A coil-equipped circuit board, a manufacturing method thereof, and an actuator

Abstract

A kind of circuit board with coil and its manufacturing method and actuator, the circuit board includes circuit board and coil, coil is fixedly installed on circuit board;The coil is hollow coil, both ends of the coil wire head are located in the range of the hollow area of coil, and both ends of the wire head are spaced apart and respectively electrically connected with circuit board.The manufacturing method includes the following steps: taking first circuit structural member with several circuit lines;The first circuit structural member is carried out patch production to respectively weld electronic components such as coil on each circuit line, to obtain second circuit structural member;Wherein, before carrying out patch production, the both ends of the coil wire head are shaped to the hollow area;The obtained second circuit structural member is divided into independent circuit board with coil.Borrowing this, the two coil wire heads originally located outside are changed to be placed in the inner circle hollow area, the size of the circuit board with coil can be reduced, and the occupied space of actuator, camera module in equipment (such as mobile phone) is reduced.

Description

Technical Field

[0001] This invention relates to the technical field of electronic product manufacturing, and in particular to a circuit board with a coil, its manufacturing method, and an actuator. Background Technology

[0002] Actuators are commonly found in existing electronic products, such as in camera modules where they control the movement of the lens module. The manufacturing process of actuators typically involves assembling and soldering multiple coils onto a single circuit board. However, existing coil soldering processes present the following problems:

[0003] First, such as Figure 11 As shown, in the traditional coil 2, both lead ends 21 extend outside the coil body, and two solder pads located outside the coil need to be set on the circuit board. This requires a large space to be reserved on the circuit board for the coil installation and soldering, which is not conducive to the miniaturization design of the circuit board.

[0004] Secondly, coil misalignment often occurs during the coil 2 welding process, leading to welding defects. Therefore, existing technologies use fixtures to position the coil. However, existing fixtures typically have positioning grooves to position the outer contour of the coil. Due to the elasticity of the wire during the coil winding process, the outer coil size may bulge or become inconsistent. This results in the coil, even with existing fixtures, still experiencing some misalignment after being welded to the circuit board. Consequently, when assembled onto the actuator, the relative position between the coil and the magnet may also shift, affecting the performance of actuators and other electronic products.

[0005] Finally, after the coil leads are soldered to the pads, glue needs to be applied to both leads and the coil body separately to secure them tightly to the circuit board. This process involves multiple glue applications, is cumbersome, and affects production efficiency. Summary of the Invention

[0006] The purpose of this invention is to provide a circuit board with a coil, a method for manufacturing the same, and an actuator, which can ensure the coil soldering effect and guarantee the performance of electronic products.

[0007] To achieve the above objectives, the solution of the present invention is:

[0008] A circuit board with a coil includes a circuit board and a coil, wherein the coil is mounted and fixed on the circuit board having circuit lines.

[0009] The coil is a hollow coil, with both ends of the coil located within the hollow area of ​​the coil. The two ends of the coil are spaced apart from each other and electrically connected to the circuit lines respectively.

[0010] Further, two pads for electrically connecting with the two end wire heads respectively are arranged on the circuit line of the circuit board, and the two pads are located in the hollow area and are fixedly welded with the two wire heads respectively.

[0011] Further, the coil is fixedly attached to the circuit board, and two recessed areas are arranged on the side of the circuit board close to the coil, the two recessed areas are located in the hollow area, and the two pads are located in the two recessed areas respectively; the two end wire heads are divided into inner wire heads and outer wire heads; the recessed area where the pad connected with the outer wire head is provided with a channel below the coil body, and the channel is used for accommodating the outer wire head.

[0012] The application further provides an actuator comprising the coil-carrying circuit board.

[0013] The application further provides a manufacturing method of the coil-carrying circuit board, comprising the following steps:

[0014] Step 1: taking a first circuit structure part carrying a plurality of circuit lines;

[0015] Step 2: performing SMT production on the first circuit structure part to weld electronic components on the circuit lines respectively, and finally obtaining a second circuit structure part carrying electronic components; the electronic components include a coil;

[0016] In step 2, before the SMT production, the two end wire heads of the coil are shaped into the hollow area, then the coil positioning jig is used to position the coil and the circuit lines on the first circuit structure part, and then the coil positioning jig, the electronic components and the first circuit structure part are sent into the SMT machine to perform the SMT production, so that the two end wire heads of the coil located in the hollow area are electrically connected with the circuit lines respectively;

[0017] Step 3: dividing the second circuit structure part obtained in step 2 into a plurality of independent coil-carrying circuit boards.

[0018] Further, in step 1, a plurality of mutually spaced circuit lines are printed on the substrate in batches to form the first circuit structure part carrying a plurality of circuit lines.

[0019] The substrate comprises a bottom reinforcing plate and a surface insulating layer; and the circuit lines are liquid metal circuit, conductive silver paste circuit or FPC circuit.

[0020] Further, the coil positioning jig comprises a first positioning plate, a pressing plate and a second positioning plate which are stacked in sequence;

[0021] The first positioning plate is provided with a placement area for placing the first circuit structure part on the side close to the pressing plate;

[0022] The pressing plate is abutted against the first positioning plate to limit and fix the first circuit structure, and the pressing plate is provided with two-sided through welding notches and limiting notches; the welding notches are arranged according to the welding area position of the first circuit structure; the limiting notches are arranged according to the position of the electronic components and are matched with the outer contour of the electronic components in shape;

[0023] The second positioning plate is abutted against the pressing plate away from the first positioning plate, and the side close to the pressing plate of the second positioning plate is protruded with a positioning column located in the coil center hole;

[0024] The shape and size of the positioning column of the second positioning plate are matched with the shape and size of the coil center hole.

[0025] Further, the positioning in step 2 includes the following procedures:

[0026] (1) The first circuit structure is placed and fixed on the placement area of the first positioning plate, and then the pressing plate is covered to limit and fix the first circuit structure;

[0027] (2) The tin paste is brushed on the first circuit structure through the limiting notches, and then the electronic components are preliminarily placed on the first circuit structure through the limiting notches; finally, the second positioning plate is covered, and the positioning column protruded at the bottom of the second positioning plate is inserted into the coil center hole to correct and position the coil on the first circuit structure.

[0028] Further, the positioning in step 2 includes the following procedures:

[0029] (1) The first circuit structure is placed and fixed on the placement area of the first positioning plate, and then the pressing plate is covered to limit and fix the first circuit structure;

[0030] (2) The tin paste is brushed on the first circuit structure through the limiting notches, and then the coil in the electronic components is placed in the positioning column of the second positioning plate through the coil center hole, and other electronic components are preliminarily placed in the first circuit structure through the limiting notches; finally, the position between the coil and the first circuit structure is positioned in combination of the second positioning plate, the pressing plate and the first positioning plate.

[0031] Further, the first positioning plate is further provided with at least two spaced positioning members; the pressing plate is provided with a pressing plate through hole for the positioning members to pass through; the second positioning plate is provided with a positioning hole for the positioning members to pass through; the placement area is provided with a plurality of upward protruding inner positioning pins; the first circuit structure is formed with a circuit board through hole for the inner positioning pins to pass through, and the pressing plate is provided with a pressing plate inner through hole for the inner positioning pins to pass through; the outer periphery of the positioning column of the second positioning plate is provided with a plurality of two-sided through second positioning plate through holes.

[0032] By adopting the technical scheme, the two ends of the coil are gathered into the inner hollow area, without occupying the peripheral space of the coil, thereby saving the space after installation of the coil to the maximum, facilitating miniaturization design of the circuit board, and when the coil is fixed by dispensing, the hollow area is only dispensed once, thereby reinforcing the coil body and the two ends of the coil and the circuit board, saving dispensing times and improving production efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0033] Figure 1 A top view of a circuit board with a coil according to an embodiment of the application;

[0034] Figure 2 A perspective view of a circuit board with a coil according to an embodiment of the application;

[0035] Figure 3 An exploded view of a circuit board with a coil according to an embodiment of the application.

[0036] Figure 4 A flow chart of a manufacturing method according to an embodiment of the application;

[0037] Figure 5 A step diagram of a manufacturing method according to an embodiment of the application;

[0038] Figure 6 A perspective view of a coil positioning jig according to an embodiment of the application;

[0039] Figure 7 A partially exploded view of a coil positioning jig according to an embodiment of the application;

[0040] Figure 8 An exploded view of a coil positioning jig according to an embodiment of the application;

[0041] Figure 9 A bottom view of a second positioning plate of a coil positioning jig according to an embodiment of the application;

[0042] Figure 10 A sectional view of a coil positioning jig according to an embodiment of the application;

[0043] Figure 11 A schematic view of a coil.

[0044] Label explanation:

[0045] Circuit board 1, solder pad 11, recessed area 12, give-way channel 13, coil 2, wire end 21, inner wire end 211, outer wire end 212, hollow area 22, coil body 23;

[0046] Substrate 20, reinforcing plate 201, insulating layer 202, circuit line 30, first circuit structure 40, circuit board through hole 41, electronic component 50, second circuit structure 60;

[0047] Coil positioning jig 80, first positioning plate 81, placement area 811, inner positioning pin 8111, positioning member 812, mounting hole 813, pressing plate 82, pressing plate perforation 821, welding gap 822, limiting gap 823, pressing plate inner perforation 824, pressing plate through hole 825, second positioning plate 83, positioning hole 831, positioning column 832, second positioning plate through hole 833, support block 834;

[0048] Circuit board with coil 90. DETAILED DESCRIPTION

[0049] To make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0050] As shown in the drawings, Figures 1 to 3 A circuit board with coil in the embodiment includes a circuit board 1 and a coil 2, and the coil 2 is fixedly installed on the circuit board 1 with circuit lines 30 (see Figure 5 ).

[0051] The coil 2 is a runway-type hollow coil 2, both ends of the coil 2 are located within the hollow area 22 of the coil 2, and both ends of the coil 2 are spaced apart and electrically connected to the circuit board 1.

[0052] Therefore, by gathering both ends of the coil 2 into the hollow area 22, the peripheral space of the coil 2 can be saved, the space after installation of the coil 2 can be maximally saved, the miniaturization design of the circuit board 1 can be facilitated, and the both ends of the coil 2 are gathered in the hollow area 22, so that the circuit board 1 can be fixed by dispensing only once in the hollow area 22, the coil 2 and both ends of the coil 2 can be reinforced, the dispensing frequency can be saved, and the production efficiency can be improved.

[0053] In the embodiment, the circuit board 1 is provided with two pads 11 for electrically connecting to both ends of the coil 2, and the two pads 11 are located within the hollow area 22 and are respectively welded and fixed to both ends of the coil 2. The coil 2 in the embodiment can be electrically connected and fixed to the circuit board 1 by means of surface mounting.

[0054] The coil 2 can be fixedly attached to the circuit board 1; the circuit board 1 is provided with two recessed areas 12 spaced apart on the side surface close to the coil 2, the recessed areas 12 are located within the hollow area 22, and the two pads 11 are respectively located within the two recessed areas 12.

[0055] By setting the recessed area 12, the two pads 11 can be further physically separated, and the mutual interference of the two wire ends 21 and the two pads 11 when respectively welded in the narrow hollow area 22 can be avoided, and the occurrence of short circuit can be avoided.

[0056] Meanwhile, the two ends of the coil 2 can be divided into inner wire ends 211 and outer wire ends 212, the inner wire ends 211 can be retained in the hollow area 22 after the winding of the coil 2 is completed, and the outer wire ends 212 can extend in the hollow area 22 after passing through the coil body 23 from outside to inside. Thus, the recessed area 12 where the pad 11 connected with the outer wire end 212 is located also has a giving passage 13 below the coil body 23, which is used for accommodating the outer wire end 212, so that the coil 2 can be tightly attached to the circuit board 1, the coil 2 is prevented from being raised on one side, the tightness of the two ends of the coil 2 and the pad 11 is ensured, the welding effect is guaranteed, and virtual welding and missing welding are avoided.

[0057] In the embodiment, the two pads 11 are located on the side of the circuit board 1 close to the coil 2, and of course, the two pads 11 can also be located on the side of the circuit board 1 away from the coil 2 (not shown in the figure), at this time, the two wire ends 21 can pass through the circuit board 1 and then be welded and fixed to the two pads 11.

[0058] Further, the two pads 11 can be located on the side of the circuit board 1 close to the coil 2 and on the side of the circuit board 1 away from the coil 2, respectively, so that one of the wire ends 21 passes through the circuit board 1, and the two wire ends 21 can be welded and fixed to the two pads 11.

[0059] As can be seen from the above, the pad 11 is located in the hollow area 22 of the coil 2 and can be welded with the wire end 21 in the hollow area 22, and is not limited to being arranged on which side of the circuit board 1.

[0060] In the embodiment, the circuit board 1 can be an FPC circuit board or a liquid metal circuit board. The hollow area 22 can be formed by dispensing glue (not shown in the figure), and the glue can be used to bond and reinforce the coil body 23, the wire end 21 and the circuit board 1.

[0061] As shown in FIGS. 1 and 2, the embodiment further provides a manufacturing method for producing the circuit board with the coil, which comprises the following steps: Figure 4 Figure 5 Step 1: Take a first circuit structure 40 with a plurality of circuit lines 30.

[0062] Step 1: Take a first circuit structure 40 with a plurality of circuit lines 30.

[0063] ​Specifically, the first circuit structure 40 can be formed by printing a plurality of circuit lines 30 on the substrate 20 in batches; the substrate 20 can be a structure including a bottom reinforcing plate 201 and a surface insulating layer 202, the reinforcing plate 201 can be made of stainless steel, bakelite or other hard materials, and the insulating layer 202 can be made of PI (polyimide) or other materials; the circuit line 30 can be a liquid metal circuit, a conductive silver paste circuit or an FPC (Flexible Printed Circuit) circuit; in this way, the circuit line 30 can be printed on the surface of the substrate 20 in batches, which can greatly improve the forming efficiency of the circuit line 30 and improve the structural strength of the circuit board by the reinforcing plate 201; and the use of liquid metal circuit, conductive silver paste circuit or FPC circuit can reduce the product size and weight.

[0064] Step 2: The first circuit structure 40 is produced by SMT process or other process to weld and fix the electronic components 50 on each circuit line 30, and finally the second circuit structure 60 with electronic components 50 is obtained; the electronic components 50 can be Hall elements, capacitors, coils 2 or driving chips, etc.

[0065] In step 2, before the production by SMT process, the two ends of the coil 2 can be shaped into the hollow area 22, and then the coil positioning jig 80 is used to position the coil 2 and the circuit line 30 on the first circuit structure 40, and then the coil positioning jig 80, the electronic components 50 such as the coil 2 and the first circuit structure 40 are directly sent to the SMT machine for production, so that the two ends of the coil 2 in the hollow area 22 are electrically connected with the circuit line 30.

[0066] Step 3: The second circuit structure 60 is divided into a plurality of independent coil-equipped circuit boards 90 with electronic components 50 and circuit lines 30.

[0067] Therefore, by printing the circuit line 30 in batches and then producing by SMT process in batches, the welding efficiency of the electronic components 50 is greatly improved; by shaping the coil 2 inward, the space can be saved, which is convenient for miniaturization of circuit design, and the coil positioning jig 80 is used to ensure the position accuracy between the coil 2 and the circuit line 30 after welding, which can effectively ensure the performance of the subsequent circuit board assembled on the camera module actuator or other electronic products.

[0068] Meanwhile, in step 3, before dividing the second circuit structure 60, the hollow areas 22 of each coil 2 that are welded and fixed on the second circuit structure 60 can be fixed by applying glue. Each coil 2 only needs to be glued once to simultaneously achieve the bonding and fixing between the two wire ends 21 and the coil body 23 and the circuit board. In mass production, the number of glue applications can be significantly reduced and production efficiency can be improved.

[0069] For example Figures 6 to 10 As shown, specifically, the coil positioning fixture 80 provided in this embodiment includes a first positioning plate 81, a pressure plate 82, and a second positioning plate 83 stacked in sequence.

[0070] The top surface of the first positioning plate 81 near the pressure plate 82 is provided with a placement area 811 for the first circuit structure component 40 and at least two spaced positioning components 812.

[0071] The pressure plate 82 covers and abuts against the top of the first positioning plate 81, and has a pressure plate through hole 821 for the positioning member 812 to pass through. The pressure plate 82 also has a welding notch 822 and a limiting notch 823 that are both through the top and bottom surfaces. The welding notch 822 is set according to the welding area position of the first circuit structure 40, and the limiting notch 823 is set according to the position of the electronic components 50 such as the coil 2 and its shape matches the outer contour of the electronic components 50 such as the coil 2.

[0072] The second positioning plate 83 covers and abuts against the pressure plate 82 away from the first positioning plate 81, and is provided with a positioning hole 831 for the positioning member 812 to pass through. The bottom surface of the second positioning plate 83 near the pressure plate 82 also has a protruding positioning post 832 that is located in the center hole of the coil 2.

[0073] Therefore, in step 2, when the coil 2 is welded with the aid of the coil positioning jig 80, the first circuit structure 40 can be placed and fixed on the placement area 811 of the first positioning plate 81 in advance, and then the first circuit structure 40 is further fixed and positioned by covering the pressing plate 82 after aligning the pressing plate hole 821 and the positioning piece 812, at this time, the solder paste can be brushed, and then the coil 2 and other electronic components 50 are preliminarily positioned on the first circuit structure 40 by means of the limiting notch 823, and then the second positioning plate 83 is covered after aligning the positioning hole 831 and the positioning piece 812, and the positioning column 832 protruding from the bottom of the second positioning plate 83 is inserted into the center hole of the coil 2, so that the coil 2 on the first circuit structure 40 is positioned and corrected, ensuring that the coil 2 can be accurately positioned at the preset position of the first circuit structure 40, and finally the positioning jig is sent to the patch equipment for welding production, so that the coil 2 and other electronic components 50 and the first circuit structure 40 are accurately positioned and reliably connected and fixed, which can effectively ensure the performance of the subsequent circuit board assembled on the electronic product, for example, ensuring that the coil 2 center of the FPC assembled on the actuator can be accurately positioned on the magnet, ensuring that the induction and cooperation between the magnet and the magnet are reliable and stable. Moreover, the positioning column 832 above the pressing plate 82 does not interfere with the first circuit structure 40 below the pressing plate 82, which can adapt to different styles of circuit boards, has stronger practicability and better adaptability.

[0074] The positioning piece 812, the pressing plate hole 821 and the positioning hole 831 are matched to realize the positioning and matching of the first positioning plate 81, the pressing plate 82 and the second positioning plate 83 in the embodiment, which has a relatively simple structure, and of course other positioning methods can also be used for positioning, which is not limited thereto.

[0075] In the embodiment, the top surface of the first positioning plate 81 can be provided with a plurality of placement areas 811 to correspond to each circuit line 30 on the first circuit structure 40 respectively, and 24 placement areas 811 are taken as an example for description in the embodiment, and the number of the welding notch 822 and the limiting notch 823 of the pressing plate 82 and the positioning column 832 of the second positioning plate 83 can be increased correspondingly.

[0076] In the embodiment, the placement areas 811 on the first positioning plate 81 can be arranged in sequence along the length direction of the first positioning plate 81, and a positioning piece 812 can be arranged at the diagonal position of the length direction of the first positioning plate 81, which can be a positioning pin, and the first positioning plate 81 is provided with a mounting hole 813 for fixing the positioning pin, and of course the number and structure of the specific positioning piece 812 are not limited to the embodiment.

[0077] The placing area 811 can also be provided with several upward protruding inner positioning pins 8111. In this embodiment, two left and right spaced inner positioning pins 8111 are provided in each placing area 811. The first circuit structure 40 is provided with circuit board through holes 41 for the inner positioning pins 8111 to pass through, and the pressing plate 82 is provided with pressing plate inner through holes 824 for the inner positioning pins 8111 to pass through. In this way, the positioning and cooperation of the first circuit structure 40 and the placing area 811 can be facilitated, and the fixing of the pressing plate 82 to the first circuit structure 40 and the positioning and cooperation of the pressing plate 82 and the first positioning plate 81 can be enhanced.

[0078] In this embodiment, the outer periphery of the positioning column 832 of the second positioning plate 83 can be provided with several second positioning plate through holes 833 penetrating through the upper and lower surfaces. In this embodiment, four second positioning plate through holes 833 are distributed in front, back, left and right. The second positioning plate through holes 833 can be used to reduce the weight of the second positioning plate 83, facilitate the transfer of the jig for production, and manually correct the coil 2 as needed through the second positioning plate through holes 833.

[0079] In this embodiment, the shape and size of the positioning column 832 of the second positioning plate 83 are adaptively set according to the shape and size of the center hole of the coil 2. In this embodiment, the coil 2 is a racetrack coil 2, and the corresponding positioning column 832 can be a rounded rectangular protruding column, which can accurately position and insert into the coil 2.

[0080] The bottom surface of the second positioning plate 83 can also protrude several support blocks 834, which can prevent the second positioning plate 83 from excessively pressing the coil 2. In this embodiment, one support block 834 is provided at each corner of the second positioning plate 83, and the pressing plate 82 can be provided with pressing plate through holes 825 for the support blocks 834 to pass through, which can further increase the assembly accuracy between the second positioning plate 83 and the first positioning plate 81 and the pressing plate 82.

[0081] In this embodiment, the first positioning plate 81, the pressing plate 82 and the second positioning plate 83 are sequentially arranged from bottom to top. Of course, the second positioning plate 83 can also be placed below, and then the pressing plate 82, the first circuit structure 40 and the first positioning plate 81 are assembled and covered above the second positioning plate 83 and the coils 2 after the coils 2 are fixed and positioned. The same positioning and correction of the coils 2 can also be achieved.

[0082] In summary, the actuator manufactured by the above manufacturing method can have good product performance.

[0083] The above merely describes preferred embodiments of the present application, and the protection scope of the present application is not limited to the above-described embodiments. Any technical scheme falling within the concept of the present application shall fall within the protection scope of the present application. It should be noted that equivalent changes and modifications made by those of ordinary skill in the art without departing from the principles of the present application shall still fall within the protection scope of the present application.

[0084] In the description of the embodiments of the present application, it should be understood that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly used when the product of the present application is used, or the orientation or positional relationship commonly understood by those skilled in the art, and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0085] In addition, the terms "first", "second", "third", etc. are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" and "several" is two or more, unless otherwise explicitly specified and limited.

[0086] In the description of the embodiments of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "set", "install", "connect", "connected" should be understood in a broad sense, for example, can be fixedly connected, can be detachably connected, or integrally connected; can be mechanically connected, or electrically connected or can communicate with each other; can be directly connected, or indirectly connected through an intermediate medium, or the communication between two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0087] In addition, the present application provides various specific examples of processes and materials, but those of ordinary skill in the art can realize the application of other processes and / or the use of other materials.

Claims

1. A method of manufacturing a circuit board with a coil, characterized by: The method comprises the following steps: Step 1: taking a first circuit structure part with a plurality of circuit lines; Step 2: carrying out patch production on the first circuit structure part to respectively weld electronic components on the circuit lines, and finally obtaining a second circuit structure part with electronic components; the electronic components include coils; In step 2, before the patch production, the two end wires of the coil are shaped into the hollow area, then the coil positioning jig is used to position the coil and the circuit lines on the first circuit structure part, and then the coil positioning jig, the electronic components and the first circuit structure part are sent into the patch machine to carry out patch production, so that the two end wires of the coil in the hollow area are respectively electrically connected with the circuit lines; Step 3: dividing the second circuit structure part obtained in step 2 into independent circuit boards with coils; The coil positioning jig comprises a first positioning plate, a pressing plate and a second positioning plate which are stacked in sequence; The first positioning plate is provided with a placement area for placing the first circuit structure part on one side close to the pressing plate; The pressing plate is abutted against the first positioning plate to limit and fix the first circuit structure part, and the pressing plate is provided with a welding gap and a limiting gap which penetrate through two sides; the welding gap is arranged according to the welding area position of the first circuit structure part; the limiting gap is arranged according to the position of the electronic components and is matched with the outer contour of the electronic components; The second positioning plate is abutted against the pressing plate away from the first positioning plate, and the second positioning plate is provided with a positioning column for the coil center hole on one side close to the pressing plate; The shape and size of the positioning column of the second positioning plate are matched with the shape and size of the coil center hole.

2. The method of manufacturing a circuit board with a coil according to claim 1, characterized by: In step 1, a plurality of mutually spaced circuit lines are printed on a substrate to form the first circuit structure part with a plurality of circuit lines; The substrate comprises a bottom reinforcing plate and a surface insulating layer; the circuit lines are liquid metal circuits or FPC circuits.

3. The method according to claim 1, characterized in that: The positioning in step 2 comprises the following procedures: (1) placing and fixing the first circuit structure part on the placement area of the first positioning plate, and then covering the pressing plate to limit and fix the first circuit structure part; (2) brushing tin paste on the first circuit structure part through the limiting gap, and then preliminarily limiting and placing the electronic components on the first circuit structure part through the limiting gap; finally, covering the second positioning plate, and inserting the positioning column at the bottom of the second positioning plate into the coil center hole to correct and position the coil on the first circuit structure part.

4. The method according to claim 1, characterized in that: The positioning in step 2 comprises the following procedures: (1) placing and fixing the first circuit structure part on the placement area of the first positioning plate, and then covering the pressing plate to limit and fix the first circuit structure part; (2) The coil in the electronic component is placed in the positioning column of the second positioning plate through the coil center hole by brushing tin paste on the first circuit structure member through the limiting gap, and other electronic components are preliminarily placed in the first circuit structure through the limiting gap; finally, the position between the coil and the first circuit structure member is positioned in combination with the second positioning plate, the pressing plate and the first positioning plate.

5. The method of manufacturing a circuit board with a coil according to claim 1, characterized by: In step 3, before the second circuit structure member is segmented, the hollow area of each coil fixedly welded on the second circuit structure member is fixed by dispensing.

6. A circuit board with a coil, characterized by: Manufactured by the manufacturing method as claimed in claim 1.

7. An actuator characterized by, A circuit board with a coil manufactured by the manufacturing method as claimed in claim 1.

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