Rapid thermal response liquid cooling heat exchanger based on thermoelectric refrigerating unit assembly

Abstract

The invention discloses a rapid thermal response liquid cooling heat exchanger based on a thermoelectric refrigerating unit assembly, and relates to the technical field of liquid cooling heat exchangers, and the rapid thermal response liquid cooling heat exchanger comprises a 3D uniform temperature plate assembly, a thermoelectric refrigerating unit assembly and a liquid cooling plate assembly which are integrated into a whole; the 3D temperature-uniforming plate assembly comprises a first 3D temperature-uniforming plate unit and a second 3D temperature-uniforming plate unit, the first 3D temperature-uniforming plate unit is in contact with the cold end of the thermoelectric refrigerating unit assembly, the second 3D temperature-uniforming plate unit is in contact with the hot end of the thermoelectric refrigerating unit assembly, the liquid cooling plate assembly is fixed on the second 3D temperature-uniforming plate unit, and the heating device is fixed on the first 3D temperature-uniforming plate unit. According to the liquid cooling heat exchanger, the thermoelectric refrigerating unit assembly, the 3D vapor chamber assembly and the liquid cooling plate assembly are combined, and the defects that the thermoelectric refrigerating unit assembly is low in efficiency and small in power, and the liquid cooling plate is low in response speed are overcome. And a new way is provided for active thermal control of the high-power electronic chip.

Description

Technical Field

[0001] This invention relates to the field of liquid-cooled heat exchanger technology, and more specifically to the field of a fast thermal response liquid-cooled heat exchanger based on thermoelectric cooler components. Background Technology

[0002] Existing liquid cooling heat sinks all achieve thermal control of electronic devices by introducing liquid cooling fluid into a liquid cooling plate, with one side of the plate in contact with the chips or other devices requiring heat dissipation. This cooling method is highly efficient; by optimizing the cooling plate, adjusting the liquid flow rate, and regulating the liquid temperature, the temperature of electronic devices can be controlled within a certain range. However, its drawbacks are also significant. The flow rate and temperature of the liquid cooling fluid are controlled by the liquid cooling source, which requires secondary heat exchange with the external environment. Its temperature is difficult to adjust rapidly, and even with rapid flow rate adjustments, it is difficult for the chips requiring heat dissipation to respond quickly. The entire temperature control process is very slow, making it difficult to meet the rapid thermal control and response requirements of precision instruments and equipment.

[0003] Thermoelectric cooler components are based on semiconductor materials, and consist of multiple thermoelectric cooling units. Based on the Peltier effect, they utilize the directional heat transfer when an electric current passes through the semiconductor material to achieve cooling or heating. They feature a simple and compact structure, no moving parts, rapid start-up and shutdown, wide environmental adaptability, high reliability (over 200,000 hours), and no refrigerant. These characteristics make them ideal for applications with limited heat dissipation space, requiring localized heat dissipation and precise temperature control. These features fully meet the temperature control requirements of temperature-sensitive devices.

[0004] However, the disadvantages of thermoelectric cooler components are also very obvious. They have low heat dissipation power. Even a thermoelectric cooler component with an area of ​​40mm*40mm has a peak cooling power of less than 70W. Moreover, as the temperature difference between the two sides of the thermoelectric cooler component increases, the efficiency of the thermoelectric cooler component decreases sharply. In most cases, the efficiency is less than 1. This means that thermoelectric cooler components alone cannot be used in electronic devices with high heat dissipation power. Summary of the Invention

[0005] The purpose of this invention is to solve the technical problems of slow response speed and low cooling power of existing simple liquid-cooled plates and thermoelectric cooler components. This invention provides a fast thermal response liquid-cooled heat exchanger based on thermoelectric cooler components.

[0006] To achieve the above objectives, the present invention specifically adopts the following technical solution: This invention provides a fast thermal response liquid-cooled heat exchanger based on a thermoelectric cooler assembly, comprising an integrated 3D vapor chamber assembly, a thermoelectric cooler assembly, and a liquid-cooled plate assembly. The 3D vapor chamber assembly includes a first 3D vapor chamber unit and a second 3D vapor chamber unit. The first 3D vapor chamber unit is in contact with the cold end of the thermoelectric cooler assembly, and the second 3D vapor chamber unit is in contact with the hot end of the thermoelectric cooler assembly. The liquid cooling plate assembly is fixed on the second 3D heat exchanger unit, and the heating device is fixed on the first 3D heat exchanger unit; Specifically, this solution is a liquid-cooled heat exchanger that combines a thermoelectric cooler assembly, a 3D vapor chamber, and a liquid cooling plate, overcoming the low efficiency and low power of the thermoelectric cooler assembly and the slow response speed of the liquid cooling plate. It provides a new approach for active thermal control of high-power electronic chips.

[0007] In one embodiment, both the first 3D vapor chamber unit and the second 3D vapor chamber unit include a bottom substrate and a plurality of fins arranged in parallel on the bottom substrate; the liquid cooling plate assembly is fixed on the bottom substrate of the second 3D vapor chamber unit, and the heating device is fixed on the bottom substrate of the first 3D vapor chamber unit.

[0008] In one embodiment, a substrate liquid storage cavity is provided in the bottom substrate, and a fin liquid storage cavity communicating with the substrate liquid storage cavity is provided in each fin. The substrate liquid storage cavity and the fin liquid storage cavity are filled with a heat-conducting medium.

[0009] Specifically, the bottom substrate and the cavity in the fins of the 3D heat spreader unit proposed in this solution are all connected. The cavity is filled with a certain amount of liquid (water, acetone, etc.). When the bottom surface is heated and the entire structure generates a certain temperature difference, the internal liquid can generate an evaporation-condensation-evaporation cycle, and the heat is transferred quickly, achieving efficient heat diffusion and uniform temperature control.

[0010] In one embodiment, the thermoelectric cooler assembly includes multiple thermoelectric cooler units arranged side by side at equal intervals, with a thermally conductive gap between adjacent thermoelectric cooler units. Each thermoelectric cooling unit includes a hot end, a cold end, and multiple PN junctions arranged in parallel between the hot end and the cold end.

[0011] In one embodiment, the number of fins in the first 3D heat dissipation plate unit, the number of fins in the second 3D heat dissipation plate unit, and the number of thermoelectric cooling single pieces are the same, and they correspond one-to-one to form multiple sets of three-dimensional heat dissipation components. In each group of three-dimensional heat dissipation components, the fins of the first 3D vapor chamber unit are in contact with the cold end of the corresponding thermoelectric cooling unit, and the fins of the second 3D vapor chamber unit are in contact with the hot end of the thermoelectric cooling unit.

[0012] Specifically, existing thermoelectric cooling units have low power and low efficiency (taking the 40mm*40mm*4.7mm model currently on the market as an example, its maximum cooling power is less than 70W, and its efficiency is less than 0.5 when the temperature difference is large). They are used alone for temperature control of heating devices, with the cold end in contact with the heating device and the hot end in contact with the liquid cooling plate. Therefore, the heat dissipation power of this traditional structure is limited by the thermoelectric cooling unit and cannot exceed the cooling power of a single thermoelectric cooling unit.

[0013] This solution combines thermoelectric cooler components with 3D vapor chamber components. The 3D vapor chamber components can quickly conduct heat, transforming the original two-dimensional heat diffusion into three-dimensional heat diffusion. This effectively increases the number of thermoelectric cooler units. By combining 3D vapor chamber components with thermoelectric cooler components, five thermoelectric cooler components can be used in the same cooling area, increasing the cooling power by five times.

[0014] In one embodiment, multiple PN junctions are arranged at equal intervals between the hot end and the cold end.

[0015] In one embodiment, the liquid cooling plate assembly includes a liquid cooling plate body, a liquid cooling cavity disposed inside the liquid cooling plate body, and a liquid cooling source for supplying liquid to the liquid cooling cavity. The liquid cooling plate body is fixed on the bottom substrate of the second 3D heat spreader unit.

[0016] In one embodiment, the outer wall of the liquid cooling plate body is provided with an inlet and a return port that communicate with the interior of the liquid cooling cavity, the liquid cooling source is provided with an outlet pipe that communicates with the inlet, and the liquid cooling source is provided with a return pipe that communicates with the return port.

[0017] In one embodiment, a liquid discharge pump is provided on the liquid discharge pipeline.

[0018] In one embodiment, the thermoelectric cooler assembly further includes a controller and a temperature sensor disposed on the heating element, the temperature sensor being signal-connected to the controller; Each thermoelectric cooling unit is connected to the controller signal, and the heat dissipation power of each thermoelectric cooling unit is controlled by the controller.

[0019] Specifically, the thermoelectric cooler assembly is located in the heat transfer path and can achieve electronic control, fast response speed, and high temperature control accuracy.

[0020] The thermoelectric cooler assembly is located on the heat transfer path of the entire heat sink, and its heat dissipation power directly determines the overall heat dissipation power of the heat sink. Furthermore, the thermoelectric cooler assembly achieves closed-loop temperature control through a controller and temperature acquisition of the heating element. This significantly improves temperature control accuracy and response speed compared to existing simple liquid cooling plates. Moreover, the thermoelectric cooler assembly can achieve heating and cooling by switching the positive and negative terminals of its power supply. Most chips have a narrow operating temperature range, requiring not only temperature control but also difficulty functioning properly at low temperatures. By switching the positive and negative power supply of the thermoelectric cooler assembly, the chip can be heated, ensuring its startup and operation characteristics at low temperatures, thus making the entire device more environmentally adaptable.

[0021] The beneficial effects of this invention are as follows: 1. This invention features a rational design, employing a highly efficient combination of a 3D vapor chamber assembly, a thermoelectric cooler assembly, and a liquid-cooled plate assembly to overcome the limitations of slow thermal response of liquid-cooled plates and low cooling power of thermoelectric cooler assemblies. This results in an active heat dissipation device suitable for high heat flux density electronic devices, with controllable target temperature. It overcomes the shortcomings of low efficiency and low power of thermoelectric cooler assemblies and slow response of liquid-cooled plates, providing a new approach for active thermal control of high-power electronic chips.

[0022] 2. The thermoelectric cooler components are located in the heat transfer path, enabling electronic control, fast response speed, and high temperature control accuracy. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 yes Figure 1 Exploded view; Figure 3 This is a schematic diagram of the thermoelectric transport path; Figure 4 This is a schematic diagram of the structure of a thermoelectric cooling unit; Figure 5 yes Figure 1 A schematic diagram of a partial structure; Figure 6 yes Figure 1 A schematic diagram combining the controller and temperature sensor; Figure 7 yes Figure 1 The assembled 3D model; Figure 8 This is a partial cross-sectional view of the first 3D heat exchanger unit; Reference numerals: 1. Heating element; 2. First 3D vapor chamber unit; 3. Second 3D vapor chamber unit; 4. Liquid cooling plate assembly; 5. Thermoelectric cooler assembly; 6. Controller; 7. Temperature sensor; 21. Bottom substrate; 22. Fins; 51. Cold end; 52. Hot end; 53. PN junction. Detailed Implementation

[0025] To make the technical problems, technical solutions, and technical effects of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0026] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0027] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0028] In the description of the embodiments of the present invention, it should be noted that the terms "inner", "outer", "upper", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the present invention.

[0029] Example 1 like Figures 1 to 8 As shown, this embodiment provides a fast thermal response liquid-cooled heat exchanger based on a thermoelectric cooler assembly 5, including an integrated 3D heat spreader assembly, a thermoelectric cooler assembly 5, and a liquid-cooled plate assembly 4. The 3D vapor chamber assembly includes a first 3D vapor chamber unit 2 and a second 3D vapor chamber unit 3. The first 3D vapor chamber unit 2 is in contact with the cold end 51 of the thermoelectric cooler assembly 5, and the second 3D vapor chamber unit 3 is in contact with the hot end 52 of the thermoelectric cooler assembly 5. The liquid cooling plate assembly 4 is fixed on the second 3D heat exchanger unit 3, and the heating device 1 is fixed on the first 3D heat exchanger unit 2; Specifically, this solution is a liquid-cooled heat exchanger that combines a thermoelectric cooler assembly 5, a 3D vapor chamber, and a liquid cooling plate, overcoming the low efficiency and low power of the thermoelectric cooler assembly 5 and the slow response speed of the liquid cooling plate. It provides a new approach for active thermal control of high-power electronic chips.

[0030] Example 2 like Figures 1 to 8 As shown, this embodiment provides a fast thermal response liquid-cooled heat exchanger based on a thermoelectric cooler assembly 5, including an integrated 3D heat spreader assembly, a thermoelectric cooler assembly 5, and a liquid-cooled plate assembly 4. The 3D vapor chamber assembly includes a first 3D vapor chamber unit 2 and a second 3D vapor chamber unit 3. The first 3D vapor chamber unit 2 is in contact with the cold end 51 of the thermoelectric cooler assembly 5, and the second 3D vapor chamber unit 3 is in contact with the hot end 52 of the thermoelectric cooler assembly 5. The liquid cooling plate assembly 4 is fixed on the second 3D heat exchanger unit 3, and the heating device 1 is fixed on the first 3D heat exchanger unit 2; The first 3D heat spreader unit 2 and the second 3D heat spreader unit 3 both include a bottom substrate 21 and a plurality of fins 22 arranged side by side on the bottom substrate 21; the liquid cooling plate assembly 4 is fixed on the bottom substrate 21 of the second 3D heat spreader unit 3, and the heating device 1 is fixed on the bottom substrate 21 of the first 3D heat spreader unit 2.

[0031] The bottom substrate 21 is provided with a substrate liquid storage cavity, and each fin 22 is provided with a fin 22 liquid storage cavity that communicates with the substrate liquid storage cavity. The substrate liquid storage cavity and the fin 22 liquid storage cavity are filled with a heat-conducting medium.

[0032] Specifically, such as Figure 8 As shown, the bottom substrate 21 and the cavities in the fins 22 of the 3D heat spreader unit proposed in this solution are all connected. The cavities are filled with a certain amount of liquid (water, acetone, etc.). When the bottom surface is heated and the entire structure generates a certain temperature difference, the internal liquid can generate an evaporation-condensation-evaporation cycle, and the heat is transferred quickly, achieving efficient heat diffusion and uniform temperature control.

[0033] Example 3 This embodiment is a further optimization based on embodiment 2, specifically: The thermoelectric cooler assembly 5 includes multiple thermoelectric cooler units arranged side by side at equal intervals, with a thermally conductive gap between adjacent thermoelectric cooler units; Each thermoelectric cooling unit includes a hot end 52, a cold end 51 arranged in parallel, and multiple PN junctions 53 disposed between the hot end 52 and the cold end 51.

[0034] The number of fins 22 in the first 3D heat dissipation plate unit 2, the number of fins 22 in the second 3D heat dissipation plate unit 3, and the number of thermoelectric cooling single pieces are the same, and they correspond one-to-one to form multiple sets of three-dimensional heat dissipation components. In each group of three-dimensional heat dissipation components, the fins 22 of the first 3D heat dissipation plate unit 2 are in contact with the cold end 51 of the corresponding thermoelectric cooling unit, and the fins 22 of the second 3D heat dissipation plate unit 3 are in contact with the hot end 52 of the thermoelectric cooling unit.

[0035] Specifically, existing thermoelectric cooling units have low power and low efficiency (taking the 40mm*40mm*4.7mm model currently on the market as an example, its maximum cooling power is less than 70W, and its efficiency is less than 0.5 when the temperature difference is large), and are used alone for temperature control of heating element 1 (such as...). Figure 4 As shown in the figure, the cold end 51 is in contact with the heat-generating device 1, and the hot end 52 is in contact with the liquid cooling plate. Therefore, the heat dissipation power of this traditional structure is limited by the thermoelectric cooler assembly 5, and cannot exceed the cooling power of a single thermoelectric cooler assembly 5.

[0036] This solution combines thermoelectric cooler assembly 5 with a 3D vapor chamber assembly. The 3D vapor chamber assembly can rapidly conduct heat, transforming the original two-dimensional heat diffusion into three-dimensional heat diffusion. This effectively increases the number of thermoelectric cooler units. By combining the 3D vapor chamber assembly with the thermoelectric cooler assembly 5, using five thermoelectric cooler assemblies 5 in the same cooling area, the cooling power is increased fivefold. (e.g.) Figure 5 (As shown).

[0037] Example 4 This embodiment is a further optimization based on embodiment 3, specifically: Multiple PN junctions 53 are arranged at equal intervals between the hot end 52 and the cold end 51.

[0038] The liquid cooling plate assembly 4 includes a liquid cooling plate body, a liquid cooling cavity disposed inside the liquid cooling plate body, and a liquid cooling source for supplying liquid to the liquid cooling cavity. The liquid cooling plate body is fixed on the bottom substrate 21 of the second 3D heat spreader unit 3.

[0039] The outer wall of the liquid cooling plate body is provided with an inlet and a return port that communicate with the inside of the liquid cooling cavity. The liquid cooling source is provided with an outlet pipe that communicates with the inlet and a return pipe that communicates with the return port.

[0040] A liquid discharge pump is installed on the liquid discharge pipeline.

[0041] Example 5 This embodiment is a further optimization based on embodiment 4, specifically: Thermoelectric cooler assembly 5 also includes controller 6 and temperature sensor 7 disposed on heating device 1, temperature sensor 7 being signal connected to controller 6; Each thermoelectric cooling unit is connected to the controller 6 via a signal, and the heat dissipation power of each thermoelectric cooling unit is controlled by the controller 6.

[0042] Specifically, the thermoelectric cooler component 5 is located in the heat transfer path, enabling it to achieve electronic control, fast response speed, and high temperature control accuracy.

[0043] like Figure 3 and Figure 7 As shown, the thermoelectric cooler assembly 5 is located on the heat transfer path of the entire radiator, and the heat dissipation power of the thermoelectric cooler assembly 5 directly determines the heat dissipation power of the entire radiator. Furthermore, the thermoelectric cooler assembly 5 obtains temperature data via the controller 6 and the heating element 1 (e.g.,...). Figure 7 As shown, it can achieve closed-loop temperature control, and the temperature control accuracy and response speed are greatly improved compared with the existing simple liquid cooling plate. Moreover, the thermoelectric cooler component 5 can achieve heating and cooling by switching the positive and negative power supply. Most chips have a narrow operating temperature range. Not only do they need to be controlled within a certain temperature range, but they also have difficulty working normally at low temperatures. By switching the positive and negative power supply of the thermoelectric cooler component 5, the chip can be heated, ensuring the chip's startup and working characteristics at low temperatures, making the entire device more environmentally adaptable.

Claims

1. A fast thermal response liquid-cooled heat exchanger based on a thermoelectric cooler assembly, characterized in that, Including an integrated 3D vapor chamber assembly, a thermoelectric cooler assembly (5) and a liquid cooling plate assembly (4); The 3D vapor chamber assembly includes a first 3D vapor chamber unit (2) and a second 3D vapor chamber unit (3). The first 3D vapor chamber unit (2) is in contact with the cold end (51) of the thermoelectric cooler assembly (5), and the second 3D vapor chamber unit (3) is in contact with the hot end (52) of the thermoelectric cooler assembly (5). The liquid cooling plate assembly (4) is fixed on the second 3D heat exchanger unit (3), and the heating device (1) is fixed on the first 3D heat exchanger unit (2).

2. The fast thermal response liquid-cooled heat exchanger based on a thermoelectric cooler assembly according to claim 1, characterized in that, The first 3D heat spreader unit (2) and the second 3D heat spreader unit (3) both include a bottom substrate (21) and a plurality of fins (22) arranged side by side on the bottom substrate (21); the liquid cooling plate assembly (4) is fixed on the bottom substrate (21) of the second 3D heat spreader unit (3), and the heating device (1) is fixed on the bottom substrate (21) of the first 3D heat spreader unit (2).

3. A fast thermal response liquid-cooled heat exchanger based on a thermoelectric cooler assembly according to claim 2, characterized in that, The bottom substrate (21) is provided with a substrate liquid storage cavity, and each fin (22) is provided with a fin (22) liquid storage cavity that communicates with the substrate liquid storage cavity. The substrate liquid storage cavity and the fin (22) liquid storage cavity are filled with a heat-conducting medium.

4. A fast thermal response liquid-cooled heat exchanger based on a thermoelectric cooler assembly according to claim 2 or 3, characterized in that, The thermoelectric cooler assembly (5) includes multiple thermoelectric cooler units arranged side by side at equal intervals, with a thermally conductive gap between two adjacent thermoelectric cooler units. Each of the thermoelectric cooling units includes a hot end (52), a cold end (51) arranged in parallel, and a plurality of PN junctions (53) disposed between the hot end (52) and the cold end (51).

5. A fast thermal response liquid-cooled heat exchanger based on a thermoelectric cooler assembly according to claim 4, characterized in that, The number of fins (22) of the first 3D heat spreader unit (2), the number of fins (22) of the second 3D heat spreader unit (3) and the number of thermoelectric cooling single pieces are the same, and they correspond one-to-one to form multiple sets of three-dimensional heat dissipation components. In each group of the three-dimensional heat dissipation components, the fins (22) of the first 3D heat dissipation plate unit (2) are in contact with the cold end (51) of the corresponding thermoelectric cooling unit, and the fins (22) of the second 3D heat dissipation plate unit (3) are in contact with the hot end (52) of the thermoelectric cooling unit.

6. A fast thermal response liquid-cooled heat exchanger based on a thermoelectric cooler assembly according to claim 4, characterized in that, Multiple PN junctions (53) are arranged at equal intervals between the hot end (52) and the cold end (51).

7. A fast thermal response liquid-cooled heat exchanger based on a thermoelectric cooler assembly according to claim 5, characterized in that, The liquid cooling plate assembly (4) includes a liquid cooling plate body, a liquid cooling cavity disposed inside the liquid cooling plate body, and a liquid cooling source for supplying liquid to the liquid cooling cavity. The liquid cooling plate body is fixed on the bottom substrate (21) of the second 3D heat spreader unit (3).

8. A fast thermal response liquid-cooled heat exchanger based on a thermoelectric cooler assembly according to claim 7, characterized in that, The outer wall of the liquid cooling plate body is provided with an inlet and a return port that communicate with the interior of the liquid cooling cavity. The liquid cooling source is provided with an outlet pipe that communicates with the inlet and a return pipe that communicates with the return port.

9. A fast thermal response liquid-cooled heat exchanger based on a thermoelectric cooler assembly according to claim 8, characterized in that, An outlet pump is installed on the outlet pipe.

10. A fast thermal response liquid-cooled heat exchanger based on a thermoelectric cooler assembly according to claim 8, characterized in that, The thermoelectric cooler assembly (5) further includes a controller (6) and a temperature sensor (7) disposed on the heating device (1), wherein the temperature sensor (7) is signal-connected to the controller (6); Each of the thermoelectric cooling units is connected to the controller (6) via a signal, and each of the thermoelectric cooling units controls the heat dissipation power through the controller (6).

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