Wafer thinning equipment

Abstract

The invention relates to the technical field of wafer processing, in particular to wafer thinning equipment, which comprises a machine core assembly arranged on a bearing surface and used for thinning a wafer; the damping assembly is arranged at the bottom of the machine core assembly; the supporting frame assembly is combined on the machine core assembly; the transferring and cleaning assembly is arranged on the supporting frame assembly and used for conveying a wafer to be processed to the machine core assembly; the transfer cleaning assembly is also used for cleaning the wafer thinned by the machine core assembly; wherein the machine core assembly is configured as a rigid supporting piece for the wafer thinning equipment to be in contact with the bearing surface. The machine core assembly is directly arranged on the bearing face, the damping assembly is arranged between the machine core assembly and the bearing face, damping is conducted on the machine core assembly through the damping assembly, transmission through other parts is not needed any more, and therefore when the machine core assembly vibrates, the damping assembly can rapidly buffer and absorb the vibration, and the machine core assembly works stably.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer processing, and in particular to a wafer thinning device. BACKGROUND

[0002] In the field of wafer processing, the existing wafer processing device has a frame as a support, and precise machining components and auxiliary components are arranged on the frame, and a damping structure is arranged at the bottom of the frame. When the existing wafer processing device works and vibrates, the precise machining components and auxiliary components are arranged on the frame, and the precise machining components and auxiliary components vibrate with the frame. The damping structure arranged at the bottom of the frame first damps the frame, and then indirectly damps the precise machining components, which has weak effect and easily affects the machining precision of the movement core. SUMMARY

[0003] The present application aims to at least solve one of the problems in the prior art or related art.

[0004] To this end, the present application provides a wafer thinning device, and the movement core component is configured as a rigid support of the wafer thinning device in contact with the bearing surface, so that the movement core component improves the stability and precision of the machining process.

[0005] According to the wafer thinning device of the first aspect of the present application, the wafer thinning device comprises: a movement core component arranged on the bearing surface and used for thinning the wafer; a damping component arranged at the bottom of the movement core component; a support frame component combined with the movement core component; a transfer and cleaning component arranged on the support frame component and used for transferring the wafer to be processed to the movement core component; the transfer and cleaning component is also used for cleaning the wafer thinned by the movement core component and transferring the cleaned wafer to a collection box; The movement core component is configured as a rigid support of the wafer thinning device in contact with the bearing surface.

[0006] Optionally, the movement core component comprises: a rack arranged on the bearing surface; a base module arranged on the rack; a turntable module rotatably installed on the base module; a wire harness arranged in the base module, one end of the wire harness being connected with an external control system, and the other end of the wire harness being connected with the turntable module.

[0007] Optionally, the support frame component comprises: a support bottom frame fixedly connected with a bottom position close to the rack; An auxiliary frame is sleeved on the core assembly and fixedly installed on the support bottom frame, a bearing space is formed between the auxiliary frame and the support bottom frame, and the transfer and cleaning assembly is arranged in the bearing space.

[0008] Optionally, the core assembly further comprises: a main shaft located above the rotary table module; a driving module arranged on the rack and connected with the auxiliary frame, the driving module being located at one side of the rotary table module and connected with the main shaft, and the driving module being configured to drive the main shaft to descend so as to thin the wafer on the rotary table module.

[0009] Optionally, the transfer and cleaning assembly comprises: a transfer module arranged on the auxiliary frame and close to the core assembly, the transfer module being configured to deliver the wafer to be processed to the core assembly; a cleaning module arranged on the support bottom frame and connected with the auxiliary frame, the cleaning module being located below the transfer module, and the transfer module being further configured to transfer the thinned wafer of the core assembly to the cleaning module for cleaning; wherein the cleaning module and the transfer module are located at the side of the rotary table module away from the driving module.

[0010] Optionally, the rotary table module comprises: a rotating disc rotatably installed on the base module; a plurality of wafer bearing discs arranged on the rotating disc, and the axes of the plurality of wafer bearing discs being arranged around the axis of the rotating disc; a rotating shaft coaxially and fixedly installed at the bottom of the rotating disc; the base module comprises: a base shell, part of the rotating shaft extending into the base shell, and an activity space for the wire harness to move being formed between the base shell and the rotating shaft extending into the base shell; a first hinge member hingedly connected to the inner wall of the base shell; a second hinge member hingedly connected to the rotating shaft; wherein the first hinge member and the second hinge member are both rotatably connected with the wire harness.

[0011] Optionally, when the second hinge member rotates with the rotating shaft, the rotation range of the second hinge member is -240° to 0° or 0° to 240°, starting from the position where the second hinge member is close to the first hinge member.

[0012] Optionally, the base shell is provided with an access opening in communication with the activity space.

[0013] Optionally, the base module further comprises: a pipeline baffle arranged in the activity space and close to one side of the access opening, the pipeline baffle being configured to block part of the wire harness from extending out of the access opening when the wire harness rotates with the rotating shaft.

[0014] Optionally, the pipeline baffle comprises: a first baffle unit arranged in an arc shape on the moving path of the wire harness, a center of the first baffle unit being on the axis of the rotating shaft; two second baffle units arranged at two ends of the first baffle unit in contact with the wire harness, the second baffle units being curved away from the rotating shaft.

[0015] The technical scheme has at least the following advantages or beneficial effects: The wafer thinning device provided by the embodiment of the present application comprises a core assembly, a damping assembly, a support frame assembly and a transfer and cleaning assembly. The core assembly is directly arranged on a bearing surface. The damping assembly is arranged between the core assembly and the bearing surface, and the core assembly is damped through the damping assembly. The support frame assembly is fixedly installed on the core assembly. The transfer and cleaning assembly is arranged on the core assembly. When the transfer and cleaning assembly works and generates vibration, the vibration is transmitted to the core assembly through the support frame assembly. In the transmission process, the support frame assembly consumes and weakens part of the vibration. When the vibration is transmitted to the core assembly, the damping assembly installed on the core assembly plays a role. The damping assembly is arranged between the bearing surface and the core assembly, and directly damps the core assembly through the damping assembly, so that the damping assembly can quickly buffer and absorb the vibration when the core assembly vibrates, so that the core assembly can work stably. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 A perspective structural schematic diagram of a wafer thinning device provided by an embodiment of the present application is shown. Figure 2 A front view structural schematic diagram of a wafer thinning device provided by an embodiment of the present application is shown. Figure 3 A perspective structural schematic diagram of a rotating shaft base module provided by an embodiment of the present application is shown. Figure 4 A top view structural schematic diagram of a base module provided by an embodiment of the present application is shown.

[0017] REFERENCE NUMERALS 100 - core assembly, 200 - damping assembly, 300 - support frame assembly, 400 - transfer and cleaning assembly, 500 - bearing surface, 600 - auxiliary support seat 110 - rack, 120 - base module, 130 - rotary table module, 140 - wire harness, 150 - main shaft, 160 - driving module 131 - rotating disc, 132 - wafer bearing disc, 133 - rotating shaft 310 - support bottom frame, 320 - auxiliary frame 410-transport module, 420-washing module; 121-base shell, 122-first hinge, 123-second hinge, 124-pipeline baffle; 124a-first baffle unit, 124b-second baffle unit; 101-active space, 102-access hole, 301-bearing space. DETAILED DESCRIPTION

[0018] In order to better explain the present application, in order to facilitate understanding, the following will be combined with the drawings, through specific embodiments, the present application is described in detail.

[0019] The wafer thinning equipment is an ultra-precision machining equipment for precision grinding of semiconductor wafers. The core function of the wafer thinning equipment is to reduce the thickness of the wafer through precision machining of the core, so as to meet the needs of advanced packaging and integrated circuits.

[0020] In the prior art, such equipment usually adopts a frame structure design, taking the frame as the overall support basis, and arranging the core, the transport module and the washing module and other functional components on it. However, the traditional architecture has significant defects: the shock absorbing support structure is usually placed under the frame, which indirectly provides shock absorption for the core, but the effect is limited, and it cannot effectively suppress the vibration transmission during equipment operation. Vibration interference will directly lead to an increase in surface roughness and size deviation, which seriously restricts product quality and yield.

[0021] In order to at least solve one of the technical problems existing in the prior art or related art, the present application provides a wafer thinning equipment, which comprises a core assembly, a shock absorbing assembly, a support frame assembly and a transport and washing assembly. The core assembly is directly arranged on the bearing surface, the shock absorbing assembly is arranged between the core assembly and the bearing surface, and the shock absorbing assembly directly absorbs the shock of the core assembly. The support frame assembly is fixedly installed on the core assembly, and the transport and washing assembly is arranged on the core assembly. When the transport and washing assembly generates vibration and transmits it to the core assembly through the frame assembly, the shock absorbing assembly at the bottom of the core assembly directly absorbs the vibration. The shock absorbing assembly can quickly buffer and absorb the vibration, so as to make the core assembly work stably.

[0022] A wafer thinning equipment according to the present application is described below with reference to the accompanying drawings.

[0023] Referring to Figures 1 to 4The wafer thinning equipment provided by the present application comprises: a core component 100 arranged on a bearing surface 500 and used for wafer thinning processing; a shock absorption component 200 arranged at the bottom of the core component 100; a support frame component 300 combined with the core component 100; and a transfer and cleaning component 400 arranged on the support frame component 300 and used for transferring wafers to be processed to the core component 100; the transfer and cleaning component 400 is also used for cleaning the wafers thinned by the core component 100 and transferring the cleaned wafers to a collection box; wherein the core component 100 is configured as a rigid support of the wafer thinning equipment in contact with the bearing surface 500.

[0024] The wafer thinning equipment provided by the present application comprises: a core component 100 arranged on a bearing surface 500 and used for wafer thinning processing; a shock absorption component 200 arranged at the bottom of the core component 100; a support frame component 300 combined with the core component 100; and a transfer and cleaning component 400 arranged on the support frame component 300 and used for transferring wafers to be processed to the core component 100; the transfer and cleaning component 400 is also used for cleaning the wafers thinned by the core component 100 and transferring the cleaned wafers to a collection box; wherein the core component 100 is configured as a rigid support of the wafer thinning equipment in contact with the bearing surface 500.

[0025] In the present technical solution, the core component 100 is directly arranged on the bearing surface 500 and directly contacts the bearing surface 500, so that the core component 100 is configured as a rigid support of the wafer thinning equipment in contact with the bearing surface 500, which is different from the traditional way of taking a frame structure as the main support. The contact and support between the whole wafer thinning equipment and the bearing surface 500 are arranged as the core component 100, so that the core component 100 can be more stably erected on the bearing surface 500, greatly enhancing the stability of the core component 100 and fundamentally ensuring the stability and precision of the machining process of the core component 100.

[0026] The damping assembly 200 is arranged at the bottom of the core assembly 100 and is in contact with the bearing surface 500. The damping assembly 200 can directly damp the core assembly 100. During processing, when the core assembly 100 is affected by vibration factors, the damping assembly 200 can quickly buffer and absorb the vibration, so that the vibration transmitted to the core assembly 100 is greatly reduced. Unlike the traditional way of indirectly damping the core assembly 100 by placing a damping support structure under the support frame, the damping arrangement directly connected to the core assembly 100 is more effective and can greatly improve the damping effect of the core assembly 100 and reduce the adverse effects of vibration on the processing precision of the core assembly 100. For example, the damping assembly 200 can be a damping pad, but is not limited to this. The damping pad is arranged at the bottom of the core assembly 100 and is in contact with the bearing surface 500. By arranging the damping pad, a gap can be formed between the core assembly 100 and the bearing surface 500. This gap allows the forklift or crane to directly contact the bottom surface of the core during equipment transfer, thereby facilitating transfer.

[0027] The support frame assembly 300 is mounted on the core assembly 100, and the transfer and cleaning assembly 400 is mounted on the support frame assembly 300. The support frame assembly 300 integrates the transfer and cleaning assembly 400 with the core assembly 100. The transfer and cleaning assembly 400 is connected to the core assembly 100 through the support frame assembly 300. The transfer and cleaning assembly 400 is mounted on the support frame assembly 300 and plays an important role. It is responsible for transporting the wafers to be processed to the core assembly 100 to ensure the continuity of material supply in the processing process. At the same time, it can also clean the thinned wafers after processing by the core assembly 100 and collect the cleaned wafers to prepare for subsequent wafer operations.

[0028] For example, in the prior art, the overall device of the wafer thinning equipment uses a frame structure as the main support. The core assembly 100 and other components such as the transfer and cleaning assembly 400 are arranged on the frame structure. When the transfer and cleaning assembly 400 or other components on the frame structure shake, the vibration is transmitted to the core assembly 100 through the frame structure. As known from the above, since the core assembly 100 and other components such as the transfer and cleaning assembly 400 are arranged on the frame structure, when the frame structure vibrates, all structures on the frame structure will vibrate together. When the damping assembly 200 is arranged on the frame structure, the damping assembly 200 first damps the frame structure. When the vibration of the frame structure is reduced, the core assembly 100 and the transfer and cleaning assembly 400 on the frame structure can also be damped. Therefore, in the prior art, when the transfer and cleaning assembly 400 works and vibrates, it will affect the working precision of the core assembly 100 on the frame structure, thereby affecting the product quality of the thinned wafers. In the technical solution, the movement core assembly 100 is directly arranged on the bearing surface 500, the support frame assembly 300 is combined on the movement core assembly 100, and the transfer and cleaning assembly 400 is arranged on the support frame assembly 300. When the transfer and cleaning assembly 400 works and generates vibration, the vibration is transmitted to the movement core assembly 100 through the support frame assembly 300. In the transmission process, the support frame assembly 300 consumes and weakens part of the vibration. When the vibration is transmitted to the movement core assembly 100, the shock-absorbing assembly 200 installed on the movement core assembly 100 plays a role. The shock-absorbing assembly 200 is arranged between the bearing surface 500 and the movement core assembly 100, directly absorbs the vibration of the movement core assembly 100 through the shock-absorbing assembly 200, and no longer needs to be transmitted through other components. Therefore, when the movement core assembly 100 vibrates, the shock-absorbing assembly 200 can quickly buffer and absorb the vibration, so that the movement core assembly 100 can work stably.

[0029] Referring to Figures 1 to 4 In some examples, the movement core assembly 100 includes a rack 110 arranged on the bearing surface 500, a base module 120 arranged on the rack 110, a turntable module 130 rotatably installed on the base module 120, and a wire harness 140 arranged in the base module 120. One end of the wire harness 140 is connected with an external control system, and the other end of the wire harness 140 is connected with the turntable module 130.

[0030] In the technical solution, the rack 110 is arranged on the bearing surface 500 and serves as a basic support component of the movement core assembly 100, providing a stable mounting platform for the entire movement core assembly 100. The base module 120 is installed on the rack 110, and the turntable module 130 is installed on the base module 120. For example, the driving source of the turntable module 130 is arranged on the rack 110 to provide the required rotating power for the turntable module 130, enabling the turntable module 130 to rotate at a predetermined speed, direction, and other parameters. The main function of the turntable module 130 is to carry the wafer that needs to be thinned. When the turntable module 130 starts to rotate, the wafer moves with the rotation of the turntable. The wire harness 140 is arranged in the base module 120 and plays a role in electric control, gas control, and liquid control transmission in the equipment. One end of the wire harness 140 is connected with an external control system, and the other end of the wire harness 140 is connected with the turntable module 130. The wire harness 140 transmits electric control, gas control, and liquid control instructions from the control system to the turntable module 130, realizing the transmission of electric energy, gas, and liquid operations to the turntable module 130. Arranging the wire harness 140 in the base module 120 can first reduce the occupation of external space of the base module 120. At the same time, the base module 120 provides a relatively stable and safe space for the wire harness 140, protecting the wire harness 140 from external interference, collision, and other factors during equipment operation, and ensuring the stability of electric energy, gas, and liquid transmission.

[0031] Exemplarily, the size of the base module 120 is reduced to the minimum size without affecting the operation of other devices, so as to save the space of the overall device occupied by the base module 120.

[0032] Exemplarily, the wire harness 140 includes but is not limited to water pipes, gas pipes and cables, and the transmission of electric energy, gas, liquid and signals can be realized through the wire harness 140. The constraint mode of the wire harness 140 includes but is not limited to two modes, one is the mode of drag chain constraint, and the other is the mode of pipe and wire constraint.

[0033] Referring to Figure 1 and Figure 2 In some examples, the support frame assembly 300 includes a support bottom frame 310 fixedly connected to a position close to the bottom of the rack 110, and an auxiliary frame 320 sleeved on the core assembly 100 and fixedly installed on the support bottom frame 310. A bearing space 301 is formed between the auxiliary frame 320 and the support bottom frame 310, and the transfer and cleaning assembly 400 is arranged in the bearing space 301.

[0034] In the technical scheme, the support frame assembly 300 includes the support bottom frame 310 and the auxiliary frame 320. The support bottom frame 310 is fixedly connected to a position close to the bottom of the rack 110, thereby providing a firm base support point for the entire support frame assembly 300. By being connected to the bottom of the rack 110, the support bottom frame 310 tightly combines the support frame assembly 300 and the rack 110 of the core assembly 100 together to form a stable overall structure. The auxiliary frame 320 is sleeved on the core assembly 100 and fixedly installed on the support bottom frame 310. The auxiliary frame 320 is sleeved outside the core assembly 100 to play a certain protection role, preventing external objects from accidentally colliding with the core assembly 100 and affecting the normal work of the core assembly 100. Moreover, by being fixedly connected to the support bottom frame 310, the structural strength of the entire support frame assembly 300 is enhanced. The auxiliary frame 320 and the support bottom frame 310 jointly constitute the overall structure of the frame, thereby improving the overall rigidity of the device and further reducing the risk of structural deformation caused by external vibration, impact force and other factors. Exemplarily, the core assembly 100 can be connected to the auxiliary frame 320.

[0035] The auxiliary frame 320 and the support bottom frame 310 form the bearing space 301, and the transfer and cleaning assembly 400 is arranged in the bearing space 301. Therefore, the structural layout of the wafer thinning device is more compact and reasonable. The bearing space 301 provides a stable mounting position for the transfer and cleaning assembly 400, thereby avoiding the shaking or displacement of the transfer and cleaning assembly 400 during the operation of the device, and ensuring that the transfer and cleaning assembly 400 can accurately and stably transport the wafer to be processed and the wafer after cleaning to the core assembly 100.

[0036] Exemplarily, the bottom of the support frame 310 can also be provided with an auxiliary support seat 600 for auxiliary support. When the support frame assembly 300 shakes, the auxiliary support seat 600 will contact the bearing surface 500, thereby playing a role of auxiliary support for the support frame assembly 300.

[0037] Referring to Figures 1 to 4 In some examples, the machine core assembly 100 further comprises a main shaft 150 located above the turntable module 130, and a driving module 160 arranged on the rack 110 and connected with the auxiliary frame 320. The driving module 160 is located on one side of the turntable module 130 and is connected with the main shaft 150. The driving module 160 is used to drive the main shaft 150 to descend so as to thin the wafer on the turntable module 130.

[0038] In this technical solution, the machine core assembly 100 further comprises the main shaft 150 and the driving module 160. The driving module 160 is arranged on the rack 110 and connected with the auxiliary frame 320, so that it has a stable installation position in the wafer thinning device. On the one hand, by being connected with the rack 110, the driving module 160 obtains a stable support foundation. On the other hand, by being connected with the auxiliary frame 320, the structural stability of the driving module 160 is further enhanced, thereby supporting and guaranteeing the stable operation of the device. The driving module 160 is located on one side of the turntable module 130, so that the driving module 160 can be connected with the main shaft 150 located above the turntable module 130 without interfering with the normal rotation of the turntable module 130. The lateral layout not only ensures the relative independence and operability between the components, but also ensures that they can effectively work together. The main shaft 150 is located above the turntable module 130. In the wafer thinning process, the main shaft 150 is a component that directly acts on the wafer. When the wafer is placed on the turntable module 130 and rotated to be directly below the main shaft 150, the driving module 160 controls the main shaft 150 to descend and move towards the wafer on the turntable module 130. The main shaft 150 realizes the thinning of the wafer through the processing head or cutter installed thereon.

[0039] Exemplarily, during the operation of the device, after receiving an instruction from an external control system, the driving module 160 starts to work and controls the main shaft 150 to descend. During the descending process of the main shaft 150, the processing cutter at the lower end of the main shaft 150 contacts the wafer on the turntable module 130, thereby completing the thinning operation of the wafer.

[0040] Referring to Figure 1 and Figure 2In some examples, the transfer and cleaning assembly 400 comprises: a transfer module 410 arranged on the auxiliary frame 320 and close to the core assembly 100, used to transport the wafer to be processed to the core assembly 100; and a cleaning module 420 arranged on the support base frame 310 and connected with the auxiliary frame 320, the cleaning module 420 is located below the transfer module 410, and the transfer module 410 is also used to transfer the thinned wafer from the core assembly 100 to the cleaning module 420 for cleaning; wherein the cleaning module 420 and the transfer module 410 are located on the side of the rotary table module 130 away from the driving module 160.

[0041] In the technical solution, the transfer module 410 is arranged on the auxiliary frame 320 and close to the core assembly 100, which makes it convenient to dock with the core assembly 100 in space, and the auxiliary frame 320 provides a stable mounting basis for the transfer module 410, and the arrangement close to the core assembly 100 shortens the conveying path, which is conducive to improving the conveying efficiency of the wafer to be processed and reducing unnecessary transfer time loss; one of the main functions of the transfer module 410 is to transport the wafer to be processed to the core assembly 100, which has precise positioning and conveying capability, and can accurately place the received wafer on the rotary table module 130 in the core assembly 100, ensuring that the wafer is in the appropriate processing position and ensuring the accuracy of the thinning process; the transfer module 410 mainly undertakes the action of taking out the thinned wafer from the rotary table module 130 of the core assembly 100 and transferring it to the cleaning module 420, ensuring that the thinned wafer can smoothly enter the cleaning link and ensuring the smoothness of the entire production process.

[0042] The cleaning module 420 is installed on the support base frame 310 and connected with the auxiliary frame 320, the support base frame 310 provides a stable bearing basis for the cleaning module 420, and the connection with the auxiliary frame 320 further enhances the stability and relevance of the cleaning module 420 in the entire device structure; the cleaning module 420 is located below the transfer module 410, which reduces the distance between the cleaning module 420 and the transfer module 410, and can realize the rapid transfer of the wafer from the transfer module 410 to the cleaning module 420 for cleaning, thereby improving the work efficiency.

[0043] The overall layout of the transfer and cleaning assembly 400 is on the side of the rotary table module 130 away from the driving module 160, which optimizes the space structure of the entire device. First, the cleaning module 420 and the transfer module are concentrated on the side away from the driving module 160, which avoids interference of the cleaning module 420 and the transfer module with the area near the driving module 160, and reduces the risk of mutual collision or interference during the operation of different modules.

[0044] Referring to Figures 1 to 4In some examples, the turntable module 130 includes: a turntable 131 rotatably mounted on the base module 120; a wafer carrier disk 132, with multiple wafer carrier disks 132 disposed on the turntable 131 and the axes of the multiple wafer carrier disks 132 distributed around the axis of the turntable 131; and a rotating shaft 133 coaxially fixedly mounted on the bottom of the turntable 131. The base module 120 includes: a base shell 121, with a portion of the rotating shaft 133 extending into the base shell 121, and a movable space 101 for the movement of the wire harness 140 formed between the base shell 121 and the rotating shaft 133 extending into the base shell 121; a first hinge 122 hinged to the inner wall of the base shell 121; and a second hinge 123 hinged to the rotating shaft 133. Both the first hinge 122 and the second hinge 123 are rotatably connected to the wire harness 140.

[0045] In this technical solution, the turntable module 130 includes a turntable 131, multiple wafer carrier disks 132, and a rotating shaft 133. The multiple wafer carrier disks 132 are disposed on the turntable 131, and the axes of the multiple wafer carrier disks 132 are distributed around the axis of the turntable 131. Exemplarily, there are at least three wafer carrier disks 132. The rotating shaft 133 is coaxially fixedly mounted on the bottom of the turntable 131, and the drive source of the turntable module 130 is disposed on the frame 110. The drive source is connected to the rotating shaft 133 and provides power output to the rotating shaft 133 so that the turntable 131 rotates relative to the base module 120. The base module 120 includes a base shell 121, a rotating shaft 133, a first hinge 122, and a second hinge 123. The base shell 121 is mounted on the frame 110, providing a support base for other components of the base module 120. A portion of the rotating shaft 133 extends into the base shell 121 and is coaxially arranged with the base shell 121. The portion of the rotating shaft 133 extending into the base shell 121 and the base shell 121 form an active space 101 for the movement of the wire harness 140. This provides a dedicated active area for the wire harness 140, allowing it to move accordingly within the active space 101 as the rotating shaft 133 rotates. This avoids excessive stretching or twisting of the wire harness 140 due to rotation, providing a safe and orderly active environment for the wire harness 140.

[0046] The first hinge 122 is hinged to the inner wall of the base shell 121, and the first hinge 122 can rotate relative to the base shell 121 to a certain extent. The second hinge 123 is hinged to the rotating shaft 133 and also has a swinging function. The first hinge 122 and the second hinge 123 are both rotationally connected with the wire harness 140. This structure can effectively guide the movement of the wire harness 140 during operation. When the rotating shaft 133 rotates, the second hinge 123 rotates with it, driving one end of the wire harness 140 connected thereto to move in a circular motion around the rotating shaft 133. The first hinge 122 cooperates with the movement of the wire harness 140 through its own swinging, so that the wire harness 140 can rotate with the rotating shaft 133 while reducing the stress on the wire harness 140, thereby ensuring the stability of the signal transmission of the wire harness 140 and prolonging the service life of the wire harness 140.

[0047] In the prior art, the wire harness 140 is arranged outside the base shell 121. This arrangement has obvious disadvantages. Firstly, the wire harness 140 outside the base shell 121 occupies additional space outside the base shell 121, making the overall structure of the device appear relatively messy and crowded, which is not conducive to the compact arrangement of the device and the rational use of space. Secondly, the wire harness 140 exposed outside the base shell 121 is easily affected by collisions, friction, and environmental factors such as dust and moisture from external objects, thereby greatly increasing the risk of damage to the wire harness 140. Once the wire harness 140 is damaged, it may cause transmission failure of electric energy, gas energy, liquid energy, and signals, affecting the normal operation of the device and increasing maintenance costs and downtime.

[0048] In the present technical solution, the wire harness 140 is placed in the active space 101 formed between the base shell 121 and the rotating shaft 133, and is guided to rotate by the first hinge 122 and the second hinge 123. This effectively overcomes the problems of the prior art, optimizes the internal space structure of the device, improves the safety and reliability of the wire harness 140, and ensures the stable operation of the device.

[0049] Referring to Figure 2 and Figure 4 In some examples, when the second hinge 123 rotates with the rotating shaft 133, the rotation range of the second hinge 123 is -240° to 240°, starting from the position where the second hinge 123 is closest to the first hinge 122.

[0050] Exemplarily, as known from the above, the rotary table module 130 comprises a rotary disc 131 and at least three wafer supporting discs 132, wherein the rotary disc 131 is rotatably installed on the base module 120, when the rotary disc 131 rotates under the driving of the driving source, the wafer supporting discs 132 are arranged on the rotary disc 131 at equal intervals with the rotary shaft 133 of the rotary disc 131 as the center, and the wafer supporting discs 132 are used for supporting wafers; when the rotary table module 130 works, the rotation angle range thereof is-240° to 0° or 0° to 240°.

[0051] In the technical solution, the measurement starting point of the limited rotation angle is first defined at the position where the second hinge 123 is close to the first hinge 122, and this position is a fixed reference position during the operation of the equipment, and when the second hinge 123 starts to rotate from this starting position, the measurement with the preset angle is started.

[0052] The rotation range of the second hinge 123 is-240° to 0° or 0° to 240°, which limits the rotation angle interval of the second hinge 123 around the rotary shaft 133, and the negative angle-240° represents the maximum angle of rotation in the counterclockwise direction from the starting position; and the positive angle 240° represents the maximum angle of rotation in the opposite direction (i.e. the clockwise direction) from the starting position.

[0053] Exemplarily, the setting of the rotation range is closely related to the work of the entire base module 120; since the wire harness 140 is rotatably connected with the second hinge 123, the rotation of the second hinge 123 will drive the corresponding movement of the wire harness 140, and by limiting the rotation range of the second hinge 123, the problems such as excessive stretching, twisting or winding of the wire harness 140 due to excessive rotation can be prevented, so as to guarantee the stable function and service life of the wire harness 140.

[0054] Referring to Figures 1 to 4 In some examples, the base shell 121 is provided with an access opening 102 which is in communication with the activity space 101.

[0055] In the technical solution, the access opening 102 is in communication with the activity space 101 formed between the base shell 121 and the rotary shaft 133, and the wire harness 140 rotates in the activity space 101 along with the rotation of the rotary shaft 133; the access opening 102 provides a channel for the maintenance personnel to conveniently maintain and replace the activity space 101, and the maintenance personnel can access the components and the wire harness 140 in the activity space 101 without disassembling too many complex components, which significantly reduces the maintenance difficulty.

[0056] Exemplarily, due to the continuous movement of the wire harness 140 in the active space 101, wear, aging or loose connection may occur after long-term operation. Through the access hole 102, the maintenance personnel can directly observe and check the state of the wire harness 140 in the active space 101, check whether the appearance of the wire harness 140 is damaged or cracked, whether the connection points of the wire harness 140 and the first and second hinged members 122 and 123 are firm, and discover potential safety hazards and fault points in time. Once problems are found in the wire harness 140 or related components during the inspection, the access hole 102 can serve as a convenient channel, and the maintenance personnel can directly extend the repair tool into the active space 101 through the access hole 102 to repair or replace the wire harness 140. Compared with large-scale disassembly and reassembly of the entire base module 120, the use of the access hole 102 greatly saves repair time and labor cost, reduces the downtime of the equipment, and improves the use efficiency of the equipment.

[0057] Exemplarily, a transparent acrylic plate can be arranged outside the access hole 102 to block the access hole 102 and prevent foreign matters from entering the active space 101, so as to ensure the normal work of the wire harness 140 and other components in the active space 101.

[0058] Referring to Figure 2 and Figure 4 In some examples, the base module 120 further includes a pipeline baffle 124 arranged in the active space 101 and close to one side of the access hole 102. The pipeline baffle 124 is used to block part of the wire harness 140 from extending out of the access hole 102 when the wire harness 140 rotates with the rotating shaft 133.

[0059] In this technical solution, when the module is running, the rotating shaft 133 drives the components connected thereto to rotate, including the second hinged member 123 connected to the rotating shaft 133, and then the wire harness 140 moves correspondingly with the rotation of the rotating shaft 133. In this process, due to the complexity of the movement and the activity range of the wire harness 140, part of the wire harness 140 may move towards the access hole 102 due to swinging or displacement. If no protection is provided, these wire harnesses 140 may extend out of the access hole 102, resulting in disordered exposure of the wire harness 140 to the outside and potential risks, such as interference with other components and damage to the wire harness 140. The pipeline baffle 124 is arranged to block the wire harness 140. In the case of rotation with the rotating shaft 133, the pipeline baffle 124 blocks part of the wire harness 140 from extending out of the access hole 102, reducing various risks caused by abnormal extension of the wire harness 140. The blocking function of the pipeline baffle 124 can continuously play a role in long-term and high-frequency operation of the equipment, ensuring the stability of the equipment operation.

[0060] Referring to Figure 2 and Figure 4 In some examples, the pipeline baffle 124 comprises: a first baffle unit 124a arranged in an arc shape on the moving path of the wire harness 140, the center of the arc of the first baffle unit 124a being on the axis of the rotating shaft 133; and two second baffle units 124b arranged at the two ends of the first baffle unit 124a in contact with the wire harness 140, the second baffle units 124b being curved away from the rotating shaft 133.

[0061] In this technical solution, the pipeline baffle 124 comprises the first baffle unit 124a and the second baffle unit 124b, wherein the first baffle unit 124a is arranged in an arc shape on the moving path of the wire harness 140, the center of the arc of the first baffle unit 124a being on the axis of the rotating shaft 133, and since the wire harness 140 rotates with the rotating shaft 133, the moving path of the wire harness 140 forms a part of a circumferential track with the rotating shaft 133 as the center, the arc-shaped first baffle unit 124a can block along this path, maximally exerting its blocking effect and effectively preventing the wire harness 140 from extending out of the access opening 102 when rotating in the circumferential direction of the rotating shaft 133. For example, the first baffle unit 124a is arranged in an arc shape, and the center of the arc of the first baffle unit 124a is on the axis of the rotating shaft 133, so that the first baffle unit 124a can be fitted to the inner wall of the base shell 121 to ensure that the first baffle unit 124a does not occupy too much of the activity space 101, and at the same time, the turning path of the wire harness 140 is restricted to make the turning movement of the wire harness 140 smooth.

[0062] The two second baffle units 124b are arranged at the two ends of the first baffle unit 124a in contact with the wire harness 140, and the second baffle units 124b are curved away from the rotating shaft 133. When the wire harness 140 rotates with the rotating shaft 133, the positions in contact with the first baffle unit 124a are the two ends of the first baffle unit 124a. By installing the second baffle units 124b at the two ends of the first baffle unit 124a in contact with the wire harness 140, since the second baffle units 124b are curved away from the rotating shaft 133, the wire harness 140 can change from being in contact with the straight end of the first baffle unit 124a to being in contact with the curved second baffle units 124b during rotation, which can avoid damaging the wire harness 140 and also play a role in assisting in planning the moving path of the wire harness 140, thereby ensuring smooth movement of the wire harness 140 in the activity space 101.

[0063] In the description of the application, it is necessary to understand that the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can be explicitly or implicitly included one or more of the features. In the description of the application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified and limited.

[0064] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrated; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0065] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can be direct contact between the first and second features, or indirect contact between the first and second features through intermediate medium. Moreover, the first feature is "above", "over" and "on" the second feature, which can be directly above or obliquely above the first feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature is "below", "under" and "under" the second feature, which can be directly below or obliquely below the first feature, or only indicates that the horizontal height of the first feature is lower than that of the second feature.

[0066] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "embodiment", "exemplary embodiment", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or features of different embodiments or examples described in the present application without contradiction.

[0067] Although the embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and cannot be understood as limiting the present application, and those skilled in the art can modify, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A wafer thinning device, characterized in that, The wafer thinning device comprises: a core assembly arranged on a bearing surface and configured to thin a wafer; a damping assembly arranged at the bottom of the core assembly; a support frame assembly coupled to the core assembly; a transfer and cleaning assembly arranged on the support frame assembly and configured to deliver a wafer to be processed to the core assembly, and to clean the wafer thinned by the core assembly and transfer the cleaned wafer to a collection box. The core assembly is configured as a rigid support of the wafer thinning device in contact with the bearing surface.

2. The wafer thinning apparatus according to claim 1, wherein The core assembly comprises: a rack arranged on a bearing surface; a base module arranged on the rack; a turntable module rotatably arranged on the base module; a wire harness arranged in the base module, one end of the wire harness being connected to an external control system, and the other end of the wire harness being connected to the turntable module.

3. The wafer thinning apparatus according to claim 2, wherein The support frame assembly comprises: a support bottom frame fixedly connected to the bottom of the rack; an auxiliary frame arranged on the core assembly and fixedly arranged on the support bottom frame, a bearing space being formed between the auxiliary frame and the support bottom frame, and the transfer and cleaning assembly being arranged in the bearing space.

4. The wafer thinning apparatus according to claim 3, wherein The core assembly further comprises: a main shaft arranged above the turntable module; a drive module arranged on the rack and connected to the auxiliary frame, the drive module being arranged on one side of the turntable module and connected to the main shaft, and the drive module being configured to drive the main shaft to descend so as to thin a wafer on the turntable module.

5. The wafer thinning apparatus according to claim 4, wherein The transfer and cleaning assembly comprises: a transfer module arranged on the auxiliary frame and configured to deliver a wafer to be processed to the core assembly; a cleaning module arranged on the support bottom frame and connected to the auxiliary frame, the cleaning module being arranged below the transfer module, and the transfer module being further configured to transfer the wafer thinned by the core assembly to the cleaning module for cleaning; The cleaning module and the transfer module are arranged on the side of the turntable module away from the drive module.

6. The wafer thinning apparatus according to claim 3, wherein The turntable module comprises: a turntable rotatably arranged on the base module; a plurality of wafer bearing discs arranged on the turntable, and the axes of the wafer bearing discs being arranged around the axis of the turntable; a rotating shaft coaxially and fixedly arranged at the bottom of the turntable. The base module comprises: a base shell, part of the rotating shaft being arranged in the base shell, and an activity space for the wire harness being formed between the base shell and the rotating shaft arranged in the base shell; a first hinge member hingedly arranged on the inner wall of the base shell; a second hinge member hingedly arranged on the rotating shaft; The first hinge member and the second hinge member are both rotatably connected to the wire harness.

7. The wafer thinning device according to claim 6, wherein: when the second hinge member rotates with the rotating shaft, the rotation range of the second hinge member is -240° to 0° or 0° to 240°, starting from the position where the second hinge member is close to the first hinge member. 8.The wafer thinning apparatus of claim 6, wherein the base housing is provided with an access opening in communication with the active space. The base module further comprises:

9. The wafer thinning apparatus according to claim 8, wherein A pipeline baffle is arranged in the active space and close to one side of the access opening; the pipeline baffle is used to block part of the wire harness in the wire harness from extending out of the access opening when the wire harness rotates with the rotating shaft. The pipeline baffle comprises:

10. The wafer thinning apparatus according to claim 9, wherein A first baffle unit is arranged in an arc shape on the moving path of the wire harness, and the center of the first baffle unit is on the axis of the rotating shaft; Two second baffle units are arranged at the two ends of the first baffle unit in contact with the wire harness, and the second baffle units are curved away from the rotating shaft. ​

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