has the same structure, and the second structural parameter in a set of structural parameters includes the structural parameters of the connecting part. The step of determining the elastic force value supported by any elastic sheet among the plurality of elastic sheets, based on the second structural parameter and the first structural parameter of the elastic sheet, includes: For any elastic sheet, a first bending stiffness of the elastic sheet is determined based on a first structural parameter of the elastic sheet, and a second bending stiffness of the connection between the elastic sheet and the adjacent elastic sheet is determined based on the structural parameters of the connection between the elastic sheet and the adjacent elastic sheet; wherein, the adjacent elastic sheet is an elastic sheet that is adjacent to the position of the elastic sheet. Based on the first structural parameters of any elastic sheet, the structural parameters of the connection between any elastic sheet and the adjacent elastic sheet, the first bending stiffness, and the second bending stiffness, the elastic force value supported by any elastic sheet is determined.

5. The method according to claim 4, characterized in that, Each elastic sheet has a wedge-shaped structure and includes a through hole, which is located away from the connecting portion and is used to connect the elastic element to be manufactured and the heat dissipation element. The first structural parameters of each elastic sheet include the thickness of the elastic sheet, the first elastic modulus of the material, the first length, and the second length. The first length is the length of the first portion of the elastic sheet connected to the connecting portion, and the second length is the length passing through the through hole of the elastic sheet and parallel to the first portion. Determining the first bending stiffness of any elastic sheet based on its first structural parameters includes: The first length of any elastic sheet is weighted based on a preset first weight, the second length of any elastic sheet is weighted based on a preset second weight, and the first cross-sectional moment of inertia of any elastic sheet is determined based on the weighted first length, the weighted second length, and the thickness of any elastic sheet. The first bending stiffness is determined based on the moment of inertia of the first cross section and the elastic modulus of the first material.

6. The method according to claim 4, characterized in that, The structural parameters of the connecting part include the width, thickness, and elastic modulus of the second material. The determination of the second bending stiffness of the connection between any elastic sheet and the adjacent elastic sheet based on the structural parameters of the connection between the elastic sheet and the adjacent elastic sheet includes: Based on the width and thickness of the connection between any elastic sheet and the adjacent elastic sheet, determine the second cross-sectional moment of inertia of the connection between any elastic sheet and the adjacent elastic sheet; The second bending stiffness is determined based on the moment of inertia of the second cross section and the elastic modulus of the second material.

7. The method according to any one of claims 4 to 6, characterized in that, The determination of the elastic force value supported by any elastic sheet based on the first structural parameters of any elastic sheet, the structural parameters of the connection between any elastic sheet and the adjacent elastic sheet, the first bending stiffness, and the second bending stiffness includes: Based on the first structural parameters of any elastic sheet, the structural parameters of the connection between any elastic sheet and the adjacent elastic sheet, the first bending stiffness, and the second bending stiffness, the third bending stiffness of the target region of the elastic element to be prepared is determined; wherein, the target region includes any elastic sheet, the adjacent elastic sheet, and the connection between any elastic sheet and the adjacent elastic sheet; Based on the first structural parameters of any elastic sheet, the structural parameters of the connection between any elastic sheet and the adjacent elastic sheet, and the third bending stiffness, the elastic force value supported by any elastic sheet is determined.

8. The method according to claim 7, characterized in that, Each elastic sheet includes a through hole, which is located away from the connecting portion and is used to connect the elastic element to be manufactured and the heat dissipation element; the first structural parameter of each elastic sheet includes a third length, and the structural parameter of the connecting portion includes the length of the connecting portion; wherein, the third length is the distance between the center of the through hole on each elastic sheet and the center of the first part where each elastic sheet is connected to the connecting portion, and the length of the connecting portion is the distance between the center of the second part where the adjacent elastic sheet is connected to the connecting portion and the center of the first part; The determination of the third bending stiffness of the target region of the elastic element to be prepared based on the first structural parameters of any elastic sheet, the structural parameters of the connection between any elastic sheet and the adjacent elastic sheet, the first bending stiffness, and the second bending stiffness includes: The first bending stiffness is weighted based on the third length of any elastic sheet, the bending stiffness of the adjacent elastic sheets is weighted based on the third length of the adjacent elastic sheets, and the second bending stiffness is weighted based on the length of the connecting portion to obtain the third bending stiffness; wherein the third length of the adjacent elastic sheets is the same as the third length of any elastic sheet, and the bending stiffness of the adjacent elastic sheets is the same as the first bending stiffness.

9. The method according to claim 8, characterized in that, The first structural parameter of any elastic sheet includes the bending height of the elastic sheet; wherein, the bending height is the vertical distance between the through hole on the elastic sheet and the connecting portion; The determination of the elastic force value supported by any elastic sheet based on the first structural parameter of any elastic sheet, the structural parameter of the connection between any elastic sheet and the adjacent elastic sheet, and the third bending stiffness includes: The elastic force value supported by any elastic sheet is determined based on the bending height of any elastic sheet, the third length of any elastic sheet, the length of the connection between any elastic sheet and the adjacent elastic sheet, and the third bending stiffness.

10. The method according to claim 1, characterized in that, The process of obtaining the preset pressure value between the chip to be assembled and the heat sink includes: Obtain the contact area between the chip and the heat sink; The preset pressure value is determined based on the contact area and the preset pressure.

11. A data processing apparatus, characterized in that, The device includes: The acquisition module is configured to acquire multiple preset sets of structural parameters and a preset pressure value between the chip to be assembled and the heat sink; wherein, the preset pressure value represents the maximum pressure that the chip and the heat sink can withstand against each other, and a set of structural parameters represents the structural parameters of an elastic element to be prepared; the elastic element is used to connect to the heat sink on the side of the chip facing away from the heat sink and to provide elastic force to the heat sink; The module is configured to determine the elastic force value supported by the elastic component to be prepared based on the structural parameters for each set of structural parameters. The target structural parameter determination module is configured to select structural parameters among the multiple sets of structural parameters whose supported elastic force value is greater than or equal to the preset pressure value as target structural parameters; wherein, the target structural parameters are used to prepare target elastic elements, so that the target elastic elements are installed on the side of the chip facing away from the heat sink and connected to the heat sink.

12. An electronic device, characterized in that, include: processor; Memory used to store computer programs or instructions; The processor executes the computer program or instructions to implement the steps of the data processing method according to any one of claims 1 to 10.

13. A non-transitory computer-readable storage medium storing a computer program or instructions, characterized in that, When the computer program or instructions in the storage medium are executed by a processor, the steps of the data processing method according to any one of claims 1 to 10 are implemented.

14. A computer program product, comprising a computer program or instructions, characterized in that, When the computer program or instructions are executed by a processor, they implement the steps of the data processing method according to any one of claims 1 to 10.

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