A single crystal silicon wafer polishing waste cleaner and method of use

Abstract

The present application relates to single crystal silicon wafer polishing technical field, and disclose a kind of single crystal silicon wafer polishing waste material cleaning scraper and its using method, including rotary moving mechanism and movable scraping mechanism, its inside is provided with hollow scraper plate located above polishing platform and can move with sliding block, fixed scraping strip is installed in hollow scraper plate bottom and can be scraped to the waste material attached on the surface of polishing platform, and mobile scraping strip is placed in hollow scraper plate inside and can generate reciprocating motion and move to the waste material attached on the surface of polishing platform and be scraped.The single crystal silicon wafer polishing waste material cleaning scraper and its using method, preliminary scraping work is carried out to waste material using scraper plate moving along the length direction of polishing platform, and then scraping work is carried out to waste material remaining on the surface of polishing platform using scraping strip reciprocating along the width direction of polishing platform, so as to improve the scraping motion rate of waste material, improve the cleaning effect of waste material, to ensure the polishing quality of single crystal silicon wafer.

Description

A waste scraper for polishing single-crystal silicon wafers and its usage method Technical Field

[0001] This invention relates to the field of single-crystal silicon wafer polishing technology, specifically to a waste scraper for single-crystal silicon wafer polishing and its usage method. Background Technology

[0002] Monocrystalline silicon wafers are crystals with a basically complete lattice structure. Their main uses are as semiconductor materials and for solar photovoltaic power generation and heating. During the processing of monocrystalline silicon wafers, polishing is required.

[0003] For example, Chinese patent publication number "CN222405148U" discloses a "waste cleaner for polishing monocrystalline silicon wafers". Its main structure includes a polishing platform; a waste cleaning section is provided above the polishing platform; a scraper for cleaning the top of the connecting seat is installed in the fixed groove and can be raised and lowered. The front end of the scraper is bent downward and pressed against the top surface of the polishing platform. A connecting rod passes through the scraper and slides with the scraper, and the bottom end of the spring presses against the scraper. Through the polishing platform and the waste cleaning section, the waste generated by polishing monocrystalline silicon wafers falls on the polishing platform. The motor drives the lead screw to rotate, and the rotation of the lead screw drives the connecting seat to move horizontally. The connecting seat simultaneously drives the support rod and the mounting seat to move horizontally. At this time, the scraper moves along the top of the polishing platform, and the scraper can push the waste on the top of the polishing platform into the collection box for collection.

[0004] It is obvious that the above-mentioned waste scraper for polishing monocrystalline silicon wafers uses a horizontally moving scraper to scrape off the waste on the surface of the polishing platform. During the movement of the scraper, the relative movement direction between the scraper and the polishing platform is only the length direction of the polishing platform. The waste is very likely to enter the bottom of the scraper along the movement gap between the scraper and the polishing platform, resulting in a reduced cleaning effect. In addition, the single movement direction between the scraper and the polishing platform leads to a reduced movement rate, which will also cause the cleaning effect of the equipment to deteriorate. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a waste scraper for polishing monocrystalline silicon wafers and its usage method. The scraper, which moves along the length of the polishing platform, performs initial scraping of waste. Then, a scraper bar, capable of reciprocating along the width of the polishing platform, scrapes away any remaining waste on the surface of the platform. This increases the scraping efficiency, improves the waste removal effect, and ensures the polishing quality of the monocrystalline silicon wafers, thus solving the aforementioned technical problems.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a waste scraper for polishing single-crystal silicon wafers, comprising a polishing platform for polishing work, and a rotary moving mechanism, which internally comprises two symmetrically mounted bottom mounting bases fixedly installed at the bottom of the polishing platform, a rotatable horizontal threaded rod installed between the two bottom mounting bases, a sliding slider capable of horizontal movement under the rotation of the horizontal threaded rod, and a horizontal limiting rod installed between the two bottom mounting bases to prevent the sliding slider from rotating; and a movable scraping mechanism internally comprises a hollow scraper located above the polishing platform and capable of moving with the sliding slider, a fixed scraper installed at the bottom of the hollow scraper and capable of scraping the waste adhering to the surface of the polishing platform, and a movable scraper placed inside the hollow scraper and capable of reciprocating motion to move and scrape the waste adhering to the surface of the polishing platform.

[0007] Preferably, the rotary moving mechanism includes a first shaft mounting hole disposed in the bottom area of ​​two bottom mounting bases. The two bottom mounting bases are symmetrically mounted on the bottom surface of the polishing platform along the length direction of the polishing platform. The two bottom mounting bases are fixedly connected at opposite ends by a horizontal limiting slide rod. A first rotating shaft capable of rotation is mounted on the bottom mounting base through a bearing inside the first shaft mounting hole. A horizontal threaded rod is fixedly mounted between the two first rotating shafts at opposite ends by a coupling. The sliding block is provided with a limiting slide hole that can slide horizontally along the horizontal limiting slide rod. The sliding block is provided with an internal threaded hole installed at the body of the horizontal threaded rod through a threaded structure. A curved connecting rod located on one side of the polishing platform is fixedly mounted on one side of the sliding block. A first connecting plate integrally formed with the curved connecting rod is provided at the top end of the curved connecting rod.

[0008] Preferably, the cross-sectional shape of the limiting sliding hole is consistent with the cross-sectional shape of the horizontal limiting sliding rod, both being polygonal structures, and the structural dimensions of the cross-sectional shape of the limiting sliding hole match the structural dimensions of the cross-sectional shape of the horizontal limiting sliding rod.

[0009] Preferably, the thread structure includes an internal thread structure disposed on the inner wall of the internal thread hole and an external thread structure disposed on the horizontal thread rod body, and the internal thread structure and the external thread structure are matched with each other.

[0010] Preferably, the movable scraping mechanism includes a second connecting plate disposed at one end of the hollow scraper and fixedly connected to a first connecting plate. The hollow scraper has an open-bottomed hollow segmented area inside. A fixed scraper strip is fixedly installed on the bottom of the hollow scraper on one side of the hollow segmented area. The hollow scraper has a downward sliding notch with an open bottom on the other side of the hollow segmented area. An upper sliding cavity is provided at the top of the downward sliding notch. A movable scraper strip capable of reciprocating along the length of the downward sliding notch is placed inside the downward sliding notch. The top of the movable scraper strip is embedded in a cavity located inside the upper sliding cavity. At the bottom of the fixing strip, a thrust plate integrally formed with the upper surface of the fixing strip is provided. The other end of the hollow scraper is provided with a No. 1 shaft through hole connecting the external space and one end of the upper sliding cavity. A horizontal telescopic rod passing through the No. 1 shaft through hole is fixedly installed on one surface of the thrust plate. A No. 1 helical spring in a compressed state is placed around the rod body located inside the upper sliding cavity. An external connecting rod is fixedly installed at one end of the horizontal telescopic rod. A linear reciprocating motor is fixedly installed on the upper surface of the hollow scraper. The end of the reciprocating motion lead screw of the linear reciprocating motor is fixedly connected to the end of the external connecting rod through a linkage plate.

[0011] Preferably, the cross-sectional shape of the perforated section of the first shaft is consistent with the cross-sectional shape of the horizontal telescopic rod, both being polygonal structures, and the structural dimensions of the cross-sectional shape of the perforated section of the first shaft match the structural dimensions of the cross-sectional shape of the horizontal telescopic rod.

[0012] Preferably, the feature is that it further includes a torque-controllable linkage mechanism, which is provided with a rotatable hollow disc, an inner rotating column that can drive the first rotating shaft to rotate, and an arc-shaped contact plate that can link the hollow disc and the inner rotating column by means of friction.

[0013] Preferably, the torque-controllable linkage mechanism includes a hollow disc and an inner rotating column. A driven pulley is provided on one end face of the hollow disc, and a cylindrical component mounting cavity is provided at the center of the hollow disc. A second shaft mounting hole is provided at the center of one end of the hollow disc, and a rotatable linkage shaft is mounted inside the second shaft mounting hole via a bearing. One end of the linkage shaft is fixedly connected to the rotating end of one of the first rotating shafts. The inner rotating column is placed at the center of the cylindrical component mounting cavity, and a shaft fixing groove for fixing the linkage shaft is provided at the center of one end of the inner rotating column. The hollow disc is located at the center of the... The periphery of the cylindrical component mounting cavity is provided with multiple annular array-shaped cylindrical component movable cavities. The circumferential sides of the cylindrical component movable cavities and the cylindrical component mounting cavity are connected by a second shaft through a hole. The hollow disc has an inner movable plate that can move along the axial direction of the cylindrical component mounting cavity inside the cylindrical component mounting cavity. A second helical spring is installed at one end of the inner movable plate, and a connecting shaft that passes through the second shaft through a hole is fixedly installed at the other end of the inner movable plate. An arc-shaped abutment plate that abuts against the circumferential surface of the inner rotating column is fixedly installed at one end of the connecting shaft inside the cylindrical component mounting cavity.

[0014] Preferably, one end of the second helical spring abuts against one end face of the inner movable plate, and the other end abuts against one end face of the movable cavity of the cylindrical component, and the second helical spring is in a compressed state.

[0015] As a preferred method of use, S1: First, take a drive motor with a drive pulley installed at the end of the rotor, and connect the drive pulley and the driven pulley; S2: Start the drive motor and the linear reciprocating motor. The rotation of the drive motor will drive the hollow disc and the horizontal threaded rod to rotate in a specific direction. Due to the threaded connection, the sliding slider will drive the hollow scraper to move along the length of the polishing platform through the curved connecting rod; S3: The fixed scraper will perform a directional scraping action on the waste material on the surface of the polishing platform. At the same time, the reciprocating screw of the linear reciprocating motor will drive the fixed strip to reciprocate along the width of the polishing platform through the linkage plate, so that the moving scraper will generate a comprehensive scraping motion in two directions on the surface of the polishing platform, and cause the waste material to move in a specific direction; S4: When the waste material falls from one end of the polishing platform, the single scraping operation is completed.

[0016] Compared with the prior art, the present invention provides a waste scraper for polishing single-crystal silicon wafers and its usage method, which has the following beneficial effects:

[0017] The waste material is initially scraped off using a scraper that moves along the length of the polishing platform. Then, a scraper that can reciprocate along the width of the polishing platform is used to scrape off the remaining waste material on the surface of the polishing platform. This increases the scraping efficiency and improves the removal effect of waste material, thus ensuring the polishing quality of the monocrystalline silicon wafer. Attached Figure Description

[0018] Figure 1 is a perspective view of the present invention;

[0019] Figure 2 is a perspective cross-sectional view of the present invention;

[0020] Figure 3 is a perspective view of the rotary moving mechanism in this invention;

[0021] Figure 4 is a perspective cross-sectional view of the rotary moving mechanism in this invention;

[0022] Figure 5 is a perspective view of the movable scraping mechanism in this invention;

[0023] Figure 6 is a perspective cross-sectional view of the movable scraping mechanism in this invention from a first perspective;

[0024] Figure 7 is a perspective cross-sectional view of the movable scraping mechanism in this invention from a second perspective;

[0025] Figure 8 is a three-dimensional cross-sectional view of the torque-controllable linkage mechanism in this invention.

[0026] The components include: 1. Rotary moving mechanism; 11. Bottom mounting base; 12. Horizontal limiting slide bar; 13. No. 1 shaft mounting hole; 14. No. 1 rotating shaft; 15. Coupling; 16. Horizontal threaded rod; 17. Sliding slider; 18. Limiting slide hole; 19. Internal threaded hole; 110. Curved connecting rod; 111. No. 1 connecting plate; 2. Movable scraping mechanism; 21. Hollow scraper; 22. No. 2 connecting plate; 23. Hollow segmented area; 24. Fixed scraper; 25. Upper sliding cavity; 26. Lower sliding notch; 27. Moving scraper; 28. Fixed strip; 29. ​​Horizontal... 210. Telescopic rod; 211. No. 1 helical spring; 212. Thrust plate; 213. No. 1 shaft through hole; 214. External connecting rod; 215. Linear reciprocating motor; 216. Linkage plate; 3. Torque controllable linkage mechanism; 31. Hollow disc; 32. Driven pulley; 33. Columnar component mounting cavity; 34. No. 2 shaft mounting hole; 35. Columnar component movable cavity; 36. No. 2 shaft through hole; 37. Inner movable plate; 38. No. 2 helical spring; 39. Arc-shaped contact plate; 310. Inner rotating column; 311. Shaft fixing groove; 312. Linkage shaft; 4. Polishing platform. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] Please refer to Figures 1 and 2. A waste scraper for polishing monocrystalline silicon wafers includes a polishing platform 4 for polishing work, a drive motor with a drive pulley mounted on the end of a rotor, and a drive pulley and a driven pulley 32.

[0029] To achieve the directional driving function of the hollow scraper 21, please refer to Figures 1, 2, 3, and 4. A rotary moving mechanism 1 is required. The mechanism has two symmetrical bottom mounting bases 11 fixedly mounted on the bottom of the polishing platform 4, a horizontal threaded rod 16 mounted between the two bottom mounting bases 11 and capable of rotation, a sliding slider 17 that can move horizontally under the rotation of the horizontal threaded rod 16, and a horizontal limiting rod 12 mounted between the two bottom mounting bases 11 to prevent the sliding slider 17 from rotating. When the drive motor is started, the rotation of the drive motor will drive the hollow disc 31 and the horizontal threaded rod 16 to rotate in a directional manner. Due to the threaded connection, the sliding slider 17 will drive the hollow scraper 21 to move along the length of the polishing platform 4 through the curved connecting rod 110, thereby achieving the directional driving function of the hollow scraper 21.

[0030] For the specific structure of the rotary moving mechanism 1, please refer to Figures 3 and 4. It includes a first shaft mounting hole 13 located in the bottom region of two bottom mounting bases 11. The two bottom mounting bases 11 are symmetrically mounted on the bottom surface of the polishing platform 4 along its length. The two bottom mounting bases 11 are fixedly connected at their opposite ends by a horizontal limiting slide rod 12. A first rotating shaft 14, capable of rotation, is mounted on each bottom mounting base 11 via a bearing inside the first shaft mounting hole 13. A horizontal threaded rod 16 is fixedly mounted between the two first rotating shafts 14 at their opposite ends via a coupling 15. The sliding slider 17 has a limiting slide hole 18 inside, allowing it to slide horizontally along the horizontal limiting slide rod 12. The slider 17 has an internal threaded hole 19 that is installed on the horizontal threaded rod 16 via a threaded structure. A curved connecting rod 110 located on one side of the polishing platform 4 is fixedly installed on one side of the slider 17. The top of the curved connecting rod 110 is provided with a first connecting plate 111 integrally formed with it. The cross-sectional shape of the limiting sliding hole 18 is consistent with the cross-sectional shape of the horizontal limiting sliding rod 12, both being polygonal structures. The cross-sectional dimensions of the limiting sliding hole 18 match the cross-sectional dimensions of the horizontal limiting sliding rod 12. The threaded structure includes an internal thread structure located on the inner circumference of the internal threaded hole 19 and an external thread structure located on the horizontal threaded rod 16, and the internal thread structure and the external thread structure are mutually matched.

[0031] To improve the removal effect of waste, please refer to Figures 1, 2, 5, 6, and 7. A movable scraping mechanism 2 needs to be set up. The mechanism 2 has a hollow scraper 21 located above the polishing platform 4 and movable with the sliding slider 17, a fixed scraper 24 installed at the bottom of the hollow scraper 21 and capable of scraping the waste attached to the surface of the polishing platform 4, and a movable scraper 27 placed inside the hollow scraper 21 and capable of reciprocating motion to move and scrape the waste attached to the surface of the polishing platform 4. The fixed scraper 24 will perform a directional scraping action on the waste on the surface of the polishing platform 4. At the same time, the reciprocating screw of the linear reciprocating motor 214 will drive the fixed scraper 28 to reciprocate along the width direction of the polishing platform 4 through the linkage plate 215. This makes the movable scraper 27 generate a comprehensive scraping motion in two directions on the surface of the polishing platform 4, and make the waste move in a directional manner, thereby improving the scraping motion rate of the waste, improving the removal effect of the waste, and ensuring the polishing quality of the monocrystalline silicon wafer.

[0032] Regarding the specific structure of the movable scraping mechanism 2, please refer to Figures 5, 6, and 7. It includes a second connecting plate 22 fixedly connected to a first connecting plate 111 at one end of the hollow scraper 21. The hollow scraper 21 has a hollow segmented area 23 with an open bottom. A fixed scraper strip 24 is fixedly installed on the bottom of the hollow scraper 21 on one side of the hollow segmented area 23. The hollow scraper 21 has a downward sliding notch 26 with an open bottom on the other side of the hollow segmented area 23. An upper sliding cavity 25 is provided at the top of the downward sliding notch 26. A movable scraper strip 27 capable of reciprocating along the length of the downward sliding notch 26 is placed inside the downward sliding notch 26. The top of the movable scraper strip 27 is embedded in the bottom of a fixed strip 28 located inside the upper sliding cavity 25. A thrust plate 211 integrally formed with the fixed strip 28 is provided on the upper surface of the fixed strip 28. The other end of the hollow scraper 21 is provided with a first shaft through hole 212 connecting the external space and one end of the upper sliding cavity 25. A horizontal telescopic rod 29 passing through the first shaft through hole 212 is fixedly installed on one surface of the thrust plate 211. A first helical spring 210 in a compressed state is placed around the rod body located inside the upper sliding cavity 25. An external connecting rod 213 is fixedly installed at one end of the horizontal telescopic rod 29. A linear reciprocating motor 214 is fixedly installed on the upper surface of the hollow scraper 21. The reciprocating motion screw end of the linear reciprocating motor 214 is fixedly connected to the end of the external connecting rod 213 through a linkage plate 215. The cross-sectional shape of the first shaft through hole 212 is consistent with the cross-sectional shape of the horizontal telescopic rod 29, both being polygonal structures. The cross-sectional dimensions of the first shaft through hole 212 match the cross-sectional dimensions of the horizontal telescopic rod 29.

[0033] To prevent damage to the threaded structure due to torque overload, please refer to Figures 1 and 8. A torque-controllable linkage mechanism 3 needs to be installed. The mechanism includes a rotatable hollow disc 31, an inner rotating column 310 that can drive the first rotating shaft 14 to rotate, and an arc-shaped contact plate 39 that can link the hollow disc 31 and the inner rotating column 310 by friction. During rotation, if the torque intensity between the threaded structures exceeds the force formed by the maximum static friction between the inner rotating column 310 and the arc-shaped contact plate 39, relative rotation will occur between the hollow disc 31 and the arc-shaped contact plate 39. This will not cause the torque resistance to continue to increase, thereby preventing torque overload from damaging the threaded structure.

[0034] Regarding the specific structure of the torque-controllable linkage mechanism 3, please refer to Figure 8. It includes a hollow disc 31 and an inner rotating column 310. A driven pulley 32 is provided on one end face of the hollow disc 31. A cylindrical component mounting cavity 33 is provided at the center of the hollow disc 31. A second shaft mounting hole 34 is provided at the center of one end of the hollow disc 31. A rotatable linkage shaft 312 is mounted inside the second shaft mounting hole 34 via a bearing. One end of the linkage shaft 312 is fixedly connected to the rotating end of one of the first rotating shafts 14. The inner rotating column 310 is placed at the center of the cylindrical component mounting cavity 33. A shaft fixing groove 311 for fixing the linkage shaft 312 is provided at the center of one end of the inner rotating column 310. Multiple annular array columns are arranged around the periphery of the cylindrical component mounting cavity 33 on the hollow disc 31. The cylindrical component movable cavity 35 and the cylindrical component mounting cavity 33 are connected by a second shaft through hole 36. The hollow disk 31 has an inner movable plate 37 that can move along the axial direction of the cylindrical component mounting cavity 33 inside the cylindrical component mounting cavity 33. A second helical spring 38 is installed at one end of the inner movable plate 37, and a connecting shaft that passes through the second shaft through hole 36 is fixedly installed at the other end of the inner movable plate 37. An arc-shaped abutting plate 39 that abuts against the circumferential surface of the inner rotating column 310 is fixedly installed at one end of the connecting shaft located inside the cylindrical component mounting cavity 33. One end of the second helical spring 38 abuts against one end face of the inner movable plate 37, and the other end abuts against one end face of the cylindrical component movable cavity 35. The second helical spring 38 is in a compressed state.

[0035] During operation, firstly, a drive motor with a drive pulley installed at the end of the rotor is used, and the drive pulley and driven pulley 32 are connected. The drive motor and linear reciprocating motor 214 are started. The rotation of the drive motor will drive the hollow disc 31 and the horizontal threaded rod 16 to rotate in a specific direction. Due to the threaded connection, the sliding slider 17 will drive the hollow scraper 21 to move along the length direction of the polishing platform 4 through the curved connecting rod 110. The fixed scraper 24 will perform a directional scraping action on the waste material on the surface of the polishing platform 4. At the same time, the reciprocating screw of the linear reciprocating motor 214 will drive the fixed strip 28 to reciprocate along the width direction of the polishing platform 4 through the linkage plate 215. This makes the moving scraper 27 generate a comprehensive scraping motion in two directions on the surface of the polishing platform 4, and make the waste material move in a specific direction. When the waste material falls from one end of the polishing platform 4, the single scraping work is completed.

[0036] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A waste scraper for polishing single-crystal silicon wafers, comprising a polishing platform (4) for polishing operations, characterized in that: It also includes a rotary moving mechanism (1), which has two symmetrical bottom mounting bases (11) fixedly mounted on the bottom of the polishing platform (4), a horizontal threaded rod (16) mounted between the two bottom mounting bases (11) and capable of rotation, a sliding block (17) capable of horizontal movement under the rotation of the horizontal threaded rod (16), and a horizontal limiting rod (12) mounted between the two bottom mounting bases (11) and capable of preventing the sliding block (17) from rotating; and a movable scraping mechanism (2), which has a hollow scraper (21) located above the polishing platform (4) and capable of moving with the sliding block (17), and a scraper mounted on the bottom of the hollow scraper (21) capable of scraping the surface of the polishing platform. (4) A fixed scraper (24) for scraping off waste on the surface and a movable scraper (27) placed inside the hollow scraper (21) and capable of reciprocating motion to scrape off waste adhering to the surface of the polishing platform (4); a curved connecting rod (110) located on one side of the sliding slider (17) is fixedly installed on one side of the polishing platform (4), and a first connecting plate (111) integrally formed with the top of the curved connecting rod (110); the movable scraping mechanism (2) includes a second connecting plate (22) located at one end of the hollow scraper (21) and fixedly connected to the first connecting plate (111), and the hollow scraper (21) has a hollow dividing area (23) with an open bottom. A fixed scraper (24) is fixedly installed on the bottom of the plate (21) located on one side of the hollow segmentation area (23). The hollow scraper (21) has a lower sliding notch (26) with an open bottom inside the hollow segmentation area (23) on the other side. An upper sliding cavity (25) is provided at the top of the lower sliding notch (26). A movable scraper (27) capable of reciprocating along the length of the lower sliding notch (26) is placed inside the lower sliding notch (26). The top of the movable scraper (27) is embedded in the bottom of a fixed strip (28) located inside the upper sliding cavity (25). A thrust plate (211) integrally formed with the fixed strip (28) is provided on the upper surface of the fixed strip (28). The hollow scraper (21) The other end of the plate (211) is provided with a first shaft through hole (212) connecting the external space and one end of the upper sliding cavity (25). A horizontal telescopic rod (29) passing through the first shaft through hole (212) is fixedly installed on one surface of the thrust plate (211). A first helical spring (210) in a compressed state is placed around the rod body inside the upper sliding cavity (25) of the horizontal telescopic rod (29). An external connecting rod (213) is fixedly installed at one end of the horizontal telescopic rod (29). A linear reciprocating motor (214) is fixedly installed on the upper surface of the hollow scraper (21). The reciprocating motion screw end of the linear reciprocating motor (214) is fixedly connected to the end of the external connecting rod (213) through a linkage plate (215).

2. The waste scraper for polishing single-crystal silicon wafers according to claim 1, characterized in that: The rotary moving mechanism (1) includes a first shaft mounting hole (13) provided in the bottom area of ​​two bottom mounting bases (11). The two bottom mounting bases (11) are symmetrically mounted on the bottom surface of the polishing platform (4) along the length direction of the polishing platform (4). The two bottom mounting bases (11) are fixedly connected at opposite ends by a horizontal limiting slide bar (12). The bottom mounting base (11) has a first rotating shaft (14) that can rotate installed inside the first shaft mounting hole (13) by a bearing. The two first rotating shafts (14) are fixedly installed between opposite ends by a coupling (15) with a horizontal threaded rod (16). The sliding slider (17) has a limiting slide hole (18) that can slide horizontally along the horizontal limiting slide bar (12). The sliding slider (17) has an internal threaded hole (19) installed at the rod body of the horizontal threaded rod (16) by a threaded structure.

3. The waste scraper for polishing single-crystal silicon wafers according to claim 2, characterized in that: The cross-sectional shape of the limiting sliding hole (18) is consistent with the cross-sectional shape of the horizontal limiting sliding rod (12), both being polygonal structures, and the structural dimensions of the cross-section of the limiting sliding hole (18) match the structural dimensions of the cross-section of the horizontal limiting sliding rod (12).

4. The waste scraper for polishing single-crystal silicon wafers according to claim 3, characterized in that: The threaded structure includes an internal thread structure located on the inner wall of the internal threaded hole (19) and an external thread structure located on the body of the horizontal threaded rod (16), and the internal thread structure and the external thread structure are matched with each other.

5. The waste scraper for polishing single-crystal silicon wafers according to claim 4, characterized in that: The cross-sectional shape of the first shaft through hole (212) is consistent with the cross-sectional shape of the horizontal telescopic rod (29), both being polygonal structures, and the structural dimensions of the cross-sectional shape of the first shaft through hole (212) match the structural dimensions of the cross-sectional shape of the horizontal telescopic rod (29).

6. A waste scraper for polishing single-crystal silicon wafers according to any one of claims 2-5, characterized in that: It also includes a torque controllable linkage mechanism (3), which has a rotatable hollow disc (31), an inner rotating column (310) that can drive the first rotating shaft (14) to rotate, and an arc-shaped contact plate (39) that can link the hollow disc (31) and the inner rotating column (310) by means of friction.

7. A waste scraper for polishing single-crystal silicon wafers according to claim 6, characterized in that: The torque-controllable linkage mechanism (3) includes a hollow disc (31) and an inner rotating column (310). A driven pulley (32) is provided on one end face of the hollow disc (31). A cylindrical component mounting cavity (33) is provided in the center of the hollow disc (31). A second shaft mounting hole (34) is provided in the center of one end of the hollow disc (31). A rotatable linkage shaft (312) is installed inside the second shaft mounting hole (34) through a bearing. One end of the linkage shaft (312) is fixedly connected to the rotating end of one of the first rotating shafts (14). An inner rotating column (310) is placed in the center of the cylindrical component mounting cavity (33). A shaft fixing groove (311) for fixing the linkage shaft (312) is provided in the center of one end of the inner rotating column (310). The hollow disc (310) is... 1) Multiple annular array-type movable cylindrical component cavities (35) are provided around the cylindrical component mounting cavity (33). The circumferential side surfaces of the movable cylindrical component cavities (35) and the cylindrical component mounting cavity (33) are connected by a second shaft through hole (36). The hollow disk (31) has an inner movable plate (37) that can move along the axial direction of the cylindrical component mounting cavity (33) inside the cylindrical component mounting cavity (33). A second helical spring (38) is placed at one end of the inner movable plate (37). A connecting shaft that passes through the second shaft through hole (36) is fixedly installed at the other end of the inner movable plate (37). An arc-shaped contact plate (39) that abuts against the circumferential surface of the inner rotating column (310) is fixedly installed at one end of the connecting shaft inside the cylindrical component mounting cavity (33).

8. The waste scraper for polishing single-crystal silicon wafers according to claim 7, characterized in that: One end of the second helical spring (38) abuts against one end face of the inner movable plate (37), and the other end abuts against one end face of the movable cavity (35) of the cylindrical component, and the second helical spring (38) is in a compressed state.

9. A method of using a waste scraper for polishing single-crystal silicon wafers according to claim 8, characterized in that: The process includes the following steps: S1: First, take a drive motor with a drive pulley installed at the end of the rotor, and connect the drive pulley and the driven pulley (32); S2: Start the drive motor and the linear reciprocating motor (214). The rotation of the drive motor will cause the hollow disc (31) and the horizontal threaded rod (16) to rotate in a specific direction. Due to the threaded connection, the sliding slider (17) will drive the hollow scraper (21) to move along the length of the polishing platform (4) through the curved connecting rod (110); S3: The fixed scraper (24) will perform a directional scraping action on the waste material on the surface of the polishing platform (4). At the same time, the reciprocating screw of the linear reciprocating motor (214) will drive the fixed strip (28) to reciprocate along the width direction of the polishing platform (4) through the linkage plate (215), so that the moving scraper (27) will generate a comprehensive scraping action in two directions on the surface of the polishing platform (4) and cause the waste material to move in a directional manner; S4: When the waste material falls from one end of the polishing platform (4), the single scraping work can be completed.

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