Flexible circuit board, electronic equipment and manufacturing method of flexible circuit board

Abstract

The invention relates to a flexible circuit board, electronic equipment and a manufacturing method of the flexible circuit board, the flexible circuit board comprises a plurality of sub-board sections, two adjacent sub-board sections are electrically connected, and the plurality of sub-board sections comprise at least two adjacent sub-board sections which are arranged at an angle; each board dividing section is provided with a board face perpendicular to the thickness direction of the board dividing section, and the multiple board dividing sections comprise at least two adjacent board dividing sections with different board face numbers for arranging components. The utilization rate of the jointed board of the flexible circuit board is high.

Description

Technical Field

[0001] This disclosure relates to the field of flexible circuit board technology, and more specifically, to a flexible circuit board, an electronic device, and a method for manufacturing a flexible circuit board. Background Technology

[0002] In related technologies, FPC boards, also known as flexible printed circuit boards, are widely used in electronic devices. With the increasing demand for flexible printed circuit boards, their shapes are gradually becoming irregular, resulting in lower panel utilization during production. Summary of the Invention

[0003] The purpose of this disclosure is to provide a flexible circuit board with high panel utilization.

[0004] To achieve the above objectives, this disclosure provides a flexible circuit board including multiple sub-segments, with adjacent sub-segments electrically connected. The multiple sub-segments include at least two adjacent sub-segments arranged at an angle. Each sub-segment has a surface perpendicular to its own thickness direction, and the multiple sub-segments include at least two adjacent sub-segments with different numbers of surface areas for arranging components.

[0005] Optionally, in two adjacent board segments with different numbers of board surfaces where components are arranged, components are arranged on both board surfaces of one board segment, and components are arranged on one of the two board surfaces of the other board segment.

[0006] Optionally, the multiple plate segments include at least two adjacent and parallel plate segments.

[0007] Optionally, the plate segment has a side surface that is perpendicular to the width direction of the plate segment, and in two adjacent plate segments that are set at an angle, the two adjacent side surfaces are set at an angle.

[0008] Optionally, in two adjacent plate segments that are set at an angle, the two adjacent plate surfaces are set at an angle.

[0009] Optionally, a connecting plate is provided on the surface of the sub-section, and a connector is provided on the connecting plate, and two adjacent connectors on two adjacent sub-sections are plugged in.

[0010] Optionally, a connecting plate is provided on the surface of the plate segment, and adjacent connecting plates on adjacent plate segments are welded together.

[0011] Optionally, a bonding adhesive is provided between the component and the corresponding board surface.

[0012] According to a second aspect of this disclosure, an electronic device is provided, including the flexible circuit board as described above.

[0013] According to a third aspect of this disclosure, a method for manufacturing a flexible circuit board is provided, the method comprising:

[0014] Multiple segments of a molded flexible circuit board;

[0015] In at least two sub-board segments, a mounting plate is provided on one of the board surfaces of each sub-board segment, a first solder is provided on the mounting plate, components are mounted on the first solder, and at least two sub-board segments after mounting components are respectively oven-cured.

[0016] On the other surface of at least one sub-section after the above-mentioned reflow oven curing, a mounting plate is set, a first solder is set on the mounting plate, components are mounted on the first solder, and at least one sub-section after mounting the components is reflow oven cured again.

[0017] Optionally, the manufacturing method includes:

[0018] When the first solder is set on the mounting plate, the second solder is set on one of the two adjacent connecting plates in two pre-set adjacent sub-sections. The connecting plate is set on the same plate surface as the corresponding mounting plate.

[0019] After at least one sub-segment of the board is re-cured in an oven, multiple sub-segments of the flexible circuit board are placed in a preset posture and a preset position. Flux is applied to the second solder of one of the two adjacent connecting pads in two preset adjacent sub-segments, and the other connecting pad is mounted on the corresponding flux.

[0020] The multiple slabs arranged above are then cured in an oven.

[0021] Optionally, the melting point of the flux is set to be lower than that of the first solder.

[0022] Optionally, the manufacturing method includes:

[0023] After at least one board segment has been re-cured in a reflow oven after mounting the components, a second solder is applied to one of the two adjacent connecting pads in two pre-set adjacent board segments.

[0024] Multiple segments of the flexible circuit board are placed in a preset posture and position, and the other connecting pad of two adjacent connecting pads in two preset adjacent segments is attached to the corresponding second solder.

[0025] The multiple slabs arranged above are then cured in an oven.

[0026] Optionally, the melting point of the second solder is set to be lower than that of the first solder.

[0027] Optionally, the manufacturing method includes:

[0028] When the first solder is set on the mounting plate, the second solder is set on one of the two adjacent connecting plates in two pre-set adjacent sub-sections. The connecting plate is set on the same plate surface as the corresponding mounting plate.

[0029] After at least one segment of the board is re-cured in an oven after the components are mounted, multiple segments of the flexible circuit board are placed in a preset posture and a preset position. Flux is applied to the second solder of one of the two adjacent connecting pads in two preset adjacent segments, and the other connecting pad is placed on the corresponding flux.

[0030] Laser brazing equipment is used to heat the second solder and flux between two adjacent connecting pads.

[0031] Optionally, the manufacturing method includes:

[0032] Each segment of the flexible circuit board is manufactured using a panelization process to form multiple segments of the flexible circuit board.

[0033] The segmented sections are then divided into plates.

[0034] Optionally, the manufacturing method includes:

[0035] Before placing multiple segments of the flexible circuit board in a preset posture and position, the segments are separated.

[0036] Optionally, the manufacturing method includes:

[0037] Apply adhesive between the components and the corresponding board surface;

[0038] The PCB sections with adhesive bonding are cured using a baking device.

[0039] The flexible circuit board provided in this disclosure has the following beneficial effects:

[0040] By designing the flexible circuit board to include multiple segments, the irregularly shaped flexible circuit board can include multiple relatively regular segments. Here, the relatively regular segments will be arranged more compactly when splicing, thus the splicing utilization rate of the segments is higher. Therefore, compared with splicing the entire flexible circuit board, the present disclosure can improve the splicing utilization rate of the flexible circuit board by splicing multiple segments, that is, the splicing utilization rate of the flexible circuit board of the present disclosure is higher.

[0041] In addition, since the bending point of the flexible circuit board has a significant impact on the panel utilization rate, this disclosure designs multiple panel segments as including at least two adjacent panel segments set at an angle, which can cut the flexible circuit board at the bending point, thereby further improving the panel utilization rate of the flexible circuit board.

[0042] Furthermore, since flexible circuit boards include components that are fixed to the board surface, for each board segment, the components on the two boards need to be reflow oven-cured separately. That is, a board segment with components on a single board surface requires one reflow oven-curing cycle, while a board segment with components on two board surfaces requires two reflow oven-curing cycles. Thus, at least two adjacent board segments with different numbers of board surfaces for component placement represent different reflow oven-curing cycles. Here, each board segment can be reflow oven-cured separately when fixing components; that is, the reflow oven-curing of each board segment is independent and does not affect each other. Therefore, compared to reflowing the entire flexible circuit board twice, this disclosure can reduce the number of reflow oven-curing cycles for board segments with components on non-double board surfaces, thereby effectively improving the yield rate of flexible circuit boards.

[0043] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0044] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings:

[0045] Figure 1 This is a schematic diagram of the structure of a flexible circuit board according to the first embodiment of this disclosure;

[0046] Figure 2 This is a schematic diagram of the structure of a flexible circuit board according to the second embodiment of the present disclosure;

[0047] Figure 3 This is a schematic diagram of the structure of a flexible circuit board according to the third embodiment of this disclosure;

[0048] Figure 4 This is a schematic diagram of the structure of a flexible circuit board according to the fourth embodiment of this disclosure;

[0049] Figure 5 This is a schematic diagram of the structure of a flexible circuit board with components provided according to an embodiment of the present disclosure;

[0050] Figure 6 This is a flowchart of the manufacturing process of a flexible circuit board according to an embodiment of the present disclosure;

[0051] Figure 7This is another flowchart of the manufacturing process of a flexible circuit board according to an embodiment of this disclosure;

[0052] Figure 8 This is another flowchart of the manufacturing process of flexible circuit boards according to embodiments of the present disclosure.

[0053] Explanation of reference numerals in the attached figures

[0054] 1-Separation section, 11-Board surface, 12-Side surface, 13-Connecting plate, 14-Mounting plate, 15-First solder, 16-Second solder, 17-Fluoride, 18-Connecting adhesive, 2-Components, 3-Connector, 10-First separation section, 20-Second separation section. Detailed Implementation

[0055] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0056] In this disclosure, unless otherwise stated, directional terms such as "inner" and "outer" refer to the inner and outer contours of each component itself. The terms "first" and "second" are used to distinguish one element from another and do not imply sequence or importance. Furthermore, in the following description, when referring to the accompanying drawings, the same reference numerals in different drawings denote the same or similar elements, which will not be repeated here.

[0057] According to some embodiments of this disclosure, a flexible circuit board is provided, with reference to... Figures 1 to 7 As shown, the flexible circuit board includes multiple sub-segments 1, two adjacent sub-segments 1 are electrically connected, the multiple sub-segments 1 include at least two adjacent sub-segments 1 arranged at an angle; the sub-segments 1 have a board surface 11 perpendicular to its own thickness direction, and the multiple sub-segments 1 include at least two adjacent sub-segments 1 with different numbers of board surfaces for arranging components 2.

[0058] The flexible circuit board provided in this disclosure has the following beneficial effects:

[0059] By designing the flexible circuit board to include multiple sub-segments 1, the irregularly shaped flexible circuit board can include multiple relatively regular sub-segments 1. Here, the relatively regular sub-segments 1 will be arranged more compactly when splicing, thus the splicing utilization rate of the sub-segments 1 is higher. Therefore, compared with splicing the entire flexible circuit board, the present disclosure can improve the splicing utilization rate of the flexible circuit board by splicing multiple sub-segments 1, that is, the splicing utilization rate of the flexible circuit board of the present disclosure is higher.

[0060] In addition, since the bending point of the flexible circuit board has a significant impact on the panel utilization rate, this disclosure designs multiple panel segments 1 as including at least two adjacent panel segments 1 arranged at an angle, which can cut the flexible circuit board at the bending point, thereby further improving the panel utilization rate of the flexible circuit board.

[0061] Furthermore, since the flexible circuit board includes components 2, which are fixed on the board surface 11, for each segment 1, the components 2 on the two board surfaces 11 need to be reflowed for curing separately. That is, a segment 1 with components 2 on a single board surface 11 needs to be reflowed once, and a segment 1 with components 2 on two board surfaces 11 needs to be reflowed twice. Thus, at least two adjacent segments 1 with different numbers of board surfaces 11 where components 2 are arranged represent at least two adjacent segments 1 with different numbers of reflows. Here, each segment 1 can be reflowed separately when fixing the components 2, meaning that the reflows of each segment 1 are independent and do not affect each other. In this way, compared to reflowing the entire flexible circuit board twice, this disclosure can reduce the number of reflows for segments 1 with components 2 on non-double board surfaces 11, thereby effectively improving the yield of the flexible circuit board, avoiding component 2 failure after multiple reflows, and preventing internal wiring breakage in segment 1.

[0062] Furthermore, the size of the sectional section 1 is smaller than that of the overall flexible circuit board, which facilitates the production and transportation of the sectional section 1, and the sectional section 1 is not easily torn during the production and transportation process.

[0063] Furthermore, compared to producing the flexible circuit board as a whole, this disclosure produces the sub-segment 1 independently. When any sub-segment 1 has an abnormal problem, it can be repaired or replaced, while other sub-segments 1 can be retained. This reduces the scrap rate of the flexible circuit board and lowers the rework cost.

[0064] Furthermore, by producing each segment 1 independently, it is easy to control the flatness and expansion rate of the corresponding segment 1. As a result, the overall flatness of the assembled flexible circuit board is high and the expansion rate is low, thus resulting in a high yield rate of the flexible circuit board.

[0065] Furthermore, producing each segment 1 independently can reduce the manufacturing difficulty of the corresponding fixture for each segment 1, thereby helping to reduce the manufacturing cost of flexible circuit boards.

[0066] It should be noted that the electrical connection between two adjacent board segments 1 refers to the continuity of their circuits, which ensures the performance of the flexible circuit board. Furthermore, two adjacent board segments 1 with different numbers of board surfaces 11 for arranging components 2 can be understood as follows: one board segment 1 has one board surface 11 for arranging components 2, meaning one board surface 11 of this segment 1 has components 2, while the other board surface 11 does not; the other board segment 1 has two board surfaces 11 for arranging components 2, meaning both board surfaces 11 of this segment 1 have components 2; or, one board segment 1 has zero board surfaces 11 for arranging components 2, meaning neither board surface 11 of this segment 1 has components 2; the other board segment 1 has one or two board surfaces 11 for arranging components 2. In some embodiments, refer to... Figure 4 As shown, in two adjacent board segments 1 with different numbers of board surfaces 11 where components 2 are arranged, both board surfaces 11 of one board segment 1 are arranged with components 2, and one of the two board surfaces 11 of the other board segment 1 is arranged with components 2.

[0067] It should be noted that, in this disclosure, multiple board segments 1 may include two board segments 1 with different shapes and / or different sizes, which can further improve the panel utilization rate of flexible circuit boards. In addition, the aforementioned multiple may refer to two, three or even more, and this disclosure does not limit this.

[0068] The aforementioned component 2 can be one of a capacitor, resistor, filter, or chip, and this disclosure does not impose any limitations on it. After being fixed to the board surface 11, the component 2 can conduct electricity with the circuit in the corresponding sub-board segment 1.

[0069] In some embodiments of this disclosure, reference is made to Figure 1 As shown, the plate segment 1 may have a side surface 12, which is perpendicular to the width direction of the plate segment 1. In two adjacent plate segments 1 arranged at an angle, the two adjacent side surfaces 12 may be arranged at an angle. In this case, the included angle between the two plate segments 1 can be 90°. In some other embodiments of this disclosure, refer to... Figure 2 As shown, in two adjacent segment 1s arranged at an angle, the two adjacent board surfaces 11 are arranged at an angle. In this case, the included angle between the two segment 1s can be greater than 90°. Since, in this embodiment, the two adjacent segment 1s are stacked in the thickness direction, the two adjacent segment 1s have a greater impact on the panel utilization rate when the flexible circuit board is assembled as a whole. Therefore, assembling the two adjacent segment 1s separately can effectively improve the panel utilization rate of the flexible circuit board. Of course, in this disclosure, the two adjacent segment 1s can be arranged at an angle in other forms, and this disclosure does not limit this arrangement.

[0070] In some embodiments of this disclosure, reference is made to Figure 3 and Figure 4 As shown, the plurality of plate segments 1 may include at least two adjacent and parallel plate segments 1. Here, two adjacent and parallel plate segments 1 can be understood as belonging to the same part of a rectangular plate. This arrangement can prevent any one plate segment 1 from being too long, reducing the risk of scrapping the plate segment 1. Here, the lengths of two adjacent parallel plate segments 1 can be equal, and this disclosure does not impose any limitation on this.

[0071] In some embodiments of this disclosure, reference is made to Figure 5 As shown, a connecting plate 13 can be provided on the board surface 11 of the sub-board segment 1, and a connector 3 is provided on the connecting plate 13. Adjacent connectors 3 on two adjacent sub-board segments 1 are plugged in. In this way, by using the plugging of two connectors 3, on the one hand, the circuit of two adjacent sub-board segments 1 can be made conductive, and on the other hand, the two adjacent sub-board segments 1 can be detachably connected, which is beneficial for replacing faulty sub-board segments 1. In some embodiments, the distance between the connector 3 and the component 2 on the same board surface 11 can be greater than or equal to 0.4mm to 0.8mm, for example greater than or equal to 0.6mm, to reduce the risk of interference between the two connectors 3 and the component 2 when plugged in.

[0072] In other embodiments of this disclosure, reference is made to Figures 6 to 8 As shown, a connecting plate 13 is provided on the surface 11 of the sub-board segment 1. Adjacent connecting plates 13 on adjacent sub-board segments 1 can be welded, for example by reflow soldering or laser brazing. This disclosure does not limit this. Here, by welding adjacent connections, adjacent sub-board segments 1 can be fixed while ensuring circuit conduction. In some embodiments, the connecting plate 13 can be a rectangular plate with a length of at least 0.3mm to 0.5mm, for example, at least 0.4mm. This disclosure does not limit this.

[0073] In some embodiments of this disclosure, reference is made to Figure 6 As shown, a connecting adhesive 18 can be provided between the component 2 and the corresponding board surface 11. In this way, the connecting adhesive 18 can improve the stability of the component 2 after it is connected to the board segment 1.

[0074] According to a second aspect of this disclosure, an electronic device is provided, including the flexible circuit board as described above. This electronic device possesses all the beneficial effects of the flexible circuit board described above, which will not be elaborated upon herein. In some embodiments, the electronic device may be a wearable device, such as a watch, bracelet, Bluetooth headset, smart glasses, ring, etc., or it may be a mobile phone, home appliance, vehicle, etc., and this disclosure does not impose any limitations thereon.

[0075] According to a third aspect of this disclosure, a method for manufacturing a flexible circuit board is provided, the method being used to manufacture the flexible circuit board as described above, with reference to... Figures 6 to 8 As shown, the manufacturing method includes: forming multiple segments 1 of a flexible circuit board; in at least two segments 1, a mounting plate 14 is provided on one of the board surfaces 11 of each segment 1, a first solder 15 is provided on the mounting plate 14, components 2 are mounted on the first solder 15, and the at least two segments 1 after mounting the components 2 are respectively oven-cured; on the other board surface 11 of the at least one segment 1 after oven curing, a mounting plate 14 is provided, a first solder 15 is provided on the mounting plate 14, components 2 are mounted on the first solder 15, and the at least one segment 1 after mounting the components 2 is again oven-cured.

[0076] Through the above technical solution, in the manufacturing method of the flexible circuit board provided in this disclosure, multiple sub-segments 1 can be formed first. Then, when the components 2 are mounted and fixed, each sub-segment 1 is independently subjected to reflow oven curing. In this way, compared with performing reflow oven curing twice on the entire flexible circuit board, this disclosure can reduce the number of reflow oven curing times for the sub-segments 1 on which the components 2 are located on the non-double-sided board 11, thereby effectively improving the yield of the flexible circuit board. For example, in some embodiments, refer to Figures 6 to 8 As shown, multiple board segments 1 may include two board segments 1, which are respectively constructed as a first board segment 10 and a second board segment 20. Here, both surfaces 11 of the first board segment 10 are provided with components 2, and one surface 11 of the second board segment 20 is provided with components 2. For the first board segment 10, a mounting pad 14 can be first provided on one surface 11, and a first solder 15 can be applied to the mounting pad 14. Components 2 are then mounted on the first solder 15. Subsequently, the first board segment 10 is independently reflow oven cured. After that, the other surface 11 of the first board segment 10 is reflow oven cured. A mounting tray 14 is provided on the board surface 11, and a first solder 15 is applied to the mounting tray 14. Components 2 are then mounted on the first solder 15. Subsequently, the first sub-section 10 is independently reflowed for curing. This completes the mounting of components 2 on the first sub-section 10. For the second sub-section 20, a mounting tray 14 can be provided on one of the board surfaces 11, and the first solder 15 is applied to the mounting tray 14. Components 2 are then mounted on the first solder 15. Subsequently, the second sub-section 20 is independently reflowed for curing. This completes the mounting of components 2 on the second sub-section 20.

[0077] In some embodiments of this disclosure, reference is made to Figure 6As shown, the above manufacturing method may include: when the first solder 15 is applied to the mounting plate 14, a second solder 16 is applied to one of the two adjacent connecting plates 13 in two pre-set adjacent sub-sections 1. The connecting plate 13 is set on the same board surface 11 as the corresponding mounting plate 14. This can save processes and improve the production efficiency of flexible circuit boards. For example, when the mounting plate 14 is set on the other board surface 11 of the first sub-section 10 and the first solder 15 is applied to the mounting plate 14, the connecting plate 13 can be set on the other board surface 11, and the second solder 16 can be applied to the connecting plate 13; in the next... After at least one segment 1 of the board, after mounting the component 2, is reflow oven cured, the second solder 16 has been cured. Multiple segments 1 of the flexible circuit board are placed in a preset posture and position. Flux 17 is applied to the second solder 16 of one of the two adjacent connecting pads 13 in two preset adjacent segments 1, and the other connecting pad 13 is mounted on the corresponding flux 17. The multiple segments 1 are then reflow oven cured. This allows adjacent connecting pads 13 to be soldered using a reflow oven. The addition of flux 17 ensures that the soldering of adjacent connecting pads 13 is achieved even after the second solder 16 has cured. After the multiple segments 1 are reflow oven cured, the flexible circuit board of this disclosure is formed. Compared to using connectors to connect adjacent segments, this embodiment eliminates the step of manually setting connectors, thus saving on the manufacturing cost of the flexible circuit board and improving its manufacturing efficiency. In addition, compared to using laser brazing to connect two adjacent connecting pads, in the above embodiment, the other connecting pad 13 can be attached to the corresponding flux 17, thereby improving the manufacturing efficiency of flexible circuit boards.

[0078] It should be noted that "segment 1 is placed in a preset posture" refers to the actual posture of segment 1 on the flexible circuit board, including the posture of segment 1 in all six degrees of freedom; "segment 1 is placed in a preset position" refers to the actual position of segment 1 on the flexible circuit board. Furthermore, both the first solder 15 and the second solder 16 can be solder paste, and this disclosure does not limit their application. In some embodiments, the thickness of the first solder 15 can be at least 0.02mm to 0.10mm, for example, at least 0.03mm, 0.06mm, 0.08mm, etc., and this disclosure does not limit their application. Correspondingly, the thickness of the second solder 16 can be at least 0.02mm to 0.10mm, for example, at least 0.03mm, 0.06mm, 0.08mm, etc., and this disclosure does not limit their application.

[0079] It should also be noted that during the reflow oven curing process, the cooling rate of the first solder 15 can be at least 1℃ / s to 3℃ / s, for example, at least 2℃ / s. Correspondingly, the cooling rate of the second solder 16 can be at least 1℃ / s to 3℃ / s, for example, at least 2℃ / s. This disclosure does not impose any limitations on this.

[0080] In some embodiments of this disclosure, multiple segments 1 of a flexible circuit board can be placed in a reflow fixture in a preset posture and position. The reflow fixture can be oxidized and can be equipped with magnetic components to prevent the multiple segments 1 from loosening or shifting.

[0081] In some embodiments of this disclosure, when the multiple plate segments 1 arranged above are passed through the oven for curing, an oven temperature plate can be set up, and a thermocouple can be set on the oven temperature plate to test the poor oven temperature.

[0082] In some embodiments, the melting point of flux 17 can be set to be lower than that of the first solder 15. In this way, the first solder 15 will not melt when flux 17 is cured in a reflow oven, thereby ensuring the stability of the connection between component 2 and board segment 1.

[0083] In some embodiments of this disclosure, reference is made to Figure 7 and Figure 8 As shown, the manufacturing method may include: after at least one sub-segment 1 of the flexible circuit board is reflowed and cured, a second solder 16 is applied to one of the two adjacent connecting pads 13 in two pre-defined adjacent sub-segments 1; multiple sub-segments 1 of the flexible circuit board are arranged in a pre-defined orientation and position, and the other connecting pad 13 of two adjacent connecting pads 13 in two pre-defined adjacent sub-segments 1 is applied to the corresponding second solder 16; the multiple sub-segments 1 are reflowed and cured. Here, since the second solder 16 is applied to the connecting pads 13 after the component 2 is mounted, i.e., the second solder 16 is not cured, the second solder 16 can serve to weld the two adjacent connecting pads 13 when the multiple sub-segments 1 are reflowed and cured. This arrangement eliminates the need for the step of applying flux 17, thereby reducing the number of reflows and lowering the risk of failure of the component 2 and the sub-segment 1.

[0084] In some embodiments, the melting point of the second solder 16 can be set to be lower than that of the first solder 15. In this way, when the second solder 16 is cured in the furnace, the first solder 15 will not melt, thereby ensuring the stability of the connection between the component 2 and the board segment 1.

[0085] In some embodiments of this disclosure, reference is made to Figure 6As shown, the manufacturing method may include: when setting the first solder 15 on the mounting plate 14, setting the second solder 16 on one of the two adjacent connecting plates 13 in two pre-set adjacent sub-segments 1, the connecting plate 13 being set on the same board surface 11 as the corresponding mounting plate 14; after at least one sub-segment 1 having been re-cured in an oven after mounting the components 2, placing the multiple sub-segments 1 of the flexible circuit board in a pre-set posture and position, and setting flux 17 on the second solder 16 of one of the two adjacent connecting plates 13 in two pre-set adjacent sub-segments 1, and setting the other connecting plate 13 on the corresponding flux 17; using a laser brazing device to heat the second solder 16 and flux 17 between the two adjacent connecting plates 13, thus, using the laser brazing device, the two adjacent connecting plates 13 can be welded by laser brazing. Compared to using connectors to connect two adjacent board segments, the above implementation method eliminates the step of manually setting the connectors, which can save on the manufacturing cost of flexible circuit boards and improve the manufacturing efficiency of flexible circuit boards.

[0086] In some embodiments of this disclosure, through holes can be formed on the connecting pads 13 without flux 17 in two adjacent connecting pads 13. This facilitates the melting of the second solder 16 to partially accommodate it in the through holes, thereby improving the stability of the connection between the two connecting pads 13 after laser brazing. The diameter of the through holes can be at least 0.10 mm to 0.15 mm, for example, 0.13 mm, and this disclosure does not limit this.

[0087] In some embodiments of this disclosure, reference is made to Figures 6 to 8 As shown, the manufacturing method may include: manufacturing each segment 1 of the flexible circuit board using a panelizing process to form multiple segments 1 of the flexible circuit board; and separating the segments 1. Here, separating the segments 1 involves punching the segments on the panel to finally form the segment 1. Furthermore, after the step of separating the segments is completed, and after the above-mentioned multiple arranged segments 1 are cured in an oven, the flexible circuit board can be finally formed.

[0088] It should be noted that the panelization process refers to the process of forming multiple identical sub-segments on a single circuit board. This circuit board is called a panel, meaning that multiple identical sub-segments are formed on the panel.

[0089] In some embodiments of this disclosure, reference is made to Figure 6 and Figure 7As shown, the manufacturing method may include: separating the multiple segments 1 of the flexible circuit board into individual panels before placing them in a preset orientation and position. This saves space occupied by excess parts on the panel, thereby effectively preventing interference between adjacent segments 1 when multiple segments 1 are placed.

[0090] In other embodiments of this disclosure, reference is made to Figure 8 As shown, there are two board segments 1, namely the first board segment 10 and the second board segment 20. The manufacturing method may include: separating the second board segment 20 before placing the multiple board segments 1 of the flexible circuit board in a preset posture and preset position; separating the first board segment 10 after the multiple board segments 1 are placed in a furnace for curing. Thus, when the multiple board segments 1 are placed in a furnace for curing, the panels of the first board segment 10 can provide auxiliary support for the second board segment 20, thereby improving the welding effect of the two adjacent connecting plates 13.

[0091] In some embodiments of this disclosure, reference is made to Figure 6 As shown, the manufacturing method may include: applying a bonding adhesive 18 between the component 2 and the corresponding board surface 11; and curing the board segment 1 with the bonding adhesive 18 applied using a baking device. This can improve the connection strength between the component 2 and the board segment 1. The baking device can be a baking oven or a baking furnace, and this disclosure is not limited thereto. Furthermore, this disclosure can select an appropriate time to apply the bonding adhesive 18 as needed; for example, in some embodiments, refer to... Figure 6 As shown, after the multiple pre-placed board segments 1 have been oven-cured, a bonding adhesive 18 can be applied between the component 2 and the corresponding board surface 11. In other embodiments, the bonding adhesive 18 can be applied between the component 2 and the corresponding board surface 11 after at least one board segment 1 with the component 2 mounted has been oven-cured again, and before the multiple board segments 1 of the flexible circuit board are placed in a preset posture and preset position. In other embodiments, the bonding adhesive 18 can also be applied between the component 2 and the corresponding board surface 11 before separating the board segments 1, thereby improving the application efficiency of the bonding adhesive 18.

[0092] Below, this disclosure will, in conjunction with the specific embodiments described above, further explain... Figure 6 The manufacturing method of flexible circuit boards is described in detail, taking a flexible circuit board including a first segment 10 and a second segment 20 as an example. (Refer to...) Figure 6As shown, firstly, a first sub-section 10 and a second sub-section 20 are manufactured using a panelizing process. For the first sub-section 10, a mounting plate 14 is first placed on one of the board surfaces 11, a first solder 15 is placed on the mounting plate 14, and components 2 are mounted on the first solder 15. The first sub-section 10 with components 2 mounted is then oven-cured. Subsequently, the first sub-section 10 is flipped over, and a mounting plate 14, a first solder 15, and components 2 are mounted sequentially on the other board surface 11. Simultaneously, a connecting plate 13 and a second solder 16 are placed. The first sub-section 10 with components 2 mounted is oven-cured again. Then, the first sub-section 10 is separated into its final form. For the second sub-section 20, one of the... A mounting plate 14 is provided on the board surface 11, and a first solder 15 is provided on the mounting plate 14. Components 2 are mounted on the first solder 15. The second sub-board segment 20 after mounting the components 2 is oven-cured. Subsequently, the second sub-board segment 20 is separated to finally form the second sub-board segment 20. Then, the first sub-board segment 10 and the second sub-board segment 20 are placed in a preset posture and preset position, and the other connecting plate 13 of the two adjacent connecting plates 13 is attached to the flux 17. Then, the placed first sub-board segment 10 and the second sub-board segment 20 are oven-cured. Subsequently, a connecting adhesive 18 is provided between the components 2 and the corresponding board surface 11. Then, the connecting adhesive 18 is cured using a baking device. Thus, the flexible circuit board of this disclosure can be obtained.

[0093] Below, this disclosure will, in conjunction with the specific embodiments described above, further explain... Figure 7 The manufacturing method of flexible circuit boards is described in detail, taking a flexible circuit board including a first segment 10 and a second segment 20 as an example. (Refer to...) Figure 7As shown, firstly, a panelization process is used to manufacture the first sub-board segment 10 and the second sub-board segment 20. For the first sub-board segment 10, a mounting plate 14 is first placed on one of the board surfaces 11, a first solder 15 is placed on the mounting plate 14, and components 2 are mounted on the first solder 15. The first sub-board segment 10 after mounting components 2 is then oven-cured. Subsequently, the first sub-board segment 10 is flipped over, and the mounting plate 14, the first solder 15, and components 2 are sequentially placed on the other board surface 11. The first sub-board segment 10 after mounting components 2 is oven-cured again. Then, a connecting plate 13 and a second solder 16 are placed on the first sub-board segment 10, and the first sub-board segment 10 is separated to finally form the first sub-board segment 10. For the second sub-section 20, a mounting plate 14 is provided on one of the board surfaces 11, a first solder 15 is provided on the mounting plate 14, and components 2 are mounted on the first solder 15. The second sub-section 20 after mounting components 2 is then oven-cured. Subsequently, a connecting plate 13 is provided on the second sub-section 20, and the second sub-section 20 is separated to finally form the second sub-section 20. Then, the first sub-section 10 and the second sub-section 20 are placed in a preset posture and a preset position, and the other connecting plate 13 of the two adjacent connecting plates 13 is mounted on the corresponding second solder 16. After that, the placed first sub-section 10 and the second sub-section 20 are oven-cured, thereby obtaining the flexible circuit board of this disclosure.

[0094] Below, this disclosure will, in conjunction with the specific embodiments described above, further explain... Figure 8 The manufacturing method of flexible circuit boards is described in detail, taking a flexible circuit board including a first segment 10 and a second segment 20 as an example. (Refer to...) Figure 8As shown, firstly, a first sub-section 10 and a second sub-section 20 are manufactured using a panelization process. For the first sub-section 10, a mounting plate 14 is first placed on one of the board surfaces 11, a first solder 15 is placed on the mounting plate 14, and components 2 are mounted on the first solder 15. The first sub-section 10 with components 2 mounted is then reflow oven-cured. Subsequently, the first sub-section 10 is flipped over, and the mounting plate 14, the first solder 15, and components 2 are sequentially placed on the other board surface 11. The first sub-section 10 with components 2 mounted is then reflow oven-cured. Finally, a connecting plate 13 and a second solder 16 are placed on the first sub-section 10. For the second sub-section 20, a mounting plate is placed on one of the board surfaces 11. 14. A first solder 15 is placed on the mounting plate 14, and components 2 are mounted on the first solder 15. The second sub-section 20 after mounting components 2 is then cured in an oven. Subsequently, a connecting plate 13 is placed on the second sub-section 20, and the second sub-section 20 is separated to finally form the second sub-section 20. Then, the unseparated first sub-section 10 and the separated second sub-section 20 are placed in a preset posture and preset position, and the other connecting plate 13 of the two adjacent connecting plates 13 is mounted on the corresponding second solder 16. Then, the placed first sub-section 10 and second sub-section 20 are cured in an oven. After that, the first sub-section 10 is separated. Thus, the flexible circuit board of this disclosure can be obtained.

[0095] The preferred embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, this disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this disclosure, various simple modifications can be made to the technical solutions of this disclosure, and these simple modifications all fall within the protection scope of this disclosure.

[0096] In some embodiments, after ink printing on the PCB segment 1, it can be baked and cured, and a plating layer can be applied to the connecting plate 13 and / or mounting plate 14 of the PCB segment 1. The plating layer can be constructed as one of an electroless gold layer, an OSP (organic solderability preservative) layer, a tin plating layer, or a gold plating layer, and this disclosure does not limit it.

[0097] In some implementations, the internal circuitry of segment 1 can be roughened to prevent oxidation of the internal circuitry.

[0098] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.

[0099] Furthermore, various different embodiments of this disclosure can be combined in any way, as long as they do not violate the spirit of this disclosure, they should also be regarded as the content disclosed in this disclosure.

Claims

1. A flexible circuit board, characterized by, The flexible circuit board comprises a plurality of sub-plate segments, and two adjacent sub-plate segments are electrically connected, and the plurality of sub-plate segments comprises at least two adjacent and angularly arranged sub-plate segments; the sub-plate segment has a plate surface perpendicular to the thickness direction of the sub-plate segment, and the plurality of sub-plate segments comprises at least two adjacent sub-plate segments with different numbers of plate surfaces on which components are arranged.

2. The flexible circuit board of claim 1, wherein, In the two adjacent sub-plate segments with different numbers of plate surfaces on which components are arranged, both plate surfaces of one of the sub-plate segments are arranged with components, and one of the two plate surfaces of the other sub-plate segment is arranged with components.

3. The flexible circuit board of claim 1, wherein, The plurality of sub-plate segments comprises at least two adjacent and parallel arranged sub-plate segments.

4. The flexible circuit board of claim 1, wherein, The sub-plate segment has a side surface perpendicular to the width direction of the sub-plate segment, and in the two adjacent angularly arranged sub-plate segments, the two adjacent side surfaces are angularly arranged.

5. The flexible circuit board of claim 1, wherein, In the two adjacent angularly arranged sub-plate segments, the two adjacent plate surfaces are angularly arranged.

6. The flexible circuit board of claim 1, wherein, The plate surface of the sub-plate segment is provided with a connecting pad, the connecting pad is provided with a connector, and the two adjacent connectors on the two adjacent sub-plate segments are plugged.

7. The flexible circuit board of claim 1, wherein, The plate surface of the sub-plate segment is provided with a connecting pad, and the two adjacent connecting pads on the two adjacent sub-plate segments are welded.

8. The flexible circuit board of claim 1, wherein, The connecting glue is arranged between the component and the corresponding plate surface.

9. An electronic device, comprising: The flexible circuit board comprises a plurality of sub-plate segments, and two adjacent sub-plate segments are electrically connected, and the plurality of sub-plate segments comprises at least two adjacent and angularly arranged sub-plate segments; the sub-plate segment has a plate surface perpendicular to the thickness direction of the sub-plate segment, and the plurality of sub-plate segments comprises at least two adjacent sub-plate segments with different numbers of plate surfaces on which components are arranged.

10. A method of manufacturing a flexible circuit board, characterized by, The manufacturing method comprises: forming a plurality of sub-plate segments of the flexible circuit board; in at least two sub-plate segments, mounting pads are arranged on one of the plate surfaces of each sub-plate segment, first solders are arranged on the mounting pads, components are attached to the first solders, and the at least two sub-plate segments after the components are attached are cured in an oven respectively; another plate surface of at least one sub-plate segment after the curing in the oven is provided with a mounting pad, a first solder is arranged on the mounting pad, a component is attached to the first solder, and the at least one sub-plate segment after the component is attached is cured in an oven again.

11. The method of manufacturing a flexible circuit board according to claim 10, wherein The manufacturing method comprises: when the first solder is arranged on the mounting pad, in the two adjacent sub-plate segments, a second solder is arranged on one of the two adjacent connecting pads, and the connecting pad is arranged on the same plate surface as the corresponding mounting pad; after the at least one sub-plate segment after the component is attached is cured in the oven again, the plurality of sub-plate segments of the flexible circuit board are placed in a preset posture and at a preset position, a flux is arranged on the second solder of one of the two adjacent connecting pads in the two adjacent sub-plate segments, and the other connecting pad is attached to the corresponding flux; the plurality of sub-plate segments after the placement are cured in the oven.

12. The method of manufacturing a flexible circuit board according to claim 11, wherein The melting point of the flux is set to be lower than the melting point of the first solder.

13. The method of manufacturing a flexible circuit board according to claim 10, wherein The manufacturing method comprises: after the at least one sub-plate segment after the component is attached is cured in the oven again, a second solder is arranged on one of the two adjacent connecting pads in the two adjacent sub-plate segments; the plurality of sub-plate segments of the flexible circuit board are placed in a preset posture and at a preset position, and the other connecting pad of the two adjacent connecting pads in the two adjacent sub-plate segments is attached to the corresponding second solder; the plurality of sub-plate segments after the placement are cured in the oven.

14. The method of manufacturing a flexible circuit board according to claim 13, wherein The melting point of the second solder is set to be lower than the melting point of the first solder.

15. The method of manufacturing a flexible circuit board according to claim 10, wherein The manufacturing method comprises: When the first solder is arranged on the mounting plate, in the preset two adjacent sub-plate segments, the second solder is arranged on one of the two adjacent connecting plates, which is arranged on the same plate surface as the corresponding mounting plate; After the at least one sub-plate segment with the mounted components is cured again, the plurality of sub-plate segments of the flexible circuit board are placed in the preset posture and the preset position, and in the preset two adjacent sub-plate segments, the flux is arranged on the second solder of one of the two adjacent connecting plates, and the other connecting plate is arranged on the corresponding flux; The second solder and the flux between the two adjacent connecting plates are heated by using a laser soldering device.

16. The method of manufacturing a flexible circuit board according to any one of claims 10 to 15, wherein The manufacturing method comprises: Each sub-plate segment of the flexible circuit board is manufactured by using a plate splicing process to form the plurality of sub-plate segments of the flexible circuit board; The sub-plate segments are divided.

17. The method of manufacturing a flexible circuit board according to claim 16, wherein The manufacturing method comprises: Before the plurality of sub-plate segments of the flexible circuit board are placed in the preset posture and the preset position, the sub-plate segments are divided.

18. The method of manufacturing a flexible circuit board according to any one of claims 10 to 15, wherein The manufacturing method comprises: A connecting glue is arranged between the component and the corresponding plate surface; The sub-plate segment with the connecting glue is cured by using a baking device.

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