Conductive elastic piece and electronic equipment

Abstract

The embodiment of the invention provides a conductive elastic piece and electronic equipment, the conductive elastic piece comprises an elastic piece base body, an extension layer and a first metal layer, the conductive elastic piece is provided with a first surface and a second surface which are oppositely arranged, and a third surface which is connected with the first surface and the second surface, the extension layer is at least arranged on the first surface, the second surface and the third surface, and the first metal layer is attached to the face, away from the elastic piece base body, of the extension layer. Compared with the prior art, the conductive elastic piece can improve the effective contact area and optimize the PIM problem, can be designed to be smaller, facilitates the miniaturization of the conductive elastic piece, and further facilitates the realization of ultrathin electronic equipment.

Description

Technical Field

[0001] This application relates to the field of communication equipment technology, and in particular to a conductive elastic element and an electronic device. Background Technology

[0002] With the continuous development of mobile communication technology, the internal structure of electronic devices is becoming increasingly complex and highly integrated. For example, taking mobile phones as an example, the high integration of components makes mobile phones increasingly thinner. This results in smaller and smaller spacing between adjacent components along the thickness direction of the phone. Under these circumstances, reducing radiated spurious emissions (RSE) and avoiding signal interference between adjacent components are particularly important.

[0003] In related technologies, conductive foam is often used in electronic devices to reduce stray radiation, conduct electricity, and prevent electrostatic discharge.

[0004] However, current conductive foams are difficult to miniaturize and have poor overall performance, which results in electronic devices being unable to achieve ultra-thin designs or good performance when used in electronic devices. Summary of the Invention

[0005] This application provides a conductive elastic element and an electronic device. Compared with related technologies, the conductive elastic element can increase the effective contact area, optimize the PIM problem, and can also be designed to be smaller, which is conducive to the miniaturization of the conductive elastic element and thus facilitates the realization of ultra-thin electronic devices.

[0006] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0007] In a first aspect, embodiments of this application provide a conductive elastic element comprising: an elastic element substrate having a first surface and a second surface disposed opposite to each other, and a third surface connecting the first surface and the second surface; an extension layer disposed at least on the first surface, the second surface, and the third surface; and a first metal layer attached to the side of the extension layer facing away from the elastic element substrate.

[0008] The conductive elastic element provided in this application embodiment achieves electrical connection between a first structure and a second structure in an electronic device by providing an extension layer on at least the first, second, and third surfaces of the elastic element substrate and a first metal layer on the side of the extension layer facing away from the elastic element substrate. Furthermore, when the elastic element substrate is compressed and deformed, the extension layer can be stretched, thereby stretching the first metal layer. Since the extension layer can fix the first metal layer, it can prevent the first metal layer from breaking under tension. In addition, compared to the conductive cloth in related technologies, the contact surface between the first metal layer and the first and second structures is flatter, increasing the effective contact area between the conductive elastic element and the first and second structures, optimizing the PIM problem, and thus enabling the electronic device to have better performance. Moreover, since the contact surface of the first metal layer is flatter than that of the conductive cloth in related technologies, the conductive elastic element can be designed to be smaller with the same effective contact area, which is beneficial for miniaturization of the conductive elastic element and thus for achieving ultra-thin electronic devices. Meanwhile, the conductive elastic element stacked structure provided in this application embodiment is simple and has a small incompressibility, which on the one hand is conducive to the thinning of electronic devices, and on the other hand can avoid causing display problems to the display components.

[0009] In one possible implementation, the conductive elastic element further includes a second metal layer disposed on the side of the first metal layer opposite to the second surface, and the second metal layer is electrically connected to the first metal layer. The first metal layer and / or the elastic element substrate are fixedly connected to the second metal layer, and the second metal layer extends protruding relative to the elastic element substrate to form a welded portion.

[0010] The second metal layer is electrically connected to the first metal layer, allowing the second structure to be electrically connected to the first structure through the pathway formed between the two metal layers. The conductive elastic element can be integrally welded to the second structure of the electronic device via a welding section, thus fixing the conductive elastic element to the second structure and preventing displacement of the conductive elastic element during use.

[0011] In one possible implementation, the second metal layer at the welded portion is folded and stacked, and the welded portion is a laser-welded portion. This allows the thickness of the welded portion to meet the requirements of laser welding.

[0012] In one possible implementation, the conductive elastic element further includes a first adhesive layer, wherein the second metal layer at the welded portion is folded over and then laminated and bonded together through the first adhesive layer.

[0013] The first adhesive layer can fix the folded second metal layer, preventing it from lifting up and affecting the welding operation of the welding part.

[0014] In one possible implementation, the conductive elastic element further includes a metal component, which is stacked with the welded portion, and the area where the metal component and the welded portion are located is a laser-welded portion. This allows the thickness of the welded portion to meet the requirements of laser welding.

[0015] In one possible implementation, the metal part is fixedly connected to the welded part by a second adhesive layer or by welding.

[0016] This allows for the pre-fixation of metal parts, preventing them from detaching from the conductive elastic element or becoming loose, which could affect subsequent welding operations.

[0017] In one possible implementation, the metal component is a stainless steel sheet with a thickness greater than or equal to 0.05 mm. This increases the pull-out resistance of the welded portion, thereby improving the connection stability between the conductive elastic component and other parts.

[0018] In one possible implementation, the first metal layer is attached to the extended layer by a rolling process. This can improve the flexibility, ductility, fatigue resistance, and hardness of the first metal layer, and can also reduce the thickness of the first metal layer, preventing cracks or breakage of the conductive elastic element at low operating heights, and is also beneficial for the miniaturization of the conductive elastic element.

[0019] In one possible implementation, the first metal layer is a rolled copper layer.

[0020] In one possible implementation, the ratio between the thickness of the first metal layer and the thickness of the extended layer is less than or equal to one-half.

[0021] Because the elastic modulus of the rolled metal itself is insufficient, the extension layer, serving as the substrate, needs to have a certain thickness to improve the overall resilience of the extension layer and the first metal layer. A ratio of less than or equal to half the thickness of the first metal layer to the thickness of the extension layer can improve the overall resilience of the extension layer and the first metal layer. If the thickness of the extension layer is insufficient, when cutting the extension layer and the first metal layer, the surfaces of the first metal layer and the extension layer will collapse, resulting in unevenness after cutting. In the conductive elastic element provided in this application embodiment, setting the ratio of the thickness of the first metal layer to the thickness of the extension layer to less than or equal to half can improve the flatness of the extension layer and the first metal layer after cutting.

[0022] In one possible implementation, the first metal layer is subjected to an etching process to reduce the thickness of the first metal layer.

[0023] Etching is a technique that uses chemical or physical methods to selectively remove materials. The first metal layer formed on the extension layer can be further processed by etching to reduce the thickness of the first metal layer. The thickness of the extension layer can also be designed to be smaller, which is beneficial for the lightweight design of conductive elastic components.

[0024] In one possible implementation, a third adhesive layer is further included, which is disposed between the extension layer and the conductive elastic substrate.

[0025] The third adhesive layer can enhance the connection stability between the extension layer and the elastic component substrate, preventing the conductive elastic component from disintegrating during assembly and use, thus preventing the conductive elastic component from failing.

[0026] In one possible implementation, the conductive elastic element further includes a fourth adhesive layer, the extension layer being disposed on a portion of the second surface, and the portion of the second surface not having the extension layer being disposed thereon being connected to the second metal layer via the fourth adhesive layer.

[0027] The fourth adhesive layer securely connects the elastic component substrate, the extension layer, and the first metal layer to the second metal layer, preventing the conductive elastic component from disintegrating during assembly or use and thus preventing its failure. The fourth adhesive layer can be made of thermosetting adhesive or pressure-sensitive adhesive, etc.

[0028] In one possible implementation, the conductive elastic element further includes a first conductive adhesive layer, the extension layer being disposed over the entire area of ​​the second surface, and the first conductive adhesive layer being disposed between the first metal layer and the second metal layer.

[0029] The first conductive adhesive layer serves two purposes: firstly, it securely connects the second metal layer to the elastic component substrate, and secondly, it electrically connects the second metal layer to the first metal layer. This facilitates the miniaturization of the conductive elastic component.

[0030] In one possible implementation, the conductive elastic element further includes a second conductive adhesive layer disposed on the side of the weld portion opposite to the first metal layer.

[0031] In one possible implementation, both the first conductive adhesive layer and the second conductive adhesive layer include: a first colloid and a first conductive particle embedded in the first colloid. The first colloid has a first surface and a second surface that are opposite to each other along its thickness direction. The particle size of the first conductive particle is greater than the thickness of the first colloid, and the first conductive particle protrudes from the first surface and the second surface. Alternatively, the particle size of the first conductive particle is equal to the thickness of the first colloid, and the outer surface of the first conductive particle is flush with the first surface and the second surface.

[0032] By setting the particle size of the first conductive particles, the conductivity between the first metal layer and the second metal layer can be ensured. Furthermore, a larger particle size of the first conductive particles can reduce the proportion of the first conductive particles in the first colloid and reduce the PIM deterioration caused by the overlap between particles, thereby improving the overall PIM problem of the electronic device.

[0033] In one possible implementation, the first conductive adhesive layer and the second conductive adhesive layer further include a conductive nonwoven fabric layer, a second colloid, and second conductive particles embedded in the second colloid. The second colloid has a third side and a fourth side opposite to each other along its thickness direction. The particle size of the second conductive particles is greater than the thickness of the second colloid, and the second conductive particles protrude from the third side and the fourth side. Alternatively, the particle size of the second conductive particles is equal to the thickness of the second colloid, and the outer surface of the second conductive particles is flush with the third side and the fourth side. The conductive nonwoven fabric layer is disposed between the first colloid and the second colloid.

[0034] By adjusting the particle size of the second conductive particles, conductivity between the first and second metal layers can be ensured. Furthermore, a larger particle size reduces the proportion of second conductive particles in the second colloid and minimizes PIM (Position Injection Marking) degradation caused by particle overlap, thus improving the overall PIM of the electronic device. The conductive nonwoven fabric layer improves the tensile strength, tear resistance, and flexibility of the first conductive adhesive layer. Moreover, compared to colloids simply filled with conductive particles, it offers more uniform conductivity, reducing local resistance differences and further improving PIM. Additionally, the conductive nonwoven fabric layer can improve bilateral overlap impedance, further mitigating PIM issues.

[0035] In one possible implementation, the first conductive particles account for more than 1.5% of the volume fraction of the first colloid, and the second conductive particles account for more than 1.5% of the volume fraction of the second colloid.

[0036] In one possible implementation, the elastic element substrate is polyurethane foam or silicone foam.

[0037] The elastic component matrix is ​​made of foamed material, which can ensure good fatigue resilience and stable rebound force, thereby supporting full contact between the conductive elastic component and other components, and can avoid yielding and non-rebound after the first metal layer is over-compressed.

[0038] In one possible implementation, the extended layer is a polyimide film, a modified polyimide film, or a fluorine-based film.

[0039] In one possible implementation, the elastic modulus of the extended layer is greater than 2.5 GPa.

[0040] In one possible implementation, the second metal layer is a copper foil, aluminum foil, or nickel-plated copper foil, and the thickness of the second metal layer is greater than or equal to 0.03 mm.

[0041] In one possible implementation, the conductive elastic element further includes an insulating adhesive layer disposed on the side of the second metal layer facing away from the first metal layer.

[0042] The insulating adhesive layer serves to pre-fix the conductive elastic element and enhances the connection stability of the conductive elastic element on the second structure. Furthermore, the insulating adhesive layer also provides insulation between the second metal layer and the second structure. Because the insulating adhesive layer provides pre-fixation, no specific fixture is required during welding. After the conductive elastic element and the second structure are welded, the second structure and the first structure are only connected by the welded joint, avoiding interference from multiple conductive paths.

[0043] Secondly, embodiments of this application provide an electronic device including the conductive elastic element as described above, wherein a first structure and a second structure in the electronic device are electrically connected through the conductive elastic element.

[0044] The electronic device provided in this application embodiment achieves electrical connection between a first structure and a second structure by providing an extension layer on at least the first, second, and third surfaces of the elastic element substrate and a first metal layer on the side of the extension layer facing away from the elastic element substrate. Furthermore, when the elastic element substrate is compressed and deformed, the extension layer can be stretched, thereby stretching the first metal layer. Since the extension layer can fix the first metal layer, it can prevent the first metal layer from breaking under tension. In addition, compared to the conductive cloth in related technologies, the contact surface between the first metal layer and the first and second structures is flatter, increasing the effective contact area between the conductive elastic element and the first and second structures, optimizing the PIM problem, and thus enabling the electronic device to have better performance. Moreover, since the contact surface of the first metal layer is flatter than that of the conductive cloth in related technologies, the conductive elastic element can be designed to be smaller with the same effective contact area, which is beneficial for miniaturization of the conductive elastic element and thus for achieving ultra-thin electronic devices. Meanwhile, the conductive elastic element stacked structure provided in this application embodiment is simple and has a small incompressibility, which on the one hand is conducive to the thinning of electronic devices, and on the other hand can avoid causing display problems to the display components.

[0045] In one possible implementation, the first structure is any one of a display component, a camera component, an antenna, a mid-frame, a circuit board, a spring, a battery cover, and a camera decorative component, and the second structure is any one of a display component, a camera component, an antenna, a mid-frame, a circuit board, a spring, a battery cover, and a camera decorative component.

[0046] In one possible implementation, the first structure is a display component, and the second structure is a mid-frame. Attached Figure Description

[0047] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0048] Figure 2 This is an exploded view of an electronic device provided in an embodiment of this application;

[0049] Figure 3 This is a schematic diagram of the cross-sectional structure between the mid-frame and the display component of an electronic device in a related technology;

[0050] Figure 4 This is a schematic diagram of the structure of conductive foam in a related technology;

[0051] Figure 5 This is a schematic diagram of the surface appearance of the conductive cloth in a related technology.

[0052] Figure 6 This is a schematic diagram of the cross-sectional structure of the conductive cloth in conductive foam, which is a related technology.

[0053] Figure 7 A schematic diagram of the structure of a conductive elastic element provided in an embodiment of this application. Figure 1 ;

[0054] Figure 8 A schematic cross-sectional view of the structure between the mid-frame and the display component of an electronic device provided in an embodiment of this application;

[0055] Figure 9 A schematic diagram of the structure of a conductive elastic element provided in an embodiment of this application. Figure 2 ;

[0056] Figure 10 A schematic diagram of the welded surface of a workpiece (e.g., 7th series aluminum) under ultrasonic welding;

[0057] Figure 11 A schematic diagram of the structure of a conductive elastic element provided in an embodiment of this application. Figure 3 ;

[0058] Figure 12 A schematic diagram of the structure of a conductive elastic element provided in an embodiment of this application. Figure 4 ;

[0059] Figure 13 A schematic diagram of the structure of a conductive elastic element provided in an embodiment of this application. Figure 5 ;

[0060] Figure 14 This is a microscopic morphology diagram of the rolled copper.

[0061] Figure 15 Microscopic morphology of electrolytic copper;

[0062] Figure 16 This is a diagram showing the external morphology of rolled copper.

[0063] Figure 17 This is a morphological image of electrolytic copper.

[0064] Figure 18 This is a schematic diagram of the fracture of electrolytic copper under pressure.

[0065] Figure 19 A schematic diagram showing the thickness of the extension layer and the first metal layer in a conductive elastic element provided in an embodiment of this application;

[0066] Figure 20 According to Figure 4 A bottom view of the conductive foam;

[0067] Figure 21 Schematic diagram of the cross-sectional structure of the first conductive adhesive provided in an embodiment of this application Figure 1 ;

[0068] Figure 22 Schematic diagram of the cross-sectional structure of the first conductive adhesive provided in an embodiment of this application Figure 2 ;

[0069] Figure 23 A schematic diagram of the structure of a conductive elastic element provided in an embodiment of this application. Figure 6 .

[0070] Explanation of reference numerals in the attached figures:

[0071] 10-Electronic device; 11-Middle frame; 12-Display component;

[0072] 20-Conductive foam; 21-Foam core; 22-Conductive cloth; 23-Adhesive backing;

[0073] 30 - Metal sheet; 40 - Welded part;

[0074] 100 - Electronic devices;

[0075] 110 - Display component; 120 - Housing; 121 - Mid-frame; 1211 - Bezel; 1212 - Mid-plate; 121a - Accommodation space; 122 - Back cover;

[0076] 200 - Conductive elastic element;

[0077] 210 - Elastic component substrate; 211 - First surface; 212 - Second surface; 213 - Third surface;

[0078] 220 - Extension layer; 230 - First metal layer;

[0079] 240 - Second metal layer; 241 - Welding section;

[0080] 250 - First adhesive layer; 251 - Second adhesive layer; 252 - Third adhesive layer; 253 - Fourth adhesive layer;

[0081] 260 - Insulating adhesive layer; 270 - Metal parts;

[0082] 280 - First conductive adhesive layer;

[0083] 281-First side; 282-Second side; 283-Third side; 284-Fourth side; 285-First colloid; 286-First conductive particle; 287-Conductive nonwoven fabric layer; 288-Second colloid; 289-Second conductive particle; 290-Second conductive adhesive layer. Detailed Implementation

[0084] The terminology used in the implementation section of this application is only for explaining specific embodiments of this application and is not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0085] First, some terms used in the embodiments of this application will be explained so that those skilled in the art can understand them.

[0086] foam

[0087] Foam refers to materials that have been foamed, such as polyurethane and plastic particles. Foam is characterized by its light weight, elasticity, rapid pressure-sensitive fixing, ease of use, flexibility, ultra-thin size, and reliable performance.

[0088] conductive foam

[0089] Conductive foam refers to foam core wrapped with conductive cloth or similar materials. After processing, it has good surface conductivity and can be easily fixed to the structure that needs shielding using adhesive tape or similar materials.

[0090] Low working height of conductive foam

[0091] The minimum working height of conductive foam refers to the minimum thickness at which conductive foam can maintain good conductivity under compressed conditions. It is an important parameter for the design and selection of conductive foam.

[0092] electrostatic discharge

[0093] Electrostatic discharge (ESD) is the phenomenon of the sudden transfer of static charge between objects with different potentials. ESD can damage or cause malfunctions in electronic components, requiring protection in electronic devices.

[0094] Passive intermodulation

[0095] Passive intermodulation (PIM) refers to the mixing of two or more frequencies in a nonlinear device, which generates stray signals.

[0096] radioactive stray

[0097] Radiated spurious emission (RSE) refers to radiation occurring at discrete frequencies other than the carrier frequency and sidebands and adjacent channels caused by normal modulation and switching transients when modulated with a standard signal. Radiated spurious emissions may include harmonic components generated by nonlinear structures, intermodulation signals, etc.

[0098] non-woven fabric

[0099] Non-woven fabric, also known as non-woven cloth, needle-punched cloth, or needle-punched non-woven fabric, is made from materials such as polyester fibers and is produced through a needle-punching process. Non-woven fabric has no warp or weft threads; it is a fabric formed without spinning or weaving. Instead, it is made by arranging short or long textile fibers in a directional or random manner to form a web structure, which is then reinforced using mechanical, thermal, or chemical methods. Non-woven fabric is characterized by its moisture-proof, breathable, flexible, lightweight, flame-retardant, non-toxic, odorless, inexpensive, and recyclable properties.

[0100] The above is a brief introduction to the terms used in the embodiments of this application, and will not be repeated below.

[0101] Figure 1 This is a schematic diagram of the structure of an electronic device 100 provided in an embodiment of this application, with reference to... Figure 1 As shown, the electronic device 100 provided in this application embodiment includes: a display component 110 and a housing 120.

[0102] Specifically, the display component 110 is mounted on the housing 120, and the display area of ​​the display component 110 is exposed to present image information to the user. The display component 110 may include a display module capable of displaying images and videos. The display module may be a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode (AMOLED), a flexible light-emitting diode (FLED), a quantum dot light-emitting diode (QLED), etc. Furthermore, in some embodiments of this application, the display component 110 may also include a light-transmitting cover plate, which is disposed on the outside of the display module to protect it. The light-transmitting cover plate may be made of light-transmitting materials such as transparent glass or polyimide that provide protection. In some embodiments of this application, the display component 110 can not only display images and videos but also have touch functionality.

[0103] Figure 2 This is an exploded structural diagram of an electronic device 100 provided in an embodiment of this application, with reference to... Figure 2 As shown, the housing 120 may include a middle frame 121 and a back cover 122. The display assembly 110 and the back cover 122 are respectively disposed on opposite sides of the middle frame 121. The middle frame 121 has a receiving space 121a, which may be located on the side of the middle frame 121 facing the display assembly 110 or on the side of the middle frame 121 facing the back cover 122. Of course, the receiving space 121a may be present on both the side of the middle frame 121 facing the display assembly 110 and the side of the middle frame 121 facing the back cover 122.

[0104] The accommodating space 121a can house the necessary components of the electronic device 100. For example, in some embodiments of this application, the electronic device 100 may further include multiple components (not shown in the figures), which can be installed in the accommodating space 121a. These components may include, for example, a motherboard, processor, internal memory, external memory interface, universal serial bus (USB) interface, charging management module, power management module, battery, antenna, communication module, camera, audio module, speaker, receiver, microphone, headphone jack, sensor module, motor, indicator, and subscriber identification module (SIM) card interface, etc. The electronic device 100 may have more or fewer components than described above, may combine two or more components, or may have different component configurations. Each component can be implemented in hardware, software, or a combination of hardware and software, including one or more signal processing and / or application-specific integrated circuits.

[0105] The middle frame 121 may include a border 1211 and a middle plate 1212. The border 1211 includes a left border, a top border, a right border, and a bottom border, which are connected sequentially to form an annular border 1211. The middle plate 1212 is placed in the annular border 1211 and connected to the annular border 1211. The middle plate 1212 is used to install the electronic components necessary for the electronic device 100.

[0106] The internal structure of electronic device 100 can realize its functions through electrical connections. These electrical connections are generally low-voltage connections, which can easily lead to the generation of nonlinear products such as harmonics and passive intermodulation at the contact interfaces of the internal structure. Nonlinear products are the main source of mobile phone radiated spurious emissions, and radiated spurious emissions interference is an important indicator for mobile phone acceptance.

[0107] To reduce or eliminate radiated stray radiation and avoid signal interference between adjacent components, the internal structure of the mobile phone can be electrically connected using conductive foam 20. For example, Figure 3 This is a schematic cross-sectional view of the structure between the mid-frame 11 and the display component 12 of an electronic device 10 in a related art, for reference. Figure 3As shown, in related technologies, conductive foam 20 is typically placed between the display component 12 and the mid-frame 11 to achieve purposes such as conductivity, improved electrostatic discharge, and reduced antenna clutter. The conductive foam 20 features low PIM (Position Inconsistency Indicator). To further improve the overall PIM of the electronic device 10, a metal sheet 30 is added between the conductive foam 20 and the mid-frame 11 to improve the impedance and roughness of the contact interface between the mid-frame 11 and the conductive foam 20, thereby optimizing the overall PIM. The metal sheet 30 can be a spot-welded spring or an ultrasonically welded copper foil.

[0108] Figure 4 This is a schematic diagram of the structure of conductive foam 20 in a related technology, for reference. Figure 4 As shown, in related technologies, conductive foam 20 includes a foam core 21 and a conductive cloth 22 covering the foam core 21. The conductive cloth 22 is made of woven fabric and is conductive, enabling electrical connection between two objects. However, the conductive cloth 22 has a woven structure (see reference). Figure 5 As shown, Figure 5 (This is a schematic diagram of the surface appearance of the conductive cloth 22 of the conductive foam 20 in a related technology). The woven conductive cloth 22 can be considered as being composed of crisscrossing microfibers, making the surface of the conductive cloth 22 uneven (see reference). Figure 6 As shown, Figure 6 (This is a schematic diagram of the cross-sectional structure of the conductive cloth 22 of the conductive foam 20 in a related technology). This results in a limited contact area between the conductive foam 20 and other objects. In addition, the gaps between the crisscrossing tiny cloth strips further limit the contact area between the conductive foam 20 and other objects.

[0109] However, sufficient contact area is required for conductive foam 20 during use. This is because conductive foam 20 is bonded to the contact surface through compression; insufficient contact area may lead to increased resistance, or even signal attenuation or electromagnetic shielding failure. Furthermore, in high-current scenarios, sufficient contact area can also disperse the current density, preventing localized overheating or ablation. Additionally, conductive foam 20 can be used to shield against electromagnetic interference; insufficient contact can lead to gap leakage, reducing shielding effectiveness and causing problems such as PIM (Positive Infrared Matrix) issues.

[0110] Because the conductive foam 20 needs to ensure sufficient contact area, the woven conductive fabric 22 limits the overall miniaturization of the conductive foam 20. When the conductive foam 20 is used in the electronic device 100, the electronic device 100 cannot achieve ultra-thinness, nor can it have good performance.

[0111] Based on this, the present application provides a conductive elastic element that can solve the problem that the current conductive foam 20 is difficult to miniaturize and has poor overall performance.

[0112] The conductive elastic element 200 provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0113] Figure 7 A schematic diagram of the structure of the conductive elastic element 200 provided in an embodiment of this application. Figure 1 ,refer to Figure 7 As shown, the conductive elastic element 200 provided in this application embodiment includes: an elastic element substrate 210, an extension layer 220, and a first metal layer 230.

[0114] Specifically, the elastic element substrate 210 has a first surface 211 and a second surface 212 disposed opposite to each other, and a third surface 213 connecting the first surface 211 and the second surface 212. It is understood that in the conductive elastic element 200 provided in this application embodiment, the elastic element substrate 210 can have various shapes, such as a rectangle, trapezoid, frustum, etc., and of course, it can also be an irregular shape, as long as the shape of the elastic element substrate 210 meets the specific working conditions. Generally, the shape of the elastic element substrate 210 is a regular hexahedron. For example, as shown... Figure 7 As shown, the elastic element substrate 210 is a regular hexagon, and includes a first surface 211, a second surface 212, a third surface 213, a fourth surface, a fifth surface, and a sixth surface. The first surface 211 and the second surface 212 are disposed opposite to each other, so that the first surface 211 can be connected to a first structure in the electronic device 100, and the second surface 212 can be connected to a second structure in the electronic device 100.

[0115] The first structure can be a display component 110, a camera component, an antenna, a mid-frame 121, a circuit board, a spring, a battery cover, a camera decorative component, etc., in the electronic device 100. The second structure can be a display component 110, a camera component, an antenna, a mid-frame 121, a circuit board, a spring, a battery cover, a camera decorative component, etc., in the electronic device 100.

[0116] In some embodiments of this application, the conductive elastic element 200 is used to electrically connect the display assembly 110 and the middle frame 121, that is, the first surface 211 is connected to the display assembly 110, and the second surface 212 is connected to the middle frame 121 (e.g., Figure 8 (as shown in the image).

[0117] An extension layer 220 is disposed at least on the first surface 211, the second surface 212, and the third surface 213. A first metal layer 230 is attached to the side of the extension layer 220 facing away from the elastic element substrate 210. The extension layer 220 is ductile; when the conductive elastic element 200 is compressed, the deformation of the elastic element substrate 210 causes the extension layer 220 to be stretched, which in turn causes the first metal layer 230 to be stretched. The extension layer 220 serves to fix the first metal layer 230, preventing it from breaking under tension.

[0118] It should be noted that the extension layer 220 being disposed at least on the first surface 211, the second surface 212, and the third surface 213 means that the extension layer 220 can be disposed on the first surface 211, the second surface 212, and the third surface 213, or it can be disposed on other surfaces. For example, the extension layer 220 can also be disposed on the fourth surface, the fifth surface, and / or the sixth surface of a regular hexahedron. For example, as shown... Figure 7 As shown, the extension layer 220 is disposed on the first surface 211, the second surface 212, and the third surface 213, so that the extension layer 220 does not enclose a closed cavity. The fourth, fifth, and sixth surfaces of the elastic element substrate 210 are all "open" to provide clearance space when the elastic element substrate 210 deforms. It can be understood that when the extension layer 220 is disposed on the first surface 211 to the sixth surface side, extra gaps can be reserved in the closed cavity formed by the extension layer 220, that is, the volume of the closed cavity formed by the extension layer 220 is larger than the volume of the elastic element substrate 210, so as to provide clearance space when the elastic element substrate 210 deforms.

[0119] The first metal layer 230 is attached to one side of the elastic substrate 210 of the extension layer 220, so that the first structure and the second structure of the electronic device 100 can be electrically connected.

[0120] In some embodiments of this application, the elastic element substrate 210 can be polyurethane foam or silicone foam. The use of foamed material in the elastic element substrate 210 ensures good fatigue resilience and stable rebound force, thereby supporting sufficient contact between the conductive elastic element 200 and other components, and preventing yielding and non-rebound after overpressure of the first metal layer 230. This application does not limit the material of the elastic element substrate 210, as long as it meets certain elasticity requirements under specific working conditions.

[0121] In some embodiments of this application, the extension layer 220 may be a polyimide film, a modified polyimide film, or a fluorine-based film, etc. The elastic modulus of the extension layer 220 is greater than 2.5 GPa.

[0122] It is understood that the conductive elastic element 200 provided in this application embodiment, by providing an extension layer 220 on at least the first surface 211, the second surface 212, and the third surface 213 of the elastic element substrate 210, and providing a first metal layer 230 on the side of the extension layer 220 facing away from the elastic element substrate 210, can realize the electrical connection between the first structure and the second structure in the electronic device 100. Furthermore, when the elastic element substrate 210 is compressed and deformed, the extension layer 220 can be stretched, thereby causing the first metal layer 230 to be stretched. Since the extension layer 220 can fix the first metal layer 230, it can prevent the first metal layer 230 from breaking under stretching. In addition, compared with the conductive cloth 22 in related technologies, the contact surface of the first metal layer with the first and second structures is flatter, which can increase the effective contact area between the conductive elastic element 200 and the first and second structures, optimize the PIM problem, and thus enable the electronic device 100 to have better performance. Furthermore, since the first metal layer 230 has a flatter contact surface than the conductive cloth 22 in the related technology, the conductive elastic element 200 can be designed to be smaller with the same effective contact area, which is conducive to the miniaturization of the conductive elastic element 200 and thus to the realization of the ultra-thin electronic device 100.

[0123] In another related technology, the exterior of the elastic component substrate can also be wrapped with PET double-sided tape, PI film, and a conductive layer. The PET double-sided tape, PI film, and conductive layer are sequentially arranged from the inside out on the outer surface of the elastic component substrate. The PI film is overlapped and bonded to the outer side of the PET double-sided tape. The central area of ​​the PET double-sided tape is adhered to the upper surface of the elastic component substrate. Both ends of the PET double-sided tape wrap around the left and right sides of the elastic component substrate and overlap to adhere to the lower surface of the elastic component substrate. One end of the conductive layer is adhered to the upper surface of the elastic component substrate, and the other end wraps around the left side of the elastic component substrate and adheres to the lower surface of the elastic component substrate. A substrate-free double-sided adhesive is then placed below the conductive layer. However, this arrangement results in a complex layering pattern between the materials, a large incompressibility, and limits the design of low working heights for the conductive elastic component. For example, in this related technology, the thickness of the conductive layer is approximately 6μm-25μm, the thickness of the PI film is approximately 7μm-25μm, the thickness of the PET double-sided tape is approximately 8μm-12μm, and the thickness of the substrate-free double-sided adhesive is approximately 10μm-15μm. The overall incompressible thickness of the conductive elastic element is approximately 46μm-104μm. It is easy to understand that when the conductive elastic element is at the same extreme working height, the conductive elastic element with a larger incompressible thickness has a larger compression ratio of the elastic element matrix, meaning that the elastic force of the elastic element matrix is ​​greater. This can cause display problems in the display component 110.

[0124] The conductive elastic element 200 provided in this application embodiment has a simple stacked structure and a small incompressible amount. On the one hand, it is beneficial to make the electronic device 100 thinner, and on the other hand, it can avoid causing display problems to the display component 110.

[0125] Of course, this application does not end there. Figure 9 A schematic diagram of the structure of a conductive elastic element provided in an embodiment of this application. Figure 2 ,refer to Figure 9 As shown, in some embodiments of this application, the conductive elastic element 200 further includes a second metal layer 240, which is disposed on the side of the first metal layer 230 away from the second surface 212, and the second metal layer 240 is electrically connected to the first metal layer 230, so that the second structure can be electrically connected to the first structure through the passage formed by the second metal layer 240 and the first metal layer 230.

[0126] To ensure the overall connectivity of the conductive elastic element 200, the first metal layer 230 and / or the elastic element substrate 210 are fixedly connected to the second metal layer 240. For example, as shown... Figure 9 As shown in some embodiments of this application, the extension layer 220 is disposed on a portion of the second surface 212, and the area of ​​the second surface 212 where the extension layer 220 is not disposed is connected to the second metal layer 240 via a fourth adhesive layer 253. It is understood that the fourth adhesive layer 253 can fix the entire structure formed by the elastic element substrate 210, the extension layer 220, and the first metal layer 230 to the second metal layer 240, preventing the conductive elastic element 200 from disintegrating during assembly or use, thus preventing the conductive elastic element 200 from failing. The fourth adhesive layer 253 can be a thermosetting adhesive or a pressure-sensitive adhesive, etc.

[0127] Please continue to refer to this. Figure 9 As shown, in the conductive elastic element 200 provided in the embodiments of this application, the extension layer 220 may be adhesive or non-adhesive depending on the material used. To improve the connection stability between the extension layer 220 and the elastic element substrate 210, in some embodiments of this application, the conductive elastic element 200 may further include a third adhesive layer 252, which is disposed between the extension layer 220 and the conductive elastic element 200 substrate. The third adhesive layer 252 can strengthen the connection stability between the extension layer 220 and the elastic element substrate 210, preventing the conductive elastic element 200 from disintegrating during assembly and use, thus preventing the conductive elastic element 200 from failing.

[0128] Please continue to refer to this. Figure 9As shown, the second metal layer 240 protrudes and extends relative to the elastic element substrate 210 to form a welding portion 241. The conductive elastic element can be integrally welded to the second structure of the electronic device 100 through the welding portion 241, that is, the conductive elastic element 200 is integrally welded and fixed to the second structure by welding the welding portion 241, preventing the conductive elastic element 200 from shifting during use of the electronic device 100.

[0129] The second metal layer 240 can be made of copper foil, aluminum foil, or nickel-plated copper foil, etc. This application does not strictly limit the material of the second metal layer 240. In some embodiments of this application, the thickness of the second metal layer 240 is greater than or equal to 0.03 mm. This avoids the second metal layer 240 being too thin, which could result in insufficient pull-out resistance after welding of the conductive elastic element 200, thus reducing the risk of unreliability.

[0130] Please continue to refer to this. Figure 9 As shown, in some embodiments of this application, the conductive elastic element 200 may further include an insulating adhesive layer 260, which is disposed on the side of the second metal layer 240 facing away from the first metal layer 230. It is understood that the insulating adhesive layer 260 can pre-fix the conductive elastic element 200 and enhance the connection stability of the conductive elastic element 200 on the second structure. Furthermore, the insulating adhesive layer 260 can also provide insulation between the second metal layer 240 and the second structure.

[0131] When welding part 241 is welded to the second structure, the insulating adhesive layer 260 located at welding part 241 will be punctured or vaporized, without affecting the welding or the stability of the welded connection. Since the insulating adhesive layer 260 can play a pre-fixing role, no specific fixture is required during the welding process. After the conductive elastic element 200 is welded to the second structure, the second structure and the first structure are connected only by the welding position of welding part 241, which can avoid interference caused by multiple conductive paths.

[0132] In some embodiments, the welded part 241 can be welded to the second structure by ultrasonic welding. However, ultrasonic welding achieves material bonding by generating heat through friction between the contact surfaces through high-frequency mechanical vibration. When the vibrational energy is transmitted in the weldment 40, it causes localized plastic deformation, forming periodic undulations, exhibiting a wave-like shape. (See reference...) Figure 10 As shown, Figure 10This diagram illustrates the welded surface of component 40 (e.g., 7-series aluminum) under ultrasonic welding. When component 40 is welded to other parts via ultrasonic welding, the welded surface of component 40 is wavy, meaning that only the "troughs" of the wavy surface weld well to other parts. However, this results in insufficient weld area and inadequate pull-out resistance, posing a risk to weld reliability. Furthermore, when the conductive elastic element 200 is ultrasonically welded to the second structure, the lateral expansion of the elastic element substrate 210 under pressure may cause accidental contact between the first metal layer 230 and the "peaks" of the component 40.

[0133] In view of this, to avoid problems arising from ultrasonic welding, the conductive elastic element 200 provided in this application embodiment is welded to the second structure by laser welding. Because laser welding is used, there are certain requirements regarding the thickness of the weldment. Figure 11 A schematic diagram of the structure of the conductive elastic element 200 provided in an embodiment of this application. Figure 3 Please refer to Figure 11 As shown, in some embodiments of this application, the second metal layer 240 at the welding portion 241 is folded and stacked to ensure that the welding portion 241 meets the thickness requirements for laser welding. It should be noted that the number of folded and stacked layers of the second metal layer 240 at the welding portion 241 can be two or more. Figure 11 The following explanation will be based on the example of the second metal layer 240 at the welded part 241 being folded and stacked into two layers.

[0134] Because the second metal layer 240 in the conductive elastic element 200 provided in this application embodiment is made of relatively thin components such as copper foil, aluminum foil, or nickel-plated copper foil, it is not easy to fix the second metal layer 240 after folding. Please continue to refer to Figure 11 As shown, in some embodiments of this application, the conductive elastic element may further include a first adhesive layer 250, and the second metal layer 240 at the welding portion 241 is folded and then laminated and bonded together through the first adhesive layer 250. The first adhesive layer 250 can fix the folded second metal layer 240 to prevent the folded second metal layer 240 from lifting up and affecting the welding operation of the welding portion 241.

[0135] Figure 12 A schematic diagram of the structure of the conductive elastic element 200 provided in an embodiment of this application. Figure 4 Please refer to Figure 12 As shown, in some embodiments of this application, the conductive elastic element 200 may further include a metal element 270, which is stacked with the welding portion 241, and the area where the metal element 270 and the welding portion 241 are located is the laser welding portion 241. It should be noted that in the embodiments of this application, the placement of the metal element 270 within the welding portion 241 is not limited; for example… Figure 12In the process of folding and stacking the second metal layer 240 at the welding part 241, the metal part 270 can be disposed between the stacked second metal layers 240 (which can be understood as the metal part 270 being wrapped by the second metal layer 240), or it can be disposed on the entire upper surface of the second metal layer 240. Alternatively, it can be disposed as follows: Figure 13 As shown, when the second metal layer 240 of the welded part 241 is not folded and stacked, the metal part 270 is disposed on the upper surface of the second metal layer 240. Adding the metal part 270 also meets the thickness requirements of the laser welding butt welded part 241.

[0136] In some embodiments of this application, the metal part 270 can be a stainless steel sheet with a thickness greater than or equal to 0.05 mm. This increases the pull-out resistance of the welded part 241 after welding, thereby improving the connection stability between the conductive elastic element 200 and the electronic device 100.

[0137] It should be noted that when laser welding is used to directly weld thin copper foil, aluminum foil, or nickel-plated copper foil as the second metal layer 240, oxidation and blackening are likely to occur on the surface of the second metal layer 240. Using metal components 270 stacked on top of the second metal layer 240 can alleviate or eliminate the oxidation and blackening phenomenon on the surface of the second metal layer 240.

[0138] Please continue to refer to this. Figure 12 and Figure 13 As shown, in some embodiments of this application, the metal part 270 can be fixedly connected to the welding part 241 via the second adhesive layer 251. Alternatively, the metal part 270 can be connected to the welding part 241 by welding. In this way, the metal part 270 can be pre-fixed, preventing the metal part 270 from detaching from the conductive elastic element or from becoming loose, which would affect the subsequent welding operation of the welding part 241.

[0139] It should be noted that in the conductive elastic element provided in the embodiments of this application, the first metal layer 230 can be attached to the extension layer 220 by an electrolytic process or by a rolling process.

[0140] A comparison is made using electrolytic copper or rolled copper as an example of the first metal layer 230.

[0141] Table 1: Performance Comparison Chart of Electrolytic Copper and Rolled Copper

[0142] Performance Comparison Electrolytic copper Rolled copper Grain structure columnar fibrous flexibility Difference excellent ductility Difference excellent Fatigue resistance Difference excellent Thickness range 5μm-400μm 9μm-105μm hardness Difference excellent

[0143] According to Table 1 and Figure 14 , Figure 15 , Figure 16 and Figure 17It can be seen that rolled copper layers have advantages over electrolytic copper layers in terms of flexibility, ductility, fatigue resistance, thickness, and hardness.

[0144] refer to Figure 18 As shown, electrolytic copper is brittle, difficult to bend, and has poor toughness, making it prone to cracking or breakage under pressure F. When electrolytic copper is applied to the first metal layer 230, the conductive elastic element 200 is susceptible to cracking or breakage at low operating heights. Therefore, in some embodiments of this application, the first metal layer 230 is made of rolled copper. This improves the flexibility, ductility, fatigue resistance, and hardness of the first metal layer 230, reduces its thickness, prevents cracking or breakage of the conductive elastic element 200 at low operating heights, and facilitates miniaturization of the conductive elastic element 200.

[0145] However, since the elastic modulus of the rolled metal itself is insufficient, the extension layer 220, which serves as the substrate, needs to have a certain thickness to improve the overall resilience of the extension layer 220 and the first metal layer 230. Figure 19 This is a schematic diagram showing the thickness of the extension layer 220 and the first metal layer 230 in a conductive elastic element 200 provided in an embodiment of this application, with reference to... Figure 19 As shown, in some embodiments of this application, the ratio between the thickness H1 of the first metal layer 230 and the thickness H2 of the extension layer 220 is less than or equal to one-half, i.e., H1:H2≤1:2. Furthermore, if the thickness of the extension layer 220 is insufficient, when cutting the extension layer 220 and the first metal layer 230, the surfaces of the first metal layer 230 and the extension layer 220 will collapse, resulting in unevenness after cutting. In the conductive elastic element 200 provided in the embodiments of this application, setting the ratio between the thickness H1 of the first metal layer 230 and the thickness H2 of the extension layer 220 to less than or equal to one-half can improve the flatness of the extension layer 220 and the first metal layer 230 after cutting.

[0146] Under existing process conditions, the minimum thickness of copper foil in the direct forming process of rolled copper is 9 μm. At this thickness, the thickness of the extension layer 220 needs to be designed to be above 18 μm, which will result in a large overall incompressibility of the conductive elastic element 200, affecting the thinner and lighter design of the conductive elastic element 200. Based on this, in some embodiments of this application, the first metal layer 230 can also be reduced by etching. Etching is a technique that selectively removes material using chemical or physical methods. The first metal layer 230 formed on the extension layer 220 can be further processed by etching to reduce the thickness of the first metal layer 230. The thickness of the extension layer 220 can also be designed to be smaller, which is beneficial to the thinner and lighter design of the conductive elastic element 200. The thickness reduction of the first metal layer 230 by etching can be dynamically adjusted according to the antenna frequency of the electronic device 100 and the thickness requirements of each component in the electronic device 100.

[0147] Please review Figure 4 , Figure 20 According to Figure 4 A bottom view of the conductive foam 20, in either the C-type or D-type conductive foam 20, with... Figure 4 and Figure 20 Taking the C-type conductive foam 20 as an example, the total bottom area of ​​the conductive foam 20 is 2x6mm. -2 The conductive cloth has an area of ​​2x3.5mm. 2 Adhesive backing 23, area 2x2mm 2 The area between the conductive cloth 22 and the adhesive backing 23 is 2 x 0.5 mm. 2 That is, the bottom of the conductive foam 20 is only 2x3.5mm. 2 The effective contact area is limited, which hinders the miniaturization design of the conductive foam 20.

[0148] In view of this, please refer to Figure 12 and Figure 13 As shown, in some embodiments of this application, the conductive elastic element 200 further includes a first conductive adhesive layer 280, an extension layer 220 disposed over the entire area of ​​the second surface 212, and the first conductive adhesive layer 280 disposed between the first metal layer 230 and the second metal layer 240. The first conductive adhesive layer 280 serves two purposes: firstly, to fix the second metal layer 240 to the elastic element substrate 210, and secondly, to electrically connect the second metal layer 240 to the first metal layer 230. Thus, when the first metal layer 230 requires, for example, 2x3.5mm... 2 When the effective contact area is determined, the overall bottom area of ​​the elastic substrate 210, the extension layer 220, and the first metal layer 230 can be set to 2 x 3.5 mm. 2 Compared to related technologies, the bottom area of ​​conductive foam 20 is 2x6mm. 2The design area is reduced by 41%, which is beneficial for the miniaturization of the conductive elastic element 200.

[0149] In the conductive elastic element 200 provided in the embodiments of this application, the first conductive adhesive layer 280 adopts a low PIM conductive adhesive, such as ACF (Anisotropic Conductive Film) adhesive, conductive adhesive with non-woven fabric substrate, etc.

[0150] Figure 21 Schematic diagram of the cross-sectional structure of the first conductive adhesive provided in an embodiment of this application Figure 1 ,refer to Figure 21 As shown, in some embodiments of this application, the first conductive adhesive layer 280 includes a first colloid 285 and first conductive particles 286 embedded in the first colloid 285. The first conductive particles may be particles with a metal plating.

[0151] The first colloid 285 has a first surface 281 and a second surface 282 that are opposite to each other along its thickness direction. The first surface 281 is connected to the first metal layer 230, and the second surface 282 is connected to the second metal layer 240.

[0152] The first conductive particle 286 has a particle size greater than the thickness of the first colloid 285, and the first conductive particle 286 protrudes from the first surface 281 and the second surface 282. Alternatively, the particle size of the first conductive particle 286 is equal to the thickness of the first colloid 285, and the outer surface of the first conductive particle 286 is flush with the first surface 281 and the second surface 282. Figure 21 The example given is that the particle size of the first conductive particle 286 is equal to the thickness of the first colloid 285, and the outer surface of the first conductive particle 286 is flush with the first surface 281 and the second surface 282.

[0153] Thus, by setting the particle size of the first conductive particle 286, the conductivity between the first metal layer 230 and the second metal layer 240 can be guaranteed. Furthermore, the larger particle size of the first conductive particle 286 can reduce the proportion of the first conductive particle 286 in the first colloid 285 and reduce the PIM deterioration caused by the overlap between particles, thereby improving the overall PIM problem of the electronic device 100.

[0154] Figure 22 Schematic diagram of the cross-sectional structure of the first conductive adhesive provided in an embodiment of this application Figure 2 ,refer to Figure 22 As shown, in some embodiments of this application, the first conductive adhesive layer 280 further includes a conductive nonwoven fabric layer 287, a second colloid 288, and second conductive particles 289 embedded in the second colloid 288. The conductive nonwoven fabric layer 287 is disposed between the first colloid 285 and the second colloid 288. The second conductive particles 289 may be particles with a metal plating.

[0155] The second colloid 288 has a third surface 283 and a fourth surface 284 that are opposite to each other along its thickness direction. The first surface 281 of the first colloid 285 is connected to the first metal layer 230, the second surface 282 of the first colloid 285 is connected to the conductive nonwoven fabric layer 287, the third surface 283 of the second colloid 288 is connected to the conductive nonwoven fabric layer 287, and the fourth surface 284 of the second colloid 288 is connected to the second metal layer 240.

[0156] The second conductive particle 289 has a particle size greater than the thickness of the second colloid 288, and the second conductive particle 289 protrudes from the third surface 283 and the fourth surface 284. Alternatively, the particle size of the second conductive particle 289 is equal to the thickness of the second colloid 288, and the outer surface of the second conductive particle 289 is flush with the third surface 283 and the fourth surface 284. Figure 21 The example given is that the particle size of the second conductive particle 289 is equal to the thickness of the second colloid 288, and the outer surface of the second conductive particle 289 is flush with the third surface 283 and the fourth surface 284.

[0157] Thus, by setting the particle size of the second conductive particle 289, the conductivity between the first metal layer 230 and the second metal layer 240 can be guaranteed. Furthermore, the larger particle size of the second conductive particle 289 can reduce the proportion of the second conductive particle 289 in the second colloid 288 and reduce the PIM deterioration caused by the overlap between particles, thereby improving the overall PIM problem of the electronic device 100.

[0158] Furthermore, the conductive nonwoven fabric layer 287 can improve the tensile strength, tear resistance, and flexibility of the first conductive adhesive layer 280. Moreover, compared to colloids simply filled with conductive particles, it exhibits more uniform conductivity, reducing local resistance differences and thus helping to improve PIM (Position Indentation). In addition, the conductive nonwoven fabric layer 287 can also improve the double-sided overlap impedance, further mitigating PIM issues.

[0159] The conductive nonwoven fabric forms a thin film on the substrate surface through physical vapor deposition (PVD), thus avoiding the PIM problem caused by fiber overlap.

[0160] Similarly, Figure 23 A schematic diagram of the structure of the conductive elastic element 200 provided in an embodiment of this application. Figure 6 ,refer to Figure 23As shown, in some embodiments of this application, the conductive elastic element 200 may further include a second conductive adhesive layer 290, which is disposed on the side of the welding portion 241 facing away from the first metal layer 230. The structure, technical effects, and technical objectives of the second conductive adhesive layer 290 and the first conductive adhesive layer 280 are the same as those of the first conductive adhesive layer, and will not be described in detail here.

[0161] In some embodiments of this application, the volume fraction of the first conductive particle 286 is greater than 1.5%, and the volume fraction of the second conductive particle 289 is greater than 1.5%.

[0162] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design solutions. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0163] In the description of the embodiments of this application, the term "at least one" means one or more, and "more than one" means two or more. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of a single item or a plurality of items. For example, at least one of a, b, c can represent a, b, c, a and b, a and c, b and c, a and b and c, where a, b, and c can be a single item or a plurality of items.

[0164] In the description of embodiments of this application, "parallel," "perpendicular," "equal," and "coplanar" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximately parallelism, wherein the acceptable deviation range for approximately parallelism may be, for example, within ±10° or ±5°. "Perpendicular" includes absolute perpendicularity and approximately perpendicularity, wherein the acceptable deviation range for approximately perpendicularity may be, for example, within ±10° or ±5°; "equal" includes absolute equality and approximately equality, wherein the acceptable deviation range for approximately equality may be, for example, the difference between the two equals being less than or equal to 5% of either one. For example, an angle of 180° between two components includes both absolute 180° and approximate 180°, where an acceptable deviation range for approximate 180° could be, for example, within ±10° or ±5°; similarly, an angle of 0° between two components includes both absolute 0° and approximate 0°, where an acceptable deviation range for approximate 0° could be, for example, within ±10° or ±5°. Similarly, an angle of 90° between two components includes both absolute 90° and approximate 90°, where an acceptable deviation range for approximate 90° could be, for example, within ±10° or ±5°.

[0165] In embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one" does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0166] The directional terms used in the embodiments of this application, such as "inner" and "outer," are merely for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or a specific orientation structure and operation. Therefore, they should not be construed as limitations on the embodiments of this application. Furthermore, unless otherwise stated in this application, "multiple" in this application refers to two or more.

[0167] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0168] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0169] The terms "first," "second," "third," "fourth," etc. (if present) in the claims, description, and drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0170] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0171] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them; although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A conductive elastic element, characterized in that, include: The elastic element substrate has a first surface and a second surface disposed opposite to each other, and a third surface connecting the first surface and the second surface; An extension layer is disposed at least on the first surface, the second surface, and the third surface; The first metal layer is attached to the side of the extension layer that is opposite to the elastic element substrate.

2. The conductive elastic element according to claim 1, characterized in that, It also includes a second metal layer; The second metal layer is disposed on the side of the first metal layer away from the second surface, and the second metal layer is electrically connected to the first metal layer. The first metal layer and / or the elastic element substrate are fixedly connected to the second metal layer. The second metal layer extends outward relative to the elastic substrate to form a weld.

3. The conductive elastic element according to claim 2, characterized in that, The second metal layer at the welding section is folded and stacked, and the welding section is a laser welding section.

4. The conductive elastic element according to claim 3, characterized in that, Also includes: First adhesive layer; The second metal layer at the welded portion is folded over and then bonded together by the first adhesive layer.

5. The conductive elastic element according to any one of claims 2-4, characterized in that, It also includes metal parts; The metal component and the welding part are stacked together, and the area where the metal component and the welding part are located is a laser welding part.

6. The conductive elastic element according to claim 5, characterized in that, The metal part is fixedly connected to the welded part by a second adhesive layer or by welding.

7. The conductive elastic element according to claim 5 or 6, characterized in that, The metal part is a stainless steel sheet, and the thickness of the stainless steel sheet is greater than or equal to 0.05 mm.

8. The conductive elastic element according to any one of claims 1-7, characterized in that, The first metal layer is attached to the extended layer by a rolling process.

9. The conductive elastic element according to claim 8, characterized in that, The first metal layer is a rolled copper layer.

10. The conductive elastic element according to claim 8 or 9, characterized in that, The ratio between the thickness of the first metal layer and the thickness of the extended layer is less than or equal to one-half.

11. The conductive elastic element according to any one of claims 1-10, characterized in that, The first metal layer is etched to reduce its thickness.

12. The conductive elastic element according to any one of claims 1-11, characterized in that, It also includes a third adhesive layer; The third adhesive layer is disposed between the extension layer and the conductive elastic element substrate.

13. The conductive elastic element according to any one of claims 2-12, characterized in that, It also includes a fourth adhesive layer; The extension layer is disposed on a portion of the second surface, and the portion of the second surface without the extension layer is connected to the second metal layer via the fourth adhesive layer.

14. The conductive elastic element according to any one of claims 2-12, characterized in that, It also includes a first conductive adhesive layer; The extension layer is disposed over the entire area of ​​the second surface, and the first conductive adhesive layer is disposed between the first metal layer and the second metal layer.

15. The conductive elastic element according to any one of claims 2-13, characterized in that, It also includes a second conductive adhesive layer; The second conductive adhesive layer is disposed on the side of the weld portion opposite to the first metal layer.

16. The conductive elastic element according to claims 14 and 15, characterized in that, Both the first conductive adhesive layer and the second conductive adhesive layer include: a first colloid and first conductive particles embedded in the first colloid; The first colloid has a first surface and a second surface that are opposite to each other along its thickness direction; The particle size of the first conductive particle is larger than the thickness of the first colloid, and the first conductive particle protrudes from the first surface and the second surface, or... The particle size of the first conductive particle is equal to the thickness of the first colloid, and the outer surface of the first conductive particle is flush with the first surface and the second surface.

17. The conductive elastic element according to claim 16, characterized in that, The first conductive adhesive layer and the second conductive adhesive layer further include a conductive nonwoven fabric layer, a second colloid, and second conductive particles embedded in the second colloid; The second colloid has a third and a fourth surface that are opposite to each other along its thickness direction; The particle size of the second conductive particle is larger than the thickness of the second colloid, and the second conductive particle protrudes from the third and fourth surfaces, or... The particle size of the second conductive particle is equal to the thickness of the second colloid, and the outer surface of the second conductive particle is flush with the third and fourth surfaces; The conductive nonwoven fabric layer is disposed between the first colloid and the second colloid.

18. The conductive elastic element according to claim 16 or 17, characterized in that, The first conductive particle accounts for more than 1.5% of the volume fraction of the first colloid, and the second conductive particle accounts for more than 1.5% of the volume fraction of the second colloid.

19. The conductive elastic element according to any one of claims 1-18, characterized in that, The elastic element substrate is polyurethane foam or silicone foam.

20. The conductive elastic element according to any one of claims 1-19, characterized in that, The extended layer is a polyimide film, a modified polyimide film, or a fluorine-based film.

21. The conductive elastic element according to any one of claims 1-20, characterized in that, The elastic modulus of the extended layer is greater than 2.5 GPa.

22. The conductive elastic element according to any one of claims 2-21, characterized in that, The second metal layer is copper foil, aluminum foil, or nickel-plated copper foil, and the thickness of the second metal layer is greater than or equal to 0.03 mm.

23. The conductive elastic element according to any one of claims 2-22, characterized in that, Also includes: Insulating adhesive layer; The insulating adhesive layer is disposed on the side of the second metal layer that faces away from the first metal layer.

24. An electronic device, characterized in that, Includes the conductive elastic element as described in any one of claims 1-23, wherein the first structure and the second structure in the electronic device are electrically connected through the conductive elastic element.

25. The electronic device according to claim 24, characterized in that, The first structure is any one of the following: display component, camera component, antenna, mid-frame, circuit board, spring, battery cover, and camera decorative part; The second structure is any one of the following: display component, camera component, antenna, mid-frame, circuit board, spring, battery cover, and camera decorative part.

26. The electronic device according to claim 24 or 25, characterized in that, The first structure is a display component, and the second structure is a middle frame.

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