Cooling device for semiconductor manufacturing

Abstract

The application provides a cooling device for semiconductor manufacturing, which comprises: a baffle plate separating a cooling cavity into a first cavity and a second cavity, the first cavity and the second cavity being respectively communicated with an air inlet and an air outlet; a reset assembly arranged on a shell and connected with the baffle plate, the reset assembly being used for providing a reset driving force in a first direction for the baffle plate; a gas flow channel for gas flow being formed between the baffle plate and a liquid level of cooling liquid in the cooling cavity, the first cavity and the second cavity being communicated through the gas flow channel, when air pressure of the air inlet increases, the gas flow pushes the baffle plate to move to the side of the second cavity to increase the volume of the first cavity, and when the air pressure decreases, the reset assembly drives the baffle plate to reset to the side of the first cavity. The cooling device for semiconductor manufacturing disclosed by the application solves the problems of the prior art, such as the decrease of cooling efficiency caused by the fluctuation of the liquid level of the cooling liquid and the poor gas-liquid separation effect.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor equipment, in particular to a cooling device for semiconductor manufacturing. BACKGROUND

[0002] After processes such as chemical mechanical polishing (CMP), etching, and photolithography, various contaminants such as abrasive particles, metal impurities, organic contaminants, and oxide residues may remain on the surface of the substrate. To improve the cleaning efficiency of the contaminants, the substrate is usually cleaned with heated chemical liquid. The heated chemical liquid can enhance the chemical activity and more efficiently decompose and peel off stubborn contaminants on the surface of the substrate, thereby significantly improving the cleaning effect.

[0003] In the cleaning system, the chemical liquid is heated to a certain temperature and quickly evaporates during the cleaning process, resulting in a large amount of vapor containing chemical liquid components in the cleaning system. The vapor is discharged together with the exhaust gas of the cleaning system, forming an exhaust gas stream containing high-humidity vapor, which is treated by a gas-liquid separation device. Due to the start-stop and temperature adjustment of the heated chemical liquid during the cleaning process, the amount of vapor produced is unstable, which may cause fluctuations in the exhaust gas pressure and result in continuous changes in the state of the gas stream entering the gas-liquid separation device.

[0004] Chinese patent application No. CN117954348A discloses a substrate processing device, a polishing device, and a substrate processing method. The substrate processing device includes a processing module for processing a substrate with a liquid, and a gas-liquid separation tank connected to an exhaust outlet of the processing module, which separates the liquid from the exhaust gas received from the processing module and discharges the exhaust gas to an exhaust conduit. The gas-liquid separation tank has a tank body, a heat exchanger arranged in the tank body to cool the exhaust gas, and an air nozzle arranged in the tank body to supply air to cool the exhaust gas.

[0005] However, in actual operation, the substrate processing device in the above-mentioned prior art may cause gas flow impact when the exhaust gas pressure fluctuates (especially when the pressure is too high), resulting in fluctuations in the liquid level of the cooling liquid in the gas-liquid separation tank, which may destroy the stable contact state between the gas and the cooling liquid, thereby reducing the uniformity of heat exchange, ultimately leading to a decrease in cooling efficiency and poor gas-liquid separation effect. At the same time, the high-speed gas flow may collide violently with the baffle and the inner wall of the gas-liquid separation tank, thereby forming obvious operating noise, which not only worsens the working environment in the workshop but also affects the comfort and concentration of the operators.

[0006] It should be noted that the above introduction to the background art is merely intended to facilitate clear, complete explanation of the technical solutions of the present application and to facilitate understanding of the present application by those skilled in the art. The above technical solutions cannot be considered as known to those skilled in the art merely because they are described in the background art section of the present application. SUMMARY

[0007] The present application aims to disclose a cooling device for semiconductor manufacturing, which solves the problems of reduced cooling efficiency and poor gas-liquid separation effect caused by fluctuation of the liquid level of the cooling liquid in the prior art.

[0008] To achieve the above object, the present application provides a cooling device for semiconductor manufacturing, comprising: a shell with a cooling cavity formed inside, opposite side walls of the shell along a first direction are respectively configured with an air inlet and an air outlet;

[0009] A wind-resisting plate movably arranged inside the shell along the first direction, the wind-resisting plate separates the cooling cavity into a first cavity and a second cavity, the first cavity and the second cavity are respectively communicated with the air inlet and the air outlet;

[0010] A return assembly arranged in the shell and connected with the wind-resisting plate, the return assembly is used to provide the wind-resisting plate with a reset driving force along the first direction;

[0011] A gas flow channel for gas circulation is formed between the wind-resisting plate and the liquid level of the cooling liquid in the cooling cavity, the first cavity and the second cavity are communicated through the gas flow channel, when the air pressure of the air inlet increases, the gas flow pushes the wind-resisting plate to move to the side of the second cavity to increase the volume of the first cavity; when the air pressure decreases, the return assembly drives the wind-resisting plate to reset to the side of the first cavity.

[0012] As a further improvement of the present application, the cooling device for semiconductor manufacturing further comprises: a liquid stabilizing assembly arranged at the bottom of the cooling cavity, the gas flow channel is formed between the wind-resisting plate and the liquid stabilizing assembly;

[0013] The liquid stabilizing assembly comprises: a plurality of flow-resisting plates arranged along a second direction perpendicular to the first direction, the flow-resisting plates are immersed in the cooling liquid and the top of each flow-resisting plate is flush with the liquid level of the cooling liquid.

[0014] As a further improvement of the present application, the bottom of each flow-resisting plate is configured with a plurality of flow guide grooves, the flow guide grooves of adjacent flow-resisting plates are staggered along the first direction.

[0015] As a further improvement of the present application, the top of the wind baffle plate is in close contact with the top side wall of the shell and forms a sealed sliding; the side edges of the wind baffle plate are in close contact with the two side walls of the shell opposite to each other along the second direction and forms a sealed sliding.

[0016] As a further improvement of the present application, the shell is configured with a sliding rail extending along the first direction, the sliding rail is located at the two sides of the wind baffle plate along the second direction, and the wind baffle plate is configured with a sliding block in sliding fit with the sliding rail.

[0017] The return assembly is configured as an elastic member, which is arranged in the sliding rail and connected with the sliding block.

[0018] As a further improvement of the present application, the air inlet is provided with an air pressure gauge for detecting the air pressure; the return assembly is configured as an electric drive device for driving the wind baffle plate to move along the first direction according to the detection data of the air pressure gauge.

[0019] As a further improvement of the present application, the cooling device for semiconductor manufacturing further comprises a cooling plate fixed to the bottom of the shell and used for cooling the cooling liquid in the cooling cavity.

[0020] As a further improvement of the present application, the elastic member is arranged on the side of the wind baffle plate facing the first cavity, or the elastic member is arranged on the side of the wind baffle plate facing the second cavity.

[0021] As a further improvement of the present application, the side of the wind baffle plate facing the first cavity and the side of the wind baffle plate facing the second cavity are both provided with the elastic member.

[0022] As a further improvement of the present application, the sliding rail is formed on the two side walls of the shell opposite to each other along the second direction, and the wind baffle plate is outwardly convex along the second direction to form the sliding block.

[0023] Compared with the prior art, the beneficial effects of the present application are that the first cavity with increased volume can provide more buffering space and diffusion space for the high-speed airflow, thereby reducing the turbulence intensity of the high-speed airflow in the first cavity, avoiding the formation of concentrated impact of the high-speed airflow in the first cavity, and increasing the flow path of the high-speed airflow in the first cavity to consume the kinetic energy of the high-speed airflow, thereby reducing the flow rate of the high-speed airflow before reaching the liquid surface of the cooling liquid, avoiding the direct high-speed impact of the airflow on the liquid surface of the cooling liquid, and inhibiting the fluctuation of the liquid surface of the cooling liquid. During the cooling process of the high-humidity vapor in contact with the liquid surface of the cooling liquid, the high-humidity vapor can maintain uniform and continuous stable contact with the cooling liquid through the stable liquid surface of the cooling liquid, thereby improving the uniformity of heat exchange and the gas-liquid separation effect. The problem of reduced cooling efficiency and poor gas-liquid separation effect caused by fluctuation of the liquid surface of the cooling liquid in the prior art is solved. At the same time, when the high-speed airflow drives the air resistance plate to move, part of the kinetic energy of the high-speed airflow is converted into mechanical energy of the air resistance plate, thereby reducing the flow rate of the high-speed airflow in the first cavity and the collision intensity of the high-speed airflow with the air resistance plate, and further weakening the noise generated by the airflow impacting the air resistance plate and the inner wall of the shell, thereby improving the workshop working environment and improving the comfort and work concentration of the operator. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 It is a schematic diagram of the cooling device for semiconductor manufacturing disclosed by the present application as a whole;

[0025] Figure 2 It is a schematic diagram of the cooling device for semiconductor manufacturing disclosed by the present application as a whole; Figure 1 It is a sectional view along the arrow A-A direction;

[0026] Figure 3 It is a schematic diagram of the cooling device for semiconductor manufacturing disclosed by the present application as a whole;

[0027] Figure 4 It is a schematic diagram of the cooling device for semiconductor manufacturing disclosed by the present application as a whole;

[0028] Figure 5 It is a schematic diagram of the cooling device for semiconductor manufacturing disclosed by the present application as a whole;

[0029] Figure 6 It is a schematic diagram of the cooling device for semiconductor manufacturing disclosed by the present application as a whole;

[0030] Figure 7 It is a schematic diagram of the cooling device for semiconductor manufacturing disclosed by the present application as a whole; DETAILED DESCRIPTION

[0031] The present application will be described in detail below in conjunction with the embodiments shown in the drawings, but it should be noted that these embodiments are not limiting to the present application, and equivalent transformations or substitutions of function, method, or structure made by those skilled in the art based on these embodiments are within the scope of protection of the present application.

[0032] The attached drawings in the present invention are not strictly drawn according to actual proportions, and the specific dimensions of each structure can be determined according to actual needs. The attached drawings described in the present invention are only schematic diagrams of the structures. The lines shown in the attached drawings of the specification included in the present invention can be understood as components having a certain actual thickness.

[0033] Please refer to Figures 1 to 7 A specific implementation manner of a cooling device for semiconductor manufacturing disclosed.

[0034] Refer to Figures 1 to 3 As shown, in this embodiment, the cooling device 100 for semiconductor manufacturing includes: a housing 10 with a cooling cavity 11 formed inside, and opposite side walls of the housing 10 along a first direction (such as the direction shown by the X-axis in Figure 3 ) are respectively configured with an air inlet 101 and an air outlet 102; a wind blocking plate 20 movably arranged inside the housing 10 along the first direction, the wind blocking plate 20 divides the cooling cavity 11 into a first cavity 111 and a second cavity 112, and the first cavity 111 and the second cavity 112 are respectively connected to the air inlet 101 and the air outlet 102; a return component 30 arranged on the housing 10 and connected to the wind blocking plate 20, the return component 30 is used to provide a reset driving force for the wind blocking plate 20 along the first direction; an air flow channel 50 for gas circulation is formed between the wind blocking plate 20 and the liquid level M of the coolant in the cooling cavity 11, and the first cavity 111 and the second cavity 112 are connected through the air flow channel 50. When the intake air pressure at the air inlet 101 increases, the air flow pushes the wind blocking plate 20 to move towards the second cavity 112 side to increase the volume of the first cavity 111; when the intake air pressure decreases, the return component 30 drives the wind blocking plate 20 to reset towards the first cavity 111 side.

[0035] When the cleaning system (not shown) causes the exhaust air pressure to increase (especially when the pressure is too high) due to operations such as starting and stopping the heating liquid medicine and adjusting the temperature, the exhaust air flow containing high-humidity vapor enters the first cavity 111 from the air inlet 101. Since the exhaust air pressure is higher than the normal pressure inside the cooling cavity 11 at this time, the pressure gradient formed between the two will drive the exhaust air flow to accelerate and form a high-speed air flow. This high-speed air flow will generate a thrust on the wind blocking plate 20 and push the wind blocking plate 20 along Figure 3The first cavity 111 moves towards the second cavity 112 in the direction indicated by the middle arrow x1, increasing its volume. This increased volume provides a larger buffer and diffusion space for the high-speed airflow, reducing turbulence intensity within the cavity and preventing concentrated impacts. It also increases the flow path, consuming kinetic energy and reducing velocity before reaching the coolant surface M. The airflow in the first cavity 111 enters the second cavity 112 through the airflow channel 50. During this process, the airflow first contacts the coolant in the first cavity 111 for cooling, then contacts the coolant in the second cavity 112 for further cooling. Finally, the cooled airflow is discharged through the outlet 102.

[0036] Because the high-speed airflow is slowed down before reaching the coolant surface M, it avoids the airflow directly impacting the coolant surface M at high speed, thus suppressing the fluctuation of the coolant surface M. During the cooling process, the high-humidity vapor can maintain a uniform and continuous stable contact state with the coolant through the stable coolant surface M, thereby improving the uniformity of heat exchange and the gas-liquid separation effect. This solves the problems of reduced cooling efficiency and poor gas-liquid separation effect caused by coolant surface fluctuation in the prior art.

[0037] Meanwhile, when the high-speed airflow pushes the baffle plate 20 to move, part of the kinetic energy of the high-speed airflow is converted into the mechanical energy of the baffle plate 20, thereby reducing the flow velocity of the high-speed airflow in the first cavity 111 and reducing the collision intensity between the high-speed airflow and the baffle plate 20. This weakens the noise generated by the airflow impacting the baffle plate 20 and the inner wall of the shell 10, improves the workshop working environment, and enhances the comfort and concentration of the operators.

[0038] When the exhaust pressure decreases, the thrust of the exhaust airflow on the baffle plate 20 weakens, and the return assembly 30 releases the reset driving force to push the baffle plate 20 along... Figure 3 The device is reset to the first cavity 111 side in the direction indicated by the middle arrow x2, returning to the initial position of the baffle plate 20 and restoring the volume of the first cavity 111 to normal, ensuring that the semiconductor manufacturing cooling device 100 can operate stably under different air pressure conditions.

[0039] In some examples, the coolant can be ultrapure water or a 25% sodium hydroxide solution. Taking ultrapure water as an example, it cools the airflow through heat exchange and simultaneously dissolves small amounts of acidic vapors such as hydrogen fluoride and sulfuric acid in the airflow. When the high-humidity vapors are buffered and decelerated in the first chamber 111 and come into contact with the coolant surface M, the ultrapure water absorbs a large amount of heat carried by the airflow, achieving rapid cooling of the airflow; at the same time, it uses its own solubility to dissolve and remove small amounts of acidic vapors in the airflow. Furthermore, by replacing the coolant, the problem of coolant solubility saturation can be avoided, preventing a decrease in cooling efficiency or a reduction in acid removal capacity due to the accumulation of impurities.

[0040] In some examples, the parameter Figure 2 and Figure 3 As shown, the semiconductor manufacturing cooling device 100 further includes: a liquid stabilizing assembly 40 disposed at the bottom of the cooling chamber 11, with an airflow channel 50 formed between the air baffle 20 and the liquid stabilizing assembly 40; the liquid stabilizing assembly 40 includes: a plurality of second directions perpendicular to the first direction (such as... Figure 3 The baffles 41 arranged in the direction shown by the Y-axis are immersed in the coolant and their tops are flush with the coolant surface M in the cooling chamber 11. After the high-speed airflow is buffered and its velocity reduced in the first chamber 111, the coolant surface M may still fluctuate during the cooling process when the airflow contacts the coolant surface M. When ripples are generated on the coolant surface M due to airflow contact, the baffles 41, with their tops flush with the coolant surface M in the cooling chamber 11, can block the diffusion path of the ripples on the coolant surface M and limit the fluctuations to the area between adjacent baffles 41, preventing them from spreading to the entire coolant surface M. This ensures that the coolant surface M remains stable. A stable coolant surface M allows high-humidity vapor to maintain a uniform and continuous stable contact with the coolant, improving the uniformity of heat exchange and the gas-liquid separation effect.

[0041] In some examples, the parameter Figure 3 As shown, the bottom of the baffle plate 41 is constructed with multiple guide channels 42, and the guide channels 42 of adjacent baffle plates 41 are staggered along the first direction. When the airflow comes into contact with the coolant surface M, causing local flow of coolant, the guide channels 42 can guide the coolant to flow in an orderly manner, avoiding disordered turbulence caused by airflow disturbance; and through the staggered distribution of the guide channels 42 of adjacent baffle plates 41 along the first direction, that is, as Figure 3 As shown, the position of the guide groove 42a of the first baffle plate 41a in the X-axis direction is completely offset from the position of the guide groove 42b of the second baffle plate 41b in the X-axis direction. This allows the coolant to change direction multiple times as it flows through the multiple guide grooves 42 that are staggered along the first direction, thereby consuming the kinetic energy of the coolant flow and preventing the coolant from forming a through-flow impact flow along the first direction, thus suppressing the fluctuation of the coolant surface M caused by the coolant's own flow.

[0042] In some examples, the parameter Figure 7 As shown, an inlet 103 and a drain 104 are formed at the bottom of the housing 10. The inlet 103 is used to replenish fresh coolant into the cooling chamber 11. The inlet 103 can be positioned near the cooling plate 60, so that the fresh coolant is quickly cooled to the target temperature after entering the cooling chamber 11, and then evenly diffused throughout the entire cooling chamber 11 through the guide channel 42. The drain 104 is used to discharge waste liquid after absorbing heat and dissolving or neutralizing acidic vapors. The drain 104 can be positioned at the end opposite to the inlet 103, so that the waste liquid in the cooling chamber 11 is discharged under the guiding action of the guide channel 42, avoiding the accumulation of waste liquid at the bottom of the cooling chamber 11.

[0043] In some examples, the parameter Figure 2 , Figure 5 and Figure 6 As shown, the top of the wind baffle 20 is attached to the top side wall of the housing 10 to form a sealed sliding, and the side of the wind baffle 20 is attached to the two opposite side walls of the housing 10 along the second direction to form a sealed sliding.

[0044] The sealing and sliding fit between the baffle plate 20 and the housing 10 ensures that all high-speed airflow entering the first cavity 111 is buffered and decelerated by the baffle plate 20, and then enters the second cavity 112 only through the airflow channel 50. This ensures that the airflow is in full contact with the coolant surface M and prevents uncooled airflow from being directly discharged. Furthermore, the close fit and guidance between the baffle plate 20 and the housing 10 ensures that the baffle plate 20 can only move smoothly in the first direction, avoiding deflection or jamming due to air pressure impact. This ensures that when the exhaust pressure increases, the baffle plate 20 can move smoothly to the second cavity 112 to increase the volume of the first cavity 111, and when the exhaust pressure decreases, it can accurately reset under the drive of the return component 30, ensuring that the semiconductor manufacturing cooling device 100 can operate stably under different air pressure conditions.

[0045] In some examples, in some examples, the parameter Figure 3 As shown, a removable cover plate 13 is formed on the top of the housing 10, and the top of the baffle plate 20 is attached to the inner wall of the cover plate 13 to form a sealed sliding connection. The cover plate 13 can be connected to the housing 10 by bolts, clips, etc., so as to facilitate the inspection and replacement of the internal components of the semiconductor manufacturing cooling device 100.

[0046] In some examples, the parameter Figure 2 and Figure 4As shown, the housing 10 is configured with a slide rail 12 extending in a first direction, the slide rail 12 being located on both sides of the wind baffle 20 in a second direction, and the wind baffle 20 being configured with a slider 21 that forms a sliding engagement with the slide rail 12; the return assembly 30 is configured as an elastic element 31 (e.g., a spring), the elastic element 31 being disposed in the slide rail 12 and connected to the slider 21.

[0047] When the exhaust pressure increases, the high-speed airflow pushes the baffle plate 20 to move towards the second cavity 112. The baffle plate 20 slides along the slide rail 12 via the slider 21. The slide rail 12 on both sides of the baffle plate 20 forms a double-sided guide, ensuring that the baffle plate 20 can only slide in a straight line in the first direction. This avoids changes in the sealing gap due to unilateral force (for example, failure of the sealing sliding fit between the side of the baffle plate 20 and the housing 10). It also prevents the baffle plate 20 from tilting or getting stuck due to airflow impact. This ensures that the sealing sliding fit between the baffle plate 20 and the top and side walls of the housing 10 remains stable during the movement of the baffle plate 20, preventing airflow from leaking out from the gaps on both sides of the baffle plate 20.

[0048] Simultaneously, as the slider 21 slides within the slide rail 12, it synchronously causes the elastic elements 31 on both sides to undergo elastic deformation, converting part of the kinetic energy of the airflow into the elastic potential energy of the elastic elements 31. Furthermore, the elastic potential energy stored in the elastic elements 31 on both sides is evenly distributed, further weakening the impact force of the airflow. When the exhaust pressure decreases, the thrust of the airflow on the baffle plate 20 weakens. At this time, the elastic elements 31 within the slide rail 12 release their elastic potential energy, generating a symmetrical reset driving force on both sides of the baffle plate 20. This force pushes the slider 21 in the opposite direction along the slide rail 12 toward the first cavity 111, preventing the baffle plate 20 from tilting or jamming due to excessive elastic force on one side. This ensures that the baffle plate 20 accurately returns to its initial position and that the volume of the first cavity 111 returns to normal, guaranteeing that the semiconductor manufacturing cooling device 100 can operate stably under different air pressure conditions.

[0049] In some examples, the elastic element 31 is disposed on the side of the wind baffle 20 facing the first cavity 111, or the elastic element 31 is disposed on the side of the wind baffle 20 facing the second cavity 112.

[0050] When the elastic element 31 is positioned on the side of the baffle plate 20 facing the first cavity 111 (this state is not shown), one end of the elastic element 31 is connected to the baffle plate 20, and the other end is fixed to the slide rail 12. At this time, when the exhaust gas pressure increases, the high-speed airflow pushes the baffle plate 20 to move towards the second cavity 112, and the elastic element 31 will be stretched synchronously to convert part of the kinetic energy of the airflow into the elastic potential energy of the elastic element 31; when the air pressure decreases, the airflow thrust weakens, the elastic element 31 releases its elastic potential energy, and pulls the baffle plate 20 back to the first cavity 111.

[0051] When the elastic element 31 is positioned on the side of the baffle plate 20 facing the second cavity 112 (this state is not shown), one end of the elastic element 31 is connected to the baffle plate 20, and the other end is fixed to the slide rail 12. At this time, when the exhaust pressure increases, the high-speed airflow pushes the baffle plate 20 to move towards the second cavity 112, and the elastic element 31 will be compressed synchronously to convert part of the kinetic energy of the airflow into the elastic potential energy of the elastic element 31; when the air pressure decreases, the airflow thrust weakens, the elastic element 31 releases its elastic potential energy, and pushes the baffle plate 20 back to the first cavity 111.

[0052] In some examples, the parameter Figure 5 As shown, elastic members 31 are provided on both the side of the wind baffle 20 facing the first cavity 111 and the side of the wind baffle 20 facing the second cavity 112.

[0053] When the exhaust pressure increases, the high-speed airflow pushes the baffle plate 20 to move towards the second cavity 112. The elastic element 31 of the baffle plate 20 facing the second cavity 112 is compressed by the slider 21 and stores elastic potential energy. At the same time, the elastic element 31 facing the first cavity 111 is stretched and stores elastic potential energy. The elastic elements 31 on both sides of the baffle plate 20 jointly bear and consume the airflow energy, forming a double buffer for the high-speed airflow to weaken the impact of the airflow and prevent the baffle plate 20 from shaking due to excessive force. At the same time, with the guidance of the slide rails 12 on both sides of the baffle plate 20, the baffle plate 20 moves smoothly along the first direction. When the exhaust pressure decreases, the airflow thrust weakens, and the elastic elements 31 on both sides release elastic potential energy simultaneously. The elastic element 31 facing the second cavity 112 pushes the slider 21, and the elastic element 31 facing the first cavity 111 pulls the slider 21. The bidirectional force of the elastic elements 31 on both sides forms a balanced and stable reset driving force on the wind baffle 20, so as to drive the wind baffle 20 to accurately and smoothly return to the initial position.

[0054] In some examples, the parameter Figure 4 and Figure 6 As shown, the slide rail 12 is formed on the two opposite side walls of the housing 10 along the second direction, and the wind baffle 20 protrudes outward along the second direction to form the slider 21.

[0055] The slider 21 and the slide rail 12 form an embedded sliding fit. The outer side of the slider 21 and the inner side of the slide rail 12 are in close contact. When the high-speed airflow pushes the wind baffle 20 to move along the first direction, the sliding fit between the sliders 21 on both sides and the slide rail 12 prevents the wind baffle 20 from tilting or getting stuck, ensuring that the sealing sliding fit between the wind baffle 20 and the housing 10 is always tight, and preventing airflow from leaking through the gap.

[0056] In some examples, the air inlet 101 is provided with a barometer (not shown) for detecting the intake air pressure; the return assembly 30 is configured as an electric drive (not shown) for driving the baffle 20 to move in a first direction based on the barometer's detection data.

[0057] When the barometer detects an increase (especially a sudden increase) in the air pressure at the air inlet 101, the electric drive unit (e.g., an electric cylinder) calculates the required adjustment amount in real time based on the pressure data. The specific algorithm for calculating the adjustment amount based on the pressure data is existing technology and will not be described in detail here. The electric drive unit actively drives the wind deflector 20 along... Figure 3 The baffle 20 moves towards the second cavity 112 in the direction indicated by the middle arrow x1. The moving speed and distance of the baffle 20 match the increase in air pressure. For example, it moves quickly when the air pressure rises sharply to rapidly expand the volume of the first cavity 111, and moves slowly when the air pressure rises gradually to avoid over-adjustment. This ensures that the first cavity 111 can provide buffer and diffusion space that is compatible with the high-speed airflow in an instant, quickly reducing the intensity and velocity of airflow turbulence and suppressing the impact of airflow on the coolant surface M. When the barometer detects a decrease in air pressure at the air inlet 101, the electric drive device reverses the direction of the baffle 20 based on the pressure drop data. Figure 3 The wind deflector 20 is reset to the first cavity 111 in the direction indicated by the middle arrow x2. The electric drive device adjusts the driving force and speed to ensure that the wind deflector 20 is smoothly restored to the initial position, so as to avoid secondary disturbance of the airflow in the first cavity 111 due to too fast reset.

[0058] In some examples, the parameter Figure 2 and Figure 7 As shown, the semiconductor manufacturing cooling device 100 also includes a cooling plate 60 fixed to the bottom of the housing 10 and used to cool the coolant in the cooling chamber 11. When the airflow is buffered and decelerated through the first chamber 111 and comes into contact with the coolant surface M through the airflow channel 50, it will transfer a large amount of heat carried by itself to the coolant, causing the coolant temperature to gradually rise. The cooling plate 60 can continuously absorb the heat in the coolant, keeping the coolant in a suitable cooling temperature range, avoiding the reduction of cooling capacity due to the increase in coolant temperature, and ensuring efficient heat exchange during the contact of the airflow with the coolant surface M.

[0059] The detailed descriptions listed above are merely specific descriptions of feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. All equivalent embodiments or modifications made without departing from the spirit of the present invention should be included within the scope of protection of the present invention.

[0060] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0061] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A cooling device for semiconductor manufacturing, characterized in that, include: The shell forms a cooling cavity inside, and the two side walls of the shell opposite each other along the first direction are respectively constructed with an air inlet and an air outlet; A baffle plate is movably disposed inside the housing along the first direction, the baffle plate dividing the cooling cavity into a first cavity and a second cavity, the first cavity and the second cavity being respectively connected to the air inlet and the air outlet; A return assembly disposed on the housing and connected to the wind baffle plate, the return assembly being used to provide a reset driving force for the wind baffle plate along the first direction; An airflow channel for gas circulation is formed between the baffle plate and the coolant surface in the cooling cavity. The first cavity and the second cavity are connected through the airflow channel. When the intake air pressure at the air inlet increases, the airflow pushes the baffle plate to move towards the second cavity to increase the volume of the first cavity. When the intake air pressure decreases, the return assembly drives the baffle plate to reset towards the first cavity. The cooling device for semiconductor manufacturing further includes: a liquid stabilizing component disposed at the bottom of the cooling cavity, wherein the airflow channel is formed between the air baffle and the liquid stabilizing component; The liquid stabilizing component includes: a plurality of flow-blocking plates arranged along a second direction perpendicular to the first direction, the flow-blocking plates being immersed in the coolant and their tops being flush with the surface of the coolant; The bottom of the flow-blocking plate is constructed with multiple flow-guiding grooves, and the flow-guiding grooves of adjacent flow-blocking plates are staggered along the first direction.

2. The cooling apparatus for semiconductor manufacturing according to claim 1, characterized in that, The top of the wind baffle plate is attached to the top side wall of the housing to form a sealed sliding connection, and the side of the wind baffle plate is attached to the two opposite side walls of the housing along the second direction to form a sealed sliding connection.

3. The cooling apparatus for semiconductor manufacturing according to claim 2, characterized in that, The housing is configured with a slide rail extending along the first direction, the slide rail being located on both sides of the wind baffle along the second direction, and the wind baffle being configured with a slider that forms a sliding engagement with the slide rail; The return component is configured as an elastic element, which is disposed within the slide rail and connected to the slider.

4. The cooling apparatus for semiconductor manufacturing according to claim 2, characterized in that, The air inlet is equipped with a barometer for detecting the intake air pressure; the return component is configured as an electric drive device for driving the wind baffle to move along a first direction based on the detection data of the barometer.

5. The cooling apparatus for semiconductor manufacturing according to claim 1, characterized in that, The semiconductor manufacturing cooling device further includes a cooling plate fixed to the bottom of the housing and used to cool the coolant in the cooling cavity.

6. The cooling apparatus for semiconductor manufacturing according to claim 3, characterized in that, The elastic element is disposed on the side of the wind baffle facing the first cavity, or the elastic element is disposed on the side of the wind baffle facing the second cavity.

7. The cooling apparatus for semiconductor manufacturing according to claim 3, characterized in that, The elastic element is provided on both the side of the wind baffle facing the first cavity and the side of the wind baffle facing the second cavity.

8. The cooling apparatus for semiconductor manufacturing according to claim 3, characterized in that, The slide rail is formed on the two opposite side walls of the housing along the second direction, and the wind baffle plate protrudes outward along the second direction to form the slider.

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